CN205376228U - Electronic components multilayer composite metal electrode - Google Patents
Electronic components multilayer composite metal electrode Download PDFInfo
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- CN205376228U CN205376228U CN201520971270.7U CN201520971270U CN205376228U CN 205376228 U CN205376228 U CN 205376228U CN 201520971270 U CN201520971270 U CN 201520971270U CN 205376228 U CN205376228 U CN 205376228U
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Abstract
The utility model relates to an electronic components multilayer composite metal electrode, including a composite metal electrode layer and the 2nd composite metal electrode layer, a composite metal electrode layer adopts the preparation of aluminium paste screen -printing technique, as pottery and electrode anchor coat and electricity conductive and heat conductive layer, the multilayer combined electrode that the 2nd composite metal electrode layer adopted the cu wire to make or adopt cu or ag to be the top layer through hot spraying technology passes through the preparation of magnetron sputtering technology. The utility model discloses guaranteeing to substitute ag electrode technology through using the composite metal electrode under the product electrical property prerequisite, promoted the ability that resistant big surge current of electronic components or many times big surge current assault, but through regard as the layer to strengthen the anti ablation characteristic of electronic component to soldering tin with cu or ag combined electrode layer to can use the cheap low ag of price or not have ag soldering tin, reduce the making electrode cost.
Description
Technical field
This utility model relates to electronic building brick field, especially a kind of electronic devices and components multilayer composite metal electrode.
Background technology
Varistor is by mixing a small amount of electron level Bi in electron level ZnO powder base material2O3、Co2O3、MnO2、Sb2O3、TiO2、Cr2O3、Ni2O3Etc. multiple additives, the fine electronic pottery that the technical process such as blended, molding, sintering is made；It has the characteristic that applied voltage sensitivity is changed by resistance value, the various transient overvoltages that are mainly used in perception, limiting circuit being likely to occur, absorbs surge energy.
In order to reduce the manufacturing cost of varistor, promoting varistor manufacturing process level, put into more human, financial, and material resources at present always and carry out technological innovation, achieve a series of innovation achievement in electrode manufacturing process, relevant passing achievement is listed below:
1. application number is 201110140236.1, and denomination of invention is " copper-electrode zinc-oxide voltage-sensitive resistor and preparation method thereof ", discloses under oxygen-free atmosphere, adopts tunnel chain-conveyer furnace, the technique of burning infiltration electrodes in base metal；
2. application number is 2015101584847, denomination of invention is " electronic devices and components multilamellar alloy electrode and preparation method thereof ", disclose the use of a kind of preparation method of two-layer compound electrode fabrication electronic devices and components electrode, wherein ground floor adopts base metal powder slurrying, typography is coated with, and the second layer adopts hot-spraying technique direct spraying Cu alloy material.
Utility model content
The technical problems to be solved in the utility model is: provide a kind of electronic devices and components multilayer composite metal electrode, substitutes conventional silver slurry typography, solves electronic devices and components electrode Cost Problems.
This utility model solves its technical problem and be the technical scheme is that a kind of electronic devices and components multilayer composite metal electrode, including the first clad metal electrode layer and the second clad metal electrode layer, it is characterised in that: the first described clad metal electrode layer covers ceramic matrix surface；First clad metal electrode layer is the aluminium paste layer made by silk screen printing；The second described clad metal electrode layer is covered on the first clad metal electrode layer；The second described clad metal electrode layer is layers of copper or copper alloy layer；Described copper alloy layer is the multi-layer composite electrode that Cu or Ag is top layer adopting magnetron sputtering technique to make.
Further, what multi-layer composite electrode described in the utility model included top layer can the articulamentum of layer and bottom；Described can layer be Cu or Ag layer；Described articulamentum is the composite bed that in Ni, Cr, Cu, Zn, V, at least two metal is constituted.
Further saying, layers of copper described in the utility model is the Cu tinsel of Cu tinsel or plated surface matcoveredn.
Preparation technology of the present utility model includes preparation the first clad metal electrode layer and preparation the second clad metal electrode layer；The second described clad metal electrode layer is covered on the first clad metal electrode layer；
The preparation method of the first described clad metal electrode layer comprises the following steps:
1) it is cleaned ceramic matrix surface processing；
2) aluminium paste is adopted to be covered in ceramic matrix surface by screen printing mode；
3) put into sintering furnace and carry out burning infiltration, according to glass dust softening point situation, complete the preparation of the first clad metal electrode layer；
The preparation method of the second described clad metal electrode layer comprises the following steps:
A), hot-spraying technique is adopted: embed burning attached the first good complex metal layer electrode layer in thermal spraying tool；Adopt Cu tinsel as thermal spraying silk, sets the spray parameters of employing electric arc or flame heat spray on the first complex metal layer electrode layer coating thickness as the second layer clad metal electrode layer of more than 20 μm；
Or,
B), magnetron sputtering technique is adopted:
I) use the target that the alloy that at least two metal in Ni, Cr, Cu, Zn, V metal is constituted makes, the first complex metal layer electrode layer adopts magnetron sputtering technique prepare articulamentum；
Ii) adopting Cu and magnetron sputtering technique to prepare on articulamentum surface can layer；The thickness of the second clad metal electrode layer is 0.3～4 μm.
Described step A) in, Cu tinsel can use pure Cu tinsel can also use the Cu tinsel of electroplating surfaces with tin.
Electrode shape, according to ceramic component shape, is not limited to any shape of electrode；Electronic building brick shape can be square, circular, ellipse etc.；The electronic building bricks such as electronic devices and components are pressure-sensitive, air-sensitive, PTC temperature-sensitive, NTC temperature-sensitive, piezoelectric ceramics, ceramic condenser.
The beneficial effects of the utility model are: compared with tradition Ag electrode process, mainly can be by increasing electrode film layer thickness, change electrodes conduct, heat conductivility, such that it is able to the ability of lifting electronic devices and components withstand large surge current or repeatedly big inrush current shock；By being used as to strengthen the electronic component anti-corrode characteristic to scolding tin by layer with Cu or Ag composite electrode layers, thus low-cost low Ag can be used or without Ag scolding tin；Under ensureing product electrical property premise, by using clad metal electrode to substitute Ag electrode process thus reducing electrode fabrication cost.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, this utility model is further illustrated.
Fig. 1 is structural representation of the present utility model；
Fig. 2 is technique general flow chart of the present utility model；
In figure: 1, ceramic matrix；21, the first clad metal electrode layer；22, the second clad metal electrode；3, pin；4, insulating barrier.
Detailed description of the invention
Presently in connection with accompanying drawing and preferred embodiment, this utility model is described in further detail.These accompanying drawings are the schematic diagram of simplification, and basic structure of the present utility model is only described in a schematic way, and therefore it only shows the composition relevant with this utility model.
A kind of electronic devices and components as shown in Figure 1, for varistor, technological process is as in figure 2 it is shown, containing dispensing, mist projection granulating, dry-pressing formed, Low fire ceramic, ceramic surface silk screen printing, second layer clad metal electrode makes, welding, insulant encapsulating, solidification.
Following example adopt diameter 14mm, thickness 1.8mm, and model is the varistor of 14471 is example.
Embodiment:
Ground floor clad metal electrode layer making step:
1) it is cleaned ceramic matrix surface processing；
2) aluminium paste is used to be covered on ceramic matrix 1 by above-mentioned conducting resinl by screen printing mode；
3) chip being completed for printing electrode being put into sintering furnace and carries out burning infiltration, according to glass dust softening point situation, general burning infiltration temperature selects between 500～750 DEG C, prepares thus completing the first clad metal electrode layer 21.
Second layer alloy electrode layers making step:
1. hot-spraying technique
The substrate burning attached first complex metal layer electrode is embedded in thermal spraying tool；
Adopt Cu tinsel or tin plating Cu tinsel as thermal spraying silk, set the spray parameters of electric-arc thermal spray coating, according to the second layer clad metal electrode layer that product specification requires coating thickness to be more than 20 μm.
2. magnetron sputtering technique
Adopt the substrate having burnt attached good the first metal layer material, use the target that the alloy that at least two metal in Ni, Cr, Cu, Zn, V metal is constituted makes, the first complex metal layer electrode layer adopts magnetron sputtering technique prepare articulamentum；Adopting Cu or Ag to be prepared by magnetron sputtering technique on articulamentum surface can layer；Making thickness according to specification requirement is the second clad metal electrode layer 22 between 0.3～4 μm.
Being welded with pin 3 by second clad metal electrode, welding product are encapsulated through the epoxy resin/insulating barrier such as organic siliconresin or phenolic aldehyde 4 material, detecting electric characteristic.
Such as following table, from electrode material characteristic aspect, relatively traditional Ag electrode and this Combined electrode difference in electrode heat conduction, conductive effect；
Such as following table, the relatively every main performance difference such as following table of product of traditional print silver electrode technique and this case embodiment technique making:
From embodiment contrast table it is concluded that, compared with traditional printing silver electrode structure, this new technology adopts the product that cheap Cu, Al clad metal electrode being main makes, main electrical property can remain unchanged, and there is more excellent high current impulse withstanding capability, composite wave ability can reach more than 2 times of tradition Ag electrode.
Simply detailed description of the invention of the present utility model described in description above, flesh and blood of the present utility model is not construed as limiting by various illustrations, person of an ordinary skill in the technical field after having read description can to before described detailed description of the invention make an amendment or deform, without departing from the spirit and scope of utility model.
Claims (3)
1. an electronic devices and components multilayer composite metal electrode, including the first clad metal electrode layer and the second clad metal electrode layer, it is characterised in that: the first described clad metal electrode layer covers ceramic matrix surface；First clad metal electrode layer is the aluminium paste layer made by silk screen printing；The second described clad metal electrode layer is covered on the first clad metal electrode layer；The second described clad metal electrode layer is layers of copper or copper alloy layer；Described copper alloy layer is the multi-layer composite electrode that Cu or Ag is top layer adopting magnetron sputtering technique to make.
2. electronic devices and components multilayer composite metal electrode as claimed in claim 1, it is characterised in that: what described multi-layer composite electrode included top layer can the articulamentum of layer and bottom；Described can layer be Cu or Ag layer；Described articulamentum is metal composite layer.
3. electronic devices and components multilayer composite metal electrode as claimed in claim 1, it is characterised in that: described layers of copper is the Cu tinsel of Cu tinsel or plated surface matcoveredn.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520971270.7U CN205376228U (en) | 2015-11-30 | 2015-11-30 | Electronic components multilayer composite metal electrode |
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| CN201520971270.7U CN205376228U (en) | 2015-11-30 | 2015-11-30 | Electronic components multilayer composite metal electrode |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105355348A (en) * | 2015-11-30 | 2016-02-24 | 兴勤（常州）电子有限公司 | Electronic component multi-layer composite metal electrode and making process thereof |
| CN107359032A (en) * | 2017-08-09 | 2017-11-17 | 合肥圣达电子科技实业有限公司 | A kind of aluminium silver electrode composite piezo-resistance and preparation method thereof |
| CN111952028A (en) * | 2020-09-08 | 2020-11-17 | 江西兴勤电子有限公司 | High-flux thermosensitive element and preparation method thereof |
| CN112289532A (en) * | 2020-09-23 | 2021-01-29 | 贵州凯里经济开发区中昊电子有限公司 | Method for preparing nanocrystalline film electrode by using copper alloy as material and application |
-
2015
- 2015-11-30 CN CN201520971270.7U patent/CN205376228U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105355348A (en) * | 2015-11-30 | 2016-02-24 | 兴勤（常州）电子有限公司 | Electronic component multi-layer composite metal electrode and making process thereof |
| CN107359032A (en) * | 2017-08-09 | 2017-11-17 | 合肥圣达电子科技实业有限公司 | A kind of aluminium silver electrode composite piezo-resistance and preparation method thereof |
| CN111952028A (en) * | 2020-09-08 | 2020-11-17 | 江西兴勤电子有限公司 | High-flux thermosensitive element and preparation method thereof |
| CN112289532A (en) * | 2020-09-23 | 2021-01-29 | 贵州凯里经济开发区中昊电子有限公司 | Method for preparing nanocrystalline film electrode by using copper alloy as material and application |
| CN112289532B (en) * | 2020-09-23 | 2023-09-01 | 贵州凯里经济开发区中昊电子有限公司 | Method for preparing nanocrystalline thin film electrode by using copper alloy as material and application |
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