JP2017007697A - Packaging material for packaging electronic component and electronic component package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a packaging material for packaging electronic components which allows electronic components to be taken out from recessed parts provided in a carrier tape with excellent accuracy, and an electronic component package having electronic components stored in the packaging material for packaging electronic components.SOLUTION: A packaging material 10 for packaging electronic components has: a carrier tap 1 which is used for packaging electronic components, formed in a belt-shape, and has recessed parts 12 which can store the electronic components on a first surface (one surface) 15 and a cover tape 20 which is joined to the carrier tape 1 at the first surface 15 side and seals the openings of the recessed parts 12. The carrier tape 1 and the cover tape 20 and joined to each other at two joining parts 25 extended along a longitudinal direction of the carrier tape 1 and provided across the recessed parts 12, where the shortest distance d between the recessed parts 12 and the joining parts 25 is equal to 0.2 mm or more.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a packaging material for electronic component packaging and an electronic component package.

  In general, as an electronic component package for storing electronic components (particularly very small chip components such as chip resistors, chip LEDs, and chip capacitors), an electronic component storing carrier tape (hereinafter referred to as a tape for storing electronic components) having a recess capable of storing the electronic components. , A packaging material for packaging electronic components in which a top cover tape (hereinafter also simply referred to as “cover tape”) is sealed, in which electronic components are housed in the recesses. ing.

  As a carrier tape, a punch carrier tape in which a part of a belt-shaped sheet is penetrated by punching and a bottom tape is attached to the lower surface of the sheet to form a concave component storage part (pocket) (for example, patent document) 1), a press carrier tape (for example, see Patent Document 2) in which a part of the belt-like sheet is formed by compression processing, and a part of the belt-like sheet is molded (pressure forming, vacuum drum molding, press molding, etc.) ), And an embossed carrier tape (see, for example, Patent Document 3) in which a pocket is formed.

  In such an electronic component packaging material 1000, the recess 512 in which the electronic component 40 is accommodated is sealed with the cover tape 200. Normally, the electronic component 40 is not taken out from the electronic component packaging material 1000. As shown in FIG. 5, the cover tape (sealing material) 200 is peeled from the carrier tape (base material) 500 to expose the recess 512, thereby the electronic component 40 accommodated in the recess 512 is This is done by picking up using an electronic component suction nozzle or the like.

  Therefore, in order for the cover tape 200 to seal the recess 512 in which the electronic component 40 is accommodated, the surface on the carrier tape 500 side needs to have heat sealability with respect to the carrier tape 500, for example.

  As described above, since the cover tape 200 has heat sealing properties, depending on the method of heat sealing (heat sealing) of the cover tape 200 to the carrier tape 500, when the cover tape 200 is peeled from the carrier tape 500, the electronic component 40 However, the electronic component 40 adheres to the surface of the cover tape 200 on the carrier tape 500 side instead of the concave portion 512. As a result, the electronic component 40 is accurately picked up from the concave portion 512 by the electronic component suction nozzle. There was a problem that I could not.

Japanese Patent Laid-Open No. 10-218281 Japanese Patent No. 3751414 JP 2011-225257 A

  An object of the present invention is to provide an electronic component packaging material capable of taking out an electronic component from a recess provided in a carrier tape with excellent accuracy, and an electronic component in which the electronic component is accommodated in the electronic component packaging material It is to provide a package.

Such an object is achieved by the present invention described in the following (1) to (10).
(1) A carrier tape that is used to wrap an electronic component, has a strip shape, and has a plurality of recesses on one side that can store the electronic component, and is joined to the carrier tape on the one side. Having a cover tape for sealing the opening of the recess,
The plurality of concave portions are packaging materials for electronic component packaging arranged in a row on the one surface along the longitudinal direction of the carrier tape,
The carrier tape and the cover tape extend along the longitudinal direction of the carrier tape and are joined at two joints provided across the recess,
A packaging material for packaging electronic parts, wherein the shortest distance between the recess and the joint is 0.2 mm or more.

  (2) The packaging material for electronic component packaging according to (1), wherein the two joint portions are substantially parallel to the plurality of concave portions arranged in a row.

  (3) The packaging material for electronic component packaging according to (1) or (2), wherein the width of each of the joint portions is 0.1 mm or more and 1.5 mm or less.

  (4) The said cover tape is a packaging material for electronic component packaging in any one of said (1) thru | or (3) which has a base material layer and the sealant layer laminated | stacked on this base material layer.

  (5) The electronic component packaging packaging material according to (4), wherein the sealant layer contains an ethylene-based copolymer as a main material.

  (6) The electronic component packaging packaging material according to (4) or (5), wherein the sealant layer has a thickness of 1 μm or more and 15 μm or less.

  (7) The electronic component packaging packaging material according to any one of (4) to (6), wherein the base material layer has a thickness of 7 μm to 30 μm.

  (8) The packaging material for electronic component packaging according to any one of (4) to (7), wherein the sealant layer has a sealing property with respect to the carrier tape containing polycarbonate as a main material.

  (9) The packaging material for electronic component packaging according to any one of (1) to (8), wherein the cover tape has a total light transmittance (specified in JIS K 7361-1) of 80% or more.

  (10) An electronic component package comprising the packaging material for electronic component packaging according to any one of (1) to (9) and the electronic component housed in the recess.

  According to the packaging material for packaging electronic parts of the present invention, when the cover tape is peeled from the carrier tape, it is possible to accurately suppress or prevent the electronic parts stored in the recesses from adhering to the cover tape side. And the electronic component can be accurately stored in the recess. Therefore, the electronic component can be picked up more accurately using the electronic component suction nozzle or the like.

It is a fragmentary perspective view which shows embodiment of the packaging material for electronic component packaging of this invention. It is the figure (plan view) which looked at the packaging material for electronic component packaging shown in FIG. 1 from the arrow A direction. It is sectional drawing along line BB of the packaging material for electronic component packaging shown in FIG. It is sectional drawing along line CC of the packaging material for electronic components packaging shown in FIG. It is a fragmentary perspective view which shows the conventional packaging material for electronic component packaging.

  Hereinafter, the electronic component packaging material and the electronic component package according to the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

<Packaging for packaging electronic parts>
1 is a partial perspective view showing an embodiment of a packaging material for electronic component packaging according to the present invention, FIG. 2 is a diagram of the packaging material for packaging electronic component shown in FIG. 1 as viewed from the direction of arrow A, and FIG. 1 is a cross-sectional view taken along line BB of the electronic component packaging packaging material shown in FIG. 1, and FIG. 4 is a cross-sectional view taken along line CC of the electronic component packaging packaging material shown in FIG. In the following description, the upper side in FIGS. 1, 3 and 4 is referred to as “upper”, the lower side is referred to as “lower”, the front side in FIG. 2 is referred to as “upper”, and the rear side in FIG.

  The packaging material 10 for packaging an electronic component is used for packaging (accommodating) an electronic component, has a band shape, and has a recess (electronic component accommodating recess; pocket) 12 that can accommodate an electronic component (not shown). A carrier tape (hereinafter also referred to simply as “carrier tape”) 1 provided on one surface (upper surface) 15 and the first surface 15 side are joined to the carrier tape 1 to be recessed 12 of the carrier tape 1. And a top cover tape (hereinafter also simply referred to as “cover tape”) 20 for sealing (covering) the opening.

  A carrier tape (base material) 1 shown in FIGS. 1 to 4 is made of a resin made of a belt-like sheet, and is arranged on the upper first surface (one surface) 15 of the carrier tape 1 along its longitudinal direction. The plurality of recesses 12 arranged in one row and the plurality of feed holes 11 arranged in one row so as to be parallel to the plurality of recesses 12 are provided.

  Moreover, in this embodiment, the 2nd surface (other surface) 13 on the opposite side (lower side) of the 1st surface 15 in the carrier tape 1 is substantially flat.

  In other words, in this embodiment, the carrier tape 1 has a bottomed recess 12 that opens to the first surface 15, and a feed hole 11 that penetrates the first surface 15 and the second surface 13. The surface 13 is configured by a surface having substantially no step near the bottom of the recess 12 and the outer periphery thereof.

  As shown in FIG. 1, the plurality of recesses 12 are provided at equal intervals along the longitudinal direction of the belt-like sheet so as to be arranged in a line on the first surface 15. Each of these recesses 12 can store an electronic component.

  In addition, the electronic component generally has a rectangular parallelepiped shape, and in this embodiment, as shown in FIGS. 1 and 2, the shape of the recess 12 for accommodating the electronic component is also corresponding to this. It has a rectangular parallelepiped shape. Therefore, in the present embodiment, the shape of the recess 12 in plan view is rectangular, but in accordance with the shape of the electronic component to be stored, a polygonal shape such as a triangle, pentagon, or hexagon, or a circular shape Etc. may be made.

  In addition, on the inner peripheral surface of the recess 12, protrusions or recesses may be formed along the thickness direction of the carrier tape 1 in consideration of the pickup property of the electronic component suction nozzle.

  Furthermore, a step may be provided on the bottom surface of the recess 12. Thereby, for example, when a terminal or the like is formed on the bottom surface of the electronic component, the terminal can be prevented from coming into contact with the bottom surface of the recess 12. In addition, it is possible to accurately prevent the terminals and the like from being damaged.

  As shown in FIGS. 1 and 2, the plurality of feed holes 11 are provided in a row and at equal intervals so as to be parallel to the plurality of recesses 12. These feed holes 11 are used when feeding the electronic component stored in the recess 12 to an electronic component package manufacturing machine, a surface mounter, or the like. That is, it is used when applied to a method for manufacturing an electronic component package and a method for taking out an electronic component.

  Further, the size of the feed hole 11 is, for example, when the width of the carrier tape 1 in the short direction is 8 mm, the average inner diameter is preferably set to about Φ1.5 to 1.6 mm, more preferably Φ1.5. When the width of the carrier tape 1 in the short direction is 4 mm, the average inner diameter is preferably set to about Φ0.76 to 0.84 mm, and more preferably Φ0.78 to 0. .82mm is set. Thereby, the said feed can be implemented reliably.

  The plurality of recesses 12 and the plurality of feed holes 11 are both arranged in a line along the longitudinal direction of the belt-shaped sheet, but the interval between the respective recesses 12 and the feeding holes 11 is particularly limited. For example, two or more recesses 12 may be disposed between the two feed holes 11 in the longitudinal direction, or one recess 12 may be provided between the two feed holes 11. It may be arranged.

  The carrier tape 1 included in the electronic component packaging material 10 is made of resin. By being made of resin, when feeding, fine powder such as paper powder is not generated from the carrier tape 1 itself, and it is possible to prevent the occurrence of poor solder joints of electronic parts and clogging of electronic part suction nozzles. it can. Moreover, the dimensional change of the recessed part 12 by the standing in the recessed part 12 and moisture absorption can be prevented. Thereby, it is possible to sufficiently cope with the cleanliness, improve the stability of taping and surface mounting, and improve the productivity.

  Moreover, the strength of the carrier tape 1 increases due to being made of resin. Thus, even when the thickness of the carrier tape 1 is reduced in order to accommodate electronic components having a small height, when the carrier tape 1 is fed at the time of taping or mounting, the feed holes 11 of the carrier tape 1 are Deformation and breakage of the carrier tape 1 can be prevented. As a result, poor feeding can be sufficiently suppressed, storage stability during taping and pick-up performance during mounting can be improved, and stability of taping and surface mounting can be improved and productivity can be improved.

  In addition, the resin constituting the carrier tape 1 is not particularly limited, but various resins such as polycarbonate, polystyrene, polyethylene, polypropylene, polyester (polyethylene terephthalate, etc.), polyvinyl chloride, polyamide, polyacetal (various thermoplastics). Resin), and one or more of them can be used in combination. Among these, a resin mainly composed of polycarbonate is preferably used. In recent years, with the downsizing of electronic components, the carrier tape 1 having a narrow width of about 8 mm is preferably used. Further, when the electronic components are stored in the recesses 12 and heat sealed with the cover tape 20. A long one is preferably used so that it can be fed by an electronic component package manufacturing machine or the like. For this reason, development of a narrow and long carrier tape 1 is strongly demanded, and as a result, a tape composed of a resin whose main material is polycarbonate, which is a rigid resin, is used. It is becoming.

  Moreover, conductive fillers, such as carbon black, a graphite, and a carbon fiber, are mixed with these resins as needed. Thereby, since conductivity can be imparted to the carrier tape 1 and charging of the carrier tape 1 can be effectively suppressed, destruction of electronic components due to static electricity can be suppressed. Moreover, you may add various additives, such as a foaming agent and a lubricant, as needed. Furthermore, a release agent made of a silicone resin, a fluorine resin, or a conductive film may be formed on the surface of the carrier tape 1. The layer structure of the carrier tape 1 may be a single layer or a multilayer that satisfies these requirements.

  Moreover, in this embodiment, the recessed part 12 is formed in the 1st surface 15 of the carrier tape 1, and the 2nd surface 13 on the opposite side of the 1st surface 15 in the carrier tape 1 is substantially flat. That is, the 2nd surface 13 is comprised by the surface which does not have a level | step difference substantially in the bottom part of the recessed part 12, and its outer peripheral part vicinity. For this reason, the carrier tape 1 can be used similarly to a punch carrier tape or a press carrier tape by using a taping machine or a mounting machine for a punch carrier tape or a press carrier tape. Further, when the carrier tape 1 is wound around and transported, the second surface 13 is substantially flat, so that it is possible to prevent collapse or loosening. Thereby, the deformation | transformation of the recessed part 12 and the crack of the cover tape 20 can be prevented.

  The size of the recess 12 is determined by the size of the electronic component to be packaged. The size of the recess 12 is D (mm), E (mm), D ≦ E, and the size of the electronic component is X (mm), Y (Mm), when X ≦ Y, 0 <D−X ≦ 0.3 and 0 <E−Y ≦ 0.3 are preferably satisfied, and 0.05 ≦ D−X ≦ 0.15, 0. More preferably, 05 ≦ E−Y ≦ 0.15. By being in the preferred range, it is possible to improve the storage stability at the time of taping and the pick-up property at the time of mounting, and to prevent the damage of the electronic components from the impact, contamination, etc. during the storage or transportation of the carrier tape 1. Can do.

  As shown in FIGS. 1 and 2, the cover tape 20 has a belt shape and is bonded (sealed) to the first surface 15 of the carrier tape 1 so as to seal (cover) the opening of the recess 12 of the carrier tape 1. Has been.

  The cover tape 20 is joined to the carrier tape 1 on the first surface 15 side of the carrier tape 1 in a state where the electronic component is housed in the recess 12, and after being stored and transported in this state, the carrier tape 1 After that, the electronic component is used to pick up (take out) the electronic component housed in the recess 12 using an electronic component suction nozzle or the like.

  In this embodiment, such a cover tape 20 has a base material layer 21 and a sealant layer 22 laminated on the base material layer 21 side, as shown in FIGS. The carrier tape 1 is joined to the first surface 15 of the carrier tape 1 by heat sealing.

  The cover tape 20 and the carrier tape 1 are joined to each other by the heat seal at the joint portion 25. In the present invention, the joint portion 25 extends along the longitudinal direction of the carrier tape 1 and forms one row. Two are provided so as to sandwich (straddle) the plurality of recessed portions 12 arranged side by side. In other words, the two joining portions 25 are provided so as to be substantially parallel to the plurality of recesses 12 arranged in a row, with the plurality of recesses 12 positioned therebetween. And the shortest distance d of the recessed part 12 and the junction part 25 is 0.2 mm or more.

  Thus, the size of the shortest distance d between the concave portion 12 and the joint portion 25 is set to 0.2 mm or more, that is, the separation distance between the concave portion 12 and the joint portion 25 is set to an appropriate range or more. Thus, when the cover tape 20 is peeled from the carrier tape 1, even if static electricity is generated in the region where the joint portion 25 of the cover tape 20 is located, the Coulomb force caused by the static electricity causes the recess 12 to It is possible to accurately suppress or prevent the electronic components to be stored from adhering to the cover tape 20 side. Therefore, since the electronic component can be accurately stored in the recess 12, the electronic component can be picked up more accurately using the electronic component suction nozzle or the like.

  Here, the size of the shortest distance d between the recess 12 and the joint 25 may be 0.2 mm or more, preferably 0.3 mm or more and 5.0 mm or less, and 0.3 mm or more and 3.0 mm or less. It is more preferable that By setting the size of the shortest distance d to be equal to or greater than the lower limit value, it is possible to more appropriately suppress or prevent the electronic component housed in the recess 12 from adhering to the cover tape 20 side. In addition, by setting the size of the shortest distance d to be equal to or less than the upper limit value, it is possible to prevent the electronic component packaging material 10 from being enlarged in the width direction. For example, it is possible to more accurately suppress or prevent the electronic component from entering into the gap formed between the cover tape 20 and the carrier tape 1 and detaching from the recess 12.

  Further, the width of the joint portion 25, that is, the length of the joint portion 25 in the direction orthogonal to the longitudinal direction of the joint portion 25 (short direction) is not particularly limited, but is, for example, 0.1 mm or more and 1.5 mm or less. It is preferably 0.2 mm or more and 0.8 mm or less. Thereby, the cover tape 20 and the carrier tape 1 can be firmly bonded at the bonding portion 25, and the area where the bonding portion 25 of the cover tape 20 is located when the cover tape 20 is peeled from the carrier tape 1 The amount of static electricity generated can be set to a size within a range in which the electronic component housed in the recess 12 is prevented from adhering to the cover tape 20 side.

Such a sealant layer 22 may be composed of any resin. Examples of the resin include polypropylene resin, polyethylene resin, polycarbonate resin, (meth) acrylic resin, polystyrene resin, and polyester. Based resins, etc., and one or more of these can be used in combination. Among these, it is preferable to use a polyethylene resin as a main material. Thereby, the sealing performance (adhesiveness) between the sealant layer 22 and the carrier tape 1 can be reliably ensured. Further, when the surface roughness Rz (specified in JIS B 0601) of the sealant layer 22 is set to 1.0 μm or more, the adhesive strength with the resin layer containing polyorganosiloxane is more reliably reduced to 0.3 g / mm ² or less. Can be set.

  The sealing property is the cover when the cover tape 20 is heat-sealed to the carrier tape 1 at 220 ° C. for 0.015 seconds and then peeled off from the carrier tape 1 in accordance with JIS C-0806-3. It means that the peel strength of the tape 20 is 20 gf or more, and it may be 20 gf or more, but it is preferably 30 gf or more and 50 gf or less. Thereby, it is possible to accurately prevent the cover tape 20 from being peeled off from the carrier tape 1 during storage and transportation of the electronic component package, and at the time of picking up the electronic component housed from the recess 12, the cover tape 20 can be easily peeled off from the carrier tape 1.

  The peel strength is, for example, JIS C-0806-3 after a carrier tape 1 having a width of 8 mm and a cover tape 20 having a length of 500 mm and a width of 5 mm are bonded to each other on the surface on the sealant layer 22 side. Based on the above, it can be obtained by calculating the average peel strength when the cover tape 20 is peeled off at a measurement speed of 300 mm / min.

  Further, examples of the polyethylene resin include ethylene-methyl acrylate copolymer (EMA), ethylene-ethyl acrylate copolymer (EEA), ethylene-butyl acrylate copolymer (EBA), and ethylene-methyl methacrylate copolymer. (EMMA) ethylene- (meth) acrylate copolymer, ethylene-vinyl acetate copolymer (EVA), styrene- (meth) acrylate copolymer (MS), graft copolymer of polyethylene glycol and polypropylene And an ethylene copolymer such as a polymer (SEBS) obtained by hydrogenating a double bond of a block copolymer of styrene and butadiene. By using these ethylene-based copolymers as the polyethylene-based resin, the above-described effects can be exhibited more remarkably.

  Further, the weight average molecular weight of the resin constituting the sealant layer 22 is not particularly limited, but is preferably about 6,000 to 700,000, and more preferably about 10,000 to 500,000. When the weight average molecular weight of the resin constituting the sealant layer 22 is in the above range, the film formability of the sealant layer 22 can be improved, and the seal between the sealant layer 22 and the carrier tape 1 can be improved. Property (adhesion) can be ensured.

  In addition, the weight average molecular weight of resin which comprises the sealant layer 22 can be measured by GPC (gel permeation chromatography), for example.

  Further, the sealant layer 22 may be added with a cohesion adjusting resin, an adhesive adjusting resin, or the like as long as it does not adversely affect the adhesive resin with the carrier tape 1.

The adhesiveness adjusting resin is not particularly limited as long as it can adjust the adhesiveness, but is preferably an olefin resin, more preferably a polyethylene resin, for example, low density polyethylene, medium density polyethylene, high density polyethylene, linear And low density polyethylene. In particular, since increasing the compatibility with the adhesive resin, the density is less than 900 g / ^{m 3} or more 920 g / ^{m 3,} melting point 100 ° C. or higher 120 than ° C., preferably less than MFR1.0g / 10min or 5 g / 10min.

  The cohesive force adjusting resin is used to facilitate separation of the carrier tape 1 and the cover tape 20 by adjusting the cohesive failure of the sealant layer (heat seal layer) 22 when the cover tape 20 is peeled from the carrier tape 1. Used for.

  The cohesive force adjusting resin is not particularly limited as long as it can adjust cohesive failure, but is preferably a styrene resin, such as polystyrene, styrene / butadiene / styrene block copolymer (SBS), styrene / ethylene / Butadiene / styrene block copolymer (SEBS), styrene / isoprene / styrene block copolymer (SIS), styrene / ethylene / propylene / styrene block copolymer (SEPS), styrene-methyl acrylate copolymer, styrene Examples include methyl methacrylate copolymer and hydrogenated styrene block copolymer. In particular, a styrene-methyl methacrylate copolymer and a hydrogenated styrene block copolymer are preferable from the viewpoint of transparency. The cohesive strength adjusting resin is preferably 5% by weight or more and 60% by weight or less, and preferably 10% by weight or more and 50% by weight or less with respect to the resin composition constituting the sealant layer (heat seal layer) 22. More preferred. The effect of facilitating cohesive failure can be obtained by being at least the lower limit value, and the effect of not inhibiting the adhesiveness can be obtained by being at most the upper limit value.

  The sealant layer 22 can further include an antistatic resin. The antistatic resin is not particularly limited. For example, a polyether / polyolefin copolymer, a polyetheresteramide block copolymer, a quaternary ammonium base-containing methacrylate copolymer, and a quaternary ammonium base-containing maleimide copolymer. , Polystyrene sulfonate soda and the like. Among these, a polyether / polyolefin copolymer is preferable. The polyether / polyolefin copolymer has high antistatic performance, excellent transparency after baking, and good mixing with an adhesive resin. By including an antistatic resin, it becomes possible to impart conductivity. By imparting conductivity, it is possible to prevent a problem that an electronic component adheres to the charged cover tape 20 due to static electricity generated when the cover tape 20 is peeled off, or destruction of the electronic component due to electrostatic discharge. . The antistatic resin is preferably 10% by mass or more and 40% by mass or less with respect to the resin composition constituting the sealant layer (heat seal layer) 22.

  Further, the thickness of the sealant layer 22 is preferably 1 μm or more and 15 μm or less, and more preferably 5 μm or more and 13 μm or less. Thereby, the sealant layer 22 can have a sealing property (adhesiveness) to the carrier tape 1.

  In addition, the base material layer 21 is processed with various materials as appropriate depending on the application if it has mechanical strength that can withstand external force applied during tape processing or heat sealing to a carrier tape, and heat resistance that can withstand heat sealing. Film can be used.

  Specifically, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, nylon 6, nylon 66, polypropylene, polymethylpentene, polyvinyl chloride, polyacrylate, polymethacrylate, polyimide, polyetherimide, polyarylate, polysulfone, Polyethersulfone, polyphenylene ether, polycarbonate, ABS resin and the like are examples of the material for the base layer film. In order to improve the mechanical strength, polyethylene terephthalate, nylon 6, nylon 66 and the like are preferable. Moreover, as the base material layer 21, a laminate of two or more layers selected from the exemplified resins may be used.

  Although the weight average molecular weight of resin which comprises the base material layer 21 is not specifically limited, It is preferable that it is about 8,000-1,000,000, and it is more preferable that it is about 8,500-950,000. By setting the weight average molecular weight of the resin constituting the base material layer 21 within the above range, the base material layer 21 can be provided with excellent flexibility.

  In addition, the weight average molecular weight of resin which comprises the base material layer 21 can be measured by GPC (gel permeation chromatography), for example.

  Although an unstretched film may be used for the base material layer 21, it is preferable to use a film stretched uniaxially or biaxially in order to increase the mechanical strength of the entire cover tape. In particular, it is more preferable to include one or more of biaxially stretched polyester and biaxially stretched polypropylene.

  Moreover, the thickness of the base material layer 21 is preferably 7 μm or more and 30 μm or less, and more preferably 10 μm or more and 25 μm or less. Thereby, the base material layer 21 can be provided with excellent flexibility. If the thickness of the base material layer 21 is not more than the above upper limit value, the rigidity of the cover tape does not become too high, and even when a twist stress is applied to the carrier tape 1 after heat sealing, the cover tape 20 Is less likely to follow the deformation of the carrier tape 1 and cause peeling. Moreover, if the thickness of the base material layer 21 is equal to or greater than the above lower limit value, the mechanical strength of the cover tape 20 will be suitable, and the cover will be covered during high-speed peeling when taking out the electronic component housed in the recess 12. The problem that the tape 20 is broken can be suppressed.

  Moreover, the base material layer 21 may have an antistatic agent such as a metal oxide, a carbon-based material, and a conductive polymer material, a slip agent, and an antiblocking agent as long as the characteristics are not impaired. .

  Furthermore, it is preferable that the cover tape 20 provided with such a sealant layer 22 and the base material layer 21 has light transmittance (transparency). Thereby, even before the cover tape 20 is peeled from the carrier tape 1, the state in the recess 12, for example, whether or not the electronic component is stored, the stored state of the electronic component, and the like can be confirmed through the cover tape 20. .

  In addition, specifically, the degree of light transmittance is preferably 80% or more, more preferably 85% or more, as defined in JIS K 7361-1.

  Furthermore, the haze (specified in JIS K 7136) of the cover tape 20 is preferably 70% or less, and more preferably 30% or less.

  By setting the total light transmission and haze of the cover tape 20 within the above ranges, the state in the recess 12 can be more reliably confirmed (visually confirmed) via the cover tape 20.

  In addition, the electronic component packaging material 10 and the electronic component package are wound and stored and transported with the second surface 13 facing the reel (core material) side. Thereby, space saving at the time of storage and transportation of the packaging material 10 for electronic component packaging and the electronic component package is achieved.

  By connecting the cover tape 20 to the carrier tape 1 so that the electronic component is housed in the recess 12 of the packaging material 10 for packaging electronic components having the above-described configuration, and then the recess 12 is covered, the electronic component is obtained. An electronic component package (electronic component package of the present invention) in which electronic components are stored in the packaging material 10 is obtained.

  In addition, joining in the junction part 25 of these carrier tapes 1 and the cover tape 20 is normally performed by heat sealing. The heat sealing is performed using a sealing machine so that the two joining portions 25 are formed along the longitudinal direction (long side) of the cover tape 20.

The electronic component is of a size that can be accommodated in the concave portion 12 of the carrier tape 1. For example, a resistor, a capacitor, a light emitting diode, a semiconductor element (semiconductor chip), a semiconductor package including the semiconductor element, and the like can be used. Although it is mentioned, in the packaging material 10 for electronic component packaging, it is used especially preferably for accommodation of a light emitting diode as an electronic component. In a light emitting diode, the encapsulant is usually made of a resin containing polyorganosiloxane, and the encapsulant has high tackiness. Therefore, when the adhesive strength of the cover tape 20 with the silicone resin layer is set to a low adhesive strength such as 0.3 g / mm ² or less as described above, even if the light emitting diode is housed in the recess 12, the cover When the tape 20 is peeled from the carrier tape 1, it is possible to accurately suppress or prevent the electronic component from adhering to the cover tape 20 side.

  As mentioned above, although the packaging material for electronic component packaging and the electronic component packaging body of this invention were demonstrated based on embodiment of illustration, this invention is not limited to this.

  For example, in the electronic component packaging packaging material and the electronic component package according to the present invention, each component can be replaced with any component that can exhibit the same function, or any component can be added. Can do.

  Moreover, although the said embodiment demonstrated the case where the carrier tape with which the packaging material for electronic component packaging has a several recessed part, it is not limited to this case, The recessed part which a carrier tape has may be one.

  Furthermore, in the said embodiment, although the cover tape was comprised by two layers, a base material layer and a sealant layer, it is not limited to this, Various intermediate | middle layers are inserted between the base material layer and the sealant layer. And various coating layers may be laminated on the surface of the base material layer opposite to the sealant layer, and it is composed of three or more layers including the base material layer and the sealant layer. Also good.

Hereinafter, based on an Example, this invention is demonstrated more concretely.
1. Formation of Cover Tape 60 parts of Elvalloy AC1820 (ethylene-methyl acrylate copolymer, (meth) acrylate group 20%, manufactured by Mitsui DuPont Polychemical Co., Ltd.) as adhesive resin, and styrene MS-600 (as cohesive force adjusting resin) 20 parts of styrene-methyl methacrylate copolymer (manufactured by Nippon Steel Chemical Co., Ltd.) and 20 parts of Pelestat 212 (PP-PEG block copolymer, Sanyo Chemical Industries, Ltd.) as an antistatic resin. The resin composition which comprises a sealant layer was knead | mixed with the twin-screw extruder. On the PET film (Toyobo Co., Ltd., E5102) with a film thickness of 16 μm as the base material layer, low density polyethylene (Sumitomo Chemical Co., Ltd., Sumikasen L705) is used as the intermediate layer at an extrusion temperature of 300 ° C. by extrusion lamination. A film was formed to a thickness of 20 μm, and a cover tape was obtained by forming a resin composition constituting the sealant layer as a sealant layer on the formed intermediate layer to a thickness of 5 μm at an extrusion temperature of 300 ° C. by an extrusion laminating method. .

2. Formation of Carrier Tape A carrier tape was obtained by press-molding a carbon-kneaded polystyrene sheet.

  In addition, as a recessed part with which a carrier tape is provided, the thing of 0.35 mm with respect to the longitudinal direction of a carrier tape and 0.65 mm with respect to the short direction of a carrier tape was formed in planar view.

3. Formation of Electronic Component Packaging [Example 1]
The carrier tape in which the electronic component was housed in the recess and the cover tape were overlapped so that the recess provided in the carrier tape was covered with the cover tape.

  Thereafter, using a sealing machine (“MBM4000” manufactured by ISMEA), heat bonding was performed along the longitudinal direction of the cover tape, so that two joints were formed so as to straddle the recess.

  Thereby, the electronic component packaging body of Example 1 with which the electronic component was accommodated in the recessed part with which the packaging material for electronic component packaging to which the carrier tape and the cover tape were joined was obtained.

  In addition, as an electronic component, the thing of the size of 0.6 mm x 0.3 mm was accommodated in the recessed part.

  Moreover, as a junction part, the thing of width 0.4mm was formed in parallel with respect to several recessed part so that the shortest distance d with a recessed part might be 0.48 mm.

[Example 2]
The electronic component of the second embodiment is the same as the first embodiment except that the joining portion is formed so that the shortest distance d to the recess is 0.3 mm and the carrier tape and the cover tape are joined. A package was obtained.

[Example 3]
The electronic component of Example 3 is the same as Example 1 except that the joining part is formed so that the shortest distance d to the recess is 0.2 mm and the carrier tape and the cover tape are joined. A package was obtained.

[Comparative Example 1]
The electronic component of Comparative Example 1 is the same as Example 1 except that the joining portion is formed so that the shortest distance d to the recess is 0.14 mm and the carrier tape and the cover tape are joined. A package was obtained.

4). Evaluation About the electronic component package of each Example and Comparative Example, the cover tape was peeled off from the carrier tape, and then the electronic component housed in the recess was picked up using the electronic component suction nozzle.

Electronic component pick-up by this electronic component suction nozzle was carried out for each of the electronic component packaging bodies of the examples and comparative examples, and the success rate of the pickup was determined by the success or failure of the pickup.
And the obtained pick-up success rate was evaluated based on the evaluation criteria shown below.

Evaluation criteria ◎: 99.999% or more ○: 99.990% or more and less than 99.999% △: 95.000% or more and less than 99.990% ×: less than 95.000% The results are shown in Table 1 below. Show.

  As shown in Table 1, in the electronic component package in each example, the electronic component pickup by the electronic component suction nozzle is excellent because the shortest distance d between the joining portion and the concave portion is 0.2 mm or more. Results that could be implemented with success rate were obtained.

  On the other hand, in the electronic component package in the comparative example, when the cover tape is peeled from the carrier tape, the shortest distance d between the joint and the recess is less than 0.2 mm. The stored electronic component adhered to the cover tape, and as a result, it was shown that the electronic component pick-up by the electronic component suction nozzle cannot be performed with an excellent pickup success rate.

DESCRIPTION OF SYMBOLS 1 Carrier tape 10 Packaging material 11 for electronic component packaging Feed hole 12 Recess 13 Second surface 15 First surface 20 Cover tape 21 Base material layer 22 Sealant layer 25 Joining portion 40 Electronic component 200 Cover tape 500 Carrier tape 512 Recess 1000 Electronic component Packaging materials

Claims (10)

A carrier tape that is used to wrap an electronic component, has a strip shape, and has a plurality of concave portions on one side that can store the electronic component, and the opening of the concave portion joined to the carrier tape on the one surface side And a cover tape for sealing
The plurality of concave portions are packaging materials for electronic component packaging arranged in a row on the one surface along the longitudinal direction of the carrier tape,
The carrier tape and the cover tape extend along the longitudinal direction of the carrier tape and are joined at two joints provided across the recess,
A packaging material for packaging electronic parts, wherein the shortest distance between the recess and the joint is 0.2 mm or more.   The packaging material for electronic component packaging according to claim 1, wherein each of the two joint portions is substantially parallel to the plurality of concave portions arranged in a row.   The packaging material for electronic component packaging according to claim 1 or 2, wherein the width of each joint is 0.1 mm or more and 1.5 mm or less.   The packaging material for electronic component packaging according to any one of claims 1 to 3, wherein the cover tape includes a base material layer and a sealant layer laminated on the base material layer.   The packaging material for electronic component packaging according to claim 4, wherein the sealant layer contains an ethylene-based copolymer as a main material.   The packaging material for electronic component packaging according to claim 4, wherein the sealant layer has a thickness of 1 μm or more and 15 μm or less.   The packaging material for electronic component packaging according to any one of claims 4 to 6, wherein the base material layer has a thickness of 7 µm or more and 30 µm or less.   The packaging material for electronic component packaging according to any one of claims 4 to 7, wherein the sealant layer has a sealing property with respect to the carrier tape containing polycarbonate as a main material.   The packaging material for electronic component packaging according to any one of claims 1 to 8, wherein the cover tape has a total light transmittance (specified in JIS K 7361-1) of 80% or more.   An electronic component package comprising: the electronic component packaging packaging material according to any one of claims 1 to 9; and the electronic component housed in the recess.

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