JP2010244773A - Current protecting element structure, and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a current protecting element structure and a method of manufacturing the same. <P>SOLUTION: The current protecting element structure includes a base material, a cavity, a melting element, and an electrode terminal. The base material has an upper layer and a lower layer. The melting element is disposed between the upper layer and the lower layer of the base material, and the outer edge of the melting element is exposed to the outside of the base material. The cavity is disposed on the surface of the melting element to form a melting space for the melting element. The electrode terminal forms a conductive electrode. The method of manufacturing the current protecting element includes a step of providing the base material and forming the upper layer and the lower layer using the base material, a step of forming the cavity in the upper layer or lower layer, a step of disposing the melting element between the upper layer and the lower layer, a step of exposing the edge of the melting element to the outside of the base material, a step of forming the electrode terminal out of the edge, and a step of obtaining an element having the cavity. Hence the base material, cavity, melting element, and electrode terminal exert an effect of protecting various currents of different sizes. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a current protection device, and in particular, uses a composition application of a substrate, a cavity, a melting element, and an electrode terminal to provide various current protection effects of various sizes in a circuit. The present invention relates to a current protection element to be formed.

  Currently, there are fuses manufactured in an integral molding method on the market, FIG. 1 is a diagram showing a known fuse, US Pat. No. 6,034,589, and a chip melting element 100 applied to surface adhesion is multi-layered. Improve the structure of the molten element. US Pat. No. 7,268,661 discloses an example of such a technical scheme, which is a high-current protection circuit, which relates to a component of a molten element and a material for an electric arc. Further, a similar technical method is disclosed in the specification of US Pat. No. 5,726,621, and the invention relates to a structure of a multi-circuit melting element and a manufacturing process with a ceramic element having a protective circuit adhered to the surface. All known techniques are manufactured in a one-piece process, but the melting element of these products is limited by the uniformity of the ceramic powder and affects the temperature distribution in the melting region, so it is not reliable. .

An object of the present invention is to provide a device structure and a manufacturing method for current protection, and in particular, by using composition application of a substrate, a cavity, a molten element, and an electrode terminal, various sizes are different in a circuit. It is to form a current protection effect.
Another object of the present invention is to manufacture by the low temperature integral molding method to prevent the electric arc effect.
A further object of the present invention is to use simple cavities, melting elements, and low-temperature densified materials, and to apply current protection for small-scale, high-rated currents, low consumption loss, and small volume, minimum layer It is to achieve the advantages such as use of product number.
The final object of the present invention is further to provide an anti-electric arc effect by placing an anti-electric arc layer on the molten element to form a molten electric arc that resists the molten element.

The present invention provides a current protection device structure and a manufacturing method. The element structure for current protection includes a base material, a cavity, a molten element, and an electrode terminal. The substrate has an upper layer portion and a lower layer portion, and the melting element is placed between the upper layer portion and the lower layer portion of the substrate, and the outer edge thereof is exposed to the outside of the substrate. The cavity is placed on the surface of the melting element to form a melting space for the melting element. The electrode terminal forms a conductive electrode.
The method for manufacturing a current protection element of the present invention provides a base material, the base material forms an upper layer portion and a lower layer portion, the upper layer portion or the lower layer portion forms a cavity, and a melting element. The step of installing between the upper layer portion and the lower layer portion, the step of exposing the end portion of the molten element to the outside of the substrate, the step of forming an electrode terminal at the end portion, and the step of obtaining an element having a cavity .

  The present invention increases stability, safety, improves production competitiveness, expands the rated current space of current protection elements, increases the utilization of circuit board space, is highly effective, and low in cost, Since the volume is small and surface adhesion can be performed, utility value and demand increase.

It is a figure which shows a well-known fuse. It is a 1st Example figure of this invention. It is a 2nd Example figure of this invention. It is a 3rd Example figure of this invention. It is a 4th Example figure of this invention. It is a 5th Example figure of this invention. It is a 6th Example figure of this invention. It is a 7th Example figure of this invention. It is an 8th Example figure of this invention. It is a ninety-one embodiment diagram of the present invention. It is a 10th Example figure of this invention. It is an 11th Example figure of this invention.

2 to 12 are views showing first to eleventh embodiments of the present invention. The current protection element 1 structure of the present invention includes a base material 2, a melting element 3, a cavity 4, and an electrode terminal 5.
The base material 2 has an upper layer portion 21 and a lower layer portion 22, and forms an upper end foundation and a lower end foundation of the element 1.
The molten element 3 is placed between the upper layer portion 21 and the lower layer portion 22 of the base material 2, and the outer edge 31 is exposed to the outside of the base material 2.
The cavity 4 is installed on the surface 32 of the melting element 3 to form a melting space 41 of the melting element 3.
The electrode terminal 5 has three layers, which are formed of a silver thin layer 51, a nickel thin layer 52, and a tin foil layer 53, and are placed on the edge of the substrate 2 to form a conductive electrode.
In the practice of the present invention, the current protection element 1 structure further includes placing at least one anti-electric arc layer 6 on the molten element 3 to form a molten electric arc that resists the molten element (FIGS. 3 and 5). To FIG. 8, FIG. 10, and FIG. 11). The substrate 2 is one of glass, calcium (Ca) -boron (B) -silicon (Si) ceramic, a mixture of glass and aluminum oxide, or a material formed by low-temperature sintering. The composition material for low-temperature sintering has a densification temperature of 1000 ° C. or lower. The molten element 3 is silver (Ag), copper (Cu), aluminum (Al), gold (Au), or a metal mixture. The metal mixture is a metal alloy or a mixed metal. The cavity 4 has a smaller space dimension than the element-sized cavity, and is installed in the vicinity of the melting element 3 to form an indirect melting space for the melting element 3. The anti-electric arc layer 6 is any one of glass, a mixture of glass and metal oxide, or a material formed by low-temperature sintering. The composition material for low-temperature sintering has a densification temperature of 1000 ° C. or lower.
In a further implementation of the present invention, the sandwich layer 7 is provided between the upper layer portion 21 and the lower layer portion 22. Between the upper surface portion 71 and the upper layer portion 21 of the sandwich layer 7 and between the lower surface portion 72 and the lower layer portion 22, the melting element 3 is installed to increase the rated current amount (in FIGS. 9 to 11). Indicated). The sandwich layer 7 forms the cavity 4 near the melting element 3 and forms an indirect melting space of the melting element 3 (shown in FIG. 12).
As can be understood by those skilled in the art, the embodiment of the current protection element 1 can be implemented in a current protection element in which a single layer or multilayer electrode terminal 5 is provided. Depending on the number of layers of the cavity 4 and the sandwiching layer 7, a multilayered melting element 3 can be further installed to increase the rated current and achieve a homologous protective effect.
Subsequently, a method for manufacturing a current protection element will be described.
1. 1. Providing the base material 2, and the base material forms the upper layer portion 21 and the lower layer portion 22. 2. Upper layer portion 21 or lower layer portion 22 forms cavity 4 Thereafter, the molten element 3 is placed between the upper layer portion 21 and the lower layer portion 22. 4. The end of the molten element 3 is exposed to the outside of the substrate 2 5. The end forms an electrode terminal. Obtaining an element 1 having a cavity 4;
Consists of.
In the method of manufacturing a current protection element of the present invention, the anti-electric arc layer 6 is further formed on the upper surface 321 or the lower surface 322 of the molten element 3 after the molten element 3 is formed. A device 1 having 4 is obtained. Further, after forming the cavity 4, the molten element 3 is formed on the upper surface portion 71 and the lower surface portion 72 of the sandwich layer 7, and then the sandwich layer 7 on which the molten element 3 is placed is formed on the upper layer portion 21 and the lower layer portion. 22 to obtain an element 1 having a cavity 4 through a subsequent program.
The advantages of the present invention are as follows.
1. It has a cavity and demonstrates the ability to assist melting of melting elements, increasing the use effect, stability, and safety.
2. Having an anti-electric arc layer, the anti-electric arc layer suppresses the melting electric arc of the melting element to protect the safety of the circuit and improve the production competitiveness.
3. The sandwiching layer may not be installed or may be provided with a plurality of layers, and expands the rated current space of the current protection element.
4). When used, it saves space and is manufactured in an integrated manner, increasing the utilization of space on the circuit board.
5). Since the effect is high, the cost is low, the volume is small, and surface adhesion can be performed, the utility value and demand increase.
In the present invention, preferred embodiments have been disclosed as described above. However, the present invention is not limited to the present invention, and any person who is familiar with the technology can use various methods within the spirit and scope of the present invention. Variations and moist colors can be added, so the protection scope of the present invention is based on what is specified in the claims.

Chip melting element 100
Current protection device 1 of the present invention
Base material 2
Upper layer portion 21 and lower layer portion 22
Molten element 3
Cavity 4
Electrode terminal 5
Anti-electric arc layer 6
Sandwich layer 7
Outer edge 31
A melting space 41 is formed.
Silver thin layer 51
Nickel thin layer 52
Tin foil layer 53

Claims (10)

The element structure of current protection is characterized by a substrate, a cavity, a molten element, and an electrode terminal.
The base material has an upper layer portion and a lower layer portion, and forms an upper end base and a lower end base of the element,
The melting element is installed between the upper layer portion and the lower layer portion of the base material, the outer edge thereof is exposed to the outside of the base material,
The cavity is disposed on a surface of the molten element to form a melting space of the molten element;
The electrode terminal has three layers, formed from a silver thin layer, a nickel thin layer, and a tin foil layer, and is installed at an edge of the base material to form a conductive electrode,
Thereby, the base material, the cavity, the melting element, and the electrode terminal form a current protection effect of various different magnitudes in the circuit. The device structure for current protection according to claim 1, further comprising: forming at least one anti-electric arc layer on the molten element to form a molten electric arc that resists the molten element. The base material is one of glass, calcium (Ca) -boron (B) -silicon (Si) ceramic, a mixture of glass and aluminum oxide, or a low-temperature sintered material. The element structure for current protection according to claim 1 or 2. The molten element is any one of silver (Ag), copper (Cu), aluminum (Al), gold (Au), or a metal mixture. The element structure of current protection as described. 3. The cavity according to claim 1 or 2, wherein the cavity is installed at a location having a spatial dimension smaller than that of the element and close to the melting element to form an indirect melting space of the melting element. Current protection element structure. The anti-electric arc layer is one of glass, a mixture of glass and metal oxide, or a low-temperature sintered material, and the low-temperature sintered composition material has a densification temperature of 1000 ° C. or less. 3. The element structure for current protection according to claim 2, wherein the element structure is provided. The molten element further includes a sandwich layer between the upper layer portion and the lower layer portion, and between the upper surface of the sandwich layer and the upper layer portion, and between the lower surface portion and the lower layer portion of the sandwich layer. The device structure for current protection according to claim 1, wherein a fixed amount of current is increased by installing a current-carrying element. A method of manufacturing a current protection element, the method comprising:
Providing a substrate, wherein the substrate forms an upper layer portion and a lower layer portion;
The upper layer part or the lower layer part forming a cavity;
Installing the molten element between the upper layer portion and the lower layer portion;
Exposing the end of the melting element to the outside of the substrate;
The end forming an electrode terminal;
Obtaining an element having the cavity;
A method of manufacturing a current protection element comprising: The method further comprises forming an anti-electric arc layer on the upper surface or the lower surface of the molten element after forming the molten element, and obtaining the device having the cavity through a subsequent program. A method for producing an element for current protection as described in 1. above. Furthermore, after forming the cavity, the molten element is formed in the upper surface portion and the lower surface portion of the sandwich layer, and then the sandwich layer having the molten element is installed between the upper layer portion and the lower layer portion, 10. The method of manufacturing a current protection device according to claim 8, further comprising a step of obtaining the device having the cavity through a subsequent program.

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