TW555829B - Bottom cover tape for electronic part carrier - Google Patents

Bottom cover tape for electronic part carrier Download PDF

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Publication number
TW555829B
TW555829B TW091100293A TW91100293A TW555829B TW 555829 B TW555829 B TW 555829B TW 091100293 A TW091100293 A TW 091100293A TW 91100293 A TW91100293 A TW 91100293A TW 555829 B TW555829 B TW 555829B
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TW
Taiwan
Prior art keywords
adhesive layer
parts
tape
carrier
bottom cover
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Application number
TW091100293A
Other languages
Chinese (zh)
Inventor
Hiroki Ichikawa
Ichirou Nakano
Kyouichi Araki
Original Assignee
Nitto Denko Corp
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Publication of TW555829B publication Critical patent/TW555829B/en

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02Electrically-conducting adhesives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)
  • Wrappers (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

A bottom cover tape for electronic part carrier includes: a supporting base material layer; and an adhesive layer, wherein the adhesive layer contains: 100 parts by weight of a base polymer; 1 to 50 parts by weight of an alicyclic saturated hydrocarbon resin; and 0.1 to 20 parts by weight of at least one of an amphotoeric surface active agent free of halogen atom and sulfur atom and a nonionic surface active agent free of halogen atom and sulfur atom, so as to obtain a bottom cover tape having an excellent adhesivity to carrier tape, good antistatic properties and excellent anti-blocking properties and corrosion-inhibiting properties with respect to chip parts.

Description

^55829 五、發明說明G) 之背 零件搬』:,於一種供使用於輪送晶片型電子焚# 千搬運态用之底蓋膠帶。更特月型電子零件之電子 對搬運器帶材之優異黏著:1 ’本發明係關於— :異的抗黏連性質及對晶片 上好的抗靜電性質及 ▼。 屙蝕抑制性質的底蓋膠 &朋技-說明 =照晶片型電子零件(晶片零 層合陶莞電容器之輸送方式 )ϋ阳片固定電阻器及 隔於其中衝出用於接受晶片型電:J:在縱向中以怪定間 成之紙張搬運器(搬運器帶材=帶狀 件各承接於各別的承接封袋立即將晶片型電子零 膠帶熱合,以將晶片型電:;零件==搬運器與頂蓋 搬運器捲於捲軸上以供輸送。此一連嘖‘:捲=將紙張 泛地使用。在製造經輸送紙張搬運器之電路板Uf被廣 將頂蓋膠帶自紙張搬運器剝•,以致 ::自動吸取承接於其中之晶片型電子零件,缺後再;: 於電路板上。&一自動組裝系統被大量採用,、後再供給 ^此自動組裝m將底蓋膠帶膠黏至搬運器。 因此,底蓋膠帶應對搬運器帶材具有良好的黏著性帶 近年來發生一種晶片零件無法被空氣噴嘴吸取之 而產生吸取效率下降的問題。據推測此問題係歸因於由伴 C:\2D-CQDE\91-04\91100293.ptd 第5頁 555829 五、發明說明(2) 隨晶片零件之尺 生靜電力所造成 產生之力所造成 袋中之晶片零件 卻而造成之晶片 在此等顧慮之 重問題。因此, 蝕,及對於晶片 發明之概诫 因此,本發明 之底蓋膠帶,其 異的抗靜電性質 抑制性質。 寸及重 ’由當 ’或由 之間的 零件黏 間,會 希望提 零件展 之一目 展現對 及優異 量之進一 空氣噴嘴 因在黏缚 時間減少 著至黏著 發生晶片 供一種可 現優異可 步降低而在 將晶片零件 底蓋膠帶與 所致之黏著 層之表面。 零件被底蓋 ^— 抑制或防止 靠性之底蓋 的為提供一種供電子 搬運器帶材之優異黏 的抗黏連性質及對晶 底蓋膠帶上產 壓向黏著層時 承接於承接封 層之不充分冷 膠帶腐蝕的嚴 晶片零件之腐 膠帶。 零件搬運器用 著性,以及優 片零件之腐蝕 本發明人對前述問題 果,經發現利用特定的 零件搬運器用之底蓋膠 合對搬運器帶材之點著 抗黏連性質及腐蝕抑制 本發明提供一種供電 括支承基礎材料層 m ,及 自1至50份重量及自〇. J 及不含函原子及硫原子 面活性劑的黏著層。 之解決辦法進行廣泛的研究。結 樹脂組成物將黏著層形成於供電 帶中之支承基礎材料層上使其可 性’對晶片零件之抗靜電性質、 性質之所有需求。 子零件搬運器用之底蓋膠帶,其 包含以1 0 0份重量之基礎聚合物言十 至20份重量之量的脂環飽和烴樹 之兩性表面活性劑及/或非離子^ 55829 V. Description of the invention G) Back of parts moving ": It is a kind of bottom cover tape used for carousel wafer type electronic incineration. The electronics of more special moon-type electronic parts have excellent adhesion to the carrier strip: 1 'The present invention is related to:-different anti-blocking properties and good anti-static properties on wafers and ▼. Corrosion-suppressing bottom cover adhesive & description = Photochip-type electronic parts (transport method of wafer zero-layer ceramic capacitors) Liyang chip fixed resistor and punched out for receiving chip-type electrical : J: A paper carrier made in a strange way in the vertical direction (the carrier tape = the belt-shaped pieces are each received in a separate receiving bag) and the wafer-type electronic zero tape is immediately heat-sealed to electrically heat the wafer-type electricity :; Parts == the carrier and the top cover carrier are rolled on a reel for conveyance. This series of 啧 ': roll = universal use of paper. In the manufacture of the printed circuit board Uf, the top cover tape is widely used from the paper. The carrier is peeled so that :: Automatically pick up the wafer-type electronic parts received in it, and then leave it ;: on the circuit board. &Amp; An automatic assembly system is widely used, and then supplied ^ This automatic assembly will be at the bottom The cover tape is glued to the carrier. Therefore, the bottom cover tape should have good adhesion to the carrier tape. In recent years, there has been a problem that the suction efficiency of the wafer part cannot be sucked by the air nozzle. This problem is speculated to be attributed to Due to Companion C: \ 2D-CQDE \ 91-04 \ 91100293.ptd Page 5 555829 V. Description of the invention (2) The chip parts in the bag caused by the force caused by the electrostatic force generated by the ruler of the chip parts Wafers are such a serious concern. Therefore, etching, and general guidelines for the invention of wafers. Therefore, the bottom cover tape of the present invention has different antistatic properties to suppress the properties. Inch and weight 'from when' or between In the part adhesion, I would like to mention a part of the exhibition. The air nozzle is reduced due to the decrease in the bonding time until the adhesion occurs. The wafer is an excellent and can be reduced. The surface of the adhesive layer. The part is covered by the bottom cover ^ — The bottom cover that suppresses or prevents the reliability provides an anti-adhesive property of the tape of the carrier tape and the pressure on the adhesive tape on the bottom cover tape. At the same time, the corrosion tape of the severe wafer parts which was not sufficiently corroded by the cold tape to receive the sealing layer was used. The use of the part carrier and the corrosion of the excellent film parts The bottom cover for the carrier of a specific part is glued to the point of the carrier strip to prevent the blocking properties and corrosion inhibition. The present invention provides a power supply including a support base material layer m, and from 1 to 50 parts by weight and Adhesive layer containing no surfactant and sulfur atom surfactant. The solution is extensively studied. The resin composition forms the adhesive layer on the supporting base material layer in the power supply belt to make it resistant to chip parts. All requirements for electrostatic properties and properties. The bottom cover tape for the sub-component carrier, which contains an amphoteric surfactant of an alicyclic saturated hydrocarbon tree in an amount of 10 to 20 parts by weight based on 100 parts by weight of the base polymer and / Non-ionic

發明之詳細說Details of the invention

555829 五、發明說明(3) 以下將適時參照附圖說明本發明之具體實施 , 說明根據本發明之供電子零件搬運器用之底蓋$ °圖1係 體例之示意圖。在圖1中,元件編號i係指示,,=一具 件編號2係指示支承基礎材料層,及元件編號:: 層。底蓋膠帶1包括支承基礎材料層2, 不黏者 材料層2上之黏著層3。 及a置於支承基礎 (支承基礎材料層2) 關於構成支承基礎材料層2之支承基礎材 何具有自支承性質之材料。此一支承基礎材料二二任 紙張諸如和紙(japanese paper)、描圖紙、皺紋 ^ 紙、混合紙及複合紙、不織物、布、塑膠薄膜、::成 樹脂諸如烯烴樹脂(例如’聚乙烯、聚丙稀、、二 :樹脂),聚丙婦改質樹脂及熱塑性彈膠⑷d細苯= …塑性彈膠)及聚酯(例如,聚對苯 ^ 堵如銅及鋁製成之箔或薄板、其層合物等等。 金屬 支承基礎材料2以展現不低於9〇它之 基礎材料2之炼點低於9 〇 〇c時,杳 ^ ’超乂 ▲支承 蓋膠帶熱接觸黏合至電子零件备屬加熱熨斗使底 的。 …又+而使其無法完成覆蓋的原始目 可使支承基礎材料層2之表面 行一般的表面處理、取叙沖& 黏者層3相對之表面)進 外,可使支承其Μ /月動文良處理、抗靜電處理等等。此 使支承基礎材料層2在其黏著層側上進行改良黏固 第7頁 \\312\2d-code\91-04\91100293.ptd 555829555829 V. Description of the invention (3) The specific implementation of the present invention will be described below with reference to the drawings at appropriate time, and the bottom cover for the carrier for the electric component parts according to the present invention will be described. Figure 1 is a schematic diagram of the system. In FIG. 1, the component number i indicates, = one component number 2 indicates the supporting base material layer, and the component number: layer. The bottom cover tape 1 includes a supporting base material layer 2 and an adhesive layer 3 on the non-adhesive material layer 2. And a is placed on a supporting base (supporting base material layer 2) A material about how the supporting base material constituting the supporting base material layer 2 has a self-supporting property. This supporting base material is two or two kinds of paper such as Japanese paper, tracing paper, wrinkled paper, mixed paper and composite paper, non-woven fabric, cloth, plastic film, :: resins such as olefin resins (e.g., polyethylene, Polypropylene, Polyester: Resin), Polypropylene Modified Resin and Thermoplastic Elastomer (fine benzene =… plastic elastomer) and polyester (for example, polyparaphenylene ^ plugs such as copper or aluminum foil or sheet, Laminates, etc. The metal supports the base material 2 to show no less than 90, and when the melting point of the base material 2 is less than 900 c, 杳 ^ '超 乂 ▲ The support cover tape is thermally bonded to the electronic parts. It is a heating iron to make the bottom.… And the original purpose of making it impossible to cover can make the surface of the supporting base material layer 2 perform general surface treatment, take the punch & the opposite surface of the adhesive layer 3) out, It can be supported by its M / Month, good anti-static treatment, etc. This allows the supporting base material layer 2 to have improved adhesion on its adhesive layer side. Page 7 \\ 312 \ 2d-code \ 91-04 \ 91100293.ptd 555829

效應的處理諸如真s杏 材料為塑膠薄膜之产::及電暈處理。尤其,纟支承基礎 果。 月况中,可塗布增黏塗層以改良黏固效 支承基礎材料2之屋危 機械強度及操縱性不:;可視用途而寬廣地預定’只要其 約5微米至!〇〇微米可。然而’實際上’其係自 (黏著層3) 乂自、力10微米至50微米較佳。 黏者層3係由熱塑性勤笨Λ/ 至少-基礎聚合物、r: 塑性黏著劑包括 原子之兩性表面活性及不含•原子及硫 叫疋茳Μ及/或非離子表面活性 言之’,、,、塑性黏著劑包括以1QQ份重 = = = 1至2°份重量之量的至少上= 树月曰’及不含鹵原子及/杰石古; 或非離子表面活::〜原子之兩性表面活性劑及, (基礎聚合物) 關於基礎聚合物,可使用熱塑性樹脂諸如烯烴樹脂、乙 酸乙烯醋樹脂、聚酯樹脂及苯乙烯樹脂、熱塑性彈膠等 等。此等基礎聚合物可單獨使用或以其兩者以上的^合使 用0 可使用於此之烯烴樹脂的例子包括聚乙烯(例如,低密 度聚乙烯、線性低密度聚乙烯、金屬雙環戊二稀 (metallocene)催化劑加工聚乙烯、高密度聚乙稀)、聚稀 烴諸如聚丙烯及乙稀-α -烯烴共聚物樹脂、乙稀共聚物 (例如’乙烯-不飽和叛酸共聚物諸如乙稀—丙稀酸共聚物Treatment of effects such as true apricot material is made of plastic film :: and corona treatment. In particular, radon supports the basic results. In monthly conditions, a tackifying coating can be applied to improve the adhesion effect. Supporting the house hazard of the base material 2 Mechanical strength and handling are not as wide as possible; depending on the application, as long as it is about 5 microns to 100 microns. However, 'actually' it is preferable that it is from (adhesive layer 3) to 10 μm to 50 μm. Adhesive layer 3 is made of thermoplastic Λ / at least-base polymer, r: plastic adhesive including atomic amphoteric surface activity and non-atom and sulfur called 疋 茳 Μ and / or non-ionic surface activity ', ,,, plastic adhesives include 1QQ parts weight = = = 1 to 2 ° parts by weight of at least the upper = tree moon said 'and does not contain halogen atoms and / Jie Shigu; or non-ionic surface activity :: ~ atom Amphoteric surfactants and (base polymer) As for the base polymer, thermoplastic resins such as olefin resins, vinyl acetate resins, polyester resins and styrene resins, thermoplastic elastomers, and the like can be used. These base polymers may be used alone or in a combination of two or more. 0 Examples of olefin resins that may be used for this include polyethylene (eg, low density polyethylene, linear low density polyethylene, metal dicyclopentadiene). (metallocene) catalyst for processing polyethylene, high density polyethylene), polyolefins such as polypropylene and ethylene-α-olefin copolymer resins, ethylene copolymers (e.g., 'ethylene-unsaturated acid copolymers such as ethylene —Acrylic acid copolymer

C:\2D-(DDE\91 -〇4\91100293.ptd 第 8 頁 555829 五、發明說明(5) (EAA)及乙烯-甲基丙烯酸共聚物(EMAA)、離子交聯聚合 物、乙烯-(曱基)丙烯酸酯共聚物諸如乙烯-丙烯酸甲酿共 聚物、乙烯-丙烯酸乙酯共聚物(EEA)及乙烯—曱基丙烯酸 曱I旨共聚物、乙烯-乙酸乙烯酿共聚物(EVA)、乙烯-乙烯 醇共聚物)、及聚丙烯改質樹脂。 乙酸乙烯酯樹脂之例子包括聚乙酸乙烯酯、乙酸乙烯醋 -(甲基)丙烯酸酯共聚物、乙酸乙烯醋-乙烯基酯共聚物、 及乙酸乙烯酯-順丁烯二酸酯共聚物。 熱塑性彈膠之例子包括苯乙烯熱塑性彈膠(苯乙烯嵌段 共聚物,例如,具有不小於5重量百分比之苯乙烯含量的 苯乙稀嵌段共聚物)諸如SIS(苯乙烯-異戊二烯-苯乙烯嵌 段共聚物)、SBS(苯乙烯-丁二烯-苯乙烯嵌段共聚物)、 SEBS(苯乙烯-乙烯-丁烯-苯乙烯嵌段共聚物)、SEPS(苯乙 烯-乙烯-丙烯-苯乙烯嵌段共聚物)及SEP(苯乙烯-乙烯一丙 烯嵌段共聚物)、聚胺基曱酸酯熱塑性彈膠、聚酯熱塑性 彈膠、及摻混熱塑性彈膠諸如聚丙烯與EPT(三元乙烯—丙 烯橡膠)之聚合物摻混物。 (脂環飽和烴基樹脂) 關於脂環飽和烴基樹脂,可使用,例如,經由將芳族石 油樹脂(例如,基石油樹脂)完全氫化而製得之樹脂('有 時稱為「1曰J衣飽和石油樹脂」)。此一樹脂之明確的例 包括ESCOREZ5300 及ESC0REX5380(Exx〇n MobilC: \ 2D- (DDE \ 91 -〇4 \ 91100293.ptd page 8 555829 V. Description of the invention (5) (EAA) and ethylene-methacrylic acid copolymer (EMAA), ionomer, ethylene- (Fluorenyl) acrylate copolymers such as ethylene-acrylic acid methyl ester copolymers, ethylene-ethyl acrylate copolymers (EEA) and ethylene-fluorene-based acrylic acid ester copolymers, ethylene-vinyl acetate copolymers (EVA), Ethylene-vinyl alcohol copolymer), and polypropylene modified resin. Examples of the vinyl acetate resin include polyvinyl acetate, vinyl acetate- (meth) acrylate copolymer, vinyl acetate-vinyl ester copolymer, and vinyl acetate-maleate copolymer. Examples of thermoplastic elastomers include styrene thermoplastic elastomers (styrene block copolymers, for example, styrene block copolymers having a styrene content of not less than 5 weight percent) such as SIS (styrene-isoprene -Styrene block copolymer), SBS (styrene-butadiene-styrene block copolymer), SEBS (styrene-ethylene-butene-styrene block copolymer), SEPS (styrene-ethylene -Propylene-styrene block copolymers) and SEP (styrene-ethylene-propylene block copolymers), polyurethane thermoplastic elastomers, polyester thermoplastic elastomers, and blended thermoplastic elastomers such as polypropylene Polymer blend with EPT (Ternary ethylene-propylene rubber). (Alicyclic saturated hydrocarbon-based resin) As for the alicyclic saturated hydrocarbon-based resin, for example, a resin prepared by completely hydrogenating an aromatic petroleum resin (for example, a petroleum-based petroleum resin) ('sometimes referred to as "1" J clothing Saturated Petroleum Resin "). Specific examples of this resin include ESCOREZ5300 and ESC0REX5380 (Exxon Mobil

Corporation之產品的商品名)〇 此等脂環飽和經基樹脂可單獨使用或以其兩者以Corporation's product name) 〇 These alicyclic saturated warp-based resins can be used alone or as both

555829 五、發明說明(6) 一 合使用。在黏著層3係經由擠塑層合(其需要在高溫下熔 融)而形成的情況中’由對氧化安定性的觀點來看,脂環 飽和石油樹脂為特佳。 曰、 將作為增黏樹脂之脂環飽和烴基樹脂加入於黏著層3中 可改良缚起之效率,及使底蓋膠帶展現對搬運器帶材之穩 定且良好的黏著性。 ^ 以1 00份重量之基礎聚合物計,加入於黏著層中之脂環 飽和烴基樹脂之量係,例如,自約1至5〇份重量,以自9約5 至30份重量較佳。當以i 00份重量之基礎聚合物計,脂環 飽和烴基樹脂之量低於1份重量時,熔融的黏著劑組】物 無法黏著至支承基礎材料2 (無法得到黏固效應),如其為 紙張,則必需達成共擠塑或串聯擠塑層合,而非單單擠塑 層合而形成中間層。此外,所產生之底蓋膠帶幾乎無法且 有對搬運器帶材(紙張搬運器)之期望的黏著性。… 相對地,虽以1 〇 〇份重量之基礎聚合物計,脂環飽和烴 基樹脂之量超過5 〇份重量時,在黏著層3與在薄膜形成過 程中於擠塑之後立即經設置成與黏著層3接觸之金屬輥之 ,會發士黏連,而無法穩定地製造。此外,晶片零件會黏 著至黏著層3,而使其在製造電路板之步驟中很難 — 氣喷嘴吸取。 & (兩性表面活性劑、非離子表面活性劑) 關於待加入於黏著層3中之兩性表面活性劑及/或非離 子表面活性劑,可使用不含函原子及硫原子之表面活性 州使用此一不含鹵原子及硫原子之表面活性劑作為包含555829 V. Description of invention (6) Combined use. In the case where the adhesive layer 3 is formed by extrusion lamination (which needs to be melted at a high temperature), alicyclic saturated petroleum resin is particularly preferable from the viewpoint of oxidation stability. That is, adding an alicyclic saturated hydrocarbon-based resin as a tackifying resin to the adhesive layer 3 can improve the binding efficiency, and make the bottom cover tape exhibit stable and good adhesion to the carrier tape. ^ Based on 100 parts by weight of the base polymer, the amount of alicyclic saturated hydrocarbon-based resin added to the adhesive layer is, for example, from about 1 to 50 parts by weight, and preferably from 9 to 5 to 30 parts by weight. When the amount of the alicyclic saturated hydrocarbon-based resin is less than 1 part by weight based on the i 00 parts by weight of the base polymer, the molten adhesive group cannot adhere to the supporting base material 2 (the adhesion effect cannot be obtained), such as Paper, it is necessary to achieve co-extrusion or tandem extrusion lamination, not just extrusion lamination to form an intermediate layer. In addition, the bottom cover tape produced is almost impossible and has the desired adhesion to the carrier tape (paper carrier). … In contrast, although the amount of alicyclic saturated hydrocarbon-based resin is more than 50 parts by weight based on 100 parts by weight of the base polymer, the adhesive layer 3 and the film are formed immediately after extrusion by The metal rollers in contact with the adhesive layer 3 may become stuck and cannot be stably manufactured. In addition, the chip parts will adhere to the adhesive layer 3, making it difficult to suck the air nozzle in the step of manufacturing the circuit board. & (Amphoteric surfactant, non-ionic surfactant) As for the amphoteric surfactant and / or non-ionic surfactant to be added to the adhesive layer 3, a surface-active state containing no function atom and sulfur atom can be used. This surfactant containing no halogen and sulfur atoms is included as

555829555829

、發明說明(7) κ兩性表面活性劑及/或非離子表面活性劑之表面活性劑可 防止晶片零件中之電極的腐蝕。 在含有鹵原子的表面活性劑中,鹵原子大多係以齒離子 例如☆,氣離子)的形式存在。在含有硫原子的表面活性劑 ,硫原子大多係以硫酸根離子的形式存在。此等自離子 例如,氣離子)或硫酸根離子之存在會造成在晶片零件中 人為電極之金屬的腐蝕。然而,本發明之底蓋膠帶包括不 =鹵原子或;^原子(尤其分別係為函離子或硫酸根離子之 >式)之表面活性劑作為抗靜電劑,因此,其不會腐蝕 片零件中之電極。 兩性表面 面活性劑的 驗、及2-烧 可使用於 酯、脫水山 烷基苯基醚 嵌段共聚物 聚氧伸乙基 此等兩性 用或以其兩 活丨生W丨並無特殊之限制。可使用於此之兩性表 例子包括Ν,Ν-二曱基-Ν-烷基胺基乙酸甜菜 基一1 -經乙基-卜羧甲基咪唑啉端甜菜鹼。 此之非離子表面活性劑的例子包括甘油硫酸 梨糖醇脂族酸酯、蔗糖脂族酸酯、聚氧伸乙基 、=氧伸乙基烷基醚、聚氧伸乙基聚氧伸丙基 、、聚乙二醇脂族酸酯(聚氧伸乙基脂族酸酯)、 脫水山梨糖醇脂族酸酯、及脂族酸烷醇醯胺。 表面活性劑及/或非離子表面活性劑可單獨使 者以上的混合物使用。 物4 ίί或固體含量計算,以100份重量之基礎聚合 •至10伤重里較佳。當以i Q ◦份重量之基礎聚合物計表 點著層中之表面活性劑(兩性表面活性劑 及/或非離子表面活性劑)之量係自〇 .〗至2〇份重量,以自7. Description of the invention (7) Surfactants of κ amphoteric surfactants and / or non-ionic surfactants can prevent corrosion of electrodes in wafer parts. Among the surfactants containing halogen atoms, the halogen atoms are mostly present in the form of tooth ions (such as ☆, gas ions). In surfactants containing sulfur atoms, most of the sulfur atoms exist in the form of sulfate ions. The presence of these self ions (e.g., gas ions) or sulfate ions can cause corrosion of the metal of the artificial electrode in the wafer part. However, the bottom cover tape of the present invention includes a surfactant that is not = a halogen atom or a ^ atom (especially a > formula of a halide ion or a sulfate ion, respectively) as an antistatic agent, and therefore, it does not corrode sheet parts Electrode. The test of amphoteric surfactants and 2-burning can be used for esters, sorbitan phenyl ether block copolymers, polyoxyethylene, etc. There is no special feature for these amphoterics or their dual activities. limit. Examples of amphoteric forms that can be used for this include N, N-diamidyl-N-alkylaminoacetic acid betayl-beta-ethyl-p-carboxymethylimidazoline-terminated betaine. Examples of such nonionic surfactants include glycerol sulfate sorbitol aliphatic acid esters, sucrose aliphatic acid esters, polyoxyethyl groups, polyoxyethyl groups, polyoxyethyl groups, polyoxyethyl groups Group, polyethylene glycol aliphatic acid ester (polyoxyethylene ethyl aliphatic acid ester), sorbitan aliphatic acid ester, and aliphatic acid alkanolamine. The surfactant and / or nonionic surfactant may be used alone or in a mixture of two or more. Calculate 4 liters or solid content, polymerize based on 100 parts by weight. When i Q ◦ parts by weight of the base polymer, the amount of surfactant (amphoteric surfactant and / or non-ionic surfactant) in the piercing layer is from .0 to 20 parts by weight, from

555829 五、發明說明(8) 3 =劑:力:入量低於°,1份重量時’所產生之抗靜電性 々4化’有時會產生導致晶片零件黏著至黏著屉 其無法產生充分的抗靜電效果。更;細說明的 、田以1 00伤重量之基礎聚合物計,加入於黏著層 =性劑之量低於〇·丨份重量時,黏著層之表面電阻 1〇13Ω/平方(歐姆每平方),及黏著層之摩捧‘合超 〇〇〇伏特。相對地,當以1〇〇份重量之基礎聚人二超 加入於黏著層中之表面活性劑之量超過2〇份重 舌丨生劑會,參出至黏著層之表面或介面,氺面 ,體(搬運器帶材)之充分的黏著性。此 者層對支承基礎材料層2展現不充分的黏著性, 之 成黏著層3與支承基礎材料層2之介面的破壞。 、乂 氧化抑制 '除前述所 在本發明,黏著層3可包括添加劑諸如填料 劑、軟化劑、紫外光吸收劑、防銹劑、偶合劑 說明者外之抗靜電劑、及加入於其中之交聯劑^ 不ΠΓΛ厚度/適當地預定’只要其黏著性及操縱性 I會減扣即可。然而,實際上’其係自約5微米至5〇微 m著厚度低於5微米時,所產生之黏著層對搬 運盗帶材(黏附體)展現劣化的黏著性,且可能很難工才搬 ,當黏著層3之厚度超過5〇微米時’所產生 膠帶展現過大的總厚度’其會由於當其以連續長度製造盖 所產生之重量增加而導致操縱性或生產效率劣化的問題。、 在本發明,黏著層3之軟化點係自約60 t至】7(rc (自約了代幻㈣更佳卜當黏著層3之軟化點低於㈣ 第12頁 C:\2D-OODE\91-04\91100293.ptd )»829 五、發明說明(9) 時,待輸送之具有包封於其中 暴露至高溫高渴環境瘦解i ± Ba片π件的電子零件,當 ^ ^ 4VV!! ΐ ^ lt 時,薄膜形成需要提古^ /層3之权化點超過H〇0c 化,及柿a ΓI f同 度,其會使熱合(缚起)效率次 化,及使加入於黏著層3中 〜^ >又+ ^ 及/或非離子矣而年二中表劑(兩性表面活性劑 重从 ,性劑)蒸發,而減低抗靜電效果。 聚合物之種類ί 預疋構成黏著層3之基礎 素而調整 熱塑性樹脂、熱塑性彈膠)或其他因 至二著Ω層;Ϊ J Π阻率係自1〇8至,Ω…較佳(自1〇8 :預、疋構成黏著層3之樹脂、待加入於其中之添加劑諸: 表面f性劑(抗靜電劑)等等的種類及混合比例而調整。 黏著層3之摩擦電係不高於3, 〇〇〇伏特較佳(尤其係 於1,0 00伏jf寺)。黏著層3之摩擦電壓可經由適當地預定g 加入於黏著層3中之熱塑性黏著劑之種類、黏著層3之 等等而調整。 & 、,在本發明’黏著層3之表面糙度(平均糙度Ra)係自〇· 1微 米至20微米較佳(自1微米至丨8微米更佳)。當黏著層3之表 面糙度低於0 · 1微米時,所產生之黏著層與晶片零件具有 增加的接觸面積,而會使黏著層對晶片零件之黏著性提 高’及使晶片零件更容易黏著至黏著層。相對地,當黏著 層3之表面縫度超過2〇微米時,會產生黏著層在薄膜形成 過程中龜裂’或對搬運器帶材(黏附體)之黏著性下降的問555829 V. Description of the invention (8) 3 = Agent: Force: When the amount is less than °, when the weight is 1 part, the "generated antistatic property" will sometimes cause the chip parts to stick to the adhesive drawer, which cannot produce enough. Antistatic effect. In addition, based on the detailed description of the basic polymer with a weight of 100, Tian added to the adhesive layer = when the amount of sex agent is less than 0 · 丨 parts by weight, the surface resistance of the adhesive layer is 1013Ω / square (ohm per square) ), And the adhesive layer of Mopin 'He Chao 10000 volts. In contrast, when the amount of the surfactant added to the adhesive layer is more than 20 parts by weight based on 100 parts by weight, it will be added to the surface or interface of the adhesive layer. , Full adhesion of the body (conveyor strip). This layer exhibits insufficient adhesion to the supporting base material layer 2, resulting in the destruction of the interface between the adhesive layer 3 and the supporting base material layer 2. "Inhibition of oxidation" In addition to the present invention, the adhesive layer 3 may include additives such as fillers, softeners, ultraviolet light absorbers, rust inhibitors, antistatic agents other than those described in the coupling agent, and cross-linking added thereto. The agent ^ does not have a thickness of ΓΓΛ / determined appropriately, as long as its adhesion and handling I will be reduced. However, in fact, when the thickness is from about 5 micrometers to 50 micrometers and the thickness is less than 5 micrometers, the generated adhesive layer exhibits degraded adhesion to the handling of stolen tape (adhesives), and it may be difficult to work. When the thickness of the adhesive layer 3 exceeds 50 micrometers, the 'produced tape exhibits an excessively large thickness', which may cause a problem of deterioration in handling or production efficiency due to an increase in weight generated when the cover is manufactured in a continuous length. In the present invention, the softening point of the adhesive layer 3 is from about 60 t to) 7 (rc (It is better to reduce the generation time. When the softening point of the adhesive layer 3 is lower than ㈣) Page 12 C: \ 2D-OODE \ 91-04 \ 91100293.ptd) »829 5. In the description of the invention (9), the electronic parts to be transported have i ± Ba pieces which are thinned and exposed to high temperature and high thirst environment. When ^ ^ 4VV !! ΐ ^ lt, thin film formation needs to increase the weighting point of layer ^ / layer 3 over H0c, and the same degree of persimmon a ΓI f, which will reduce the heat sealing (tie) efficiency, and make the addition In the adhesive layer 3 ~ ^ > and + ^ and / or non-ionic, and the second surface preparation (amphoteric surfactant re-equivalent from the sex agent) evaporated in the second year, reducing the antistatic effect. Types of polymers 疋 疋The basic element constituting the adhesive layer 3 adjusts the thermoplastic resin, thermoplastic elastomer) or other reasons to the Ω layer; Ϊ J Π resistivity is from 108 to Ω, preferably (from 108: pre, 疋The resin constituting the adhesive layer 3 and the additives to be added to it are adjusted by the type and mixing ratio of the surface f-reactive agent (antistatic agent), etc. The triboelectricity of the adhesive layer 3 is not higher than 3,000 volts It is better (especially at 1,000 volt jf temple). The friction voltage of the adhesive layer 3 can be adjusted by appropriately pre-determining the type of thermoplastic adhesive added to the adhesive layer 3, the adhesive layer 3, and the like. & Amp In the present invention, the surface roughness (average roughness Ra) of the adhesive layer 3 is preferably from 0.1 μm to 20 μm (more preferably from 1 μm to 8 μm). When the surface of the adhesive layer 3 is rough When the degree is lower than 0 · 1 micron, the generated adhesive layer has an increased contact area with the chip part, which will increase the adhesion of the adhesive layer to the chip part 'and make the chip part more easily adhere to the adhesive layer. In contrast, When the surface seam of the adhesive layer 3 exceeds 20 micrometers, problems such as cracking of the adhesive layer during the film formation process or a decrease in the adhesiveness of the carrier tape (adhesive body) may occur.

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五、發明說明(ίο) 題0 在本發明,可將中間層插置於支承基礎材料層2與黏著 層3之間,以增進其間的黏著性。中間層可由熱塑^樹脂 諸如聚烯烴樹脂、熱塑性彈膠、橡膠等等所形成。烯5煙曰美 樹脂之例子包括低密度聚乙烯、線性低密度聚乙烯、=$ α -烯煙共聚物、及乙烯-乙酸乙烯酯共聚物。此等構成 中間層之成份可單獨使用或以其兩者以上的混合物使用。 中間層之厚度可適當地預定,只要底蓋膠帶之操縱性等等 不會減損即可,且其為,例如,自約〇微米至4 〇微米。並 不一定需設置中間層。 ” 本發明之底蓋膠帶1可例如,利用包括藉由雙螺桿捏合 機將黏著層3之組成成份以預定比例熔融摻混,及將摻混 物=粒,或以相同方式將組成成份乾混,然後再利用/一夂般 的單一或串聯擠塑層合方法插置或不插置中間層,而將經 =粒=摻混物或乾混物層合於支承基礎材料層2上的方法 製備得。或者,可將黏著層3及中間層共擠塑及層合於支 承基礎材料層2上,而製備得底蓋膠帶1。 圖2係使用中之包含圖丨所示之底蓋膠帶丨之供晶片型電 子零件用之搬運器材料的概略縱剖面圖。供晶片型電子 2用之搬運器材料4包括具有於其中以恆定間隔衝出用於 又日日片型電子零件之矩形孔洞7之搬運器帶材5,設置於 二運裔帶材5之下表面上的底蓋膠帶1,及設置於搬運器帶 之上下表面上的頂蓋膠帶6。將搬運器材料4在搬運器 帶材5之下表面與底蓋膠帶丨熱合,而於其中形成承接封V. Description of the Invention (ίο) Question 0 In the present invention, an intermediate layer can be interposed between the supporting base material layer 2 and the adhesive layer 3 to improve the adhesion therebetween. The intermediate layer may be formed of a thermoplastic resin such as a polyolefin resin, a thermoplastic elastomer, rubber, and the like. Examples of olefinic resins include low-density polyethylene, linear low-density polyethylene, α-olefinic copolymers, and ethylene-vinyl acetate copolymers. These components constituting the intermediate layer may be used alone or as a mixture of two or more thereof. The thickness of the intermediate layer may be appropriately determined as long as the handling properties of the bottom cover tape and the like are not impaired, and it is, for example, from about 0 μm to 40 μm. It is not necessary to set an intermediate layer. The bottom cover tape 1 of the present invention can be, for example, melt-blended in a predetermined ratio with the components of the adhesive layer 3 by using a twin-screw kneader, and blending the mixture = granules, or dry-mixing the components in the same manner. , And then use the usual single or tandem extrusion lamination method to insert or not insert the intermediate layer, and the method of laminating warp = grain = blend or dry blend on the supporting base material layer 2 It can be prepared. Alternatively, the adhesive layer 3 and the intermediate layer can be co-extruded and laminated on the supporting base material layer 2 to prepare the bottom cover tape 1. Figure 2 shows the bottom cover tape shown in Figure 丨 in use.丨 A schematic longitudinal cross-sectional view of a carrier material for wafer-type electronic parts. The carrier material 4 for wafer-type electronics 2 includes rectangular holes punched out at regular intervals in the wafer-type electronic parts. The carrier tape 5 of 7, the bottom cover tape 1 provided on the lower surface of the second carrier tape 5, and the top cover tape 6 provided on the upper and lower surfaces of the carrier tape. Place the carrier material 4 on the carrier The lower surface of the strip 5 is heat-sealed with the bottom cover tape, and is shaped in it. Cheng Chengfeng

555829 五、發明說明(11) 袋。將各晶片型電子零件8承接於各別的承接封袋中。缺 後將搬運器帶材5在其上表面上與頂蓋膠帶6 菩將 搬運器帶材5捲於捲軸上以供輸送。 接耆將 由於底蓋膠帶1之黏著層3係由包含特定 物、特定之增黏劑及特定之抗靜電劑(表面活性 =所:ί宜因而底蓋膠帶1及搬運器帶材5可彼此牢固曰 此而導致晶片零件8在輸送過程中掉落。材5㈣,因 曰,蓋膠帶1亦展現優異的抗靜電性質,因此可完 曰:片零件的黏严。更詳細說明,底蓋膠帶1可抑制或防止 :片零件8黏严至其黏著層3的表面。底蓋膠帶工亦可 s =即使係在儲存過程中於承接或包 ”片:件8的黏著或融合至其之黏著層3的表:件8之後 喷ί i:ΐ:零:ί著地增進於自動組裝系統中利用空氣 帶材移出並供給於板上。 #了將日日片零件自搬運器 :外拍由於黏著層3不含任何成份(例如,函離子 離子、硫化合物諸如硫酸根離氣 或防止晶片零件8之腐叙,^ β u而底盍膠帶1可抑制 異的腐蝕抑制性質。因此,而展現對於晶片零件之優 及儲存過程中Hr生的電ί:::1可作為增進在包裝 叮i Α , 罪性的電子零件輸送材料用。 零:製得之底蓋谬帶,以輸送晶片型電子 :ί 電阻器及層合陶瓷電容器。 本發明之底蓋膠帶包括由特定成份所形成的黏著層,因555829 V. Description of the invention (11) Bag. Each wafer-type electronic component 8 is received in a separate receiving envelope. After that, the carrier tape 5 and the top cover tape 6 are wound on the upper surface thereof, and the carrier tape 5 is wound on a reel for conveyance. Since the adhesive layer 3 of the bottom cover tape 1 is composed of a specific substance, a specific tackifier, and a specific antistatic agent (surface activity = so: 宜), the bottom cover tape 1 and the carrier tape 5 can be connected to each other. This will cause the chip part 8 to fall during transportation. Material 5㈣, because the cover tape 1 also exhibits excellent antistatic properties, so it can be completed: the stickiness of the sheet parts. In more detail, the bottom cover tape 1 can be suppressed or prevented: the sheet part 8 adheres tightly to the surface of its adhesive layer 3. The bottom cover tape maker can also s = even if it is received or packaged during storage "sheet: the adhesion of the piece 8 or the fusion to its adhesion Sheet of layer 3: sprayed after piece 8 i: ΐ: zero: ί landing is enhanced in the automatic assembly system using air strips to remove and supply to the board. # 了 Japan and Japan film parts from the carrier: outside shooting due to The adhesive layer 3 does not contain any components (for example, ionization of ions, sulfur compounds such as sulfate degassing, or prevention of corrosion of the wafer component 8, ^ β u, and the bottom tape 1 can suppress different corrosion-inhibiting properties. Therefore, it exhibits For the quality of wafer parts and the electricity generated by Hr in the storage process ::: 1 can be used Promote the packaging of electronic components for sinful electronic parts. Zero: The bottom cover tape is made to transport chip-type electronics: resistors and laminated ceramic capacitors. The bottom cover tape of the present invention includes The adhesive layer formed by the ingredients, because

C:\2D-CQDE\9l-04\91100293.ptd 第15頁 運器帶材之 優異的抗靜 似過程中產 零件之靜電 帶展現對於 本發明之底 因而晶片零 由在輪送、 所造成之瑕 件的黏著, ’及因此而 上。 步地說明於 所限制。 五、發明說明(12) 此而展現對於搬 底蓋膠帶亦展現 膠帶在輸送或類 抑制或防止晶片 本發明之底蓋膠 質。此外,由於 子之抗靜電劑, 因此,可消除 嘴抓取晶片零件 或排斥及晶片零 喷嘴的錯誤吸取 片零件供給於板 本發明將進一 發明解釋為受其 優異的熱黏著性質。本發明之 電性質。因此,本發明之底蓋 生極低的摩擦電壓,而使其可 吸引至黏著層之表面。因此, 晶片零件之優異的抗黏連性 蓋膠帶包括不含_原子或硫原 件中之電極不會被腐蝕。 剝離或類似過程中利用空氣喷 疵,諸如晶片零件的靜電吸引 而使其可消除晶片零件被空氣 於自動組裝系統中平順地將晶 以下的實施例中,但不應將本C: \ 2D-CQDE \ 9l-04 \ 91100293.ptd Page 15 The excellent static resistance of the parts produced during the process of the static strip of the conveyor belt shows the electrostatic belt for the bottom of the present invention. Therefore, the wafer is caused by rotation, Adhesion of flaws, 'and up. Explained in steps. V. Explanation of the invention (12) This shows that the tape for carrying the bottom cover also shows that the tape is transporting or similar. Inhibits or prevents the wafer. In addition, due to the antistatic agent of the product, it is possible to eliminate the mistake of sucking the wafer part by the mouth, or the erroneous suction of the wafer zero nozzle. The wafer part is supplied to the board. The present invention explains a further invention by its excellent thermal adhesive properties. Electrical properties of the invention. Therefore, the bottom cover of the present invention generates an extremely low friction voltage so that it can be attracted to the surface of the adhesive layer. Therefore, the excellent anti-adhesion property of the chip part, including the electrode which does not contain atoms or sulfur elements, will not be corroded. In the process of peeling or the like, air spray defects, such as electrostatic attraction of wafer parts, can be used to eliminate wafer parts being exposed to air in an automated assembly system.

實施例1 利用雙螺桿捏合機將100份重量之低密度聚乙烯(LDPE)Example 1 100 parts by weight of low-density polyethylene (LDPE) was prepared using a twin-screw kneader.

(商品名「LJ800」之基礎聚合物,MITSUBISHI CHEMICAL(Base polymer with brand name "LJ800", MITSUBISHI CHEMICAL

CORPORATION製造;密度:〇· 918克/立方公分;熔體流率 (MFR) : 20克/1 0分鐘;軟化點·· 82 °C )、20份重量之脂環 煙基樹脂(商品名「ESCOREZ5300」之增黏樹脂,ExxonManufactured by CORPORATION; Density: 0.918 g / cm3; Melt flow rate (MFR): 20 g / 10 minutes; Softening point: 82 ° C), 20 parts by weight of alicyclic tobacco-based resin (trade name " ESCOREZ5300 "Tackifying Resin, Exxon

Mobil Corporation製造)、及1.5份重量之非離子表面活 性劑(商品名「Non i on S-1 0」之抗靜電劑(聚氧伸乙基脂 族酸酯),N0F CORPORATION製造)在130°C之溫度下捏合30 分鐘,然後再切粒。接著將經切粒的摻混物在2 5 0 °C之溫Mobil Corporation) and 1.5 parts by weight of a non-ionic surfactant (trade name "Non i on S-1 0" antistatic agent (polyoxyethylene fatty acid ester), manufactured by NOF CORPORATION) at 130 ° Knead at a temperature of 30 minutes, and then cut into pellets. The pelletized blend is then heated at a temperature of 250 ° C.

555829 五、發明說明(13) 度下擠塑通過擠塑層合機而形成薄膜,然後將其層合於作 為支承基礎材料之和紙(厚度:4 〇微米;基準重量:1 9克 /平方米)上。然後將黏著層於和紙上層合至2 5微米之厚 度,而製得層合膠帶(底蓋膠帶)。如此製得之層合膠帶具 有5 5微米之總厚度及4微米之在其黏著層上的表面糙度 Ra ° 實施例2 以與實施例1相同之方式將丨〇 〇份重量之乙烯—乙酸乙烯 酯共聚物(EVA樹脂)(商品名「LV140」之基礎聚合物, MITSUBISHI CHEMICAL CORPORATION製造;乙酸乙烯酯含 量:2重量百分比;MFR : 1 · 5克/1 0分鐘;軟化點:87 °C)、10份重量之脂環烴基樹脂(商品名rESCOREZ538〇」 之增黏樹脂’Exxon Mobil Corporation製造)及5份重量 之非離子表面活性劑(商品名「AIMEX 300-LD」,Sanyo Chemical Industries,Ltd.製造)切粒。接著將經切粒的 摻混物在2 2 0 °C之溫度下擠塑通過擠塑層合機而形成薄 膜’然後將其層合於作為支承基礎材料之和紙(厚度:4 〇 微米;基準重量:1 8克/平方米)上。然後將黏著層於和 紙上層合至2 0微米之厚度,而製得具有5 0微米之總厚度的 層合膠帶(底蓋膠帶)。其後將層合膠帶喷砂,以致黏著層 之表面縫度R a為1 5微米。 實施例3555829 V. Description of the invention (13) Extrusion is carried out to form a thin film through an extrusion laminator, and then it is laminated on a sum paper (thickness: 40 microns; reference weight: 19 g / m2) as a supporting base material. )on. Then, the adhesive layer was laminated on the paper to a thickness of 25 micrometers to prepare a laminated tape (bottom cover tape). The thus-produced laminated tape had a total thickness of 55 micrometers and a surface roughness Ra of 4 micrometers on its adhesive layer. Example 2 In the same manner as in Example 1, 100 parts by weight of ethylene-acetic acid was used. Vinyl Ester Copolymer (EVA Resin) (basic polymer with trade name "LV140", manufactured by MITSUBISHI CHEMICAL CORPORATION; vinyl acetate content: 2% by weight; MFR: 1 · 5 g / 10 minutes; softening point: 87 ° C ), 10 parts by weight of an alicyclic hydrocarbon-based resin (trade name rESCOREZ538〇), a tackifier resin made by Exxon Mobil Corporation, and 5 parts by weight of a nonionic surfactant (trade name "AIMEX 300-LD", Sanyo Chemical Industries, Ltd.). The pelletized blend is then extruded at 220 ° C through an extrusion laminator to form a film ', and then laminated to a sum paper (thickness: 40 microns; benchmark for the base material) Weight: 18 g / m2). Then, the adhesive layer was laminated on the paper to a thickness of 20 µm, and a laminated tape (bottom cover tape) having a total thickness of 50 µm was prepared. Thereafter, the laminated tape was sandblasted so that the surface seam Ra of the adhesive layer was 15 m. Example 3

利用班伯里(Banbury )混合機將1 〇〇份重量之低密度聚乙 烯(LDPE)(商品名「LJ800」之基礎聚合物,MITSUBISHIUsing a Banbury mixer, 100 parts by weight of a low-density polyethylene (LDPE) (trade name "LJ800" base polymer, MITSUBISHI

C:\2D-00DE\91-04\91100293.ptd 第17頁 555829 五、發明說明(14) CHEMICAL CORPORATION 製造;密度:0.918 克 / 立方公 分;溶體流率(M F R) : 2 0克/1 0分鐘;軟化點:8 2 °C )、2 0 份重量之脂環烴基樹脂(商品名「ESCOREZ5300」之增黏樹 脂’Exxon Mobil Corporation製造)、及2份重量之聚乙 二醇(抗靜電劑;非離子表面活性劑)捏合,然後再切粒。 接者將經切粒的推混物在2 5 0 C之溫度下擠塑通過擠塑声 合機而形成薄膜,然後將其層合於作為支承基礎材料之和 紙(异度.25微米,基準重里.14克/平方米)上。然後將 黏著層於和紙上層合至2 5微米之厚度,而製得層合膠帶 (底蓋膠帶)。如此製得之層合朦帶具有5 0微米之總厚度及 3微米之在其黏著層上的表面糙度Ra。 达較實施例1 透過擠塑層合機將低密度聚乙烯(商品名「LJ800」, MITSUBISHI CHEMICAL CORPORATION 製造;密度:〇.918克 /立方公分;MFR ·· 20克/1 0分鐘;軟化點:82 °C )層合於 作為支承基礎材料層之和紙(厚度:4 0微米;基準重量: 1 8克/平方米)上,而製得具有5 5微米之總厚度及〇. 〇 5微 米之在其黏著層上之表面糙度Ra的層合膠帶。 比較實施例2 於100份重量之直鏈低密度聚乙烯(商品名「UF240」, MITSUBISHI CHEMICAL CORPORATION 製造;密度:〇·923 克 /立方公分;MFR : 2克/10分鐘;軟化點:85。〇中加入5 份重量之第四銨鹽(陽離子性抗靜電劑)。利用捏合機捏合 混合物,然後再透過擠塑層合機擠塑層合於作為支承基礎C: \ 2D-00DE \ 91-04 \ 91100293.ptd Page 17 555829 5. Description of the invention (14) Manufactured by Chemical Corporation; density: 0.918 g / cm3; solution flow rate (MFR): 20 g / 1 0 minutes; softening point: 8 2 ° C), 20 parts by weight of an alicyclic hydrocarbon-based resin (trade name “ESCOREZ 5300” tackifying resin manufactured by Exxon Mobil Corporation), and 2 parts by weight of polyethylene glycol (antistatic Agents; non-ionic surfactants) are kneaded and then pelletized. The person then extruded the pelletized push mixture at a temperature of 250 ° C to form a film through an extrusion sound coupling machine, and then laminated it to a sum paper (anisotropy. 25 microns, reference Weight.14g / m2). Then, the adhesive layer was laminated on the paper to a thickness of 25 μm to prepare a laminated tape (bottom cover tape). The thus-obtained laminated tape has a total thickness of 50 micrometers and a surface roughness Ra of 3 micrometers on its adhesive layer. Comparative Example 1 A low-density polyethylene (trade name "LJ800", manufactured by MITSUBISHI CHEMICAL CORPORATION) was extruded through an extrusion laminator; density: 0.918 g / cm3; MFR · 20 g / 10 minutes; softening point : 82 ° C) laminated on a sum paper (thickness: 40 micrometers; reference weight: 18 g / m 2) as a supporting base material layer to obtain a total thickness of 55 micrometers and 0.05 micrometers Laminated tape with surface roughness Ra on its adhesive layer. Comparative Example 2 100 parts by weight of a linear low-density polyethylene (trade name "UF240", manufactured by MITSUBISHI CHEMICAL CORPORATION; density: 0.923 g / cm3; MFR: 2 g / 10 minutes; softening point: 85. 〇Add 5 parts by weight of the fourth ammonium salt (cationic antistatic agent). Knead the mixture with a kneader, and then extrude and laminate it on the support base with an extrusion laminator.

C:\2D-C0DE\91-04\91100293.ptd 第18頁 555829 五、發明說明(15) 材料層之和紙(厚度:35微米;基準重量:15克〆平方米) 上,而製得具有50米之總厚度及〇.5微米之在其黏著層 之表面链度Ra的層合膠帶。 評估試驗 使於貫施例及比較實施例中如此製得之層合膠帶各進行 以下之试驗。結果記述於表1。 (拉伸強度及伸長率) 使用拉力计在3 0 0毫米/分鐘之拉引速率下測量層合膠 帶的拉伸強度(牛頓/5. 25毫米)及伸長率(牛頓/5. 25毫 米)。 (黏著性) 利用熱合機(Tokyo Weld Co.,Ltd·製造之帶纏機器)在 170 C之溫度、1.5公斤力(14.7牛頓)之熨斗壓緊力及 1,200 PCS /分鐘下’將層合膠帶熱合至紙張搬運器 (H0CT0-60 ’HOKUETU PAPER MILLS,LTD·製造)之表面。 使用剝離試驗機器在300毫米/分鐘之剝離速率及wo。之 剝離角度下,測量層合膠帶之黏著性(黏著力)。 (表面電阻率) 使用高電阻率計H ires tor UP (MITSUBISH I CHEMICAL CORPORATION製造),於23。(:及65%RH之大氣中及於500伏特 3 0秒下各別測量各種層合膠帶之表面電阻率(q )。 (摩擦電壓) 根據J I S L 1 0 9 4,各別測量各種層合膠帶於其黏著層側 上的摩擦電壓(伏特)。C: \ 2D-C0DE \ 91-04 \ 91100293.ptd Page 18 555829 V. Description of the invention (15) The sum of the material layers (thickness: 35 microns; reference weight: 15 grams per square meter) Laminated tape with a total thickness of 50 meters and a chain degree Ra of 0.5 m on the surface of its adhesive layer. Evaluation test Each of the laminated tapes thus obtained in the Examples and Comparative Examples was subjected to the following tests. The results are described in Table 1. (Tensile Strength and Elongation) The tensile strength (Newton / 5. 25 mm) and elongation (Newton / 5. 25 mm) of the laminated tape were measured at a pull rate of 300 mm / min using a tensile meter. . (Adhesiveness) Using a heat sealing machine (tape winding machine manufactured by Tokyo Weld Co., Ltd.) at a temperature of 170 C, an iron pressing force of 1.5 kgf (14.7 Newtons), and 1,200 PCS / min The laminated tape was heat-sealed to the surface of a paper carrier (H0CT0-60 'HOKUETU PAPER MILLS, LTD.'). A peel test machine was used at a peel rate of 300 mm / min and wo. At the peeling angle, the adhesion (adhesion) of the laminated tape was measured. (Surface resistivity) Hires tor UP (manufactured by MITSUBISH I CHEMICAL CORPORATION), a high resistivity meter, was used at 23. (: And 65% RH in the atmosphere and 500 volts and 30 seconds each to measure the surface resistivity (q) of various laminated tapes. (Friction voltage) According to JISL 10 94, each measured various laminated tapes Friction voltage (volts) on its adhesive layer side.

乃:>829Is: > 829

(腐餘抑制性質) 將各種層合膠帶久 (Ni箔)。麸後將;之黏著層側上熱接觸黏合至鎳箔 小時。缺ί將展二曰箱於6〇°C&9〇%RH之環境中儲存100 程度。;…L;二膠帶INi猪剝離。接著檢查Nii§的變色 此而接1二見、交色的1箔判定為「G(良好)」。將在一 二積頌現變色的Ni箔判定為rF(普通)」。將 積顯現變色的Ni箔判定為「p(差)」。 、 (離子萃取) :各種層合膠帶之黏著層的材料各以切粒形態浸泡於 中。然後使切粒材料在1〇〇°C之溫度在迴流下 沸騰4 5为鉍,以卒取離子成份。使如此得到的萃取液冷 部,然後進行離子層析術,以測定其中所包含之氣離^ (C1 )及硫酸根離子(so^-)的偵測量(萃取量)(ppm)。在下 表1中,「ND」係代表「未偵測」。 實施例編號 比較實施例編號 1 2 3 1 2 拉伸強度 (N/5.25mm) 10 11 10 10 8 伸長率(N/5.25mm) 3 2 3 2 1.5 黏著性(N/5.25mm) 300< 150 250< 200< 120 表面電阻率(〇) 1x10'° 5xl08 3xl08 1χ10|4< lxlO9 摩擦電壓(V) 170 100 35 3,200 15 腐蝕抑制性質 G G G G F〜P 離子萃取 氯離子(ppm) ND ND ND ND 28 硫酸根離子(ppm) ND ND ND ND 4 如可於上表1所見,根據實施例之底蓋膠帶對搬運器帶(Residue suppression property) Various laminated tapes (Ni foil) for a long time. After bran, heat contact the side of the adhesive layer to nickel foil for hours. The box will be stored at 100 ° C in an environment of 60 ° C & 90% RH. ; ... L; Two tape INi pig peeling. Next, check the discoloration of Nii §. Then, the 1 foil that saw each other and crossed the color was judged as "G (good)". The Ni foil showing discoloration at the time of product accumulation was judged as rF (normal). " The Ni foil exhibiting discoloration was judged to be "p (poor)". (Ion extraction): The materials of the adhesive layers of various laminated tapes are immersed in pellets. The pelletized material was then boiled at a temperature of 100 ° C under reflux for 45 to bismuth to extract the ionic components. The thus-obtained extract was cooled and then subjected to ion chromatography to determine the detection amount (extraction amount) (ppm) of the gas ionization (C1) and sulfate ion (so ^-) contained therein. In Table 1 below, "ND" stands for "Not Detected". Example No. Comparative Example No. 1 2 3 1 2 Tensile strength (N / 5.25mm) 10 11 10 10 8 Elongation (N / 5.25mm) 3 2 3 2 1.5 Adhesiveness (N / 5.25mm) 300 < 150 250 < 200 < 120 Surface resistivity (〇) 1x10 '° 5xl08 3xl08 1x10 | 4 < lxlO9 Friction voltage (V) 170 100 35 3,200 15 Corrosion inhibition properties GGGGF ~ P Ion extraction chloride ion (ppm) ND ND ND ND 28 Sulfuric acid Root ion (ppm) ND ND ND ND 4 As can be seen in Table 1 above, according to the bottom cover tape of the example to the carrier belt

五、發明說明(17) 材展現良好的黏著性。實施 壓,並於其黏著層上展現低 &盍膠帶產生低的摩擦電 晶片之黏Ϊ。jt外,與晶片零件接觸之黏著^卩制或防止 或硫酸根離子’因此其不會腐蝕N卜因此,以氣,子 膠帶的腐蝕抑制性質亦優異。 只施例之底蓋 ^申凊案係以200 1年!月η日提出申請之日本 ^欠200卜003710為基礎,將其之全體内容併入 % 考舅料,如同經詳盡記述。 本文為參 立件編號之説日$ 1 2 3 4 5 8 底蓋膠帶 支承基礎材料層 黏著層 供晶片型電+贷> m 从 电十零件用之搬運器材料 搬運器帶材 頂蓋膠帶 晶片型電子零件 晶片型電子零件5. Description of the invention (17) The material exhibits good adhesion. It is pressed and exhibits a low & adhesive tape on its adhesive layer to produce a low triboelectric chip adhesion. In addition, the adhesive contact with the chip part can be prevented or prevented or sulfate ion 'so that it will not corrode Nb. Therefore, the gas and the tape have excellent corrosion inhibitory properties. Only the bottom cover of the example On the basis of Japan ’s application owed on July ^ 200, 003710, the entire content of the application is incorporated into the% examination materials, as described in detail. This article refers to the part number. $ 1 2 3 4 5 8 Bottom cover tape support base material layer Adhesive layer for wafer-type electricity + loan &m; m Carrier material carrier for electric ten parts Tape top cover tape Wafer-type electronic parts

555829 圖式簡單說明 圖1係說明本發明之底蓋膠帶之一具體實施例的概略剖 面圖;及 圖2係說明使用中之包含圖1之底蓋膠帶之供晶片型電子 零件用之搬運器材料的概略縱剖面圖。555829 Brief description of the drawings Figure 1 is a schematic cross-sectional view illustrating a specific embodiment of the bottom cover tape of the present invention; and Fig. 2 is a diagram illustrating a carrier for wafer-type electronic parts including the bottom cover tape of Fig. 1 in use A rough longitudinal section of the material.

C:\2D-00DE\91-04\91100293.ptd 第22頁C: \ 2D-00DE \ 91-04 \ 91100293.ptd Page 22

Claims (1)

1« <命100龜 年 月 曰 修正 9|以〇 1 ·二種供電子零件搬運器用之底蓋膠帶,其包括:支承 基礎材料層;及黏著層’其中,該黏著層包含相對於1 0 〇 份重量之由如稀烛樹脂、乙酸乙稀S旨樹脂、聚S旨樹脂及苯 乙烯樹脂之熱塑性樹脂、熱塑性彈膠之至少一種以上所組 成之基礎聚合物中’含有1至5 0份重量之脂環飽和煙樹 脂;及0 · 1至2 0份重量之不含鹵原子及硫原子之兩性表面 活性劑及不含鹵原子及硫原子之非離子表面活性劑的至小 一者0 2 ·如申請專利範圍第1項之供電子零件搬運器用之底笔 膠帶,其中,該黏著層具有自5微米至50微米之厚度,自 6 0 °C至170 °C之軟化點,及自108至ΙΟ13 Ω /平方之表面 阻率。 電 3·如申請專利範圍第1項之供電子零件搬運器用之广^ 膠帶,其中,該黏著層具有自〇 · 1微米至2 〇微米之矣f盒 度。 丁又表面糙 4 ·如申請專利範圍第2項之供電子零件搬運器用 ^ 膠帶,其中,該黏著層具有自〇· ;1微米至2〇微米 底蓋 度。 心表面糙 5 ·如申請專利範圍第1項之供電子零件搬運器 膠帶,其中,該黏著層展現〇至3, 0 0 0伏特之摩棒底蓋 6·如申請專利範圍第2項之供電子零件搬運器\ W 膠帶,其中,該黏著層展現〇至3, 〇〇〇伏特之摩氏蓋 7·如申請專利範圍第3項之供電子零件搬運器m。# 膠帶,其中,該黏著層展現〇至3,〇〇〇伏特之摩擦電壓氏蓋1 «< Destination 100 Years of the Turtle Revised 9 | 〇1 · Two kinds of bottom cover tapes for carrier parts for power supply parts, including: a supporting base material layer; and an adhesive layer ', wherein the adhesive layer contains a relative to 1 The base polymer consisting of at least one type of thermoplastic resin such as thin candle resin, ethyl acetate S resin, poly S resin, styrene resin, and thermoplastic elastomer contains 0 to 0 0 parts by weight. Parts by weight of alicyclic saturated tobacco resin; and at least one of 0.1 to 20 parts by weight of amphoteric surfactants containing no halogen and sulfur atoms and nonionic surfactants containing no halogen and sulfur atoms 0 2 · The underlay tape for the carrier of electric parts as claimed in item 1 of the patent application range, wherein the adhesive layer has a thickness from 5 to 50 microns, a softening point from 60 ° C to 170 ° C, and Surface resistivity from 108 to 1013 Ω / square. Electricity 3. The wide adhesive tape for the carrier of the electric component parts as described in the first item of the patent application scope, wherein the adhesive layer has a 盒 f box degree from 0.1 μm to 20 μm. Ding also has a rough surface. 4) For example, the adhesive tape for a carrier of an electric component part No. 2 in the scope of patent application, wherein the adhesive layer has a bottom cover of from 0 to 1 micrometer to 20 micrometers. Rough surface of the heart 5. As in the case of the patent application scope item 1, the tape of the carrier tape carrier, wherein the adhesive layer shows 0 to 3,00 volts of the bottom cover of the motorcycle 6. As the patent application scope item 2 provides Electronic part carrier \ W tape, in which the adhesive layer exhibits Mohs cover of 0 to 3,000 volts. 7. The electric part carrier m as described in the scope of patent application No. 3. # Adhesive tape, wherein the adhesive layer exhibits a friction voltage cover of 0 to 3,000 volts 555829 _案號91100293_年月 曰 修正产·_ 六、申請專利範圍 8.如申請專利範圍第4項之供電子零件搬運器用之底蓋 膠帶,其中,該黏著層展現〇至3, 0 0 0伏特之摩擦電壓。555829 _Case No. 91100293_ Modified production date of the year of the year. 6. Application for Patent Scope 8. For example, the bottom cover tape for the carrier parts carrier of the patent application No. 4, in which the adhesive layer shows 0 to 3, 0 0 Friction voltage of 0 volts. C:\專利案件總檔案\91\911〇〇293\911〇〇293(替換H.ptc第24頁C: \ Patent Case File \ 91 \ 911〇〇293 \ 911〇〇293 (Replaces H.ptc, page 24
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JP2005306460A (en) * 2004-04-26 2005-11-04 Denki Kagaku Kogyo Kk Cover tape and electronic part packaging carrier tape system
JP4766863B2 (en) * 2004-10-22 2011-09-07 電気化学工業株式会社 Cover tape and carrier tape system for packaging electronic components
JP4710072B2 (en) * 2004-06-23 2011-06-29 電気化学工業株式会社 Cover tape
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JP4444814B2 (en) * 2004-12-28 2010-03-31 信越ポリマー株式会社 Cover tape and electronic component packaging
JP6758801B2 (en) * 2015-03-20 2020-09-23 株式会社サンエー化研 Surface protective film
JP2018193121A (en) * 2017-05-22 2018-12-06 Koa株式会社 Bottom cover tape
JP7211239B2 (en) * 2018-06-25 2023-01-24 Tdk株式会社 How to store electronic components
JP7324049B2 (en) * 2019-05-24 2023-08-09 株式会社ダイセル semiconductor equipment
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CN114787052A (en) * 2019-12-10 2022-07-22 住友电木株式会社 Cover tape and electronic component package
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