CN204668039U - Electronic devices and components multilayer alloy electrode - Google Patents
Electronic devices and components multilayer alloy electrode Download PDFInfo
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- CN204668039U CN204668039U CN201520202154.9U CN201520202154U CN204668039U CN 204668039 U CN204668039 U CN 204668039U CN 201520202154 U CN201520202154 U CN 201520202154U CN 204668039 U CN204668039 U CN 204668039U
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Abstract
The utility model relates to a kind of multilayer alloy electrode of electronic devices and components, comprises and covers the first metal layer on ceramic matrix and the second alloy-layer successively; Described the first metal layer is metal electrode; The second described alloy-layer is alloy electrode; Second alloy-layer adopts hot-spraying technique to cover on the first metal layer; Described the first metal layer is the aluminium paste adopting silk-screen printing technique to make; The B alloy wire that the second described alloy-layer is copper and phosphorus, any one B alloy wire formed or copper and phosphorus, tin form in silicon, aluminium.The utility model second alloy-layer is selected copper alloy Spray Wire to spray and is compared the printing of copper slurry or the spraying of pure copper wire, not only instead of copper slurry typography, also while solution electronic devices and components electrode Cost Problems, promote the reliability of base metal copper electrode under applied at elevated temperature condition.
Description
Technical field
The utility model relates to electronic building brick field, especially a kind of electronic devices and components multilayer alloy electrode.
Background technology
Piezo-resistance mixes the multiple additives such as a small amount of electron level Bi2O3, Co2O3, MnO2, Sb2O3, TiO2, Cr2O3, Ni2O3 by electron level ZnO powder base-material, through the fine electronic pottery that the technical processs such as mixing, shaping, sintering are made; It has the characteristic of resistance value to the change of applied voltage sensitivity, is mainly used in various transient overvoltages, the absorption surge energy that may occur in perception, limiting circuit.
In order to reduce the manufacturing cost of piezo-resistance, application number is 201110140236.1, denomination of invention is " copper-electrode zinc-oxide voltage-sensitive resistor and preparation method thereof ", under disclosing oxygen-free atmosphere, adopt tunnel chain-conveyer furnace, the technique of burning infiltration electrodes in base metal, the piezo-resistance copper electrode that this technique makes is under applied at elevated temperature condition, fine copper is easily oxidized, to family expenses, the Long-Time Service reliability of industrial electrical equipment brings hidden danger, and technique need consume a large amount of inert gas, voltage-sensitive ceramic happiness oxygen, the qualification rate of mass is difficult to ensure, though basic material cost declines, but supplementary costs superposes, holistic cost reduces limited.
Utility model content
The technical problems to be solved in the utility model is: provide a kind of novel electron assembly multilayer alloy electrode, while solving electronic devices and components electrode Cost Problems, promotes the reliability of base metal copper electrode under applied at elevated temperature condition.
The utility model solves the technical scheme that its technical problem adopts: a kind of multilayer alloy electrode of electronic devices and components, comprises and covers the first metal layer on ceramic matrix and the second alloy-layer successively; Described the first metal layer is metal electrode; The second described alloy-layer is alloy electrode; Second alloy-layer adopts hot-spraying technique to cover on the first metal layer; Described the first metal layer is the aluminium paste layer adopting silk-screen printing technique to make; The second described alloy-layer is B alloy wire; The second described alloy-layer welds with pin; Outer wrap has insulating barrier.
B alloy wire described in the utility model is phosphor bronze alloy silk or silicon bronze alloy silk or aluminium bronze silk or copper phosphor tin silk.In described phosphor bronze, the percentage by weight of phosphorus is 7.5% ~ 8.5%, and surplus is copper; In described silicon bronze, the percentage by weight of silicon is 2.8% ~ 4.0%, and surplus is copper; In described aluminium bronze, the percentage by weight of aluminium is 7.5% ~ 8.5%, and surplus is copper; In the alloy of described copper phosphor tin, the percentage by weight of phosphorus is 6.80% ~ 7.50%, and the percentage by weight of tin is 5.0% ~ 6.0%, and surplus is copper.
Aluminum metal powder, glass dust and binding agent is comprised in aluminium paste described in the utility model; The percentage by weight of described aluminum metal powder is 65% ~ 70%; Described glass dust comprises SiO
2, BiO
2and B
2o
3; The percentage by weight of glass dust is 10% ~ 15%; The percentage by weight of described binding agent is 10% ~ 25%, and composition is ethyl cellulose and terpinol.
The preparation method of electronic devices and components multilayer alloy electrode, comprises the following steps:
1) first layer metal electrode fabrication step:
A) clean is carried out to ceramic matrix surface;
B) pure aluminum metal powder add in glass dust and binding agent be in harmonious proportion make the metal paste that tenor is 75%; By screen printing mode, above-mentioned aluminum metal cream is covered on ceramic matrix;
C) baking oven ceramics of type metal cream being put into 100 DEG C carries out oven dry 60 minutes; Taken off by the ceramics of having dried, reverse side carries out same screen printing procedure and the baking oven putting into 100 DEG C carries out oven dry 60 minutes;
D) chip that two sides has been completed for printing puts into temperature, and to be that the continuous tunnel furnace of 600 DEG C ~ 750 DEG C carries out burning attached, completes the preparation of the first metal layer;
2) second layer alloy electrode layers making step:
A) substrate burning attached good the first metal layer material is embedded in thermal spraying tool;
B) spraying wire adopts the B alloy wire that any one B alloy wire formed in copper and phosphorus, silicon, aluminium or copper and phosphorus, tin form, the spray parameters of setting electric arc or flame heat spray, spray voltage is 20 ~ 35V, and spraying current is 100 ~ 200A, and spraying air pressure is 0.5 ~ 0.6Mpa; Wire feed voltage is 10 ~ 14V, and coating thickness is 20 ~ 30 μm;
C) welded with pin by alloy electrode, welding product carry out insulation encapsulating through epoxy resin, detecting electric characteristic.
Electrode shape, according to ceramic component shape, is not limited to any shape of electrode; Electronic building brick shape can be square, circular, ellipse, cast, and column type is tapered etc.; Electronic devices and components are pressure-sensitive, air-sensitive, PTC temperature-sensitive, NTC temperature-sensitive, piezoelectric ceramic, the electronic building bricks such as ceramic condenser.
The beneficial effects of the utility model are: the second alloy-layer is selected copper alloy Spray Wire to spray and compared the printing of copper slurry or the spraying of pure copper wire, not only instead of copper slurry typography, also while solution electronic devices and components electrode Cost Problems, promote the reliability of base metal copper electrode under applied at elevated temperature condition.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is further illustrated.
Fig. 1 is structural representation of the present utility model;
Fig. 2 is technique general flow chart of the present utility model;
Fig. 3 is vacuum magnetic-control sputtering process principle figure;
Fig. 4 is electric arc spraying process schematic diagram;
In figure: 1, ceramic matrix; 3, pin; 4, insulating barrier; 22, the second alloy-layer; 21, the first metal layer.
Embodiment
With preferred embodiment, the utility model is described in further detail by reference to the accompanying drawings now.These accompanying drawings are the schematic diagram of simplification, only basic structure of the present utility model are described in a schematic way, and therefore it only shows the formation relevant with the utility model.
A kind of electronic devices and components as Figure 1-4, for piezo-resistance, technological process is as Fig. 2, and containing batching, mist projection granulating, dry-pressing formed, Low fire ceramic, ceramic surface silk screen printing, electrode arc sprays, welding, insulating material encapsulating, solidification.
Following examples all adopt diameter 14mm, thickness 1.8mm, model be 14471 piezo-resistance be example
Embodiment 1
First layer metal electrode fabrication step:
1) clean is carried out to ceramic matrix surface;
2) pure aluminum metal powder adds glass dust and adhesive reconciles into the metal paste that tenor is 75%.By screen printing mode, above-mentioned aluminum metal cream is covered on ceramic chip 1;
3) baking oven ceramics of type metal cream being put into 100 DEG C carries out oven dry 60 minutes.Taken off by the ceramics of having dried, reverse side carries out same screen printing procedure and the baking oven putting into 100 DEG C carries out oven dry 60 minutes.
4) chip that two sides has been completed for printing puts into temperature, and to be that the continuous tunnel furnace of 600 DEG C ~ 750 DEG C carries out burning attached, completes the first metal layer 21 and prepare.
Second layer alloy electrode layers making step:
The substrate burning attached good the first metal layer material is embedded in thermal spraying tool;
Spraying wire adopts aluminium bronze silk, the spray parameters of setting electric-arc thermal spray coating, and spray voltage is 20 ~ 35V, and spraying current is 100 ~ 200A, and spraying air pressure is 0.5 ~ 0.6Mpa; Wire feed voltage 10 ~ 14V, coating thickness is 20 ~ 30 μm.
Welded with pin by alloy electrode, welding product carry out insulation encapsulating through epoxy resin, detecting electric characteristic.
Embodiment 2-5 is silicon bronze spraying wire being replaced by respectively heterogeneity proportioning on embodiment 1 basis, phosphor bronze, tin bronze, and tin phosphor-copper, processing step is no longer endured at this and stated.
The aging characteristics of more each embodiment under high temperature resistant environment, high temperature ageing test condition is 125 ± 2 DEG C, 1000 ± 24 hours, applies VDC=385V, test aging front and back pressure sensitive voltage rate of change, and resistance to composite wave (6KV/3KA) ability number of times compares.
Can reach a conclusion from embodiment contrast table, the combined electrode structure adopting printing aluminium and alloy copper wire to spray is lower than the aging rear voltage change ratio of traditional printing silver electrode structure, and resistance to composite wave ability number of times can promote 40%.
The just embodiment of the present utility model described in above specification, various illustrating is not construed as limiting flesh and blood of the present utility model, person of an ordinary skill in the technical field after having read specification can to before described embodiment make an amendment or be out of shape, and do not deviate from essence and the scope of utility model.
Claims (2)
1. a multilayer alloy electrode for electronic devices and components, is characterized in that: comprise and cover the first metal layer on ceramic matrix and the second alloy-layer successively; Described the first metal layer is metal electrode; The second described alloy-layer is alloy electrode; Second alloy-layer adopts hot-spraying technique to cover on the first metal layer; Described the first metal layer is the aluminium paste layer adopting silk-screen printing technique to make; The second described alloy-layer is B alloy wire; The second described alloy-layer welds with pin; Second alloy-layer outer wrap has insulating barrier.
2. the multilayer alloy electrode of electronic devices and components as claimed in claim 1, is characterized in that: described B alloy wire is phosphor bronze alloy silk or silicon bronze alloy silk or aluminium bronze silk or copper phosphor tin silk.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520202154.9U CN204668039U (en) | 2015-04-03 | 2015-04-03 | Electronic devices and components multilayer alloy electrode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520202154.9U CN204668039U (en) | 2015-04-03 | 2015-04-03 | Electronic devices and components multilayer alloy electrode |
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| CN204668039U true CN204668039U (en) | 2015-09-23 |
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| CN201520202154.9U Active CN204668039U (en) | 2015-04-03 | 2015-04-03 | Electronic devices and components multilayer alloy electrode |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106531379A (en) * | 2015-09-11 | 2017-03-22 | 成都铁达电子有限责任公司 | Electrode material and low-cost electrode manufacturing method |
-
2015
- 2015-04-03 CN CN201520202154.9U patent/CN204668039U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106531379A (en) * | 2015-09-11 | 2017-03-22 | 成都铁达电子有限责任公司 | Electrode material and low-cost electrode manufacturing method |
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