TW555829B - Bottom cover tape for electronic part carrier - Google Patents

Abstract

A bottom cover tape for electronic part carrier includes: a supporting base material layer; and an adhesive layer, wherein the adhesive layer contains: 100 parts by weight of a base polymer; 1 to 50 parts by weight of an alicyclic saturated hydrocarbon resin; and 0.1 to 20 parts by weight of at least one of an amphotoeric surface active agent free of halogen atom and sulfur atom and a nonionic surface active agent free of halogen atom and sulfur atom, so as to obtain a bottom cover tape having an excellent adhesivity to carrier tape, good antistatic properties and excellent anti-blocking properties and corrosion-inhibiting properties with respect to chip parts.

Description

^ 55829 V. Description of the invention G) Back of parts moving ": It is a kind of bottom cover tape used for carousel wafer type electronic incineration. The electronics of more special moon-type electronic parts have excellent adhesion to the carrier strip: 1 'The present invention is related to:-different anti-blocking properties and good anti-static properties on wafers and ▼. Corrosion-suppressing bottom cover adhesive & description = Photochip-type electronic parts (transport method of wafer zero-layer ceramic capacitors) Liyang chip fixed resistor and punched out for receiving chip-type electrical : J: A paper carrier made in a strange way in the vertical direction (the carrier tape = the belt-shaped pieces are each received in a separate receiving bag) and the wafer-type electronic zero tape is immediately heat-sealed to electrically heat the wafer-type electricity :; Parts == the carrier and the top cover carrier are rolled on a reel for conveyance. This series of 啧 ': roll = universal use of paper. In the manufacture of the printed circuit board Uf, the top cover tape is widely used from the paper. The carrier is peeled so that :: Automatically pick up the wafer-type electronic parts received in it, and then leave it ;: on the circuit board. &Amp; An automatic assembly system is widely used, and then supplied ^ This automatic assembly will be at the bottom The cover tape is glued to the carrier. Therefore, the bottom cover tape should have good adhesion to the carrier tape. In recent years, there has been a problem that the suction efficiency of the wafer part cannot be sucked by the air nozzle. This problem is speculated to be attributed to Due to Companion C: \ 2D-CQDE \ 91-04 \ 91100293.ptd Page 5 555829 V. Description of the invention (2) The chip parts in the bag caused by the force caused by the electrostatic force generated by the ruler of the chip parts Wafers are such a serious concern. Therefore, etching, and general guidelines for the invention of wafers. Therefore, the bottom cover tape of the present invention has different antistatic properties to suppress the properties. Inch and weight 'from when' or between In the part adhesion, I would like to mention a part of the exhibition. The air nozzle is reduced due to the decrease in the bonding time until the adhesion occurs. The wafer is an excellent and can be reduced. The surface of the adhesive layer. The part is covered by the bottom cover ^ — The bottom cover that suppresses or prevents the reliability provides an anti-adhesive property of the tape of the carrier tape and the pressure on the adhesive tape on the bottom cover tape. At the same time, the corrosion tape of the severe wafer parts which was not sufficiently corroded by the cold tape to receive the sealing layer was used. The use of the part carrier and the corrosion of the excellent film parts The bottom cover for the carrier of a specific part is glued to the point of the carrier strip to prevent the blocking properties and corrosion inhibition. The present invention provides a power supply including a support base material layer m, and from 1 to 50 parts by weight and Adhesive layer containing no surfactant and sulfur atom surfactant. The solution is extensively studied. The resin composition forms the adhesive layer on the supporting base material layer in the power supply belt to make it resistant to chip parts. All requirements for electrostatic properties and properties. The bottom cover tape for the sub-component carrier, which contains an amphoteric surfactant of an alicyclic saturated hydrocarbon tree in an amount of 10 to 20 parts by weight based on 100 parts by weight of the base polymer and / Non-ionic

Details of the invention

555829 V. Description of the invention (3) The specific implementation of the present invention will be described below with reference to the drawings at appropriate time, and the bottom cover for the carrier for the electric component parts according to the present invention will be described. Figure 1 is a schematic diagram of the system. In FIG. 1, the component number i indicates, = one component number 2 indicates the supporting base material layer, and the component number: layer. The bottom cover tape 1 includes a supporting base material layer 2 and an adhesive layer 3 on the non-adhesive material layer 2. And a is placed on a supporting base (supporting base material layer 2) A material about how the supporting base material constituting the supporting base material layer 2 has a self-supporting property. This supporting base material is two or two kinds of paper such as Japanese paper, tracing paper, wrinkled paper, mixed paper and composite paper, non-woven fabric, cloth, plastic film, :: resins such as olefin resins (e.g., polyethylene, Polypropylene, Polyester: Resin), Polypropylene Modified Resin and Thermoplastic Elastomer (fine benzene =… plastic elastomer) and polyester (for example, polyparaphenylene ^ plugs such as copper or aluminum foil or sheet, Laminates, etc. The metal supports the base material 2 to show no less than 90, and when the melting point of the base material 2 is less than 900 c, 杳 ^ '超 乂 ▲ The support cover tape is thermally bonded to the electronic parts. It is a heating iron to make the bottom.… And the original purpose of making it impossible to cover can make the surface of the supporting base material layer 2 perform general surface treatment, take the punch & the opposite surface of the adhesive layer 3) out, It can be supported by its M / Month, good anti-static treatment, etc. This allows the supporting base material layer 2 to have improved adhesion on its adhesive layer side. Page 7 \\ 312 \ 2d-code \ 91-04 \ 91100293.ptd 555829

Treatment of effects such as true apricot material is made of plastic film :: and corona treatment. In particular, radon supports the basic results. In monthly conditions, a tackifying coating can be applied to improve the adhesion effect. Supporting the house hazard of the base material 2 Mechanical strength and handling are not as wide as possible; depending on the application, as long as it is about 5 microns to 100 microns. However, 'actually' it is preferable that it is from (adhesive layer 3) to 10 μm to 50 μm. Adhesive layer 3 is made of thermoplastic Λ / at least-base polymer, r: plastic adhesive including atomic amphoteric surface activity and non-atom and sulfur called 疋 茳 Μ and / or non-ionic surface activity ', ,,, plastic adhesives include 1QQ parts weight = = = 1 to 2 ° parts by weight of at least the upper = tree moon said 'and does not contain halogen atoms and / Jie Shigu; or non-ionic surface activity :: ~ atom Amphoteric surfactants and (base polymer) As for the base polymer, thermoplastic resins such as olefin resins, vinyl acetate resins, polyester resins and styrene resins, thermoplastic elastomers, and the like can be used. These base polymers may be used alone or in a combination of two or more. 0 Examples of olefin resins that may be used for this include polyethylene (eg, low density polyethylene, linear low density polyethylene, metal dicyclopentadiene). (metallocene) catalyst for processing polyethylene, high density polyethylene), polyolefins such as polypropylene and ethylene-α-olefin copolymer resins, ethylene copolymers (e.g., 'ethylene-unsaturated acid copolymers such as ethylene —Acrylic acid copolymer

C: \ 2D- (DDE \ 91 -〇4 \ 91100293.ptd page 8 555829 V. Description of the invention (5) (EAA) and ethylene-methacrylic acid copolymer (EMAA), ionomer, ethylene- (Fluorenyl) acrylate copolymers such as ethylene-acrylic acid methyl ester copolymers, ethylene-ethyl acrylate copolymers (EEA) and ethylene-fluorene-based acrylic acid ester copolymers, ethylene-vinyl acetate copolymers (EVA), Ethylene-vinyl alcohol copolymer), and polypropylene modified resin. Examples of the vinyl acetate resin include polyvinyl acetate, vinyl acetate- (meth) acrylate copolymer, vinyl acetate-vinyl ester copolymer, and vinyl acetate-maleate copolymer. Examples of thermoplastic elastomers include styrene thermoplastic elastomers (styrene block copolymers, for example, styrene block copolymers having a styrene content of not less than 5 weight percent) such as SIS (styrene-isoprene -Styrene block copolymer), SBS (styrene-butadiene-styrene block copolymer), SEBS (styrene-ethylene-butene-styrene block copolymer), SEPS (styrene-ethylene -Propylene-styrene block copolymers) and SEP (styrene-ethylene-propylene block copolymers), polyurethane thermoplastic elastomers, polyester thermoplastic elastomers, and blended thermoplastic elastomers such as polypropylene Polymer blend with EPT (Ternary ethylene-propylene rubber). (Alicyclic saturated hydrocarbon-based resin) As for the alicyclic saturated hydrocarbon-based resin, for example, a resin prepared by completely hydrogenating an aromatic petroleum resin (for example, a petroleum-based petroleum resin) ('sometimes referred to as "1" J clothing Saturated Petroleum Resin "). Specific examples of this resin include ESCOREZ5300 and ESC0REX5380 (Exxon Mobil

Corporation's product name) 〇 These alicyclic saturated warp-based resins can be used alone or as both

555829 V. Description of invention (6) Combined use. In the case where the adhesive layer 3 is formed by extrusion lamination (which needs to be melted at a high temperature), alicyclic saturated petroleum resin is particularly preferable from the viewpoint of oxidation stability. That is, adding an alicyclic saturated hydrocarbon-based resin as a tackifying resin to the adhesive layer 3 can improve the binding efficiency, and make the bottom cover tape exhibit stable and good adhesion to the carrier tape. ^ Based on 100 parts by weight of the base polymer, the amount of alicyclic saturated hydrocarbon-based resin added to the adhesive layer is, for example, from about 1 to 50 parts by weight, and preferably from 9 to 5 to 30 parts by weight. When the amount of the alicyclic saturated hydrocarbon-based resin is less than 1 part by weight based on the i 00 parts by weight of the base polymer, the molten adhesive group cannot adhere to the supporting base material 2 (the adhesion effect cannot be obtained), such as Paper, it is necessary to achieve co-extrusion or tandem extrusion lamination, not just extrusion lamination to form an intermediate layer. In addition, the bottom cover tape produced is almost impossible and has the desired adhesion to the carrier tape (paper carrier). … In contrast, although the amount of alicyclic saturated hydrocarbon-based resin is more than 50 parts by weight based on 100 parts by weight of the base polymer, the adhesive layer 3 and the film are formed immediately after extrusion by The metal rollers in contact with the adhesive layer 3 may become stuck and cannot be stably manufactured. In addition, the chip parts will adhere to the adhesive layer 3, making it difficult to suck the air nozzle in the step of manufacturing the circuit board. & (Amphoteric surfactant, non-ionic surfactant) As for the amphoteric surfactant and / or non-ionic surfactant to be added to the adhesive layer 3, a surface-active state containing no function atom and sulfur atom can be used. This surfactant containing no halogen and sulfur atoms is included as

555829

7. Description of the invention (7) Surfactants of κ amphoteric surfactants and / or non-ionic surfactants can prevent corrosion of electrodes in wafer parts. Among the surfactants containing halogen atoms, the halogen atoms are mostly present in the form of tooth ions (such as ☆, gas ions). In surfactants containing sulfur atoms, most of the sulfur atoms exist in the form of sulfate ions. The presence of these self ions (e.g., gas ions) or sulfate ions can cause corrosion of the metal of the artificial electrode in the wafer part. However, the bottom cover tape of the present invention includes a surfactant that is not = a halogen atom or a ^ atom (especially a > formula of a halide ion or a sulfate ion, respectively) as an antistatic agent, and therefore, it does not corrode sheet parts Electrode. The test of amphoteric surfactants and 2-burning can be used for esters, sorbitan phenyl ether block copolymers, polyoxyethylene, etc. There is no special feature for these amphoterics or their dual activities. limit. Examples of amphoteric forms that can be used for this include N, N-diamidyl-N-alkylaminoacetic acid betayl-beta-ethyl-p-carboxymethylimidazoline-terminated betaine. Examples of such nonionic surfactants include glycerol sulfate sorbitol aliphatic acid esters, sucrose aliphatic acid esters, polyoxyethyl groups, polyoxyethyl groups, polyoxyethyl groups, polyoxyethyl groups Group, polyethylene glycol aliphatic acid ester (polyoxyethylene ethyl aliphatic acid ester), sorbitan aliphatic acid ester, and aliphatic acid alkanolamine. The surfactant and / or nonionic surfactant may be used alone or in a mixture of two or more. Calculate 4 liters or solid content, polymerize based on 100 parts by weight. When i Q ◦ parts by weight of the base polymer, the amount of surfactant (amphoteric surfactant and / or non-ionic surfactant) in the piercing layer is from .0 to 20 parts by weight, from

555829 V. Description of the invention (8) 3 = Agent: Force: When the amount is less than °, when the weight is 1 part, the "generated antistatic property" will sometimes cause the chip parts to stick to the adhesive drawer, which cannot produce enough. Antistatic effect. In addition, based on the detailed description of the basic polymer with a weight of 100, Tian added to the adhesive layer = when the amount of sex agent is less than 0 · 丨 parts by weight, the surface resistance of the adhesive layer is 1013Ω / square (ohm per square) ), And the adhesive layer of Mopin 'He Chao 10000 volts. In contrast, when the amount of the surfactant added to the adhesive layer is more than 20 parts by weight based on 100 parts by weight, it will be added to the surface or interface of the adhesive layer. , Full adhesion of the body (conveyor strip). This layer exhibits insufficient adhesion to the supporting base material layer 2, resulting in the destruction of the interface between the adhesive layer 3 and the supporting base material layer 2. "Inhibition of oxidation" In addition to the present invention, the adhesive layer 3 may include additives such as fillers, softeners, ultraviolet light absorbers, rust inhibitors, antistatic agents other than those described in the coupling agent, and cross-linking added thereto. The agent ^ does not have a thickness of ΓΓΛ / determined appropriately, as long as its adhesion and handling I will be reduced. However, in fact, when the thickness is from about 5 micrometers to 50 micrometers and the thickness is less than 5 micrometers, the generated adhesive layer exhibits degraded adhesion to the handling of stolen tape (adhesives), and it may be difficult to work. When the thickness of the adhesive layer 3 exceeds 50 micrometers, the 'produced tape exhibits an excessively large thickness', which may cause a problem of deterioration in handling or production efficiency due to an increase in weight generated when the cover is manufactured in a continuous length. In the present invention, the softening point of the adhesive layer 3 is from about 60 t to) 7 (rc (It is better to reduce the generation time. When the softening point of the adhesive layer 3 is lower than ㈣) Page 12 C: \ 2D-OODE \ 91-04 \ 91100293.ptd) »829 5. In the description of the invention (9), the electronic parts to be transported have i ± Ba pieces which are thinned and exposed to high temperature and high thirst environment. When ^ ^ 4VV !! ΐ ^ lt, thin film formation needs to increase the weighting point of layer ^ / layer 3 over H0c, and the same degree of persimmon a ΓI f, which will reduce the heat sealing (tie) efficiency, and make the addition In the adhesive layer 3 ~ ^ > and + ^ and / or non-ionic, and the second surface preparation (amphoteric surfactant re-equivalent from the sex agent) evaporated in the second year, reducing the antistatic effect. Types of polymers 疋 疋The basic element constituting the adhesive layer 3 adjusts the thermoplastic resin, thermoplastic elastomer) or other reasons to the Ω layer; Ϊ J Π resistivity is from 108 to Ω, preferably (from 108: pre, 疋The resin constituting the adhesive layer 3 and the additives to be added to it are adjusted by the type and mixing ratio of the surface f-reactive agent (antistatic agent), etc. The triboelectricity of the adhesive layer 3 is not higher than 3,000 volts It is better (especially at 1,000 volt jf temple). The friction voltage of the adhesive layer 3 can be adjusted by appropriately pre-determining the type of thermoplastic adhesive added to the adhesive layer 3, the adhesive layer 3, and the like. & Amp In the present invention, the surface roughness (average roughness Ra) of the adhesive layer 3 is preferably from 0.1 μm to 20 μm (more preferably from 1 μm to 8 μm). When the surface of the adhesive layer 3 is rough When the degree is lower than 0 · 1 micron, the generated adhesive layer has an increased contact area with the chip part, which will increase the adhesion of the adhesive layer to the chip part 'and make the chip part more easily adhere to the adhesive layer. In contrast, When the surface seam of the adhesive layer 3 exceeds 20 micrometers, problems such as cracking of the adhesive layer during the film formation process or a decrease in the adhesiveness of the carrier tape (adhesive body) may occur.

C: \ 2D-0QDE \ 91-04 \ 91100293.ptd 555829

V. Description of the Invention (ίο) Question 0 In the present invention, an intermediate layer can be interposed between the supporting base material layer 2 and the adhesive layer 3 to improve the adhesion therebetween. The intermediate layer may be formed of a thermoplastic resin such as a polyolefin resin, a thermoplastic elastomer, rubber, and the like. Examples of olefinic resins include low-density polyethylene, linear low-density polyethylene, α-olefinic copolymers, and ethylene-vinyl acetate copolymers. These components constituting the intermediate layer may be used alone or as a mixture of two or more thereof. The thickness of the intermediate layer may be appropriately determined as long as the handling properties of the bottom cover tape and the like are not impaired, and it is, for example, from about 0 μm to 40 μm. It is not necessary to set an intermediate layer. The bottom cover tape 1 of the present invention can be, for example, melt-blended in a predetermined ratio with the components of the adhesive layer 3 by using a twin-screw kneader, and blending the mixture = granules, or dry-mixing the components in the same manner. , And then use the usual single or tandem extrusion lamination method to insert or not insert the intermediate layer, and the method of laminating warp = grain = blend or dry blend on the supporting base material layer 2 It can be prepared. Alternatively, the adhesive layer 3 and the intermediate layer can be co-extruded and laminated on the supporting base material layer 2 to prepare the bottom cover tape 1. Figure 2 shows the bottom cover tape shown in Figure 丨 in use.丨 A schematic longitudinal cross-sectional view of a carrier material for wafer-type electronic parts. The carrier material 4 for wafer-type electronics 2 includes rectangular holes punched out at regular intervals in the wafer-type electronic parts. The carrier tape 5 of 7, the bottom cover tape 1 provided on the lower surface of the second carrier tape 5, and the top cover tape 6 provided on the upper and lower surfaces of the carrier tape. Place the carrier material 4 on the carrier The lower surface of the strip 5 is heat-sealed with the bottom cover tape, and is shaped in it. Cheng Chengfeng

555829 V. Description of the invention (11) Bag. Each wafer-type electronic component 8 is received in a separate receiving envelope. After that, the carrier tape 5 and the top cover tape 6 are wound on the upper surface thereof, and the carrier tape 5 is wound on a reel for conveyance. Since the adhesive layer 3 of the bottom cover tape 1 is composed of a specific substance, a specific tackifier, and a specific antistatic agent (surface activity = so: 宜), the bottom cover tape 1 and the carrier tape 5 can be connected to each other. This will cause the chip part 8 to fall during transportation. Material 5㈣, because the cover tape 1 also exhibits excellent antistatic properties, so it can be completed: the stickiness of the sheet parts. In more detail, the bottom cover tape 1 can be suppressed or prevented: the sheet part 8 adheres tightly to the surface of its adhesive layer 3. The bottom cover tape maker can also s = even if it is received or packaged during storage "sheet: the adhesion of the piece 8 or the fusion to its adhesion Sheet of layer 3: sprayed after piece 8 i: ΐ: zero: ί landing is enhanced in the automatic assembly system using air strips to remove and supply to the board. # 了 Japan and Japan film parts from the carrier: outside shooting due to The adhesive layer 3 does not contain any components (for example, ionization of ions, sulfur compounds such as sulfate degassing, or prevention of corrosion of the wafer component 8, ^ β u, and the bottom tape 1 can suppress different corrosion-inhibiting properties. Therefore, it exhibits For the quality of wafer parts and the electricity generated by Hr in the storage process ::: 1 can be used Promote the packaging of electronic components for sinful electronic parts. Zero: The bottom cover tape is made to transport chip-type electronics: resistors and laminated ceramic capacitors. The bottom cover tape of the present invention includes The adhesive layer formed by the ingredients, because

C: \ 2D-CQDE \ 9l-04 \ 91100293.ptd Page 15 The excellent static resistance of the parts produced during the process of the static strip of the conveyor belt shows the electrostatic belt for the bottom of the present invention. Therefore, the wafer is caused by rotation, Adhesion of flaws, 'and up. Explained in steps. V. Explanation of the invention (12) This shows that the tape for carrying the bottom cover also shows that the tape is transporting or similar. Inhibits or prevents the wafer. In addition, due to the antistatic agent of the product, it is possible to eliminate the mistake of sucking the wafer part by the mouth, or the erroneous suction of the wafer zero nozzle. The wafer part is supplied to the board. The present invention explains a further invention by its excellent thermal adhesive properties. Electrical properties of the invention. Therefore, the bottom cover of the present invention generates an extremely low friction voltage so that it can be attracted to the surface of the adhesive layer. Therefore, the excellent anti-adhesion property of the chip part, including the electrode which does not contain atoms or sulfur elements, will not be corroded. In the process of peeling or the like, air spray defects, such as electrostatic attraction of wafer parts, can be used to eliminate wafer parts being exposed to air in an automated assembly system.

Example 1 100 parts by weight of low-density polyethylene (LDPE) was prepared using a twin-screw kneader.

(Base polymer with brand name "LJ800", MITSUBISHI CHEMICAL

Manufactured by CORPORATION; Density: 0.918 g / cm3; Melt flow rate (MFR): 20 g / 10 minutes; Softening point: 82 ° C), 20 parts by weight of alicyclic tobacco-based resin (trade name " ESCOREZ5300 "Tackifying Resin, Exxon

Mobil Corporation) and 1.5 parts by weight of a non-ionic surfactant (trade name "Non i on S-1 0" antistatic agent (polyoxyethylene fatty acid ester), manufactured by NOF CORPORATION) at 130 ° Knead at a temperature of 30 minutes, and then cut into pellets. The pelletized blend is then heated at a temperature of 250 ° C.

555829 V. Description of the invention (13) Extrusion is carried out to form a thin film through an extrusion laminator, and then it is laminated on a sum paper (thickness: 40 microns; reference weight: 19 g / m2) as a supporting base material. )on. Then, the adhesive layer was laminated on the paper to a thickness of 25 micrometers to prepare a laminated tape (bottom cover tape). The thus-produced laminated tape had a total thickness of 55 micrometers and a surface roughness Ra of 4 micrometers on its adhesive layer. Example 2 In the same manner as in Example 1, 100 parts by weight of ethylene-acetic acid was used. Vinyl Ester Copolymer (EVA Resin) (basic polymer with trade name "LV140", manufactured by MITSUBISHI CHEMICAL CORPORATION; vinyl acetate content: 2% by weight; MFR: 1 · 5 g / 10 minutes; softening point: 87 ° C ), 10 parts by weight of an alicyclic hydrocarbon-based resin (trade name rESCOREZ538〇), a tackifier resin made by Exxon Mobil Corporation, and 5 parts by weight of a nonionic surfactant (trade name "AIMEX 300-LD", Sanyo Chemical Industries, Ltd.). The pelletized blend is then extruded at 220 ° C through an extrusion laminator to form a film ', and then laminated to a sum paper (thickness: 40 microns; benchmark for the base material) Weight: 18 g / m2). Then, the adhesive layer was laminated on the paper to a thickness of 20 µm, and a laminated tape (bottom cover tape) having a total thickness of 50 µm was prepared. Thereafter, the laminated tape was sandblasted so that the surface seam Ra of the adhesive layer was 15 m. Example 3

Using a Banbury mixer, 100 parts by weight of a low-density polyethylene (LDPE) (trade name "LJ800" base polymer, MITSUBISHI

C: \ 2D-00DE \ 91-04 \ 91100293.ptd Page 17 555829 5. Description of the invention (14) Manufactured by Chemical Corporation; density: 0.918 g / cm3; solution flow rate (MFR): 20 g / 1 0 minutes; softening point: 8 2 ° C), 20 parts by weight of an alicyclic hydrocarbon-based resin (trade name “ESCOREZ 5300” tackifying resin manufactured by Exxon Mobil Corporation), and 2 parts by weight of polyethylene glycol (antistatic Agents; non-ionic surfactants) are kneaded and then pelletized. The person then extruded the pelletized push mixture at a temperature of 250 ° C to form a film through an extrusion sound coupling machine, and then laminated it to a sum paper (anisotropy. 25 microns, reference Weight.14g / m2). Then, the adhesive layer was laminated on the paper to a thickness of 25 μm to prepare a laminated tape (bottom cover tape). The thus-obtained laminated tape has a total thickness of 50 micrometers and a surface roughness Ra of 3 micrometers on its adhesive layer. Comparative Example 1 A low-density polyethylene (trade name "LJ800", manufactured by MITSUBISHI CHEMICAL CORPORATION) was extruded through an extrusion laminator; density: 0.918 g / cm3; MFR · 20 g / 10 minutes; softening point : 82 ° C) laminated on a sum paper (thickness: 40 micrometers; reference weight: 18 g / m 2) as a supporting base material layer to obtain a total thickness of 55 micrometers and 0.05 micrometers Laminated tape with surface roughness Ra on its adhesive layer. Comparative Example 2 100 parts by weight of a linear low-density polyethylene (trade name "UF240", manufactured by MITSUBISHI CHEMICAL CORPORATION; density: 0.923 g / cm3; MFR: 2 g / 10 minutes; softening point: 85. 〇Add 5 parts by weight of the fourth ammonium salt (cationic antistatic agent). Knead the mixture with a kneader, and then extrude and laminate it on the support base with an extrusion laminator.

C: \ 2D-C0DE \ 91-04 \ 91100293.ptd Page 18 555829 V. Description of the invention (15) The sum of the material layers (thickness: 35 microns; reference weight: 15 grams per square meter) Laminated tape with a total thickness of 50 meters and a chain degree Ra of 0.5 m on the surface of its adhesive layer. Evaluation test Each of the laminated tapes thus obtained in the Examples and Comparative Examples was subjected to the following tests. The results are described in Table 1. (Tensile Strength and Elongation) The tensile strength (Newton / 5. 25 mm) and elongation (Newton / 5. 25 mm) of the laminated tape were measured at a pull rate of 300 mm / min using a tensile meter. . (Adhesiveness) Using a heat sealing machine (tape winding machine manufactured by Tokyo Weld Co., Ltd.) at a temperature of 170 C, an iron pressing force of 1.5 kgf (14.7 Newtons), and 1,200 PCS / min The laminated tape was heat-sealed to the surface of a paper carrier (H0CT0-60 'HOKUETU PAPER MILLS, LTD.'). A peel test machine was used at a peel rate of 300 mm / min and wo. At the peeling angle, the adhesion (adhesion) of the laminated tape was measured. (Surface resistivity) Hires tor UP (manufactured by MITSUBISH I CHEMICAL CORPORATION), a high resistivity meter, was used at 23. (: And 65% RH in the atmosphere and 500 volts and 30 seconds each to measure the surface resistivity (q) of various laminated tapes. (Friction voltage) According to JISL 10 94, each measured various laminated tapes Friction voltage (volts) on its adhesive layer side.

Is: > 829

(Residue suppression property) Various laminated tapes (Ni foil) for a long time. After bran, heat contact the side of the adhesive layer to nickel foil for hours. The box will be stored at 100 ° C in an environment of 60 ° C & 90% RH. ; ... L; Two tape INi pig peeling. Next, check the discoloration of Nii §. Then, the 1 foil that saw each other and crossed the color was judged as "G (good)". The Ni foil showing discoloration at the time of product accumulation was judged as rF (normal). " The Ni foil exhibiting discoloration was judged to be "p (poor)". (Ion extraction): The materials of the adhesive layers of various laminated tapes are immersed in pellets. The pelletized material was then boiled at a temperature of 100 ° C under reflux for 45 to bismuth to extract the ionic components. The thus-obtained extract was cooled and then subjected to ion chromatography to determine the detection amount (extraction amount) (ppm) of the gas ionization (C1) and sulfate ion (so ^-) contained therein. In Table 1 below, "ND" stands for "Not Detected". Example No. Comparative Example No. 1 2 3 1 2 Tensile strength (N / 5.25mm) 10 11 10 10 8 Elongation (N / 5.25mm) 3 2 3 2 1.5 Adhesiveness (N / 5.25mm) 300 < 150 250 < 200 < 120 Surface resistivity (〇) 1x10 '° 5xl08 3xl08 1x10 | 4 < lxlO9 Friction voltage (V) 170 100 35 3,200 15 Corrosion inhibition properties GGGGF ~ P Ion extraction chloride ion (ppm) ND ND ND ND 28 Sulfuric acid Root ion (ppm) ND ND ND ND 4 As can be seen in Table 1 above, according to the bottom cover tape of the example to the carrier belt

5. Description of the invention (17) The material exhibits good adhesion. It is pressed and exhibits a low & adhesive tape on its adhesive layer to produce a low triboelectric chip adhesion. In addition, the adhesive contact with the chip part can be prevented or prevented or sulfate ion 'so that it will not corrode Nb. Therefore, the gas and the tape have excellent corrosion inhibitory properties. Only the bottom cover of the example On the basis of Japan ’s application owed on July ^ 200, 003710, the entire content of the application is incorporated into the% examination materials, as described in detail. This article refers to the part number. $ 1 2 3 4 5 8 Bottom cover tape support base material layer Adhesive layer for wafer-type electricity + loan &m; m Carrier material carrier for electric ten parts Tape top cover tape Wafer-type electronic parts

555829 Brief description of the drawings Figure 1 is a schematic cross-sectional view illustrating a specific embodiment of the bottom cover tape of the present invention; and Fig. 2 is a diagram illustrating a carrier for wafer-type electronic parts including the bottom cover tape of Fig. 1 in use A rough longitudinal section of the material.

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Claims (1)

1 «< Destination 100 Years of the Turtle Revised 9 | 〇1 · Two kinds of bottom cover tapes for carrier parts for power supply parts, including: a supporting base material layer; and an adhesive layer ', wherein the adhesive layer contains a relative to 1 The base polymer consisting of at least one type of thermoplastic resin such as thin candle resin, ethyl acetate S resin, poly S resin, styrene resin, and thermoplastic elastomer contains 0 to 0 0 parts by weight. Parts by weight of alicyclic saturated tobacco resin; and at least one of 0.1 to 20 parts by weight of amphoteric surfactants containing no halogen and sulfur atoms and nonionic surfactants containing no halogen and sulfur atoms 0 2 · The underlay tape for the carrier of electric parts as claimed in item 1 of the patent application range, wherein the adhesive layer has a thickness from 5 to 50 microns, a softening point from 60 ° C to 170 ° C, and Surface resistivity from 108 to 1013 Ω / square. Electricity 3. The wide adhesive tape for the carrier of the electric component parts as described in the first item of the patent application scope, wherein the adhesive layer has a 盒 f box degree from 0.1 μm to 20 μm. Ding also has a rough surface. 4) For example, the adhesive tape for a carrier of an electric component part No. 2 in the scope of patent application, wherein the adhesive layer has a bottom cover of from 0 to 1 micrometer to 20 micrometers. Rough surface of the heart 5. As in the case of the patent application scope item 1, the tape of the carrier tape carrier, wherein the adhesive layer shows 0 to 3,00 volts of the bottom cover of the motorcycle 6. As the patent application scope item 2 provides Electronic part carrier \ W tape, in which the adhesive layer exhibits Mohs cover of 0 to 3,000 volts. 7. The electric part carrier m as described in the scope of patent application No. 3. # Adhesive tape, wherein the adhesive layer exhibits a friction voltage cover of 0 to 3,000 volts 555829 _Case No. 91100293_ Modified production date of the year of the year. 6. Application for Patent Scope 8. For example, the bottom cover tape for the carrier parts carrier of the patent application No. 4, in which the adhesive layer shows 0 to 3, 0 0 Friction voltage of 0 volts. C: \ Patent Case File \ 91 \ 911〇〇293 \ 911〇〇293 (Replaces H.ptc, page 24