MY139319A - Bottom cover tape for electronic part carrier - Google Patents

Bottom cover tape for electronic part carrier

Info

Publication number
MY139319A
MY139319A MYPI20020076A MYPI20020076A MY139319A MY 139319 A MY139319 A MY 139319A MY PI20020076 A MYPI20020076 A MY PI20020076A MY PI20020076 A MYPI20020076 A MY PI20020076A MY 139319 A MY139319 A MY 139319A
Authority
MY
Malaysia
Prior art keywords
bottom cover
parts
cover tape
weight
electronic part
Prior art date
Application number
MYPI20020076A
Inventor
Hiroki Ichikawa
Ichirou Nakano
Kyouichi Araki
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of MY139319A publication Critical patent/MY139319A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Packaging Frangible Articles (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Packages (AREA)
  • Wrappers (AREA)

Abstract

A BOTTOM COVER TAPE (1) FOR ELECTRONIC PART CARRIER INCLUDES: A SUPPORTING BASE MATERIAL LAYER (2); AND AN ADHESIVE LAYER (3), WHEREIN THE ADHESIVE LAYER (3) CONTAINS: 100 PARTS BY WEIGHT OF A BASE POLYMER; 1 TO 50 PARTS BY WEIGHT OF AN ALICYCLIC SATURATED HYDROCARBON RESIN; AND 0.1 TO 20 PARTS BY WEIGHT OF AT LEAST ONE OF AN AMPHOTOERIC SURFACE ACTIVE AGENT FREE OF HALOGEN ATOM AND SULFUR ATOM AND A NONIONIC SURFACE ACTIVE AGENT FREE OF HALOGEN ATOM AND SULFUR ATOM, SO AS TO OBTAIN A BOTTOM COVER TAPE (1) HAVING AN EXCELLENT ADHESIVITY TO CARRIER TAPE, GOOD ANTISTATIC PROPERTIES AND EXCELLENT ANTI-BLOCKING PROPERTIES AND CORROSION-INHIBITING PROPERTIES WITH RESPECT TO CHIP PARTS.
MYPI20020076A 2001-01-11 2002-01-09 Bottom cover tape for electronic part carrier MY139319A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001003710A JP4573442B2 (en) 2001-01-11 2001-01-11 Bottom cover tape for electronic component carriers

Publications (1)

Publication Number Publication Date
MY139319A true MY139319A (en) 2009-09-30

Family

ID=18872007

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20020076A MY139319A (en) 2001-01-11 2002-01-09 Bottom cover tape for electronic part carrier

Country Status (6)

Country Link
JP (1) JP4573442B2 (en)
KR (1) KR20020060618A (en)
CN (1) CN1200062C (en)
MY (1) MY139319A (en)
SG (1) SG96676A1 (en)
TW (1) TW555829B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG115510A1 (en) * 2001-12-20 2005-10-28 Nitto Denko Corp Cover tape for the electronic part conveyance, process for its production and electronic part conveying member
JP2004189314A (en) * 2002-12-13 2004-07-08 Nitta Ind Corp Electronic component support
JP3808852B2 (en) * 2003-09-12 2006-08-16 大王製紙株式会社 Carrier tape mount base material
EP1741640B9 (en) * 2004-04-26 2012-09-26 Denki Kagaku Kogyo Kabushiki Kaisha Cover tape, and carrier tape system for packing electronic component
JP4766863B2 (en) * 2004-10-22 2011-09-07 電気化学工業株式会社 Cover tape and carrier tape system for packaging electronic components
JP2005306460A (en) * 2004-04-26 2005-11-04 Denki Kagaku Kogyo Kk Cover tape and electronic part packaging carrier tape system
JP4710072B2 (en) * 2004-06-23 2011-06-29 電気化学工業株式会社 Cover tape
JP4444814B2 (en) * 2004-12-28 2010-03-31 信越ポリマー株式会社 Cover tape and electronic component packaging
JP6758801B2 (en) * 2015-03-20 2020-09-23 株式会社サンエー化研 Surface protective film
JP2018193121A (en) * 2017-05-22 2018-12-06 Koa株式会社 Bottom cover tape
JP7211239B2 (en) * 2018-06-25 2023-01-24 Tdk株式会社 How to store electronic components
JP7324049B2 (en) * 2019-05-24 2023-08-09 株式会社ダイセル semiconductor equipment
CN114787052A (en) * 2019-12-10 2022-07-22 住友电木株式会社 Cover tape and electronic component package

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52104547A (en) * 1976-02-29 1977-09-02 Tokyo Silicone Kk Antistatic paint
CA1222071A (en) * 1984-01-30 1987-05-19 Joseph A. Aurichio Conductive die attach tape
US4645711A (en) * 1985-08-26 1987-02-24 Minnesota Mining And Manufacturing Company Removable pressure-sensitive adhesive tape
US4699842A (en) * 1985-10-17 1987-10-13 Minnesota Mining And Manufacturing Company Pressure-sensitive adhesive having broad useful temperature range
IT1217821B (en) * 1988-06-09 1990-03-30 Autoadesivitalia Spa SELF-ADHESIVE MASTRO WITH LOW NOISE PERFORMANCE AND PROCEDURE FOR ITS PREPARATION
US5834538A (en) * 1996-06-18 1998-11-10 Hercules Incorporated Pressure sensitive adhesives
JP2000191991A (en) * 1998-12-24 2000-07-11 Nitto Denko Corp Top cover tape for chip type electronic part carrier
JP2001003014A (en) * 1999-06-16 2001-01-09 Nitto Denko Corp Bottom cover tape for chip type electronic part carrier

Also Published As

Publication number Publication date
JP2002211677A (en) 2002-07-31
SG96676A1 (en) 2003-06-16
JP4573442B2 (en) 2010-11-04
KR20020060618A (en) 2002-07-18
TW555829B (en) 2003-10-01
CN1200062C (en) 2005-05-04
CN1364842A (en) 2002-08-21

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