CN101266851A - Electrostatic protection component, and electronic component module using the same - Google Patents
Electrostatic protection component, and electronic component module using the same Download PDFInfo
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- CN101266851A CN101266851A CNA2008100838776A CN200810083877A CN101266851A CN 101266851 A CN101266851 A CN 101266851A CN A2008100838776 A CNA2008100838776 A CN A2008100838776A CN 200810083877 A CN200810083877 A CN 200810083877A CN 101266851 A CN101266851 A CN 101266851A
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- emitting diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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Abstract
An electrostatic discharge protection component comprising a ceramic sintered body having ceramic substrate 12 , varistor portion 10 formed thereon excluding some non-formed portion 18 , and glass ceramic layer 14 further formed thereon, a pair of terminal electrodes 13 a, 13 b disposed by exposing a part thereof at non-formed portion 18 on ceramic substrate 12 of the ceramic sintered body, a pair of external electrodes 16 a, 16 b, and heat conducting portion 15 vertically penetrating ceramic substrate 12 , a light-emitting diode or the like mounted on heat conducting portion 15 at non-formed portion 18 , it is possible to reduce the size and to efficiently dissipate the heat generated by the component mounted.
Description
Technical field
The conduct protection electronic equipment that the present invention relates to use in various electronic equipments is not subjected to the static of the electronic unit of electrostatic influence to tackle parts and has utilized this static to tackle the electronic component modules such as light-emitting diode (LED) module of parts.
Background technology
In recent years, the miniaturization of electronic equipments such as mobile phone, low consumption electrification develop rapidly, follow in this, and the proof voltage of the various electronic units of the circuit of formation electronic equipment descends gradually.
Therefore, the various electronic units that cause such as the electrostatic pulse that when human body contacts with the conducting portion of electronic equipment, produces especially the fault of the electronic equipment that destruction caused of semiconductor device disturb and increase.
And, be accompanied by the development of the blue diode of white color system as a kind of light-emitting diode of semiconductor device, can estimate in the backlight of display device or the photoflash lamp of minicam etc., to use and wait and obtain universal widely.But the light-emitting diode of these white color system exists at the low problem of the proof voltage of electrostatic pulse.
In the past, for example, opened the spy and to disclose the technology that such protection light-emitting diode is not influenced by electrostatic pulse in the 2002-335012 communique.Open in the disclosed technology of 2002-335012 communique the spy, by the electronic unit that variable resistor or Zener diode have nonlinear resistance property like this is set between the line of introducing static and ground connection, electrostatic pulse is switched to ground connection, suppress to be applied to the high voltage of light-emitting diode thus.
But, in above-mentioned combination in the past in the formation of light-emitting diode and variable resistor or Zener diode, connect light-emitting diode and variable resistor or Zener diode by miscellaneous parts such as substrates, not integrated, thereby be difficult to miniaturization.
And, for the luminous quantity that makes light-emitting diode is bigger, need the bigger electric current that flows.But current amount flowing is big more, can cause the heating of light-emitting diode itself more.And, can cause results such as light-emitting diode deterioration, luminous efficiency reduction and the lost of life because of this heat.Therefore, for the luminous efficiency that does not make light-emitting diode reduces, prevents the life-span deterioration, the heat dissipation that need make light-emitting diode effectively and sent.But the parts that form the chip type of more small-sized encapsulation shape do not have cooling mechanism, have externally used resin, therefore, and the heat dissipation that is difficult to make light-emitting diode effectively and is sent.
Summary of the invention
The present invention is used to solve above-mentioned problem, the electronic component module that purpose is to provide a kind of thermal diffusivity excellence, small-sized, high-intensity static reply parts and has utilized this static corresponding component.
To achieve these goals, static of the present invention reply parts comprise: possess ceramic substrate, the variable resistance part that forms replacing stacked variable resistance layer and internal electrode on the ceramic substrate and the ceramic sintered bodies of the glass-ceramic layer that forms on variable resistance part; Be arranged at the pair of terminal electrode of ceramic sintered bodies; The pair of external electrodes that is connected with terminal electrode with internal electrode; With the heat conduction body that connects ceramic sintered bodies; Variable resistance part and glass-ceramic layer all form on the non-part that forms outside the part of the part of ceramic substrate, terminal electrode is in the non-mode that forms on the part according to its part and is formed on the ceramic substrate, and the heat conduction body is formed on the non-formation part of ceramic substrate.
And electronic component module of the present invention carries the electronic unit element on the heat conduction body of above-mentioned electronic unit, the terminal electrode of the terminal of electronic unit element and electronic unit is electrically connected to fetch installs.
According to static reply parts of the present invention, can realize being built-in with the small-sized and high-intensity static reply parts of variable resistor function.
And when carrying electronic unit elements such as light-emitting diode is installed, the non-formation part that can not form variable resistance part and glass-ceramic layer on ceramic substrate is that recess carries the electronic unit element, therefore can realize the slimming of module.
Also have, the heat conduction body is set, can carry the electronic unit element in this part, therefore, the heat that can send the parts that carried effectively dispels the heat.
And then, owing to being in non-formation part, its part of terminal electrode is formed on the ceramic substrate, therefore, the face of the terminal electrode that is electrically connected with the electronic unit element and the lift-launch face of electronic unit element are roughly the plane, can realize that the flip-chip of electronic unit element is installed.
In addition, according to electronic component module of the present invention, protect the electronic unit element not influenced by electrostatic pulse by the variable resistance part of static reply parts, therefore anti-electrostatic pulse excellence.
And then, can dispel the heat effectively to the heat that electronic unit elements such as light-emitting diode are sent by the heat conduction body, so the thermal diffusivity excellence, luminous efficiency is good.
Also have, the non-formation part that can not form variable resistance part and glass-ceramic layer on ceramic substrate is that recess carries the electronic unit element, therefore can make the module slimming, can realize small-sized, slim and practical electronic component module.
And then it is different with the terminal conjunction method that has utilized metal wire that the electronic unit element is carried out the flip-chip installation, can not produce the shade of metal wire, do not have luminance nonuniformity, can realize the electronic component module that luminous efficiency is higher.
Description of drawings
Fig. 1 is the stereoscopic figure of the static reply parts of embodiments of the present invention 1.
Fig. 2 is the cutaway view of the A-A ' of above-mentioned static reply parts.
Fig. 3 is the cutaway view of the B-B ' of above-mentioned static reply parts.
Fig. 4 is the signal exploded perspective view of above-mentioned static reply parts.
Fig. 5 is the cutaway view of the electronic component module of above-mentioned execution mode.
Fig. 6 is the equivalent circuit diagram of above-mentioned electronic component module.
Fig. 7 is the signal exploded perspective view of the static reply parts of comparative example.
Fig. 8 is the stereoscopic figure of the static reply parts of comparative example.
Fig. 9 is the cutaway view of the electronic component module of comparative example.
Figure 10 is the cutaway view that is used to illustrate the method that the thermal diffusivity of the electronic component module of above-mentioned execution mode is estimated.
Figure 11 is the cutaway view that is used to illustrate the method that the thermal diffusivity of the electronic component module of comparative example is estimated.
Figure 12 is the stereoscopic figure of the static reply parts of embodiments of the present invention 2.
Figure 13 is the cutaway view of the A-A ' of above-mentioned static reply parts.
Figure 14 is the cutaway view of the B-B ' of above-mentioned static reply parts.
Figure 15 is the signal exploded perspective view of above-mentioned static reply parts.
Figure 16 is the cutaway view of the electronic component module of above-mentioned execution mode.
Figure 17 is the cutaway view that is used to illustrate the method that the thermal diffusivity of the electronic component module of above-mentioned execution mode is estimated.
Embodiment
Below, utilize accompanying drawing, describe being used to implement best mode of the present invention.In addition, in the following embodiments,, describe having used the light-emitting diode (LED) module of light-emitting diode in the electronic unit element as the example of electronic component module.
1. first execution mode
Below, the static of embodiments of the present invention 1 reply parts and light-emitting diode (LED) module are described.
Fig. 1 is the stereoscopic figure of the static reply parts of embodiments of the present invention 1.Fig. 2 is the cutaway view of 2-2 line of Fig. 1 of the static reply parts of present embodiment.Fig. 3 is the cutaway view of 3-3 line of Fig. 1 of the static reply parts of present embodiment.Fig. 4 is the signal exploded perspective view of the static reply parts of present embodiment.Fig. 5 is the cutaway view of the light-emitting diode (LED) module of present embodiment.Fig. 6 is the equivalent circuit diagram of the light-emitting diode (LED) module of present embodiment.
As shown in Figure 1, Figure 2, Figure 3 and Figure 4, the static of present embodiment reply parts have variable resistance part 10, and this variable resistance part 10 is alternately laminated and constitute by three variable resistance layer 10a, 10b, 10c and internal electrode 11a, 11b.The static reply parts of present embodiment also have ceramic sintered bodies, and this ceramic sintered bodies comprises: ceramic substrate 12, the variable resistance part 10 in formation on this ceramic substrate 12, the glass-ceramic layer 14 of stacked formation on this variable resistance part 10.On the ceramic substrate 12 of ceramic sintered bodies, be provided with the non-formation part 18 that does not form variable resistance part 10 and glass-ceramic layer 14.That is, on ceramic substrate 12, on the part outside the non-formation part 18 of a part, form variable resistance part 10 and glass-ceramic layer 14.On the ceramic substrate 12 of ceramic sintered bodies, the mode that is on the non-formation part 18 according to its part is provided with pair of terminal electrode 13a and 13b.The surface of the opposite side of the formation face with terminal electrode 13a and 13b of the ceramic substrate 12 of this ceramic sintered bodies is provided with pair of external electrodes 16a and 16b.In the non-formation part 18 of the ceramic substrate 12 of ceramic sintered bodies, be provided with and connect heat conduction body 15 up and down, and then, below ceramic sintered bodies, be provided with the outside heat conduction body 17 that is connected with heat conduction body 15.Internal electrode 11a is electrically connected with outer electrode 16a and terminal electrode 13a through connecting with via hole conductor 19a.Equally, internal electrode 11b is electrically connected with outer electrode 16b and terminal electrode 13b through connecting with via hole conductor 19b.And when electronic unit element such as light-emitting diode was installed to the static of present embodiment reply component mounting, the heat conduction body 15 of the non-formation part 18 of the ceramic substrate 12 of ceramic sintered bodies became the lift-launch part of electronic unit element.And terminal electrode 13a and 13b become the part that is electrically connected with the electronic unit element.
In addition, as shown in Figure 5, in the light-emitting diode (LED) module of present embodiment, on the heat conduction body 15 of the non-formation part 18 of the ceramic substrate 12 of the static of present embodiment reply parts, carry by conductive adhesive 22 and to be connected with light-emitting diode 20.One side's of light-emitting diode 20 the projection terminal of overshooting shape is electrically connected with terminal electrode 13a, and the projection terminal of the opposing party's overshooting shape is electrically connected with terminal electrode 13b, carry out flip-chip thus and install.
Therefore, the circuit of the light-emitting diode (LED) module of present embodiment becomes equivalent electric circuit shown in Figure 6.Among Fig. 6, on the outer electrode 202 and 203 of the variable resistor 201 that internal electrode 11a, 11b and variable resistance layer 10b by above-mentioned explanation form, be connected in parallel to light-emitting diode 204.
As mentioned above, in the static reply parts of present embodiment, in that the part except the non-formation part 18 of a part all is laminated to and carries out sintering on the ceramic substrate 12 and non-formation part 18 places ceramic sintered bodies after integrated, on the ceramic substrate 12 with variable resistance part 10 and glass-ceramic layer 14, be formed with the heat conduction body 15 that connects this ceramic sintered bodies.
And in the light-emitting diode (LED) module of present embodiment, the heat conduction body 15 in the non-formation part 18 of the ceramic substrate 12 of ceramic sintered bodies is equipped with light-emitting diode 20.
Therefore, be the big part of thermal conductivity by making heat conduction body 15, thereby the heat that can send the parts that carried dispels the heat effectively.
And, the outside heat conduction body 17 that is connected with heat conduction body 15 by setting below ceramic sintered bodies, can improve carry the connecting airtight property of connecting portion when being connected to outside heating panel etc., the heat that can more effectively send the light-emitting diode 20 that is carried dispels the heat.
And then, because being recess, the non-formation part 18 that does not form variable resistance part 10 and glass-ceramic layer 14 on ceramic substrate 12 carries light-emitting diode 20, therefore, can realize the slimming of light-emitting diode (LED) module.
And, because terminal electrode 13a and 13b are formed on the ceramic substrate 12 according to the mode that its part is on the non-formation part 18, therefore, the face of the terminal electrode that is electrically connected with light-emitting diode 20 and the lift-launch face of light-emitting diode 20 are roughly the plane, can realize that the flip-chip of light-emitting diode 20 is installed.
It is different with the terminal conjunction method that has utilized metal wire that light-emitting diode 20 is carried out the flip-chip installation, can not produce the shade of metal wire, do not have luminance nonuniformity, can realize the light-emitting diode (LED) module that luminous efficiency is higher.
Then, utilize Fig. 4, the static of embodiments of the present invention 1 is tackled member manufacturing method describe.
At first, making and prepare with zinc oxide is the ceramic powders of main component and the zinc oxide raw cook that is made of organic bond.And making and preparing with aluminium oxide and pyrex is the glass-ceramic powder of main component and the glass-ceramic raw cook that is made of organic bond.At this moment, the thickness of these raw cooks is about 30 μ m respectively.In addition, these raw cooks are after burning till, and the zinc oxide raw cook becomes variable resistance part 10, and the glass-ceramic raw cook becomes glass-ceramic layer 14.
As shown in Figure 4, at first, be connected position, by punch (puncher) etc. through hole be set, and in this through hole, be packed into silver paste with via hole conductor 19a and 19b the zinc oxide raw cook that becomes variable resistance layer 10a and 10b becoming separately.Then, becoming on the zinc oxide raw cook of variable resistance layer 10a, utilizing silver paste to form the conductor layer that becomes internal electrode 11a by silk screen print method.Being laminated with on it becomes the zinc oxide of variable resistance layer 10b raw cook, utilizes silver paste to be formed with the conductor layer that becomes internal electrode 11b by silk screen print method on this zinc oxide raw cook.And then being laminated with thereon becomes the zinc oxide of variable resistance layer 10c raw cook, produces the duplexer that becomes variable resistance part 10 thus.Then, the stacked thereon glass-ceramic raw cook that becomes glass-ceramic layer 14, thus produce the duplexer that becomes variable resistance part 10 and glass-ceramic layer 14.At this moment, the conductor layer that becomes internal electrode 11a and 11b as shown in Figure 4, the part of the non-formation part 18 that forms after avoiding becoming and forming.And, become the through hole that connects with via hole conductor 19a and be arranged on the position that conductor layer that will become internal electrode 11a and the conductor layer that becomes terminal electrode 13a couple together.Equally, become the through hole that connects with via hole conductor 19b and be arranged on the position that conductor layer that will become internal electrode 11b and the conductor layer that becomes terminal electrode 13b couple together.
Then, punch with punch according to the variable resistance part 10 that connects this duplexer and the mode of glass-ceramic layer 14, the through hole of diameter 0.6mm is set, it becomes the non-formation part 18 that does not form variable resistance part and glass-ceramic layer.
On the other hand,, utilize the aluminum oxide substrate that is provided with through hole at three place's assigned positions, in the through hole of this aluminum oxide substrate, be filled with silver paste as ceramic substrate 12.And then, on a face of aluminum oxide substrate, utilize silver paste to form the conductor layer that becomes terminal electrode 13a and 13b by silk screen print method.On another face of ceramic substrate 12, utilize silver paste to form the conductor layer that becomes outside heat conduction body 17 and outer electrode 16a and 16b by silk screen print method.The silver paste of filling in the through hole at above-mentioned three places becomes heat conduction body 15, connects with via hole conductor 19a and 19b after burning till.And, connect with via hole conductor 19a in that to burn till the back integrated with being connected with via hole conductor 19a of above-mentioned duplexer, connect with via hole conductor 19b after burning till and being connected of above-mentioned duplexer use via hole conductor 19b integrated.
Then, formed on the aluminum oxide substrate of conductor layer, attached the duplexer that becomes variable resistance part 10 and glass-ceramic layer 14 that is provided with above-mentioned through hole, as the duplexer piece in above-mentioned through hole, filling silver paste.In addition, the thickness of above-mentioned aluminum oxide substrate is about 180 μ m, and the thickness of conductor layer is about 2.5 μ m.The content of the silver of the silver paste that uses in the heat conduction body 15 is 85wt%, and the diameter of heat conduction body 15 is 300 microns, and the diameter that connects with via hole conductor 19a and 19b is 100 microns.And, becoming shape shown in Figure 4 in order to make after blocking, the pattern of the conductor layer of printing is made as to be arranged a plurality of illustrated shape and pattern form that form in length and breadth.
Then, above-mentioned duplexer piece heated in atmosphere carried out in atmosphere, being heated to 930 ℃ and burning till after the unsticking mixture handles, form incorporate sintered body.Then, the part of electrode 16a, 16b and terminal electrode 13a, 13b is externally implemented the plating of nickel, gold, and the sintered body of this duplexer piece is blocked separation with the size of regulation, as individual sheet, obtain the static reply parts in Fig. 1, Fig. 2 and the present embodiment shown in Figure 3.
The about 2.0mm of static reply part length direction size of the present embodiment of producing, the about 1.25mm of Width size, the about 0.3mm of thickness direction size.And, the variable resistor voltage V between outer electrode 16a and the 16b
1mAVoltage when promptly flowing the electric current of 1mA is 27V.
In addition, in the manufacture method of above-mentioned present embodiment, method as forming outer electrode 16a and 16b, outside heat conduction body 17 has illustrated and meanwhile burnt till the method that forms when variable resistance part 10 and glass-ceramic layer 14 are set on aluminum oxide substrate.But, also can adopt following order: at first, variable resistance part 10 and glass-ceramic layer 14, heat conduction body 15 are set on aluminum oxide substrate, are connected with via hole conductor 19a and 19b, as sintered body.Then, on a face of aluminum oxide substrate, become the conductor layer of the silver paste of outside heat conduction body 17, outer electrode 16a and 16b, these layers are baked and banked up with earth.Then, form heat conduction body 17, outer electrode 16a and 16b.And the sintered body under this situation can be the sintered bodies of a plurality of pieces of arranging in length and breadth, also can be the sintered body of a sheet, but considers from the productivity ratio aspect preferably to carry out in the stage of the sintered body of piece.
In order to compare, the static reply parts of comparative example have been made with present embodiment.The signal exploded perspective view of expression comparative example among Fig. 7, its stereoscopic of expression figure among Fig. 8.From Fig. 7 and Fig. 8 as can be known, the static of comparative example reply parts and the static in the present embodiment difference of tackling parts is: the non-formation part 18 that does not form variable resistance part and glass-ceramic layer is not set on ceramic substrate 12; Be provided with terminal electrode 13a and 13b on the surface of glass-ceramic layer 14; Heat conduction body 15 and outside heat conduction body 17 are not set; Be provided with outer electrode in the side.
Then, utilize Fig. 5, the manufacture method of the light-emitting diode (LED) module of one embodiment of the present invention is described.
Static reply parts to above-mentioned present embodiment carry connection light-emitting diode 20 by so-called flip-chip installation method, are made into the light-emitting diode (LED) module of present embodiment shown in Figure 5.Particularly, by conductive adhesive 22, light-emitting diode 20 pasters (die bond) of blueness that will have a projection terminal of overshooting shape carry on the heat conduction body 15 of non-formation part 18 of ceramic substrate 12 of the static reply parts be connected to present embodiment.And, be connected with terminal electrode 13a by the projection terminal of conductive adhesive 22 side's of light-emitting diode 20 overshooting shape, the opposing party's of light-emitting diode 20 the projection terminal of overshooting shape is connected with terminal electrode 13b.Then, form resin mold (not shown), produce the light-emitting diode (LED) module of Fig. 5 according to the mode that covers light-emitting diode 20.In addition, among Fig. 5, represented to have carried out conductive adhesive 22 and terminal electrode 13a and all electric example of setting discretely of 13b on the heat conduction body 15 after paster is installed, but the conductive adhesive 22 on the heat conduction body 15 can be set to also: the terminal electrode that becomes earth terminal one side with either party among terminal electrode 13a and the 13b is electrically connected.
As shown in Figure 5, the light-emitting diode (LED) module of present embodiment, the non-formation part 18 that does not form variable resistance part 10 and glass-ceramic layer 14 on ceramic substrate 12 is a recess, flip-chip is equipped with light-emitting diode 20.Therefore, light-emitting diode 20 can not given prominence to largely, can realize the slimming of module.And, different with the terminal conjunction method that has utilized metal wire, can not produce the shade of metal wire, there is not luminance nonuniformity, can realize the light-emitting diode (LED) module that luminous efficiency is higher.
And, in order to compare, utilize the static reply parts of above-mentioned comparative example with present embodiment, made the light-emitting diode (LED) module of comparative example in the following order.Fig. 9 is the cutaway view of the light-emitting diode (LED) module of comparative example.Among Fig. 9, at first, by conductive adhesive light-emitting diode 20 pasters of blueness are carried on the glass-ceramic layer 14 of static reply parts of comparative example.Then, by terminal conjunction method, be connected with terminal electrode 13a with the terminal of metal wire 21 with light-emitting diode 20.Then, be connected with terminal electrode 13b with metal wire 21 another terminal light-emitting diode 20.Then, form resin mold (not shown) according to the mode that covers light-emitting diode 20.As shown in Figure 9, in the light-emitting diode (LED) module of comparative example, light-emitting diode 20 is outstanding largely, compares with the light-emitting diode (LED) module of present embodiment, is difficult to realize the slimming of module.
And,, as follows thermal diffusivity is estimated at the light-emitting diode (LED) module of light-emitting diode (LED) module in these present embodiments and comparative example.For each light-emitting diode (LED) module, the light-emitting diode (LED) module of present embodiment is installed on the heating panel 30 as shown in Figure 10, be installed to as shown in Figure 11 on the heating panel 30 at comparative example.In addition, though not shown, on the surface of heating panel 30, to except that the part of ground connection side, carrying out insulation processing, the wiring of laying supply capability at least in outer electrode 16a and the part that 16b is contacted.
Then, each blue light-emitting diode 20 is applied the power of 1W, make led lighting, sustainable supply power reaches capacity until the temperature of light-emitting diode 20.Temperature about light-emitting diode 20 at this moment is about 100 ℃ in the light-emitting diode (LED) module of comparative example, with respect to this, be about 80 ℃ in the light-emitting diode (LED) module of present embodiment.
As mentioned above, the light-emitting diode (LED) module of judging present embodiment 1 is compared the thermal diffusivity excellence with the light-emitting diode (LED) module of comparative example.
And separately luminous intensity when the temperature of having measured blue LED 20 reaches capacity is 100 o'clock at the light strength ratio of the light-emitting diode (LED) module of establishing comparative example, and the light strength ratio of the light-emitting diode (LED) module in the present embodiment is about 125.Judge according to this result: because therefore the light-emitting diode (LED) module thermal diffusivity excellence of present embodiment, can prevent that the luminous efficiency of light-emitting diode from reducing.
And, in the comparative example of the terminal conjunction method that has utilized metal wire 21, produce the shade of metal wire 21, but can not produce the shade of metal wire in the light-emitting diode (LED) module of present embodiment, therefore obtained uniform luminous.
And, in the static reply parts and light-emitting diode (LED) module of present embodiment, outer electrode 16a and 16b are arranged on the face of the opposite side of the formation face with terminal electrode 13a and 13b of ceramic substrate 12, therefore, compare with light-emitting diode (LED) module with the static reply parts of comparative example, can reduce the area when installations such as circuit board.
Also have,, therefore, in the manufacture process, after element being blocked a sheet, need to add outer electrode 16a and 16b because the static of comparative example reply parts are arranged on the side with outer electrode 16a and 16n.Therefore, must carry out the installation of plating and the light-emitting diode 20 of outer electrode 16a and 16b by individual sheet.With respect to this, in the static of the present embodiment reply parts, internal electrode 11a and 11b, outer electrode 16a and 16b, terminal electrode 13a and 13b all can be formed by silk screen print method.Therefore, can before element being blocked a sheet, form outer electrode 16a and 16b.Therefore, can before blocking a sheet, carry out the plating of outer electrode 16a and 16b, can simplify manufacturing process and reduce cost.
And then, can also before blocking a sheet, carry electronic unit elements such as light-emitting diode is installed, then, block a sheet, make light-emitting diode (LED) module thus, therefore, the manufacturing process that can simplify light-emitting diode (LED) module reduces cost.
2. second execution mode
Below, the electronic unit and the light-emitting diode (LED) module of embodiments of the present invention 2 described.
Figure 12 is the stereoscopic figure of the static reply parts of present embodiment.Figure 13 is the cutaway view of 13-13 line of Figure 12 of the static reply parts of present embodiment.Figure 14 is the cutaway view of 14-14 line of Figure 12 of the static reply parts of present embodiment.Figure 15 is the signal exploded perspective view of the static reply parts of present embodiment.Figure 16 is the cutaway view of the light-emitting diode (LED) module of present embodiment.
As Figure 12, Figure 13, Figure 14 and shown in Figure 15, the static of present embodiment reply parts and execution mode 1 are same, and variable resistance part 10 is alternately laminated and form by variable resistance layer 10a, 10b, 10c and internal electrode 11a, 11b.And, the static of present embodiment reply parts also have ceramic sintered bodies, and this ceramic sintered bodies comprises: ceramic substrate 12, on this ceramic substrate 12 except a part part the non-formation part 18 and the variable resistance part 10 that forms and then the glass-ceramic layer 14 of stacked formation on this variable resistance part 10.On the ceramic substrate 12 of this ceramic sintered bodies, the mode that is on the non-formation part 18 according to its part is provided with pair of terminal electrode 13a and 13b.At this ceramic sintered bodies, be provided with the pair of external electrodes 16a and the 16b that are connected with 13b with internal electrode 11a and 11b, terminal electrode 13a.In the present embodiment, outer electrode 16a and 16b are arranged on the side of ceramic sintered bodies.
And, in the non-formation part 18 of the ceramic substrate 12 of ceramic sintered bodies, be provided with and connect heat conduction body 15 up and down, and then, below ceramic sintered bodies, be provided with the outside heat conduction body 17 that is connected with heat conduction body 15.Internal electrode 11a and terminal electrode 13a are electrically connected with outer electrode 16a by being drawn out to single-ended of ceramic sintered bodies.Equally, internal electrode 11b and terminal electrode 13b are electrically connected with outer electrode 16b by being drawn out to another single-ended of ceramic sintered bodies.And when electronic unit element such as light-emitting diode was installed to the static of present embodiment reply component mounting, the heat conduction body 15 of the non-formation part 18 of the ceramic substrate 12 of ceramic sintered bodies became the lift-launch part of electronic unit element. Terminal electrode 13a and 13b become the part that is electrically connected with the electronic unit element.
In addition, as shown in figure 16, in the light-emitting diode (LED) module of present embodiment, on the heat conduction body 15 of the non-formation part 18 of the ceramic substrate 12 of the static of present embodiment reply parts, carry by conductive adhesive 22 and to be connected with light-emitting diode 20.The projection terminal of one side's of light-emitting diode 20 overshooting shape is electrically connected with terminal electrode 13a, and the projection terminal of the opposing party's overshooting shape is electrically connected with terminal electrode 13b, carries out flip-chip thus and installs.
And the circuit of the light-emitting diode (LED) module of present embodiment and execution mode 1 become equivalent electric circuit shown in Figure 6 equally.
As mentioned above, in the static reply parts of present embodiment, be laminated in variable resistance part 10 and glass-ceramic layer 14 on the part except the non-formation part 18 of a part and carry out sintering on the ceramic substrate 12 and non-formation part 18 places ceramic sintered bodies after integrated, on the ceramic substrate 12, be formed with the heat conduction body 15 that connects this ceramic sintered bodies.
And in the light-emitting diode (LED) module of present embodiment, the heat conduction body 15 in the non-formation part 18 of the ceramic substrate 12 of ceramic sintered bodies is equipped with light-emitting diode 20.
Therefore, be the big part of thermal conductivity by making heat conduction body 15, thereby the heat that can send the parts that carried dispels the heat effectively.
And, the outstanding outside heat conduction body 17 that is connected with heat conduction body 15 by setting below ceramic sintered bodies, can improve carry the connecting airtight property of connecting portion when being connected to outside heating panel etc., the heat that can more effectively send the parts that carried dispels the heat.
And then, because being recess, the non-formation part 18 that does not form variable resistance part 10 and glass-ceramic layer 14 on ceramic substrate 12 carries light-emitting diode 20, therefore, can realize the slimming of light-emitting diode (LED) module.
Because terminal electrode 13a and 13b are formed on the ceramic substrate 12 according to the mode that its part is on the non-formation part 18, therefore, the lift-launch face of the terminal electrode 13a that is electrically connected with light-emitting diode 20 and the face of 13b and light-emitting diode 20 is roughly the plane, can realize that the flip-chip of light-emitting diode 20 is installed.
It is different with the terminal conjunction method that has utilized metal wire that light-emitting diode 20 is carried out the flip-chip installation, can not produce the shade of metal wire, do not have luminance nonuniformity, can realize the light-emitting diode (LED) module that luminous efficiency is higher.
Then, utilize Figure 15, the static of present embodiment is tackled member manufacturing method describe.
At first, making and prepare with zinc oxide is the ceramic powders of main component and the zinc oxide raw cook that is made of organic bond.And making and preparing with aluminium oxide and pyrex is the glass-ceramic powder of main component and the glass-ceramic raw cook that is made of organic bond.At this moment, the thickness of these raw cooks is about 30 μ m respectively.In addition, these raw cooks are after burning till, and the zinc oxide raw cook becomes variable resistance part 10, and the glass-ceramic raw cook becomes glass-ceramic layer 14.
As shown in figure 15, becoming on the zinc oxide raw cook of variable resistance layer 10a, utilizing silver paste to form the conductor layer that becomes internal electrode 11a by silk screen print method.Being laminated with on it becomes the zinc oxide of variable resistance layer 10b raw cook, utilizes silver paste to be formed with the conductor layer that becomes internal electrode 11b by silk screen print method on this zinc oxide raw cook.And then being laminated with thereon becomes the zinc oxide of variable resistance layer 10c raw cook, produces the duplexer that becomes variable resistance part 10 thus.And, the stacked thereon glass-ceramic raw cook that becomes glass-ceramic layer 14, thus produce the duplexer that becomes variable resistance part 10 and glass-ceramic layer 14.At this moment, the conductor layer that becomes internal electrode 11a and 11b as shown in figure 15, the part of the non-formation part 18 that forms after avoiding becoming and forming.
Then, punch with punch, be set to not form the through hole of diameter 0.6mm of the non-formation part 18 of variable resistance part 10 and glass-ceramic layer 14 according to the variable resistance part 10 that connects this duplexer and the mode of glass-ceramic layer 14.
On the other hand,, utilize the aluminum oxide substrate that is provided with through hole at assigned position, in the through hole of this aluminum oxide substrate, be filled with silver paste as ceramic substrate 12.And then, on a face of aluminum oxide substrate, utilize silver paste to form the conductor layer that becomes terminal electrode 13a and 13b by silk screen print method.And, on another face of ceramic substrate 12, utilize silver paste to form the conductor layer that becomes outside heat conduction body 17 by silk screen print method.The silver paste of filling in the above-mentioned through hole becomes heat conduction body 15 after burning till.
Then, formed on the aluminum oxide substrate of conductor layer, attached the duplexer that becomes variable resistance part 10 and glass-ceramic layer 14 that is provided with above-mentioned through hole, as the duplexer piece in above-mentioned through hole, filling silver paste.In addition, the thickness of above-mentioned aluminum oxide substrate is about 180 μ m, and the thickness of conductor layer is about 2.5 μ m.The content of the silver of the silver paste that uses in the heat conduction body is 85wt%, and the diameter of heat conduction body is 300 microns.And, becoming shape shown in Figure 15 in order to make after blocking, the pattern of the conductor layer of printing is made as to be arranged a plurality of illustrated shape and pattern form that form in length and breadth.
Then, above-mentioned duplexer piece heated in atmosphere carried out in atmosphere, being heated to 930 ℃ and burning till after the unsticking mixture handles, form incorporate sintered body.The sintered body of this duplexer piece is blocked separation with the size of regulation, as the duplexer of individual sheet.And then the end face coating silver paste to this sintered body heats with 900 ℃ in atmosphere, forms outer electrode 16a and 16b.Then, the part of electrode 16a, 16b and terminal electrode 13a, 13b is externally implemented the plating of nickel, gold, obtains the static reply parts in Figure 12, Figure 13 and the present embodiment shown in Figure 14.
The about 2.0mm of static reply part length direction size of the present embodiment of producing, the about 1.25mm of Width size, the about 0.3mm of thickness direction size.And, the variable resistor voltage V between outer electrode 16a and the 16b
1mAVoltage when promptly flowing the electric current of 1mA is 27V.In addition, in the manufacture method of above-mentioned present embodiment, the method as forming heat conduction body 15 and outside heat conduction body 17 has illustrated and meanwhile burnt till the method that forms when variable resistance part 10 and glass-ceramic layer 14 are set on aluminum oxide substrate.But, also can adopt following order: at first, variable resistance part 10 is set on aluminum oxide substrate and glass-ceramic layer 14 is used as sintered body.Then, in through hole, fill the silver paste that becomes heat carrier portion 15, on a face of aluminum oxide substrate, become the conductor layer of the silver paste of outside heat conduction body 17, these layers are baked and banked up with earth.Then, form heat conduction body 15 and heat conduction body 17.
And the sintered body under this situation can be the sintered bodies of a plurality of pieces of arranging in length and breadth, also can be the sintered body of a sheet, but considers from the productivity ratio aspect preferably to carry out in the stage of the sintered body of piece.
In addition, identical in order to compare with the situation of execution mode 1 with present embodiment, made the static reply parts of Fig. 7 and comparative example shown in Figure 9.The difference of the static reply parts of comparative example and the static reply parts in the present embodiment is: the non-formation part 18 that does not form variable resistance part and glass-ceramic layer is not set on ceramic substrate 12; Be provided with terminal electrode 13a and 13b on the surface of glass-ceramic layer 14; Heat conduction body 15 and outside heat conduction body 17 are not set.
Then, utilize Figure 16, the manufacture method of the light-emitting diode (LED) module of present embodiment is described.
Static reply parts to above-mentioned present embodiment carry connection light-emitting diode 20 by so-called flip-chip installation method, are made into the light-emitting diode (LED) module of present embodiment shown in Figure 16.Particularly, by conductive adhesive 22, light-emitting diode 20 pasters of blueness that will have a projection terminal of overshooting shape carry on the heat conduction body 15 of non-formation part 18 of ceramic substrate 12 of the static reply parts be connected to present embodiment.Be connected with terminal electrode 13a by the projection terminal of conductive adhesive, the opposing party's of light-emitting diode 20 the projection terminal of overshooting shape is connected with terminal electrode 13b a side's of light-emitting diode 20 overshooting shape.Then, form resin mold (not shown), produce the light-emitting diode (LED) module of Figure 16 according to the mode that covers light-emitting diode 20.
In addition, among Figure 16, conductive adhesive 22 and terminal electrode 13a and all electric example of setting discretely of 13b on the heat conduction body 15 after paster is installed have been represented to have carried out.But the conductive adhesive 22 on the heat conduction body 15 also can be set to: the terminal electrode that becomes earth terminal one side with either party among terminal electrode 13a and the 13b is electrically connected.
As shown in figure 16, the light-emitting diode (LED) module of present embodiment, the non-formation part 18 that does not form variable resistance part 10 and glass-ceramic layer 14 on ceramic substrate 12 is a recess, flip-chip is equipped with light-emitting diode 20.Therefore, light-emitting diode can not given prominence to largely, can realize the slimming of module.
And, different with the terminal conjunction method that has utilized metal wire, can not produce the shade of metal wire, there is not luminance nonuniformity, can realize the light-emitting diode (LED) module that luminous efficiency is higher.
In addition,, utilize the static reply parts of above-mentioned comparative example, made the light-emitting diode (LED) module of comparative example in the following order in order to compare.In Fig. 7～Fig. 9, at first, by conductive adhesive (not shown) light-emitting diode 20 pasters of blueness are carried on the glass-ceramic layer 14 of static reply parts of comparative example.Then, by terminal conjunction method, be connected with terminal electrode 13a with the terminal of metal wire 21 with light-emitting diode 20.Then, be connected with terminal electrode 13b with metal wire 21 another terminal light-emitting diode 20.Then, form resin mold (not shown) according to the mode that covers light-emitting diode 20.As shown in Figure 9, in the light-emitting diode (LED) module of comparative example, light-emitting diode is outstanding largely, compares with the light-emitting diode (LED) module of present embodiment shown in Figure 16, is difficult to realize the slimming of module.
At the light-emitting diode (LED) module of light-emitting diode (LED) module in these present embodiments and comparative example, as follows thermal diffusivity is estimated.Each light-emitting diode (LED) module (illustrated comparative example) as shown in Figure 17 be installed on the heating panel 30, each blue light-emitting diode is applied the power of 1W, make led lighting, sustainable supply power reaches capacity until the temperature of light-emitting diode.Temperature about light-emitting diode at this moment is about 100 ℃ in the light-emitting diode (LED) module of comparative example, with respect to this, be about 80 ℃ in the light-emitting diode (LED) module of present embodiment.As mentioned above, the light-emitting diode (LED) module of judging present embodiment is compared the thermal diffusivity excellence with the light-emitting diode (LED) module of comparative example.
And separately luminous intensity when the temperature of having measured blue light-emitting diode reaches capacity is 100 o'clock at the light strength ratio of the light-emitting diode (LED) module of establishing comparative example, and the light strength ratio of the light-emitting diode (LED) module in the present embodiment is about 125.Judge according to this result: because therefore the light-emitting diode (LED) module thermal diffusivity excellence of present embodiment, can prevent that the luminous efficiency of light-emitting diode from reducing.
And, in the comparative example of the terminal conjunction method that has utilized metal wire, produce the shade of metal wire, but can not produce the shade of metal wire in the light-emitting diode (LED) module of present embodiment, therefore obtained uniform luminous.
As mentioned above, static reply parts of the present invention can realize being built-in with the small-sized and high-intensity electronic unit of variable resistor function.
And, static reply parts of the present invention are when carrying electronic unit elements such as light-emitting diode is installed, the non-formation part that can not form variable resistance part and glass-ceramic layer on ceramic substrate is that recess carries the electronic unit element, therefore can realize the slimming of module.
Also have, static reply parts of the present invention are provided with the heat conduction body, can carry the electronic unit element in this part, and therefore, the heat that can send the parts that carried effectively dispels the heat.
In addition, electronic component module of the present invention is not influenced by electrostatic pulse by electronic unit elements such as variable resistance part protection light-emitting diodes, therefore anti-electrostatic pulse excellence.
And then electronic component module of the present invention can dispel the heat to the heat that the electronic unit element is sent effectively by the heat conduction body, so the thermal diffusivity excellence, and luminous efficiency is good.
And electronic component module of the present invention does not form variable resistance part and glass-ceramic layer on ceramic substrate non-formation part is that recess carries the electronic unit element, therefore can make the module slimming, can realize small-sized, slim and practical electronic component module.
Also have, electronic component module of the present invention is different with the terminal conjunction method that has utilized metal wire, can not produce the shade of metal wire, does not have luminance nonuniformity, can realize the electronic component module that luminous efficiency is higher.
And, electronic component module of the present invention if the substrate that adopts white such as aluminium oxide as ceramic substrate, then for example when light-emitting diode has been installed, owing to be the high white of reflectivity around the light-emitting diode, therefore, can further improve the luminous efficiency of light-emitting diode.
Claims (6)
1, a kind of electronic unit comprises:
Ceramic sintered bodies, it possesses ceramic substrate, replace stacked variable resistance layer and internal electrode and variable resistance part that forms and the glass-ceramic layer that forms on described variable resistance part on described ceramic substrate;
The pair of terminal electrode, it is arranged at described ceramic sintered bodies;
Pair of external electrodes, it is connected with described terminal electrode with described internal electrode; With
The heat conduction body, it connects described ceramic sintered bodies;
Described variable resistance part and described glass-ceramic layer all form on the non-part that forms outside the part of the part of described ceramic substrate,
Described terminal electrode is in the described non-mode that forms on the part according to its part and is formed on the described ceramic substrate,
Described heat conduction body is formed on the described non-formation part of described ceramic substrate.
2, electronic unit according to claim 1 is characterized in that,
Described outer electrode is formed on the face of the opposite side of the face with being formed with described terminal electrode on the described ceramic substrate.
3, electronic unit according to claim 1 is characterized in that,
On the face of the opposite side of the face with being formed with described terminal electrode of described ceramic sintered bodies, be provided with the outside heat conduction body that is connected with described heat conduction body.
4, a kind of electronic component module carries the electronic unit element at the described heat conduction body of the described electronic unit of claim 1, the described terminal electrode of the terminal of described electronic unit element and described electronic unit is electrically connected to fetch installs.
5, electronic component module according to claim 4 is characterized in that,
Described electronic unit element is installed by the chip upside-down mounting.
6, electronic component module according to claim 4 is characterized in that,
Described electronic unit element is a light-emitting diode.
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| JP2007-063197 | 2007-03-13 | ||
| JP2007063197A JP2008227137A (en) | 2007-03-13 | 2007-03-13 | Electrostatic countermeasure component and light-emitting diode module using the same |
| JP2007-107945 | 2007-04-17 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011041934A1 (en) * | 2009-10-06 | 2011-04-14 | 光宏精密股份有限公司 | Semiconductor carrier structure |
| CN104716115A (en) * | 2013-12-12 | 2015-06-17 | 恩智浦有限公司 | Sensor package and manufacturing method |
| CN112585744A (en) * | 2018-08-29 | 2021-03-30 | 京瓷株式会社 | Wiring substrate, electronic device, and electronic module |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5614315B2 (en) * | 2010-02-15 | 2014-10-29 | 株式会社村田製作所 | ESD protection device |
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2007
- 2007-03-13 JP JP2007063197A patent/JP2008227137A/en active Pending
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2008
- 2008-03-11 CN CNA2008100838776A patent/CN101266851A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011041934A1 (en) * | 2009-10-06 | 2011-04-14 | 光宏精密股份有限公司 | Semiconductor carrier structure |
| CN104716115A (en) * | 2013-12-12 | 2015-06-17 | 恩智浦有限公司 | Sensor package and manufacturing method |
| US10192842B2 (en) | 2013-12-12 | 2019-01-29 | Ams International Ag | Package for environmental parameter sensors and method for manufacturing a package for environmental parameter sensors |
| CN112585744A (en) * | 2018-08-29 | 2021-03-30 | 京瓷株式会社 | Wiring substrate, electronic device, and electronic module |
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| JP2008227137A (en) | 2008-09-25 |
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