CN204066918U - Combined type copper electrode ceramic positive temperature coefficient thermosensitive resistor - Google Patents
Combined type copper electrode ceramic positive temperature coefficient thermosensitive resistor Download PDFInfo
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- CN204066918U CN204066918U CN201420539241.9U CN201420539241U CN204066918U CN 204066918 U CN204066918 U CN 204066918U CN 201420539241 U CN201420539241 U CN 201420539241U CN 204066918 U CN204066918 U CN 204066918U
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Abstract
The utility model relates to a kind of combined type copper electrode ceramic positive temperature coefficient thermosensitive resistor, comprise ceramic body, the electrode layer be arranged on ceramic body, the protective layer of ceramic body outside and the pin of protective layer lower end, described electrode layer is compound electrode layer; Described electrode layer is made up of bottom electrode layer and outer electrode layer; Described bottom electrode layer is the Cr layer that sputter is formed; Described outer electrode layer is the Cu layer that sputter is formed; Described bottom electrode layer and ceramic body surface conjunction, outer electrode layer is stacked on bottom electrode layer and forms combined type copper electrode layer.The utility model adopts combined type copper electrode layer material sputter on ceramic body, substitutes traditional noble metal electrode burning infiltration technique, not only significantly can reduce electrode material cost; Shorten electrode preparation time; The situation that time prepared by sputter, between electrode and porcelain body, pulling force is not good can also be improved; Solve under copper electrode is prepared in high temperature simultaneously and understand problem of oxidation, reduce pollution, achieve environmental protection technique.
Description
Technical field
The utility model relates to a kind of thermistor, especially a kind of combined type copper electrode ceramic positive temperature coefficient thermosensitive resistor.
Background technology
Ceramic positive temperature coefficient thermosensitive resistor is the ceramic material namely applying its feature development with barium titanate base material; its material behavior is when product temperature is higher than occupying gift temperature spot; its resistivity presents one to skyrocket change; based on this phenomenon; develop every component application (overcurrent protection, temperature sensor, constent temperature heater etc.), and its basic structure mainly contains ceramic body structure, electrode layer, pin configuration and protective layer composition.The characteristics such as structure is simple, volume is little because product has, and stability is high, therefore extensive use is now on electronic circuit design protection and temperature sensing component.
The mode that traditional CPTCR adopts in electrode preparation mostly is the burning infiltration technique of silver slurry coating, though it can meet the preparation of above-mentioned CPTCR electrode, its shortcoming is as follows: 1, silver-colored burning infiltration processing procedure is tediously long, labor intensive; 2, the allotment of silver slurry contains hazardous substance, and all has pollution doubt to human body environment; 3, silver electrode cost intensive, cannot provide high performance-price ratio product supplied for electronic commercial Application.
Utility model content
The technical problems to be solved in the utility model is: provide a kind of combined type copper electrode ceramic positive temperature coefficient thermosensitive resistor, have cost low, the advantages such as environmental pollution is little.
The utility model solves the technical scheme that its technical problem adopts: a kind of combined type copper electrode ceramic positive temperature coefficient thermosensitive resistor, comprise ceramic body, the electrode layer be arranged on ceramic body, the protective layer of ceramic body outside and the pin of protective layer lower end, described electrode layer is compound electrode layer; Described electrode layer is made up of bottom electrode layer and outer electrode layer; Described bottom electrode layer is the Cr layer that sputter is formed; Described outer electrode layer is the Cu layer that sputter is formed; Described bottom electrode layer and ceramic body surface conjunction, outer electrode layer is stacked on bottom electrode layer and forms combined type copper electrode layer.
In order to better form the link of nurse difficult to understand contact as electrode layer and ceramic body, the thickness of bottom electrode layer Cr layer described in the utility model is less than or equal to 0.01 μm;
In order to avoid product is because of the not good problem of thermal diffusivity, the side effect that the change of atarting material operating characteristics and other withstand voltage/withstanding current capability reduce, the thickness of outer electrode layer Cu layer described in the utility model is 0.3 ~ 0.6 μm.
Bottom electrode layer described in the utility model contacts with ceramic body and forms CrO layer, as the transition zone that connection two dissimilar materials engages; Described outer electrode layer is stacked on CrO layer.
Preparation technology is as follows:
1) surface preparation is carried out after being sintered by the ceramic body of thermistor;
2) the surface sputtering one deck Cr metal of mode at ceramic body of vacuum splashing and plating is adopted;
3) treat that the oxygen atom in Cr metal and air forms chromium oxide;
4) adopt the mode of vacuum splashing and plating to sputter Cu target on ceramic body surface, copper atom is stacked on ceramic body.
The beneficial effects of the utility model are: adopt combined type copper electrode layer material sputter on ceramic body, substitute traditional noble metal electrode burning infiltration technique, and guarantee CPTCR function and reliability unaffected; Not only significantly can reduce electrode material cost about 70%; Shorten electrode preparation time about 50%; The situation that time prepared by sputter, between electrode and porcelain body, pulling force is not good can also be improved; Solve under copper electrode is prepared in high temperature simultaneously and understand problem of oxidation, reduce pollution, achieve environmental protection technique.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is further illustrated.
Fig. 1 is the schematic diagram of the utility model sputter Cr;
Fig. 2 is the schematic diagram of the utility model sputter Cu;
In figure: 1, ceramic body; 2, chromium oxide.
Embodiment
With preferred embodiment, the utility model is described in further detail by reference to the accompanying drawings now.These accompanying drawings are the schematic diagram of simplification, only basic structure of the present utility model are described in a schematic way, and therefore it only shows the formation relevant with the utility model.
As Fig. 1, shown in 2, by ceramic body after CPTCR sintering after the preliminary treatment of sputter front surface, after adjusting suitable power parameter, first bottom electrode layer adopts vacuum splashing and plating Cr metal, it is made to be sputtered in CPTCR porcelain body on the surface, in process, Cr metal captures the oxygen atom on porcelain body surface, except formation nurse contact difficult to understand, the chromium oxide ceramics body structure high with metal stack compatible degree is formed on the other hand in conjunction with oxygen atom, as the transition zone that connection two dissimilar materials engages, namely at sputtering Cu target after sputter Cr metal terminates, copper atom is made to be stacked on CPTCR porcelain body, form layer external electrode structure, this structure has excellent radiating effect, the advantage of conductivity and weldering property, as wire bond or other current path good material of CPTCR.
With the Cr layer of vacuum splashing and plating technology sputter one layer thickness≤0.01 μm, use and form the link of nurse difficult to understand contact as electrode layer and porcelain body.
Product is nurse difficult to understand contact because needs are formed, therefore selects upper using transition metal as paying the utmost attention in electrode material, and experiment mainly selectes two transition metal as primer, is respectively nickel and chromium metal, experimental data as table one,
The product of silver burning infiltration and sputter Ni, Cr hearth electrode, its pulling force result is sputter Cr> silver burning infiltration > sputter Ni, this result comes from using Cr film as hearth electrode, CrO is formed in porcelain body end, because CrO and metal level storehouse have good compatible degree, and though Ni film can form NiO in porcelain body end equally, but itself and agreeing with property of metal stack if CrO is unexcellent, therefore pulling force presents comparatively Cr is low about 30%, therefore namely select CrO it uses the adhesion of raising two out-phase storeroom as transition zone.
With the Cu layer that vacuum splashing and plating art sputter one thickness is 0.3 ~ 0.6 μm, consider that copper metal has close outer-shell electron orbital structure (d10-s1) with silver, have close character, because electronics locomotivity is high, therefore have preferably thermal conductivity, therefore adopt it as composite electrode layers main material, reach and silver electrode effects equivalent, avoid product because of the not good problem of thermal diffusivity, the side effect that the change of atarting material operating characteristics and other withstand voltage/withstanding current capability reduce.
The samely state bright, because copper product and silver have close structural, it has splendid electrical conductivity equally, can still effectively make to avoid electric current too concentrated under certain electrode layers thickness, cause electrode to damage, and assembly such as to burn at the inefficacy.
Outer electrode material replaces Ag with Cu, it is the same with Ag at high temperature all can form solid solution with tin, reaches preferably associativity, but under 300 DEG C of high temperature, easily forms CuO oxide because of Cu, resulting in follow-up welding cannot operation, therefore imports and prepares Cu electrode with sputter.
The just embodiment of the present utility model described in above specification, various illustrating is not construed as limiting flesh and blood of the present utility model, person of an ordinary skill in the technical field after having read specification can to before described embodiment make an amendment or be out of shape, and do not deviate from essence and the scope of utility model.
Claims (3)
1. a combined type copper electrode ceramic positive temperature coefficient thermosensitive resistor, comprise ceramic body, the electrode layer be arranged on ceramic body, the protective layer of ceramic body outside and the pin of protective layer lower end, it is characterized in that: described electrode layer is compound electrode layer; Described electrode layer is made up of bottom electrode layer and outer electrode layer; Described bottom electrode layer is the Cr layer that sputter is formed; Described outer electrode layer is the Cu layer that sputter is formed; Described bottom electrode layer and ceramic body surface conjunction, outer electrode layer is stacked on bottom electrode layer and forms combined type copper electrode layer.
2. combined type copper electrode ceramic positive temperature coefficient thermosensitive resistor as claimed in claim 1, is characterized in that: the thickness of described bottom electrode layer Cr layer is less than or equal to 0.01 μm; The thickness of described outer electrode layer Cu layer is 0.3 ~ 0.6 μm.
3. combined type copper electrode ceramic positive temperature coefficient thermosensitive resistor as claimed in claim 1, is characterized in that: described bottom electrode layer contacts with ceramic body and forms CrO layer, and described outer electrode layer is stacked on CrO layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420539241.9U CN204066918U (en) | 2014-09-18 | 2014-09-18 | Combined type copper electrode ceramic positive temperature coefficient thermosensitive resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420539241.9U CN204066918U (en) | 2014-09-18 | 2014-09-18 | Combined type copper electrode ceramic positive temperature coefficient thermosensitive resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204066918U true CN204066918U (en) | 2014-12-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420539241.9U Withdrawn - After Issue CN204066918U (en) | 2014-09-18 | 2014-09-18 | Combined type copper electrode ceramic positive temperature coefficient thermosensitive resistor |
Country Status (1)
| Country | Link |
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| CN (1) | CN204066918U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104282404A (en) * | 2014-09-18 | 2015-01-14 | 兴勤（常州）电子有限公司 | Composite copper electrode ceramic positive temperature coefficient thermistor and preparation process thereof |
| CN107622850A (en) * | 2017-09-25 | 2018-01-23 | 江苏时瑞电子科技有限公司 | Negative tempperature coefficient thermistor with combined type copper electrode and preparation method thereof |
| WO2019104707A1 (en) * | 2017-12-01 | 2019-06-06 | 桑胜伟 | Method for preparing thermistor copper electrode composite layer |
-
2014
- 2014-09-18 CN CN201420539241.9U patent/CN204066918U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104282404A (en) * | 2014-09-18 | 2015-01-14 | 兴勤（常州）电子有限公司 | Composite copper electrode ceramic positive temperature coefficient thermistor and preparation process thereof |
| CN104282404B (en) * | 2014-09-18 | 2017-05-17 | 兴勤（常州）电子有限公司 | Composite copper electrode ceramic positive temperature coefficient thermistor and preparation process thereof |
| CN107622850A (en) * | 2017-09-25 | 2018-01-23 | 江苏时瑞电子科技有限公司 | Negative tempperature coefficient thermistor with combined type copper electrode and preparation method thereof |
| WO2019104707A1 (en) * | 2017-12-01 | 2019-06-06 | 桑胜伟 | Method for preparing thermistor copper electrode composite layer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20141231 Effective date of abandoning: 20170517 |