JP3942685B2 - Semiconductor packaging equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor packaging apparatus in which a carrier tape into which a semiconductor product is inserted is thermocompression-bonded and wound on a reel, and in particular in an assembly line, the top tape is peeled off to take out the semiconductor product from the carrier tape pocket. The present invention relates to a semiconductor packaging device improved so as to perform thermocompression bonding in consideration of the peel strength at the time of peeling work so that the peel strength at the time is constant.
[0002]
[Prior art]
A conventional semiconductor packaging apparatus includes a carrier tape 3 in which the semiconductor product 4 of FIG. 1A is inserted by a seal iron 1 and a iron receiver 5 shown in FIG. 1C, as shown in FIG. The top tape 2 was thermocompression bonded.
[0003]
2A and 2B are views showing a carrier tape obtained by thermocompression bonding of a conventional top tape. FIG. 2A is a plan view and FIG. 2B is a cross-sectional view. As shown in FIG. 2, after inserting the semiconductor product into the pocket portion of the carrier tape 3 having a pocket for inserting the semiconductor product 4, the top tape 2 is placed, and the seal iron 1 controlled at a constant temperature is placed thereon. After pressure welding and thermocompression bonding and sealing at the position of the seal trace 8, the wrapped tape is wound around a reel or the like.
[0004]
When mounting the tape and reel processed semiconductor product 4 on a printed circuit board or the like on an automated assembly line, the top tape 2 is peeled off from the carrier tape 3 using a mounting machine, and the semiconductor product 4 in the pocket is removed. The top tape 2 is peeled off from the carrier tape 3 using a mounting machine, and the semiconductor product 4 in the pocket is adsorbed by a vacuum chuck or the like of the mounting machine and is successively carried on the printed circuit board.
[0005]
[Problems to be solved by the invention]
However, in the above prior art, when the top tape 2 is peeled off from the carrier tape 3, the peel strength is not constant over the entire seal trace 8. As shown in the comparison diagram of the strength of peel strength in FIG. 3, the strength of the peel strength when peeling the top tape in conjunction with the pitch of the semiconductor product 4 is the carrier in the conventional example as shown by the solid line B curve. The peel strength is low at the boundary between the pockets of the tape 3 and the pocket portion is high, and the fluctuation of the curve indicating the strength of the peel strength is severe and the variation of the peel strength becomes large. There is a problem that the tape 2 is cut or the carrier tape 3 is deformed, and it is impossible to continuously perform a normal peeling operation.
[0006]
Accordingly, an object of the present invention is to provide a semiconductor packaging device that enables smooth continuous mounting of semiconductor products on an assembly line by thermocompression bonding so as to eliminate variation in peel strength when the top tape is peeled off from the carrier tape. It is to provide.
[0007]
[Means for Solving the Problems]
To achieve the above object, the present invention is based on thermocompression bonding the top tape in the carrier tape pockets because is formed in a plurality aligned state to accommodate the semiconductor products, semiconductor packaging a plurality of semiconductor products In packaging equipment,
A seal iron receiver arranged to receive a flat portion of the carrier tape, each of which is formed on both sides of the plurality of pockets;
A seal iron for thermocompression bonding the flat portion of the carrier tape and the top tape with the seal iron receiver;
With
The seal iron receptacle is characterized in that a portion that contacts a region close to the boundary between the pockets and the pocket is formed of a material having better cushioning properties than other portions.
[0008]
According to this configuration, by changing the material of a part of the iron receiver, the cushion performance of the iron receiver in the area corresponding to the boundary between the pockets and the pockets is improved, and the peel strength is enhanced and the overall peel strength varies. Can be eliminated.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0010]
1A and 1B are perspective views of a sealing unit portion of a semiconductor packaging device according to an embodiment of the present invention.
[0011]
1 (a) and 1 (b), 1 is a seal iron using aluminum or stainless steel as a material, 2 is a top tape to be peeled off in an assembly line, 3 is a carrier tape into which a semiconductor product is inserted, and 4 is a semiconductor. Product 6 is the iron receptacle of the present invention. Further, 7-1 to 7-4 are made of a material having good cushioning properties such as polyurethane, and have better shock absorption performance than a general iron receiver 6. The length in the longitudinal direction is longer than the width of the carrier tape pocket and the boundary between the pockets. The semiconductor packaging device according to the present invention is for packaging a plurality of semiconductor products 4 on the basis of thermocompression bonding of the top tape 2 to the carrier tape 3, and as is apparent from FIGS. 1 and 2, the carrier tape 2 is formed in a state in which a plurality of pockets for housing the semiconductor product 4 are arranged. Further, as is apparent in FIG. 1 (a), on both sides of the plurality of pockets are formed flat portions, respectively, as is apparent in FIG. 1 (b), Shirukote receives 6 their plane portion Arranged to receive. The seal iron 1 and the seal iron receptacle 6 are configured so as to thermocompress the flat portion of the carrier tape 2 and the top tape 2.
[0012]
FIG.1 (c) is a perspective view of a prior art. In FIG. 1 (c), reference numeral 5 denotes a conventional iron support using stainless steel as a material for heat-pressing a top tape 2 and a carrier tape 3 together with a heated seal iron 1.
[0013]
Fig.2 (a) is a top view which shows the carrier tape which heat-pressed the conventional top tape.
[0014]
FIG. 2B is a cross-sectional view showing a carrier tape obtained by thermocompression bonding of a conventional top tape.
[0015]
FIG. 3 is a comparative view of peel strength by the sealing unit shown in FIG.
[0016]
Next, the operation will be described.
[0017]
First, as shown in FIGS. 2A and 2B, after the semiconductor product 4 is inserted into the pocket portion of the carrier tape 3 having a pocket into which the semiconductor product 4 is inserted, the top tape 2 is placed on top of the seal tape. The top tape 2 and the carrier tape 3 are brought into pressure contact with the sealing iron 1 from the top surface of the top tape 2 by a semiconductor wrapping apparatus (the operation part other than the iron is not shown) capable of moving up and down by controlling 1 to a predetermined temperature. Is heat-pressed, and the crimped carrier tape is wound around a reel or the like and stored.
[0018]
In this case, as shown by the solid line B curve in FIG. 3, the conventional example of crimping has a large variation in peel strength, and the mounting machine of one automatic wiring line has also been speeded up, causing trouble when peeling the top tape. Since this situation is likely to occur, in the present invention, as a measure for improving this, a measure is taken to improve the value only on the MIN side without changing the value on the MAX side of the peel strength to suppress the variation in the peel strength. I'm taking it.
[0019]
The peel strength can be specifically expressed by the following formula.
[0020]
Peel strength = (Temperature, pressure, time, width of iron, cushioning of iron receiving, distance from embossed pocket) / thickness of tape
In this way, the product of six factors from the numerator (temperature to the distance from the pocket) is divided by the denominator (top tape thickness). In adjusting the peel strength from this formula, for the four elements of “temperature, pressure, time, distance from the embossed pocket”, when trying to raise the MIN side, the MAX side also rises and the predetermined peel strength is set. Because it will be misaligned, it will be focused on adjusting the cushioning (impact absorbability) of the trowel holder that can improve only the target MIN side value, and the position where the peel strength MIN of the trowel holder 6 occurs (the boundary between the pocket and the pocket) For example, polyurethane having a cushioning performance than the stainless steel of the iron receiving body is used as the material of the portion in contact with the area adjacent to the iron receiving body 6 so that the four corners of the iron receiving 6 become 7-1 to 7-4. That is, as for the said seal iron receptacle 6, the part which contacts the area | region close | similar to the boundary part of a pocket and a pocket is formed with the material with better cushioning properties than another part.
[0021]
Therefore, in the thermocompression bonding of the top tape 2 according to the present embodiment, the stainless steel portion of the iron receiving body 6 absorbs shocks at the center portion of the embossed pocket by the seal iron 1, and at the same time, the boundary portion between the pocket and the pocket and a portion close thereto ( At both ends of the embossed tape, the seal iron receiving end portions 7-1 to 7-4 such as polyurethane absorb the impact. As shown in the previous equation, the peel strength is proportional to the cushioning property of the iron receiving, so it is pushed up corresponding to the lower bottom portion on the MIN side of the solid line B curve in FIG. 3, so the total peel strength is shown by the one-dot chain line A in FIG. Like the improvement curve in the case of the present embodiment indicated by a curve, the MIN side is improved and the variation in peel strength is improved.
[0022]
In this way, in the packaging process in which the carrier tape 3 into which the semiconductor product 4 is inserted and the top tape 2 are thermocompression bonded, thermocompression bonding is performed in consideration of variation in peel strength when peeling off. When it is introduced into a line or the like, the tape is peeled off by the mounting machine due to the improvement in peel strength as shown by the curve A in FIG. 3, and the semiconductor product 4 is smoothly taken out and conveyed.
[0023]
【The invention's effect】
As described above, according to the present invention, a portion made of a material having a good cushioning property (high shock absorption) such as polyurethane, at a portion corresponding to the boundary portion between the embossed pocket and the pocket of the iron receiver and a portion close thereto. Therefore, it is possible to smoothly and continuously mount semiconductor products on the assembly line by performing thermocompression bonding during packaging so as to eliminate variations when the top tape is peeled off from the carrier tape.
[Brief description of the drawings]
FIG. 1 is a perspective view (a) of an upper portion of a sealing unit portion of a semiconductor packaging apparatus according to an embodiment of the present invention, a perspective view (b) of a seal iron receiver, and a perspective view of a conventional seal iron receiver ( c).
FIG. 2A is a plan view showing a carrier tape to which a top tape is thermocompression bonded, and FIG. 2B is a sectional view showing a carrier tape to which a top tape is thermocompression bonded.
FIG. 3 is a comparative view of peel strength of thermocompression bonding by the seal iron receiver shown in FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Sealing iron 2 Top tape 3 Carrier tape 4 Semiconductor product 5 Sealing iron receiving body 6 of the prior art Sealing iron receiving body 7-1 of the present invention Sealing iron receiving end 7-2 of the present invention Sealing iron receiving end 7-3 of the present invention Sealing iron receiving end 7-4 Sealing iron receiving end of the present invention

Claims (1)

In a semiconductor packaging apparatus for packaging a plurality of semiconductor products based on thermocompression bonding of a top tape to a carrier tape formed in a state in which a plurality of pockets for housing semiconductor products are arranged,
A seal iron receiver arranged to receive a flat portion of the carrier tape, each of which is formed on both sides of the plurality of pockets;
A seal iron for thermocompression bonding the flat portion of the carrier tape and the top tape with the seal iron receiver;
With
The semiconductor wrapping apparatus according to claim 1, wherein the seal trowel receiver has a portion in contact with an area close to the boundary between the pocket and the pocket formed of a material having better cushioning properties than other portions .

Images