CN102376697A - High color rendering white light LED (Light Emitting Diode) module - Google Patents
High color rendering white light LED (Light Emitting Diode) module Download PDFInfo
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- CN102376697A CN102376697A CN2010102652868A CN201010265286A CN102376697A CN 102376697 A CN102376697 A CN 102376697A CN 2010102652868 A CN2010102652868 A CN 2010102652868A CN 201010265286 A CN201010265286 A CN 201010265286A CN 102376697 A CN102376697 A CN 102376697A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48095—Kinked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48111—Disposition the wire connector extending above another semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/4917—Crossed wires
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
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Abstract
The invention discloses a high color rendering white light LED (Light Emitting Diode) module which comprises a high heat conducting substrate and an LED chip, wherein the high heat conducting substrate comprises a metal substrate and a ceramic substrate; the LED chip comprises at least one of a red light LED chip and a blue light LED chip; the blue light LED chip is provided with a fluorescent powder layer; the LED chip is directly and fixedly connected to the high heat conducting substrate; a line layer is also arranged on the high heat conducting substrate; and when the high heat conducting substrate is the metal substrate, an insulating layer is arranged between the line layer and the metal substrate and the LED chips are electrically connected by the line layer. The invention has the benefits that the blue light LED chip is provided with the fluorescent layer; the blue light LED chip and the red light LED chip can be used for conveniently changing color temperature by adjusting relative current to obtain high color rendering while light; the LED chips are directly and fixedly connected to the metal substrate or the ceramic substrate; welding, silver paste die bonding and other process techniques can be adopted; and the whole packaging module has low heat resistance, simple structure and lower production cost.
Description
Technical field
The present invention relates to a kind of LED illuminating product, particularly a kind of white light LEDs module of high-color rendering.
Background technology
Along with the develop rapidly of LED technology and reaching its maturity of great power LED production technology, its low consumption, efficient, volume is little, in light weight and numerous advantages such as long-life, and it is widely used; The Development of Packaging Technology of great power LED has been accelerated great power LED greatly in lighting field and the application that shows the field, particularly shows the field; Such as projector equipment, not only more harsh to the heat dissipation problem requirement of led chip, also need the led chip module can produce the high white light that shows; To satisfy the needs of using, present low-thermal resistance high-power light-emitting diode module, complex manufacturing; Product structure is also complicated, needs insulating barrier, covers copper layer, electrode layer and external insulation layer, and the metal substrate center is provided with pit; Led chip is installed in the pit; Cause manufacturing procedure more, production cost is higher, and the insulating barrier below the copper-clad plate has also increased thermal resistance.The method that generates high whitening light in addition has two kinds: the one, and adopt multi-colored led chip colour mixture to produce white light; The advantage of this method is the white light that can obtain high colour developing, but shortcoming is the adjustment difficulty to colour temperature, because the parameter of every led chip there are differences; Cause production efficiency low; Unstable product quality, light efficiency is very low simultaneously, is difficult to accurately obtain the led chip module of satisfactory high whitening light.A kind of in addition method is to adopt multiple fluorescent material to mix the white light that obtains high colour developing; This method causes overall light efficiency very low because of the poor efficiency of rouge and powder; Under higher temperature, cause color rendering index to descend owing to the performance change of different fluorescent material is inconsistent; Colour temperature rises sharply on the contrary, is difficult to obtain practicality.
Summary of the invention
For addressing the above problem, the object of the present invention is to provide that a kind of production technology is simple, steady quality, high light efficiency, the satisfactory high-quality high whitening light led chip module of parameter.Its core is with the high efficiency bloom of single stable and red light chips synthesizing stable and the white light of the high color rendering index (CRI) of high light efficiency.
For achieving the above object, technical scheme of the present invention is: a kind of high apparent white light LEDs module, comprise high thermal conductive substrate and led chip, and said high thermal conductive substrate comprises metal substrate and ceramic substrate,
Said led chip comprises red LED chip and blue-light LED chip each at least one;
Said blue-light LED chip is provided with the layer of fluorescent powder layer;
Said led chip directly is fixedly connected on the said high thermal conductive substrate;
Also be provided with line layer on the said high thermal conductive substrate, when high thermal conductive substrate is metal substrate, be provided with insulating barrier between said line layer and the metal substrate, be electrically connected through said line layer between the said led chip.
Preferably, said phosphor powder layer is the yellow fluorescence bisque.
Preferably, said red LED chip and blue-light LED chip difference parallel/series; Or two kinds of led chip parallel/series together.
Preferably, said led chip also comprises at least one green light LED chip, and said red LED chip, blue-light LED chip and green light LED chip be parallel/series respectively; Or wherein two kinds of led chip parallel/series together, the independent parallel/series of a kind of in addition led chip; Or three kinds of equal parallel/series of led chip together.
Preferably, the LED module of said high whitening light also possibly be provided with protective cover, said protective cover comprise frame be located on the frame or with frame be holistic transparency window, said protective cover cover at said led chip above.
Preferably, the LED module of said high whitening light also is provided with device for monitoring temperature, and said device for monitoring temperature is connected with the electric power starting of the LED module of the said high whitening light of control or the electric control gear signal of telecommunication of closing.
Preferably, the LED module of said high whitening light also is provided with overtemperature protection system, and said overtemperature protection system is a thermistor, and said thermistor is series between said led chip and the power supply.
Preferably, said metal substrate comprises copper base, aluminium base and money base plate, and said ceramic substrate comprises aluminium oxide ceramic substrate and aluminium nitride ceramics substrate.
Preferably, said led chip also comprises White-light LED chip or yellow light LED chip.
Preferably, also be provided with the optical alignment hole of assist location on the said high thermal conductive substrate.
Adopt the beneficial effect of present technique scheme to be: blue-light LED chip is provided with phosphor powder layer and red LED chip together, through regulating relative electric current; Can change colour temperature very easily, and obtain the white light of high-color rendering, led chip directly is fixedly connected on metal substrate or the ceramic substrate; Can adopt processing technologys such as welding, the solid crystalline substance of silver slurry; The thermal resistance of whole encapsulation module is low, and is simple in structure, and production cost is lower.
Description of drawings
Fig. 1 is the cutaway view of a kind of high-power LED encapsulation module of the present invention embodiment 1;
Fig. 2 is the sketch map of a kind of high-power LED encapsulation module of the present invention embodiment 1;
Fig. 3 is the sketch map of a kind of high-power LED encapsulation module of the present invention embodiment 2;
Fig. 4 is the sketch map of a kind of high-power LED encapsulation module of the present invention embodiment 3;
Fig. 5 is the light intensity curve figure of prior art after by blue light and gold-tinted colour mixture;
Fig. 6 is that blue light of the present invention adds the gold-tinted of yellow fluorescence bisque generation and the light intensity curve figure after the ruddiness colour mixture;
Fig. 7 is the sketch map of a kind of high-power LED encapsulation module of the present invention embodiment 5;
Fig. 8 is the circuit connection diagram of a kind of high-power LED encapsulation module of the present invention embodiment 5;
Fig. 9 is the sketch map of a kind of high-power LED encapsulation module of the present invention embodiment 6;
Figure 10 is the circuit connection diagram of a kind of high-power LED encapsulation module of the present invention embodiment 6.
The numeral corresponding component title represented among the figure with letter:
11. metal substrate 12. ceramic substrate 2.LED chips 21. blue-light LED chips 22. red LED chips 23. green light LED chips 24. phosphor powder layers 3. line layer bars 41. frames 42. transparency windows 5. temperature sensors 6. insulating barriers 7. pins 8. optical alignment holes
Embodiment
Below in conjunction with accompanying drawing and embodiment the present invention is done further detailed explanation.
Embodiment 1,
As depicted in figs. 1 and 2; A kind of high apparent white light LEDs module comprises high thermal conductive substrate and led chip 2, and high thermal conductive substrate is a metal substrate 11; Led chip 2 comprises 21 5 of 22 4 of red LED chips and blue-light LED chips, and the arrangement mode of two kinds of color led chips 2 is as shown in Figure 2;
Blue-light LED chip 21 is provided with one deck yellow fluorescence bisque 24;
Two kinds of led chips 2 directly are fixedly connected on the metal substrate 11;
Also be provided with line layer bar 3 on the metal substrate 11; Be the line layer of strip, the anode that is provided with 6, two kinds of led chips 2 of insulating barrier between line layer bar 3 and the metal substrate 11 is connected on the line layer bar 3 jointly; Its negative electrode is connected on another line layer bar 3 jointly; Thereby two kinds of led chips 2 are connected in parallel, and on metal substrate, draw pair of pins 7, as the interface of control power supply.
Also be provided with the optical alignment hole 8 of assist location on the metal substrate 11, with installation and the adjustment that makes things convenient for module.
Present embodiment also is provided with protective cover and device for monitoring temperature, protective cover comprise frame 41 be located on the frame 41 or with frame be holistic transparency window 42, protective cover cover at said led chip above.Device for monitoring temperature is a temperature sensor 5, and temperature sensor 5 is connected with the electric power starting of the LED module of the high whitening light of control or the electric control gear signal of telecommunication of cutting out.
Present embodiment can be through the adjustment to yellow fluorescence bisque 24, and debugging easily obtains the consistent product of colour temperature, and cost is lower like this, and program is simpler, steady quality.
Fig. 5 is the light intensity curve figure of prior art after by blue light and gold-tinted colour mixture, and Fig. 6 is that blue light of the present invention adds gold-tinted that the yellow fluorescence bisque produces and the light intensity curve figure after the ruddiness colour mixture; Can know that through Fig. 5 and Fig. 6 contrast the light intensity of the high whitening light that the present invention produces will obviously be superior to prior art.
Embodiment 2,
As shown in Figure 3; All the other are identical with embodiment 1; Difference is that blue-light LED chip 21 is divided into independently two groups with red LED chip 22, and these two groups of led chips 2 are through four different line layer bars 3 parallel connection respectively of mutually insulated; And on metal substrate 11, draw two pairs of pins that correspond respectively to blue-light LED chip 21 chipsets and red LED chip 22 chipsets; Thereby electric control gear capable of using is controlled blue-light LED chip 21 chipsets and red LED chip 22 chipsets respectively, and the electric current of red LED chip 22 and blue-light LED chip 21 can independent regulation, thereby blends the white light of different color rendering indexs; Simultaneously, also can blend the warm white or the positive white light of the variable color temperature of high light efficiency.Can realize the more control expanded function.
As shown in Figure 4, all the other are identical with embodiment 2, and difference is; Red LED chip 22 is 1; Blue-light LED chip 21 is 7, and the arrangement of also setting up 23, three kinds of led chips of a green light LED chip is as shown in Figure 4; Red LED chip 22, blue-light LED chip 21 and green light LED chip 23 are divided into three groups of parallel connections respectively; And draw the pin 7 of three pairs of corresponding red LED chip 22 chipsets of difference, blue-light LED chip 21 chipsets and green light LED chip 23 chipsets, thereby electric control gear capable of using respectively blue-light LED chip 21 chipsets, red LED chip 22 chipsets and green light LED chip 23 chipsets are controlled, can realize the more control expanded function.
Embodiment 4,
All the other are identical with embodiment 3, and difference is that present embodiment also is provided with overtemperature protection system; Overtemperature protection system is a thermistor; This thermistor is series between said led chip and the power supply, and when chipset was overheated, the resistance of thermistor increased; Reduce even cut off the power supply of led chip, reach the purpose of its temperature of control.
Like Fig. 7 and shown in Figure 8, all the other are identical with embodiment 4, and difference is; Blue-light LED chip 21 is divided into two groups, and four every group, every group of blue-light LED chip 21 is connected in series; Two groups of blue-light LED chips 21 are connected in parallel then; 21 groups of blue-light LED chips after the parallel connection are connected with red LED chip 22, draw pair of pins 7 at last, by electric control gear all led chips 2 are controlled simultaneously.
The arrangement mode of two kinds of color led chips 2 is as shown in Figure 7.
Embodiment 6,
Like Fig. 9 and shown in Figure 10, all the other are identical with embodiment 4, and difference is; Blue-light LED chip 21 is divided into two groups, and four every group, every group of blue-light LED chip 21 is connected in series; Two groups of blue-light LED chips 21 are connected in parallel then, and the blue-light LED chip after the parallel connection is drawn pair of pins 7 for 21 groups at last, and red LED chip 22 is drawn pair of pins 7 separately; Thereby electric control gear can be controlled respectively and adjust blue-light LED chip 21 and red LED chip 22, has expanded controlled function.
The arrangement mode of two kinds of color led chips 2 is as shown in Figure 9.
In the foregoing description, metal substrate 11 comprises copper base, aluminium base and money base plate, also can adopt the ceramic substrate that comprises aluminium oxide ceramic substrate and aluminium nitride ceramics substrate.
In the led chip group, also can add White-light LED chip or yellow light LED chip, adjust colour temperature.
Adopt the beneficial effect of present technique scheme to be: blue-light LED chip is provided with phosphor powder layer and red LED chip together, through regulating relative electric current; Can change colour temperature very easily, and obtain the white light of high-color rendering, led chip directly is fixedly connected on metal substrate or the ceramic substrate; Can adopt processing technologys such as welding, the solid crystalline substance of silver slurry; The thermal resistance of whole encapsulation module is low, and is simple in structure, and production cost is lower.
Above-described only is preferred implementation of the present invention, should be pointed out that for the person of ordinary skill of the art, under the prerequisite that does not break away from the invention design, can also make some distortion and improvement, and these all belong to protection scope of the present invention.
Claims (10)
1. one kind high apparent white light LEDs module comprises high thermal conductive substrate and led chip, and said high thermal conductive substrate comprises metal substrate and ceramic substrate, it is characterized in that,
Said led chip comprises red LED chip and blue-light LED chip each at least one;
Said blue-light LED chip is provided with the layer of fluorescent powder layer;
Said led chip directly is fixedly connected on the said high thermal conductive substrate;
Also be provided with line layer on the said high thermal conductive substrate, when high thermal conductive substrate is metal substrate, be provided with insulating barrier between said line layer and the metal substrate, be electrically connected through said line layer between the said led chip.
2. height according to claim 1 shows the white light LEDs module, it is characterized in that, said phosphor powder layer is the yellow fluorescence bisque.
3. height according to claim 2 shows the white light LEDs module, it is characterized in that, said red LED chip and blue-light LED chip be parallel connection or series connection respectively; Or two kinds of led chip parallel/series together.
4. the LED module of high whitening light according to claim 2 is characterized in that, said led chip also comprises at least one green light LED chip, and said red LED chip, blue-light LED chip and green light LED chip be parallel/series respectively; Or wherein two kinds of led chip parallel/series together, a kind of in addition led chip separately the parallel connection; Or three kinds of equal parallel/series of led chip together.
5. show the white light LEDs module according to the arbitrary described height of claim 1 to 4; It is characterized in that; The LED module of said high whitening light also possibly be provided with protective cover; Said protective cover comprise frame be located on the frame or with frame be holistic transparency window, said protective cover be located at said led chip above.
6. height according to claim 5 shows the white light LEDs module; It is characterized in that; The LED module of said high whitening light also is provided with device for monitoring temperature, and said device for monitoring temperature is connected with the electric power starting of the LED module of the said high whitening light of control or the electric control gear signal of telecommunication of closing.
7. height according to claim 5 shows the white light LEDs module, it is characterized in that, the LED module of said high whitening light also is provided with overtemperature protection system, and said overtemperature protection system is a thermistor, and said thermistor is series between said led chip and the power supply.
8. the LED module of high whitening light according to claim 5 is characterized in that, said metal substrate comprises copper base, aluminium base and money base plate, and said ceramic substrate comprises aluminium oxide ceramic substrate and aluminium nitride ceramics substrate.
9. height according to claim 5 shows the white light LEDs module, it is characterized in that, said led chip also comprises White-light LED chip or yellow light LED chip.
10. height according to claim 5 shows the white light LEDs module, it is characterized in that, also is provided with the optical alignment hole of assist location on the said high thermal conductive substrate.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010265286.8A CN102376697B (en) | 2010-08-27 | 2010-08-27 | High color rendering white light LED (Light Emitting Diode) module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201010265286.8A CN102376697B (en) | 2010-08-27 | 2010-08-27 | High color rendering white light LED (Light Emitting Diode) module |
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| CN102376697A true CN102376697A (en) | 2012-03-14 |
| CN102376697B CN102376697B (en) | 2015-06-24 |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102709279A (en) * | 2012-05-30 | 2012-10-03 | 东莞市凯昶德电子科技股份有限公司 | LED (Light Emitting Diode) packaging structure of high brilliance full color display |
| CN103762294A (en) * | 2014-02-18 | 2014-04-30 | 深圳市安培盛科技有限公司 | Ceramic substrate with temperature sensing function and manufacturing method of ceramic substrate with temperature sensing function |
| CN103883887A (en) * | 2012-12-19 | 2014-06-25 | 苏州科医世凯半导体技术有限责任公司 | LED modules powered by multiple welding legs |
| CN104037272A (en) * | 2014-03-26 | 2014-09-10 | 深圳市格天光电有限公司 | High-integration flip chip COB (Chip On Board) light source with temperature feedback function, and manufacturing method of COB light source |
| CN105321939A (en) * | 2014-08-01 | 2016-02-10 | 楼云中 | White LED with adjustable color temperature and good color rendering |
| CN107768366A (en) * | 2017-11-23 | 2018-03-06 | 广东金源照明科技股份有限公司 | A kind of COB encapsulation for filling Thermal protection IC and its method for packing |
| CN109140252A (en) * | 2018-08-27 | 2019-01-04 | 佛山市顺德区蚬华多媒体制品有限公司 | Lamps and lanterns, LED light source and its manufacturing method |
| WO2019033725A1 (en) * | 2017-08-15 | 2019-02-21 | 深圳创维－Rgb电子有限公司 | White led consisting of three primary colors rgb and application thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102709279A (en) * | 2012-05-30 | 2012-10-03 | 东莞市凯昶德电子科技股份有限公司 | LED (Light Emitting Diode) packaging structure of high brilliance full color display |
| CN103883887A (en) * | 2012-12-19 | 2014-06-25 | 苏州科医世凯半导体技术有限责任公司 | LED modules powered by multiple welding legs |
| CN103762294A (en) * | 2014-02-18 | 2014-04-30 | 深圳市安培盛科技有限公司 | Ceramic substrate with temperature sensing function and manufacturing method of ceramic substrate with temperature sensing function |
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| CN104037272A (en) * | 2014-03-26 | 2014-09-10 | 深圳市格天光电有限公司 | High-integration flip chip COB (Chip On Board) light source with temperature feedback function, and manufacturing method of COB light source |
| CN105321939A (en) * | 2014-08-01 | 2016-02-10 | 楼云中 | White LED with adjustable color temperature and good color rendering |
| WO2019033725A1 (en) * | 2017-08-15 | 2019-02-21 | 深圳创维－Rgb电子有限公司 | White led consisting of three primary colors rgb and application thereof |
| CN107768366A (en) * | 2017-11-23 | 2018-03-06 | 广东金源照明科技股份有限公司 | A kind of COB encapsulation for filling Thermal protection IC and its method for packing |
| CN109140252A (en) * | 2018-08-27 | 2019-01-04 | 佛山市顺德区蚬华多媒体制品有限公司 | Lamps and lanterns, LED light source and its manufacturing method |
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