JP2012188133A - Sealant material, cover tape and package for conveying electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sealant material which is excellent in adhesive force with a carrier tape even in an adhesion condition of a short time required for a carrier tape for conveying electronic parts which contains polycarbonate, is capable of suppressing the deterioration in the adhesive force when performing the aging in high temperature and high humidity and is excellent in peelability (peeling sense) on the peeling.SOLUTION: The sealant material is used for the carrier tape for conveying electronic parts which contains polycarbonate and includes at least an ethylene-(meth)acrylic acid alkyl ester copolymer (A) and a tackiness-imparting agent (B), wherein content ratios of the ethylene-(meth)acrylic acid alkyl ester copolymer (A), the tackiness-imparting agent (B), an ethylene-vinyl acetate copolymer (C) and an ethylene-α-olefin copolymerization elastomer (D) are respectively 25 to 95 pts.mass, 3 to 20 pts.mass, 0 to 70 pts.mass and 0 to 70 pts.mass, with respect to 100 pts.mass of the sum amount of (A) to (D).

Description

  The present invention relates to a sealant material that is in close contact with a carrier tape using polycarbonate suitable for storage and transportation of IC chips and the like, a cover tape using the sealant material, and a package for transporting electronic components.

Carrier tapes used for transporting and storing microchips such as semiconductors and electronic components are widely known.
According to this carrier tape, microchips and the like that are too small to be handled can be stored and transported by being embedded one by one in a recess provided in the carrier tape.
A cover tape for closing a recess in which a microchip or the like is embedded is adhered to the carrier tape by heat sealing or the like, and packaged. After transporting in this state, the carrier tape is set in a component assembly machine (mounting machine) called a mounter, and the embedded microchip or the like can be taken out.

  In addition to microchips and the like, conventionally, plastic containers having easily openable lid materials are known as containers for foods and drinks such as cup noodles, jelly and yogurt, and pharmaceuticals. As a heat seal material provided on such an easy-open lid, for example, a composition of an ethylene / vinyl acetate copolymer and a tackifying resin, polyethylene or a low crystalline ethylene / α-olefin copolymer, etc. A heat seal material blended with is known.

  However, plastic materials used for the carrier tape main body are also diversified, and the heat sealability desired by the conventional heat seal material may not be maintained. Further, depending on the application, the required heat sealability differs, and other characteristics are required.

  As a technique related to heat sealing, an ethylene copolymer composition containing an ethylene / unsaturated ester copolymer, an elastomer, a crystalline polyolefin, and a tackifier in a desired range is disclosed (for example, patents). It is said that it is excellent in sealing property, low-temperature heat-sealing property, and easy-opening property with respect to food and drink containers such as polypropylene and polystyrene.

  Also disclosed is a heat-sealable resin composition obtained by melt-mixing an ethylene / vinyl ester having a predetermined vinyl ester content, a copolymer of ethylene and propylene or butene-1, and a tackifier (for example, And Patent Documents 2 to 3). This is known as an easy-open heat-seal material used for food packaging such as pudding and jelly.

WO2006 / 090722 JP 58-47038 A Japanese Patent Publication No. 63-29894

  As the carrier tape described above, those based on polystyrene (PS) are mainly used. However, the processing speed of the carrier tape tends to increase due to a demand for improvement in productivity, and the above-mentioned carrier tape is based on PS. The carrier tape used as a material has a problem of breaking when the speed is increased. In response to this problem, an increasing number of cases where polycarbonate (PC) is used as a base material for carrier tapes. In addition, there are an increasing number of cases in which conductive polycarbonate is used for high-speed production targeting ESD (electrostatic sensitive devices).

However, in addition to PC being a material that is difficult to bond, a carrier tape using PC is required to be bonded at a high temperature for a short time (for example, 0.1 to 0.3 seconds). For this reason, carrier tapes using PCs tend to make it difficult to obtain a desired adhesive force as an adhesive force by thermal bonding (heat sealing).
In addition, the carrier tape is sealed with a cover tape and then stored under high temperature and high humidity (for example, in an environment of 60 ° C. and 90% RH). Delamination can be a problem.
Furthermore, in the carrier tape, from the viewpoint of preventing displacement and pop-out of the IC chip to be encapsulated, zipping when peeling the sealant material (cover tape) from the carrier tape (smooth vibration occurs without being able to peel smoothly) It is sometimes required to suppress the phenomenon), that is, to improve the peelability (peeling feeling) at the time of peeling.

  The present invention has been made in view of the above, and is excellent in adhesive strength with a carrier tape even under a short time bonding condition required for a carrier tape for conveying an electronic component containing polycarbonate, under high temperature and high humidity. It is intended to provide a sealant material that is suppressed in lowering of the adhesive force when aging is performed and has excellent peelability (peeling feeling) at the time of peeling, and a cover tape and a packaging for transporting electronic components using the same. The purpose is to achieve the purpose.

Specific means for achieving the above object are as follows.
<1> Used for carrier tapes for transporting electronic components containing polycarbonate,
(A) an ethylene / (meth) acrylic acid alkyl ester copolymer;
(B) a tackifier;
Including at least
The content ratio of the (A), (B), (C) ethylene / vinyl acetate copolymer, and (D) ethylene / α-olefin copolymer elastomer is a total amount of (A) to (D) 100. It is the sealant material which is 25-95 mass parts, 3-20 mass parts, 0-70 mass parts, and 0-70 mass parts, respectively with respect to mass parts.

<2> Furthermore, it is a sealant material as described in <1> containing the (E) antiblocking agent whose content ratio with respect to 100 mass parts of total amounts of said (A)-(D) is 0.1-10 mass parts.

<3> Further, the content ratio of (A) to (D) to 100 parts by mass of the total amount includes 0.1 to 5 parts by mass of (F) slip agent <1> or <2> The sealant material described in 1.

<4> A layer containing the sealant material according to any one of <1> to <3> on a base material, and thermally bonded to a carrier tape for conveying an electronic component containing polycarbonate. Cover tape.

<5> A carrier tape for conveying an electronic component containing polycarbonate, and a layer containing the sealant material according to any one of <1> to <3> on a substrate, and the carrier for conveying an electronic component And a cover tape for heat-bonding to the tape.

  According to the present invention, when the aging is performed under high temperature and high humidity, the adhesive tape is excellent in adhesive force even under a short time bonding condition required for a carrier tape for transporting electronic components containing polycarbonate. Thus, a sealant material excellent in peelability (peeling feeling) at the time of peeling, a cover tape using the same, and a package for transporting electronic components can be provided.

  Hereinafter, the sealant material, the cover tape, and the electronic component carrying package of the present invention will be described in detail.

  The sealant material of the present invention is used for carrier tapes for transporting electronic components containing polycarbonate, and (A) an ethylene / (meth) acrylic acid alkyl ester copolymer (hereinafter referred to as “component (A)” or “(A ) ") And (B) a tackifier (hereinafter also referred to as" component (B) "or" (B) "), and (A), (B), (C) Ethylene / vinyl acetate copolymer (hereinafter also referred to as “component (C)” or “(C)”), and (D) ethylene / α-olefin copolymer elastomer (hereinafter referred to as “component (D)” or “( D) ”) is contained in an amount of 25 to 95 parts by mass, 3 to 20 parts by mass, 0 to 70 parts by mass, and 0 with respect to 100 parts by mass of the total amount of (A) to (D). -70 mass parts.

By adopting the sealant material of the present invention as described above, it has excellent adhesive strength with the carrier tape, high temperature and high humidity even under short-time bonding conditions required for carrier tapes for transporting electronic components containing polycarbonate. A decrease in the adhesive strength when aging is performed under a low temperature (for example, in an environment of 60 ° C. and 90% RH) is suppressed. Furthermore, since the difference between the maximum peel strength and the minimum peel strength at the heat seal portion can be reduced, the peelability (peeling feeling) at the time of peeling can be improved. In other words, it can be peeled off smoothly without feeling the vibration of zippering.
Hereinafter, the adhesive force may be referred to as “heat seal strength” or “peel strength”.

(A) Ethylene / (meth) acrylic acid alkyl ester copolymer The sealant material of the present invention contains an ethylene / (meth) acrylic acid alkyl ester copolymer (component (A)). The sealant material of the present invention may contain the component (A) alone or in combination of two or more.
In the present invention, the content ratio of the component (A) in the sealant material is in the range of 25 to 95 parts by mass with respect to 100 parts by mass of the total amount of the components (A) to (D).
When the content ratio of the component (A) to 100 parts by mass of the total amount of the components (A) to (D) is less than 25 parts by mass, the adhesive strength (heat seal strength) decreases due to aging under high temperature and high humidity. .
When the amount of the component (A) with respect to 100 parts by mass of the total amount of the components (A) to (D) exceeds 95 parts by mass, the adhesive strength (heat seal strength) is insufficient.
Especially, 30-90 mass parts is preferable and, as for the quantity of the component (A) with respect to 100 mass parts of total amounts of component (A)-(D), 40-90 mass parts is more preferable.

The ethylene / (meth) acrylic acid alkyl ester copolymer (A), which is an essential component of the resin composition in the present invention, has 1 or more carbon atoms (preferably 1 to 8 carbon atoms) of ethylene and acrylic acid or methacrylic acid. It is a copolymer (preferably a random copolymer) with an alkyl ester.
Examples of alkyl esters of acrylic acid or methacrylic acid include methyl acrylate, ethyl acrylate, isopropyl acrylate, npropyl acrylate, isobutyl acrylate, nbutyl acrylate, 2-ethylhexyl acrylate, methyl methacrylate, Examples include ethyl methacrylate, npropyl methacrylate, isopropyl methacrylate, isobutyl methacrylate, nbutyl methacrylate and the like.

Among these, (meth) acrylic acid alkyl ester having an alkyl ester having 1 to 4 carbon atoms is preferable from the viewpoint of availability, performance, and price.
Examples of such preferred copolymer (A) include ethylene / methyl acrylate, ethylene / ethyl acrylate copolymer, ethylene / n-propyl acrylate copolymer, ethylene / isopropyl acrylate copolymer, and ethylene / acrylic. N-butyl acid copolymer, ethylene / isobutyl acrylate copolymer, ethylene / methyl methacrylate copolymer, ethylene / ethyl methacrylate copolymer, ethylene / n-propyl methacrylate copolymer, ethylene / isopropyl methacrylate copolymer Examples thereof include a polymer, an ethylene / nbutyl methacrylate copolymer, and an ethylene / isobutyl methacrylate copolymer.

  In addition, the component (A) in this invention may copolymerize 2 or more types of (meth) acrylic-acid alkylester with ethylene.

  In addition, among the component (A) in the present invention, preferably used are a melting point T [° C.] measured in accordance with JIS K7121-1987, and a (meth) acrylic acid alkyl ester unit content X [mol]. %] Satisfies the formula (1).

    −3.0X + 125 ≧ T ≧ −3.0X + 107 (1)

  The component (A) satisfying the formula (1) is excellent in heat resistance as compared with the ethylene / (meth) acrylic acid alkyl ester copolymer not satisfying the formula (1). Therefore, the sealant strength (heat seal strength) that can withstand the heat generated by high-speed production can be maintained.

The method for producing the component (A) satisfying the formula (1) is not particularly limited, but can be obtained by a high-pressure radical polymerization process by a tubular method.
For example, ethylene gas and the total amount of (meth) acrylic acid alkyl ester monomer and organic peroxide are introduced from the inlet of the tubular reactor, and the average reaction temperature in the reactor is set in the range of 150 to 250 ° C. When polymerization is performed, a component (A) satisfying the formula (1) is obtained.
Since the reactivity differs between ethylene and (meth) acrylic acid alkyl ester, the concentration of the (meth) acrylic acid alkyl ester monomer in ethylene gas varies at the inlet and outlet in the tubular reactor. That is, the (meth) acrylic acid alkyl ester monomer concentration in the ethylene gas is high at the inlet portion and low at the outlet portion, and a copolymer having a high (meth) acrylic acid alkyl ester content and a low copolymer are mixed. To generate. Among them, a copolymer having a low (meth) acrylic acid alkyl ester content gives a higher melting point and heat resistance. Therefore, when the average value of the (meth) acrylic acid alkyl ester content of the copolymer is the same, the component (A) obtained by the tubular method has a higher melting point than the autoclave method. The component (A) that satisfies the conditions can be obtained.

  The component (A) of the present invention may be obtained by polymerization by an ordinary autoclave method other than the above.

  The component (A) in the present invention is not particularly limited, but the (meth) acrylic acid alkyl ester unit content X is 0.5 mol% or more and 15 mol% or less, preferably 0.5 mol% or more and 10 mol% or less, More preferably, it is 1.5 mol% or more and 6 mol% or less. Component (A) in which X is in the above range is further excellent in the mechanical properties, heat resistance, and heat seal strength of the sealant material.

The (meth) acrylic acid alkyl ester unit content X is measured by an infrared absorption spectrum (IR) belonging to the (meth) acrylic acid alkyl ester. For example, in the case of ethyl acrylate (EA), it is determined from the absorbance at 860 cm ⁻¹ belonging to EA. However, the calibration curve is obtained by determining the EA concentration by nuclear magnetic resonance spectrum (NMR) and correlating with the absorbance of IR at 860 cm ⁻¹ .

In addition, the component (A) in the present invention is not particularly limited, but the melt flow rate (190 ° C., 2160 g load) measured according to JIS K7210-1999 is 1 g / 10 min to 50 g / 10 min, preferably It is 2 g / 10 min or more and 10 g / 10 min or less.
When the melt flow rate of the component (A) is 1 g / 10 min or more, the film processability is further improved, and when the melt flow rate of the component (A) is 50 g / 10 min or less, the low molecular component is Therefore, the phenomenon of stickiness with the carrier tape after aging can be further suppressed.

(B) Tackifier The sealant material of the present invention contains at least one tackifier (component (B)).
In this invention, let the content rate of the component (B) in a sealant material be the range of 3-20 mass parts with respect to 100 mass parts of total amounts of said (A)-(D).
When the content ratio of the component (B) with respect to 100 parts by mass of the total amount of the components (A) to (D) is less than 3 parts by mass, the heat seal strength is insufficient.
When the content ratio of the component (B) with respect to 100 parts by mass of the total amount of the components (A) to (D) exceeds 20 parts by mass, the strength tends to be excessive, and the peelability (peeling feeling) at the time of peeling deteriorates.
Especially, 5-15 mass parts is preferable and, as for the content ratio of the component (B) with respect to 100 mass parts of total amounts of component (A)-(D), 7-11 mass parts is more preferable.

  As the tackifier, a tackifying resin can be used. Examples of tackifiers include aliphatic hydrocarbon resins, alicyclic hydrocarbon resins, aromatic hydrocarbon resins, polyterpene resins, rosins, styrene resins, coumarone / indene resins, and the like. it can.

  As the aliphatic hydrocarbon resin, for example, a fraction containing at least one mono- or diolefin having 4 to 5 carbon atoms such as 1-butene, isobutene, butadiene, 1,3-pentadiene, isoprene, and the like is polymerized. And the resulting resin.

  Examples of the alicyclic hydrocarbon resin include a resin obtained by polymerizing a cyclic monomer such as cyclopentadiene, a resin obtained by polymerizing a diene component in the spent C4 to C5 fraction after cyclization and dimerization, and aromatic Examples thereof include resins obtained by intra-nuclear hydrogenation of group hydrocarbon resins (for example, hydrogenated petroleum resins).

  Examples of the aromatic hydrocarbon resin include a resin obtained by polymerizing a fraction containing at least one vinyl aromatic hydrocarbon having 8 to 10 carbon atoms such as vinyltoluene, indene, and α-methylstyrene, or Examples thereof include resins obtained by copolymerizing these fractions and the aliphatic hydrocarbon fraction.

  Examples of the polyterpene resins include α-pinene polymers, β-pinene polymers, dipentene polymers, terpene / phenol copolymers, α-pinene / phenol copolymers, and hydrogenated products thereof. Can do.

  Examples of the rosins include, for example, rosins such as gum rosin, wood rosin and tall oil, and modified products thereof. Examples of the modified products include those subjected to modification such as hydrogenation, disproportionation, dimerization, and esterification. it can.

  Examples of the styrene resin include low molecular weight resinous polymers obtained by polymerizing styrene monomers such as styrene, vinyl toluene, α-methyl styrene, and isopropyl toluene.

  The tackifier tends to be preferably a resin having a softening point of 85 to 130 ° C. When the softening point is generally 85 ° C. or higher, the effect of excellent heat resistance tends to be exhibited, and when it is 130 ° C. or lower, the effect of excellent adhesiveness tends to be exhibited.

(C) Ethylene / vinyl acetate copolymer The sealant material of the present invention preferably contains at least one ethylene / vinyl acetate copolymer (component (C)).
When the sealant material of the present invention contains the component (C), the heat seal strength can be further stabilized.

In this invention, let the content rate of the component (C) in a sealant material be the range of 0-70 mass parts with respect to 100 mass parts of total amounts of a component (A)-(D).
When the content ratio of the component (C) with respect to 100 parts by mass of the total amount of the components (A) to (D) exceeds 70 parts by mass, the heat seal strength after aging is significantly reduced.
Especially, 1-70 mass parts is preferable, as for the content rate of the component (C) with respect to 100 mass parts of total amounts of component (A)-(D), 1-30 mass parts is more preferable, and 1-20 mass parts is further. 5 to 10 parts by mass is preferable.

The ethylene / vinyl acetate copolymer in the present invention is a copolymer obtained by copolymerizing at least ethylene and vinyl acetate, and in some cases, other monomers may be further copolymerized.
The copolymerization ratio of vinyl ester in the ethylene / vinyl acetate copolymer (that is, the content of structural units derived from vinyl ester) is 3 to 20% by mass relative to the total mass of the ethylene / vinyl acetate copolymer. It is preferable that Thereby, heat seal intensity | strength can be improved more and stickiness can be suppressed more.
Examples of the vinyl ester include vinyl acetate and vinyl propionate, and the copolymer unit of the copolymer may include a plurality of types of vinyl ester-derived structural units. In the present invention, at least a vinyl acetate-derived structural unit is included. The case where it contains as a copolymerization unit is preferable.

  The ethylene / vinyl acetate copolymer in the present invention is preferably a binary copolymer of ethylene and vinyl acetate in a proportion of 3 to 20% by mass relative to the total mass of the copolymer.

  The melt flow rate (unit: g / 10 min) at 190 ° C. and 2160 g load measured in accordance with JIS K7210-1999 of the (C) ethylene / vinyl acetate copolymer is as follows. From the viewpoint of property (peelability), 1 to 30 g / 10 minutes is preferable, and 1 to 10 g / 10 minutes is more preferable.

(D) Ethylene / α-olefin copolymer elastomer The sealant material of the present invention preferably contains at least one ethylene / α-olefin copolymer elastomer (component (D)).
When the sealant material of the present invention contains the component (D), the temperature dependence of the heat seal strength can be reduced.

In this invention, let the content rate of the component (D) in a sealant material be the range of 0-70 mass parts with respect to 100 mass parts of total amounts of a component (A)-(D).
When the content ratio of the component (D) with respect to 100 parts by mass of the total amount of the components (A) to (D) exceeds 70 parts by mass, the stickiness increases and the workability may be deteriorated.
Especially, 1-70 mass parts is preferable, as for the content ratio of the component (D) with respect to 100 mass parts of total amounts of component (A)-(D), 5-60 mass parts is more preferable, and 10-50 mass parts is further. 10 to 40 parts by mass are preferable.

  As an alpha olefin, a C2-C12 thing is preferable, for example, ethylene, propylene, 1-butene, 1-hexene, 1-octene, 4-methyl-pentene etc. are mentioned.

  Examples of the ethylene / α-olefin copolymer elastomer include an ethylene / propylene copolymer, an ethylene / 1-butene copolymer, an ethylene / 1-hexene copolymer, and an ethylene / 1-octene copolymer. Of these, ethylene / 1-butene copolymer is particularly preferred.

The density of the ethylene / α-olefin copolymer elastomer is preferably in the range of 860 to 900 kg / m ³ and more preferably in the range of 880 to 890 kg / m ³ from the viewpoint of improving heat seal strength and suppressing the occurrence of zipping.

(E) Antiblocking agent It is preferable that the sealant material of this invention contains at least 1 type (component (E)) of an antiblocking agent. By containing an antiblocking agent, the blocking of the film is alleviated.

  Examples of the antiblocking agent include silica, aluminosilicate (zeolite, etc.) and the like.

In this invention, the component (E) in a sealant material can be contained in the range of 0.1-10 mass parts with respect to 100 mass parts of total amounts of the said components (A)-(D). When the content ratio of the component (E) is 0.1 parts by mass or more, it indicates that it is substantially included for imparting anti-blocking properties. High prevention effect. When the content ratio of the component (E) is 10% by mass or less, it is advantageous in that the transparency can be kept high.
Especially, from a sticky prevention and transparency viewpoint, the content ratio of a component (E) has the preferable range of 1-3 mass parts with respect to 100 mass parts of total amounts of the said components (A)-(D).

(F) Slip Agent The sealant material of the present invention preferably contains at least one slip agent (component (F)). By containing a slip agent, processability such as extrusion, roll-off property, film slipperiness and the like are improved.

  Examples of slip agents include palmitic acid amide, stearic acid amide, behenic acid amide, oleic acid amide, erucic acid amide, oleyl palmamide, stearyl palmamide, methylene bis stearyl amide, methylene bis oleyl amide, ethylene bis oleyl amide, Examples include various amides such as ethylenebiserucic acid amide, polyalkylene glycols such as polyethylene glycol and polypropylene glycol, and hydrogenated castor oil.

In this invention, the component (F) in a sealant material can be contained in the range of 0.1-5 mass parts with respect to 100 mass parts of total amounts of the said components (A)-(D). When the content ratio of the component (F) is 0.1 parts by mass or more, it indicates that it is substantially included for imparting slip properties. When it is 0.1 parts by mass or more, processability such as extrusion, separation Rollability and film slipperiness are improved. Conversely, when the content of the component (F) is 5% by mass or less, it is advantageous in that excessive slip does not occur and the sealant material is not contaminated.
Especially, from a viewpoint of workability, a roll-off property, and film slipperiness, the content ratio of a component (F) is 0.2-1 mass with respect to 100 mass parts of total amounts of the said component (A)-(D). A range of parts is preferred.

  In addition to the above components, the sealant material of the present invention can be exemplified by additives such as antioxidants, heat stabilizers, light stabilizers, pigments, and dyes as necessary.

  The sealant material of the present invention includes the components (A) and (B), and the components (C), (D), (E), (F), and other additives that may be blended as necessary. The agents can be prepared by mixing each simultaneously or sequentially. In preparing the sealant material of the present invention, a single screw extruder, a twin screw extruder, a Banbury mixer, various kneaders, and the like can be used.

  The sealant material of the present invention has a melt flow rate (MFR; the same shall apply hereinafter) at 190 ° C. and 2160 g load in accordance with JIS K7210-1999 in consideration of processability such as extrusion and heat seal strength, and 1 to 100 g / 10. Minutes are preferred, especially those from 3 to 50 g / 10 minutes.

  The sealant material of the present invention is used for a carrier tape (particularly a polycarbonate carrier tape) for transporting electronic components containing polycarbonate, and is laminated on the carrier tape and bonded by heat sealing or the like, for example, an IC chip. It can be stored and transported by closing the storage section storing the container.

  The sealant material of the present invention can be used by a method in which a film is formed in advance by a casting method or an inflation method and is bonded to a carrier tape containing polycarbonate by a dry lamination method.

  Next, the cover tape of the present invention and the electronic component transport packaging body using the same will be described in detail.

The cover tape of the present invention is used by heat-sealing a carrier tape for transporting electronic components produced by including polycarbonate, and includes a base material and the sealant material of the present invention on the base material. A layer (hereinafter also referred to as a “sealant layer”) is provided.
Since the cover tape of the present invention is constituted by using the sealant material of the present invention, the adhesive force with the carrier tape can be obtained even under short-time bonding conditions required for a carrier tape for transporting electronic components containing polycarbonate. And the reduction of the adhesive force due to aging under high temperature and high humidity is suppressed. Furthermore, the cover tape of the present invention is excellent in peelability at the time of peeling, that is, it can be peeled smoothly while suppressing zipping, so that the electronic components housed in the carrier tape spill out and change its position. In addition, adverse effects on static electricity sensitive devices due to static electricity based on peeling electrification can be suppressed.

  In addition, the carrier tape for transporting electronic components to which the cover tape of the present invention can be applied is not only the one prepared by including the above-mentioned polycarbonate, but also one that contains a styrene resin or one made of paper. Applicable.

  The thickness of the sealant layer is preferably 3 to 50 μm. When the thickness is within the above range, good heat sealability can be obtained.

  There is no restriction | limiting in particular as a base material, Paper, aluminum, polyester (for example, polyethylene terephthalate), polyethylene, polypropylene, polystyrene, aluminum vapor deposition polyester, aluminum vapor deposition polypropylene, silica vapor deposition polyester, etc. are mentioned. These base materials may have not only a single layer structure but also a laminated structure of two or more layers.

The package for transporting electronic components of the present invention has a carrier tape for transporting electronic components produced by including polycarbonate, and a layer containing the above-described sealant material of the present invention on a base material. And a cover tape that is thermally bonded to the carrier tape.
Since the package for transporting electronic components of the present invention is configured using the sealant material of the present invention, the carrier tape can be used even under short-time bonding conditions required for carrier tapes for transporting electronic components containing polycarbonate. The adhesive strength between the cover tape and the cover tape is excellent, and a decrease in the adhesive strength due to aging under high temperature and high humidity is suppressed. Furthermore, the electronic component transport packaging body of the present invention has excellent peelability when peeling the carrier tape and the cover tape, that is, it can be peeled smoothly while suppressing zipping, so that the electronic component housed in the carrier tape Can be prevented from spilling out and changing its position, and adverse effects on static electricity sensitive devices due to static electricity based on peeling charging can be suppressed.

  Carrier tape for transporting electronic components is set in a component assembly machine (mounting machine), embedded in electronic components such as microchips, stored, transported, etc., and then can be taken out as desired It is formed.

  The package for transporting electronic components uses carrier tape and cover tape for transporting electronic components, and an opening for opening a housing portion that accommodates electronic components (for example, IC chips and electrostatic sensitive devices) of the carrier tape for transporting electronic components. The cover tape is overlaid on the surface such that the sealant layer faces the opening surface and heat-sealed from above the cover tape.

  EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples. However, the present invention is not limited to the following examples unless it exceeds the gist thereof. Unless otherwise specified, “part” is based on mass.

[Examples 1-4, Comparative Examples 1-3]
-Preparation of sealant composition-
Each component was charged into a 65 mmφ single screw extruder (manufactured by Nakatani Machinery Co., Ltd.) so as to have the composition shown in Table 1 below, and melt-kneaded at a resin temperature of 160 ° C. to prepare a sealant composition.

-Production of evaluation film-
Next, stretched polyethylene terephthalate (PET) having a thickness of 12 μm and low-density polyethylene (LDPE) having a thickness of 20 μm were stacked by extrusion and extruded to prepare a stretched PET / LDPE laminated film having a multilayer structure.
On the LDPE surface of this stretched PET / LDPE laminate film, the sealant composition prepared above was extruded and laminated at a thickness of 20 μm by extrusion lamination using a 40 mmφT die molding machine (manufactured by Nakatani Machinery Co., Ltd.). An evaluation film having a laminated structure of / LDPE / stretched PET was produced.
The extrusion lamination was performed under conditions of a resin temperature of 220 ° C. and a processing speed of 30 m / min.

-Production of laminated samples-
Apart from the above, a polycarbonate carrier tape (made by Taiwan Carrier Tape Enterprise Co., Ltd.) was prepared as an adherend.
On this polycarbonate carrier tape (hereinafter also referred to as “PC carrier tape”), the evaluation film prepared above is overlaid so that the sealant layer faces the PC carrier tape, and heated under the following conditions using a heat sealer. Sealed to obtain a laminated sample.
<Condition>
-Heat sealer: manufactured by Tester Sangyo Co., Ltd.-Heat seal temperature: 2 conditions of 150 ° C and 180 ° C-Heat seal pressure: 0.3 MPa
Heat seal time: 0.3 seconds Heat seal bar and heat seal location: Two heat seal bars of 0.5 mm width x 300 mm length were arranged, and the heat seal location was 1 mm wide x 300 mm long.

-Evaluation-
The produced laminated sample was stored under the following condition a or the following condition b, and the sample after storage was measured and evaluated as follows.
The results of measurement and evaluation are shown in Table 2 and Table 3 below.
(Condition a) Standing in a room at 23 ° C. and 50% RH for 1 day (Condition b) Standing in a thermostatic chamber at 60 ° C. and 90% RH for 7 days (aging), then 23 ° C. and 50% RH Leave in the room for 1 day

[Peel strength (heat seal strength)]
For the sample after storage under the condition a or b, a peel strength tester VG-35 (manufactured by Vanguard) is used to peel the evaluation film from the PC carrier tape as the adherend under the following peeling conditions ( That is, the heat-sealed portion was peeled off), and the peel strength at the time of peeling was measured.
The average value of the peel strength at the heat-sealed portion was defined as the peel strength after storage in the treatment a or the treatment b, and the obtained peel strength is shown in Table 2 or Table 3. Moreover, about the sample after the storage on condition b, the presence or absence of the zipping at the time of peeling of an evaluation film was also confirmed in that case.
<Peeling conditions>
・ Peeling speed: 300 mm / min
Peeling angle: 165 ° to 180 ° (angle between the evaluation film and the pulling direction when peeling)
・ Peeling direction: peeling in the longitudinal direction

[Change rate of peel strength due to aging]
According to the following formula (2), the rate of change in peel strength due to aging was determined.

Rate of change in peel strength due to aging (%)
= ((Peel strength after storage under condition b-Peel strength after storage under condition a) / Peel strength after storage under condition a) × 100 (2)

[Peel strength difference]
In the measurement of the peel strength of the sample after storage under the above condition b, the difference between the maximum peel strength and the minimum peel strength at the heat-sealed portion was determined and used as the peel strength difference.
The smaller the peel strength difference (less than 30 g / mm), the better the peelability (peeling feeling) at the time of peeling.
The larger the peel strength difference is, the worse the peelability (peeling feeling) at the time of peeling, and the tendency for zipping to occur.

-Description of Table 1-
MFR: Melt flow rate measured in accordance with JIS K7210-1999 at 190 ° C. and a load of 2160 g (unit: g / 10 minutes)
EMA: ethylene / methyl acrylate copolymer (content of structural unit derived from methyl acrylate (MA) 2.8 mol%, melting point 101 ° C. (melting range 98.6 to 116.6 according to formula (1)) ℃))
EVA1: Ethylene / vinyl acetate copolymer 1 (content of structural unit derived from vinyl acetate (VA): 16% by mass)
EVA2: ethylene-vinyl acetate copolymer 2 (content of structural unit derived from vinyl acetate (VA) 10 mass%)
EBR: ethylene butene copolymer (Toughmer A4085, manufactured by Mitsui Chemicals, Inc.)
・ Ethylenehexene copolymer: Evolue SP0540, manufactured by Prime Polymer Co., Ltd. ・ Hydrogenated petroleum resin: Hydrogenated aromatic hydrocarbon resin (Arcon AM1, Arakawa Chemical Co., Ltd.)
-Terpene phenol resin: YS Polystar T145, manufactured by Yasuhara Chemical Co., Ltd.-Softening temperature: Ring and ball method softening point-AB agent: Anti-blocking agent (Silton JC-50 (aluminum silicate), Mizusawa Chemical Co., Ltd.)
・ ELA: erucic acid amide ・ PEG4000: Polyethylene glycol (manufactured by NOF Corporation)

As shown in Table 2 and Table 3, in Examples 1 to 4, the peel strength (adhesive strength) is high, and the decrease in peel strength (adhesive strength) when aging is performed under high temperature and high humidity is suppressed. It was. Further, in Examples 1 to 4, since the difference in peel strength was small, it was confirmed that the peelability (peel feeling) at the time of peeling was excellent.
On the other hand, in Comparative Example 1 containing no component (B), the peel strength was low.
Moreover, the peel strength was low even in Comparative Example 2 composed only of the component (A).
Moreover, in the comparative example 3 which does not contain a component (A), the peeling strength when performing aging under high temperature and high humidity fell. Furthermore, in Comparative Example 3, the peel strength difference was large, and the peelability (peel feeling) at the time of peeling was lowered.

Claims (5)

Used in carrier tapes for transporting electronic parts containing polycarbonate,
(A) an ethylene / (meth) acrylic acid alkyl ester copolymer;
(B) a tackifier;
Including at least
The content ratio of the (A), (B), (C) ethylene / vinyl acetate copolymer, and (D) ethylene / α-olefin copolymer elastomer is a total amount of (A) to (D) 100. The sealant material which is 25-95 mass parts, 3-20 mass parts, 0-70 mass parts, and 0-70 mass parts, respectively with respect to mass parts.   The sealant material according to claim 1, further comprising (E) an antiblocking agent having a content ratio of 0.1 to 10 parts by mass with respect to 100 parts by mass of the total amount of (A) to (D).   Furthermore, the content ratio with respect to 100 mass parts of total amounts of said (A)-(D) contains 0.1-5 mass parts (F) slip agent, The Claim 1 or Claim 2 characterized by the above-mentioned. Sealant material.   The cover tape which has a layer containing the sealant material of any one of Claims 1-3 on a base material, and is heat-bonded and used for the carrier tape for electronic component conveyance containing polycarbonate.   A carrier tape for transporting electronic components containing polycarbonate, and a layer containing the sealant material according to any one of claims 1 to 3 on a substrate, wherein the carrier tape for transporting electronic components is heated. A package for transporting electronic components, comprising a cover tape to be bonded.