JP2004106880A - Cover tape for packaging electronic parts, and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cover tape for packaging an electronic part wherein the quality deterioration by a winding collapse is eliminated, and unevenness in peeling strength is reduced, and which is easy to use. <P>SOLUTION: This cover tape has a structure wherein on a base material film having an antistatic layer at least on one surface, a pressure-sensitive adhesive layer and a release film are laminated in this order. The pressure-sensitive adhesive layer is laminated on both sides of the base material film excepting the central part, and the release film has a release agent layer on the surface on the pressure-sensitive adhesive layer side. <P>COPYRIGHT: (C)2004,JPO

Description

【００３６】
＊）基材上面とは、感圧接着剤層が積層されない側の面。基材下面とは、感圧接着剤層が積層される側の面。
【００３７】
【表２】

【００３８】
【表３】

【００３９】
【発明の効果】
本発明のカバーテープによれば、カバーテープ自体の巻き崩れによる品質低下がないので、密封作業、開封作業が良好できる。
特に、請求項２のカバーテープによれば、基材フィルムの一面（上面）に帯電防止層を設けたものでも、帯電防止層上に離型剤層を設ける必要がなくなり、その結果として、上記帯電防止層と離型剤層との密着が悪いために、巻き物としたときに離型剤層が感圧接着剤層に転写する不具合を防げる。
また、請求項３のカバーテープによれば、カバーテープでキャリアテープ（電子部品入り）を密封する際、より確実にカバーテープの帯電による事故を防ぐことができる。
さらに、請求項４の製造方法によれば、粘着面が露出していないので、巻き崩れが容易に修正でき、カバーテープの製造速度を上げることができる。
【図面の簡単な説明】
【図１】本発明の第１実施例の電子部品包装用カバーテープの断面構成図である。
【図２】本発明の第２実施例の電子部品包装用カバーテープの断面構成図である。
【図３】本発明の第３実施例の電子部品包装用カバーテープの断面構成図である。
【図４】本発明の第４実施例の電子部品包装用カバーテープの断面構成図である。
【図５】本発明の第５実施例の電子部品包装用カバーテープの断面構成図である。
【図６】本発明の電子部品包装用カバーテープの一例であり、（ａ）は正面図、（ｂ）は断面構成図である。
【図７】本発明の電子部品包装用カバーテープを用い、エンボスキャリアテープを封止した状態を示す断面構成図である。
【符号の説明】
１０：電子部品包装用カバーテープ
１：帯電防止層
２：基材フィルム
３：感圧接着剤層
４：離型剤層
５：離型基材フィルム
６：離型フィルム[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention covers a carrier tape such as an embossed carrier tape or a square hole punched carrier tape for accommodating a chip-type electronic component used for storage, transportation, and mounting on an electronic circuit board of the chip-type electronic component. To a cover tape for packaging electronic parts.
[0002]
[Prior art]
In recent years, demand for small-sized electronic components has shown remarkable growth due to the remarkable development of surface mounting technology. These chip-type electronic components, for example, ICs, transistors, diodes, capacitors, crystal oscillators, etc., are housed in pockets of a carrier tape formed of a plastic molded product in a pocket shape, and the upper surface of the carrier tape is adhered with a cover tape. Thus, it is stored and transported in a sealed package. Attachment to an electronic circuit board or the like is performed by removing the cover tape, taking out the stored electronic components, and mounting them at predetermined positions.
[0003]
The cover tape has on its lower surface an adhesive layer for bonding to the upper surface of the carrier tape. Some adhesive layers use a pressure-sensitive adhesive. In the case of using the pressure-sensitive adhesive, the peel strength at the time of peeling the cover tape is hardly influenced by the material of the embossed carrier tape, and the stability of the peel strength with time is good.
And, in the case of a cover tape of a type using a pressure-sensitive adhesive, a release agent layer for winding the cover tape when forming the cover tape is usually provided on the upper surface thereof.
However, the width of the cover tape is usually from several millimeters to several tens of millimeters. However, when the width is taken as a roll, there is a problem that it is difficult to correct the roll if the roll collapses due to the influence of the pressure-sensitive adhesive layer. This is probably because the pressure-sensitive adhesive layer is not present at the center of the tape so that the electronic component does not adhere to the tape.
The winding collapse is likely to occur at the time of winding in the manufacture of the cover tape, but also occurs at the time of transporting or using the cover tape.
[0004]
Further, when formed into a roll, the release agent layer may be transferred to the adhesive layer, and the peel strength may vary.
The reason for this is that the cover tape needs an antistatic layer for antistatic, and if a release agent layer is provided on the antistatic layer, the release agent layer is This is probably because it is transferred to the layer. There is a demand for an improvement in the variation in the peel strength because the variation in the peel strength is a cause of trouble in taking out the electronic component.
[0005]
As such a conventional cover tape, there is known a chip transport cover tape formed of a laminate in which a release layer is laminated on one surface of a base material and pressure-sensitive adhesive portions are laminated on both longitudinal ends of the other surface. Have been.
[0006]
[Patent Document 1]
JP-A-6-81986 (Claims, FIGS. 3 and 4)
[0007]
[Problems to be solved by the invention]
The present invention is intended to solve the problem when the cover tape is made into a roll, and aims to provide a cover tape for electronic component packaging that does not have quality deterioration due to winding collapse, and furthermore, has a peel strength. An object of the present invention is to provide a cover tape for packaging electronic parts which has a small variation and is easy to use.
[0008]
[Means for Solving the Problems]
The present invention is a cover tape having a structure in which a pressure-sensitive adhesive layer and a release film are sequentially laminated on a substrate film having an antistatic layer on at least one surface, wherein the pressure-sensitive adhesive layer comprises a substrate A cover tape for packaging electronic parts, characterized in that the release film is laminated on both sides except for the central portion of the film, and the release film has a release agent layer on the surface on the pressure-sensitive adhesive layer side. About.
Here, the cover tape for packaging electronic parts of the present invention has a structure in which an antistatic layer is laminated on at least one surface of a base film, and a pressure-sensitive adhesive layer and a release film are sequentially laminated on the other surface. Can be
Further, the cover tape for packaging electronic parts of the present invention may have an antistatic layer on a surface other than the pressure-sensitive adhesive layer side.
Next, the present invention applies a plurality of pressure-sensitive adhesive layers at regular intervals along the longitudinal direction of the film to a base film having an antistatic layer on at least one surface, and then releases the base film. After bonding the release agent layer side of the release film having the release agent layer to the pressure-sensitive adhesive layer and integrating the same, the pressure-sensitive adhesive layer of each strip is cut at substantially the center in the longitudinal direction of the film. The present invention relates to a method for producing the above-mentioned cover tape for packaging electronic parts.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
The present invention is a tape covering an embossed carrier tape or a square hole punched carrier tape provided with a storage pocket for storing electronic components, and at least one surface of a base film made of a plastic film, preferably the upper surface. An antistatic layer, for example, an antistatic layer having a surface resistivity of 1 × 10 ¹² Ω / □ or less. The carrier tape has a pressure-sensitive adhesive layer coated in stripes so that the opening area of the concave portion is a non-adhesive surface, and is formed of a plastic film having a release agent layer provided on the pressure-sensitive adhesive layer side. Laminated with release film.
Preferably, an antistatic layer, for example, an antistatic layer having a surface resistivity of 1 × 10 ¹² Ω / □ or less is provided on at least the outermost surface of the release film base layer. The non-adhesive surface preferably has a total light transmittance of 60% or more and a haze value of 20% or less so that the inside of the storage pocket can be seen through.
[0010]
Hereinafter, a first embodiment of a cover tape for packaging electronic parts according to the present invention will be described with reference to FIGS.
FIG. 1 is a cross-sectional configuration diagram of an example of a cover tape for packaging electronic components of the present invention.
The cover tape 10 of the first embodiment shown in FIG. 1 has an antistatic layer 1 provided on the uppermost layer of a base film 2.
A pressure-sensitive adhesive layer 3 is provided on both sides of the lower surface of the base film 2 except for the center.
Further, the release film 6 is provided with a release agent layer 4 on the pressure-sensitive adhesive layer 3 side of the release base film 5.
[0011]
Here, as a synthetic resin used for the base film 2 of the cover tape 10 of the present invention, a biaxially stretched film such as polyester such as polyethylene terephthalate, polyamide, or polypropylene is used to add rigidity to the cover tape. Is preferred. Preferably, it is a biaxially stretched film of polyethylene terephthalate (PET). The base film 2 needs to be able to withstand the strength when the cover tape is peeled off from the carrier tape 20 (see FIG. 7). Accordingly, the strength is preferably, for example, one having a tensile strength of 1.50 kgf / mm ² or more. The thickness of the base film 2 is preferably 6 to 50 μm. If the thickness is less than 6 μm, the strength is insufficient, and wrinkles are likely to occur during bonding. On the other hand, if it exceeds 50 μm, the flexibility becomes insufficient and the adhesion becomes difficult.
In order to improve the adhesion to the antistatic layer 1 and / or the pressure-sensitive adhesive layer 3, the base film 2 is preliminarily subjected to a preliminary treatment such as a corona treatment, a plasma treatment, or a sandblast treatment on the film surface. It may be.
[0012]
Examples of a method for forming the antistatic agent layer 1 include a method of applying a surfactant, a method of applying conductive fine particles, a method of depositing a metal, and a method of applying or forming a π-electron conjugated conductive polymer. As a coating method, a known method such as a gravure coat, a die head coat, a reverse coat, a comma coat, an air knife coat, and a Mayer bar coat is used. As a vapor deposition method, a known method such as a vacuum vapor deposition method is used. The surface resistivity of the antistatic layer 1 is 1 × 10 ¹² Ω / □ or less, preferably 1 × 10 ⁷ Ω / □ or less.
[0013]
Examples of the method of applying the surfactant include a fatty acid amine salt which is an ionic surfactant, an anionic surfactant such as an alkyl phosphate type, an alkyl sulfate type, and an alkyl allyl sulfate type, or an alkyl amine sulfate type or a quaternary ammonium. Cationic surfactants such as salt type, quaternary ammonium resin type, bilidium salt, morpholine derivative, sorbitan type which is a nonionic surfactant, ether type, amine or amide type, ethanolamide type, fatty acid glycerin ester, alkyl There are alkyl betaine type, alkyl imidazoline derivative, alanine salt and the like, which are amphoteric activators such as polyethyleneimine, and used alone or in combination. When a surfactant is used, it is difficult to lower the surface resistivity, so it is desirable to apply the surfactant to both surfaces of the base film 2 as shown in FIGS.
[0014]
The method for applying the conductive fine particles is not particularly limited as long as it is a conductive fine particle, and fine metal particles such as nickel, aluminum, copper, and iron, conductive carbon fine particles, tin oxide, zinc oxide, and titanium oxide A conductive sulfide such as a metal oxide such as zinc sulfide, copper sulfide, and nickel sulfide is used, and is applied by being mixed with a coating resin.
When the thickness of the resin mixed with the conductive fine particles is large, the haze value becomes high, and when the resin is thin, a sufficient antistatic effect is not obtained. Therefore, it is desirable to laminate the resin with a thickness of 0.5 to 20 μm.
[0015]
As a method for depositing a metal, an inorganic oxide such as aluminum oxide, tin oxide, magnesium oxide, or a mixture thereof is used. Thickness of vapor deposition increases as the thickness increases, and there is a risk that the thin film may be cracked by external factors such as bending and pulling. It is desirable that the layers be stacked at the same time.
[0016]
A method of applying or forming a π-electron conjugated conductive polymer is to use a monomer having a conjugated double bond in the molecular structure and causing polymerization by oxidation, such as aniline and an aniline derivative, N-methylpyrrole, and 3-methylpyrrole. , 3-methylthiophene, 3-methylfuran, 3-methylindole, etc. are used, and are brought into contact with an oxidizing polymerization agent in the presence of a dopant such as an inorganic acid or an organic sulfonic acid to form a π-electron conjugated conductive polymer layer. To form The π-electron conjugated conductive polymer obtained by the above method may be mixed with a coating resin and applied.
[0017]
The pressure-sensitive adhesive layer 3 uses an acrylic, rubber, silicon-based pressure-sensitive adhesive, and is formed by a known method such as a gravure coat, a die head coat, a reverse coat, a comma coat, an air knife coat, and a Meyer bar coat. It is applied in a stripe shape in the longitudinal direction of the base film 2. In the slit processing, the central part of the stripe coating is cut and wound into a record shape or the like. The width of the stripe coating is determined by the opening of the concave portion of the carrier tape and the sealable region. However, if the width is small, slit processing becomes difficult. Peeling strength adjusts the strength when peeling the cover tape from the carrier tape to 10 g to 130 g. If necessary, additives such as a crosslinking agent, a plasticizer, a stabilizer, and a pigment may be added to the pressure-sensitive adhesive. If the thickness of the pressure-sensitive adhesive layer 3 is too large, the distance from the carrier tape becomes large, and the stored electronic components are turned over or rolled over, causing an obstacle at the time of surface mounting, and if it is thin, good adhesion cannot be obtained. It is desirable to laminate with a thickness of 5 to 30 μm.
[0018]
The release film 6 is laminated immediately after the pressure-sensitive adhesive layer 3 is applied to the base film 2 by stripe coating, and the center of the stripe is cut with a microslitter or the like, and wound up in a record state in the laminated state. The release film 6 is removed at the time of use, that is, at the time of bonding to the carrier tape in which the electronic component is inserted.
The material of the release substrate film 5 needs to be able to withstand the strength at the time of removal, and it is preferable to use a biaxially stretched film such as polyester such as polyethylene terephthalate, polyamide, or polypropylene. The thickness of the release base film 5 is preferably 6 to 50 μm, similarly to the base film 2 of the cover tape.
[0019]
Further, a release agent layer 4 is provided on the pressure-sensitive adhesive layer 3 side of the release base film 5.
The release agent layer 4 is made of a thermosetting resin such as an epoxy resin or an isocyanate resin, or a glass-based inorganic compound containing a silicone compound, silicon, or aluminum, and is applied by the known method as described above. If the thickness of the release agent layer 4 is large, the risk of transfer to the pressure-sensitive adhesive layer 3 increases, and if the thickness is small, an appropriate release effect cannot be obtained. It is desirable that the layers are laminated at a thickness of 0.05 to 1.0 g / m ² ).
[0020]
The cover tape 10 of the present invention has a plurality of strips of the pressure-sensitive adhesive layer 3 at regular intervals along the longitudinal direction of the film on the lower surface side of the base film 2 having the antistatic layer 1 on the uppermost layer. After being coated in a shape, the release substrate film 6 having the release agent layer 4 on one surface of the release substrate film 5 is placed such that the pressure-sensitive adhesive layer 3 side and the release agent layer 4 side face each other. Then, by cutting along the longitudinal direction of the film and cutting at substantially the center of the pressure-sensitive adhesive layer 3, an elongated cover tape as shown in FIG. 6 can be obtained. Here, in FIG. 6, (a) is a side view of the cover tape, and (b) is a cross-sectional configuration diagram thereof.
Further, as shown in FIG. 7, the cover tape 10 of the present invention is used as a cover tape for sealing the embossed carrier tape 20 on which the electronic components 30 are mounted.
[0021]
Next, the second embodiment of the present invention shown in FIG. 2 is the same as the first embodiment except that the antistatic layer 1 is provided on the lower surface of the base film 2 instead of the upper surface. In this case, the antistatic layer 1 is provided on the lower surface of the base film.
[0022]
The third embodiment of the present invention shown in FIG. 3 is the same as the first embodiment except that the antistatic layers 1 are provided on both surfaces of the base film 2. In this case, since the antistatic layer 1 is provided on both sides of the base film, there is an effect that disturbance due to static electricity can be reduced.
[0023]
In addition, the fourth embodiment of the present invention shown in FIG. 4 is different from that in which an antistatic layer 1 having, for example, a surface resistivity of 1 × 10 ¹² Ω / □ or less is further provided on the lower surface (outside) of the release base film 5. Is the same as in the first embodiment. In this case, since the antistatic layer 1 is also provided on the lower surface side of the release substrate film 5, an effect of suppressing the adsorption of dust is exerted. In particular, it is preferable to use an antistatic agent as the antistatic layer 1 because the antistatic property is exhibited.
[0024]
Further, in the fifth embodiment of the present invention shown in FIG. 5, the lower surface side of the base film 2 and the lower surface (outside) of the release base film 5 have, for example, a surface resistivity of 1 × 10 ¹² Ω / □ or less. It is the same as the first embodiment, except that the prevention layer 1 is further provided. In this case, since the antistatic layer 1 is provided on both sides of the base film 2 and on the lower surface side of the release base film 5, the effect of suppressing the adsorption of dust more than in the fourth embodiment is exerted. In particular, it is preferable to use an antistatic agent as the antistatic layer 1 because the antistatic property is exhibited.
[0025]
【Example】
Hereinafter, examples of the present invention will be described in detail, but the present invention is not limited to these examples. The compounds used, the base film, the contents of the cover tape and the carrier tape, and various evaluations are as follows.
[0026]
Quaternary ammonium surfactants, manufactured by Kao Corporation, Sarsol B-50
Formation of polypyrrole;
The base film is immersed in a 0.1 mol / l potassium peroxodisulfate aqueous solution, and a 1/5 volume of a 0.2 mol / l pyrrole aqueous solution is added to the solution to form a base film. Antistatic layers of polypyrrole were formed on both sides.
Acrylic adhesive; Acronal-4D, manufactured by Mitsubishi Yuka Birdish Co., Ltd.
Silicone release agent; SRX-211 manufactured by Dow Corning Toray Silicone Co., Ltd.
PET film; Lumirror, manufactured by Toray Industries, Inc.
Preparation of cover tape With the non-adhesive surface being 3.5 mm wide, a pressure-sensitive adhesive is applied in stripes to a width of 2 mm to form a pressure-sensitive adhesive layer, and the pressure-sensitive adhesive is applied with a microslitter. The central portion of the layer was cut, and a cover tape having a width of 1 mm and a width of 5.5 mm on each side was produced, and then wound up to give a 1,000 m roll.
[0028]
Carrier tape There are two types of embossed carrier tapes: one in which carbon is kneaded in polystyrene (hereinafter, carbon-kneaded PS) and one in which carbon is printed on amorphous polyethylene terephthalate (hereinafter, carbon-coated A-PET). Carrier tapes were used, and these were used as test pieces for a peel test after adhesion with the cover tape.
[0029]
The surface resistivity was measured according to JIS K-6911. The measurement conditions are 23 ° C. and 50% RH, the printing pressure is 10 V, and the unit is Ω / □.
Winding efficiency (slit processing efficiency)
The cutting speed at the time of slitting was used as an evaluation standard.
；: 20 m / min or more ×; less than 20 m / min
Roll collapse correction property The rolled cover tape was forced into a roll collapse state, and it was evaluated whether the roll collapse could be corrected.
；: Can be easily corrected.
×: almost uncorrectable.
[0030]
Peel strength was measured according to JIS C-0806. Peeling angle 170 °, Peeling speed 300m
Peeled at m / min and measured at room temperature. The test piece was produced by pressing (adhering) a total of 20 points, which were collected at intervals of 50 m, from a 1,000 m long cover tape to a carrier tape.
Difference between maximum value and minimum value In the peel strength test , the difference between the maximum value and the minimum value in 20 test pieces was determined.
[0031]
Example 1
A biaxially stretched polyethylene terephthalate (PET) film is used as a base film, and an antistatic agent containing a quaternary ammonium surfactant as a main component is applied to both surfaces of the base material, and pressure-sensitive adhesive containing an acrylic resin as a main component An antistatic agent was applied to the outside of a release film having a PET film as a base material, a silicone-based release agent was applied to the pressure-sensitive adhesive side, and the pressure-sensitive adhesive was stripe-coated. Immediately after, a release film was bonded to the pressure-sensitive adhesive layer side, slitted to a narrow width, and then wound up to produce a cover tape of the present invention.
[0032]
Table 1 shows the surface resistivity of the obtained cover tape upper surface (base film upper surface antistatic layer), the lower surface (base film lower surface antistatic layer), the slit processing efficiency, and the like. Further, using the obtained cover tape (the cover tape is stored in a rolled state in an environment of 25 ° C. to 35 ° C. for 30 days), it is pressure-bonded (adhered) to the carrier tape, and then left alone (conditions in Table 3). ), The peel strength when the cover tape was peeled off, the change with time of the peel strength, the difference between the maximum value and the minimum value, and the peeling charge potential were measured. Table 3 shows the results.
[0033]
Example 2
A cover tape was obtained in the same manner as in Example 1 except that the antistatic layer of the quaternary ammonium-based surfactant was a π-electron conjugated conductive polymer. The results are shown in Tables 1 and 3.
[0034]
Comparative Examples 1-2
A cover tape was prepared and evaluated in the same manner as in Example 1 except that the configuration of the cover tape was as shown in Table 2. The results are shown in Tables 2 and 3.
[0035]
[Table 1]

[0036]
*) The upper surface of the substrate is the surface on which the pressure-sensitive adhesive layer is not laminated. The lower surface of the substrate is a surface on which the pressure-sensitive adhesive layer is laminated.
[0037]
[Table 2]

[0038]
[Table 3]

[0039]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to the cover tape of this invention, since there is no quality deterioration by the collapse of the cover tape itself, a sealing operation and an opening operation can be favorable.
In particular, according to the cover tape of claim 2, even when the antistatic layer is provided on one surface (upper surface) of the base film, it is not necessary to provide the release agent layer on the antistatic layer. Since the adhesion between the antistatic layer and the release agent layer is poor, it is possible to prevent the release agent layer from transferring to the pressure-sensitive adhesive layer when it is formed into a roll.
According to the cover tape of the third aspect, when the carrier tape (containing electronic components) is sealed with the cover tape, an accident due to charging of the cover tape can be more reliably prevented.
Further, according to the manufacturing method of the fourth aspect, since the adhesive surface is not exposed, the winding collapse can be easily corrected, and the manufacturing speed of the cover tape can be increased.
[Brief description of the drawings]
FIG. 1 is a sectional configuration view of a cover tape for packaging electronic components according to a first embodiment of the present invention.
FIG. 2 is a sectional configuration view of a cover tape for packaging electronic components according to a second embodiment of the present invention.
FIG. 3 is a sectional configuration view of a cover tape for packaging electronic parts according to a third embodiment of the present invention.
FIG. 4 is a sectional configuration view of a cover tape for packaging electronic components according to a fourth embodiment of the present invention.
FIG. 5 is a sectional configuration view of a cover tape for packaging electronic parts according to a fifth embodiment of the present invention.
6A and 6B are examples of a cover tape for packaging electronic components of the present invention, wherein FIG. 6A is a front view and FIG.
FIG. 7 is a cross-sectional configuration diagram showing a state in which an embossed carrier tape is sealed using the electronic component packaging cover tape of the present invention.
[Explanation of symbols]
10: Cover tape for packaging electronic parts 1: Antistatic layer 2: Base film 3: Pressure-sensitive adhesive layer 4: Release agent layer 5: Release base film 6: Release film

Claims (4)

A cover tape having a structure in which a pressure-sensitive adhesive layer and a release film are sequentially laminated on a base film having an antistatic layer on at least one surface, wherein the pressure-sensitive adhesive layer is located at a central portion of the base film. And a release film having a release agent layer on the surface on the side of the pressure-sensitive adhesive layer, except for the above. 2. The cover tape for packaging electronic parts according to claim 1, wherein an antistatic layer is laminated on at least one surface of the base film, and a pressure-sensitive adhesive layer and a release film are sequentially laminated on the other surface. 3. The cover tape for packaging electronic parts according to claim 1, wherein the release film has an antistatic layer on a surface other than the pressure-sensitive adhesive layer side. A base film having an antistatic layer on at least one surface, along the longitudinal direction of the film, at regular intervals, a plurality of strips, after applying a pressure-sensitive adhesive layer, a release having a release agent layer After laminating the release agent layer side of the film with the pressure-sensitive adhesive layer and integrating them, the pressure-sensitive adhesive layer of each strip is cut at substantially the center in the longitudinal direction of the film. 3. The method for producing a cover tape for packaging electronic parts according to any one of 3.

Images