JPH03204989A - Flexible printed circuit board - Google Patents
Flexible printed circuit boardInfo
- Publication number
- JPH03204989A JPH03204989A JP34339289A JP34339289A JPH03204989A JP H03204989 A JPH03204989 A JP H03204989A JP 34339289 A JP34339289 A JP 34339289A JP 34339289 A JP34339289 A JP 34339289A JP H03204989 A JPH03204989 A JP H03204989A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- flexible printed
- circuit board
- sensitive adhesive
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims abstract description 30
- 239000010410 layer Substances 0.000 claims abstract description 28
- 239000000463 material Substances 0.000 claims abstract description 12
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 11
- 238000005520 cutting process Methods 0.000 claims description 9
- 239000012790 adhesive layer Substances 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 7
- 229920000800 acrylic rubber Polymers 0.000 abstract description 2
- 239000002985 plastic film Substances 0.000 abstract description 2
- 229920000058 polyacrylate Polymers 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
「産業上の利用分野」
本発明は、フレキシブルプリント回路基板、特に薄くフ
レキシビリティの高いものであって、比較的小さな形状
のフレキシブルプリント回路基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention relates to a flexible printed circuit board, particularly a flexible printed circuit board that is thin and highly flexible, and has a relatively small shape.
「従来の技術」
従来、小さく薄く７レキシビリテイの高いプリント回路
基板を、実装時の作業性向上等の目的でベースシート上
に容易に剥離可能な状態で多数個配置したフレキシブル
プリント回路基板の製造法としては、例えば特開昭６０
−３１２９０号、特開昭６０−５２０８２号のように、
それに多数個のフレキシブルプリント回路基板を形成し
た一枚のフレキシブル基材の不要部分を、−度に全部切
断して個々のフレキシブルプリント回路基板がばらばら
な状態にならないように、適当な個所を一部仮連結用に
残して除去し、しかるのもフレキシブルプリント回路基
板の裏面等に一番好都合な中法の幅を持った、適当な粘
着剤処理をほどこしたベースシート等で、個々のフレキ
シブルプリント回路基板が連結されるように貼り合わせ
し、そのあとで最初側々のフレキシブルプリント回路基
板を連結した状態を保つため残しておいた不要連結部分
を切断除去して完成品を得る方法がある。"Conventional technology" Conventionally, a method of manufacturing a flexible printed circuit board in which a large number of small, thin, and highly flexible printed circuit boards are arranged on a base sheet in a state where they can be easily peeled off for the purpose of improving workability during mounting. For example, JP-A-60
-31290, JP-A No. 60-52082,
Then, in order to prevent unnecessary parts of one flexible substrate on which many flexible printed circuit boards are formed from being cut all at once, the individual flexible printed circuit boards are cut into pieces. The base sheet, which is left for temporary connection and removed, has the most convenient width for the back side of the flexible printed circuit board, and has been treated with an appropriate adhesive. There is a method of bonding the boards together so that they are connected, and then cutting and removing unnecessary connecting parts that were initially left to maintain the connected state of the flexible printed circuit boards on the sides to obtain a finished product.
「発明が解決しようとする課題」
処でフレキシブルプリント回路基板のある種のものでは
、その端子部あるいは可撓部等の必要個所の裏面に予め
粘着剤層を設けておき、この粘着剤によって、フレキシ
ブルプリント回路基板を機器に接着して実装するものが
ある。``Problems to be Solved by the Invention'' However, in some types of flexible printed circuit boards, an adhesive layer is previously provided on the back side of necessary parts such as terminals or flexible parts, and this adhesive can be used to Some devices are mounted by adhering a flexible printed circuit board to the device.
この場合、フレキシブルプリント回路基板が、−個づつ
単独に分割されたものにあっては、小さく薄い離型紙の
剥離作業は時間がかかる上に、製品間での不要なはり付
き等により打ち抜き工程、検査工程等で取り扱いが煩雑
となりやすい。In this case, if the flexible printed circuit board is divided into individual pieces, it is time consuming to peel off the small and thin release paper, and unnecessary adhesion between the products may cause the punching process to be delayed. Handling is likely to be complicated during the inspection process, etc.
又かかる不都合を解消するために例えば特囲昭６０−３
１２９０号、特開昭６０−５２０８２号等の発明があっ
て、上記の欠点の解消が試みられ、かなりの改善となっ
たが、製造工程かやＸ複雑となる上にやはり根本的に離
型紙を剥離する作業が製造工程中に於いて又は製品の実
装時に於いて省略出来ない。In addition, in order to eliminate such inconvenience, for example,
1290 and JP-A-60-52082, etc., attempts were made to solve the above-mentioned drawbacks, and they were a considerable improvement, but the manufacturing process became more complicated and still fundamentally required release paper. The work of peeling off the film cannot be omitted during the manufacturing process or when mounting the product.
本発明は、従前の技術のかかる問題点を解消するべく、
小さく薄く剥離しにくい離型紙が実装時に自動的に剥離
される事を主眼として開発されたものである。In order to solve the problems of the conventional technology, the present invention has the following features:
It was developed with the aim of automatically peeling off the small, thin, and difficult-to-peel release paper during mounting.
「課題を解決するための手段」
即ち本発明は、フレキシブル基材に製品となるべき所要
のフレキシブルプリント回路基板を複数個形成したもの
を用い、フレキシブルプリント回路基板の裏面に接する
所要の部分に、片面離型剤処理された離型紙を離型剤処
理層か感圧性粘着剤層側となって有する感圧性粘着シー
トを、感圧性粘着剤層をプリント回路基板側に位置させ
て圧着し、そのフレキシブルプリント回路基板と反対の
側に、微粘着性を有するベースシートをフレキシブルプ
リント回路基板の裏面全体に圧着し、このものをフレキ
シブルプリント回路基板の必要な外周に泊ってベースシ
ートは切断せず、フレキシブルプリント回路基板と感圧
性粘着剤層を切断して構成した、感圧性粘着剤層付きフ
レキシブルプリント回路基板を多数個容易に剥離可能な
状態でベースシート上に配列したことを特徴とするフレ
キシブルプリント回路基板である。"Means for Solving the Problems" That is, the present invention uses a flexible base material in which a plurality of required flexible printed circuit boards to be made into a product are formed, and a required portion in contact with the back surface of the flexible printed circuit board is A pressure-sensitive adhesive sheet having a release paper treated with a release agent on one side on either the release agent-treated layer or the pressure-sensitive adhesive layer side is pressure-bonded with the pressure-sensitive adhesive layer positioned on the printed circuit board side. On the opposite side of the flexible printed circuit board, a slightly adhesive base sheet is crimped onto the entire back side of the flexible printed circuit board, and this is placed around the required outer periphery of the flexible printed circuit board without cutting the base sheet. A flexible print characterized in that a large number of flexible printed circuit boards with a pressure-sensitive adhesive layer, which are formed by cutting a flexible printed circuit board and a pressure-sensitive adhesive layer, are arranged on a base sheet in an easily peelable state. It is a circuit board.
以下に具体例により本発明の詳細な説明する。The present invention will be explained in detail below using specific examples.
本発明のフレキシブルプリント回路基板の構造（後述第
２図（ａ）のＡ−Ａ切断面に対応する完成製品切断面〕
を第５図に示している。図中（２）はフレキシブルプリ
ント回路基板であり、ベースフィルム（９）、接着剤（
１０）、配線パターンを構成する導体（銅）（８）、カ
バーレイ（絶縁層Ｘ１１）で構成される。Structure of the flexible printed circuit board of the present invention (finished product cut surface corresponding to the A-A cut surface in FIG. 2(a) described later)
is shown in Figure 5. In the figure (2) is a flexible printed circuit board, which includes a base film (9), an adhesive (
10), a conductor (copper) (8) constituting a wiring pattern, and a coverlay (insulating layer X11).
（４）は感圧性粘着剤層、（５）は片面離型剤処理され
た離型紙で（４）、（５）で感圧性粘着テープとなる。(4) is a pressure-sensitive adhesive layer, (5) is a release paper treated with a release agent on one side, and (4) and (5) form a pressure-sensitive adhesive tape.
（６）はベースシー）、（７）は（６）の微粘着剤層で
ある。(6) is the base sea) and (7) is the slightly adhesive layer of (6).
上記に於いてフレキシブルプリント回路基板（２）は複
数個が一枚のベースシート（６）上に横並びに存在する
。In the above, a plurality of flexible printed circuit boards (2) are arranged side by side on one base sheet (6).
「作用」
上記の本発明の製品は、後述製造工程から理解される通
り、複数個のフレキシブルプリント回路基板が微粘着剤
処理されたベースシート上に固定された状態で出来上っ
ている。"Function" As will be understood from the manufacturing process described below, the product of the present invention described above is made up of a plurality of flexible printed circuit boards fixed on a base sheet treated with a slight adhesive.
この製品から実装のため個々のフレキシブルプリント回
路基板を剥離、取り上げる時は、フレキシブルプリント
回路基板の裏面には必要な感圧性粘着剤層のみが付加さ
れた状態であって、感圧性粘着剤保護用離型紙除去の作
業は不必要である。When peeling off and picking up individual flexible printed circuit boards from this product for mounting, make sure that only the necessary pressure-sensitive adhesive layer is applied to the back side of the flexible printed circuit board to protect the pressure-sensitive adhesive. The work of removing release paper is unnecessary.
さて上記本発明の製品は以下の具体例の様にして作られ
る。Now, the above-mentioned product of the present invention is manufactured as shown in the following specific example.
第１図に於いて、（１）はカバーレイのあるフレキシブ
ル銅張積層板等の基材を示し、この基材（１）には常法
に従って製品となるべき複数個のフレキシブルプリント
回路基板（２）を形成しである。なお（８）は配線バク
ーンである。In Figure 1, (1) shows a base material such as a flexible copper-clad laminate with a coverlay, and this base material (1) has a plurality of flexible printed circuit boards ( 2) is formed. Note that (8) is a wiring Bakun.
そして−例としてこのフレキシブルプリント回路基板（
２）は（３）で示す可撓性部分の一部に実装時に必要な
所要の強度を有する感圧性粘着剤層の付加が要求された
ものとする。And - for example, this flexible printed circuit board (
In 2), it is assumed that a pressure-sensitive adhesive layer having the required strength necessary for mounting is required to be added to a part of the flexible portion shown in (3).
第２図は本発明の好ましい実施例を示すもので、フレキ
シブルプリント回路基板（２）の可撓性部分（３）の裏
面に感圧性粘着剤層（４）を貼り合わせする。この際感
圧性粘着剤層（４）のフレキシブルプリント回路基板と
接している面と反対の面は第２図（ｂ）に示すように片
面離型剤処理した離型紙（５）で保護されており（片面
離型剤処理層は感圧性粘着剤層側）、（４）、（５）で
感圧性粘着テープを構成する。FIG. 2 shows a preferred embodiment of the present invention, in which a pressure-sensitive adhesive layer (4) is bonded to the back side of a flexible portion (3) of a flexible printed circuit board (2). At this time, the surface of the pressure-sensitive adhesive layer (4) opposite to the surface in contact with the flexible printed circuit board is protected with a release paper (5) treated with a release agent on one side, as shown in Figure 2(b). (1-sided release agent treated layer is on the pressure-sensitive adhesive layer side), (4) and (5) constitute a pressure-sensitive adhesive tape.
一方で第６図に示すような基材（１）と同寸法で、厚さ
５０〜２００μｍ程の紙又はプラスチック製のシートで
その片面にアクリルゴム系微粘着剤層（７）を２〜３μ
ｍ程形成したベースシート（６）を用意する。On the other hand, a paper or plastic sheet with the same dimensions as the base material (1) and a thickness of about 50 to 200 μm as shown in FIG.
A base sheet (6) of about m length is prepared.
前記第２図のように加工されたフレキシブル基材（１）
とベースシート（６）を、次の工程では第４図に示す如
く１〜５ Ｋ９／ａＡの圧力で加圧接着させる。フレキ
シブル基材（１）とベースシート（６）はベースシート
上に付加された微粘着層（７）により全面で（感圧性粘
着剤層のある部分はそれを介して）接着するが、説明の
便宜上一部組れた状態で第４図は描かれている。Flexible base material (1) processed as shown in Figure 2 above
In the next step, the base sheet (6) and the base sheet (6) are bonded under pressure at a pressure of 1 to 5 K9/aA as shown in FIG. The flexible base material (1) and the base sheet (6) are adhered to each other on the entire surface (through the pressure-sensitive adhesive layer) by the slight adhesive layer (7) added on the base sheet, but as explained in the explanation. For convenience, FIG. 4 is drawn in a partially assembled state.
以上の工程を経て、ベースシートと一体化されたフレキ
シブル基材の製品となるべき、フレキシブルプリント回
路基板（２）の外周に沿って（第２図をも参照）、刃先
深さを調節して、フレキシブルプリント基板（２）と感
圧性粘着剤層（４）とが切り抜かれ、ベースシート（６
）はほとんど切り込まないハーフカット加工を行い、製
品とならない不要部分を除去する。After going through the above steps, the depth of the cutting edge is adjusted along the outer periphery of the flexible printed circuit board (2) (see also Figure 2), which is to become a flexible substrate product integrated with the base sheet. , the flexible printed circuit board (2) and the pressure-sensitive adhesive layer (4) are cut out, and the base sheet (6) is cut out.
) performs a half-cut process that requires almost no cutting, and removes unnecessary parts that will not become part of the product.
かくして前述第５図の如き完成製品が得られる。In this way, a finished product as shown in FIG. 5 is obtained.
尚製品形状によっては、ハーフカット加工に至るいずれ
かの工程に於いて、実装時製品剥離を容易にする目的等
によりベースシートの適当な位置に孔明加工をするのも
有効である。Depending on the shape of the product, it may be effective to make holes at appropriate positions on the base sheet during any of the steps leading to half-cutting, for the purpose of facilitating product peeling during mounting.
以上説明した製造工程からも明らかなように、上記完成
品はベースシート（６）の上に感圧性粘着剤層（４）を
必要個所に有する複数個のフレキシブルプリント回路基
板（２）が微粘着剤層（７）により固定された状態であ
って実装のため離型紙の存在により容易に剥離でき能率
の良い実装作業が可能である。As is clear from the manufacturing process explained above, the finished product has a plurality of flexible printed circuit boards (2) having a pressure-sensitive adhesive layer (4) in the necessary places on a base sheet (6) with a slight adhesiveness. It is fixed by the agent layer (7) and can be easily peeled off due to the presence of a release paper for mounting, allowing efficient mounting work.
なお本発明に於いて、航記の如く、離型紙を有する忍圧
性粘着剤層をフレキシブルプリント回路基板に貼り合わ
せた後で、微粘着性を有するベースシートをフレキシブ
ルプリント回路基板に貼り合わせ前に、ハーフカットで
は打ち抜き出来ないフレキシブル回路基板上の孔及び一
部外周を打抜くこともある。In addition, in the present invention, as described above, after the pressure-resistant adhesive layer with release paper is bonded to the flexible printed circuit board, and before the base sheet having slight adhesiveness is bonded to the flexible printed circuit board, In some cases, holes and part of the outer periphery of the flexible circuit board that cannot be punched out by half-cutting are punched out.
「発明の効果」
以上説明したような本発明によるフレキシブルプリント
回路基板は、これを実装する等の後工程に於いて下記の
、＠に記述する有効な利点かある。"Effects of the Invention" The flexible printed circuit board according to the present invention as described above has the following effective advantages in post-processes such as mounting.
■ 特に小さく薄くフレキシビリティの高いフレキシブ
ルプリント回路基板を製造する時点及び実装する時点で
、小さな面積の薄い離型紙をいちいち時間をかけて取り
除く作業が無い事等取り扱い作業がやりやすくなって工
数低減、歩留向上が期待出来る。■ In particular, when manufacturing and mounting flexible printed circuit boards that are small, thin, and highly flexible, the handling work becomes easier and the number of man-hours is reduced because there is no need to take time to remove thin release paper from a small area one by one. Yield improvement can be expected.
＠ ７レキシプルプリント回路基板がベースシート上に
連続して、容易に剥離可能な状態で規則的に配列されて
いるので、上記の実装作業もその一例であるが、当該フ
レキシブルプリン）回路基板を取り扱う後工程での自動
化を容易ならしめる。@7 The flexible printed circuit boards are arranged continuously and regularly on the base sheet in a manner that allows them to be easily peeled off. Facilitates automation in post-process handling.
第１図はそれに複数個のフレキシブルプリント回路基板
か形成されたフレキシブル基材の斜視図、第２図（ａ）
はフレキシブル基材裏面の必要な部面に感圧性粘着テー
プを貼り合わもしたものの平面図、第２図（ｂ）は第２
図（ａ）のＡ−Ａ断面図、第３図は片面にアクリルゴム
系微粘着剤層付加加工された紙又はプラスチック製ベー
スシートの断面図、第４図はフレキシブル基材とベース
シートを重ね合わせ一体となったものの断面図、第５図
は本発明の製品トなったフレキシブルプリント回路基板
の断面図（たｙし第２図（ｂ）に対応するもの）を夫々
例示している。
１・・・フレキシブル基材、
２１９．フレキシブルプリント回路基板、３）・・・（
６）の可撓部分、
４）・・・感圧性粘着剤層、（５）・・・離型紙、６）
・・・ベースシート、（７）・・・微粘着層り層。
第
電
図
８゛
第
図
第
図
第
因FIG. 1 is a perspective view of a flexible substrate on which a plurality of flexible printed circuit boards are formed; FIG. 2(a)
Figure 2(b) is a plan view of a flexible substrate with pressure-sensitive adhesive tape pasted on the necessary parts of the back side of the flexible base material.
Figure 3 is a cross-sectional view of a paper or plastic base sheet treated with an acrylic rubber-based slight adhesive layer on one side; Figure 4 is a cross-sectional view of the flexible base material and the base sheet stacked together. FIG. 5 is a cross-sectional view of the assembled product, and FIG. 5 is a cross-sectional view of a flexible printed circuit board (corresponding to FIG. 2(b)) as a product of the present invention. 1...Flexible base material, 219. Flexible printed circuit board, 3)...(
Flexible portion of 6), 4)...Pressure sensitive adhesive layer, (5)...Release paper, 6)
... base sheet, (7) ... slightly adhesive layer. Chart 8゛ Chart Chart Chart Cause
Claims (1)
シブルプリント回路基板を複数個形成したものを用い、
フレキシブルプリント回路基板の裏面に接する所要の部
分に、片面離型剤処理された離型紙を離型剤処理層が感
圧性粘着剤層側となって有する感圧性粘着シートを、感
圧性粘着剤層をフレキシブルプリント回路基板側に位置
させて圧着し、そのフレキシブルプリント回路基板と反
対の側に、微粘着性を有するベースシートをフレキシブ
ルプリント回路基板の裏面全体に圧着し、このものをフ
レキシブルプリント回路基板の必要な外周に沿ってベー
スシートは切断せず、フレキシブルプリント回路基板と
感圧性粘着剤層を切断して構成した、感圧性粘着剤層付
きフレキシブルプリント回路基板を多数個容易に剥離可
能な状態でベースシート上に配列したことを特徴とする
フレキシブルプリント回路基板。(1) Using a flexible base material formed with a plurality of flexible printed circuit boards as required to become a product,
A pressure-sensitive adhesive sheet having a release paper treated with a release agent on one side, with the release agent-treated layer facing the pressure-sensitive adhesive layer, is placed on the required portion of the flexible printed circuit board in contact with the back surface of the flexible printed circuit board. is placed on the side of the flexible printed circuit board and crimped, and on the opposite side to the flexible printed circuit board, a base sheet with slight adhesiveness is crimped over the entire back side of the flexible printed circuit board, and this is used as a flexible printed circuit board. A state in which a large number of flexible printed circuit boards with a pressure-sensitive adhesive layer can be easily peeled off by cutting the flexible printed circuit board and the pressure-sensitive adhesive layer without cutting the base sheet along the required outer circumference. A flexible printed circuit board characterized by being arranged on a base sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34339289A JPH03204989A (en) | 1989-12-31 | 1989-12-31 | Flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34339289A JPH03204989A (en) | 1989-12-31 | 1989-12-31 | Flexible printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03204989A true JPH03204989A (en) | 1991-09-06 |
| JPH0524676B2 JPH0524676B2 (en) | 1993-04-08 |
Family
ID=18361160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34339289A Granted JPH03204989A (en) | 1989-12-31 | 1989-12-31 | Flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03204989A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009277804A (en) * | 2008-05-13 | 2009-11-26 | Ricoh Co Ltd | Pattern arrangement sheet and method of manufacturing the same, and electronic device chip and method of manufacturing the same |
| CN109936920A (en) * | 2017-12-16 | 2019-06-25 | 神讯电脑(昆山)有限公司 | The link configuration of LED light bar |
-
1989
- 1989-12-31 JP JP34339289A patent/JPH03204989A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009277804A (en) * | 2008-05-13 | 2009-11-26 | Ricoh Co Ltd | Pattern arrangement sheet and method of manufacturing the same, and electronic device chip and method of manufacturing the same |
| CN109936920A (en) * | 2017-12-16 | 2019-06-25 | 神讯电脑(昆山)有限公司 | The link configuration of LED light bar |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0524676B2 (en) | 1993-04-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |