CN105469954A - Electrode of metal powder matrix inductor and preparation method thereof - Google Patents
Electrode of metal powder matrix inductor and preparation method thereof Download PDFInfo
- Publication number
- CN105469954A CN105469954A CN201610031376.8A CN201610031376A CN105469954A CN 105469954 A CN105469954 A CN 105469954A CN 201610031376 A CN201610031376 A CN 201610031376A CN 105469954 A CN105469954 A CN 105469954A
- Authority
- CN
- China
- Prior art keywords
- electrode
- inductor
- layer
- basic unit
- conductive metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 38
- 239000002184 metal Substances 0.000 title claims abstract description 38
- 239000011159 matrix material Substances 0.000 title claims abstract description 18
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 239000000843 powder Substances 0.000 title abstract 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 28
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 18
- 229910052709 silver Inorganic materials 0.000 claims description 16
- 239000004332 silver Substances 0.000 claims description 16
- 229910045601 alloy Inorganic materials 0.000 claims description 14
- 239000000956 alloy Substances 0.000 claims description 14
- 239000000428 dust Substances 0.000 claims description 14
- 229910052759 nickel Inorganic materials 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 229910000906 Bronze Inorganic materials 0.000 claims description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 6
- 239000010974 bronze Substances 0.000 claims description 6
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 6
- 229910001120 nichrome Inorganic materials 0.000 claims description 6
- 229910052725 zinc Inorganic materials 0.000 claims description 6
- 239000011701 zinc Substances 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 5
- 238000010923 batch production Methods 0.000 abstract description 2
- 230000007797 corrosion Effects 0.000 abstract description 2
- 238000005260 corrosion Methods 0.000 abstract description 2
- 238000005265 energy consumption Methods 0.000 abstract description 2
- 229910000510 noble metal Inorganic materials 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- 230000000873 masking effect Effects 0.000 abstract 1
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 239000010946 fine silver Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
Abstract
The invention provides an electrode of a metal powder matrix inductor, which is arranged at the electrode of the inductor, the electrode comprises a base layer, a conductive layer and a tin layer which are sequentially laminated at the electrode, and the base layer is arranged at the electrode in an electroplating mode. The invention also provides a preparation method of the electrode of the metal powder matrix inductor, which comprises the following steps: masking all or part of the inductor; removing the mask at the electrodes of the inductor; preparing a base layer at the electrode; and sequentially preparing a conductive layer and a tin layer on the surface of the base layer. The invention greatly reduces the cost of the prior electrode process preparation by reducing the use of noble metal and reducing the energy consumption in the process; the adhesive force of the electrode is improved, and the mounting reliability of the electrode is enhanced; the preparation process is simplified, and the yield in batch production is improved; the corrosion resistance of the metal powder matrix is improved, and the service life of the device is prolonged.
Description
Technical field
The present invention relates to electronic component technology field, especially relate to electrode of a kind of metal dust matrix inductor and preparation method thereof.
Background technology
Inductor (Inductor) can be the element that magnetic energy stores electric energy conversion.The similar of inductor in transformer, but only has a winding.Inductor has certain inductance, and it only hinders the change of electric current.If inductor is under the state not having electric current to pass through, during circuit ON, it will attempt to hinder electric current to flow through it; If inductor is under the state having electric current to pass through, circuit disconnect time it will attempt maintenance electric current constant.
In recent years, electronics field develops rapidly, and circuit board, if PCB is the necessary parts of electronic product, and on pcb board, inductor is the electronic component that utilization rate is very high.
Two electrodes of traditional inductor adopt following method preparation: first at the electrode place coated with conductive silver slurry of inductor, then form through high temperature sintering, after this, silver layer forms nickel dam and tin layers.But, in the termination electrode manufacture process of current inductor, the main silver slurry that uses is as hearth electrode materials'use, by after binder removal being the fine silver of more than 90%, but along with economic develop rapidly in recent years, the prices of raw and semifnished materials go up very large, and particularly the rise in price of silver slurry is swifter and more violent, and rising by silver slurry price affects, inductor production cost is caused to increase considerably, the great difficulty to production and operation band.
On the other hand, in recent years, metal dust matrix (iron, nickel, chromium, aluminium etc.) inductor instead of traditional iron oxygen base inductor gradually, and metal dust matrix inductor not easily withstand high temperatures, if adopt said method to prepare its electrode, when carrying out high temperature sintering to conductive silver paste, described inductor body can be damaged.Therefore, said method is not suitable for metal dust matrix inductor yet.
Summary of the invention
For solving prior art shortcomings and deficiencies, the object of this invention is to provide electrode of a kind of metal dust matrix inductor and preparation method thereof.
The object of the invention is to be achieved through the following technical solutions:
An electrode for metal dust matrix inductor, it is arranged at the electrode place of described inductor, described electrode comprise stack gradually in described electrode place basic unit, conductive layer and tin layers, described basic unit is arranged at described electrode place by the mode of plating.
Preferably, described basic unit comprises one deck conductive metal layer.
Preferably, described conductive layer comprises one deck conductive metal layer or electrical conductivity alloy layer, or the multilayer conductive metal level be cascading and/or electrical conductivity alloy layer.
Preferably, described basic unit is: zinc, copper, nickel or silver; Described conductive metal layer is: copper, nickel or silver; Described electrical conductivity alloy layer is: nichrome or signal bronze.
An electrode preparation method for metal dust matrix inductor, it comprises the following steps:
Mask is carried out to all or part of of described inductor;
The mask at the electrode place of described inductor is removed;
Base film layer is prepared at described electrode place;
At the surperficial sequential system of described base film layer for conductive layer and tin layers.
Preferably, described basic unit comprises one deck conductive metal layer.
Preferably, described conductive layer comprises one deck conductive metal layer or electrical conductivity alloy layer, or the multilayer conductive metal level be cascading and/or electrical conductivity alloy layer.
Preferably, described basic unit is: zinc, copper, nickel or silver; Described conductive metal layer is: copper, nickel or silver; Described electrical conductivity alloy layer is: nichrome or signal bronze.
Relative to prior art, the invention has the advantages that:
1, by reducing using and reducing the energy consumption in technique of noble metal, cost prepared by existing electrode process is significantly reduced;
2, improve electrode adhesion, strengthen its installation reliability;
3, simplify preparation technology, improve the yields in batch production;
4, improve metal dust matrix resistance to corrosion, extend the useful life of device.
Accompanying drawing explanation
Fig. 1 is the cross-sectional view of the electrode of the metal dust matrix inductor of the embodiment of the present invention.
Embodiment
Embodiment one:
The present embodiment provides a kind of electrode of metal dust matrix inductor, as shown in Figure 1, it is arranged at the electrode place of described inductor 1, described electrode comprise stack gradually in described electrode place basic unit 11, conductive layer 12 and tin layers 13, wherein, described basic unit 11 is arranged at described electrode place by the mode of plating.
Described basic unit 11 is conductive metal layers, as: zinc, copper, nickel or silver layer, preferably copper.
Described conductive layer 12 can be conductive metal layer, as: copper, nickel or silver layer; Also can be electrical conductivity alloy layer, as: nichrome or signal bronze.
Described conductive layer 12 can be one deck, also can be the multilayer of stacked setting.
Embodiment two:
Present embodiments provide a kind of preparation method of the electrode for the preparation of the metal dust matrix inductor described in embodiment one, it comprises the following steps:
To described inductor all or part of (comprising electrode place and non-electrode place) mask;
The mask at the electrode place of bottom is removed, make the bottom of inductor except other positions at electrode place all not exposed, only have electrode place exposed;
At described electrode place plating base film 11;
At the surperficial sequential system of described base film layer 11 for conductive layer 12 and tin layers 13.
Described conductive layer 12 can be conductive metal layer, as: copper, nickel or silver layer; Also can be electrical conductivity alloy layer, as: nichrome or signal bronze.
Described basic unit 11 is conductive metal layers, as: zinc, copper, nickel or silver layer;
Described conductive layer 12 can be one deck, also can be the multilayer of stacked setting.
It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (10)
1. the electrode of a metal dust matrix inductor, it is arranged at the electrode place of described inductor, it is characterized in that: described electrode comprise stack gradually in described electrode place basic unit, conductive layer and tin layers, described basic unit is arranged at described electrode place by the mode of plating.
2. basic unit according to claim 1, is characterized in that: described basic unit is one deck conductive metal layer.
3. electrode according to claim 2, is characterized in that: described basic unit is: zinc, copper, nickel or silver.
4. electrode according to claim 1, is characterized in that: described conductive layer comprises one deck conductive metal layer or electrical conductivity alloy layer, or the multilayer conductive metal level be cascading and/or electrical conductivity alloy layer.
5. electrode according to claim 4, is characterized in that: described conductive metal layer is: copper, nickel or silver; Described electrical conductivity alloy layer is: nichrome or signal bronze.
6. an electrode preparation method for metal dust matrix inductor, is characterized in that: comprise the following steps:
Mask is carried out to all or part of of described inductor;
The mask at the electrode place of described inductor is removed;
Basic unit is prepared by the mode of plating at described electrode place;
At the surperficial sequential system of described basic unit for conductive layer and tin layers.
7. basic unit according to claim 6, is characterized in that: described basic unit is one deck conductive metal layer.
8. electrode according to claim 7, is characterized in that: described basic unit is: zinc, copper, nickel or silver.
9. electrode according to claim 6, is characterized in that: described conductive layer comprises one deck conductive metal layer or electrical conductivity alloy layer, or the multilayer conductive metal level be cascading and/or electrical conductivity alloy layer.
10. method according to claim 9, is characterized in that: described conductive metal layer is: copper, nickel or silver; Described electrical conductivity alloy layer is: nichrome or signal bronze.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610031376.8A CN105469954A (en) | 2015-12-31 | 2016-01-18 | Electrode of metal powder matrix inductor and preparation method thereof |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2015110343996 | 2015-12-31 | ||
| CN201511034399 | 2015-12-31 | ||
| CN201610031376.8A CN105469954A (en) | 2015-12-31 | 2016-01-18 | Electrode of metal powder matrix inductor and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105469954A true CN105469954A (en) | 2016-04-06 |
Family
ID=55607561
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610031376.8A Pending CN105469954A (en) | 2015-12-31 | 2016-01-18 | Electrode of metal powder matrix inductor and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105469954A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110911067A (en) * | 2019-11-08 | 2020-03-24 | 广东风华高新科技股份有限公司 | Current sensing resistor and manufacturing method thereof |
| WO2021008635A3 (en) * | 2019-10-09 | 2021-03-04 | 深圳华络电子有限公司 | Inductance device electrode preparation method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10163067A (en) * | 1996-12-02 | 1998-06-19 | Mitsubishi Materials Corp | External electrode of chip electronic component |
| CN1405791A (en) * | 2001-09-20 | 2003-03-26 | 株式会社村田制作所 | Conductive paste, lamina ceramic electronic element producing method and lamina ceramic electronic element |
| CN101030476A (en) * | 2006-02-28 | 2007-09-05 | Tdk株式会社 | An electronic component |
| CN101051565A (en) * | 2006-04-04 | 2007-10-10 | 太阳诱电株式会社 | Surface-mounting ceramic electronic component |
| CN102290239A (en) * | 2010-05-19 | 2011-12-21 | 株式会社村田制作所 | Method for a producing ceramic electronic component |
| CN205751810U (en) * | 2015-12-31 | 2016-11-30 | 中山因塞施特电子科技有限公司 | Electrode of metal powder matrix inductor |
-
2016
- 2016-01-18 CN CN201610031376.8A patent/CN105469954A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10163067A (en) * | 1996-12-02 | 1998-06-19 | Mitsubishi Materials Corp | External electrode of chip electronic component |
| CN1405791A (en) * | 2001-09-20 | 2003-03-26 | 株式会社村田制作所 | Conductive paste, lamina ceramic electronic element producing method and lamina ceramic electronic element |
| CN101030476A (en) * | 2006-02-28 | 2007-09-05 | Tdk株式会社 | An electronic component |
| CN101051565A (en) * | 2006-04-04 | 2007-10-10 | 太阳诱电株式会社 | Surface-mounting ceramic electronic component |
| CN102290239A (en) * | 2010-05-19 | 2011-12-21 | 株式会社村田制作所 | Method for a producing ceramic electronic component |
| CN205751810U (en) * | 2015-12-31 | 2016-11-30 | 中山因塞施特电子科技有限公司 | Electrode of metal powder matrix inductor |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021008635A3 (en) * | 2019-10-09 | 2021-03-04 | 深圳华络电子有限公司 | Inductance device electrode preparation method |
| US11655554B2 (en) | 2019-10-09 | 2023-05-23 | Dongguan Hualuo Electronics Co., Ltd. | Method for preparing electrode of inductive component |
| CN110911067A (en) * | 2019-11-08 | 2020-03-24 | 广东风华高新科技股份有限公司 | Current sensing resistor and manufacturing method thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160406 |
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| RJ01 | Rejection of invention patent application after publication |