JP2008227137A - Electrostatic countermeasure component and light-emitting diode module using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a small-sized, highly strong electrostatic countermeasure component having the excellent heat radiation property and a light-emitting diode module using the same. <P>SOLUTION: The electrostatic countermeasure component comprises a ceramic sintered compact having a ceramic substrate 12, a varistor part 10 formed thereon except for a part of a non-formation part 18 and a glass ceramic layer 14 formed further thereon, a pair of terminal electrodes 13a, 13b provided on the ceramic substrate 12 of the ceramic sintered compact with a part thereof exposed on the non-formation part 18, a pair of external electrodes 16a, 16b and a heat conductor part 15 provided through the upper and lower sides of the ceramic substrate 12. The light-emitting diode module comprises a light-emitting diode element mounted on the heat conductor part 15 in the non-formation part 18 of the electrostatic countermeasure component. Since the heat conductor part 15 is provided, the electrostatic countermeasure component and the light-emitting diode module radiate efficiently the heat emitted by the loaded parts. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an anti-static component used in various electronic devices and a light emitting diode module using the same.

  In recent years, electronic devices such as mobile phones have been rapidly reduced in size and power consumption, and accordingly, the withstand voltage of various electronic components constituting the circuit of the electronic device has been reduced.

  Therefore, troubles of electronic devices due to destruction of various electronic components, particularly semiconductor devices, due to electrostatic pulses generated when the conductive part of the human body and the electronic device contact each other are increasing.

  In addition, light-emitting diodes, which are a type of semiconductor device, are expected to be widely spread, such as being used for backlights for display devices and flashes for small cameras, with the development of white blue diodes. However, these white light emitting diodes are becoming problematic due to their low withstand voltage against electrostatic pulses.

  Conventionally, as countermeasures against static electricity pulses of such light emitting diodes, electrostatic pulses are bypassed to the ground by interposing electronic components having non-linear resistance characteristics such as varistors and Zener diodes between the static electricity line and the ground. In other words, a method of suppressing a high voltage applied to the light emitting diode has been performed.

For example, Patent Document 1 is known as prior art document information using a varistor or a Zener diode in order to protect the light emitting diode from electrostatic pulses.
JP 2002-335012 A

  However, in the configuration in which the conventional light emitting diode is combined with the varistor or Zener diode, the light emitting diode is connected to the varistor or Zener diode through another member such as a substrate and is not integrated, so the size is reduced. Is difficult.

  Further, in order to increase the light emission amount of the light emitting diode, it is necessary to flow a larger current. However, as the amount of current flowing increases, the light emitting diode itself generates heat. This heat deteriorates the light emitting diode, resulting in a decrease in light emission efficiency and a shortened life. Therefore, it is necessary to efficiently release the heat generated by the light emitting diodes in order to prevent deterioration of the life without reducing the light emitting efficiency of the light emitting diodes. However, a chip type chip having a relatively small package shape has no heat dissipation mechanism and uses a resin for the exterior, so it is difficult to efficiently release the heat generated by the light emitting diode element.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a small and high-strength antistatic component excellent in heat dissipation and a light emitting diode module using the same.

  To achieve the above object, the present invention includes a ceramic substrate, a varistor portion formed by alternately laminating varistor layers and internal electrodes on the ceramic substrate, and a glass ceramic layer formed on the varistor portion. A ceramic sintered body, a pair of terminal electrodes provided on the ceramic sintered body, a pair of external electrodes connected to the internal electrode and the terminal electrode, and a heat conductor portion penetrating the ceramic sintered body, The varistor part and the glass ceramic layer are formed excluding a part of the ceramic substrate that is not formed, and the terminal electrode is exposed to the part that is not formed. It was formed on the ceramic substrate, and the heat conductor portion was an antistatic component formed on the non-formed portion of the ceramic substrate.

  The present invention also provides a light emitting diode module in which a light emitting diode is mounted on the heat conductor portion of the above-mentioned antistatic component and the terminals of the light emitting diode and the terminal electrode of the antistatic component are electrically connected. did.

  According to the anti-static component of the present invention, a small and high-strength anti-static component with a built-in varistor function can be realized, and when an electronic component element such as a light emitting diode is mounted and mounted, the varistor portion on the ceramic substrate and Since the electronic component element can be mounted in the concave portion which is a non-formed portion where the glass ceramic layer is not formed, the module can be thinned. Further, since the heat conductor portion is provided and the electronic component element can be mounted on this portion, there is an effect that heat generated by the mounted component can be efficiently radiated.

  Furthermore, since the terminal electrode is formed on the ceramic substrate with a part thereof exposed to the non-formed part, the surface of the terminal electrode electrically connected to the electronic component element and the mounting surface of the electronic component element are almost the same. As a result, the electronic component element can be flip-chip mounted.

  Further, according to the light emitting diode module of the present invention, since the light emitting diode is protected from the electrostatic pulse by the varistor portion of the antistatic component, it has excellent anti-static pulse resistance, and further, the heat conductor efficiently generates the heat generated by the light emitting diode. Since the heat can be dissipated automatically, the heat dissipation is excellent, the light emission efficiency is good, and the light emitting diode is mounted in the concave portion on the ceramic substrate where the glass ceramic layer is not formed. It can be thinned, and a light-emitting diode module that is small, thin, and practical can be realized.

  Further, the flip-chip mounting of the light-emitting diode has the effect that, unlike the wire bonding method using the metal wire, the shadow of the metal wire does not occur, so there is no light emission unevenness, and a light-emitting diode module with higher light emission efficiency can be realized. .

  Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the drawings.

(Embodiment)
Hereinafter, the antistatic component and the light emitting diode module of the present invention will be described using an embodiment. 1 is an external perspective view of an antistatic component in one embodiment of the present invention, FIG. 2 is a cross-sectional view of the antistatic component in the embodiment of the present invention taken along line AA 'in FIG. 1, and FIG. 1 is a cross-sectional view taken along the line BB ′ of FIG. 1 of the antistatic component in one embodiment of the present invention, and FIG. 4 is a schematic exploded perspective view of the antistatic component in one embodiment of the present invention. FIG. 5 is a cross-sectional view of a light emitting diode module according to an embodiment of the present invention, and FIG. 6 is an equivalent circuit diagram of the light emitting diode module according to an embodiment of the present invention.

  1, FIG. 2, FIG. 3, FIG. 4, and FIG. Is a glass ceramic layer, 15 is a heat conductor portion, 16a and 16b are external electrodes, 17 is an external heat conductor portion, 18 is a varistor portion and a non-formed portion where the glass ceramic layer is not formed, and 20 is a light emitting diode element. is there.

  As shown in FIGS. 1, 2, 3, and 4, the antistatic component in the present embodiment is a varistor except for a ceramic substrate 12 and a part of the ceramic substrate 12 that is not formed. A ceramic sintered body comprising a varistor portion 10 formed by alternately laminating layers 10a, 10b and 10c and internal electrodes 11a and 11b, and a glass ceramic layer 14 formed by laminating the varistor portion 10; A pair of terminal electrodes 13a and 13b are provided on the ceramic substrate 12 of the ceramic sintered body so that a part of the ceramic substrate 12 is exposed to the non-formed portion 18 and connected to the internal electrodes 11a and 11b and the terminal electrodes 13a and 13b. The external electrodes 16a and 16b are provided, and a heat conductor portion 15 penetrating vertically is formed in the non-formed portion 18 of the ceramic substrate 12 of the ceramic sintered body. Only, it is provided with a external heat conducting portion 17 further connected to the heat conducting portion 15 on the lower surface of the ceramic sintered body. The internal electrode 11a and the terminal electrode 13a are electrically connected to the external electrode 16a by being drawn out to one end portion of the ceramic sintered body, and the internal electrode 11b and the terminal electrode 13b are drawn to the other end portion of the ceramic sintered body. In this configuration, the external electrode 16b is electrically connected. When an electronic component element such as a light emitting diode is mounted on and mounted on the antistatic component in the present embodiment, the heat conductor portion 15 of the non-formed portion 18 of the ceramic substrate 12 of the ceramic sintered body is the electronic component element. The terminal electrodes 13a and 13b serve as mounting portions, and serve as electrical connection portions with the electronic component elements.

  Further, as shown in FIG. 5, the light emitting diode module according to the present embodiment includes the light emitting diode element 20 on the heat conductor portion 15 of the non-formed portion 18 of the ceramic substrate 12 of the antistatic component according to the present embodiment. It is configured such that one bump-shaped bump terminal is electrically connected to the terminal electrode 13a, and the other bump-shaped bump terminal is electrically connected to the terminal electrode 13b and flip-chip mounted.

  And the circuit of the light emitting diode module in this Embodiment becomes an equivalent circuit shown in FIG. In FIG. 6, 201 is a varistor formed by internal electrodes 11a and 11b and a varistor layer 10b, 202 and 203 are external electrodes, and 204 is a light emitting diode.

  As described above, the antistatic component in the present embodiment is formed by laminating the varistor portion 10 and the glass ceramic layer 14 on the ceramic substrate 12 except for a part of the non-formed portion 18 and sintering and integrating them. The ceramic sintered body is provided with a heat conductor portion 15 penetrating the ceramic sintered body in the non-formed portion 18 of the ceramic substrate 12, and the light emitting diode module in the present embodiment is made of a ceramic sintered body. The light-emitting diode element 20 is mounted on the heat conductor portion 15 of the non-formed portion 18 of the ceramic substrate 12, and the mounted component can be obtained by providing the heat conductor portion 15 and increasing the heat conductivity. An anti-static component and a light-emitting diode module that can efficiently dissipate the generated heat. Further, by providing a protruding external heat conductor portion 17 connected to the heat conductor portion 15 on the lower surface of the ceramic sintered body, it is possible to improve the adhesion of the connection portion when mounted and connected to an external heat sink or the like. The heat generated by the mounted components can be radiated more efficiently.

  Furthermore, since the light emitting diode element 20 is mounted in the concave portion which is the non-formed portion 18 where the varistor portion 10 and the glass ceramic layer 14 are not formed on the ceramic substrate 12, the light emitting diode module can be reduced in thickness. Since the terminal electrodes 13a and 13b are formed on the ceramic substrate 12 with a part thereof exposed to the non-formed portion 18, the surface of the terminal electrode electrically connected to the light emitting diode element 20 and the light emitting diode element The light-emitting diode element 20 can be flip-chip mounted, and the light-emitting diode element 20 flip-chip mounted has a shadow of the metal wire unlike the wire bonding method using the metal wire. Since it does not occur, there is no uneven light emission, and a light emitting diode module with higher light emission efficiency can be realized.

  Then, the manufacturing method of the antistatic component in one embodiment of this invention is demonstrated using FIG.

  First, a zinc oxide raw sheet made of a ceramic powder mainly composed of zinc oxide and an organic binder was prepared and prepared. Moreover, the glass-ceramic raw sheet which consists of a glass-ceramic powder which has an alumina and a borosilicate glass as a main component, and an organic binder was produced and prepared. At this time, the thickness of each raw sheet was about 30 μm. Each of these green sheets is fired, the zinc oxide green sheet becomes the varistor part 10, and the glass-ceramic green sheet becomes the glass ceramic layer 14.

  As shown in FIG. 4, on the zinc oxide raw sheet used as the varistor layer 10a, the conductor layer used as the internal electrode 11a was formed by the screen printing method using the silver paste. A zinc oxide raw sheet to be a varistor layer 10b in which a conductor layer to be the internal electrode 11b was formed by screen printing using silver paste was laminated thereon. Furthermore, a zinc oxide raw sheet to be the varistor layer 10c was laminated thereon to produce a laminate to be the varistor part 10. Further, a glass-ceramic raw sheet to be the glass ceramic layer 14 was laminated thereon, and a laminate to be the varistor part 10 and the glass ceramic layer 14 was produced. At this time, as shown in FIG. 4, the conductor layer to be the internal electrodes 11a and 11b was formed so as to avoid the portion to be the non-formed portion 18 to be formed later.

  Next, a puncher was punched out so as to penetrate the varistor part 10 and the glass ceramic layer 14 of this laminated body, and a through hole having a diameter of 0.6 mm was provided as a non-formed part 18 where the varistor part and the glass ceramic layer were not formed.

  On the other hand, an alumina substrate having through holes at predetermined positions is used as the ceramic substrate 12, a silver paste is filled into the through holes of the alumina substrate, and a silver paste is used on one surface of the alumina substrate to perform screen printing. Then, a conductor layer to be the terminal electrodes 13a and 13b was formed, and a conductor layer to be the external heat conductor portion 17 was formed on the other surface by a screen printing method using silver paste. The silver paste filled in the above through holes becomes the thermal conductor portion 15 after firing.

  Next, a laminated body to be the varistor part 10 and the glass ceramic layer 14 provided with the above through holes is pasted on an alumina substrate in which a silver paste is filled into the above through holes to form a conductor layer, and a laminated body block and did. The thickness of the alumina substrate is about 180 μm, the thickness of the conductor layer is about 2.5 μm, the silver content of the silver paste used for the heat conductor is 85 wt%, and the diameter of the heat conductor is 300 microns. It was. Further, the printed pattern of the conductor layer was a pattern shape in which a large number of the illustrated shapes were arranged vertically and horizontally so as to have the shape shown in FIG. 4 after cutting.

  Next, the laminate block was heated in the atmosphere to remove the binder, and then heated to 930 ° C. in the atmosphere and fired to obtain an integrated sintered body. The sintered body of the laminated body block was cut and separated with a predetermined dimension to obtain an individual laminated body. Further, a silver paste was applied to the end face of the sintered body and heated in the atmosphere at 900 ° C. to form the external electrodes 16a and 16b. Subsequently, the parts of the external electrode and the terminal electrode were plated with nickel and gold, and the antistatic component in the present embodiment shown in FIGS. 1, 2, and 3 was obtained.

  The produced antistatic component in the present embodiment had a longitudinal dimension of about 2.0 mm, a widthwise dimension of about 1.25 mm, and a thicknesswise dimension of about 0.3 mm. The varistor voltage V1mA between the external electrodes 16a and 16b, that is, the voltage when a current of 1 mA flows was 27V.

  In the manufacturing method according to the present embodiment, the thermal conductor portion 15 and the external thermal conductor portion 17 are formed when the varistor portion 10 and the glass ceramic layer 14 are provided on an alumina substrate. Although the method of forming by firing at the same time has been described, after forming a sintered body in which the varistor portion 10 and the glass ceramic layer 14 are provided on an alumina substrate, the through hole is filled with a silver paste that becomes the heat conductor portion 15. A conductor layer of silver paste that forms the external heat conductor portion 17 is formed on one surface of the alumina substrate, and these are baked to form the heat conductor portion 15 and the external heat conductor portion 17. Good. In addition, the sintered body in this case may be a block sintered body or a block sintered body arranged vertically and horizontally, but it is preferably performed at the stage of the block sintered body from the viewpoint of productivity.

  For comparison, a static electricity countermeasure component of a comparative example having a schematic exploded perspective view shown in FIG. 7 was produced. The antistatic component of the comparative example is different from the antistatic component in the present embodiment in that the terminal electrodes 13a and 13b are not provided on the ceramic substrate 12 without the varistor portion and the non-formed portion 18 where the glass ceramic layer is not formed. 14 on the surface, and the heat conductor portion 15 and the external heat conductor portion 17 are not provided.

  Next, the manufacturing method of the light emitting diode module in one embodiment of this invention is demonstrated using FIG.

  The light emitting diode module according to the present embodiment shown in FIG. 5 was manufactured by mounting and connecting the light emitting diode element 20 to the antistatic component in the present embodiment by a so-called flip chip mounting method. Specifically, the blue light-emitting diode element 20 having the projecting bump terminals is formed on the heat conductive portion 15 of the non-formed portion 18 of the ceramic substrate 12 of the antistatic component in the present embodiment with the conductive adhesive 22. Are connected by die bonding, and one protruding bump terminal of the blue light emitting diode element 20 and the terminal electrode 13a are connected by a conductive adhesive, and the other protruding bump terminal of the blue light emitting diode element 20 is connected. And the terminal electrode 13b were connected by a conductive adhesive, and then resin molded (not shown) so as to cover the blue light emitting diode element 20, thereby producing the light emitting diode module of FIG. FIG. 5 shows an example in which the conductive adhesive 22 on the die-bonded heat conductor 15 is electrically separated from both the terminal electrodes 13a and 13b. The conductive adhesive 22 may be provided so as to be electrically connected to one of the terminal electrodes 13a and 13b which is the ground terminal.

  As shown in FIG. 5, in the light emitting diode module according to the present embodiment, the light emitting diode element 20 is flip-chiped in a concave portion which is a non-formation portion 18 on which the varistor portion 10 and the glass ceramic layer 14 are not formed. Since it is mounted, the light emitting diode does not protrude greatly, and the module can be thinned. Further, unlike a wire bonding method using a metal wire, a shadow of the metal wire is not generated, so there is no unevenness in light emission, and a light emitting diode module with higher light emission efficiency can be realized.

  For comparison, after using the antistatic component of the above comparative example and mounting the blue light emitting diode element 25 on the glass ceramic layer 14 of the comparative antistatic component by die-bonding with a conductive adhesive. The one terminal of the blue light emitting diode element 25 and the terminal electrode 13a are connected by the metal wire 21 by the wire bonding method, and the other terminal of the blue light emitting diode element 25 and the terminal electrode 13b are connected by the metal wire 21. Then, a resin mold (not shown) was formed so as to cover the blue light emitting diode element 25, and a light emitting diode module of a comparative example was manufactured. A cross-sectional view of the light emitting diode module of the comparative example is shown in FIG. As shown in FIG. 8, in the light emitting diode module of the comparative example, the light emitting diode protrudes greatly, and it is difficult to reduce the thickness of the module as compared with the light emitting diode module in the present embodiment.

  And about these light emitting diode modules in this Embodiment and the light emitting diode module of a comparative example, heat dissipation was evaluated as follows. As shown in FIG. 9 (not shown for the comparative example), each light emitting diode module is mounted on the heat sink 30 and 1 W of power is applied to each blue light emitting diode element to cause the diode to emit light. The power was continuously applied until the temperature of the blue light emitting diode element was saturated. The temperature of the blue light emitting diode element at that time was about 100 ° C. in the case of the light emitting diode module of the comparative example, whereas it was about 80 ° C. in the case of the light emitting diode module in the present embodiment. As mentioned above, it turns out that the light emitting diode module in this Embodiment is excellent in heat dissipation compared with the light emitting diode module of a comparative example.

  Further, when the light intensity when the temperature of the blue light-emitting diode element was saturated was measured, when the light intensity ratio of the light-emitting diode module of the comparative example was 100, the light intensity of the light-emitting diode module in the present embodiment The ratio was about 125. From this result, it can be seen that the light emitting diode module in the present embodiment is excellent in heat dissipation, and thus the light emitting efficiency of the light emitting diode can be prevented from being lowered. Further, in the comparative example of the wire bonding method using the metal wire, the shadow of the metal wire was generated, but the light emitting diode module in this embodiment did not cause the shadow of the metal wire, and thus light emission without unevenness was obtained.

  As described above, the anti-static component of the present invention can realize a small and high-strength anti-static component with a built-in varistor function, and can be mounted on a ceramic substrate when an electronic component element such as a light-emitting diode is mounted and mounted. Since the electronic component element can be mounted on the varistor portion and the concave portion which is a non-formed portion where the glass ceramic layer is not formed, the module can be thinned. Further, since the heat conductor portion is provided and the electronic component element can be mounted on this portion, the heat generated by the mounted component can be efficiently radiated.

  Further, the light emitting diode module of the present invention is excellent in electrostatic pulse resistance since the light emitting diode is protected from electrostatic pulses in the varistor portion. Furthermore, heat generated by the light emitting diode can be efficiently radiated in the heat conductor part, so that heat dissipation is excellent and light emission efficiency is good. Also, the varistor part on the ceramic substrate and the glass ceramic layer are not formed. Since the light emitting diode is mounted in the concave portion, which is a part, the module can be thinned, and the light emitting diode module becomes small, thin and practical. Further, unlike the wire bonding method using a metal wire, the shadow of the metal wire does not occur, so there is no uneven light emission, and the light emitting diode module with higher light emission efficiency is obtained.

  In addition to this, when a white substrate such as alumina is used as the ceramic substrate, when the light emitting diode is mounted, since the periphery of the light emitting diode is white with high reflectance, the light emitting efficiency of the light emitting diode can be further increased.

  The anti-static component according to the present invention can realize a small and high-strength anti-static component with a built-in varistor function, and when an electronic component element such as a light-emitting diode is mounted and mounted, the module can be thinned. Since the heat generated by the mounted components can be efficiently dissipated, the light-emitting diode module using this component has excellent anti-static pulse resistance, excellent heat dissipation, and good luminous efficiency. It is particularly useful as a diode module.

1 is an external perspective view of an anti-static component according to an embodiment of the present invention. Sectional view taken along the line AA 'of the static electricity countermeasure component Sectional view at BB 'of the static electricity countermeasure component Schematic exploded perspective view of the static electricity countermeasure component Sectional drawing of the light emitting diode module in one embodiment of this invention Equivalent circuit diagram of the LED module Schematic exploded perspective view of static electricity countermeasure parts of comparative example Sectional view of a light emitting diode module of a comparative example Sectional drawing for demonstrating the method to evaluate the heat dissipation of a light emitting diode module

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Varistor part 10a, 10b, 10c Varistor layer 11a, 11b Internal electrode 12 Ceramic substrate 13a, 13b Terminal electrode 14 Glass ceramic layer 15 Thermal conductor part 16a, 16b External electrode 17 External thermal conductor part 18 Non-formation part 20, 25 Light emitting diode element 21 Metal wire 22 Conductive adhesive 30 Heat sink 201 Varistor 202, 203 External electrode 204 Light emitting diode

Claims (4)

A ceramic sintered body comprising a ceramic substrate, a varistor portion formed by alternately laminating varistor layers and internal electrodes on the ceramic substrate, and a glass ceramic layer formed on the varistor portion; and the ceramic sintered body A pair of terminal electrodes provided on the body, a pair of external electrodes connected to the internal electrode and the terminal electrode, and a heat conductor portion penetrating the ceramic sintered body, the varistor portion and the glass ceramic The layer is formed excluding a part of the ceramic substrate that is not formed, and the terminal electrode is formed on the ceramic substrate by exposing a part of the terminal electrode to the non-formed part. The heat conductor is an anti-static component formed on the non-formed portion of the ceramic substrate. The antistatic component according to claim 1, wherein an external heat conductor portion connected to the heat conductor portion is provided on a surface opposite to the terminal electrode of the ceramic sintered body. The light emitting diode module which mounted the light emitting diode in the heat conductor part of the antistatic component of Claim 1, and electrically connected the terminal of the said light emitting diode and the terminal electrode of the said antistatic component. The light emitting diode module according to claim 3, wherein the light emitting diode is flip-chip mounted.

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