CN205428613U

CN205428613U - A multilayer composite metal electrode for electronic components

Info

Publication number: CN205428613U
Application number: CN201520976225.0U
Authority: CN
Inventors: 黃任亨; 李晓乐; 张世开
Original assignee: THINKING ELECTRONIC INDUSTRIAL (CHANGZHOU) Co Ltd
Current assignee: THINKING ELECTRONIC INDUSTRIAL (CHANGZHOU) Co Ltd
Priority date: 2015-11-30
Filing date: 2015-11-30
Publication date: 2016-08-03
Anticipated expiration: 2025-11-30

Abstract

The utility model relates to a multilayer composite metal electrode for electronic components, including a composite metal electrode layer and the 2nd composite metal electrode layer, a composite metal electrode layer cover at ceramic base body surface face, a composite metal electrode layer is the aluminium paste layer through the screen printing preparation, the 2nd composite metal electrode layer cover on a composite metal electrode layer, the 2nd composite metal electrode layer for adopting magnetron sputtering technology preparation cu or ag to be the multilayer combined electrode on top layer. The utility model discloses guaranteeing under the product electrical property prerequisite, thereby reducing the making electrode cost through using the composite metal electrode to substitute ag electrode technology.

Description

A kind of multilayer composite metal electrode for electronic devices and components

Technical field

This utility model relates to electronic building brick field, a kind of multilayer composite metal electrode for electronic devices and components.

Background technology

Varistor is by mixing a small amount of electron level Bi in electron level ZnO powder base material₂O₃、Co₂O₃、MnO₂、Sb₂O₃、TiO₂、Cr₂O₃、Ni₂O₃Etc. multiple additives, the fine electronic pottery that the technical process such as blended, molding, sintering is made；It has the characteristic that applied voltage sensitivity is changed by resistance value, is mainly used in perception, limiting circuit various transient overvoltages, the absorption surge energy being likely to occur.

In order to reduce the manufacturing cost of varistor, promoting varistor manufacturing process level, put into more human, financial, and material resources at present always and carry out technological innovation, achieve a series of innovation achievement in terms of electrode manufacturing process, relevant passing achievement is listed below:

1. Application No. 201110140236.1, invention entitled " copper-electrode zinc-oxide voltage-sensitive resistor and preparation method thereof ", disclose under oxygen-free atmosphere, use tunnel chain-conveyer furnace, the technique of burning infiltration electrodes in base metal；

2. Application No. 2015101584847, invention entitled " electronic devices and components multilamellar alloy electrode and preparation method thereof ", disclose a kind of preparation method using two-layer compound electrode fabrication electronic devices and components electrode, wherein ground floor uses base metal powder slurrying, typography coats, and the second layer uses hot-spraying technique direct spraying Cu alloy material.

Further, but traditional manufacturing process mostly be use Ag electrode process, due to Ag belong to noble metal and conduct electricity, heat conductivility poor, the most either for cost of manufacture or properties of product angle, all there is certain defect.

Utility model content

The technical problems to be solved in the utility model is: provide a kind of multilayer composite metal electrode for electronic devices and components, substitutes conventional silver slurry typography, solves electronic devices and components electrode Cost Problems.

This utility model solves its technical problem and be the technical scheme is that a kind of multilayer composite metal electrode for electronic devices and components, including the first clad metal electrode layer and the second clad metal electrode layer, the first described clad metal electrode layer covers on ceramic matrix surface；First clad metal electrode layer is the aluminium paste layer made by silk screen printing；The second described clad metal electrode layer is covered on the first clad metal electrode layer；The second described clad metal electrode layer be use magnetron sputtering technique make Cu or Ag be the multi-layer composite electrode on top layer.

Further, what multi-layer composite electrode described in the utility model included top layer can layer and the articulamentum of bottom；Described can layer be Cu or Ag layer；Described articulamentum is the composite bed that in Ni, Cr, Cu, Zn, V, at least two metal is constituted.

Further saying, the thickness of the second clad metal electrode layer described in the utility model is 0.3～4 μm.

Electrode shape, according to ceramic component shape, is not limited to any shape of electrode；Electronic building brick shape can be square, circular, ellipse etc.；The electronic building bricks such as electronic devices and components are pressure-sensitive, air-sensitive, PTC temperature-sensitive, NTC temperature-sensitive, piezoelectric ceramics, ceramic condenser.

The beneficial effects of the utility model are, solve defect present in background technology, by increasing electrode film layer thickness, change electrodes conduct, heat conductivility, such that it is able to promote the resistance to big surge current of electronic devices and components or the ability of the biggest inrush current shock；By being used as to strengthen the electronic component anti-corrode characteristic to scolding tin by layer with Cu or Ag composite electrode layers, thus low-cost low Ag can be used or without Ag scolding tin；Under ensureing product electrical property premise, reduce electrode fabrication cost by using clad metal electrode to substitute Ag electrode process.

Accompanying drawing explanation

With embodiment, this utility model is further illustrated below in conjunction with the accompanying drawings.

Fig. 1 is structural representation of the present utility model；

Fig. 2 is technique general flow chart of the present utility model；

In figure: 1, ceramic matrix；21, the first clad metal electrode layer；22, the second clad metal electrode；3, pin；4, insulating barrier.

Detailed description of the invention

Presently in connection with accompanying drawing and preferred embodiment, this utility model is described in further detail.These accompanying drawings are the schematic diagram of simplification, and basic structure of the present utility model is described the most in a schematic way, and therefore it only shows the composition relevant with this utility model.

A kind of electronic devices and components as shown in Figure 1, as a example by varistor, technological process is as in figure 2 it is shown, containing dispensing, mist projection granulating, dry-pressing formed, Low fire ceramic, ceramic surface silk screen printing, second layer clad metal electrode makes, welding, insulant encapsulating, solidification.

Following example use diameter 14mm, thickness 1.8mm, as a example by model is the varistor of 14471.

Embodiment:

Ground floor clad metal electrode layer making step:

1) it is cleaned ceramic matrix surface processing；

2) aluminium paste is used to be covered on ceramic matrix 1 by above-mentioned conducting resinl by screen printing mode；

3) chip being completed for printing electrode being put into sintering furnace and carries out burning infiltration, according to glass dust softening point situation, general burning infiltration temperature selects between 500～750 DEG C, thus completes the first clad metal electrode layer 21 and prepare.

Second layer alloy electrode layers making step:

Use the substrate having burnt attached good the first metal layer material, the target that the alloy using at least two metal in Ni, Cr, Cu, Zn, V metal to constitute makes, the first complex metal layer electrode layer use magnetron sputtering technique prepare articulamentum；Using Cu or Ag to be prepared by magnetron sputtering technique on articulamentum surface can layer；Making thickness according to specification requirement is the second clad metal electrode layer 22 between 0.3～4 μm.

Being welded with pin 3 by second clad metal electrode, welding product are encapsulated through the epoxy resin/insulating barrier such as organic siliconresin or phenolic aldehyde 4 material, detecting electric characteristic.

Such as following table, in terms of electrode material characteristic, relatively traditional Ag electrode and this Combined electrode difference in terms of electrode heat conduction, conductive effect；

Product every main performance difference such as following table such as following table, relatively traditional print silver electrode technique with this case embodiment technique making:

From embodiment contrast table it is concluded that, compared with traditional printing silver electrode structure, this new technology uses cheap Cu, Al to be the product that main clad metal electrode makes, main electrical property can remain unchanged, and there is more excellent high current impulse withstanding capability, composite wave ability can reach more than 2 times of tradition Ag electrode.

Simply detailed description of the invention of the present utility model described in description above, flesh and blood of the present utility model is not construed as limiting by various illustrations, person of an ordinary skill in the technical field after having read description can to before described detailed description of the invention make an amendment or deform, without departing from the spirit and scope of utility model.

Claims

1. for a multilayer composite metal electrode for electronic devices and components, including the first clad metal electrode layer and the second clad metal electrode layer, it is characterised in that: the first described clad metal electrode layer covers on ceramic matrix surface；First clad metal electrode layer is the aluminium paste layer made by silk screen printing；The second described clad metal electrode layer is covered on the first clad metal electrode layer；The second described clad metal electrode layer be use magnetron sputtering technique make Cu or Ag be the multi-layer composite electrode on top layer；The thickness of the second described clad metal electrode layer is 0.3～4 μm.

A kind of multilayer composite metal electrode for electronic devices and components, it is characterised in that: what described multi-layer composite electrode included top layer can layer and the articulamentum of bottom；Described can layer be Cu or Ag layer；Described articulamentum is metal composite layer.