CN101789294B - Electronic component and manufacturing method thereof - Google Patents
Electronic component and manufacturing method thereof Download PDFInfo
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- CN101789294B CN101789294B CN2009101891411A CN200910189141A CN101789294B CN 101789294 B CN101789294 B CN 101789294B CN 2009101891411 A CN2009101891411 A CN 2009101891411A CN 200910189141 A CN200910189141 A CN 200910189141A CN 101789294 B CN101789294 B CN 101789294B
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Abstract
The invention discloses an electronic component and a manufacturing method thereof. The method comprises the following steps of: (a) preparing a magnet; (b) coating the ends of the magnet with end sealing materials which can be decomposed easily to form an end sealing magnet; (c) forming a glass layer on the surface of the end sealing magnet; (d) baking the end sealing magnet to enable the end sealing materials and the glass at the end sealing parts to be separated from the ends of the magnet; and (e) forming terminal electrodes at the ends of the magnet. The electronic component manufactured with the method not only can protect the magnet of the component in the electroplating process, but also can ensure the effective connection of an external terminal and the magnet or an internal electrode thereof.
Description
Technical field
The present invention relates to electronic component, particularly comprise electronic component of magnet and preparation method thereof.
Background technology
In recent years, along with the extensive use of electronic devices and components, when paying attention to element function, pay close attention to reliability, the especially reliability of service life of element more.The ordinary electronic element often needs to electroplate; To guarantee being connected of terminal position and wiring board; But in acid or alkaline plating bath chemistry atmosphere; Element magnetic body part is corroded easily, deterioration, has a strong impact on element function, outward appearance and useful life, and wherein relatively the typical case promptly is the thermistor that [MnO2] x [Co3O4] y [NiO] z material system is made.This makes and prevents to be become very urgent by bath corrosion at the peripheral coated glass of magnet.In addition, during the electronic element mass production, owing to reasons such as material, sintering furnace temperature distributing disproportionation are spared, the internal electrode live width is wide; Tend to cause the magnet cracking; Make internal electrode expose in air, have a strong impact on component reliability, be necessary at magnet outer surface coating protective layer; When the crack is made up, isolated internal connecting electrodes and external environment.In the known technology solution; Patent documentation 1 (publication number CN 1861271A) provides a kind of method and device of coated glass, but this technology has open defect, under following two kinds of situation, will lose efficacy: the one, and strict for coated glass; If glass fails to get into magnet; To cause the residual a large amount of glass in element termination, and cause terminal electrode effectively not contact with magnet, thus the component failure of making; The 2nd, when connection electrode was contained in magnet inside, this surface-treated technical scheme very likely was enclosed in magnet inside with electrode, cause internal electrode can not with the effective conducting of outside terminal, thereby the component failure of making.
Summary of the invention
Main purpose of the present invention is exactly the deficiency to prior art, and a kind of electronic component and preparation method thereof is provided, and can be that the magnet of element provides protection when electroplating, and can guarantee that again outside terminal effectively is connected with magnet or its internal electrode.
For realizing above-mentioned purpose, the present invention adopts following technical scheme:
A kind of fabrication of electronic components method may further comprise the steps:
A. prepare magnet;
B. adopt labile end-blocking material to coat the termination of said magnet, form end sealing magnet;
C. form glassy layer on the surface of said end sealing magnet;
D. cure said end sealing magnet so that the glass at said end-blocking material and end-blocking place breaks away from from the termination of said magnet; With
E. form terminal electrode in the termination of said magnet.
Preferably, said end-blocking material is labile resinous material.
Preferably, said step c comprises following substep:
C1. organic compounds such as glass and isopropyl alcohol are mixed and form solution;
C2. in said solution, add the corundum bead, barreling reaches 2～5um up to glass particle granularity D50;
C3. spray said solution through spray gun in said end sealing magnet, or said end sealing magnet is flooded in said solution, thereby form one deck glass liquid film on the surface of said end sealing magnet; With
C4. low temperature drying solidifies said glass liquid film.
Preferably, said steps d comprises following substep:
D1. said end sealing magnet was cured 1～3 hour, make the softening and connection densification of glass particle;
D2. said end-blocking material expanded by heating when curing, the glass of the end of said magnet breaks owing to this expansion and peels off; With
D3. said end-blocking material continues to raise along with temperature and decomposes gasification.
Preferably, in the said steps d, after curing, also carry out chamfering, the termination residual glass is removed the termination with level and smooth said magnet.
Preferably, among the said step e, form in the electric conducting material of said terminal electrode and contain glass, said electric conducting material combines with the part that the termination and the said glassy layer of said magnet do not break away from.
Preferably, said step e comprises following substep:
E1. on smooth metal substrate, form and have certain thickness slurry silverskin as said electric conducting material; With
E2. said slurry silverskin is inserted in the termination of said magnet, the size of said slurry silverskin is greater than the size of the cross section of said glassy layer and the formation of said magnet.
Preferably, said magnet is no more than 1/4 of electronic component length by the difference of said terminal electrode length that coats and the length that is coated by said end-blocking material.
Preferably, said electronic component is the lamination sheet type thermistor, the multi-layered ceramic main body of said magnet for ceramic substrate being laminated each other, forming behind cutting and the sintering.
A kind of usefulness fabrication of electronic components method according to claim 1 electronic component manufactured; Said electronic component comprises magnet and terminal electrode; The end that said magnet is removed on the surface of said magnet is coated with glassy layer, and said terminal electrode directly combines with the termination of said magnet.
Beneficial technical effects of the present invention is:
According to fabrication of electronic components method of the present invention, adopt labile end-blocking material to coat the termination of magnet earlier, form glassy layer at cross cut end (of a beam) again; And then cure magnet; Make the glass of end-blocking material and termination break away from magnet, compared to prior art, method of the present invention is many a termination procedure and the operation of removing end-blocking; Thereby the termination is being exposed again among air, guaranteed that terminal electrode is connected with magnet or with the effective of its internal electrode.
Further; Through control end-blocking portion size and terminal electrode size, when being combined with the termination of magnet, electric conducting material also combines with the part that glassy layer does not break away from, can effectively increase the cohesive force of terminal electrode and magnet; Strengthen element termination adhesive force, improve the reliability of element.
Description of drawings
Fig. 1 a is the flow chart of fabrication of electronic components method embodiment of the present invention;
Fig. 1 b be with Fig. 1 a in the corresponding Product Status sketch map of each operation;
Fig. 2 is the sectional view of the embodiment of a kind of lamination sheet type thermistor of the present invention;
Fig. 3 is the length that end-blocking material and terminal electrode coat magnet respectively among a kind of embodiment, and a is an end-blocking material coated length, and b is the terminal electrode coated length;
Fig. 4 follows terminal electrode and end-blocking material to coat the magnet size gap to change, and the magnet termination adhesive force that causes changes diagram;
Fig. 5 a is a laminated chip inductor Inside coil volume rendering sketch map;
Fig. 5 b is that the laminated chip inductor Inside coil stays limit amount sketch map;
Fig. 5 c stays limit amount to be decreased near after 0 known laminated chip inductor Inside coil, causes inductor interior section electrode to expose the sketch map at the magnet outer surface;
Fig. 5 d is the sectional view of the embodiment of a kind of laminated chip inductor of the present invention.
Embodiment
Below in conjunction with accompanying drawing embodiments of the invention are further specified.
Fig. 1 a and Fig. 1 b have described the embodiment that manufacture method according to the present invention is made a kind of lamination sheet type thermistor, and the manufacture method of present embodiment may further comprise the steps:
Step a. magnet preparatory process
At first, preparing pulverous MnO2, Co3O4 and NiO mixture from original material, is 1 by total mole number, and it preferably comprises 0.6 mole MnO2,0.08 mole Co3O4 and 0.16 mole NiO;
Then, the dusty material for preparing is mixed with the ester class solution stirring of isobutanol, and add organic bond and dispersant, adopt ball mill to stir, continue 10 hours formation ceramic sizes,, form ceramic substrate then through coating process;
Next, laminate each other, form thermal sensitive ceramics, then be cut to the thermal sensitive ceramics element main body of predetermined size piece through ceramic diaphragm;
The laminated body that obtains is like this carried out sintering in 1200 ℃ of air atmosphere, thereby form the corresponding multi-layered ceramic main body 10 of magnet preparatory process shown in Fig. 1 b.
Step b. termination procedure
Use labile resinous material, coat the two ends of multi-layered ceramic main body, form the corresponding end sealing magnet 14 of termination procedure shown in Fig. 1 b.
Used resin material can be an epoxy resin, but is not limited thereto.
Should point out that under the prerequisite of magnet end face that can adequately protect, the end-blocking portion size is more little good more.
The step c working procedure of coating
Promptly, form one deck glassy layer 11 at the element outer surface through adopting the method for coating or dipping.
At first, can organic compounds such as glass and isopropyl alcohol be mixed forming solution, add the corundum bead, barreling 24～36 hours treats that glass particle granularity D50 stops barreling when reaching 2～5um left and right sides;
Then, flood in glass solution through the spray gun spraying or with element again, thereby form one deck glass liquid film in magnet surface;
Next after solidifying through low temperature drying, form the corresponding magnet of working procedure of coating shown in Fig. 1 b.
Steps d. cure operation
This operation also can be called end-blocking chemical industry preface, and main acting on is to make the glassy layer densification of magnet surface, and removes the end-blocking material synchronously.
At first, in high temperature (for example greater than 500 ℃), cured 2 hours applying the element of accomplishing, can be according to the different practical operation temperature of adjusting of the glass material of selecting.In high-temperature process, glass particle is softening, and interconnects quick closeization.Meanwhile, end-blocking material expanded by heating, end portion glass are peeled off owing to breaking appears in the end-blocking material that expands earlier.Along with temperature continue to raise, the end-blocking material begins to decompose gasification, and disappears from the element termination, and then the termination of magnet exposes again in air, promptly obtains shown in Fig. 1 b, curing the corresponding magnet of operation.
During actual fabrication, consider that the interface of breaking when glass breakage is peeled off is irregular, segment glass maybe not can be peeled off fully, therefore preferably after curing completion, also carries out chamfering, and the termination residual glass is removed the termination with level and smooth magnet.
Step e. terminal chemical industry preface
Promptly form the outside terminal electrode that connects, this operation can be employed in the element termination and be stained with the electrocondution slurry realization.
At first, formation has certain thickness silverskin on smooth metal substrate, and the element magnet that then will fix inserts silverskin, thereby forms the terminal electrode 12,13 that the terminal chemical industry ordered pair shown in Fig. 1 b is answered.
Preferably, form in the silverskin of said terminal electrode and contain glass, the size that silverskin coats magnet coats the size of magnet greater than the end-blocking material, and terminal electrode is contacted with glassy layer.This can realize in the following manner, when promptly being stained with silver, makes the size of the cross section that silverskin size that magnet gets into forms greater than end-blocking material and said glassy layer and said magnet.Silver slurry glass merges each other with magnet and combines, and simultaneously, has certain contact area because the silver slurry of formation terminal electrode contains a certain proportion of glass and terminal electrode and glassy layer, so silver slurry glass also mutually combines with glassy layer when combining with magnet.At this moment, two parts of glassy layer adhesion of silver slurry glass and magnet adhesion and silver slurry glass and coating have been formed the terminal electrode adhesive force of element jointly.
Fig. 3 is two kinds of sizes diagrams relatively, and a is end-blocking material and magnet contact size (being the size that coats magnet on the length direction), and b is terminal electrode and magnet contact size, and b is greater than a.Experimental result shows that this can effectively improve the adhesion between member end sub-electrode and the magnet, increases the element Mechanical Reliability.Fig. 4 does | the b-a| value is to the sketch map that influences of element terminal adhesive force.
When actual components is made, consider terminal electrode too affects component resistance value and element outward appearance, preferred | b-a| is no more than 1/4 size of leement duration.
As comparative example 1, utilize the method shown in the patent documentation 1, promptly do not do termination process, variety of problems can appear, and the most significantly be exactly that to apply the range of choice of glass very limited.Manufacture method in the patent documentation 1 requires to apply glass except following the magnet compatibility, and also requirement can get into magnet, otherwise because there is glass in the member end head part, will have a strong impact on component reliability.Secondly, the element termination adhesive force that utilizes patent documentation 1 to make is less than normal than patent of the present invention, and when element application was in the electronic product of stronger anti-mechanical shock such as portable needs such as grade, the present invention had significant advantage.
Please refer to Fig. 2, a kind of lamination thermistor 20 that adopts the inventive method to make comprises laminated body 10 (being magnet), applies glassy layer 11 and terminal electrode 13.Laminated body 10 forms through sintering; Apply glassy layer 11 and adopt prefabricated glass paste,, then the glass densification is formed through high-temperature process through the spray gun spraying or through solution soaking; Terminal electrode 13 is after element is accomplished end-blocking and gone termination process, is stained with silver through silverskin and realizes.
Below be that example is explained method of the present invention to make a kind of lamination sheet type ceramic electrical sensor.
Adopt and the identical method of a last embodiment, through magnet preparation, end-blocking, apply, cure, operation such as terminalization, can form this laminated chip inductor.
As relatively, at first existing lamination sheet type ceramic electrical sensor is described.Fig. 5 a is the volume rendering sketch map of a lamination sheet type ceramic electrical sensor.Inductor is different from that the thermistor part is among the embodiment, and coil electrode is contained in its inside.Be accompanied by the development trend of the big sensibility reciprocal of inductor, present stage big sensibility reciprocal product inductance value far away can not practical requirement, need the further product of the bigger sensibility reciprocal of exploitation.Computing formula according to inductance value:
L＝u
0u
eN
αS/l
Under the fixing prerequisite of element material Ue and component size, want to improve inductance value L, the essential area coil S that improves.During the routine inductor design, in order to guarantee the element operate as normal, often require the coil distance magnet surface to leave certain surplus, shown in Fig. 5 b, promptly inductor stays limit amount L to have lower limit, and this has just limited area coil, thereby has limited the element inductance value.Like Fig. 5 c, inductor stays the limit amount to approach 0, and after inductor internal electrode 15 cut into lamination element individuality, inductor interior section electrode exposed at the magnet outer surface.Because exposed electrode can be by eremacausis, and then causes product failure.Iff applies one deck glassivation in the product appearance, stops electrode to contact with extraneous, can bring harmful effect to product internal electrode and outer electrode connectivity again.
The invention provides a kind of limit amount of staying and can be decreased to, effectively improve the inductance value of element near 0, and the impregnable solution of component reliability.The laminated chip inductor cross section such as Fig. 5 d that make according to the present invention.Laminated chip inductor 21 surfaces coated are covered with glassivation, simultaneously because the end-blocking and the effect of going termination procedure, so needn't Considering Surface glass to product internal electrode and the internuncial harmful effect of external terminal electrode.Table 1 shows the influence result of different overlay thickness to product reliability.
Table 1 pair different glass layer thickness is to the explanation of inductance element reliability effect
Wherein each failtests condition is following:
High/low-temperature impact: 125 ℃ of 30 minutes times of temperature, switched to low temperature-55 ℃ maintenance 30 minutes in 20 seconds, experience 100 circulates;
Damp and hot impact: 55 ℃ of temperature, humidity 95%RH, experimental period 1000 hours;
High temperature load: 125 ℃ of temperature, under the making current situation, to test 1000 hours, size of current is determined by the inductor rated current;
Damp and hot load: 55 ℃ of temperature, humidity 95%RH tested 1000 hours, and size of current is determined by the inductor rated current.
For the inductor design scheme that electrode exposes, adopt the present invention when effectively improving the product inductance value, significantly to reduce product electrode open circuit risk.
Above content is to combine concrete preferred implementation to the further explain that the present invention did, and can not assert that practical implementation of the present invention is confined to these explanations.For the those of ordinary skill of technical field under the present invention, under the prerequisite that does not break away from the present invention's design, can also make some simple deduction or replace, all should be regarded as belonging to protection scope of the present invention.
Claims (9)
1. a fabrication of electronic components method is characterized in that, may further comprise the steps:
A. prepare magnet;
B. adopt labile end-blocking material to coat the termination of said magnet, form end sealing magnet, said labile end-blocking material is an expanded by heating when curing, and begins to decompose gasification along with temperature continues to raise, and the material that disappears from the termination of magnet;
C. form glassy layer on the surface of said end sealing magnet;
D. cure said end sealing magnet so that the glass at said end-blocking material and end-blocking place breaks away from from the termination of said magnet; With
E. form terminal electrode in the termination of said magnet.
2. fabrication of electronic components method as claimed in claim 1 is characterized in that, said end-blocking material is labile resinous material.
3. fabrication of electronic components method as claimed in claim 1 is characterized in that, said step c comprises following substep:
C1. glass is mixed with the isopropyl alcohol organic compound and form solution;
C2. in said solution, add the corundum bead, barreling reaches 2～5um up to glass particle granularity D50;
C3. spray said solution through spray gun in said end sealing magnet, or said end sealing magnet is flooded in said solution, thereby form one deck glass liquid film on the surface of said end sealing magnet; With
C4. low temperature drying solidifies said glass liquid film.
4. fabrication of electronic components method as claimed in claim 1 is characterized in that, said steps d comprises following substep:
D1. said end sealing magnet was cured 1～3 hour, make the softening and connection densification of glass particle;
D2. said end-blocking material expanded by heating when curing, the glass of the end of said magnet breaks owing to this expansion and peels off; With
D3. said end-blocking material continues to raise along with temperature and decomposes gasification.
5. fabrication of electronic components method as claimed in claim 1 is characterized in that, in the said steps d, after curing, also carries out chamfering, and the termination residual glass is removed the termination with level and smooth said magnet.
6. like each described fabrication of electronic components method in the claim 1 to 5; It is characterized in that; Among the said step e, form in the electric conducting material of said terminal electrode and contain glass, said electric conducting material combines with the part that the termination and the said glassy layer of said magnet do not break away from.
7. fabrication of electronic components method as claimed in claim 6 is characterized in that, said step e comprises following substep:
E1. on smooth metal substrate, form and have certain thickness slurry silverskin as said electric conducting material; With
E2. said slurry silverskin is inserted in the termination of said magnet, the size of said slurry silverskin is greater than the size of the cross section of said glassy layer and the formation of said magnet.
8. fabrication of electronic components method as claimed in claim 6 is characterized in that, said magnet is no more than 1/4 of electronic component length by the difference of said terminal electrode length that coats and the length that is coated by said end-blocking material.
9. like each described fabrication of electronic components method in the claim 1 to 5, it is characterized in that said electronic component is the lamination sheet type thermistor, the multi-layered ceramic main body of said magnet for ceramic substrate being laminated each other, forming behind cutting and the sintering.
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| CN2009101891411A CN101789294B (en) | 2009-12-16 | 2009-12-16 | Electronic component and manufacturing method thereof |
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| CN2009101891411A CN101789294B (en) | 2009-12-16 | 2009-12-16 | Electronic component and manufacturing method thereof |
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| CN101789294A CN101789294A (en) | 2010-07-28 |
| CN101789294B true CN101789294B (en) | 2012-03-07 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101719414B (en) * | 2009-12-21 | 2012-03-28 | 深圳顺络电子股份有限公司 | Inductor and manufacturing method thereof |
| KR102004238B1 (en) * | 2014-01-07 | 2019-07-26 | 삼성전기주식회사 | Chip electronic component and manufacturing method thereof |
| CN105632668B (en) * | 2016-01-21 | 2018-01-12 | 深圳顺络电子股份有限公司 | A kind of electronic component and preparation method thereof |
| JP6950773B1 (en) * | 2020-03-17 | 2021-10-13 | 大日本印刷株式会社 | Cover tape and packaging for electronic component packaging |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1487534A (en) * | 2002-09-10 | 2004-04-07 | ������������ʽ���� | Chip type electronic parts |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1487534A (en) * | 2002-09-10 | 2004-04-07 | ������������ʽ���� | Chip type electronic parts |
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Effective date of registration: 20210301 Address after: No. 301, Rong Le Dong Road, Songjiang District, Shanghai Patentee after: Shunluo (Shanghai) Electronics Co., Ltd Address before: Shenzhen City, Guangdong province Baoan District 518110 sightseeing road s Fuyuan sunlord Industrial Park Patentee before: Shenzhen Sunlord Electronics Co.,Ltd. |
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