KR101221492B1 - Led and led lighting having thermistor for temperature control and the manufacturing method - Google Patents

Abstract

PURPOSE: An LED with a built-in thermistor for controlling temperature and an LED lighting device, and a manufacturing method thereof are provided to accurately place thermistor patterns at a desired size in a nearest spot of a portion where a lighting LED chip is mounted, thereby accurately measure an actual heat radiating state caused by operating the LED chip. CONSTITUTION: A ceramic package is composed of an upper body(45) and a lower body(44). Thermistor patterns(43) are formed by screen-printing and printing, or sputtering. A negative electrode(41) of the ceramic package is charged with an alloy of gold or silver for radiating heat of an LED and constituting an electrical circuit with an external circuit. A positive electrode(42) of the ceramic package is charged with the alloy of gold or silver for radiating heat of the LED and constituting the electrical circuit with the external circuit. A silver paste(16) joins a diode to the ceramic package.

Description

LED and LED lighting having thermistor for temperature control and manufacturing method thereof {LED and LED lighting having thermistor for temperature control and the manufacturing method}

The present invention relates to LED and LED lighting applied to landscape lighting, street lamps, explosion-proof lamps and floodlights, and uses a high power large area lighting emitting diode (LED) as a thermistor The present invention relates to an LED or LED illuminator with a built-in temperature control thermistor which detects and injects a large current to prevent overheating even at a high temperature, and specifically, an aluminum oxide (Al ₂ O ₃ ). Screen printing of a thermistor material having a negative thermal coefficient (NTC) or a positive thermal coefficient (PTC) formed by mixing in a cream or gel form on a main ceramic green sheet ) And a method of printing on the ceramic substrate or the ceramic green sheet by lamination, and the electrode material inside the ceramic package. As a conductive material or a thermistor electrode, which fills a plurality of through holes for circuit construction in ceramics or ceramic green sheets, MoMn paste is used as the main component of molybdenum tendon. The present invention relates to a method for manufacturing LED or LED lighting and a related field device having a built-in thermistor-type high temperature co-fired ceramic (HTCC).

A package used for a general LED illuminator is a device configured to mount an LED chip therein and connect the chip and a lead frame to an external driving circuit. The basic process of the LED package is a chip bonding process in which a conductive epoxy paste or eutectic is injected to assemble the chip, and a lead frame constituting the package and an electrical passage for the chip It is divided into a wire bonding process for connecting wires, and a phosphor injection process for generating white light by receiving energy of blue light or ultraviolet light as excitation energy. Conventional LED packages protect the semiconductor chip from the external environment, electrically connect the package terminals to a printed circuit board (PCB) circuit board, and transfer heat generated from the chip to the outside. Unlike conventional silicon semiconductors, it is a device that uses light, and in addition to the functions listed above, a structural design is essential to increase light emission efficiency by extracting light emitted through the chip and the phosphor to the outside as much as possible. However, in recent years, due to the need for energy saving, luminaires using high-power LEDs have emerged instead of conventional luminaires. It is very important to secure heat dissipation characteristics, and in order to improve heat dissipation characteristics, a heat slug made of silver having excellent thermal conductivity or a body of a high power LED package for lighting is installed at a location where a chip inside the package is attached. A heat sink is attached to the heat sink for heat dissipation, or by installing a TEC (thermo electric cooler) outside the LED or lighting LED package to cool it. The method of minimizing resistance is used.

The LED or LED illuminator for lighting consumes most of the supplied power except for the combination of electrons and holes in the semiconductor. When the temperature of the LED pn junction rises due to such heat, it is converted into light by the combination of electrons and holes. The luminous efficiency is lowered, so that the temperature of the chip is further increased, so that the lifetime of the device is inversely reduced. Factors affecting the p-n junction of LEDs are driving current, heat transfer path, and external temperature. In the LED structure for lighting, there is a heat flow path between the pn junction that generates the high temperature and the heat dissipation part of the package, which is a relatively low temperature, and the heat resistance is the resistance that blocks the flow. Heat generated at the pn junction can be quickly transferred to the outside. However, in order to dissipate heat, it is necessary to accurately check the degree of heat generation and the state of the lighting LED element in advance, and since it is impossible to directly measure the temperature of the LED pn junction in the package state, most LED users are required The thermocouple wire is attached, but in consideration of the convenience of operation, it can simply measure the substrate temperature around the device, and based on this temperature, simply infer the temperature inside the package and operate the external cooling function. Therefore, it is only at the level of auxiliary control of the heat dissipation of the device.

In particular, in order to achieve high output power of LEDs for the purpose of lighting, the larger the area of the LED chip is required, the greater the stress due to the difference in thermal expansion coefficient between materials constituting the chip. This is a very important consideration that cannot be overlooked for high power LEDs for lighting. In addition, the greater the thermal expansion coefficient difference between the LED chip for lighting and the package material, the greater the stress, and has a significant adverse effect on the reliability of the device. Of course, this stress can also occur in the process of using the package of the LED for lighting, as well as the solder reflow process for attaching the LED element to the PCB board, the various thermal curing process accompanied by heat treatment, as described above Even during operation of a lighting LED to which a large current is injected, mechanical and thermal defects may occur at the junction due to heat generation, defects or fatigue of metal materials, and stress.

For this reason, in order to minimize the thermal effect, it is a reality that a thermocouple wire is attached to a thermocouple wire at an adjacent distance of a package to measure the heat generation of a lighting LED device.

In addition, as a step for the rapid market introduction of LED lighting recently, users of each lighting fixtures are required for data on the high temperature life of the LED device, and in order to accurately infer the life of the LED device for lighting, it is generally 85 ° C or higher. The actual long life test of at least 6,000 hours at high temperature predicts the mean time to failure (MTTF) of the device group. Currently, most methods measure only the temperature around the device by means of the thermocouple wire. It is also true that accurate life expectancy is not possible because it assumes the device temperature and infers its operating state at that temperature. However, in the case of a compound semiconductor device, considering that the lifetime of the device decreases by about 1/2 at every 10 ° C rise in the same light output condition, the life expectancy of the device through the reliability test is determined by the judgment. This is an important factor because it contains a lifetime prediction error of about tens of thousands of hours.

Therefore, a certification body that actually performs the life evaluation task or a user requesting a life evaluation requires a solution that can accurately measure the actual heat generation temperature of the device and predict the actual life of the device.

According to the present invention, a green sheet and thermistor forming a ceramic package and a conductive electrode for forming an internal circuit are laminated together by embedding a temperature-controlled ceramic thermistor in a package of a high-power LED or an LED illuminator for lighting. By simultaneously sintering and manufacturing a single ceramic package, the thermocouple wire is attached to the outside of the ceramic package to measure the external temperature of the ceramic package, and the ceramic package structure is simpler than the method of indirectly controlling the operating temperature of the lighting LED. In addition to direct and accurate temperature measurement during the operation of high power large area lighting LED devices, it is possible to immediately detect the light efficiency degradation caused by heat generation while driving the device and to support stable high temperature operation of the lighting LED devices. It is about.

The technical problem to be achieved by the present invention is simply to replace the conventional thermocouple method of measuring the ambient temperature of the device by attaching around the LED package device for lighting, in the present invention, a thermistor made of ceramic LED lighting for the ceramic It is related to the method of pre-integrating the inside of the package.In the process of LED operation, the ceramic thermistor, which is a temperature sensing sensor, can be built at the bottom of the recent distance to which the LED chip for lighting is attached while the ceramic package is manufactured. The temperature generated by the injection current can be measured more accurately.

To this end, in the present invention, a ceramic material having NTC or PTC thermistor characteristics is mixed in the form of a cream or a gel through a printing or screening technique on the ceramic green sheet constituting the ceramic package of the LED for lighting, and then it is placed on a desired position on the ceramic green sheet. It is formed in a pattern of a desired size, and at the same time by filling the molybdenum paste in the through hole of the ceramic green sheet, as well as the formation of the internal circuit conductive electrode of the ceramic package, as well as the thermistor electrode, the ceramic green sheet, By simultaneously sintering molybdenum paste and thermistor, a single ceramic sintering process can produce a ceramic package containing NTC or PTC thermistor, a temperature sensing sensor.

In the present invention, the composition ratio of aluminum oxide in the ceramic green sheet is about 50% by weight (wt%), and the thermal conductivity of the ceramic is 2-4 W / mk, and the existing low temperature co Instead of the sintering method, the composition ratio of aluminum oxide in the ceramic green sheet is more than about 90% by weight (wt%), and the thermal conductivity of the ceramic is 10W / The PTC thermistor used above mk and used as a sensor for temperature control according to the high temperature sintering temperature is mainly composed of barium titanate (BaTiO ₃ ) and in the case of NTC thermistor, barium bismuth oxide (BaBiO ₃ ) as a main component. Use a ceramic thermistor. In addition, the conductive paste for internal circuit and electrode composition is a method of manufacturing a high-power large area lighting LED ceramic package in which a thermistor is built by simultaneously sintering it at a high temperature of 1,200 ° C. or more using a molybdenum paste that can be sintered at a high temperature.

In addition, the through-hole is formed at the lower end of the LED chip inside the package to fill the molybdenum paste, thereby utilizing the heat dissipation passage of the through-hole filled with the molybdenum to generate heat generated by the driving of the LED for illumination. Was quickly released to the outside to diverge.

Therefore, the thermistor pattern can be accurately positioned at a desired size at the closest distance of the site where the lighting LED chip of the package equipped with the thermistor according to the present invention is mounted, thereby accurately measuring the heating state due to the actual driving of the LED chip. can do.

The structure of the LED package for lighting incorporating a thermistor according to the present invention forms a through hole to form an internal circuit on a ceramic green sheet made of aluminum oxide in a laminated or single layer manner, and each through hole is a green sheet. The use of molybdenum paste is used to fill or form the thermistor electrodes or conductive internal circuits through printing or screen printing on top of the thermistor, and barium titanate or barium bismuth oxide as the thermistor material. It is about manufacturing by the method of baking.

Preferably, in the manufacture of the ceramic package according to the present invention, the sintering temperature during sintering of the package is mainly based on the sintering temperature of aluminum oxide constituting the green sheet and thermistors and molybdenum tendon whose main components are barium titanate or barium bismuth oxide. The firing temperature of the conductive paste to have a similar sintering temperature of about 1,200 ~ 1,300 ℃.

More preferably, in consideration of a high-power LED for lighting that is directly assembled on a chip on board (COB) or a lighting LED device that is attached in various sizes to the inside of the package for the LED, considering the heating state according to the operating conditions of the device It has a laminated ceramic package structure, and through holes and electrodes and thermistor patterns according to the size of the thermistor are formed in the lower layer of the corresponding LED chip to detect the exact value of the temperature occurring inside the ceramic package. It is to be able to form a structure to make it.

In addition, the conductive paste for forming a circuit therein in the laminated package structure has excellent thermal conductivity (52 W / ˚mk) in consideration of the simultaneous sintering temperature of the sintering temperature of barium titanate or barium bismuth oxide and the ceramic package. For example, it is preferable to use a molybdenum type paste mainly composed of molybdenum (element symbol Mo: Molybdenum) and manganese (element symbol Mn: Manganese). However, the present invention is not necessarily limited thereto, and it is possible to perform ceramic metallizing (metallizing) in which the thermal conductivity is good and alloying of the ceramic and the metal is easy, and the metal can be calcined and heat treated at a temperature of about 1,000 to 1,300 ° C. Or the thing of the kind of electroconductive paste which consists of an alloy of silver is preferable.

The present invention provides a PTC or NTC thermistor with a linear change in resistance over a specific temperature range, and the thermistors in a gel or cream form in order to embed the PTC or NTC thermistor in a ceramic package. And a ceramic green sheet or ceramic substrate formed through screen printing, printing, or sputtering, wherein the ceramic green sheet is formed with a plurality of through holes, and generates heat generated by operating a high power large area lighting LED device. As a thermally conductive conductor paste containing molybdenum (SiO ₂ ) as a main component or an alloy of gold or silver as an additive to release to the outside or to metallize for interlayer bonding of ceramic and metal. The ceramic green sheet is stacked and one thermistor is formed therein. And a further circuit.

In constituting the multilayer circuit in the upper electrode, the lower electrode and the inside of the ceramic package or the ceramic green sheet, the main component of the zinc oxide varistor is molybdenum tendon, and 0.1-5 wt% of silicon and 0-5 wt% of gold or silver are added. The paste is used, and the conductive circuit structure inside the multilayer ceramic package is constructed by using the above paste whose main component is molybdenum tendon.

The PTC thermistor element used in the thermistor embedded in the ceramic substrate or the green sheet has a main component of barium titanate 97 to 100 (mol%), and other additives include bismuth lithium titanate (Bi _0.5). Li _0.5 TiO ₃ ) 0 to 3 mol%, niobium oxide (Nb ₂ O ₅ ) is 0 to 0.2 mol%, and at least one of them is mixed.

In the NTC thermistor device, its main component is barium bismuth oxide (BaBiO ₃ ), and when the bismuth (Bi) is replaced with antimony (Sb), the corresponding compositional formula is BaBi _1-x Sb _x O ₃ . In this case, the range is 0 <x <0.5.

The ceramic green sheets are stacked so that a thermistor constitutes one or more circuits therein.

The present invention provides a method for manufacturing a ceramic LED package for lighting that incorporates a temperature control thermistor, in order to embed a PTC or NTC thermistor having a linear change in resistance in a specific temperature range within the ceramic package. Is formed by screen printing, printing, or sputtering a ceramic green sheet or ceramic substrate printed with molybdenum or gold or silver in a mixture in the form of a gel or cream, and the ceramic green sheet is formed through a plurality of penetrations. Holes are formed and silicon (SiO ₂ ) is added as the main component of molybdenum to radiate heat generated by the operation of the high-power large-area lighting LED device to the outside, or to metallize the metal-to-layer coupling. Thermally Conductive Conductor Faces Containing Gold or Silver Alloys And filling the ceramic green sheet to form a thermistor with one or more circuits therein.

The present invention uses a paste in which 0.1 to 5 wt% of silicon and 0 to 5 wt% of gold or silver is added, and further comprises the step of configuring the conductive circuit inside the ceramic package using the paste mainly composed of molybdenum. It is configured to include.

The PTC thermistor element used in the thermistor embedded in the ceramic substrate or the green sheet has a main component of barium titanate 100 to 97 (mol%), and other additives include bismuth lithium titanate (Bi _0.5). Li _0.5 TiO ₃ ) 0 to 3 mol%, niobium oxide (Nb ₂ O ₅ ) is 0 to 0.2 mol%, and further comprising a step of mixing at least one of these.

In the NTC thermistor device, the main component is barium bismuth oxide (BaBiO ₃ ), and when the bismuth (Bi) is replaced with antimony (Sb), the corresponding compositional formula is BaBi _1-x Sb _x O ₃ . At this time, the method further includes a step in which the range is 0 <x <0.5.

In a single layer or laminated ceramic package made of aluminum oxide, molybdenum paste is used as the electrode material of the thermistor or the conductive circuit component inside the package, and the thermistor is burned by simultaneously firing at a temperature range of 1,000 to 1,300 ° C. And further comprising the Mr embedded inside the ceramic package.

The effect of the present invention is a representative example of the stable operation of the light emitting device at high temperature due to the accurate temperature measurement according to the driving of the high-power LED or LED illuminator, the effect is as follows.

First, since the thermocouple wire for measuring the heating temperature of the LED device for lighting or the LED illuminator is not attached to the outside of the package, it is troublesome to work with the external circuit for attaching the thermocouple wire or to check the contact state with the package. There is no, thereby simplifying the configuration of the temperature control function of the light emitting device.

Second, since it is a direct thermal measurement method by thermistor at the closest distance of LED device or LED illuminator, accurate heating temperature can be measured, and it is necessary for heat dissipation using SMT-surface mount technology at the same time as package configuration. Direct connection with an external temperature control circuit is simplified.

Third, since it is a direct thermal measurement method for the device, it is possible to drive a stable lighting LED device in connection with an external cooling circuit at high temperature with almost no measurement error, thereby improving the light efficiency.

Fourth, since the package configuration of the device that does not require a thermocouple wire is possible, the module can be miniaturized.

Fifth, it is possible to select PTC or NTC thermistor, which increases the convenience of temperature measurement and cooling drive circuit selection.

1 is a schematic diagram showing an example of temperature measurement of a LED package according to the prior art ((a) actual temperature measurement with a thermocouple wire (1A operation), (b) inside the LED package and the thermocouple wire position)
Figure 2 is an example of the structure of the LED package for lighting thermistor built-in according to the present invention.
3 and 4 are examples of a laminated structure package in which a molybdenum gun and a thermistor constituting an electrode metal or a conductive internal circuit are formed in the LED package according to the present invention.
5 is an example of a resistance-temperature (RT) characteristic curve of a PTC thermistor fabricated in a bulk state.
6 is an example of a resistance-temperature (RT) characteristic curve of an NTC thermistor fabricated in bulk.
Figure 7 is an example of the manufacturing process sequence of the LED or LED illuminator for lighting built-in thermistor produced by the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in this specification and claims should not be construed as limiting in their usual or dictionary meanings, and the inventors will appropriately define the concept of terms in order to best explain their invention in the best way possible. It should be interpreted as meaning and concept corresponding to the technical idea of the present invention based on the principle that it can. Therefore, the embodiments described in the specification and the drawings shown in the drawings are only one of the most preferred embodiments of the present invention, and do not represent all of the technical idea of the present invention, it is possible to replace them at the time of the present application It should be understood that there may be various equivalents and variations.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the drawings.

The present invention is a PTC or NTC thermistor showing a linear change in resistance over a specific temperature range, and the thermistors are mixed in a gel or cream form in order to embed the PTC or NTC thermistor inside a lighting LED package. And a large ceramic green sheet or ceramic substrate formed through screen printing, printing, or sputtering, wherein the ceramic green sheet has a plurality of through holes formed therein, and is generated by operating a high power large area lighting LED device. Thermally conductive conductor pastes containing molybdenum as the main component (SiO ₂ ) or gold or silver alloys as additives to release heat to the outside or to metallize for interlayer bonding of ceramics and metals ) And the thermistor inside the ceramic green sheet It includes one or more circuits.

Here, in forming a multilayer circuit in the upper electrode, the lower electrode and the inside of the ceramic package or ceramic green sheet, the main component of the zinc oxide varistor is molybdenum tendon, silicon is 0.1 to 5 wt%, gold or silver is 0 to PTC thermistor used in the thermistor embedded in the ceramic substrate or the green sheet using a paste added by 5wt% and using the paste mainly composed of molybdenum constituent in the conductive circuit structure inside the multilayer ceramic package The main element is barium titanate 100 to 97 (mol%), and other additives include bismuth lithium titanate (Bi _0.5 Li _0.5 TiO ₃ ) 0 to 3 mol% and niobium oxide (Nb ₂ O ₅ ) 0 to 0.2 mol%, and at least one of them is mixed.

In the NTC thermistor device, the main component is barium bismuth oxide (BaBiO ₃ ), and when the bismuth (Bi) is replaced with antimony (Sb), the corresponding compositional formula is BaBi _1-x Sb _x O ₃ . In this case, the ceramic green sheet may be stacked in a range of 0 <x <0.5, and a thermistor may form one or more circuits therein.

Specifically, Figure 2 is a preferred embodiment of the present invention, is an example of the structure of the LED package for lighting thermistor built-in, when cutting the package of a) based on A-A 'in Figure 2, Figure 2 The cross-sectional structure as shown in b) is shown. In the figures 41 is a negative electrode and 42 is a positive electrode. The electrodes 41 and 42 form a plurality of holes in the lower ceramic 44 to penetrate the lower ceramic. The role of the electrodes 41 and 42 is to transfer the heat generated by the operation of the circuit and the high power large-area LED device inside the ceramic package to the outside. To release or metallize the metal for the interlayer bonding of the ceramic and the metal, molybdenum is added as a main component of silicon (SiO ₂ ) or filled with a thermally conductive conductor paste containing an alloy of gold or silver. In the example of FIG. 2, only one layer of the ceramic package has one layer. However, if necessary, the thermistor is embedded in a plurality of ceramic green sheet layers as shown in FIG. 3 by using a method of printing a thermistor. It is also possible to configure a circuit required inside the ceramic package in the form of a multilayer ceramic. 2 and 3, 45 is an upper sheet of a mirror structure made of a ceramic that serves as a reflector for reflecting light emitted from the LED device to the outside.

Figure 3 shows a specific embodiment of a lighting LED or a package thereof produced by embedding thermistor according to the present invention. First, in FIG. 3, a) is a ceramic green sheet 51 mainly composed of aluminum oxide. As shown in b) of FIG. 3, a desired through-hole on the surface of the sheet is laser-punched or mechanically processed. Form. In this case, the hole to be formed may be arbitrarily selected in consideration of the size of the device to be configured in the ceramic package, the circuit configuration form, and the smoothness of heat dissipation. The hole formed ceramic green sheet forms the required pattern 53 using screen printing, printing, sputtering, or the like, and fills the molybdenum paste as shown in c) and f) of FIG. 3. Figure 1 shows an example of a ceramic green sheet filled with molybdenum paste by screen printing. The ceramic green sheet f) manufactured according to the desired shape and size of the conductive molybdenum paste is dried through the drying process.

Then, as shown in (g) of FIG. 4), a pattern of gel or cream in which barium titanate or barium bismuth oxide is mixed with a binder is formed on the ceramic green sheet in a desired size or shape using a screen printing technique. Form. The ceramic green sheet f) printed with the thermistor pattern of the desired size dries the printed thermistor through a drying process. The dried ceramic green sheet of the thermistor is stacked in the shape as shown in Figure 4 h) to form a desired package shape, by pressing the laminated ceramic green sheet to form a single elementized ceramic package sheet. Laminated ceramic green sheets can be controlled to be matched within the contact position of the molybdenum paste, which has been previously positioned to form a desired circuit, and a thermistor made of barium titanate or barium bismuth oxide is shown in FIG. Of course, it can be laminated in a multi-layered form inside the ceramic package. When the ceramic green sheet formed by the lamination method is sintered at a temperature of about 1,000 to 1,300 ° C. for about 2 hours, a ceramic package containing a thermistor having a temperature sensing function can be completed. The finished sintered ceramic sheet is a technique that draws a line on the surface of the ceramic sheet with a diamond tip with a sharp tip, such as a laser scribing or a diamond pen that cuts glass in order to separate into individual elements. An example is shown in which a scribe line or a V-notch is formed on the surface or the back of the ceramic sheet.

PTC thermistor element proposed in the present invention is the main component of barium titanate of 100 ~ 97 (mol%), and other additive components bismuth lithium titanate (Bi _0.5 Li _0.5 TiO ₃ ) 0 ~ 3mol %, Niobium oxide (Nb ₂ O ₅ ) is 0 to 0.2 mol%, characterized in that mixing at least one or more of these. In the NTC thermistor element, the main component is barium bismuth oxide, and when the bismuth (Bi) is replaced with antimony (Sb), the compositional formula is BaBi _1-x Sb _x O ₃ , where 0 < x <0.5.

5 and 6 are manufactured in the sense to assist in confirming the operating state of the PTC and NTC thermistors according to the present composition, measured and fabricated with a specimen to check the characteristics (temperature-resistance) of the resistance change with temperature will be. In this test specimen, a specimen of 2 mm thickness and a specimen diameter of 15 mm were prepared in order to confirm the performance of the thermistor in advance, and conductive silver paste was coated on both sides of the specimen for electrode formation. In this example, the size or shape of the present invention is different from the configuration of the present invention, and the characteristic value of the resistance change with respect to temperature may also be different, but the type shown in the characteristic curve of the device will be similar in proportion to the size of the device. do.

Hereinafter, a method for practicing the present invention will be described in detail with reference to the accompanying drawings.

Schematically, the thermistors are incorporated into a ceramic package in order to embed a positive thermal coefficient (PTC) or negative thermal coefficient (NTC) thermistor with a linear change in resistance over a specific temperature range. Formed by screen printing, printing, or sputtering on a ceramic green sheet or ceramic substrate printed with molybdenum, gold or silver alloy paste as a mixture in a gel or cream form In addition, as a conductive material or a thermistor electrode filling a plurality of through holes for constructing an electrode material in a ceramic package or a ceramic green sheet, MoMn paste is used as a main component. It is preferred to produce them by simultaneously sintering them at a high temperature.

In addition, the present invention uses a paste in which 0.1 to 5 wt% of silicon and 0 to 5 wt% of gold or silver is added. It is configured to include more.

In addition, the present invention for the PTC thermistor element used in the thermistor embedded in the ceramic substrate or the green sheet is the main component of the barium titanate 100 ~ 97 (mol%), and other additives as bismuth lithium titanium Nate (Bi _0.5 Li _0.5 TiO ₃ ) 0 to 3 mol%, niobium oxide (Nb ₂ O ₅ ) is 0 to 0.2 mol%, and may further comprise a step of mixing at least one of these. .

In the present invention, in the NTC thermistor device, the main component is barium bismuth oxide (BaBiO ₃ ), and when the bismuth (Bi) is replaced with antimony (Sb), the corresponding compositional formula is BaBi _1-x Sb _x O ₃ In this case, in the ceramic package of the single layer or laminated structure made of aluminum oxide, or further comprising the step of 0 <x <0.5, the electrode material of the thermistor or the conductive circuit assembly inside the package Using a molybdenum paste, the thermistor is preferably configured to further include the step of co-firing in the temperature range of 1,000 ~ 1,300 ℃ the thermistor embedded in the ceramic package.

Figure 7 is a manufacturing process of the LED and LED lighting package for a built-in thermistor manufactured by the present invention. To prepare a ceramic green sheet to be stacked as shown in Figure 7 (S70; Step70).

The quantity is composed of one or more according to the number of laminations, and it is the first inter-process inspection that is put into the process, and inspection of stains, foreign substances, discoloration, blemishes, scratches, tears, and sizes on the ceramic green sheet. (S71). In the process of forming a plurality of through holes on the ceramic green sheet, the holes are formed on the green sheet using hole formation or mechanical work by laser drilling (S72).

S73 is the second green sheet inspection process to remove and remove defective products caused by tearing or misalignment of the ceramic green sheet, adhesion of foreign matter, dust, and discoloration. .

S74 refers to a molybdenum dry paste or a gold or silver alloy paste used as a process material, and S75 denotes a corresponding process of printing or screen printing a paste of molybdenum dried or gold or silver alloy.

S76 is a green sheet inspection process that is performed after screen printing is finished, and checks for foreign substances in the printing process, dust adhesion, smearing of the printing pattern, filling of paste or poor printing.

S77 is a drying process for ceramic green sheet substrates printed with molybdenum or gold or silver alloy paste, and S78 is a fourth green sheet inspection process for discoloration or lifting of printed patterns, stains, foreign matter adhesion, and undrying. It is an inspection process which inspects a back. S79 is a mixture of ceramic thermistor powder mixed in the form of cream or gel, and the screen printing is performed on the ceramic green sheet printed with molybdenum, gold or silver alloy paste through the printing process of S80. The printed green sheet is inspected through the process of S81 again, such as S76, incorporation of foreign matter, dust adhesion, smearing of the printing pattern, unfinished zinc oxide pattern, or poor printing. S82 is a drying process of the ceramic green sheet substrate on which the thermistor pattern is printed. After this process is completed, these ceramic green sheets have a form capable of forming one ceramic package through the stack pressing process of S83. Laminated green sheet is produced as a ceramic package as a ratio through the sintering process of S84, the sintering temperature is sintered by maintaining about 2 hours in the temperature range of 1,000 ~ 1,300 ℃, the rate of temperature increase per hour Maintain at "200 ° C / hour". The sintered ceramic sheet is inspected for foreign matter, discoloration, lifting of the pattern, twisting or deformation of the ceramic sheet, cracks, bubbles, etc. through the inspection process of the sheet of S85. After the screening process, the S86 process is performed using high-power laser to form a scribing line or V-notch that can separate the ceramic sheet into a single device, and then S87. It is finally finished through the packaging process.

11: negative electrode of the package made of copper lead frame (lead frame)
12: positive electrode of a package made of a lead frame made of copper
13: semiconductor LED chip
14: Zener Diode
15: Package sealed with plastic or resin (epoxy or resin)
16: Conductive Silver (Ag) Paste Bonding Device to Package
17 phosphor
18: Internal Au wire for wiring to external circuit
19: thermocouple for measuring the temperature of the package
41: Negative electrode of ceramic package filled with molybdenum, gold or silver alloy for heat dissipation of lighting LED and electrical circuit configuration with external circuit
42: Positive electrode of ceramic package filled with molybdenum, gold or silver alloy for heat dissipation of lighting LED and electrical circuit configuration with external circuit
43: Thermistor pattern formed by techniques such as screen printing, printing or sputtering
44: lower body of the ceramic package
45: top of ceramic package filled with phosphor
50: ceramic green sheet
51: through hole for the internal circuit configuration of the ceramic package
52: negative electrode of ceramic green sheet coated and filled with molybdenum paste
53: Positive electrode of ceramic green sheet coated and filled with molybdenum paste
54: Molecular Magnesium Paste Filled in Holes for Heat Dissipation and Circuit Construction
55: molybdenum paste
56 blade for screen printing
57: patterned screen for printing
58: Thermistor mixture in cream or gel form
59: printed thermistor pattern
60: space for the illumination LED chip to be attached inside the ceramic package
61: Thermistor pattern formed inside the multilayer ceramic package
62: laminated ceramic
63: scribe line or V-notch inserted for separation into separate packages
64: thermistor electrode 1
65 thermistor electrode 2
66 positive electrode of ceramic package
67 negative electrode of ceramic package
70: ceramic green sheet substrate
71: first green sheet inspection process
72: through hole forming process
73: second green sheet inspection process
74: molybdenum, gold or silver alloy paste
75: Printing or screen printing process of molybdenum, gold or silver alloy paste
76: third green sheet inspection process
77: drying process of the ceramic green sheet substrate printed paste
78: fourth green sheet inspection process
79: Thermistor mixture in cream or gel form
80: Screen Printing Process of Cream or Gel Thermistor Mixture
81: fifth green sheet inspection process
82: Drying Process of Ceramic Green Sheet Substrate Printed with Thermistor Mixture
83: Pressurization Process of Ceramic Green Sheet Substrate
84: Sintering of Ceramic Green Sheet Substrate
85: Inspection Process of Sintered Ceramic Sheet
86: scribe line or V-notch formation of ceramic sheet and substrate using laser
87: Packing of Ceramic Sheets

Claims (10)

LED and LED illuminators applied to landscape lighting, street lights, explosion-proof lights and floodlights,
PTC or NTC thermistor whose resistance changes linearly over a specific temperature range;
In order to embed the PTC or NTC thermistor inside the LED lighting package, the thermistors are formed in a mixture in the form of gel or cream, and are formed through screen printing, printing, or sputtering. Sheet or ceramic substrates;
The ceramic green sheet has a plurality of through holes formed therein, and the molybdenum tendon is mainly used to dissipate heat generated when the high-power large-area lighting LED device is operated or to metallize the metal-to-layer coupling between the ceramic and the metal. Filled with a thermally conductive conductor paste containing silicon (SiO ₂ ) or an alloy of gold or silver, the ceramic green sheet is laminated, and a thermistor consists of one or more circuits therein. LED and LED lights with a built-in thermistor for temperature control. The method of claim 1,
In constructing a multilayer circuit in the upper electrode, the lower electrode and the inside of the ceramic package or the ceramic green sheet, 0.1-5 wt% of silicon, 0-5 wt% of gold or silver are added as the electrode of the zinc oxide varistor, and the remaining molybdenum ( LED and LED light with a built-in thermistor for temperature control, characterized in that using 100% by weight of paste containing MoMn). The method of claim 1,
The PTC thermistor element used in the thermistor embedded in the ceramic substrate or the green sheet is 0 to 3 mol% of bismuth lithium titanate (Bi _0.5 Li _0.5 TiO ₃ ) as an additive component and niobium oxide (Nb ₂ O ₅ ) Is 0 to 0.2 mol%, the remainder is made of barium titanate as its main component to make 100 (mol%), and the LED with a built-in thermistor for temperature control, characterized in that mixing at least one or more of the additives And LED lights. The method of claim 1,
In the NTC thermistor device, the main component is barium bismuth oxide (BaBiO ₃ ), and when the bismuth (Bi) is replaced with antimony (Sb), the corresponding compositional formula is BaBi _1-x Sb _x O ₃ . In the ceramic package having a single layer or laminated structure made of aluminum oxide or having a range of 0 <x <0.5, a molybdenum paste is used as an electrode material of the thermistor or a conductive circuit component inside the package. LED and LED lighting with a built-in temperature control thermistor, which is characterized in that the thermistor is embedded in the ceramic package by firing simultaneously in the temperature range of 1,000 ~ 1,300 ℃. delete In the method of manufacturing a ceramic LED package for lighting containing a thermistor for temperature control,
In order to embed PTC or NTC thermistors in the ceramic package with a linear change in resistance over a certain temperature range, the thermistors are molybdenum or gold or silver alloys in a mixture in the form of gels or creams. The ink is formed by screen printing, printing, or sputtering on a printed ceramic green sheet or ceramic substrate,
The ceramic green sheet has a plurality of through holes formed therein, and the molybdenum tendon is mainly used to dissipate heat generated when the high-power large-area lighting LED device is operated or to metallize the metal-to-layer coupling between the ceramic and the metal. Filled with a thermally conductive conductor paste containing silicon (SiO ₂ ) or an alloy of gold or silver, the ceramic green sheet is laminated, and a thermistor consists of one or more circuits therein. Method of manufacturing an LED and LED light containing a temperature control thermistor comprising a step. The method according to claim 6,
In constructing a multilayer circuit in the upper electrode, the lower electrode and the inside of the ceramic package or the ceramic green sheet, 0.1-5 wt% of silicon, 0-5 wt% of gold or silver are added as the electrode of the zinc oxide varistor, and the remaining molybdenum ( MoMn) is included to form a 100wt% paste;
Method of manufacturing an LED and a LED light containing a thermistor for temperature control, characterized in that further comprises a. The method according to claim 6,
The PTC thermistor element used in the thermistor embedded in the ceramic substrate or the green sheet is 0 to 3 mol% of bismuth lithium titanate (Bi _0.5 Li _0.5 TiO ₃ ) as an additive component and niobium oxide (Nb ₂ O ₅ ) Making 0 to 0.2 mol%, and making the remainder as barium titanate as its main component to make 100 (mol%), and mixing at least one or more of the additives;
Method of manufacturing an LED and a LED light containing a thermistor for temperature control, characterized in that further comprises a. The method according to claim 6,
In the NTC thermistor device, the main component is barium bismuth oxide (BaBiO ₃ ), and when the bismuth (Bi) is replaced with antimony (Sb), the corresponding compositional formula is BaBi _1-x Sb _x O ₃ . When 0 <x <0.5,
In a single layer or laminated ceramic package made of aluminum oxide, molybdenum paste is used as the electrode material of the thermistor or the conductive circuit component inside the package, and the thermistor is burned by simultaneously firing at a temperature range of 1,000 to 1,300 ° C. Mr. embedded in the ceramic package;
Method of manufacturing an LED and a LED light containing a thermistor for temperature control, characterized in that further comprises a. delete

Images