CN203376986U - Base metal composite electrode of electronic ceramic component - Google Patents
Base metal composite electrode of electronic ceramic component Download PDFInfo
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- CN203376986U CN203376986U CN201320260821.XU CN201320260821U CN203376986U CN 203376986 U CN203376986 U CN 203376986U CN 201320260821 U CN201320260821 U CN 201320260821U CN 203376986 U CN203376986 U CN 203376986U
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Abstract
The utility model provides a base metal composite electrode of an electronic ceramic component. The base metal composite electrode comprises a first base metal electrode layer and a second base metal electrode layer; two sides of an electronic ceramic are covered with the first base metal electrode layer; the first base metal electrode layer is covered with the second base metal electrode layer; and the base metal electrode layers are prepared from aluminum and copper, aluminum and zinc, aluminum and nickel, or aluminum and tin. The base metal composite electrode is prepared from base metal such as aluminum and copper, aluminum and zinc, aluminum and nickel, or aluminum and tin, compared to the electrode prepared from only silver slurry or copper slurry, costs are reduced under the precondition that the function of the electrode is maintained, and the cost performance of an electronic ceramic component is raised.
Description
Technical field
The utility model relates to the technical field of the base metal combination electrode of electronic ceramic element, is specifically related to a kind of base metal combination electrode of electronic ceramic element.
Background technology
Existing zinc oxide varistor (Metal Oxide Varistors) has special nonlinear current-voltage.Once abnormal situation in use, such as meeting with thunderbolt, the interference of electromagnetic field, mains switch frequent movement, power system failure, make voltage on circuit uprush, and surpasses the conducting voltage of zinc oxide varistor, will enter the conducting district.Now electric current (I) and voltage (V) are non-linear relation, generally are referred to as non linear coefficient (Nonlinearity Parameter), and its value can reach tens of or up to a hundred.Now, zinc oxide varistor impedance meeting step-down, only have several ohm, allows overvoltage form burst current and flow out, and uses electronic product or expensive component that protection connects.Zinc oxide varistor is belong to the electronic ceramic element a kind of.
The electrode of existing electronic ceramic element generally adopts silver electrode material or copper electrode material, as shown in Figure 1, rounded or the rectangle of conventional electronic ceramic element plane, cover silver electrode layer or copper electrode layer 112 on electronic ceramic chip 111, and silver electrode material is expensive, the cost of copper electrode material is also higher, and therefore, existing single silver electrode or individual layer copper electrode do not meet the requirement of modern electronic technology to the product high performance-price ratio.
The utility model content
The utility model provides a kind of base metal combination electrode of electronic ceramic element on the one hand, has solved the technical problem that improves the cost performance of electronic ceramic element on the basis that keeps electrode function.
In order to solve the problems of the technologies described above, technical solution adopted in the utility model is:
The utility model provides a kind of base metal combination electrode of electronic ceramic element, and described electronic ceramic element comprises electronic ceramic chip and base metal combination electrode, and its key is:
Described base metal combination electrode comprises the first base metal electrode layer and the second base metal electrode layer, and described the first base metal electrode layer covers the two sides of described electronic ceramic chip, and described the second base metal electrode layer covers on described the first base metal electrode layer.
Further, described the first base metal electrode layer comprises first a base metal cover part, and described the second base metal electrode layer comprises more than one the second base metal cover part.
Further, at the described first base metal electrode layer of described electronic ceramic chip one side, comprise more than one the first base metal cover part, on described the first base metal cover part, be coated with the second base metal cover part; Described the first base metal electrode layer at described electronic ceramic chip another side comprises plural the first base metal cover part, on each described first base metal cover part, is coated with the second base metal cover part.
Further, the shape of described the first base metal electrode layer is determined according to the shape of electronic ceramic element, is not limited to any shape;
Described the second base metal electrode layer is not limited to any shape, and the area coverage of described the second base metal electrode layer can be less than, be equal to or greater than the area coverage of described the first base metal electrode layer;
Shape and the area of the second base metal electrode layer that covers the two sides of described electronic ceramic chip can be identical, can be also different.
Further, described the first base metal electrode layer is main electrode layer, described the second base metal electrode layer is the sub-electrode layer weld layer of holding concurrently, based on intensity, hardness demand, described base metal combination electrode also can be included at least one deck base metal reinforced layer increased in the middle of described the first base metal electrode layer and described the second base metal electrode layer.
Further, described the first base metal electrode layer adopts the aluminium electrode material, and described the second base metal electrode layer adopts copper electrode material, zinc electrode material, nickel electrode material or tin electrode material;
Described aluminium electrode material can be fine aluminium, can be also that aluminium content accounts for the aluminium alloy more than 40%; The copper electrode material can be fine copper, can be also that copper content accounts for the copper alloy more than 40%; The zinc electrode material can be pure zinc, can be also that zinc content accounts for the kirsite more than 40%; Nickel electrode material can be pure nickel, can be also that nickel content accounts for the nickel alloy more than 40%; The tin electrode material can be pure tin, can be also that tin content accounts for the ashbury metal more than 40%.
Further, described electronic ceramic element is any one in piezo-resistance, thermistor, gas sensing resistance, piezoelectric element, humistor, ceramic capacitor;
The shape of described electronic ceramic chip can be but is not limited to annular or the cylindrical or taper of circle or rectangle or tubular shape.
The utility model adopts the base metals such as aluminum bronze, aluminium zinc, aluminium nickel or aluminium tin as combination electrode material, with only employing silver slurry or copper slurry are compared, reduce the cost of electrode material on the basis that keeps electrode function, can improve the cost performance of the electronic ceramic element of production.
The accompanying drawing explanation
Fig. 1 is existing electrode structural chart;
The structural representation of the base metal combination electrode that Fig. 2 provides for the utility model embodiment mono-;
The structural representation of the base metal combination electrode that Fig. 3 provides for the utility model embodiment bis-;
The structural representation of the base metal combination electrode that Fig. 4 provides for the utility model embodiment tri-;
The structural representation of the base metal combination electrode that Fig. 5-1,5-2 provide for the utility model embodiment tetra-;
The structural representation of the base metal combination electrode that Fig. 6 provides for the utility model embodiment five;
The structural representation of the base metal combination electrode that Fig. 7 provides for the utility model embodiment six;
Embodiment
Specifically illustrate execution mode of the present utility model below in conjunction with accompanying drawing, accompanying drawing is only for reference and use is described, does not form the restriction to the utility model scope of patent protection.
The execution mode of the base metal combination electrode of the electronic ceramic element that the utility model provides describes by following examples:
embodiment 1:
The structural representation of the embodiment 1 of the base metal combination electrode of the electronic ceramic element that Fig. 2 provides for the utility model.As shown in Figure 2, described electronic ceramic element comprises electronic ceramic chip 111 and base metal combination electrode 113,114, the ceramic body of the uncoated electrode layer of described electronic ceramic chip 111 finger; Described base metal combination electrode comprises the first base metal electrode layer 113 and the second base metal electrode layer 114, described the first base metal electrode layer 113 covers the two sides of described electronic ceramic chip, and described the second base metal electrode layer 114 covers on described the first base metal electrode layer.Described the second base metal electrode layer 114 is weld layer.
In the present embodiment, adopt plasma spray technology base metal to be sprayed to the surface of described electronic ceramic chip.
In the present embodiment, described the first base metal electrode layer 113 adopts the aluminium electrode material, and described the second base metal electrode layer 114 adopts the copper electrode material,, described the first base metal electrode layer 113 is aluminium electrode layer 113, and described the second base metal electrode layer 114 is copper electrode layer 114.
The shape of described aluminium electrode layer 113 is determined according to the shape of electronic ceramic element, is not limited to any shape.In the present embodiment, described electronic ceramic element is circular, and described aluminium electrode layer 113 is also circular.
Described copper electrode layer 114 is not limited to any shape, and the area coverage of described copper electrode layer 114 can be less than, be equal to or greater than the area coverage of aluminium electrode layer 113.In the present embodiment, described copper electrode layer 114 comprises a copper cover part, and described copper electrode layer 114 is also circular.The area coverage of described copper electrode layer 114 is less than the area coverage of described aluminium electrode layer 113, and the diameter of described copper electrode layer 114 is less than the diameter of described aluminium electrode layer 113.
In the present embodiment, shape and the area of copper electrode layer 114 that covers the two sides of described electronic ceramic chip 111 is identical, is the identical circle of diameter.
In the present embodiment, described aluminium electrode layer 113 is main electrode layer, described copper electrode layer 114 is the sub-electrode layer weld layer of holding concurrently, based on intensity, hardness demand, described aluminum bronze combination electrode also can be included at least one deck base metal reinforced layer increased in the middle of described aluminium electrode layer 113 and described copper electrode layer 114.
In the present embodiment, the shape of described electronic ceramic chip can be, but not limited to as circle or rectangle or tubular shape is annular or cylindrical or taper.Described electronic ceramic element can be widely used in as any one in ceramic capacitor, gas sensing resistance, piezoelectric element, humistor, thermistor, piezo-resistance.
embodiment 2:
The structural representation of the embodiment 2 of the base metal combination electrode of the electronic ceramic element that Fig. 3 provides for the utility model.The difference of the present embodiment and embodiment 1 only is:
In the present embodiment, described the first base metal electrode layer 113 adopts the aluminium electrode material, and described the second base metal electrode layer 114 adopts the zinc electrode material,, described the first base metal electrode layer 113 is aluminium electrode layer 113, and described the second base metal electrode layer 114 is zinc oxide electrode layer 114;
And as shown in Figure 3, described zinc oxide electrode layer 114 is annular.In the present embodiment, the minimum 2mm of Ring Width, be 30mm to the maximum.
embodiment 3:
The structural representation of the embodiment 3 of the base metal combination electrode of the electronic ceramic element that Fig. 4 provides for the utility model.The difference of the present embodiment and embodiment 1 only is:
In the present embodiment, described the first base metal electrode layer 113 adopts the aluminium electrode material, and described the second base metal electrode layer 114 adopts the tin electrode material,, described the first base metal electrode layer 113 is aluminium electrode layer 113, and described the second base metal electrode layer 114 is tin electrode layer 114.
And as shown in Figure 4, the described tin electrode layer 114 covered on the one side of electronic ceramic chip 111 comprises a plurality of cover parts that are separated from each other.In the present embodiment, described tin electrode layer 114 comprises that two are shaped as between ，Liang Ge cover part, semicircular cover part the spacing had more than 1mm.
embodiment 4:
Fig. 5-1, the structural representation of the embodiment 4 of the base metal combination electrode of the electronic ceramic element that 5-2 provides for the utility model.The difference of the present embodiment and embodiment 1 only is: the described aluminium electrode layer 1131 in described electronic ceramic chip one side comprises more than one aluminium cover part, on described aluminium cover part, is coated with zinc cover part 1141; In Fig. 5-1, comprise an aluminium cover part at the described aluminium electrode layer 1131 of electronic ceramic chip one side, in Fig. 5-2, described aluminium electrode layer 1131 comprises two aluminium cover parts; Described aluminium electrode layer 1132 at described electronic ceramic chip another side comprises plural aluminium cover part, on each described aluminium cover part, is coated with zinc cover part 1141; In Fig. 5-1, in 5-2, at the described aluminium electrode layer 1132 of described electronic ceramic chip another side, include three aluminium cover parts.
The base metal combined electrode structure that the present embodiment provides can realize forming a plurality of electronic ceramic elements on an electronic ceramic chip, as, ceramic capacitor, gas sensing resistance, piezoelectric element, humistor, thermistor, piezo-resistance etc., a plurality of resistance of formation or the electrode of capacitance ceramic element may interconnect.
embodiment 5:
The structural representation of the embodiment 5 of the base metal combination electrode of the electronic ceramic element that Fig. 6 provides for the utility model.The difference of the present embodiment and embodiment 1 only is:
The area coverage of described nickel electrode layer 114 is greater than the area coverage of described aluminium electrode layer 113, and the diameter of described nickel electrode layer 114 is greater than the diameter of described aluminium electrode layer 113.
As shown in Figure 6, the peripheral part of nickel electrode layer 114 directly overlays on electronic ceramic chip 111.In the present embodiment, the first electrode layer diameter minimum can be 2mm, and the diameter minimum of the second electrode lay 114 is 2.5mm.
embodiment 6:
The structural representation of the embodiment 5 of the base metal combination electrode of the electronic ceramic element that Fig. 7 provides for the utility model.The difference of the present embodiment and embodiment 1 only is:
As shown in Figure 7, described copper electrode layer 114 only covers the zone that needs the welding electrode lead-out wire, and in the present embodiment, shape and the area of copper electrode layer 114 that covers the two sides of described electronic ceramic chip 111 is not identical, the copper electrode layer 114 that is two sides is asymmetrical, to adapt to the needs of different welding electrode lead-out wires.
Aluminium has good conductivity, and with the electronic ceramic body, good tack is arranged, and the solderability in order to guarantee that electrode is good, copper, zinc, nickel or tin are used as the electrode material of weld layer, be sprayed on successively on the aluminium electrode layer, guaranteed the reliability of welding, two kinds of base metal materials form cheap electrode jointly, substitute the silver electrode of original costliness or more expensive copper electrode, reduce the cost of electrode material on the basis that keeps electrode function, improved the cost performance of the electronic ceramic element of producing.
Above disclosed is only preferred embodiment of the present utility model, can not limit rights protection scope of the present utility model with this, and the equivalent variations of therefore doing according to the utility model claim, still belong to the scope that the utility model is contained.
Claims (7)
1. the base metal combination electrode of an electronic ceramic element, described electronic ceramic element comprises electronic ceramic chip and base metal combination electrode, it is characterized in that:
Described base metal combination electrode comprises the first base metal electrode layer and the second base metal electrode layer, and described the first base metal electrode layer covers the two sides of described electronic ceramic chip, and described the second base metal electrode layer covers on described the first base metal electrode layer.
2. the base metal combination electrode of electronic ceramic element according to claim 1 is characterized in that:
Described the first base metal electrode layer comprises first a base metal cover part, and described the second base metal electrode layer comprises more than one the second base metal cover part.
3. the base metal combination electrode of electronic ceramic element according to claim 1 is characterized in that:
Described the first base metal electrode layer in described electronic ceramic chip one side comprises more than one the first base metal cover part, on described the first base metal cover part, is coated with the second base metal cover part;
Described the first base metal electrode layer at described electronic ceramic chip another side comprises plural the first base metal cover part, on each described first base metal cover part, is coated with the second base metal cover part.
4. the base metal combination electrode of electronic ceramic element according to claim 1 is characterized in that:
The shape of described the first base metal electrode layer is determined according to the shape of electronic ceramic element;
The area coverage of described the second base metal electrode layer can be less than, be equal to or greater than the area coverage of described the first base metal electrode layer;
Shape and the area of the second base metal electrode layer that covers the two sides of described electronic ceramic chip can be identical, can be also different.
5. according to the base metal combination electrode of the described electronic ceramic element of any one in aforementioned claim, it is characterized in that:
Described the first base metal electrode layer adopts the aluminium electrode material, and described the second base metal electrode layer adopts copper electrode material, zinc electrode material, nickel electrode material or tin electrode material;
Described aluminium electrode material can be fine aluminium, can be also that aluminium content accounts for the aluminium alloy more than 40%; The copper electrode material can be fine copper, can be also that copper content accounts for the copper alloy more than 40%; The zinc electrode material can be pure zinc, can be also that zinc content accounts for the kirsite more than 40%; Nickel electrode material can be pure nickel, can be also that nickel content accounts for the nickel alloy more than 40%; The tin electrode material can be pure tin, can be also that tin content accounts for the ashbury metal more than 40%.
6. the base metal combination electrode of a kind of electronic ceramic element according to claim 1 is characterized in that:
Described the first base metal electrode layer is main electrode layer, described the second base metal electrode layer is the sub-electrode layer weld layer of holding concurrently, and described base metal combination electrode also is included at least one deck base metal reinforced layer increased in the middle of described the first base metal electrode layer and described the second base metal electrode layer.
7. the base metal combination electrode of a kind of electronic ceramic element according to claim 1 is characterized in that:
Described electronic ceramic element is any one in piezo-resistance, thermistor, gas sensing resistance, piezoelectric element, humistor, ceramic capacitor;
Described electronic ceramic chip be shaped as annular or the cylindrical or taper of circle or rectangle or tubular shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320260821.XU CN203376986U (en) | 2013-04-17 | 2013-05-14 | Base metal composite electrode of electronic ceramic component |
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| CN201320193964 | 2013-04-17 | ||
| CN201320193964.3 | 2013-04-17 | ||
| CN201320260821.XU CN203376986U (en) | 2013-04-17 | 2013-05-14 | Base metal composite electrode of electronic ceramic component |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103247362A (en) * | 2013-04-17 | 2013-08-14 | 隆科电子(惠阳)有限公司 | Base metal combined electrode of electronic ceramic part and preparation method of base metal combined electrode |
| US20160359312A1 (en) * | 2015-06-05 | 2016-12-08 | Tsan-Chi Chen | Surge protector having both fuse and alert functions |
| CN109275339A (en) * | 2017-05-16 | 2019-01-25 | 东莞令特电子有限公司 | Base metal electrode for metal-oxide varistor |
| CN111952028A (en) * | 2020-09-08 | 2020-11-17 | 江西兴勤电子有限公司 | High-flux thermosensitive element and preparation method thereof |
-
2013
- 2013-05-14 CN CN201320260821.XU patent/CN203376986U/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103247362A (en) * | 2013-04-17 | 2013-08-14 | 隆科电子(惠阳)有限公司 | Base metal combined electrode of electronic ceramic part and preparation method of base metal combined electrode |
| CN103247362B (en) * | 2013-04-17 | 2016-02-03 | 隆科电子(惠阳)有限公司 | Base metal combination electrode of a kind of electronic ceramic component and preparation method thereof |
| US20160359312A1 (en) * | 2015-06-05 | 2016-12-08 | Tsan-Chi Chen | Surge protector having both fuse and alert functions |
| CN109275339A (en) * | 2017-05-16 | 2019-01-25 | 东莞令特电子有限公司 | Base metal electrode for metal-oxide varistor |
| US10839993B2 (en) | 2017-05-16 | 2020-11-17 | Dongguan Littelfuse Electronics Company Limited | Base metal electrodes for metal oxide varistor |
| US11177057B2 (en) | 2017-05-16 | 2021-11-16 | Dongguan Littelfuse Electronics, Co., Ltd | Base metal electrodes for metal oxide varistor |
| CN113871118A (en) * | 2017-05-16 | 2021-12-31 | 东莞令特电子有限公司 | Base metal electrode for metal oxide piezoresistor |
| CN111952028A (en) * | 2020-09-08 | 2020-11-17 | 江西兴勤电子有限公司 | High-flux thermosensitive element and preparation method thereof |
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