TWM464797U - Base metal composite electrode of electronic ceramic element - Google Patents

Description

Base metal composite electrode for electronic ceramic components

The present invention relates to the technical field of a base metal composite electrode of an electronic ceramic component, and in particular to a base metal composite electrode of an electronic ceramic component.

The present invention claims that the basis of the domestic priority is the invention application filed on April 18, 1988, the application of which is incorporated herein by reference.

Existing metal oxide varistor (Metal Oxide Varistors) have special nonlinear current-voltage characteristics. In the event of abnormal conditions in use, such as lightning strikes, electromagnetic field interference, frequent power switch operation, power system failure, the voltage on the line suddenly increases, exceeding the conduction voltage of the zinc oxide varistor, it will enter the conduction area. At this time, the current (I) and the voltage (V) have a nonlinear relationship, which is generally called a nonlinearity parameter, and the value can be several tens or hundreds. At this point, the resistance of the zinc oxide varistor will be low, only a few ohms, allowing the overvoltage to form a surge current to protect the connected electronic products or expensive components. A zinc oxide varistor is a type of electronic ceramic component.

The electrode of the existing electronic ceramic component generally adopts a silver electrode material or a copper electrode material. As can be seen from FIG. 1, the conventional electronic ceramic component has a circular or rectangular planar shape, and is electrically The sub-ceramic chip 111 is covered with a silver electrode layer or a copper electrode layer 112, and the silver electrode material is expensive, and the cost of the copper electrode material is also high. Therefore, the existing single-layer silver electrode or single-layer copper electrode does not conform to modern electronic technology. The product is cost-effective.

In view of this, the creator has made great efforts to solve the above problems by focusing on the above-mentioned prior art, and has devoted himself to the application of the theory, that is, the goal of the creator's improvement.

One of the aims of the present invention is to provide a base metal composite electrode of an electronic ceramic component, which solves the technical problem of improving the cost performance of the electronic ceramic component while maintaining the function of the electrode.

In order to achieve the above object, the present invention provides a base metal composite electrode of an electronic ceramic component, the electronic ceramic component comprising an electronic ceramic chip, the base metal composite electrode comprising: a first first metal electrode layer, the first A base metal electrode layer covers both sides of the electronic ceramic chip; and two second base metal electrode layers cover each of the first base metal electrode layers.

The creation also has the following effects: aluminum has good electrical conductivity and has good adhesion to the electronic ceramic body, and in order to ensure good solderability of the electrode, copper, zinc, nickel or tin is used as the electrode of the solder layer. The material is sprayed on top of the aluminum electrode layer in turn to ensure the reliability of the soldering. The two kinds of base metal materials together form an inexpensive electrode, which replaces the expensive silver electrode or is more expensive. The expensive copper electrode reduces the cost of the electrode material on the basis of maintaining the function of the electrode, and improves the cost performance of the produced electronic ceramic component.

<知知>

111‧‧‧Electronic Ceramic Chip

112‧‧‧Silver electrode layer, copper electrode layer

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111‧‧‧Electronic Ceramic Chip

113‧‧‧First metal electrode layer, aluminum electrode layer

1131, 1132‧‧‧ aluminum electrode layer

114‧‧‧Second metal electrode layer, copper electrode layer, zinc electrode layer, tin electrode layer, nickel electrode layer

1141, 1142‧‧ ‧ zinc covered part

115‧‧‧Electrode lead wire

Figure 1 is a conventional electrode structure diagram.

FIG. 2 is a schematic structural view of a base metal composite electrode provided in the first embodiment of the present invention.

FIG. 3 is a schematic structural view of a base metal composite electrode provided in the second embodiment of the present invention.

4 is a schematic structural view of a base metal composite electrode provided in the third embodiment of the present invention.

5-1 is a schematic structural view of a base metal composite electrode provided in the fourth embodiment of the present invention.

FIG. 5-2 is another schematic structural view of a base metal composite electrode provided in the fourth embodiment of the present invention.

FIG. 6 is a schematic structural view of a base metal composite electrode provided in the fifth embodiment of the present invention.

FIG. 7 is a schematic structural view of a base metal composite electrode provided in the sixth embodiment of the present invention.

The detailed description and technical content of the present invention will be described below in conjunction with the drawings, but the drawings are for illustrative purposes only and are not intended to limit the present invention.

Referring to FIG. 2 to FIG. 7 , the present invention provides a base metal composite electrode of an electronic ceramic component. The electronic ceramic component includes an electronic ceramic chip 111 , and the metal composite electrode mainly includes two first and second metal electrode layers 113 and two. The second base metal electrode layer 114.

Base metal (or base metal, English: Base metal) is in addition to gold Other than precious metals such as silver and platinum, all other metals. For example: iron, copper, aluminum, etc.

FIG. 2 is a schematic structural view of a base metal composite electrode provided in the first embodiment of the present invention. As shown in FIG. 2, the electronic ceramic component includes an electronic ceramic chip 111 and a base metal composite electrode, and the electronic ceramic chip 111 refers to a ceramic body not coated with an electrode layer; the base metal composite electrode includes a first base metal electrode layer 113 and a second The metal electrode layer 114 covers the both sides of the electronic ceramic chip, and the second base metal layer 114 covers the first base metal layer 113. The second base metal electrode layer 114 is a solder layer.

In this embodiment, a blast metal is sprayed onto the surface of the electronic ceramic chip using a thermal spray technique.

In this embodiment, the first base metal electrode layer 113 is made of an aluminum electrode material, and the second base metal electrode layer 114 is made of a copper electrode material, that is, the first base metal electrode layer 113 is an aluminum electrode layer 113, and the second base metal electrode layer is used. 114 is a copper electrode layer 114.

Further, the shape of the aluminum electrode layer 113 and the shape of the electronic ceramic element are mutually compatible, and are not limited to any shape. For example, in the embodiment, the electronic ceramic component is circular, and the aluminum electrode layer 113 is also circular.

Furthermore, the copper electrode layer 114 is not limited to any shape, and the coverage area of the copper electrode layer 114 may be smaller than, equal to or larger than the coverage area of the aluminum electrode layer 113.

In the present embodiment, the copper electrode layer 114 includes a copper covered portion, and the copper electrode layer 114 is also circular. The coverage area of the copper electrode layer 114 is smaller than the coverage area of the aluminum electrode layer 113, that is, the diameter of the copper electrode layer 114 is smaller than the diameter of the aluminum electrode layer 113.

In the present embodiment, the shape and area of the copper electrode layer 114 covering both sides of the electronic ceramic chip 111 are the same, and are circular shapes having the same diameter.

In the present embodiment, the aluminum electrode layer 113 is a main electrode layer, and the copper electrode layer 114 is a sub-electrode layer and a solder layer. The aluminum-copper composite electrode may further be included between the aluminum electrode layer 113 and the copper electrode layer 114 based on strength and hardness requirements. Add at least one layer of base metal reinforcement.

In this embodiment, the shape of the electronic ceramic chip may be circular, rectangular, tubular, annular, cylindrical or tapered, but it is not limited by the above shape, and may be adjusted according to actual conditions.

Further, the electronic ceramic component can be widely applied to any one of a ceramic capacitor, a gas resistance, a piezoelectric element, a humidity sensitive resistor, a thermistor, and a varistor.

FIG. 3 is a schematic structural view of a base metal composite electrode provided in the second embodiment of the present invention. The first embodiment is different from the first embodiment in that: in the embodiment, the first base metal electrode layer 113 is made of an aluminum electrode material, and the second base metal electrode layer 114 is made of a zinc electrode material, that is, the first base metal electrode. The layer 113 is an aluminum electrode layer 113, and the second base metal electrode layer 114 is a zinc electrode layer 114.

Also, as shown in FIG. 3, the zinc electrode layer 114 is annular. In the present embodiment, the annular width is at least 2 mm and the maximum is 30 mm.

4 is a schematic structural view of a base metal composite electrode provided in the third embodiment of the present invention. The first embodiment is different from the first embodiment in that: in the embodiment, the first base metal electrode layer 113 is made of an aluminum electrode material, and the second base metal electrode layer 114 is made of a tin electrode material, that is, the first base metal electrode. Layer 113 is aluminum The second layer 113, the second base metal layer 114 is a tin electrode layer 114.

Also, as shown in FIG. 4, the tin electrode layer 114 overlying one side of the electronic ceramic chip 111 includes a plurality of cover portions separated from each other. In the present embodiment, the tin electrode layer 114 includes two cover portions having a semicircular shape with a pitch of 1 mm or more between the two cover portions.

5-1 and 5-2 are schematic structural views of a base metal composite electrode provided in the fourth embodiment of the present invention. The difference between this embodiment and the first embodiment is that the aluminum electrode layer 1131 on one side of the electronic ceramic chip includes more than one aluminum covering portion, and the aluminum covering portion is covered with the zinc covering portion 1141; in FIG. 5-1 The aluminum electrode layer 1131 on one side of the electronic ceramic chip includes an aluminum covered portion; in Fig. 5-2, the aluminum electrode layer 1131 includes two aluminum covered portions.

In addition, the aluminum electrode layer 1132 on the other side of the electronic ceramic chip includes two or more aluminum covering portions, each of which is covered with a zinc covering portion 1142; in FIGS. 5-1 and 5-2, in the electronic ceramic The aluminum electrode layers 1132 on the other side of the chip each include three aluminum covered portions.

The base metal composite electrode structure provided in this embodiment can realize forming a plurality of electronic ceramic components on an electronic ceramic chip, such as a ceramic capacitor, a gas sensor, a piezoelectric element, a humidity sensitive resistor, a thermistor, a varistor, etc. The electrodes of the plurality of resistor or capacitor ceramic elements formed may be connected to each other.

FIG. 6 is a schematic structural view of a base metal composite electrode provided in the fifth embodiment of the present invention. The difference between this embodiment and the first embodiment is only: The coverage area of the nickel electrode layer 114 is larger than the coverage area of the aluminum electrode layer 113, that is, the diameter of the nickel electrode layer 114 is larger than the diameter of the aluminum electrode layer 113.

As shown in FIG. 6, the peripheral portion of the nickel electrode layer 114 is directly covered on the electronic ceramic chip 111. In this embodiment, the diameter of the first electrode layer may be at least 2 mm, and the diameter of the second electrode layer 114 may be at least 2.5 mm.

FIG. 7 is a schematic structural view of a base metal composite electrode provided in the sixth embodiment of the present invention. This embodiment differs from the first embodiment only in that, as shown in FIG. 7, the copper electrode layer 114 covers only the region where the electrode lead wires 115 are to be soldered, and in the present embodiment, covers both sides of the electronic ceramic chip 111. The shape and area of the copper electrode layer 114 are different, that is, the two-sided copper electrode layer 114 is asymmetrical to accommodate the needs of different solder electrode lead wires 115.

In addition, the aluminum electrode material may be pure aluminum or an aluminum alloy having an aluminum content of 40% or more; the copper electrode material may be pure copper or a copper alloy having a copper content of 40% or more; the zinc electrode material may be Pure zinc can also be a zinc alloy with a zinc content of more than 40%; the nickel electrode material can be pure nickel or a nickel alloy with a nickel content of 40% or more; the tin electrode material can be pure tin or tin content. More than 40% of the tin alloy.

Aluminum has good electrical conductivity and has good adhesion to the electronic ceramic body. In order to ensure good solderability of the electrode, copper, zinc, nickel or tin is used as the electrode material of the soldering layer, and is sequentially sprayed on the aluminum electrode. Above the layer, the reliability of the solder is ensured. The two kinds of base metal materials together form an inexpensive electrode, replacing the expensive silver electrode or the more expensive copper electrode, and the cost of the electrode material is reduced on the basis of maintaining the function of the electrode. Improve the cost performance of electronic ceramic components produced.

In summary, the base metal composite electrode of the electronic ceramic component of the present invention can achieve the intended use purpose, and solve the lack of conventional knowledge, and has industrial utilization, novelty and progress, and fully conforms to the requirements of the new patent application. To file an application in accordance with the Patent Law, please check and grant the patent in this case to protect the rights of the creator.

111‧‧‧Electronic Ceramic Chip

113‧‧‧First metal electrode layer, aluminum electrode layer

114‧‧‧Second metal electrode layer, copper electrode layer

Claims (17)

A base metal composite electrode of an electronic ceramic component, the electronic ceramic component comprising an electronic ceramic chip, the base metal composite electrode comprising: a first first metal electrode layer, the two first metal electrode layers covering the electronic ceramic Two sides of the chip; and two second base metal layer covering each of the first base metal electrode layers. The base metal composite electrode of the electronic ceramic component of claim 1, wherein the first base metal electrode layer comprises a first base metal cover portion, and the second base metal electrode layer comprises one or more second base metal cover portions. . The base metal composite electrode of the electronic ceramic component of claim 1, wherein each of the second base metal electrode layers comprises one or more second base metal covering portions, the first base metal on one side of the electronic ceramic chip The electrode layer includes one or more first base metal covering portions, the first base metal covering portion is covered with the second base metal covering portion, and the first base metal electrode layer on the other side of the electronic ceramic chip includes two More than one first base metal covering portion is covered with the second base metal covering portion on each of the first base metal covering portions. The base metal composite electrode of the electronic ceramic component of claim 1, wherein the shape of the first base metal electrode layer matches the shape of the electronic ceramic component, and the coverage area of the second base metal electrode layer is smaller than the first The coverage area of the base metal electrode layer. The base metal composite electrode of the electronic ceramic component of claim 1, wherein the shape of the first base metal electrode layer matches the shape of the electronic ceramic component, and the coverage area of the second base metal electrode layer is equal to the first The coverage area of the base metal electrode layer. The base metal composite electrode of the electronic ceramic component of claim 1, wherein the shape of the first base metal electrode layer matches the shape of the electronic ceramic component, and the coverage area of the second base metal electrode layer is greater than the first The coverage area of the base metal electrode layer. The base metal composite electrode of the electronic ceramic component of claim 1, wherein the shape and area of the second second metal electrode layers covering both sides of the electronic ceramic chip are the same. The base metal composite electrode of the electronic ceramic component of claim 1, wherein the shape and area of the second second metal electrode layer covering the both sides of the electronic ceramic chip are different. The base metal composite electrode of the electronic ceramic component according to any one of claims 1 to 8, wherein the first base metal electrode layer is made of an aluminum electrode material, and the second base metal electrode layer is made of a copper electrode material, a zinc electrode material, Nickel electrode material or tin electrode material. The base metal composite electrode of the electronic ceramic component according to claim 9, wherein the aluminum electrode material is an aluminum alloy having a pure aluminum or aluminum content of 40% or more. The base metal composite electrode of the electronic ceramic component according to claim 9, wherein the second base metal electrode layer is a copper electrode material, and the copper electrode material is a copper alloy having a pure copper or copper content of 40% or more. The base metal composite electrode of the electronic ceramic component according to claim 9, wherein the second base metal electrode layer is made of a zinc electrode material, and the zinc electrode material is a zinc alloy having a pure zinc or zinc content of 40% or more. The base metal composite electrode of the electronic ceramic component according to claim 9, wherein the second base metal electrode layer is made of a nickel electrode material, and the nickel electrode material is a nickel alloy having a pure nickel or a nickel content of 40% or more. The base metal composite electrode of the electronic ceramic component of claim 9, wherein the second The base metal electrode layer is made of a tin electrode material, which is a tin alloy having a pure tin or tin content of 40% or more. The base metal composite electrode of the electronic ceramic component of claim 1, wherein the first base metal electrode layer is a main electrode layer, and the second base metal electrode layer is a secondary electrode layer and a solder layer, and the base metal composite electrode further And forming at least one layer of a base metal reinforcement layer formed between the first base metal electrode layer and the second base metal electrode layer. The base metal composite electrode of the electronic ceramic component according to claim 1, wherein the electronic ceramic component is any one of a varistor, a thermistor, a gas resistance, a piezoelectric element, a humidity sensitive resistor, and a ceramic capacitor. The base metal composite electrode of the electronic ceramic component of claim 1, wherein the electronic ceramic chip has a shape of a circle, a rectangle, a tube, a ring, a cylinder or a cone.