JP2019127286A - Cover tape and package - Google Patents

Abstract

To provide a cover tape and a package capable of suppressing cut of a tape at peeling time.SOLUTION: A cover tape 20 seals a carrier tape 10 for storing a component and has at least a base material layer 21 and an adhesive layer 23. In a range in which a drawing angle, which is an angle formed by a cover tape 20 when peeling and a drawing direction from the carrier tape 10, based on a peeling strength test of JIS C0806-3, is greater than or equal to 165° and less than or equal to 180°, the peeling strength when the peeling speed is set to be 20,000 mm/min is in a range of below 200% with respect to the peeling strength when the peeling speed is set to be 300 mm/min. Also, in a package 100, it is preferable that cohesion peeling occurs in the adhesive layer 23 when the cover tape 20 is peeled from the carrier tape 10.SELECTED DRAWING: Figure 5

Description

  BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a cover tape and a package of a carrier tape for storing components.

  It is known that a carrier tape having a housing recess for housing components is sealed with the cover tape with the cover tape and wound on a reel to form a package. Among these, the cover tape is provided with a base material layer, an intermediate layer, and an adhesive layer (see Patent Document 1), and the adhesive layer is sealed along both ends in the longitudinal direction, and peeled off at the time of mounting components.

  On the other hand, the mounting machine equipped with the package removes the cover tape of the package, takes out the component from the storage recess, and mounts it on, for example, a circuit board or the like. In recent years, mounting machines have come to be able to mount components on a circuit board at a mounting speed exceeding 10 m / min, and the peeling speed of the cover tape is also increasing accordingly.

JP, 2013-180792, A

  However, as the peeling speed increases, the frequency of occurrence of cover tape breakage also increases. It is believed that this is due to the rate dependency of peel strength.

  Then, this invention is made in view of the above subject, and it aims at providing the cover tape and package which can control a tape breakage at the time of exfoliation.

(1) An aspect according to the present invention is a cover tape for sealing a carrier tape for housing components and having at least a base layer and an adhesive layer, which is based on the peel strength test of JIS C0806-3 The peel strength when the peeling speed is 20,000 mm / min is within the range of 165 ° to 180 °, which is the angle between the cover tape when peeling and the direction of drawing from the carrier tape. It is a range of less than 200% with respect to the peel strength when the speed is 300 mm / min.
(2) In the aspect of the above (1), the adhesive layer may be formed of a resin having a weight average molecular weight (Mw) of 10,000 or more and 100,000 or less.
(3) In the aspect of the above (1) or (2), the thickness of the adhesive layer may be in the range of 1 μm to 15 μm.
(4) In any one of the embodiments (1) to (3), the thickness of the base material layer may be in the range of 20% to 40% with respect to the total thickness of the cover tape. .
(5) Another aspect according to the present invention is a package provided with a carrier tape for housing components and the cover tape according to any one of the above (1) to (4).
(6) In the embodiment of the above (5), when the cover tape is peeled off from the carrier tape, cohesive peeling may occur in the adhesive layer.

  ADVANTAGE OF THE INVENTION According to this invention, the cover tape and package which can suppress the tape break at the time of peeling can be provided.

It is the (a) top view and (b) AA sectional view showing the package of an embodiment. It is an expanded sectional view of the cover tape of an embodiment. It is the cross-sectional schematic which shows a peeling strength test. It is Table 1 which shows the result of a peeling strength test. It is an expanded sectional view showing the exfoliation state of a package, and is (a) interface exfoliation, (b) cohesive exfoliation, and (c) delamination.

  Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings. In the present specification, the same members are denoted by the same reference numerals throughout.

FIG. 1: is the (a) top view which shows the package body 100 of embodiment, (b) AA sectional drawing.
As shown in FIG. 1, the package 100 includes a carrier tape 10 and a cover tape 20 for storing the components P. Examples of the parts P to be stored include electronic parts and precision parts.

  A plurality of feed holes 11 and storage recesses 12 for storing components P are formed in the carrier tape 10 at predetermined intervals along the longitudinal direction (feed direction MD) of the tape.

  The feed hole 11 is formed in a flange portion 13 on one side formed along the longitudinal direction. In the present embodiment, the feed holes 11 are circular in plan view, but the shape and interval of the feed holes 11 are drilled in accordance with a feed mechanism such as a mounting machine. The feed holes 11 may be formed on both sides of the storage recess 12 along the flange 13 in the longitudinal direction of the tape.

  Although the accommodation recessed part 12 is formed according to the dimension and shape of the components P to accommodate, it is formed in substantially rectangular shape by planar view in this embodiment. In the storage recess 12, a bottom hole used for inspection or the like may be formed on the bottom surface, or a pedestal may be further formed on the bottom surface. The dimensions of the storage recess 12 are usually in the range of 0.1 mm square to 16 mm square, and the tape width of the carrier tape 10 is 4 mm to 24 mm.

  And this carrier tape 10 is formed using a thermoplastic resin as a material. Examples of the thermoplastic resin include synthetic resins such as polycarbonate, polystyrene, polyvinyl chloride, amorphous polyethylene terephthalate, and polypropylene, those obtained by kneading carbon into these resins, and those provided with a conductive coating on the surface. Etc.

FIG. 2 is an enlarged cross-sectional view of the cover tape 20 of the embodiment.
As shown in FIG. 2, the cover tape 20 at least includes a base layer 21 and an adhesive layer 23, and also includes an intermediate layer 22 in the present embodiment.

  The base material layer 21 is a base material of the cover tape 20, for example, biaxially stretched films such as polyethylene terephthalate (PET), polyamide (PA), polyethylene naphthalate (PEN), and these resin films. It has been subjected to antistatic treatment or conductive treatment.

  The thickness of the base layer 21 is preferably in the range of 20% to 40% of the base layer ratio (base layer thickness / total thickness) Tb relative to the total thickness of the cover tape 20. If the base layer ratio Tb is less than 20%, the tensile strength (rigidity) of the cover tape 20 cannot be increased. On the other hand, if the base layer ratio Tb is greater than 40%, the tensile force of the cover tape 20 Since the strength becomes too high (because the stiffness is too strong), the carrier tape 10 and the cover tape 20 may be separated when being wound on a reel.

  Next, the intermediate layer 22 is bonded to the base material layer 21 with an adhesive (not shown). The intermediate layer 22 is formed of a thermoplastic resin as a material. Examples of this thermoplastic resin include polyethylene (PE).

  In addition, in order to improve the adhesion between the intermediate layer 22 and the adhesive layer 23, it is preferable that a surface of the intermediate layer 22 opposite to the base layer 21 is subjected to a modification treatment such as a corona discharge treatment. That is, the adhesive layer 23 is formed on the base material layer 21 via the intermediate layer 22.

  The last adhesive layer 23 is adhered around the storage recess 12 of the carrier tape 10 to seal the storage recess 12, and is formed on the intermediate layer 22. The adhesive layer 23 is sealed along both ends in the longitudinal direction of the storage recess 12 when bonded to the carrier tape 10.

  The adhesive layer 23 is formed of a resin (adhesive) having adhesion (adhesion) properties, such as acrylic resin and polystyrene resin. The tacky resin preferably has a weight average molecular weight (Mw) of 10,000 or more and 100,000 or less, more preferably 10,000 or more and 50,000 or less. Within this range, the cohesive resin does not increase the cohesive force, and therefore, when the cover tape 20 is peeled off from the carrier tape 10, cohesive peeling at the adhesive layer 23 can easily occur.

  Moreover, as for the thickness of the contact bonding layer 23, 1 micrometer or more and 15 micrometers or less are desirable. If the thickness of the adhesive layer 23 is less than 1 μm, sufficient peel strength cannot be obtained even if the temperature is increased. On the other hand, if the thickness of the adhesive layer 23 exceeds 15 μm, the initial peel strength is increased, causing the tape to break. At this time, the ratio of the adhesive layer to the total thickness of the cover tape 20 (adhesive layer thickness / total thickness) Ta is preferably in the range of 1% to 30%, preferably, the adhesive layer ratio Ta is 2% to 25%. It should be in the range of If the adhesion layer ratio Ta is less than 1%, the adhesion can not be increased even if the temperature is raised, and if the adhesion layer ratio Ta is more than 30%, the adhesion is too high, so the peel strength is large. turn into.

  Here, the adhesive layer 23 has a peel strength Fh of the cover tape 20 when the peel speed is 20 m (20,000 mm) / min, and a peel strength of the cover tape 20 when the peel speed is 300 mm / min. In other words, it is designed to be in a range of less than 200% with respect to Fs. However, the peel strengths Fh and Fs are based on the peel strength test of JIS C0806-3. The pulling angle θ, which is the angle formed by the cover tape 20 when being peeled off and the direction of pulling out from the carrier tape 10, is 165 °. A condition to be performed is set to 180 ° or less (see FIG. 3).

  In the carrier tape 10 described above, after the component P is stored in the storage recess 12, the carrier tape 10 and the adhesive layer 23 of the cover tape 20 are bonded while being heated as necessary, and the opening of the storage recess 12 is opened. Sealed (sealed). The heating temperature in the case of heating may be, for example, in the range of about 150 ° C. to 200 ° C. Thereafter, the package 100 is wound around a reel or the like.

  Thereafter, the package 100 is mounted on a mounting machine, and the cover tape 20 is peeled off from the carrier tape 10 when the component P is mounted on the circuit board. Since the conveyance speed of the carrier tape 10 is about 10 m / min to 20 m / min, the cover tape 20 is peeled off at a peeling speed of 10 m / min to 20 m / min.

(Experimental example)
Hereinafter, the effects of the carrier tape 10 according to the embodiment of the present invention will be described in more detail with reference to examples and comparative examples. FIG. 3 is a schematic cross-sectional view showing a peel strength test. FIG. 4 is Table 1 showing the results of the peel strength test. FIG. 5: is an expanded sectional view which shows the peeling state of the package 100, and is (a) interface peeling, (b) cohesive peeling, (c) delamination.

  The base material layer 21 is made of polyethylene terephthalate resin and has a thickness of 12 μm, 16 μm, and 38 μm. The intermediate layer 22 is made of polyethylene resin, and the thickness is 22 μm, 23 μm, 30 μm, 33 μm, 37.5 μm, 47 μm, and 48 μm. Each was used, and the base material layer 21 and the intermediate layer 22 were bonded in advance.

  Moreover, in order to manufacture the adhesive agent used for the adhesive layer 23 of the cover tape 20, the following base resin, a solvent, a metal oxide, and a dispersing agent are mixed by the compounding ratio of 50: 150: 120: 0.2, respectively. An adhesive was prepared, which had different weight average molecular weights (Mw).

An acrylic resin as a base resin was a three-component polymer product of methyl methacrylate, butyl methacrylate and 2-hydroxyethyl methacrylate, and a compounding ratio of 5: 3: 2 was prepared.
The solvent for dissolving the base resin was a mixture of ethyl acetate, methyl ethyl ketone and secondary butyl alcohol, and the compounding ratio of 3: 2: 1 was prepared.

Furthermore, a metal oxide (SN-100P: Ishihara Sangyo Co., Ltd.) was prepared in order to lower the cohesion of the resin and / or to provide conductivity as a countermeasure against static electricity. This metal oxide is a conductive material having transparency made of Sb-doped SnO ₂ .
Moreover, in order to raise compatibility of an acrylic resin and a metal oxide and to prevent sedimentation, the pigment wetting and dispersing agent (DA-1401: Kushimoto Chemical Co., Ltd.) was prepared. The dispersant is a liquid, is easily adsorbed to the surface of the metal oxide (inorganic substance having an acidic group), and stabilizes the dispersibility.

Then, the above-mentioned adhesive agent was apply | coated on the intermediate | middle layer 22, the adhesive layer 23 was formed, and the cover tape 20 (width 5.3 mm) of Examples 1-6 and Comparative Examples 1-6 was produced, respectively. .
Furthermore, the carrier tape 10 (width 8 mm) made from polystyrene and the cover tape 20 were adhere | attached, and the test piece of the package 100 of Examples 1-6 and Comparative Examples 1-6 was obtained after that. At this time, the drawing angle θ is set in a range of 165 ° to 180 °, and the carrier tape 10 is adjusted while adjusting the heating temperature so that the peeling strength Fs at a peeling speed of 300 mm / min is 0.50 N. The cover tape 20 was adhered. Note that 0.5N is half the maximum peel strength required by JIS C0806-3. Moreover, the heating temperature was 150 ° C. The lower the heating temperature, the weaker the adhesion. Since the difference in peel strength is a ratio, even if the heating temperature changes, it is substantially proportional to the heating temperature.

And using the test piece of Examples 1-6 and Comparative Examples 1-6, it was 300 mm / min with the peel strength test apparatus (VG-35: Vanguard Systems Co., Ltd.) based on the peel strength test of JIS C0806-3. The cover tape 20 was peeled off at a peeling speed of 1,000 mm / min and 2,000 mm / min. From the results, the peel strength Fh at a peel rate of 20,000 mm / min was obtained by analogy with an approximate curve.
At the same time, the cover tape 20 is peeled off at a peeling speed of 20,000 mm / min by the mounting machine using the test pieces of Examples 1 to 6 and Comparative Examples 1 to 6, and tape breakage of the cover tape 20 occurs. An experiment was conducted. The results are shown in Table 1 in FIG. In Examples 1 to 6, tape breakage did not occur, and in Comparative Examples 2 to 3, 6, tape breakage occurred.

  However, in Comparative Example 1, since the weight average molecular weight (Mw) of the adhesive is too low, the peeling strength Fs at a peeling speed of 300 mm / min is set to about 0.50 N even when the heating temperature is increased to about 200 ° C. I could not do it. Moreover, in Comparative Example 4, since the base material layer ratio Tb was too high, the cover tape 20 had high rigidity (bending strength or stiffness), and the peel strength Fs could not be set to about 0.50N. Furthermore, in Comparative Example 5, since the adhesive layer ratio Ta is too low, the adhesive strength is weak, and even if the heating temperature is raised, the peel strength Fs can not be set to about 0.50N. The following experiments were discontinued for these.

  From the comparison between Examples 1 to 6 and Comparative Examples 1 to 6, the peel strength Fh when the peel speed is 20,000 mm / min is the peel strength Fs when the peel speed is 300 mm / min. On the other hand, when the peel strength ratio Fh / Fs is less than 200%, the tape breakage of the cover tape 20 does not occur.

  And in Examples 1-6, the aggregation peeling which peels in the contact bonding layer 23 occurred (refer FIG.4 (b)).

In Comparative Example 2, the peel strength ratio Fh / Fs was 300%, and the weight average molecular weight (Mw) was higher than that in Example 4. And in the comparative example 2, the interface peeling which peels between the carrier tape 10 and the contact bonding layer 23 occurred (refer Fig.4 (a)).
In Comparative Example 3, the peel strength ratio Fh / Fs was 260%, and the base material layer ratio Tb was smaller than that in Example 3.
In Comparative Example 6, the peel strength ratio Fh / Fs was 220%, and the adhesive layer ratio Ta was larger than that in Example 3. And in Comparative Example 6, interfacial peeling occurred.

  As described above, the cover tape 20 according to the embodiment of the present invention is the cover tape 20 that seals the carrier tape 10 that accommodates the component P and has at least the base layer 21 and the adhesive layer 23. Based on the peel strength test of JIS C0806-3, the peeling speed is within the range of 165 ° to 180 ° in the drawing angle θ, which is the angle formed by the cover tape 20 at the time of peeling and the drawing direction from the carrier tape 10. The peel strength Fh when 20,000 mm / min is set is in the range of less than 200% of the peel strength Fs when the peel rate is set to 300 mm / min. As a result, when the cover tape 20 is peeled off from the carrier tape 10, cohesive peeling at the adhesive layer 23 occurs, so that tape breakage in the cover tape 20 or the base layer 21 does not occur.

  Further, the difference between the peeling speed defined in the peel strength test and the peel speed on the mounting machine is greatly different, so that the peel strength of the adhesive layer 23 by the peel strength test can be used as it is. Although evaluation has been carried out at a speed close to the peeling speed with the mounting machine, the peeling strength of the adhesive layer 23 can be checked for its dependence on the peeling speed.

  In the embodiment, the adhesive layer 23 is formed of a resin having a weight average molecular weight (Mw) of 10,000 or more and 100,000 or less. As a result, cohesive peeling on the adhesive layer 23 is more likely to occur.

  In the embodiment, the thickness of the adhesive layer 23 is in the range of 1 μm to 15 μm, or in the range of 1% to 30% of the total thickness of the cover tape 20. As a result, cohesive peeling on the adhesive layer 23 is more likely to occur.

  In the embodiment, the thickness of the base material layer 21 is in the range of 20% to 40% with respect to the total thickness of the cover tape 20. As a result, the tensile strength of the cover tape 20 is in an appropriate range, tape breakage is less likely to occur, and the bending strength (stiffness) is in an appropriate range, whereby the peel strength can be lowered. That is, if the cover tape 20 is strong, when the cover tape 20 is peeled off from the carrier tape 10, the elastic force due to the stiffness acts in the direction of peeling the adhesive layer 23, and the peeling force is substantially increased. The peel strength can be said to decrease as a result.

  The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the above-described embodiments, and various modifications may be made within the scope of the gist of the present invention described in the claims. It can be changed.

(Modification)
In the above embodiment, the cover tape 20 has a three-layer structure of the base layer 21, the intermediate layer 22, and the adhesive layer 23, but may have a two-layer structure of the base layer 21 and the adhesive layer 23, for example Further, it may be a four-layer structure or more having a plurality of intermediate layers 22 such as having a polyamide synthetic resin between the base material layer 21 and the intermediate layer 22.

  In the above embodiment, a surfactant that lowers the cohesive resistance may be added to the adhesive that forms the adhesive layer 23 of the cover tape 20, or, when conductivity is not required, such as silicon carbide. An inorganic filler may be added.

DESCRIPTION OF SYMBOLS 10 Carrier tape, 11 feed hole, 12 accommodation recessed part, 13 flange part 20 cover tape, 21 base material layer, 22 intermediate layer, 23 adhesive layer 100 Package Fh, Fs Peeling strength P Parts (theta) Draw-out angle

Claims (6)

A cover tape that seals a carrier tape that accommodates components and has at least a base material layer and an adhesive layer,
In the range of 165 ° or more and 180 ° or less, the drawing angle which is the angle between the cover tape at the time of peeling off and the direction of drawing from the carrier tape based on the peel strength test of JIS C0806-3,
Peeling strength at a peeling speed of 20,000 mm / min is in the range of less than 200% of peeling strength at a peeling speed of 300 mm / min. The cover tape according to claim 1, wherein the adhesive layer is formed of a resin having a weight average molecular weight (Mw) of 10,000 or more and 100,000 or less. The cover tape according to claim 1 or 2, wherein the adhesive layer has a thickness in a range of 1 µm to 15 µm. The cover tape according to any one of claims 1 to 3, wherein the thickness of the base material layer is in the range of 20% to 40% of the total thickness of the cover tape. Carrier tape to store parts,
A packaging body comprising: the cover tape according to any one of claims 1 to 4. The package according to claim 5, wherein when the cover tape is peeled off from the carrier tape, cohesive peeling occurs in the adhesive layer.