CN207283941U - A kind of electronic circuit board graft structure - Google Patents
A kind of electronic circuit board graft structure Download PDFInfo
- Publication number
- CN207283941U CN207283941U CN201721006348.7U CN201721006348U CN207283941U CN 207283941 U CN207283941 U CN 207283941U CN 201721006348 U CN201721006348 U CN 201721006348U CN 207283941 U CN207283941 U CN 207283941U
- Authority
- CN
- China
- Prior art keywords
- electronic circuit
- circuit board
- existing
- existing electronic
- graft structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
A kind of electronic circuit board graft structure, it is characterized in that, there is electronic circuit on existing electronic circuit board, new electronic circuit is formed using screen printing technique with electrocondution slurry on the same side with electronic circuit on existing electronic circuit board, with existing electronic circuit board there is electronic circuit to combine the complete circuit being integrally formed after the new electronic circuit curing.The beneficial effects of the utility model are, have filled up the blank of existing electronic circuit board bond pad surface processing, enrich the species of existing electronic circuit board bond pad surface treatment technology.The utility model eliminates the plating nickel gold of existing electronic circuit board bond pad surface treatment technology chemical reaction and heavy silver process.Therefore, the utility model is more environmentally protective.
Description
Technical field
It the utility model is related to electronic circuit board technical field, more particularly to a kind of installation assembling flip LED chips（Below
Abbreviation CSP chips）Electronic circuit board graft technology and structure.
Background technology
In existing electronic circuit manufacturing process, one piece of complete electronic circuit board substantially need by " ... patch light-sensitive surface,
Exposure imaging, etching take off film, bond pad surface processing " technological process.
In the technological process, bond pad surface treatment process is to ensure that element or solder joint have good solderability conduction
Property.Common process of surface treatment is respectively hot air leveling（Also known as spray tin）, organic coat（Also known as OSP）, chemical nickel plating/leaching
Gold, leaching silver, will make introductions all round below：
Hot air leveling：Hot air leveling also known as hot air solder level, it is in PCB or bond pad surface coating melting tin-lead solder
It is and whole with heated compressed air（Blow）Flat technique, forms it into one layer of not only anti-copper oxidation, but also can provide good solderability
Coat.
Organic coat（OSP）：OSP is exactly on clean naked copper surface, and one layer of organic coating is grown in the method for chemistry.
This tunic has anti-oxidation, heat shock resistance, moisture-proof, to protect copper surface not continue to get rusty in normal environment（Oxidation
Or vulcanization etc.）；But in follow-up welding high temperature, such a protective film must be easy to be removed rapidly by scaling powder again, so
The clean copper surface that can enable to expose is combined into firm solder joint immediately within the extremely short time with melting scolding tin.
Chemical nickel plating gold：Chemical nickel plating/leaching gold can be formed on electronic circuit board pad stabilization, there is good conductive
Performance is led
Electric layer.
Leaching silver：According to displacement reaction principle, the fine silver conductive layer of formation submicron order on electronic circuit board pad.
However, existing electronic circuit board electronic circuit is applied to LED light source, particularly for CSP chips when, there are many
Deficiency.
The once-forming element installation assembling position of one, the electronic circuit of existing electronic circuit board, it is impossible to meet LED light
The requirement in source.
LED light power is to add up what superposition was realized by the LED chip of n smaller power, also because of this feature of LED light source,
Market has been expedited the emergence of to LED light power（Brightness）Diversity and particularity demand.And the electronics that existing electronic circuit board is once-forming
The installation assembling position of circuit and LED chip, it is clear that cannot meet needs of the market to LED light source.
Secondly, existing electronic circuit board electronic circuit bond pad surface treatment process, be not suitable with LED chip development：
The process of surface treatment of existing electronic circuit board electronic circuit pad, either hot air leveling（Also known as spray tin）, have
Machine coats（Also known as OSP）, chemical nickel plating gold, leaching silver, can be classified as rigid pad, when existing electronic circuit board flatness is low
When, necessarily cause the flatness of pad low.And LED core plate electrode belongs to rigid electrode together, and LED core plate electrode has higher put down
Face degree is high.LED chip electrode plane with higher level degree is implemented to be conductively connected with the pad plane with relatively low flatness
When, be unfavorable for two electrodes be conductively connected and heat transfer, the defect are especially using " insulating cement conduction skill in CSP chips
It is more prominent on the CSP chips of art ".
Utility model content
For above-mentioned prior art deficiency, the utility model provides a kind of electronic circuit board graft structure.
A kind of electronic circuit board graft structure provided by the utility model, is achieved through the following technical solutions：
A kind of electronic circuit board graft structure, it is characterised in that there is electronic circuit on existing electronic circuit board, existing
Have and new electronics is formed using screen printing technique with electrocondution slurry on the same side with electronic circuit on electronic circuit board
Circuit, the new electronic circuit cure after with there is electronic circuit to combine on existing electronic circuit board be integrally formed it is complete
Circuit.
It is described to use silk-screen printing with electrocondution slurry on the same side with electronic circuit on existing electronic circuit board
Technology forms new electronic circuit, it is characterised in that：The electrocondution slurry is mixed for silver paste or Argent grain and other conductive materials
Close slurry.
The new electronic circuit cure after with there is electronic circuit to combine on existing electronic circuit board be integrally formed it is complete
Whole circuit, it is characterised in that：The new electronic circuit is cured as being heating and curing.
It is described to use silk-screen printing with electrocondution slurry on the same side with electronic circuit on existing electronic circuit board
Technology forms new electronic circuit, it is characterised in that：The new electronic circuit is present in the existing electronic circuit board
On insulating layer.
It is described to use silk-screen printing with electrocondution slurry on the same side with electronic circuit on existing electronic circuit board
Technology forms new electronic circuit, it is characterised in that：The new electronic circuit is flexible pads.
The new electronic circuit is flexible pads, it is characterised in that：The flexible pads are present in the existing electricity
On the insulating layer of sub-circuit board.
The new electronic circuit is flexible pads, it is characterised in that：The flexible pads are present in the existing electronics
On circuit board on the copper-based pad with electronic circuit.
The new electronic circuit is flexible pads, it is characterised in that：The flexible pads are present in the existing electricity
On sub-circuit board on the pad with electronic circuit, the pad with electronic circuit is to use on the existing electronic circuit board
Pad after existing electronic circuit board bond pad surface treatment technology processing.
The beneficial effects of the utility model：
The beneficial effects of the utility model are, have filled up the blank of existing electronic circuit board bond pad surface processing, have enriched
The species of existing electronic circuit board bond pad surface treatment technology.
The utility model eliminates the plating nickel gold of existing electronic circuit board bond pad surface treatment technology chemical reaction and heavy silver
Technique.Therefore, the utility model is more environmentally protective.
The utility model improves the electric conductivity and heat-conductive characteristic of CSP chips, particularly when CSP chips are using " insulation
During glue conduction technology ", it can effectively improve the on-state rate and heat-conductive characteristic of CSP chips.
The utility model can be according to market to LED light power（Brightness）The demand of diversity and particularity increases and decreases luminous power,
Position and the angle of light can also be adjusted according to the luminescence feature of light, so as to improve the lighting quality of light source.Therefore, this practicality is new
Type has, more flexibility, diversity and particularity more efficient soon to market reaction, can more meet the different needs in market.
Brief description of the drawings
Fig. 1 is one of the utility model structure diagram graft structure；
Fig. 2 is the two of the utility model structure diagram graft structure；
Fig. 3 is the three of the utility model structure diagram graft structure；
In figure, existing 3 existing electronic circuit board of the electronic circuit board electronic circuit injector layer electricity of 1 existing electronic circuit board 2
New 5 flexible pads of electronic circuit, 6 existing 7 existing electronic circuit board of the electronic circuit plate insulating layer electricity of sub-line road conductive layer 4
Sub- line pad
Embodiment
The technical solution of the utility model will be done by specific embodiment 1, specific embodiment 2, specific embodiment 3 below
Further describe：
Specific embodiment 1：
A kind of electronic circuit board graft structure, it is characterised in that：There is electronic circuit on existing electronic circuit board 1,
New electric wire is formed using screen printing technique with silver paste on the same side with electronic circuit on existing electronic circuit board 1
Road 4, the new electronic circuit 4 cure when 160 DEG C 1 small after with existing electronic circuit board 1 have electronic circuit combine structure
Integral complete circuit（Referring to brief description of the drawings Fig. 1）.
Specific embodiment 2：
A kind of electronic circuit board graft structure, it is characterised in that：There is electronic circuit on existing electronic circuit board 1,
On the insulating layer of existing electronic circuit board 1 on existing electronic circuit board 1 on the same side with electronic circuit, adopted with silver paste
With screen printing technique formed flexible pads 5, flexible pads 5 cure when 160 DEG C 1 small after with having on existing electronic circuit board 1
There is the complete circuit that electronic circuit combination is integrally formed（Referring to brief description of the drawings Fig. 2）.
Specific embodiment 3：
A kind of electronic circuit board graft structure, it is characterised in that：There is electronic circuit on existing electronic circuit board 1,
On existing electronic circuit board 1 on the pad with electronic circuit, flexible pads 5 are formed using screen printing technique with silver paste, it is soft
Property pad 5 cure when 160 DEG C 1 small after with existing electronic circuit board 1 have electronic circuit combine be integrally formed it is complete
Circuit（Referring to brief description of the drawings Fig. 3）.
Obviously, described embodiment is only the part of the embodiment of the utility model, instead of all the embodiments.Base
Embodiment in the utility model, those skilled in the art obtained without making creative work it is all its
His embodiment, shall fall within the protection scope of the present invention.
Embodiment described above only represents the embodiment of the utility model, its description is more specific and detailed, but not
It is understood that as the limitation to the scope of the utility model.It should be pointed out that for those skilled in the art, do not departing from
On the premise of the utility model is conceived, various modifications and improvements can be made, these belong to scope of protection of the utility model.
Claims (8)
1. a kind of electronic circuit board graft structure, it is characterised in that be made on existing electronic circuit board of electrocondution slurry new
Electronic circuit, the new electronic circuit are combined with existing electronic circuit on existing electronic circuit board after curing and are integrally constituted
Complete electronic circuit.
2. according to a kind of electronic circuit board graft structure described in claim 1, it is characterised in that the electrocondution slurry is silver
Glue.
3. according to a kind of electronic circuit board graft structure described in claim 1, it is characterised in that the new electronic circuit is consolidated
Turn to and be heating and curing.
4. according to a kind of electronic circuit board graft structure described in claim 1, it is characterised in that the new electronic circuit is deposited
It is on the insulating layer of the existing electronic circuit board.
5. according to a kind of electronic circuit board graft structure described in claim 1, it is characterised in that the new electronic circuit it
Pad is flexible pads.
6. according to a kind of electronic circuit board graft structure described in claim 5, it is characterised in that the flexible pads are present in
On the insulating layer of the existing electronic circuit board.
7. according to a kind of electronic circuit board graft structure described in claim 5, it is characterised in that the flexible pads are present in
On the existing electronic circuit board on the copper-based pad of existing electronic circuit.
8. according to a kind of electronic circuit board graft structure described in claim 5, it is characterised in that the flexible pads are present in
On the existing electronic circuit board on the pad of existing electronic circuit, existing electronics on the existing electronic circuit board
The pad of circuit is the pad after being handled with existing electronic circuit board bond pad surface treatment technology.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721006348.7U CN207283941U (en) | 2017-08-13 | 2017-08-13 | A kind of electronic circuit board graft structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721006348.7U CN207283941U (en) | 2017-08-13 | 2017-08-13 | A kind of electronic circuit board graft structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207283941U true CN207283941U (en) | 2018-04-27 |
Family
ID=61984014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721006348.7U Active CN207283941U (en) | 2017-08-13 | 2017-08-13 | A kind of electronic circuit board graft structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207283941U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109291653A (en) * | 2018-11-09 | 2019-02-01 | 北海绩迅电子科技有限公司 | A kind of print cartridge processing method and improve print cartridge |
-
2017
- 2017-08-13 CN CN201721006348.7U patent/CN207283941U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109291653A (en) * | 2018-11-09 | 2019-02-01 | 北海绩迅电子科技有限公司 | A kind of print cartridge processing method and improve print cartridge |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101630668B (en) | Compound semiconductor element, packaging structure of optoelectronic element and manufacturing method of optoelectronic element | |
| CN1575096A (en) | Electronic circuit device and its manufacturing method | |
| CN1606154A (en) | Semiconductor device and method for making same | |
| CN207781646U (en) | A kind of LED chip face-down bonding structure and LED lamp bead | |
| CN102881806A (en) | Surface mounted device light emitting diode (SMD LED) unit and packaging method thereof | |
| CN207283941U (en) | A kind of electronic circuit board graft structure | |
| WO2014090096A1 (en) | Method for die bonding led core particles | |
| CN102088017B (en) | LED SMD (surface mount type)packaging module | |
| CN206947335U (en) | A kind of upside-down mounting RGB LED encapsulation modules and its display screen | |
| KR101979078B1 (en) | Anisotropic conductive film using solder coated metal conducting particles | |
| CN202075772U (en) | Contact-type integrated card (IC) module | |
| CN102246607B (en) | Electrode connection structure, conductive adhesive used therefor, and electronic device | |
| WO2023206939A1 (en) | Electronic structure and manufacturing method therefor | |
| KR101492890B1 (en) | Conductive adhesive composition of LED for surface mount type | |
| CN102034915A (en) | Light emitting semiconductor device | |
| CN213333786U (en) | Flexible lamp strip | |
| KR20190085349A (en) | Adhesives for LED die bonding | |
| JP2011054444A (en) | Conductive material, electronic device using the material, and method for manufacturing the device | |
| CN101266851A (en) | Electrostatic protection component, and electronic component module using the same | |
| CN1964089A (en) | A method for packaging LED on transparent soft thin film substrate | |
| TWI735787B (en) | Circuit board and manufacturing method thereof | |
| CN218820223U (en) | LED lamp panel structure and lamp | |
| US7446401B2 (en) | Structure of power semiconductor with twin metal and ceramic plates | |
| CN200941325Y (en) | Surface attaching positive coefficient thermistor | |
| WO2022220030A1 (en) | Electronic component mounting method and circuit mounting board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |