JP3180623B2 - Support plate for electronic device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a support plate for an electronic device such as a semiconductor device, and more particularly to a support plate for an electronic device using a resin film or the like as a base on which a semiconductor chip or other electronic components are mounted.

[0002]

2. Description of the Related Art In an electronic device such as a semiconductor device as described above, a flexible substrate or a TAB mounting type is used in order to reduce the size, thickness, and weight of the electronic device itself or various electronic devices to which the electronic device is attached. As a base material of the thin package, a resin film made of a tape or other appropriately shaped polyimide or the like is used. These resin films are generally soft, and when a semiconductor chip or other electronic components are mounted on the film, it is difficult to obtain sufficient strength to support them.

[0003] When assembling the electronic device using the resin film as described above to various electronic devices, handling operations such as holding and transporting each electronic device with a holder or assembling, etc. Conventionally, for example, a large number of electronic devices are continuously mounted on a long tape-shaped resin film and handled in a state of being wound up in a reel shape, or continuously mounted as described above. These are separated one by one and held in a plastic carrier or the like for handling.

[0004]

However, the reel wound as in the former case has a curl and curl due to a curl, and if it is forcibly returned, deformation and cracks may occur. There is a risk. Further, in the case of holding by a plastic carrier or the like as in the latter case, there is a problem that the attaching / detaching operation is troublesome and inefficient.

[0005] The present invention has been proposed in view of the above problems, and is intended for mounting electronic components such as a semiconductor chip on a substrate made of a resin film or the like, or for preventing warpage of the substrate after mounting. It is an object of the present invention to provide a support plate for an electronic device that can prevent occurrence of the problem and can easily perform a handling operation when transporting or assembling in the above-described mounting process or assembling process to various electronic devices. And

[0006]

To achieve the above object, a support plate for an electronic device according to the present invention is as follows.

That is, in an electronic device such as a semiconductor device using a resin film or the like as a base material, a support plate for reinforcing the base material or protecting electronic components such as semiconductor chips, and is made of a metal plate or the like. A housing portion for electronic components such as a semiconductor chip is formed at a substantially central portion of the support plate main body, and a heat-resistant adhesive layer that can be bonded to a base made of the above resin film or the like is provided on at least one surface of the support plate main body. It is characterized by having.

[0008]

When the electronic device support plate constructed as described above is used for an electronic device such as a semiconductor device in which an electronic component such as a semiconductor chip is mounted on a base material such as a resin film, the above-mentioned electronic device is used. What is necessary is just to stick a support plate main body on a base material by the said adhesive layer so that a component may be located in the accommodation part of a support plate main body, and the base material which consists of a soft resin film etc. is reinforced by the support plate main body. In addition to preventing the occurrence of warping and curling, it is possible to perform the handling operation using the above-described support plate body when assembling the electronic device to which the support plate body is attached to various electronic devices. It becomes possible.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below based on an embodiment shown in the drawings. 1A and 1B show one embodiment of a support plate for an electronic device according to the present invention, wherein FIG. 1A is a plan view and FIG. 1B is a longitudinal sectional front view.

In FIG. 1, reference numeral 1 denotes a support plate main body made of a metal plate or the like. The support plate main body 1 is formed in a substantially rectangular shape in a plane in this embodiment, and an electronic component such as a semiconductor chip not shown in the figure is provided at the center. Opening 10 as an accommodating portion for accommodating
Is provided. In addition, an adhesive layer 2 is formed on one surface of the support plate main body 1, that is, on the entire lower surface excluding the opening 10 in the case of the drawing.

Although the material of the support plate body 1 is appropriate, a metal plate is preferably used. For example, a single metal such as copper or iron, an alloy, a surface-treated steel plate, or the like can be used. The size and shape of the support plate body 1 may be appropriately designed according to the size and shape of the semiconductor device to be applied. In this embodiment, a metal plate having a thickness of 0.5 mm is used. It is formed in a 25 mm square.

As the adhesive layer 2, a heat-resistant pressure-sensitive adhesive or the like which can be bonded at room temperature to a substrate (not shown) made of a resin film of polyimide or the like in the semiconductor device as described above may be used. As a means for forming the adhesive layer 2, for example, an adhesive is applied to the surface of the support plate main body 1, and a release paper 3 is provided on the surface as necessary. Alternatively, an adhesive tape or the like may be used. For example, one release paper of a double-sided tape having release paper on both sides may be peeled off and adhered to the support plate main body 1.

In manufacturing the support plate for an electronic device as described above, the support plate main body 1 and its opening 10 are simultaneously punched by, for example, press punching, and an adhesive is applied to one surface of the support plate main body 1. The layer 2 and the release paper 3 are provided, or an adhesive tape with release paper is attached. Alternatively, the adhesive layer 2 and the release paper 3 may be provided in advance on one side of the support plate main body 1, or an adhesive tape with a release paper may be attached and then punched into a predetermined shape.

When the electronic device support plate manufactured as described above is used for an electronic device such as a semiconductor device in which electronic components such as a semiconductor chip are mounted on a base material such as a resin film not shown in the figure. Before or after mounting the electronic component, the release paper is peeled off by a remover or the like, and the support plate main body 1 is adhered to a base material by an adhesive layer 2, and at this time, the electronic component Is positioned in the opening 10 of the support plate main body 1 and mounted on the base material. When an electronic component is mounted on the base material in advance, the electronic component is positioned in the opening 10 of the support plate main body 1. Thus, the support plate main body 1 is stuck on the base material. In the case where a long tape-shaped resin film is used as the base material, electronic components such as semiconductor chips are sequentially mounted thereon, and a large number of electronic devices such as semiconductor devices are continuously formed. Alternatively, the support plate body can be adhered in the continuous state or after the individual electronic devices are divided into individual electronic devices.

By sticking the support plate main body on the base material made of a resin film or the like as described above, the base material is reinforced by the support plate main body, and it is possible to prevent warpage and curling from occurring. In addition, electronic components such as semiconductor chips mounted on the base material can be protected well. Also, when assembling the electronic device formed by adhering the support plate body to various electronic devices and the like as described above, the support plate body is picked up or held by a magnet or the like for transport / assembly. A handling operation can be performed, and workability and operability can be improved. In FIG. 1, reference numeral 1a denotes a chamfer for positioning when the support plate main body 1 or the electronic device is aligned in position or direction when the support plate main body 1 is attached to the electronic device or after the electronic device is attached.

As shown in FIG. 2, the surface of the support plate main body 1, that is, the surface opposite to the adhesive layer 2, more preferably the entire surface of the support plate main body 1 except for the portion having the adhesive layer 2, An insulating film 4 may be formed as needed. Although the material and the forming method of the coating 4 are appropriate, for example, the surface of the support plate body 1 may be coated with an insulating paint by a screen printing method or the like. Support plate body 1 as described above
When the coating 4 is formed on the surface of the semiconductor device, even when the semiconductor device is mounted on a thin and high-density mounting device having a small mounting space, it is possible to prevent a trouble such as a short circuit caused by the semiconductor device coming into contact with a mounting substrate or a case. Can be. Support plate body 1 is C
In the case of a metal that is easily discolored, such as a u-based alloy, the coating 4 also functions to prevent discoloration, and in particular, a black color coating is optimal as a color tone of a semiconductor device.

In the above embodiment, the opening 10 is formed in the support plate main body 1 as an accommodating portion for an electronic component such as a semiconductor chip.
The recess 11 may be as shown in FIG. 3 or FIG. The method of forming the concave portion 11 is appropriate. FIG. 3 shows an example in which the concave portion 11 is formed in the thick support plate body 1 by cutting or the like.
FIG. 4 shows an example in which the concave portion 11 is formed by squeezing or pressing the thin support plate body 1. However, it can also be formed by casting or other means.

In the embodiment shown in FIGS. 3 and 4, the heat-resistant adhesive layer 2 is provided on the entire lower surface of the support plate body 1 except for the concave portion 11 as in the previous embodiment, and the lower surface is peeled off as necessary. Since the paper 3 is provided, the same effect as in the above embodiment can be obtained. In particular, if the accommodating portion of the electronic component such as the semiconductor chip is formed as the concave portion 11 as described above, the electronic component accommodated in the concave portion 11 can be further protected. Also in this case, the insulating film 4 may be formed on the surface of the support plate main body 1 as necessary in the same manner as in the above embodiment.

[0019]

As described above, the supporting plate for an electronic device according to the present invention has an opening 1 for accommodating an electronic component such as a semiconductor chip at a substantially central portion of a supporting plate main body 1 made of a metal plate or the like.
0 or a concave portion 11 and the like, and a heat-resistant adhesive layer 2 that can be bonded to a base made of the above resin film or the like is provided on at least one surface of the support plate main body 1. When mounting an electronic component such as a semiconductor chip on a base material such as a film or using the mounted electronic component such as a semiconductor device, the electronic component is placed in the opening 10 or the concave portion 11 of the support plate body 1. The base material 1 made of a soft resin film or the like is reinforced by preventing the warp or the curl from being generated simply by sticking the support plate main body 1 on the base material by the adhesive layer 2 so that When the electronic component is mounted on a substrate or when an electronic device on which the electronic component is mounted is mounted on various electronic devices, a handling operation using the support plate body should be performed. Possible and it is effective, such can be significantly improved workability and operability.

[Brief description of the drawings]

FIG. 1A is a plan view showing one embodiment of a support plate for an electronic device according to the present invention. (B) is the longitudinal front view.

FIG. 2 is an enlarged vertical sectional front view of a part of the electronic device support plate according to the embodiment.

FIG. 3A is a plan view showing another embodiment of the electronic device support plate according to the present invention. (B) is the longitudinal front view.

FIG. 4A is a plan view showing another embodiment of the electronic device support plate according to the present invention. (B) is the longitudinal front view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Support board main body 2 Adhesive layer 3 Release paper 4 Insulating coating

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H05K 13/02 H01L 21/68 H01L 23/12 B65D 73/00

Claims (5)

(57) [Claims] An electronic device support plate for preventing reinforcement or warpage of an electronic device such as a semiconductor device using a resin film or the like as a substrate,
A housing portion for an electronic component such as a semiconductor chip is formed at a substantially central portion of a support plate main body made of a metal plate or the like, and heat resistance capable of bonding to a base made of the above resin film or the like on at least one surface of the support plate main body. An electronic device support plate provided with an adhesive layer. 2. The support plate for an electronic device according to claim 1, wherein an opening or a recess is formed in the support plate main body as the accommodation portion. 3. The support plate for an electronic device according to claim 1, wherein the adhesive layer is a room temperature pressure bonding type. 4. The electronic device support plate according to claim 1, wherein a release paper is provided on a surface of the adhesive layer opposite to the support plate main body. 5. The support plate for an electronic device according to claim 1, wherein an insulating film is formed on a surface of the support plate main body opposite to the adhesive layer.