CN112416587A - Temperature control method of on-chip structure and layout method of on-chip structure - Google Patents
Temperature control method of on-chip structure and layout method of on-chip structure Download PDFInfo
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- CN112416587A CN112416587A CN202011312225.2A CN202011312225A CN112416587A CN 112416587 A CN112416587 A CN 112416587A CN 202011312225 A CN202011312225 A CN 202011312225A CN 112416587 A CN112416587 A CN 112416587A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F9/00—Arrangements for program control, e.g. control units
- G06F9/06—Arrangements for program control, e.g. control units using stored programs, i.e. using an internal store of processing equipment to receive or retain programs
- G06F9/46—Multiprogramming arrangements
- G06F9/50—Allocation of resources, e.g. of the central processing unit [CPU]
- G06F9/5094—Allocation of resources, e.g. of the central processing unit [CPU] where the allocation takes into account power or heat criteria
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3003—Monitoring arrangements specially adapted to the computing system or computing system component being monitored
- G06F11/3024—Monitoring arrangements specially adapted to the computing system or computing system component being monitored where the computing system component is a central processing unit [CPU]
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3058—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F15/00—Digital computers in general; Data processing equipment in general
- G06F15/76—Architectures of general purpose stored program computers
- G06F15/78—Architectures of general purpose stored program computers comprising a single central processing unit
- G06F15/7807—System on chip, i.e. computer system on a single chip; System in package, i.e. computer system on one or more chips in a single package
Abstract
The application provides a temperature control method of an on-chip structure and a layout method of the on-chip structure, wherein the on-chip structure comprises: the temperature control method of the on-chip structure comprises the following steps of simulating a calculation unit, a circuit unit and a temperature sensor, and based on the temperature control method of the on-chip structure: acquiring the temperature collected by the temperature sensor; wherein the temperature comprises at least one of: the temperature of the analog calculation unit and the temperature of the circuit unit; and controlling the operation states of the analog calculation unit and the circuit unit according to the comparison result of the temperature and the preset temperature range. Through the method and the device, the problem that in the prior art, the operation result error of the analog device is large or the operation result is not credible due to the fact that the temperature difference of the analog device is large is solved.
Description
Technical Field
The present application relates to the field of analog devices, and more particularly, to a temperature control method for an on-chip structure and a layout method for an on-chip structure.
Background
The influence of temperature on the characteristics of an analog device is large, and in general, the kinetic energy of electrons increases due to the increase of temperature, which may cause the characteristics of the device to change, as shown in fig. 1, where fig. 1 is a schematic diagram illustrating the influence of temperature on the characteristics of a diode in the prior art. Since the analog devices have the temperature characteristics, if the temperature difference of the analog devices at different times is large, the difference of the operation results is large, that is, the error of the operation results is large. For a plurality of analog devices, the temperature difference of the analog devices at different positions can also cause deviation of operations at different positions, and the result generated by the analog device at one position cannot be directly used for the analog device at another position, so that the generated data is not credible.
Disclosure of Invention
The embodiment of the application provides a temperature control method of an on-chip structure and a layout method of the on-chip structure, and aims to solve the problem that in the prior art, the operation result error of an analog device is large or the operation result is not reliable due to large temperature difference of the analog device.
In order to solve the technical problem, the present application is implemented as follows:
in a first aspect, the present application provides a method for temperature control of an on-chip structure, the on-chip structure comprising: the device comprises an analog calculation unit, a circuit unit and a temperature sensor; the method comprises the following steps: acquiring the temperature of the analog calculation unit acquired by the temperature sensor; and controlling the operation states of the analog calculation unit and the circuit unit according to the comparison result of the temperature and the preset temperature range.
In a second aspect, the present application provides a method for layout of an on-chip structure, the on-chip structure comprising: the device comprises an analog calculation unit, a circuit unit and a temperature sensor; wherein the analog computation unit is disposed at a second target location of the on-chip structure; the method comprises the following steps: determining to set the circuit unit within a first range including the analog calculation unit; determining to place the temperature sensor at a first target location of the on-chip structure; wherein the temperature sensor is configured to acquire a temperature of at least one of: the temperature of the analog calculation unit and the temperature of the circuit unit.
In a third aspect, the present application provides an on-chip structure comprising: the device comprises an analog calculation unit, a circuit unit, a temperature sensor and a controller; the controller is respectively connected with the analog calculation unit, the circuit unit and the temperature sensor; the temperature sensor is configured to acquire the temperature, wherein the temperature includes at least one of: the temperature of the analog calculation unit and the temperature of the circuit unit; and the controller is used for controlling the running states of the analog calculation unit and the circuit unit according to the comparison result of the temperature and the preset temperature range.
In a fourth aspect, the present application provides a layout apparatus of an on-chip structure, wherein the on-chip structure includes: the device comprises an analog calculation unit, a circuit unit and a temperature sensor; the analog calculation unit is arranged at a second target position of the on-chip structure; based on this, the apparatus comprises: a first determination module for determining that the circuit unit is set within a first range including the analog calculation unit; a second determination module to determine to place the temperature sensor at a first target location of the on-chip structure; wherein the temperature sensor is configured to acquire a temperature of at least one of: the temperature of the analog calculation unit and the temperature of the circuit unit.
In a fifth aspect, an embodiment of the present application further provides an electronic device, which includes a processor, a memory, and a program or instructions stored on the memory and executable on the processor, where the program or instructions, when executed by the processor, implement the steps of the method according to the first aspect or the second aspect.
In a sixth aspect, the present application further provides a readable storage medium, on which a program or instructions are stored, which when executed by a processor implement the steps of the method according to the first aspect or the second aspect.
Through the application, the temperature of the analog computation unit in the on-chip structure can be controlled according to the comparison result of the temperature and the preset temperature range after the temperature collected by the temperature sensor is obtained, so that the operation state of the analog computation unit and the circuit unit can be controlled, the temperature control of the on-chip structure can be realized, the problem that the operation result error of the analog device is large or the operation result is not credible due to the fact that the temperature difference of the analog computation unit is overlarge can be avoided, and the problem that the operation result error of the analog device is large or the operation result is unreliable due to the fact that the temperature difference of the analog device is large in the prior art is solved.
Drawings
FIG. 1 is a diagram illustrating the effect of temperature on diode characteristics in the prior art
FIG. 2 is a flow chart of a method of temperature control of an on-chip structure of an embodiment of the present application;
FIG. 3 is a flow chart of a method of layout of an on-chip structure of an embodiment of the present application;
FIG. 4 is a schematic diagram of a structure of an on-chip structure according to an embodiment of the present application;
FIG. 5 is a first schematic diagram of an alternative on-chip structure according to an embodiment of the present application;
FIG. 6 is a second diagram illustrating an alternative on-chip structure according to an embodiment of the present application;
FIG. 7 is a third schematic diagram of an alternative on-chip structure of an embodiment of the present application;
FIG. 8 is a fourth alternative structure diagram of an on-chip structure of an embodiment of the present application;
FIG. 9 is a fifth alternative structural schematic of an on-chip structure of an embodiment of the present application;
FIG. 10 is a schematic diagram of a layout apparatus for on-chip structures according to an embodiment of the present application;
fig. 11 is a schematic diagram of an alternative structure of a layout device of an on-chip structure according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present application, it is to be understood that the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
The following describes in detail a data processing method provided by the embodiments of the present application through specific embodiments and application scenarios thereof with reference to the accompanying drawings.
The embodiment of the application provides a temperature control method of an on-chip structure, wherein the on-chip structure comprises the following steps: the device comprises an analog calculation unit, a circuit unit and a temperature sensor; fig. 2 is a flowchart of a method for controlling temperature of an on-chip structure according to an embodiment of the present application, and as shown in fig. 2, the method includes the steps of:
step S202, acquiring the temperature collected by the temperature sensor, wherein the temperature comprises at least one of the following items: the temperature of the analog calculation unit and the temperature of the circuit unit;
and step S204, controlling the operation states of the analog calculation unit and the circuit unit according to the comparison result of the temperature and the preset temperature range.
Through the steps S202 and S204 in the embodiment of the application, for the temperature of the analog computation unit in the on-chip structure, after the temperature acquired by the temperature sensor is obtained, the operation states of the analog computation unit and the circuit unit are controlled according to the comparison result of the temperature and the preset temperature range, so as to realize the temperature control of the on-chip structure, thereby avoiding the problem that the operation result error of the analog device is large or the operation result is not reliable due to the large temperature difference of the analog computation unit, and improving the accuracy of the operation result of the analog computation unit, thereby solving the problem that the operation result error of the analog device is large or the operation result is not reliable in the prior art due to the large temperature difference of the analog device.
In an optional implementation manner of the embodiment of the present application, the on-chip structure in the embodiment of the present application may further include a controller, and the controller executes the steps S202 and S204, that is, the controller may implement control of the temperature of the on-chip structure.
In an optional implementation manner of the embodiment of the present application, regarding the manner of controlling the operation states of the analog computation unit and the circuit unit according to the comparison result between the temperature and the preset temperature range in step S204, the method may further include:
step S204-11, under the condition that the temperature is within the preset temperature range, maintaining the current running states of the analog calculation unit and the circuit unit;
step S204-12, controlling the analog calculation unit and the circuit unit to stop running under the condition that the temperature exceeds the highest temperature in the preset temperature range;
and step S204-13, under the condition that the temperature is lower than the lowest temperature in the preset temperature range, controlling the operation states of the analog calculation unit and the circuit unit according to whether the analog calculation unit needs to be started.
The manner for controlling the operation states of the analog computation unit and the circuit unit according to whether the analog computation unit needs to be started up in step S204-13 may further include:
step S11, judging whether the analog computation unit needs to start operation;
step S12, under the condition that the analog computation unit needs to be started, the analog computation unit is controlled to be started and operated, and the computation unit is controlled to be operated;
in step S13, in the case where the analog computation unit does not need to start operation, the current operation states of the analog computation unit and the circuit unit are maintained.
As can be seen from the above steps S204-11 to S204-13, in the case that the temperature of the simulator exceeds the highest temperature within the preset temperature range, the analog computation unit and the circuit unit are controlled to stop operating, and the temperature is high due to a large amount of heat generated by the operation of the circuit unit, so that the analog computation unit and the circuit unit can be controlled to stop operating to prevent the temperature from further increasing, thereby effectively controlling the temperature difference, and in this case, the operation result of the analog computation unit has a large error or is not trusted, so that the operation can also be controlled to stop. And under the condition that the temperature is within the preset temperature range, the current temperature is indicated to be in a more proper interval, the operation states of the analog calculation unit and the circuit unit are not required to be controlled, and the current state is maintained. And under the condition that the temperature is lower than the lowest temperature in the preset temperature range, if the current analog calculation unit needs to work, the current analog calculation unit can be controlled to start to operate, and if the current analog calculation unit does not need to work, the current operation state can be maintained.
It should be noted that, the value of the preset temperature range may be correspondingly set according to an actual situation, for example, the temperature corresponding to the optimal working state of the analog computation unit may be set as a reference, or a worker may perform corresponding setting according to experience, and the specific value range is not limited in the present application.
In an optional implementation manner of the embodiment of the present application, in a case that the number of the analog computing units is multiple, before acquiring the temperature of the analog computing unit acquired by the temperature sensor, the method of the embodiment of the present application may further include:
step S21, obtaining a first temperature value of each analog computation unit, where the first temperature value includes at least one of: historical temperature values, predicted temperature values;
step S22, determining the number of circuit units needed by each analog computation unit according to the first temperature value and the mapping table; the mapping table is used for indicating the mapping relation between the first temperature value and the required number of the circuit units.
Through the above steps S21 to S23, the historical temperature value is a measured temperature value corresponding to the analog computation unit at different historical times, a smaller number of circuit units can be set if the historical temperature value is mostly higher, a larger number of circuit units can be set if the historical temperature value is mostly lower, and a similar processing manner is also used for the predicted temperature value. The specific setting can be determined according to the mapping relationship in the mapping table, because different temperature values in the mapping table can correspond to different numbers of circuit units, the specific mapping relationship can be set according to the actual situation.
It should be noted that the circuit unit in the embodiment of the present application is disposed in a first range including the analog computation unit, and the temperature sensor is disposed at a first target position of the on-chip structure; wherein the temperature sensor is configured to acquire a temperature of the analog computation unit within a second range including the first target position.
Since the temperature sensor can acquire the temperature of the analog computation unit in the second range including the first target position, that is, as long as the analog computation unit in the second range can acquire the temperature thereof by the temperature sensor, based on this, in the case where the analog computation unit is in the second range including one temperature sensor, the temperature of the analog computation unit is the temperature acquired by the temperature sensor; in the case where the analog calculation unit is within the second range including the plurality of temperature sensors, the temperature of the analog calculation unit is an average value of the temperatures collected by the plurality of temperature sensors.
Further, since the temperature sensor can acquire the temperatures of the analog computation units in the second range including the first target position, that is, one temperature sensor can acquire the temperatures of a plurality of analog computation units, it is not necessary to configure one temperature sensor for each analog computation unit.
In another embodiment of the present application, a layout method of an on-chip structure is provided, wherein the on-chip structure includes: the device comprises an analog calculation unit, a circuit unit, a temperature sensor and a controller; the analog calculation unit is arranged at a second target position of the on-chip structure, and it should be noted that the second target position is a position determined in advance; as shown in fig. 3, the steps of the method include:
step S302, determining to set a circuit unit in a first range including an analog calculation unit;
step S304, determining a first target position of the on-chip structure to be provided with a temperature sensor; wherein the temperature sensor is configured to acquire a temperature of the analog computation unit within a second range including the first target position.
Through the layout method of the on-chip structure in the steps S302 to S304, the operation states of the analog computation unit and the circuit unit can be controlled according to the comparison result of the temperature and the preset temperature range, so that the temperature of the analog thermometer can be controlled, the temperature difference of the analog computation unit can be prevented from being too large to influence the operation result of the analog computation unit, and the problem that the operation result error of the analog device is large or the operation result is not reliable due to the large temperature difference of the analog device in the prior art is solved.
It should be noted that, the on-chip structure in the embodiment of the present application may further include a controller, and based on this, the method steps in the embodiment of the present application may further include:
and S306, determining that the controller is respectively connected with the analog calculation unit, the circuit unit and the temperature sensor, wherein the controller controls the operation states of the analog calculation unit and the circuit unit according to the comparison result of the temperature and the preset temperature range.
In an optional implementation manner of the embodiment of the present application, in a case that the number of the analog computing units is multiple, before acquiring the temperature of the analog computing unit acquired by the temperature sensor, the method of the embodiment of the present application may further include:
step S31, obtaining a first temperature value of each analog computation unit, where the first temperature value includes at least one of: historical temperature values, predicted temperature values;
step S32, determining the number of circuit units needed by each analog computation unit according to the first temperature value and the mapping table; the mapping table is used for indicating the number of the required circuit units corresponding to the first temperature value range;
in step S33, the determined circuit unit is set within a first range including the analog calculation unit.
Through the above steps S31 to S33, the historical temperature value is a measured temperature value corresponding to the analog computation unit at different historical times, a smaller number of circuit units can be set if the historical temperature value is mostly higher, a larger number of circuit units can be set if the historical temperature value is mostly lower, and a similar processing manner is also used for the predicted temperature value. The specific setting can be determined according to the mapping relationship in the mapping table, because different temperature values in the mapping table can correspond to different numbers of circuit units, the specific mapping relationship can be set according to the actual situation.
In yet another embodiment of the present application, there is provided an on-chip structure, as shown in fig. 4, including: an analog calculation unit 42, a circuit unit 44, a temperature sensor 46, and a controller 48; the controller 48 is connected to the analog calculation unit 42, the circuit unit 44, and the temperature sensor 46; wherein the content of the first and second substances,
a temperature sensor 46 for acquiring a temperature of the analog computation unit 42, wherein the temperature comprises at least one of: simulating the temperature of the calculation unit and the temperature of the circuit unit;
and the controller 48 is used for acquiring the temperature of the analog calculation unit 42 acquired by the temperature sensor 46 and controlling the operation states of the analog calculation unit 42 and the circuit unit 44 according to the comparison result of the temperature and the preset temperature range.
It should be noted that, the analog computation unit referred to in the embodiment of the present application may be: the analog devices comprise resistors, capacitors, inductors, diodes, triodes, analog amplifiers, D/A, A/D, analog signal regulators, integrated voltage stabilizing circuits, sensors, audio and video circuits and the like.
Optionally, in a case that the number of the analog computing units is multiple, the controller 48 in this embodiment is further configured to obtain a first temperature value of each analog computing unit before obtaining the temperature of the analog computing unit collected by the temperature sensor, where the first temperature value includes at least one of: historical temperature values, predicted temperature values; and the number of the first and second groups,
the controller 48 in the embodiment of the present application is further configured to determine the number of circuit units required by each analog computation unit according to the first temperature value and the mapping table; the mapping table is used for indicating the mapping relation between the first temperature value and the required number of the circuit units.
Optionally, in a case that the analog computation unit is within a second range including one temperature sensor, the temperature of the analog computation unit is the temperature collected by the temperature sensor; in the case where the analog calculation unit is within the second range including the plurality of temperature sensors, the temperature of the analog calculation unit is an average value of the temperatures collected by the plurality of temperature sensors.
Optionally, as to a manner in which the controller in the embodiment of the present application controls the operation states of the analog computation unit and the circuit unit according to a comparison result between the temperature and the preset temperature range, further, the method may include: under the condition that the temperature is within a preset temperature range, the controller maintains the current running states of the analog calculation unit and the circuit unit; under the condition that the temperature exceeds the highest temperature within the preset temperature range, the controller controls the analog calculation unit and the circuit unit to stop running; and under the condition that the temperature is lower than the lowest temperature in the preset temperature range, the controller controls the operation states of the analog calculation unit and the circuit unit according to whether the analog calculation unit needs to be started.
The mode of the controller controlling the operation states of the analog computation unit and the circuit unit according to whether the analog computation unit needs to be started up may further be: the controller judges whether the analog calculation unit needs to be started to operate or not; under the condition that the analog computation unit needs to be started to operate, the controller controls the analog computation unit to start to operate and controls the computation unit to operate; in the case where the analog computation unit does not need to start operation, the controller maintains the current operation state of the analog computation unit and the circuit unit.
It should be noted that the circuit unit in the embodiment of the present application is provided in a first range including the analog computation unit; the temperature sensor is arranged on a first target position of the on-chip structure; wherein, the temperature sensor is used for collecting temperature; wherein the temperature comprises at least one of: and simulating the temperature of the calculation unit and the temperature of the circuit unit.
Since the temperature sensor can acquire the temperatures of the analog computation units in the second range including the first target position, that is, one temperature sensor can acquire the temperatures of a plurality of analog computation units, it is not necessary to configure one temperature sensor for each analog computation unit. As shown in fig. 5, the on-chip structure includes 8 analog computation units as an example, and 1 temperature sensor corresponds to 1 analog computation unit; as shown in fig. 6, for example, the on-chip structure includes 8 analog computation units, and each 2 analog computation units corresponds to 1 temperature sensor, that is, 1 temperature sensor can collect the temperatures of the corresponding 2 analog computation units; as shown in fig. 7, 1 temperature sensor can acquire temperature values of 4 surrounding analog calculation units, where the temperatures of the left 2 analog calculation units in the virtual frame are acquired by 2 temperature sensors (a first temperature sensor and a second temperature sensor), and the temperatures of the right 2 analog calculation units in the virtual frame are also acquired by 2 temperature sensors (a second temperature sensor and a third temperature sensor); therefore, the temperature values of the 2 analog computation units are the average values of the temperatures collected by the 2 temperature sensors.
Optionally, in a case where the number of the analog computation units is plural, at least one circuit unit is provided within a first range including the analog computation units; the quantity corresponding to at least one circuit unit is determined according to the first temperature value of the analog calculation unit and the mapping table; the first temperature value includes at least one of: historical temperature values and predicted temperature values, and the mapping table is used for indicating the number of the required circuit units corresponding to the temperature value range. That is, the number of circuit units of different analog calculation units may be different as shown in fig. 8 and 9. It should be noted that fig. 8 and fig. 9 are merely examples, and in other alternative implementations of the embodiments of the present application, the number of corresponding circuit units may be determined according to actual situations.
In another alternative implementation of the embodiment of the present application, there is further provided a layout apparatus of an on-chip structure, where as shown in fig. 4, the on-chip structure includes: the device comprises an analog calculation unit, a circuit unit and a temperature sensor; the analog calculation unit is arranged at a second target position of the on-chip structure; based on this, the apparatus in the embodiment of the present application is shown in fig. 10, and includes:
a first determination module 102 for determining to set the circuit unit within a first range including the analog calculation unit;
a second determination module 104 for determining to place a temperature sensor at a first target location of the on-chip structure; wherein the temperature sensor is configured to acquire a temperature of the analog computation unit within a second range including the first target position.
Optionally, in a case that the number of the analog computation units is multiple, the first determining module 102 includes: the acquisition unit is used for acquiring a first temperature value of each analog calculation unit, wherein the first temperature value comprises at least one of the following values: historical temperature values, predicted temperature values; the first determining unit is used for determining the number of circuit units required by each analog calculating unit according to the first temperature value and the mapping table; the mapping table is used for indicating the mapping relation between the first temperature value and the required number of the circuit units; a second determination unit for determining that the circuit unit is disposed within a first range including the analog calculation unit.
Optionally, in a case that the on-chip structure in the embodiment of the present application further includes a controller, as shown in fig. 11, the apparatus in the embodiment of the present application may further include: and a third determining module 106, configured to determine that the controller is connected to the analog calculating unit, the circuit unit, and the temperature sensor, respectively, where the controller controls the operating states of the analog calculating unit and the circuit unit according to a comparison result between the temperature and a preset temperature range.
Optionally, an embodiment of the present application further provides an electronic device, which includes a processor, a memory, and a program or an instruction stored in the memory and capable of running on the processor, where the program or the instruction is executed by the processor to implement each process of the above-mentioned on-chip structure temperature control method or on-chip structure layout method embodiment, and can achieve the same technical effect, and in order to avoid repetition, details are not repeated here.
It should be noted that the electronic devices in the embodiments of the present application include the mobile electronic devices and the non-mobile electronic devices described above.
The embodiment of the present application further provides a readable storage medium, where a program or an instruction is stored on the readable storage medium, and when the program or the instruction is executed by a processor, the program or the instruction implements each process of the above-mentioned on-chip structure temperature control method or on-chip structure layout method embodiment, and can achieve the same technical effect, and in order to avoid repetition, the detailed description is omitted here.
The processor is the processor in the electronic device described in the above embodiment. The readable storage medium includes a computer readable storage medium, such as a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and so on.
It will be apparent to those skilled in the art that the modules or steps of the present application described above may be implemented by a general purpose computing device, they may be centralized on a single computing device or distributed across a network of multiple computing devices, and alternatively, they may be implemented by program code executable by a computing device, such that they may be stored in a storage device and executed by a computing device, and in some cases, the steps shown or described may be performed in an order different than that described herein, or they may be separately fabricated into individual integrated circuit modules, or multiple ones of them may be fabricated into a single integrated circuit module. Thus, the present application is not limited to any specific combination of hardware and software.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (15)
1. A method of temperature control of an on-chip structure, the on-chip structure comprising: the device comprises an analog calculation unit, a circuit unit and a temperature sensor; the method comprises the following steps:
acquiring the temperature collected by the temperature sensor; wherein the temperature comprises at least one of: the temperature of the analog calculation unit and the temperature of the circuit unit;
and controlling the operation states of the analog calculation unit and the circuit unit according to the comparison result of the temperature and the preset temperature range.
2. The method according to claim 1, wherein in a case where the number of the analog computation units is plural, before acquiring the temperature of the analog computation unit acquired by the temperature sensor, the method further comprises:
obtaining a first temperature value of each analog computation unit, wherein the first temperature value comprises at least one of: historical temperature values, predicted temperature values;
determining the number of circuit units required by each analog calculation unit according to the first temperature value and a mapping table; the mapping table is used for indicating the mapping relation between the first temperature value and the required number of circuit units.
3. The method of claim 2,
the circuit unit is disposed within a first range including the analog computation unit;
the temperature sensor is disposed at a first target location of the on-chip structure; wherein the temperature sensor is configured to acquire a temperature of the analog computation unit within a second range including the first target position.
4. The method of claim 3,
under the condition that the analog calculation unit is in a second range including one temperature sensor, the temperature of the analog calculation unit is the temperature collected by the temperature sensor;
in the case where the analog calculation unit is within a second range including a plurality of temperature sensors, the temperature of the analog calculation unit is an average value of the temperatures acquired by the plurality of temperature sensors.
5. The method of claim 1, wherein the controlling the operation states of the analog computation unit and the circuit unit according to the comparison result of the temperature and the preset temperature range comprises:
maintaining the current operating states of the analog computation unit and the circuit unit under the condition that the temperature is within the preset temperature range;
under the condition that the temperature exceeds the highest temperature in the preset temperature range, controlling the analog calculation unit and the circuit unit to stop running;
and under the condition that the temperature is lower than the lowest temperature in the preset temperature range, controlling the operation states of the analog calculation unit and the circuit unit according to whether the analog calculation unit needs to start operation or not.
6. The method of claim 5, wherein controlling the operation states of the analog computation unit and the circuit unit according to whether the analog computation unit needs to be started up for operation comprises:
judging whether the analog computing unit needs to be started to operate or not;
under the condition that the simulation computing unit needs to be started to operate, controlling the simulation computing unit to start to operate, and controlling the computing unit to operate;
and maintaining the current operation state of the analog calculation unit and the circuit unit under the condition that the analog calculation unit does not need to start operation.
7. A method of layout of an on-chip structure, the on-chip structure comprising: the device comprises an analog calculation unit, a circuit unit and a temperature sensor; wherein the analog computation unit is disposed at a second target location of the on-chip structure; the method comprises the following steps:
determining to set the circuit unit within a first range including the analog calculation unit;
determining to place the temperature sensor at a first target location of the on-chip structure; wherein the temperature sensor is configured to acquire a temperature of at least one of: the temperature of the analog calculation unit and the temperature of the circuit unit.
8. The method according to claim 7, wherein in a case where the number of the analog computation units is plural, setting the circuit unit within a first range including the analog computation unit includes:
obtaining a first temperature value of each analog computation unit, wherein the first temperature value comprises at least one of: historical temperature values, predicted temperature values;
determining the number of circuit units required by each analog calculation unit according to the first temperature value and a mapping table; the mapping table is used for indicating the mapping relation between the first temperature value and the required number of the circuit units;
the determined circuit unit is set within a first range including the analog calculation unit.
9. An on-chip structure for use in the method of any of claims 1-6, wherein the on-chip structure comprises: the device comprises an analog calculation unit, a circuit unit, a temperature sensor and a controller; the controller is respectively connected with the analog calculation unit, the circuit unit and the temperature sensor;
the temperature sensor is configured to acquire the temperature, wherein the temperature includes at least one of: the temperature generated by the analog calculation unit in the working state and the temperature generated by the circuit unit in the working state;
and the controller is used for controlling the running states of the analog calculation unit and the circuit unit according to the comparison result of the temperature and the preset temperature range.
10. The on-chip structure of claim 9,
the circuit unit is disposed within a first range including the analog computation unit;
the temperature sensor is disposed at a first target location of the on-chip structure.
11. The on-chip structure according to claim 10, wherein in a case where the number of the analog computation units is plural, at least one of the circuit units is set within a first range including the analog computation unit; the quantity corresponding to at least one circuit unit is determined according to a first temperature value of the analog computation unit and a mapping table, wherein the first temperature value comprises at least one of the following values: historical temperature values, predicted temperature values; the mapping table is used for indicating the number of the required circuit units corresponding to the temperature value range.
12. A layout arrangement of an on-chip structure, the on-chip structure comprising: the device comprises an analog calculation unit, a circuit unit and a temperature sensor; wherein the analog computation unit is disposed at a second target location of the on-chip structure; the device comprises:
a first determination module for determining that the circuit unit is set within a first range including the analog calculation unit;
a second determination module to determine to place the temperature sensor at a first target location of the on-chip structure; wherein the temperature sensor is configured to acquire a temperature of at least one of: the temperature of the analog calculation unit and the temperature of the circuit unit.
13. The apparatus of claim 12, wherein in the case that the number of the analog computation units is plural, the first determination module comprises:
an obtaining unit, configured to obtain a first temperature value of each analog computation unit, where the first temperature value includes at least one of: historical temperature values, predicted temperature values;
the first determining unit is used for determining the number of circuit units required by each analog calculating unit according to the first temperature value and a mapping table; the mapping table is used for indicating the mapping relation between the first temperature value and the required number of the circuit units;
a second determination unit for determining that the circuit unit is disposed within a first range including the analog calculation unit.
14. An electronic device comprising a processor, a memory and a program or instructions stored on the memory and executable on the processor, which program or instructions, when executed by the processor, performs method steps comprising any of the method steps of claims 1-6, or performs method steps comprising any of the method steps of claims 7 or 8.
15. A readable storage medium, characterized in that it stores thereon a program or instructions which, when executed by a processor, carry out a method step comprising according to any one of claims 1-6, or carry out a method step comprising according to claim 7 or 8.
Priority Applications (2)
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|---|---|---|---|
| CN202011312225.2A CN112416587A (en) | 2020-11-20 | 2020-11-20 | Temperature control method of on-chip structure and layout method of on-chip structure |
| PCT/CN2021/130002 WO2022105664A1 (en) | 2020-11-20 | 2021-11-11 | Computing system and operation method therefor, and electronic device and computer-readable medium |
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| CN202011312225.2A CN112416587A (en) | 2020-11-20 | 2020-11-20 | Temperature control method of on-chip structure and layout method of on-chip structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022105664A1 (en) * | 2020-11-20 | 2022-05-27 | 北京灵汐科技有限公司 | Computing system and operation method therefor, and electronic device and computer-readable medium |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2022105664A1 (en) * | 2020-11-20 | 2022-05-27 | 北京灵汐科技有限公司 | Computing system and operation method therefor, and electronic device and computer-readable medium |
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