CN204480830U - A kind of novel electrode electronic building brick - Google Patents
A kind of novel electrode electronic building brick Download PDFInfo
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- CN204480830U CN204480830U CN201420431450.1U CN201420431450U CN204480830U CN 204480830 U CN204480830 U CN 204480830U CN 201420431450 U CN201420431450 U CN 201420431450U CN 204480830 U CN204480830 U CN 204480830U
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Abstract
The utility model relates to a kind of novel electrode electronic building brick, and comprise ceramic matrix and be arranged on the pin of ceramic matrix lower end, the outer wrap of ceramic matrix and pin has insulating barrier, and pin connects electrodes in base metal layer; Base metal in electrodes in base metal layer is zinc, copper, tin or nickel; Electrodes in base metal layer is the sprayed coating of individual layer base metal or alloy; The thickness of described electrode layer is 5 ~ 20 μm; There is between ceramic matrix and electrodes in base metal layer base metal pretreatment layer; Base metal in base metal pretreatment layer is nickel, vanadium, chromium, aluminium or zinc.The utility model under guarantee existing product electrical characteristic prerequisite, can reach following object: 1, reduce traditional silk-screened noble silver electrode element and consume; 2, the environmental pollution that organic solvent volatilizees and thermal decomposition causes of traditional silk-screened technique is avoided; 3, the ohmic contact of novel electrode and ceramic matrix is better, and electronic building brick electrical characteristic is got a promotion.
Description
Technical field
The utility model relates to electronic building brick field, especially a kind of novel electrode electronic building brick.
Background technology
Piezo-resistance is with Zinc oxide powder for main material, and doping bismuth oxide, antimony oxide, the crystal boundary elements such as manganese oxide, after dry-pressing formed, high temperature burns till as the pottery with pressure-sensitive character.
Traditional piezo-resistance conductive electrode generally adopts silk-screen printing technique to be formed, ceramic chip adheres to the organic silver slurry of argentiferous 60 ~ 80%, after 600 ~ 900 DEG C of high temperature burning infiltrations, electrode layer General Requirements at the thickness of 6 ~ 15um to ensure welding procedure and product reliability.There is following shortcoming and defect in technique:
1, contain a large amount of harmful substance in silver slurry, manufacturing process can produce serious environment pollution;
2, production cost is high, needs the silver that at substantial is valuable.Bear the ability of larger surge voltage impact in general industry for reaching piezo-resistance, have to adopt the mode thickening silver layer, silver thickness is generally all at more than 15um!
Silver electrode type piezo-resistance shortcoming:
1, adhesion is poor, and silver belongs to pottery and do not mate combination, and mainly penetrate into ceramic grain-boundary to improve adhesion by glass state material in silver slurry, adhesive force is not good, and ohmic contact resistance is large;
2, the not resistance to lead-free solder corrosion of rete---scolding tin very easily corrosion silver layer under high temperature.The product of Pb-free solder technique welding production, after long-time energising, Ag electrode is corroded by scolding tin and electrode adhesion reduction even departs from, and is that mobile device (as automobile) etc. uses this type of piezo-resistance to produce potential safety hazard.
In order to reduce the manufacturing cost of piezo-resistance, application number is 201310177249.5, denomination of invention is " base metal combination electrode of a kind of electronic ceramic assembly and preparation method thereof ", disclose the technique of Multi-layer thermal spraying base metal, made by this technique, base metal compound electric polar form piezo-resistance shortcoming is, sprayed on material and pottery just surface physics adsorb, metal material and ceramic matrix interface impedance high, high discharging current easily produces high heat at interface, the rear failure mode of impact is electrode and is separated with ceramic body, brings risk to the prolonged application reliability of product.
Utility model content
The technical problems to be solved in the utility model is: provide a kind of novel electrode electronic building brick, solves sprayed metal electrode layer and ceramic matrix ohmic contact, the problem that adhesion is not good.
The utility model solves the technical scheme that its technical problem adopts: a kind of novel electrode electronic building brick, comprise ceramic matrix and be arranged on the pin of ceramic matrix lower end, described ceramic matrix and the outer wrap of pin have insulating barrier, described pin connects by zinc, copper, tin, the electrode layer of the base metal composition of one or more mischmetals in nickel, described electrode layer is the sprayed coating of individual layer base metal or alloy; The thickness of described electrode layer is 5 ~ 20 μm; Have between described ceramic matrix and electrode layer by nickel, vanadium, chromium, aluminium, the pretreatment layer of the base metal composition of one or more mischmetals in zinc; The thickness of described pretreatment layer is 0.1 ~ 0.5 μm.Pretreatment layer object is to increase ohmic contact characteristic and adhesive force.
And prepare the method for above-mentioned novel electrode electronic building brick, comprise ceramic matrix surface pre-treating process and technology for preparing electrode;
Described ceramic matrix surface pre-treating process comprises the following steps:
1) clean is carried out to ceramic matrix surface;
2) ceramic matrix after clean is embedded in the hollow out tool close with base shape, expose and treat sputter shape; Described treats that sputter shape is determined by required electrode shape;
3) tool being loaded with ceramic matrix is put into work rest, insert sputter cavity, sputtering equipment starts to vacuumize, and vacuum degree is 2 ~ 8*10-2Mpa; Be filled with argon gas, argon flow amount is 45 ~ 50ml/s;
4) set the power of sputtering target, open sputter, within 10 ~ 30 minutes, complete whole sputter process;
Described technology for preparing electrode comprises the following steps:
1) pretreated ceramic body is inserted in the work rest of continous way electric arc or flame sprayer;
2) flush coater is tunnel continous way, can direct spraying ceramic body two-sided, and the shower nozzle of multitask station is set, the one of each shower nozzle spray material requested or alloy;
3) setting each station spray voltage is 20 ~ 35V, and spraying current is 100 ~ 200A, and spraying air pressure is 0.5Mpa; Spray time was 2 ~ 5 seconds, and coating thickness is 5 ~ 10 μm.
The step 2 of ceramic matrix surface pre-treating process described in the utility model) in hollow out tool material be made by aluminium, stainless steel or other high temperature-resistant polymer materials.
The step 3 of ceramic matrix surface pre-treating process described in the utility model) in, vacuum magnetic control sputtering equipment is single stove, two-door or continuous cavity sputtering equipment; Vacuum magnetic control sputtering equipment target used is flat target or columnar target.
The utility model makes the preprocessor of vacuum metallization before electrode layer applies to ceramic chip, pretreatment layer is ceramic chip is increase and the process of electrode layer adhesion before electrode layer processing, and this metal pretreated layer is not electrode layer composition.Electrode shape, according to ceramic component shape, is not limited to any shape of electrode; Electronic building brick shape can be square, circular, ellipse, cast, and column type is tapered etc.; Electronic building brick is pressure-sensitive, air-sensitive, PTC temperature-sensitive, NTC temperature-sensitive, piezoelectric ceramic, the electronic building bricks such as ceramic condenser.
The beneficial effects of the utility model are: 1, reduce traditional silk-screened noble silver electrode element and consume; 2, the environmental pollution that organic solvent volatilizees and thermal decomposition causes of traditional silk-screened technique is avoided; 3, the ohmic contact of novel electrode and ceramic matrix is better, and electronic building brick electrical characteristic is got a promotion.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is further illustrated.
Fig. 1 is structural representation of the present utility model;
Fig. 2 is technique general flow chart of the present utility model;
Fig. 3 is preliminary treatment sputtering technology schematic diagram;
In figure: 1, ceramic matrix; 3, pin; 4, insulating barrier; 22, electrode layer; 21, pretreatment layer.
Embodiment
With preferred embodiment, the utility model is described in further detail by reference to the accompanying drawings now.These accompanying drawings are the schematic diagram of simplification, only basic structure of the present utility model are described in a schematic way, and therefore it only shows the formation relevant with the utility model.
A kind of electronic building brick as shown in Figure 1, for piezo-resistance, technological process is as Fig. 2, and containing batching, mist projection granulating, dry-pressing formed, Low fire ceramic, ceramic surface metal pretreatment, electrode sprays, welding, insulating material encapsulating, solidification.
The surface of ceramic matrix 1 needs metal pretreatment 21, employing be nickel, vanadium, chromium, aluminium, one or more element materials in zinc, pretreating process schematic diagram as shown in Figure 3, ceramics is turned up mask tool, then tool is put into sputtering chamber's work rest, set each target power output and plated film time, start to vacuumize, be filled with inert gas, about 10 ~ 30 minutes, complete the pretreatment layer of vacuum magnetic control sputter 0.1 ~ 0.5um.This several element material can agree with ceramic matrix perfection, and form ohmic contact, sheet resistance is minimum, reduce the thermal release by inrush current shock, there is excellent anti-scolding tin erosion performance, after making welding finished product simultaneously, avoid the erosion of scolding tin in practical application, thus extend aging life-span;
The spraying of electrode is coating electrode layer 22 in preliminary treatment 21, and the material that electrode layer adopts is by zinc, and copper, tin, one or more mischmetals composition in nickel, is formed by electric arc spraying while of two-sided or flame-spraying.Work rest, by continuous spray room, tunnel, according to the optimum configurations of each station, completes in about 5 ~ 10S.
Welded with pin by novel electrode, welding product carry out insulation encapsulating through epoxy resin, detecting electric characteristic.
For piezo-resistance, the resistance to composite wave impact capacity of piezo-resistance of this type of electrode promotes 50%.Conventional piezo-resistance is the object meeting macro-energy moment impact, and generally adopt comparatively thick electrode (Ag) layer to carry out scattered current density, general thickness reaches more than 16um! The piezo-resistance structure that the utility model provides contains pretreatment layer, and play the effect of ohmic contact, excessively/isolation scolding tin erosion, thickness is only at below 10um! Compare conventional silver electrode finer and close, pretreatment layer micro-analysis is finer and close than conventional monolayers (thickness is 10 ~ 15um about) silk screen printing silver electrode, and hole is less.Piezo-resistance can be made to tolerate the maximum continuous working volts alternating current of 6KV/3KA coupling, 90.Phase angle impacts the ability to lost efficacy (60 seconds, interval), from 50 times of conventional silver electrode piezo-resistance, is promoted to 100 ~ 120 times of new electrode structure piezo-resistance! Improve 200%.
The just embodiment of the present utility model described in above specification, various illustrating is not construed as limiting flesh and blood of the present utility model, person of an ordinary skill in the technical field after having read specification can to before described embodiment make an amendment or be out of shape, and do not deviate from essence and the scope of utility model.
Claims (2)
1. a novel electrode electronic building brick, comprises ceramic matrix and is arranged on the pin of ceramic matrix lower end, and described ceramic matrix and the outer wrap of pin have insulating barrier, it is characterized in that: described pin connects electrodes in base metal layer; Base metal in described electrodes in base metal layer is zinc, copper, tin or nickel; Described electrodes in base metal layer is the sprayed coating of individual layer base metal or alloy; The thickness of described electrode layer is 5 ~ 20 μm; There is between described ceramic matrix and electrodes in base metal layer base metal pretreatment layer; Base metal in described base metal pretreatment layer is nickel, vanadium, chromium, aluminium or zinc.
2. a kind of novel electrode electronic building brick as claimed in claim 1, is characterized in that: the thickness of described base metal pretreatment layer is 0.1 ~ 0.5 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420431450.1U CN204480830U (en) | 2014-07-31 | 2014-07-31 | A kind of novel electrode electronic building brick |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420431450.1U CN204480830U (en) | 2014-07-31 | 2014-07-31 | A kind of novel electrode electronic building brick |
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| Publication Number | Publication Date |
|---|---|
| CN204480830U true CN204480830U (en) | 2015-07-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420431450.1U Expired - Fee Related CN204480830U (en) | 2014-07-31 | 2014-07-31 | A kind of novel electrode electronic building brick |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104143400A (en) * | 2014-07-31 | 2014-11-12 | 兴勤（常州）电子有限公司 | Novel electrode electronic component and preparation method thereof |
-
2014
- 2014-07-31 CN CN201420431450.1U patent/CN204480830U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104143400A (en) * | 2014-07-31 | 2014-11-12 | 兴勤（常州）电子有限公司 | Novel electrode electronic component and preparation method thereof |
| CN104143400B (en) * | 2014-07-31 | 2017-05-31 | 兴勤（常州）电子有限公司 | A kind of preparation method of electrodic electron component |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150715 Termination date: 20200731 |
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| CF01 | Termination of patent right due to non-payment of annual fee |