JP6950773B6 - - Google Patents
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- Publication number
- JP6950773B6 JP6950773B6 JP2020047023A JP2020047023A JP6950773B6 JP 6950773 B6 JP6950773 B6 JP 6950773B6 JP 2020047023 A JP2020047023 A JP 2020047023A JP 2020047023 A JP2020047023 A JP 2020047023A JP 6950773 B6 JP6950773 B6 JP 6950773B6
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020047023A JP6950773B1 (en) | 2020-03-17 | 2020-03-17 | Cover tape and packaging for electronic component packaging |
| JP2022508406A JP7201125B2 (en) | 2020-03-17 | 2021-03-17 | Electronic component packaging cover tape and package |
| TW110109523A TW202142460A (en) | 2020-03-17 | 2021-03-17 | Cover tape for packing electronic component and package |
| CN202180021226.8A CN115298109B (en) | 2020-03-17 | 2021-03-17 | Cover tape for packaging electronic component and package |
| PCT/JP2021/010788 WO2021187519A1 (en) | 2020-03-17 | 2021-03-17 | Electronic component packaging cover tape and package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020047023A JP6950773B1 (en) | 2020-03-17 | 2020-03-17 | Cover tape and packaging for electronic component packaging |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP6950773B1 JP6950773B1 (en) | 2021-10-13 |
| JP2021176758A JP2021176758A (en) | 2021-11-11 |
| JP6950773B6 true JP6950773B6 (en) | 2022-01-05 |
Family
ID=77771597
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020047023A Ceased JP6950773B1 (en) | 2020-03-17 | 2020-03-17 | Cover tape and packaging for electronic component packaging |
| JP2022508406A Active JP7201125B2 (en) | 2020-03-17 | 2021-03-17 | Electronic component packaging cover tape and package |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022508406A Active JP7201125B2 (en) | 2020-03-17 | 2021-03-17 | Electronic component packaging cover tape and package |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP6950773B1 (en) |
| CN (1) | CN115298109B (en) |
| TW (1) | TW202142460A (en) |
| WO (1) | WO2021187519A1 (en) |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4460870B2 (en) * | 2003-10-09 | 2010-05-12 | 北越紀州製紙株式会社 | Carrier tape paper for chip electronic devices |
| CN101070420B (en) * | 2006-05-09 | 2010-05-12 | 远东新世纪股份有限公司 | Conductive polymer composition and anti-static coating and anti-static film made thereby |
| JP5419329B2 (en) * | 2007-05-08 | 2014-02-19 | 日東電工株式会社 | Laminated tape for packaging materials |
| JP5456602B2 (en) * | 2010-06-29 | 2014-04-02 | 旭化成ケミカルズ株式会社 | Cover tape, cover tape manufacturing method, and electronic component package |
| CN101648622A (en) * | 2009-09-08 | 2010-02-17 | 联盟电子科技（昆山）有限公司 | Method for dissipating charges on end face of cover tape |
| CN101789294B (en) * | 2009-12-16 | 2012-03-07 | 深圳顺络电子股份有限公司 | Electronic component and manufacturing method thereof |
| JP2012214252A (en) * | 2010-09-30 | 2012-11-08 | Sumitomo Bakelite Co Ltd | Cover tape for packaging electronic component |
| JP6085410B2 (en) * | 2011-03-09 | 2017-02-22 | 三井・デュポンポリケミカル株式会社 | Sealant material, cover tape, and packaging for transporting electronic components |
| JP5602067B2 (en) * | 2011-03-09 | 2014-10-08 | 三井・デュポンポリケミカル株式会社 | Sealant material, cover tape, and packaging for transporting electronic components |
| SG11201401462QA (en) * | 2011-10-14 | 2014-09-26 | Denki Kagaku Kogyo Kk | Cover tape |
| JP6065569B2 (en) * | 2012-12-14 | 2017-01-25 | 住友ベークライト株式会社 | Cover tape for electronic component packaging and electronic component package |
| CN105377713A (en) * | 2013-07-09 | 2016-03-02 | 住友电木株式会社 | Cover tape for packaging electronic components |
| WO2016076331A1 (en) * | 2014-11-12 | 2016-05-19 | 住友ベークライト株式会社 | Cover tape for electronic part package, packaging material for electronic part package, and electronic part package |
| JP2018127256A (en) * | 2017-02-09 | 2018-08-16 | 住友ベークライト株式会社 | Cover tape and electronic component packaging body |
| JP7018173B2 (en) * | 2017-09-01 | 2022-02-10 | 東ソー株式会社 | Easy-to-peel film |
| JP6638751B2 (en) * | 2018-03-07 | 2020-01-29 | 住友ベークライト株式会社 | Cover tape and electronic component package |
-
2020
- 2020-03-17 JP JP2020047023A patent/JP6950773B1/en not_active Ceased
-
2021
- 2021-03-17 TW TW110109523A patent/TW202142460A/en unknown
- 2021-03-17 JP JP2022508406A patent/JP7201125B2/en active Active
- 2021-03-17 CN CN202180021226.8A patent/CN115298109B/en active Active
- 2021-03-17 WO PCT/JP2021/010788 patent/WO2021187519A1/en active Application Filing