CN107768366A - A kind of COB encapsulation for filling Thermal protection IC and its method for packing - Google Patents
A kind of COB encapsulation for filling Thermal protection IC and its method for packing Download PDFInfo
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- CN107768366A CN107768366A CN201711178602.6A CN201711178602A CN107768366A CN 107768366 A CN107768366 A CN 107768366A CN 201711178602 A CN201711178602 A CN 201711178602A CN 107768366 A CN107768366 A CN 107768366A
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- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000005538 encapsulation Methods 0.000 title claims abstract description 26
- 238000012856 packing Methods 0.000 title claims abstract description 11
- 239000000919 ceramic Substances 0.000 claims abstract description 109
- 239000000758 substrate Substances 0.000 claims abstract description 67
- 239000007788 liquid Substances 0.000 claims description 18
- 239000004020 conductor Substances 0.000 claims description 13
- 239000002002 slurry Substances 0.000 claims description 12
- 239000003292 glue Substances 0.000 claims description 10
- 241000218202 Coptis Species 0.000 claims description 9
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 9
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 238000005516 engineering process Methods 0.000 claims description 6
- 238000004528 spin coating Methods 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims description 4
- 238000007650 screen-printing Methods 0.000 claims description 4
- 238000003854 Surface Print Methods 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 230000008859 change Effects 0.000 abstract description 13
- 230000009467 reduction Effects 0.000 abstract description 7
- 230000033228 biological regulation Effects 0.000 abstract description 6
- 239000011799 hole material Substances 0.000 description 65
- 230000006870 function Effects 0.000 description 34
- 239000000499 gel Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 230000006698 induction Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910002114 biscuit porcelain Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The present invention relates to the improvement of LED encapsulation, more particularly to a kind of COB encapsulation for filling Thermal protection IC and its method for packing, the present invention to adopt the following technical scheme that：A kind of COB encapsulation for filling Thermal protection IC,Ltcc substrate,Thermal protection IC,Temperature sensor,LED chip,Ltcc substrate is laminated to connect and formed by more than two layers ceramic chips,Thermal protection IC,Temperature sensor is arranged in ltcc substrate,LED chip is fixed on ltcc substrate,An alternating floor ceramic chips between temperature sensor and LED chip,Thermal protection IC,Temperature sensor electrically connects,An alternating floor ceramic chips between temperature sensor and LED chip,When substrate temperature exceedes limiting temperature,Thermal protection IC is fed back information to by temperature sensor,Thermal protection IC carries out classification to output current and declines regulation and control,Both the temperature of reduction LED light source in time had been ensured,Too fast reduction output current is avoided to cause the perceptible brightness change of human eye again,Unconsciously reaching the purpose of overtemperature protection,Fundamentally solve the problems, such as that chip temperature is too high.
Description
Technical field
The present invention relates to LED encapsulation fields, more particularly to a kind of COB encapsulation for filling Thermal protection IC and its method for packing.
Background technology
Light emitting diode（Light emitting diode）As a kind of electroluminescent device, can directly convert electrical energy into
For luminous energy, there is the series of advantages such as green, the response time is short, cost is low, luminosity is high, service life length, praised
For the green illumination energy of 21 century.
With small spacing LED fast development, COB（Chip On Board）Encapsulation is more and more blue or green by LED industry
Look at.Encapsulated compared to traditional SMD, the LED light source of COB encapsulation is a kind of area source of integrated form encapsulation.COB is encapsulated LED
Chip is adhered in PCB substrate with conductive or non-conductive elargol, is then carried out wire bonding and is realized electrical connection, eliminates support
With the technique such as routing, without the technical barrier in face of Reflow Soldering, cost is not only reduced, also improves reliability.Existing COB
Encapsulation can be divided into big one or two of chip small more than ten chip, fully improve the uniformity of light distribution, but at the same time right
The requirement of radiating is also higher.
LED chip is used for the sub-fraction that luminous power only has input power, and being left most of electrical power can be converted into
Heat energy.Only can not fundamentally solve the problems, such as that LED chip temperature is too high by external cooling.Band overheat protective function at present
LED encapsulation generally mount PCB copper foil circuit layers on metallic substrates, center be LED array, peripheral to install paster TEMP
Device, temperature sensor senses substrate temperature, when temperature exceedes limiting temperature, signal is passed into Thermal protection IC, so as to LED
Chip realizes power-off protection, reduces junction temperature.
The method for packing that above prior art uses, though temperature control purpose can be reached to a certain extent, due to TEMP
Certain distance between device and LED chip be present, and the low Protection glue of thermal conductivity therebetween be present, be unfavorable for sensor sensing temperature
The change of degree.And when substrate temperature is too high, power-off protection is taken to be unfavorable for the application of LED light source in daily life.
The content of the invention
It is an object of the invention to provide a kind of COB encapsulation for filling Thermal protection IC and its method for packing, by substrate
Middle landfill Thermal protection IC and temperature sensor, an alternating floor thickness is about 50um ceramic chips between temperature sensor and LED chip,
Can sensitive and promptly induction LED chip temperature change, when temperature exceedes limiting temperature, temperature sensor passes signal
Thermal protection IC is passed, classification is carried out to output current by Thermal protection IC and declines regulation and control, had both ensured to reduce the temperature of LED light source in time
Degree, avoid too fast reduction output current to cause the perceptible brightness change of human eye again, produce flickering, unconsciously reaching
The purpose of overtemperature protection, further extend LED life-span, reduce light decay, improve the reliability of light source.
To reach above-mentioned purpose, the present invention adopts the following technical scheme that：Including ltcc substrate, Thermal protection IC, TEMP
Device, LED chip, the ltcc substrate are laminated to connect and formed by more than two layers ceramic chips, and the Thermal protection IC, temperature sensor are set
In the ltcc substrate, the LED chip is fixed on ltcc substrate, between the temperature sensor and LED chip only every
One layer of ceramic chips, the Thermal protection IC electrically connect with LED chip and temperature sensor respectively.
Further, the ltcc substrate is printed with the electrical interconnection wire made of electrocondution slurry, and the LED chip is led to
Gold thread is crossed to electrically connect with the electrical interconnection wire on ltcc substrate surface.
Further, the ltcc substrate is provided with element and places through hole, conductive through hole, injects conduction material in conductive through hole
Material.
Preferably, the top layer ceramic chips thickness is 40-60um.
Further, the LED chip surface covering protection glue, phosphor gel.
Further, the ltcc substrate include set gradually from top to bottom top layer ceramic chips, the first function ceramic chips,
Second function ceramic chips, top layer ceramic chips set at least one first conductive through hole, place ceramics and set at least one second to lead
Electric through-hole and the element place through hole, the second function ceramic chips set at least one 3rd conductive through hole, and the element is placed
Through hole can house the Thermal protection IC and temperature sensor.
Further, the 3rd function ceramic chips are also included between the first function ceramic chips and the second function ceramic chips,
The 3rd function ceramic chips set at least four the 4th conductive through holes, two the 4th conductive through holes and Thermal protection IC both positive and negative polarities electricity
Connect and with the 3rd conductive through hole location matches, two other the 4th conductive through hole Thermal protection IC current output terminals, input
Electrically connect and with the second conductive through hole location matches.
Further, the above and below surface printing of the top layer ceramic chips has the electrical interconnection made of electrocondution slurry to lead
Line, Thermal protection IC, temperature sensor are placed on top layer ceramic chips lower surface, fixed using crystal-bonding adhesive, and electrical interconnection wire is successively
The power input for connecting the Thermal protection IC connects with power output end, the first conductive through hole, the second conductive through hole, and described
Two conductive through holes and the 3rd conductive through hole number is identical and location matches.
The present invention proposes a kind of method for packing, including：
Element places through hole and conductive through hole obtained by being punched using laser technology or mechanical punching techniques to ceramic chips
Step；
The step of conductive through hole of neighbouring two layers of ceramic chips is alignd；
The step of making ceramic chips firm pasting obtain Prefabricated substrate using mechanical axis pressure or liquid isostatic pressed；
The step of Thermal protection IC current output terminals, input are electrically connected by conductive path with electrical interconnection wire；
The step of Thermal protection IC both positive and negative polarities are electrically connected by conductive path with external power source；
Using silk-screen printing or mask print process, electrocondution slurry is printed on surface above and/or under top layer ceramic chips, to make
The step of electrical interconnection wire；
The step of insulating heat-conductive is filled into the element placement through hole of Prefabricated substrate and solidified；
The step of making Prefabricated substrate and top layer ceramic chips firm pasting obtain ltcc substrate using mechanical axis pressure or liquid isostatic pressed；
The step of LED chip both positive and negative polarity is interconnected by gold thread and electrical interconnection wire；
The step of Protection glue, phosphor gel are coated using the methods of spin coating, spraying or printing successively on LED chip surface；
Ltcc substrate installation peripheral optical element obtains filling the step of Thermal protection IC COB encapsulation.
Further, function ceramic chips firm pasting is made to obtain the step of Prefabricated substrate using mechanical axis pressure or liquid isostatic pressed
Suddenly include：
Thermal protection IC and temperature sensor are placed on top layer ceramic chips lower surface, fixed using crystal-bonding adhesive, by Thermal protection IC with
The step of temperature sensor electrically connects；
The step of conductive through hole filling conductive material forms conductive path；
The first function ceramic chips, the second function ceramic chips firm pasting are made to obtain prefabricated base using mechanical axis pressure or liquid isostatic pressed
The step of plate.
As an another embodiment, function ceramic chips firm pasting is set to obtain prefabricated base using mechanical axis pressure or liquid isostatic pressed
The step of plate, includes：
The conductive through hole both ends of first function ceramic chips, the 3rd function ceramic chips, the second function ceramic chips are alignd, filling is conductive
Material forms the step of conductive path；
The first function ceramic chips, the 3rd function ceramic chips, the second function ceramic chips are glued using mechanical axis pressure or liquid isostatic pressed
Paste firm step；
Thermal protection IC and temperature sensor are placed on into element to place in through hole, Thermal protection IC electrically connects with temperature sensor, its
Middle temperature sensor is located at the step of Thermal protection IC surrounding positions.
The advantage of the invention is that：1. using the packaged type of landfill method so that between temperature sensor and LED chip only
Across one layer of ceramic chips（The um of thickness about 50）, it is capable of the change of sensitive induction chip temperature, the temperature conduction of chip to substrate
In, temperature sensor can sensitive sensing substrate temperature, when substrate temperature exceedes limiting temperature, by temperature sensor by information
Thermal protection IC is fed back to, Thermal protection IC carries out classification to output current and declines regulation and control, has both ensured to reduce the temperature of LED light source in time
Degree, avoid too fast reduction output current to cause the perceptible brightness change of human eye again, unconsciously reaching overtemperature protection
Purpose, fundamentally solve the problems, such as that chip temperature is too high；
2.LTCC substrate mature preparation process, synchronously installs Thermal protection IC, temperature sensor and filling in its manufacturing process
Plain conductor, technology difficulty and production cost can be reduced.
Brief description of the drawings
Accompanying drawing 1 is the section of structure of embodiment 1；
Accompanying drawing 2 is embodiment 1LTCC substrate exploded views；
Accompanying drawing 3a, b are the Prefabricated substrate profile of embodiment 1, top view；
Accompanying drawing 4 is the element scheme of installation of embodiment 1；
Accompanying drawing 5 is that embodiment 1 is electrically connected schematic diagram；
Accompanying drawing 6a, b, c are embodiment 1LTCC substrates profile, upper surface of base plate, base lower surface；
Accompanying drawing 7 is embodiment 1LTCC upper surface of base plate printed circuit and LED chip arrangement schematic diagram；
Accompanying drawing 8 is that embodiment 1LED light sources COB encapsulates overall profile；
Accompanying drawing 9 is the ltcc substrate exploded view of embodiment 2；
Accompanying drawing 10a, b are upper surface, the lower surface of the top layer ceramic chips of embodiment 2；
Accompanying drawing 11 is the top layer ceramic chips lower surface element scheme of installation of embodiment 2；
Accompanying drawing 12 is the section of structure of embodiment 2.
1.LTCC substrates, 2. Thermal protection IC, 3. temperature sensors, 4. LED chips, 5. electrical interconnection wires, 6. protect
Protect glue, 7. phosphor gels, 8. conductive materials, 9. optical elements, 10. gold threads, 11. top layer ceramic chips, 12. first functions
Ceramic chips, 13. second function ceramic chips, 14. the 3rd function ceramic chips, 91. first conductive through holes, 92. second is conductive logical
Hole, 93. the 3rd conductive through holes, 94. elements place through hole, 95. the 4th conductive through holes, 121. insulating heat-conductive resins.
Embodiment
Embodiment 1：
A kind of landfill Thermal protection IC2 of the embodiment of the present invention 1 as shown in figures 1-8 COB encapsulation, including ltcc substrate 1, Thermal protection
IC2, temperature sensor 3, LED chip 4, the ltcc substrate 1 include the top layer ceramic chips 11, first set gradually from top to bottom
Function ceramic chips 12, the 3rd function ceramic chips 14, the second function ceramic chips 13, the above and below surface of the top layer ceramic chips 11
The electrical interconnection wire 5 made of electrocondution slurry is printed with, Thermal protection IC2, temperature sensor 3 are placed on top layer ceramic chips 11
Lower surface, fixed using crystal-bonding adhesive, electrical interconnection wire 5 be sequentially communicated the Thermal protection IC2 power input and power supply it is defeated
Go out end, the first conductive through hole 91 connects, the second conductive through hole 92, described second conductive through hole 92 and the 3rd, 93 numbers of conductive through hole
Thermal protection IC2, temperature sensor 3 are arranged in the ltcc substrate 1 described in identical and location matches, and the LED chip 4 is fixed
In on ltcc substrate 1, it is connected by gold thread 10 with the surface lines of ltcc substrate 1, the surface covering protection glue 6 of LED chip 4, fluorescence
Arogel 7, an alternating floor ceramic chips between the temperature sensor 3 and LED chip 4, the Thermal protection IC2 respectively with LED chip 4
Electrically connected with temperature sensor 3.
3rd function ceramic chips 14 set four the 4th conductive through holes 95, two the 4th conductive through hole 95 and Thermal protection IC2
Both positive and negative polarity is electrically connected and alignd with the 3rd conductive through hole 93, and two other the 4th conductive through hole 95 and Thermal protection IC2 electric currents are defeated
Go out end, input is electrically connected and alignd with the second conductive through hole 92.
The element places through hole 94 and conductive through hole can be by mechanical punching techniques or laser drilling in ceramic chips
On punched to obtain, the shape of through hole can be the one or more in circle, rectangle, annular etc., be beaten by laser technology
Hole may insure the through hole precision of ceramic chips, phenomena such as preventing through hole hole wall hanging uneven, back side residual slurry and plug-hole.
Temperature sensor 3 perceives the temperature of ltcc substrate 1, when the temperature of ltcc substrate 1 exceedes limiting temperature, just by signal
Thermal protection IC2 is passed to, the temperature sensor 3 can be SMD temperature sensor, magnetic temperature sensor or be screwed
One or more in temperature sensor etc.
Further, the ltcc substrate 1 is printed with the electrical interconnection wire 5 made of electrocondution slurry, electrical interconnection wire 5
Arrangement mode is adjusted with specific reference to the arrangement mode of LED chip 4, and the both positive and negative polarity of LED chip 4 passes through gold thread 10 and LTCC
The electrical interconnection wire 5 on the surface of substrate 1 electrically connects；The ltcc substrate 1 is provided with element and places through hole 94, conductive through hole, leads
Conductive material 8 is injected in electric through-hole；By injecting conductive material 8 in conductive through hole, as vertical logical between each ceramic chips
Road, the conductive material 8 are copper, aluminium, gold or alloying metal liquid.
Further, classification decline regulation and control can be carried out to output current by stating Thermal protection IC2, ensure to reduce LED core in time
While 4 temperature of piece, avoid too fast reduction output current to cause the perceptible brightness change of human eye again, unconsciously reaching
The purpose of overtemperature protection.
The Protection glue 6 is epoxy resin or silica gel, and the phosphor gel 7 is that silica gel and fluorescent material mix by a certain percentage
Obtained composite, the two is sequentially coated on chip by modes such as spraying, spin coating or depositions, is obtained away from the glimmering of coating
Light bisque.There is high index of refraction and high transmission rate as Protection glue 6 using epoxy resin or silica gel, the light that can increase LED leads to
Amount, viscosity is small, easy deaeration, is adapted to embedding and compression molding, LED is had preferable durability and reliability, can using this method
By by spraying, spin coating or deposition etc. it is simple in a manner of can be achieved with it is complicated remote away from paint-on technique identical fluorescent material with other
From the effect of coating, while LED is set to reach the light such as illuminance uniformity, high light-emitting efficiency, colour temperature control and color homogeneity control
Learn and require.
Preferably, the thickness of top layer ceramic chips 11 is 40-60um, preferably 50um, using the packaged type of landfill method, is made
Between temperature sensor 3 and LED chip 4 only across one layer of 50um ceramic chips, be capable of the change of the sensitive temperature of induction LED chip 4
Change, when temperature exceedes limiting temperature, signal is passed to Thermal protection IC2 by temperature sensor 3, by Thermal protection IC2 to output electricity
Stream carries out classification and declines regulation and control, had both ensured to reduce the temperature of LED light source in time, and had avoided too fast reduction output current to cause human eye again
Perceptible brightness change, is unconsciously reaching the purpose of overtemperature protection, is further extending LED life-span, reducing light decay,
Improve the reliability of light source.
Invention additionally discloses a kind of method for packing for the COB encapsulation for filling Thermal protection IC2, comprise the following steps：
Element places through hole 94 and conductive through hole obtained by being punched using laser technology or mechanical punching techniques to ceramic chips；
The conductive through hole of neighbouring two layers of ceramic chips is alignd, conductive through hole filling conductive material 8, such as copper, aluminium, gold or alloy gold
Belong to liquid, vertical conductive path is formed after its cooling, element places through hole 94 and is used to place Thermal protection IC2 and TEMP
Device 3, therefore conductive material 8 is not carried out to the through hole and filled.
First function ceramic chips 12, the 3rd function ceramic chips 14, the second function are made using mechanical axis pressure or liquid isostatic pressed
The firm pasting of ceramic chips 13 obtains Prefabricated substrate, and the element that Thermal protection IC2, temperature sensor 3 are placed on to Prefabricated substrate is placed
In through hole 94, wherein Thermal protection IC2 is located at element and places the center of through hole 94, and temperature sensor 3 is located at surrounding, protects IC and temperature
The position of degree sensor 3 can do corresponding transfer according to demand, and the number of temperature sensor 3 can be one or more, Thermal protection IC2
Both positive and negative polarity is electrically connected by conductive path with external power source, and the element that insulating heat-conductive resin 121 is filled into Prefabricated substrate is placed
Through hole 94 is simultaneously solidified, and top layer ceramic chips 11 is obtained with Prefabricated substrate firm pasting using mechanical axis pressure or liquid isostatic pressed
Ltcc substrate 1.
Using silk-screen printing or mask print process, electrocondution slurry is printed on the upper surface of ltcc substrate 1, to make electrically
Wire 5 is interconnected, wherein, the arrangement mode of electrical interconnection wire 5 is adjusted with specific reference to the arrangement mode of LED chip 4, finally
The both positive and negative polarity of LED chip 4 is electrically connected by gold thread 10 with electrical interconnection wire 5.
Protection glue 6, phosphor gel 7 are coated successively on the surface of LED chip 4 using the methods of spin coating, spraying or printing, finally
Peripheral optical element 9 is installed, completes a kind of COB encapsulation for filling Thermal protection IC2.
Embodiment 2：
The present embodiment is substantially the same manner as Example 1, and difference part is：As shown in figs9-12, the ltcc substrate 1 is included from upper
Top layer ceramic chips 11, the first function ceramic chips 12, the second function ceramic chips 13 set gradually under, top layer ceramic chips 11 are set
At least one first conductive through hole 91, place ceramics and set at least one second conductive through hole 92 and the element to place through hole
94th, the second function ceramic chips 13 set at least one 3rd conductive through hole 93, and Thermal protection IC2 and temperature sensor 3 are placed on
The lower surface of top layer ceramic chips 11, the element, which places through hole 94, can house the Thermal protection IC2 and temperature sensor 3.
The present embodiment in 11 upper and lower surface printing of top layer ceramic chips by having the electrical interconnection wire made of electrocondution slurry
5, wherein, the arrangement mode of the upper surface electrical interconnection wire 5 of top layer ceramic chips 11 enters with specific reference to the arrangement mode of LED chip 4
Row adjustment, is finally interconnected the both positive and negative polarity of LED chip 4 by gold thread 10 and electrical interconnection wire 5；The lower surface of top layer ceramic chips 11 electricity
The arrangement mode of gas interconnection wire 5 is adjusted with specific reference to Thermal protection IC2 position, and Thermal protection IC2, temperature sensor 3 are put
Put in the lower surface of top layer ceramic chips 11, fixed using crystal-bonding adhesive, interconnected Thermal protection IC2 and temperature sensor 3 by gold thread 10.
Because Thermal protection IC2 and temperature sensor 3 are placed on the lower surface of top layer ceramic chips 11, it is not necessary to set up the 3rd function
Ceramic chips 14, save production cost and production process；The heat that LED chip 4 is sent simultaneously passes along perpendicular to the direction of wall
Pass, the temperature sensor 3 installed in the lower surface of top layer ceramic chips 11 directly sensitiveer can sense LED by heat exchange pattern
The change of the temperature of chip 4, when temperature exceedes limiting temperature, signal is passed to Thermal protection IC2 by temperature sensor 3, is protected by heat
Shield IC2, which to output current be classified, declines regulation and control, had both ensured to reduce the temperature of LED light source in time, and had avoided too fast reduction defeated again
Going out electric current causes the perceptible brightness change of human eye, is unconsciously reaching the purpose of overtemperature protection, is further extending LED's
In the life-span, light decay is reduced, improve the reliability of light source.
The packaged type of the present embodiment is substantially the same manner as Example 1, and difference part is：
The step of making function ceramic chips firm pasting obtain Prefabricated substrate using mechanical axis pressure or liquid isostatic pressed, includes：
Electrocondution slurry is printed on to the above and below surface of top layer ceramic chips 11 using silk-screen printing or mask print process, to make
Make electrical interconnection wire 5；Thermal protection IC2 and temperature sensor 3 are placed on the lower surface of top layer ceramic chips 11, consolidated using crystal-bonding adhesive
It is fixed, Thermal protection IC2 is electrically connected with temperature sensor 3；Conductive through hole filling conductive material 8 forms conductive path；Using machinery
Axle is pressed or liquid isostatic pressed makes the first function ceramic chips 12, the firm pasting of the second function ceramic chips 13 obtain Prefabricated substrate.
Certainly, better embodiment of the present invention is these are only, the use range of the present invention is not limited with this, therefore, it is every
Equivalent change is made in the principle of the invention to should be included within the scope of the present invention.
Claims (10)
1. a kind of COB encapsulation for filling Thermal protection IC, including ltcc substrate（1）, Thermal protection IC（2）, temperature sensor（3）、LED
Chip（4）, it is characterised in that：The ltcc substrate（1）Laminate to connect by more than two layers ceramic chips and form, the Thermal protection IC（2）、
Temperature sensor（3）It is arranged on the ltcc substrate（1）In, the LED chip（4）It is fixed on ltcc substrate（1）On, the temperature
Spend sensor（3）With LED chip（4）Between an alternating floor ceramic chips, the Thermal protection IC（2）Respectively with LED chip（4）And temperature
Spend sensor（3）Electrical connection.
A kind of 2. COB encapsulation for filling Thermal protection IC according to claim 1, it is characterised in that：The ltcc substrate（1）
It is printed with the electrical interconnection wire made of electrocondution slurry（5）, the LED chip（4）With ltcc substrate（1）Surface it is electric mutually
Join wire（5）Electrical connection.
A kind of 3. COB encapsulation for filling Thermal protection IC according to claim 2, it is characterised in that：The ltcc substrate（1）
It is provided with element and places through hole (94), conductive through hole, injects conductive material in conductive through hole（8）.
4. encapsulated according to a kind of any described landfill Thermal protection IC of claim 1-3 COB, it is characterised in that：The LTCC
Substrate（1）Including the top layer ceramic chips set gradually from top to bottom（11）, the first function ceramic chips（12）, the second function ceramic chips
(13), top layer ceramic chips（11）At least one first conductive through hole (91) is set, places ceramics and at least one second conduction is set
Through hole (92) and the element place through hole (94), the second function ceramic chips (13) set at least one 3rd conductive through hole
(93), the element, which places through hole (94), can house the Thermal protection IC（2）And temperature sensor（3）.
5. encapsulated according to a kind of any described landfill Thermal protection IC of claim 4 COB, it is characterised in that：First work(
Can ceramic chips（12）And second also include the 3rd function ceramic chips (14), the 3rd function green between function ceramic chips (13)
Piece (14) sets at least four the 4th conductive through holes（95）, two the 4th conductive through holes（95）With Thermal protection IC（2）Both positive and negative polarity electricity
Connect and with the 3rd conductive through hole（93）Location matches, two other the 4th conductive through hole（95）Thermal protection IC（2）Electric current is defeated
Go out end, input electrical connection and with the second conductive through hole（92）Location matches.
A kind of 6. COB encapsulation for filling Thermal protection IC according to claim 4, it is characterised in that：The top layer ceramic chips
（11）Above and below surface printing have the electrical interconnection wire made of electrocondution slurry（5）, Thermal protection IC（2）, TEMP
Device（3）It is placed on top layer ceramic chips（11）Lower surface, fixed using crystal-bonding adhesive, electrical interconnection wire（5）It is sequentially communicated the heat
Protect IC（2）Power input and power output end, the first conductive through hole (91) connection, the second conductive through hole (92), it is described
Second conductive through hole (92) is identical with the 3rd conductive through hole (93) number and location matches.
A kind of 7. COB encapsulation for filling Thermal protection IC according to claim 4, it is characterised in that：The LED chip（4）
Surface covering protection glue（6）, phosphor gel（7）.
A kind of 8. method for packing for the COB encapsulation for filling Thermal protection IC, it is characterised in that：Comprise the following steps：
1. element places through hole (94) and conduction obtained by being punched using laser technology or mechanical punching techniques to ceramic chips
The step of through hole；
2. the step of conductive through hole of neighbouring two layers of ceramic chips is alignd；
3. the step of making function ceramic chips firm pasting obtain Prefabricated substrate using mechanical axis pressure or liquid isostatic pressed, includes:
Thermal protection IC（2）Current output terminal, input pass through conductive path and electrical interconnection wire（5）The step of electrical connection；
Thermal protection IC（2）The step of both positive and negative polarity is electrically connected by conductive path with external power source；
The step of insulating heat-conductive is filled into the element placement through hole (94) of Prefabricated substrate and solidified；
Using silk-screen printing or mask print process, electrocondution slurry is printed on top layer ceramic chips（11）Above and/or under surface, to
Make electrical interconnection wire（5）The step of；
Prefabricated substrate and top layer ceramic chips are made using mechanical axis pressure or liquid isostatic pressed（11）Firm pasting obtains ltcc substrate（1）
The step of；
4. LED chip（4）Both positive and negative polarity passes through gold thread（10）With electrical interconnection wire（5）The step of interconnection；
5. the methods of using spin coating, spraying or printing is in LED chip（4）Surface coats Protection glue successively（6）, phosphor gel（7）
The step of；
6. ltcc substrate（1）Peripheral optical element is installed（9）Obtain filling Thermal protection IC（2）COB encapsulation the step of.
A kind of 9. method for packing of COB encapsulation for filling Thermal protection IC according to claim 8, it is characterised in that：Using
The step of mechanical axis is pressed or liquid isostatic pressed makes function ceramic chips firm pasting obtain Prefabricated substrate includes：
By Thermal protection IC（2）And temperature sensor（3）It is placed on top layer ceramic chips（11）Lower surface, fixed using crystal-bonding adhesive, will
Thermal protection IC（2）With temperature sensor（3）The step of electrical connection；
Conductive through hole fills conductive material（8）The step of forming conductive path；
First function ceramic chips are made using mechanical axis pressure or liquid isostatic pressed（12）, second function ceramic chips (13) firm pasting
Step.
A kind of 10. method for packing of COB encapsulation for filling Thermal protection IC according to claim 8, it is characterised in that：Using
The step of mechanical axis is pressed or liquid isostatic pressed makes function ceramic chips firm pasting obtain Prefabricated substrate includes：
By the first function ceramic chips（12）, the 3rd function ceramic chips (14), the conductive through hole both ends of the second function ceramic chips (13)
Alignment, fill conductive material（8）The step of forming conductive path；
By Thermal protection IC（2）And temperature sensor（3）It is placed on element to place in through hole (94), Thermal protection IC（2）Passed with temperature
Sensor（3）Electrical connection, wherein temperature sensor（3）Positioned at Thermal protection IC（2）The step of surrounding position；
First function ceramic chips are made using mechanical axis pressure or liquid isostatic pressed（12）, the 3rd function ceramic chips (14), the second function
The step of ceramic chips (13) firm pasting.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711178602.6A CN107768366B (en) | 2017-11-23 | 2017-11-23 | COB (chip on board) package of buried thermal protection IC (integrated circuit) and packaging method thereof |
| PCT/CN2017/114920 WO2019100446A1 (en) | 2017-11-23 | 2017-12-07 | Cob packaging for embedding thermal protection ic and packaging method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711178602.6A CN107768366B (en) | 2017-11-23 | 2017-11-23 | COB (chip on board) package of buried thermal protection IC (integrated circuit) and packaging method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107768366A true CN107768366A (en) | 2018-03-06 |
| CN107768366B CN107768366B (en) | 2024-08-20 |
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ID=61278701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711178602.6A Active CN107768366B (en) | 2017-11-23 | 2017-11-23 | COB (chip on board) package of buried thermal protection IC (integrated circuit) and packaging method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107768366B (en) |
| WO (1) | WO2019100446A1 (en) |
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| CN110456574A (en) * | 2019-09-20 | 2019-11-15 | 青岛海信电器股份有限公司 | A kind of display device and backlight module |
| CN112416587A (en) * | 2020-11-20 | 2021-02-26 | 北京灵汐科技有限公司 | Temperature control method of on-chip structure and layout method of on-chip structure |
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Also Published As
| Publication number | Publication date |
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| CN107768366B (en) | 2024-08-20 |
| WO2019100446A1 (en) | 2019-05-31 |
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