CN105632668B - A kind of electronic component and preparation method thereof - Google Patents
A kind of electronic component and preparation method thereof Download PDFInfo
- Publication number
- CN105632668B CN105632668B CN201610041380.2A CN201610041380A CN105632668B CN 105632668 B CN105632668 B CN 105632668B CN 201610041380 A CN201610041380 A CN 201610041380A CN 105632668 B CN105632668 B CN 105632668B
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- magnet structure
- glass
- electronic component
- preparation
- binding agent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/024—Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being hermetically sealed
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Hard Magnetic Materials (AREA)
Abstract
The invention discloses a kind of electronic component and preparation method thereof, the preparation method of electronic component comprises the following steps：1) magnet structure is prepared, the end of the magnet structure there are two extraction end regions；2) applied adhesive on the region where at least exit, then solidifies；The binding agent is that can pass through the binding agent for being heat-treated and decomposing；3) the whole surface sprayed glass of the magnet structure after step 2) processing；4) glass on the magnet structure surface is sintered, sintering process causes the binding agent to decompose generation force of explosion and cause the glass of the adhesive surface together to come off, the region where at least described exit is exposed after sintering；5) termination electrode of electronic component is made on the region exposed on the magnet structure, the termination electrode of making is together with the glass contact on the magnet structure.The preparation method process of the present invention is simply controllable, and the surface insulated and high oxidation and corrosion resistance of obtained electronic component is preferable.
Description
【Technical field】
The present invention relates to the preparation method of electronic component.
【Background technology】
Electronic component, such as thermosensitive type resistance, resistor etc., usually prepare after sintering obtains magnet structure, in magnetic
Termination electrode is made on the exit of the end of body structure, manufacturing process is related to the heat treatment processes such as the sintering of termination electrode.It is prepared into
The electronic component arrived, including magnet structure and end-electrode structure, end-electrode structure are arranged on the extraction end regions of magnet structure
On the end at place.Electronic component made from current preparation method, surface insulated and antioxidant anticorrosive performance be present
The problem of poor.
【The content of the invention】
The technical problems to be solved by the invention are：Above-mentioned the deficiencies in the prior art are made up, propose a kind of electronic component
And preparation method thereof, preparation process technique is simple, and the surface insulated and high oxidation and corrosion resistance of obtained electronic component
Preferably.
The technical problem of the present invention is solved by following technical scheme：
A kind of preparation method of electronic component, comprises the following steps：1) magnet structure, the end of the magnet structure are prepared
There are two extraction end regions in portion；2) applied adhesive on the region where at least exit, then solidifies；The binding agent
For the binding agent that can be decomposed by heat treatment；3) the whole surface sprayed glass of the magnet structure after step 2) processing；4) burn
The glass on the magnet structure surface is tied, sintering process causes the binding agent to decompose generation force of explosion and cause the binding agent table
The glass in face is together come off, and the region where at least described exit is exposed after sintering；5) dew on the magnet structure
The termination electrode of electronic component is made on the region gone out, the termination electrode of making is with the glass contact on the magnet structure one
Rise.
A kind of electronic component, including magnet structure, glassy layer and termination electrode；The end of the magnet structure has two to draw
Go out end regions；The termination electrode is arranged on the region at least where the exit of the magnet structure, the glass
Layer is arranged in the remaining surface of the magnet structure, is contacted with the termination electrode.
The beneficial effect that the present invention is compared with the prior art is：
Electronic component of the present invention and preparation method thereof, in the exit region coating binding agent of magnet structure, solidification
Afterwards, then integral spray glass, during sintered glass, draw end regions binding agent decomposed in heat treatment process produce it is quick-fried
Broken power so that together scaling loss comes off the glass on its surface, exposes exit region, then held in exit region
Electrode fabrication.So, the region that magnet structure needs to make termination electrode is coated formed with glass formed with termination electrode, remaining region
Glass layer.The glassy layer formed by surface, so as to increase the insulation of electronic component and high oxidation and corrosion resistance.The present invention
Preparation method, be especially suitable for the electronic component of small size, insulating properties and the preferable small size of high oxidation and corrosion resistance be made
Electronic component.
【Brief description of the drawings】
Fig. 1 is the diagrammatic cross-section that magnet structure is obtained in the preparation process of the specific embodiment of the invention one；
Fig. 2 be the specific embodiment of the invention one preparation process in cuing open after the end applied adhesive of magnet structure
Face schematic diagram；
Fig. 3 be the specific embodiment of the invention one preparation process in section after the coating glass of magnet structure surface show
It is intended to；
Fig. 4 be the specific embodiment of the invention one preparation process in by the section after the glass sintering on magnet structure surface
Schematic diagram；
Fig. 5 is the diagrammatic cross-section of electronic component made from the specific embodiment of the invention one；
Fig. 6 is the diagrammatic cross-section that magnet structure is obtained in the preparation process of the specific embodiment of the invention two；
Fig. 7 be the specific embodiment of the invention two preparation process in after the exit applied adhesive of magnet structure
Diagrammatic cross-section；
Fig. 8 is the diagrammatic cross-section of electronic component made from the specific embodiment of the invention two；
Fig. 9 is the diagrammatic cross-section that magnet structure is obtained in the preparation process of the specific embodiment of the invention three；
Figure 10 be the specific embodiment of the invention three preparation process in after the exit applied adhesive of magnet structure
Diagrammatic cross-section；
Figure 11 is the diagrammatic cross-section of electronic component made from the specific embodiment of the invention three.
【Embodiment】
With reference to embodiment and compare accompanying drawing the present invention is described in further details.
Idea of the invention is that one layer of clad is formed on the surface of electronic component, so as to improve electronic component
Insulating properties and high oxidation and corrosion resistance.Clad is formed on surface generally be directed in larger-size product, it is less be directed to compared with
Small product, such as electronic component.The size of electronic component is generally smaller, typically in the range of 1~2mm, such
It is more difficult that surface coating etc. is carried out in small size.In addition, in general surface treatment and coating technology are more in actual applications
It is that the whole surface for being directed to product is handled and coated, and electronic component surface is drawn end regions and need to manifested with manufacturing terminal
Electrode, so, conventional surface treatment and coating technology is caused to be not applied in the preparation process of electronic component.In view of
This, the present invention proposes a kind of method that technique realizes simple possible, then whole again first with binding agent by exit region coating
Body coating glass, during sintering, on the one hand solidify the glass sintering on surface, on the other hand, also make the binding agent of extraction end regions
After heat treatment decompose the glass produced on the related binding agent of force of explosion and together damage and come off, so as to expose extraction end regions, after
Continue and drawing end regions manufacturing terminal electrode.So, in whole processing procedure, the region of needs can be caused to expose manufacturing terminal
Electrode, and can cause remaining region to be coated with glassy layer, so as to improve the insulating properties and antioxygen of obtained electronic component
Change corrosive nature.
Embodiment one
In present embodiment, the preparation method of electronic component comprises the following steps：
1) magnet structure is prepared.
By being overlapped to green tape, cut, dumping and sintering, the magnet sinter of device can be made.As shown in figure 1,
For the structural representation of obtained magnet structure.The inside of magnet structure 100 includes electrode 1, and electrode 1 is from magnet structure 100
End is exposed, and exposed area is respectively as extraction end regions 100a, 100b.
2) the end encapsulating binding agent of magnet structure.
The applied adhesive on the region where at least exit, then solidifies.Binding agent divides for that can pass through heat treatment
The binding agent of solution.During coating, the region of coating at least covers the region where exit.For ease of the realization of coating processes, when
When two exits are located at the both ends of magnet structure respectively, it can be coated on the whole end face of one end where each extraction end regions
Binding agent.As shown in Fig. 2 it is the structural representation after coated with adhesive 200 over the whole end surface.
In present embodiment, applied adhesive on the one hand effect be to cover extraction end regions, be on the other hand
Decomposed during follow-up sintering, and then scaling loss comes off related follow-up glass together, exposes extraction end regions.Binding agent can be to have
Machine thing binding agent, concretely thermosetting resin, such as thermosetting epoxy resin.The infiltration of the end of resin and magnet structure is good
It is good, complete scaling loss it can be come off at a temperature of glass sintering, combination interface is smooth, without batch peak.
Preferably, the coating thickness, solidification situation etc. of binding agent is can control, specifically, for thermosetting resin, control applies
Thickness is covered for 125 ± 25 μm, solidifies 1~3h at a temperature of 100~140 DEG C.By controlling in the thickness range and solidification
Under the conditions of so that thermosetting resin can be decomposed to produce enough force of explosions during follow-up glass sintering, so as to preferably
Related glass breakage comes off, and more comprehensively exposes extraction end regions.
3) in the whole surface sprayed glass of magnet structure.
During spraying, whole surface is sprayed.Glass-coating equipment can be placed in by the magnet structure for encapsulating binding agent
In, spray certain thickness glass.It can be fixed by lance ejection frit using Burners Positions, magnet structure is set in spraying
With the mode of rolling flip in standby roller so that uniformly one layer of glass of cladding.Rotatably coated using totally enclosed type, can be very
Guarantee surface well, corner angle cladding are complete, and can be reached by coating the precision of thickness by 10 μm.Preferably, the glass of spraying uses nothing
Lead glass, its can low-temperature sintering, sintering temperature be less than magnet structure maximum sintering temperature.Glass is tied with magnet infiltration after sintering
Conjunction property is good, and surfacing is smooth, and intensity is high, and insulation and high oxidation and corrosion resistance are good.
Preferably, controlling spray gun pressure control, spray time is controlled in 3 ± 0.5h in the range of 0.2 ± 0.05MPa.This
Sample, spray gun pressure are unlikely to excessive, and solvent is easily gasificated into powder and is not easy to be bonded on magnet in the frit that causes to spray.And
The problem of excessive spray gun pressure easily causes magnet structure splashing, is collided seriously between frit glass particles, and clad comes off；Also not
As for too small, it can not effectively be sprayed on magnet structure and form glass.The length of spray time, the thickness of glass can be influenceed, sprayed
Applying overlong time can cause clad blocked up, and spray time is too short and cladding can be caused incomplete, can not play a part of protection.
Therefore, spray gun pressure during spraying and spray time are controlled in above range, can be effectively formed certain thickness glassy layer.Such as figure
It is the glassy layer 300 of surface spraying along one layer of the periphery of magnet structure shown in 3.
4) glass sintering.
The glass 300 of sintered magnet body structure surface, in sintering process, the high temperature of 200 sintered process of binding agent and decompose,
Produce force of explosion to cause the glass of adhesive surface together scaling loss comes off, the area where at least exit is exposed after coming off
Domain, it is that the region of end where exit is exposed in present embodiment, exposed area is larger, consequently facilitating following process
Into termination electrode.And the glass on the region of uncoated binding agent is then solidified into the glass of some strength in sintering process.
The schematic diagram of magnet structure after being sintered in present embodiment is as shown in figure 4, on only upper and lower two surfaces of magnet structure 100
Formed with glass 300, it is exposed independent from the end where two exits.
Preferably, it is sintered during sintering according to three phases：First stage, started to warm up from room temperature and be heated to 450 DEG C；
Second stage, 700 DEG C are heated to from 450 DEG C of heatings；Phase III, room temperature is cooled to from 700 DEG C.The above three stage is burnt
During knot, room temperature is the low temperature dumping stage to 450 DEG C, and the solvent and the volatilization of most of material, binding agent in this stage binder burn
Damage, which is decomposed, produces force of explosion, and so as to which the glass together with surface bursts apart out, related watch crystal comes off.450~700 DEG C are residual
The exclusion of remaining binding agent colloid, and remaining glass not fallen off start to be gradually softened to 700 DEG C to start to melt.700 DEG C are glass
The melting levelling stage of glass sintering.700 DEG C~room temperature the stage is temperature-fall period so that melten glass cools and solidifies, and turning into has one
Determine the glass of intensity.It is further preferred that even variation when heating or cooling so that the decomposition of binding agent, segment glass
Come off, the solidification of segment glass has the more sufficient time to carry out.Empirical tests, it is sintered according to following sintering curre：First
Stage：Room temperature -200 DEG C -350 DEG C -450 DEG C；Second stage：450—550℃—700℃；Phase III：700℃—450
DEG C-room temperature, binding agent can be made to produce sufficiently strong force of explosion and come off the glass on surface, the region where making exit is relatively filled
Reveal with dividing, and can makes the sintering process of remaining glass more abundant, and solidification is preferable.
5) making of termination electrode.
Termination electrode is made on the magnet structure for drawing end regions is exposed.Specifically, the area exposed on magnet structure
Silver paste is coated with domain, the scope and thickness of the silver paste of coating cause silver paste together with the glass contact on magnet structure, 600
Silver paste is sintered at~650 DEG C, forms termination electrode.During coating, it can be made by magnet structure be set with JIG plates in termination electrode
Silver paste coating is carried out in equipment.Silver electrode is made in sintering after coating.Electrode fabrication uses silver electrode, and silver ink firing temperature is less than surface
Glass transition temperature, so that it is guaranteed that surface glass layer will not be damaged by making the volume process of termination electrode, and silver electrode can be with magnetic
Body end portion, surface glass layer good combination.
The diagrammatic cross-section for the magnet structure being illustrated in figure 5 after making termination electrode.In Fig. 5, electronic component includes magnetic
Body structure 100, glassy layer 300 and termination electrode 400.There are two extraction end regions the end of magnet structure 100, and termination electrode 400 is set
Put on the region at least where the exit of magnet structure 100, glassy layer 300 is arranged on its of magnet structure 100
On remaining surface, contacted with termination electrode 400.Termination electrode 400 contacts with glassy layer 300, two good docking, shape
Into closed environment, the magnet structure 100 of inside can be preferably protected, avoids the subregion of magnet structure 100 from being exposed to air
In or the liquid environment of certain acid-base value in and corrode.
By above-mentioned manufacturing process, on the premise of electronic component performance itself is not changed, to the sintered magnet of device
Binding agent end-blocking is carried out, glassy layer cladding then is carried out to whole surface, binding agent scaling loss during glass sintering, related bonding
Glass in agent comes off so that draws end regions and appears good, then carries out the making of termination electrode.So, even in small size
Electronic component on, also conveniently control in some regions can expose exit to make termination electrode, shape is coated in some regions
It is simply controllable into glass, technical process.By the Surface coating glass in device, so that obtained electronic component is exhausted
Edge and high oxidation and corrosion resistance are preferable.
Embodiment two
The difference of present embodiment and embodiment one is：In present embodiment, magnet structure
End regions are drawn in same one end；In embodiment one, the extraction end regions of magnet structure are respectively two different ends.
As shown in fig. 6, it is the schematic diagram of the magnet structure sintered in present embodiment.The inside of magnet structure 110
Including electrode 1, electrode 1 exposes from the end of magnet structure 110, and exposed area is respectively as extraction end regions 110a, 110b.Draw
Go out end regions 110a and 110b in same one end.So, during coated with adhesive, the region where coating covering exit, such as Fig. 7 institutes
Show.So, coated glass, sintered glass, after making termination electrode, structural representation such as Fig. 8 institutes of obtained electronic component
Show.Only two extraction end regions are provided with termination electrode 400 on the magnet structure 110 of device, and glassy layer 300 is arranged on magnet structure
Remaining surface on, and contacted with termination electrode 400.
The preparation process of present embodiment is carried out for the magnet structure shown in Fig. 6, obtained electronic component table
Bread is covered with glassy layer, has preferable surface insulated and high oxidation and corrosion resistance.
Embodiment three
The difference of present embodiment and the first two embodiment is：In present embodiment, magnet knot
The surface of structure itself is conductive, and electrode is set without inside, and the region without being exposed by electrode, which is formed, draws end regions,
Exit can be defined in any two region of magnet structure, for making electrode.
As shown in figure 9, it is the schematic diagram of the magnet structure sintered in present embodiment.It is any on magnet structure 120
Two regions can be used as drawing end regions 120a, 120b.During coated with adhesive, coating covering exit where region it is whole
Individual end, as shown in Figure 10.So, coated glass, sintered glass, after making termination electrode, the knot of obtained electronic component
Structure schematic diagram is as shown in figure 11.It is provided with two ends (as end regions are drawn) selected on the magnet structure 120 of device
Termination electrode 400, glassy layer 300 are arranged in the remaining surface of magnet structure, and are contacted with termination electrode 400.
The preparation process of present embodiment is carried out for the magnet structure shown in Fig. 9, obtained electronic component table
Bread is covered with glassy layer, it may have preferable surface insulated and high oxidation and corrosion resistance.
Above content is to combine specific preferred embodiment further description made for the present invention, it is impossible to is assert
The specific implementation of the present invention is confined to these explanations.For general technical staff of the technical field of the invention,
Some replacements or obvious modification are made on the premise of not departing from present inventive concept, and performance or purposes are identical, should all be considered as
Belong to protection scope of the present invention.
Claims (7)
- A kind of 1. preparation method of electronic component, it is characterised in that：Comprise the following steps：1) magnet structure, the magnetic are prepared There are two extraction end regions the end of body structure；2) applied adhesive on the region where at least exit, then solidifies； The binding agent is that can pass through the binding agent for being heat-treated and decomposing；The binding agent is thermosetting resin, and coating thickness is 125 ± 25 In the range of μm, solidify 1~3h at a temperature of 100~140 DEG C；3) whole surface of the magnet structure after step 2) processing Sprayed glass；4) sinter the glass on the magnet structure surface, be sintered according to three phases during sintering：First stage, from Room temperature, which starts to warm up, is heated to 450 DEG C；Second stage, 700 DEG C are heated to from 450 DEG C of heatings；Phase III, from 700 DEG C of coolings To room temperature；Sintering process causes the binding agent to decompose generation force of explosion and cause the glass of the adhesive surface together to come off, Expose the region where at least described exit after sintering；5) electronics is made on the region exposed on the magnet structure The termination electrode of component, the termination electrode of making is together with the glass contact on the magnet structure.
- 2. the preparation method of electronic component according to claim 1, it is characterised in that：Uniformly become when heating or cooling Change.
- 3. the preparation method of electronic component according to claim 1, it is characterised in that：Carried out according to following sintering curre Sintering, first stage：Room temperature -200 DEG C -350 DEG C -450 DEG C；Second stage：450—550℃—700℃；Phase III： 700 DEG C -450 DEG C-room temperature.
- 4. the preparation method of electronic component according to claim 1, it is characterised in that：In the step 3), glass is sprayed During glass, by lance ejection frit, controlling the pressure of spray gun, spray time is in 3 ± 0.5h in the range of 0.2 ± 0.05MPa.
- 5. the preparation method of electronic component according to claim 1, it is characterised in that：In the step 3), spraying Glass is crown glass.
- 6. the preparation method of electronic component according to claim 1, it is characterised in that：In the step 5), manufacturing terminal During electrode, silver paste is coated with the region exposed on the magnet structure, the scope and thickness of the silver paste of coating cause silver paste Together with glass contact, silver paste is sintered at 600~650 DEG C, forms termination electrode.
- A kind of 7. electronic component made from preparation method according to any one of claim 1~6, it is characterised in that：Bag Include magnet structure, glassy layer and termination electrode；There are two extraction end regions the end of the magnet structure；The termination electrode is arranged on On the region at least where the exit of the magnet structure, the glassy layer is arranged on remaining of the magnet structure On surface, contacted with the termination electrode.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610041380.2A CN105632668B (en) | 2016-01-21 | 2016-01-21 | A kind of electronic component and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610041380.2A CN105632668B (en) | 2016-01-21 | 2016-01-21 | A kind of electronic component and preparation method thereof |
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| CN105632668A CN105632668A (en) | 2016-06-01 |
| CN105632668B true CN105632668B (en) | 2018-01-12 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1129841A (en) * | 1994-10-19 | 1996-08-28 | 松下电器产业株式会社 | Electronic component and its manufacture |
| CN101789294A (en) * | 2009-12-16 | 2010-07-28 | 深圳顺络电子股份有限公司 | Electronic component and manufacturing method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5304757B2 (en) * | 2010-09-06 | 2013-10-02 | Ｔｄｋ株式会社 | Ceramic laminated PTC thermistor |
-
2016
- 2016-01-21 CN CN201610041380.2A patent/CN105632668B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1129841A (en) * | 1994-10-19 | 1996-08-28 | 松下电器产业株式会社 | Electronic component and its manufacture |
| CN101789294A (en) * | 2009-12-16 | 2010-07-28 | 深圳顺络电子股份有限公司 | Electronic component and manufacturing method thereof |
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