JPH11292188A - Emboss carrier tape packaging semiconductor device and semiconductor device packaging method using this emboss carrier tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture an emboss carrier tape preventing the generation of cracks, breakages and the like on the tape at the time of releasing a top cover tape bonded on the upper face of the emboss carrier tape in the mounting and assembling process for the emboss carrier tape storing semiconductor devices. SOLUTION: When a frame section 3 holding a plurality of pocket sections 1 in which semiconductor devices 2 are stored is bonded with a top cover tape 1, and the shortest distance from the ends of pocket sections 7 to the end of the top cover tape 1 is set as L, the distance M between a bonding section 4 on which the top cover tape 1 is bonded on the frame 3 in the same direction and the ends of the pocket sections 7 is formed in the range of L×1/10 or longer to L×7/10 or shorter so that the vicinity of the ends of the pocket sections 7 are not bonded thereon.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an embossed carrier tape for packaging a semiconductor device and a method for packaging a semiconductor device with the embossed carrier tape.

[0002]

2. Description of the Related Art A conventional method of packaging a semiconductor device is to heat two temperature-controlled, heat-controlled blocks 6 in a heat block 6 as shown in the schematic diagram of FIG. The semiconductor device 2 is thermocompression-bonded (sealed) to the frame portion 3 of the embossed carrier tape inserted into the pocket portion 7 by using the top cover tape 1.

FIG. 2 is a side sectional view showing an embossed carrier tape into which a semiconductor device 2 is inserted by thermocompression bonding (sealing) of a conventional top cover tape 1.
FIG. 3 is a plan view of FIG. 2. The packaging method of the semiconductor device described above will be described in detail with reference to these drawings.
As shown in (1), after the semiconductor device 2 is inserted into the pocket portion 7 of the embossed carrier tape having the pocket into which the semiconductor device 2 is inserted, the top cover tape 1 is placed.
Subsequently, as shown in FIG. 1, the two seal irons 5 set at the interval W are controlled to a constant temperature, and the seal iron 5 and the frame portion 3 are aligned with the sprocket holes 8. After pressing the cover tape 1 from above and thermocompression bonding the top cover tape 1 and the frame portion 3 at the position of the bonding portion 4, the packaged tape is wound on a reel or the like.

When mounting the tape-and-reel processed semiconductor device 2 on a printed circuit board or the like on an automated mounting (assembly) line, the top cover tape 1 is peeled off from the frame 3 using a mounting machine. Then, the semiconductor device 2 in the pocket is sucked by a vacuum chuck or the like of the mounting machine and is successively transferred onto the printed circuit board.

[0005]

However, in the prior art described above, in the frame portion 3 shown in FIG. 1, the position of the thermocompression bonding (seal) portion by the seal iron 5, that is, the positional relationship of the bonding portion 4 is JES, EIA, EIAJ. 4, the position of the adhesive portion 4 in FIG. 4 is not determined in the area of the width Z from the end of the pocket portion 7 to the end of the top cover tape 1 in the frame portion 3, Any position in the area was fine. Therefore, in the conventional case, once the setting is completed, the interval W between the two seal irons 5 is not changed except for the case of maintenance or the like.

[0006] On the other hand, the semiconductor device 2 has various sizes depending on the use and type, and a large number of embossed carrier tapes having different widths and pocket portions 7 are used to correspond to this. Then, a case may occur in which the width of the pocket portion 7 in the long side direction is larger than the interval W between the seal irons 5, and when thermocompression bonding (seal) is performed as it is, FIG.
In some cases, a seal iron is crimped onto the pocket portion 7 from above and the adhesive portion 4 protrudes into the pocket portion 7 to be sealed.

When the thermocompression bonding (seal) is performed along the pocket portion 7 or out of the pocket portion 7 as described above, the sealing iron 5
When the peel strength changes due to the deformation of the top cover tape 1 due to the pressure and heat of the adhesive or the protrusion of the adhesive, when the top cover tape 1 is peeled off by the mounting machine, the top cover tape 1 There is a problem of the risk of an accident that a crack, breakage, or the like occurs from the inside of the bonding portion 4 and breaks. In the worst case, the semiconductor device 2 cannot be taken out of the pocket portion 7 in the mounting process.

Accordingly, an object of the present invention is to prevent accidents such as cracks and breaks when peeling a top cover tape from an embossed carrier tape, and to smoothly mount semiconductor devices on a mounting (assembly) line. It is an object of the present invention to provide an embossed carrier tape in which a semiconductor device is packaged and a method of packaging a semiconductor device in an embossed carrier tape.

[0009]

In order to solve the above-mentioned problems, an embossed carrier tape in which a semiconductor device of the present invention is packaged has a pocket portion in which a semiconductor device is housed, and
A frame portion that holds the pocket portion; and a top cover tape that covers one surface of the semiconductor device that is exposed from the pocket portion. The shortest distance from the end of the pocket portion to the end of the top cover tape is L. In this case, the distance M between the portion where the top cover tape and the frame portion are bonded to each other and the end of the pocket portion in the same direction is in the range of L × 1/10 or more and L × 7/10 or less.

[0010] The method of packaging a semiconductor device using an embossed carrier tape according to the present invention comprises the following steps: a first step of accommodating the semiconductor device in a pocket formed in the embossed carrier tape; A second step of covering the top cover tape from above the surface where the semiconductor device is exposed from the pocket, and after the second step, determining a shortest distance from an end of the pocket to an end of the top cover tape. When L is set, the distance M between the end of the pocket portion and the portion where the top cover tape and the frame portion are bonded in the same direction is L × 1/10 or more and L × 7/10 or less. A third step of bonding a part of the top cover tape and a part of the embossed carrier tape facing the part.

Here, in the third step, it is preferable that the top cover tape and the frame are bonded by thermocompression bonding.

According to the present invention, thermocompression bonding is performed on a portion of the frame portion which is at a fixed distance from the innermost side of the pocket (the area along the pocket edge) and the outermost side of the pocket (the end area of the top carrier tape). A (seal) area is provided, and the top cover tape is peeled off by a mounting machine to prevent an accident such as a crack or break when taking out a semiconductor product.

According to this configuration, the area that is not thermocompression-bonded (sealed) is set to the innermost side (most pocket side) of the lateral edge of the pocket.
, It is possible to eliminate accidents such as cracks and breaks.

[0014]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a three-dimensional perspective view showing a thermocompression (seal) unit unit of a semiconductor packaging device and an embossed carrier tape during thermocompression (seal) processing in a thermocompression (sealing) step according to an embodiment of the present invention. 2 is a side sectional view of the embossed carrier tape shown in FIG. 1, and FIG. 3 is a plan view of FIG. 2 viewed from above. here,
1 and 2 are no different from the conventional embossed carrier tape.

First, the semiconductor device 2 is housed in the pocket 7 of the embossed carrier tape. At this time, one semiconductor device 2 is stored in one pocket portion 7.

Next, the top cover tape 1 is placed on one surface of the frame 3 where the semiconductor device 2 is exposed from the opening of the pocket 7. At this time, top cover tape 1
And the center line of the embossed carrier tape 3 in the same direction overlaps, and the top cover tape 1 does not protrude beyond the pair of sprocket holes 8 toward the end of the embossed carrier tape. To do.

Next, two seal irons 5 formed in parallel with the heat block 6 at a predetermined interval are controlled to a predetermined temperature, and pressed against the frame 3 from above the top cover tape 1. The top cover tape 1 and the frame part 3 are bonded. At this time, as shown in FIG.
Assuming that the distance to the end of the cover tape 1 is Z, the distance C between the bonding portion 4 and the end of the pocket portion 7 in the same direction
Is set in advance so as to fall within the range of Z × 1/10 or more and Z × 7/10 or less. In the present embodiment, since Z is 4.38 mm and the length of the long side of the pocket portion 7 is 28.74 mm, the interval W between the seal irons 5 is 29.616 to 34.8.
34.32 mm to fit within the range of 72 mm
Is set.

According to the present invention, the dimensions of each part of the embossed carrier tape are taken into consideration, and from the end of the pocket 7 to the adhesive 4
The top and bottom cover tape 1 and the frame part 3 are crimped after setting the seal iron 5 in advance so that the distance from the top part can always be kept constant. Even if an impact or load is applied to the portion 4 from the outside, it is possible to prevent the top cover tape 1 from being cracked or broken.

The stand (not shown) on which the embossed carrier tape is installed has a structure in which the tape is not displaced in the width direction during crimping, and this stand and the heat block 6 are not shown. Alignment is done with no screws. Since the amount of misalignment of the embossed carrier tape with respect to the table in the width direction and the amount of misalignment between the heat block 6 and the table during the pressure bonding are 0.1 mm or less, according to the present embodiment, Emboss
Even when the amount of misalignment with the carrier tape 3 is maximized, the adhesive portion 4 is not formed inside the end of the pocket 7 or outside the end of the top cover tape 1.

Finally, the embossed carrier tape is wound on a reel or the like (not shown) to complete the housing of the semiconductor device 2.

Next, the embossed carrier tape according to the present embodiment will be described. As shown in FIG. 3, the embossed carrier tape of the present embodiment has a plurality of rectangular recesses (pocket portions 7) and pocket portions 7 formed continuously.
, A sprocket hole 8 formed along the long side of the frame 3, and one pocket 7 accommodates one semiconductor device 2. Each pocket 7 has a long side parallel to the short side of the embossed carrier tape, and lines X and X 'connecting these short sides are straight lines parallel to the long side of the embossed carrier tape. It is formed so that it becomes.

One surface of the frame portion 3 where the semiconductor device 2 is exposed from the pocket portion 7 is covered with a top cover tape 1, and both are adhered at an adhesive portion 4 provided on the frame portion 3. The adhesive portions 4 are fixed distances A and A 'from both ends of the long side of the top cover tape 1, respectively.
Are formed parallel to this long side at a distance, and have widths B and
It has a linear shape of B 'or a rectangular shape with short sides B and B'. In other words, the bonding portions 4 are fixed distances C, C ′ from the lines X, X ′ connecting the short sides of each pocket 7.
This is a region of a width B, B 'formed apart from these lines X, X' in parallel.

The distances C and C ′ are Z when the distance from the lines X and X ′ to the end of the top cover tape 1 is Z.
It is preferable to set the range of × 1/10 or more and Z × 7/10 or less. In the present embodiment, Z is set to 4.38 mm, so that C falls within the range of 0.438 to 3.066 mm. Is set to 2.79 mm. In the present embodiment, the widths B and B ′ of the bonding portion 4 are set to 1.1 m.
m, the distances A and A ′ from the end of the long side of the top cover tape 1 to the bonding portion 4 are also secured at 0.49 mm, and the bonding portion 4 protrudes outside the top cover tape 1. Therefore, it is possible to prevent the occurrence of poor adhesion to the frame portion 3 due to this.

The top cover tape 1 is embossed
The carrier tape must be formed to have a size that covers only a region inside the sprocket hole 8 formed continuously along a pair of long sides of the carrier tape. In the present embodiment, the width of the embossed carrier tape is Is 44.0 mm, the width of the top cover tape 1 is 37.5 mm, and the distance from the end of the top cover tape 1 to the end of the embossed carrier tape is 3.25 mm on one side. I have. Normally, the sprocket hole 8 is embossed
It is formed in an area within 3 mm from the end of the carrier tape, and the amount of displacement when the top cover tape 1 is covered with the embossed carrier tape and adhered is 0.
Since it is within 1 mm, the top cover tape 1 can be prevented from protruding from the sprocket hole 8 toward the end of the embossed carrier tape with the size set in the present embodiment.

Further, if the top cover tape 1 is loosened or stretched when covered with the embossed carrier tape, poor adhesion occurs. In the worst case, the top cover tape 1 is stored in the pocket portion 7 while moving to the next step. The semiconductor device 2 may be missing. Therefore, as shown in FIG. 2, the depth of the pocket portion 7 needs to be larger than the thickness of the semiconductor device 2. In the present embodiment, since the thickness of the semiconductor device 2 is 3.5 mm and the depth of the pocket portion 7 is 4.15 mm, the above-described problems such as poor adhesion do not occur.

The present invention is not limited to the above-described embodiment. For example, the width of the adhesive portion may be increased as long as it does not protrude outside the top cover tape (sprocket hole side). Various design changes are possible, for example, instead of using an embossed carrier tape in which the pocket portions are formed in one row parallel to the long side thereof, a pocket portion formed in two rows in the same direction is used.

[0027]

As described above, according to the present invention,
The top cover tape was removed from the frame part because the fixed part was always provided between the adhesive part formed on the frame part of the embossed carrier tape and the end part of the pocket part, and the vicinity of the end part of the pocket part was not bonded. Even if an impact or load is applied to the bonded portion when peeling off, it is possible to prevent the top cover tape from cracking or breaking.

[Brief description of the drawings]

FIG. 1 is a three-dimensional perspective view showing a thermocompression unit unit and an embossed carrier tape during thermocompression processing of a semiconductor packaging device according to an embodiment of the present invention.

FIG. 2 is a side sectional view in a plane perpendicular to a short side of the embossed carrier tape of FIG. 1;

FIG. 3 is a plan view of the embossed carrier tape of FIG. 2 as viewed from above.

FIG. 4 is a plan view of a conventional embossed carrier tape as viewed from above.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Top cover tape 2 Semiconductor device 3 Frame part 4 Adhesion part 7 Pocket part

Claims (3)

[Claims] 1. An embossed carrier having a pocket portion accommodating a semiconductor device therein, a frame portion holding the pocket portion, and a top cover tape covering one surface of the semiconductor device exposed from the pocket portion. In the tape, a partial area of the top cover tape is adhered to the opposite frame portion as an adhesive portion, and a shortest distance from an end of the pocket portion to an end of the top cover tape is L. In the same direction, the distance M between the bonding portion and the end of the pocket portion is L × 1.
An embossed carrier tape, which is in the range of not less than / 10 and not more than L × 7/10. 2. A method of packaging a semiconductor device with an embossed carrier tape, comprising: a first step of housing the semiconductor device inside a pocket formed in the embossed carrier tape; and after the first step, A second step of covering the top cover tape from above the surface where the semiconductor device is exposed from the pocket, and after the second step, from an end of the pocket to an end of the top cover tape. Where L is the shortest distance, the distance M between the portion where the frame portion of the top cover tape and the frame portion of the embossed carrier tape is bonded and the end of the pocket portion in the same direction is L × 1/10 or more. , L × 7/10 or less, a part of the top cover tape is bonded to a part of the embossed carrier tape opposed thereto. A method of packaging a semiconductor device, comprising: a third step. 3. The method according to claim 1, wherein in the third step, the top
The method of packaging a semiconductor device according to claim 2, wherein the cover tape and the frame portion are bonded by thermocompression bonding.