JP2003292033A - Bottom cover tape for conveying electronic component, and electronic component conveyer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a bottom cover tape for conveying an electronic component, which is excellent in adhesion to a carrier material and prevention of adhesion of a chip component, and an electronic component conveyer. <P>SOLUTION: The bottom cover tape for conveying the electronic component is bonded to the carrier material so as to cover the bottom surface of a hole for housing the electronic component, which is formed in the carrier material of the electronic component conveyer. The bottom cover tape is characterized by having an adhesive layer in which at least a surface is uneven. The adhesive layer having the uneven surface can also be formed as a porous adhesive layer. The electronic component conveyer is characterized in that the bottom cover tape is bonded to the carrier material so as to cover the bottom surface of the hole for housing the electronic component. The electronic component can be housed in the hole for housing the electronic component. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bottom cover tape for carrying electronic parts, which is used for carrying electronic parts such as chip-type electronic parts. The present invention relates to a bottom cover tape for transporting electronic components.

[0002]

2. Description of the Related Art Electronic components such as chip-type resistors (multilayer ceramic capacitors) and other chip-type electronic components (chip components) are conveyed by storing chip-type electronic components at regular intervals in the lengthwise direction of tape-shaped cardboard. The bottom surface of the paper carrier (carrier material) in which punching square holes are formed is heat-sealed (taping) with a bottom cover tape to create a storage pocket, and immediately after that, a chip-type electronic component is inserted into the storage pocket, A series of taping reel systems are widely used in which the upper surface of the paper carrier is heat-sealed with a top cover tape to enclose the chip-type electronic components, and then the reels are wound and conveyed. Then, in the process of manufacturing the circuit board etc. of the transfer destination, after the top cover tape is peeled off, the automatic assembly system that automatically sucks the stored chip type electronic components with the air nozzle and supplies them onto the substrate becomes the mainstream. ing.

In such an automatic incorporation system, a bottom cover tape is used by adhering it to a carrier material, and it is important that the bottom cover tape has good adhesion to the carrier material. Also, so-called "chip adhesion prevention", in which chips do not adhere to the adhesive layer due to static electricity generated during taping work or during vibration during transportation.
It is important to have (adhesion suppressing effect).

The bottom cover tape used in the taping method as described above has conventionally used a thin paper such as Japanese paper or thin paper as a base material (support base material), and a polyolefin resin on the entire surface of the support base material. An adhesive having an adhesive layer used as an adhesive is used. In addition, the adhesive layer of the conventional bottom cover tape has an antistatic treatment (such as coating and kneading).
And so on.

In recent years, chip parts have become lighter, thinner and smaller, such as lighter, thinner and smaller, and the size of the parts has been shifting to very small and light. Therefore, even if a small amount of static electricity is generated, the entire lower surface of the chip component is bonded to the adhesive layer, so that the chip component easily adheres to the adhesive layer. Especially, the bottom cover tape is heat-sealed to the carrier material. The adhesive layer in the storage pocket is easily flattened (smoothed) by the heat of the bonding, and the chip component is easily attached to the adhesive layer.

Further, in the bottom cover tape, since the adhesive layer is formed on the entire surface of the supporting base material, moisture necessary for the antistatic agent is blocked, and the antistatic function is reduced. Also from the point, the adhesion preventive property of the chip parts was deteriorated.

[0007]

Accordingly, the object of the present invention is to provide excellent adhesion to a carrier material and
An object of the present invention is to provide a bottom cover tape for transporting electronic components and an electronic component transporter that have excellent chip component adhesion preventing properties. Another object of the present invention is to further provide an electronic component carrying bottom cover tape and an electronic component carrying body capable of effectively exhibiting antistatic property and further enhancing chip component adhesion preventing property. It is in. Still another object of the present invention is to provide a bottom cover tape for carrying electronic parts and an electronic part carrier which are excellent in picking up chip parts and can enhance the mountability of chip parts on a substrate.

[0008]

Means for Solving the Problems The inventors of the present invention have conducted extensive studies to achieve the above object, and as a result, as a bottom cover tape, a bottom cover having an adhesive layer having an uneven surface on a supporting base material. When using a tape, the contact area between the chip component and the adhesive layer is reduced because the surface of the adhesive layer is uneven, and as a result, it was found that the adhesion preventing property of the chip component can be improved, The present invention has been completed.

That is, the present invention is a bottom cover tape adhered to a carrier material so as to cover a bottom surface of an electronic component storage hole formed in a carrier material in an electronic component carrier, wherein the bottom cover tape is Provided is a bottom cover tape for transporting electronic parts, wherein at least the surface has an adhesive layer having an uneven shape.

As the adhesive layer having an uneven surface, a porous adhesive layer can be preferably used. Such a porous adhesive layer is preferably formed by fibrous applying an adhesive on a supporting substrate. The bottom cover tape for transporting electronic components may be subjected to antistatic treatment or conductive treatment. The supporting base material in the bottom cover tape is preferably a porous supporting base material.

Further, according to the present invention, the bottom cover tape for carrying electronic parts is adhered to a carrier material so as to cover a bottom surface of an electronic part housing hole formed in the carrier material. A component carrier is provided. In this electronic component carrier, it is preferable that the electronic components are stored in the electronic component storage holes formed in the carrier material.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings as necessary. FIG. 1 is a schematic sectional view showing an example of a bottom cover tape for carrying electronic parts of the present invention. In FIG. 1, 1 is a bottom cover tape, 2 is a support base material, and 3 is an adhesive layer having an uneven surface (may be referred to as “surface uneven adhesive layer”). The bottom cover tape 1 is composed of a supporting base material 2 and a surface uneven adhesive layer 3 provided on the supporting base material 2.

(Supporting Base Material 2) The supporting base material constituting the supporting base material 2 may be any one having self-supporting property,
For example, Japanese paper, thin paper, crepe paper, synthetic paper, mixed paper,
Paper such as composite paper; non-woven fabric, cloth; olefin resin such as polyethylene, polypropylene, ethylene-acid copolymer resin, polypropylene modified resin, thermoplastic elastomer such as styrene thermoplastic elastomer, polyethylene terephthalate, polybutylene terephthalate, polyethylene na Examples thereof include a plastic film or sheet formed of a thermoplastic resin such as polyester such as phthalate, polyamide, or polyimide; a metal foil or a thin plate formed of a metal such as copper or aluminum; a laminate of these.

In the present invention, the supporting base material 2 is preferably formed of a support that allows moisture to pass through. Therefore, as the supporting base material, a supporting base material having porosity (porous supporting base material) is suitable. in this way,
When a porous support substrate is used as the support substrate, it becomes possible to take in moisture from the external environment,
The antistatic function can be effectively enhanced. In particular, when the surface unevenness adhesive layer 3 is a porous adhesive layer as described below, both the supporting base material 2 and the surface unevenness adhesive layer 3 have porosity, and therefore, Since the humidity of the external environment can be taken in, the antistatic function can be further enhanced.

The pores in the porous supporting base material may be open-cell-shaped pores or closed-cell-shaped pores. As the porous support substrate, a fibrous support substrate (for example, a woven fabric substrate or a non-woven fabric substrate),
Examples thereof include porous support base materials (sponge-like plastic base materials, etc.). Specifically, the fibrous supporting substrate includes a supporting substrate made of paper (for example, Japanese paper, thin paper, etc.), and the porous supporting substrate includes a supporting substrate made of plastic (for example, porous substrate). Quality polyester etc.) etc. are included. As the porous supporting base material, a fibrous or porous supporting base material capable of exhibiting excellent air permeability is suitable.

The supporting substrate 2 may be a single body or a laminated body.

The supporting base material preferably has a melting point of 90 ° C. or higher. If the melting point is lower than 90 ° C, the supporting base material may melt and adhere to the iron or the like when taping is performed by thermocompression bonding using a metal iron or the like, and the original purpose of the cover may not be achieved. There is.

The surface of the supporting base material 2 (the surface on the surface uneven adhesive layer 3 side, the surface opposite to the surface uneven adhesive layer 3 or both surfaces thereof) is subjected to conventional surface treatment, slipping treatment, charging. A preventive treatment, a conductive treatment, a laminating treatment (such as a laminating treatment with a metal foil or the like) may be performed. Further, depending on the case, a water retention treatment may be performed by mixing a water retention agent or the like or coating. Furthermore, the surface of the supporting base material 2 on the surface uneven adhesive layer 3 side may be subjected to a treatment such as ozone treatment or corona treatment for improving the anchoring property. Further, in order to improve the adhesiveness with the surface unevenness adhesive layer 3, the surface of the support base 2 on the surface unevenness adhesive layer 3 side may be subjected to an adhesion treatment. Furthermore, in order to reduce frictional electrification and the like of the supporting base material, the surface of the supporting base material 2 opposite to the surface uneven adhesive layer 3 can be made uneven.

The thickness of the supporting base material 2 can be selected within a wide range according to the application as long as the mechanical strength and handling property are not impaired, but it is generally about 5 to 100 μm, preferably about 10 to 50 μm. .

(Surface Uneven Adhesive Layer 3) The surface uneven adhesive layer 3 is an adhesive layer in which at least the surface is uneven. Therefore, in the present invention, since the surface of the adhesive layer for adhering the chip component is uneven, the contact area between the surface uneven adhesive layer 3 and the chip component is reduced. It is possible to suppress or prevent the adhesive force of the chip component from increasing.

The uneven surface of the adhesive layer 3 has an uneven surface.
A recess or a hole is formed, and as the hole, a through hole,
It may be any of non-through holes. Surface uneven adhesive layer 3
As the above, an adhesive layer (porous adhesive layer) having a surface with irregularities due to having porosity is preferable. Specifically, as such a porous adhesive layer,
Examples include fibrous adhesive layers (for example, woven or non-woven adhesive layers) and porous adhesive layers (sponge-like adhesive layers). To be

In particular, in the present invention, the surface uneven adhesive layer 3 is a porous adhesive layer having through holes (for example, a porous adhesive having a fibrous porosity such as a woven cloth shape or a non-woven cloth shape). Since it is a layer), air permeability can be enhanced, and thus moisture can be taken in. Therefore, the antistatic property can be effectively exhibited, and the generation of static electricity can be effectively prevented. Therefore, when the surface uneven adhesive layer 3 is a porous adhesive layer having a through hole (particularly, a fibrous porous adhesive layer), it is possible to suppress or prevent the adhesive force of the chip component from increasing due to static electricity. be able to. Moreover, by effectively preventing the generation of static electricity, it is possible to suppress or prevent the adverse effect of static electricity on the electronic components enclosed in the electronic component carrier in which the bottom cover tape 1 is used.

The adhesive constituting the surface uneven adhesive layer 3 (particularly, the porous adhesive layer) is not particularly limited,
For example, an adhesive having a hot melt adhesive component or a thermosetting adhesive component as the adhesive component can be used. As the adhesive forming the surface uneven adhesive layer 3 such as a porous adhesive layer, an adhesive having a hot-melt adhesive component as an adhesive component is preferable. As such a hot-melt adhesive component, an adhesive component containing a thermoplastic resin, an elastomer (thermoplastic elastomer, etc.) as a base polymer can be preferably used. Examples of the thermoplastic resin of the base polymer include polyolefin resin, polyester resin, styrene resin, acrylic resin, vinyl acetate resin, and the like. The base polymers may be used alone or in combination of two or more.

As the polyolefin resin, for example,
Polyethylene (low density polyethylene, linear low density polyethylene, metallocene catalyzed polyethylene, medium density polyethylene, high density polyethylene, etc.), polypropylene,
Polyolefin such as α-olefin copolymer (ethylene-propylene copolymer, ethylene-butene-1 copolymer, propylene-butene-1 copolymer, etc.); ethylene-based copolymer [eg, ethylene-acrylic acid copolymer Polymer (EAA), ethylene-methacrylic acid copolymer (EMA
A) and other ethylene-unsaturated carboxylic acid copolymers; ionomers; ethylene-methyl acrylate copolymers, ethylene-ethyl acrylate copolymers (EEA), ethylene-methyl methacrylate copolymers and other ethylene- ( (Meth) acrylic acid ester copolymer; ethylene-vinyl acetate copolymer (EVA); ethylene-vinyl alcohol copolymer and the like]; polypropylene modified resin and the like.

Further, a thermoplastic elastomer (synthetic rubber)
Examples include SIS (styrene-isoprene-styrene block copolymer), SBS (styrene-butadiene-styrene block copolymer), SEBS (styrene-ethylene-butylene-styrene block copolymer), SEPS (styrene- Styrene-based thermoplastic elastomers (styrene-based block copolymers) such as ethylene-propylene-styrene block copolymer) and SEP (styrene-ethylene-propylene block copolymer).
For example, a styrene block copolymer having a styrene content of 5% by weight or more); a polyurethane thermoplastic elastomer; a polyester thermoplastic elastomer; a blended thermoplastic elastomer such as a polymer blend of polypropylene and EPT (ternary ethylene-propylene rubber) And so on.

As the base polymer for the surface uneven adhesive layer 3, a thermoplastic resin, especially a polyolefin resin, is preferable.

The thickness of the surface uneven adhesive layer 3 can be appropriately selected within a range that does not impair the adhesiveness.
It is about 100 μm (preferably 30 to 60 μm).
When the thickness of the surface uneven adhesive layer 3 is less than 1 μm, the adhesive strength is weak and the workability becomes difficult. On the other hand, when it exceeds 100 μm, the total thickness of the tape increases and the tape is apt to be defective in taping due to the adhesive squeezing out at the time of taping.
Problems such as a decrease in production efficiency will occur.

The surface uneven adhesive layer 3 further includes
Tackifying resin, antistatic agent, filler, antioxidant, lubricant, nucleating agent, water retention agent, ultraviolet absorber, rust preventive, softener,
Additives such as a surfactant, a coupling agent, and a crosslinking agent may be included.

The softening point of the surface uneven adhesive layer 3 is 60 to 17.
It is preferably about 0 ° C (preferably 70 to 150 ° C). If the softening point is less than 60 ° C., the electronic parts carrier in which the electronic parts are encapsulated will adhere or adhere to the surface uneven adhesive layer 3 when exposed to high temperature and high humidity environment for a long time. There is a case. Further, when the softening point of the surface uneven adhesive layer 3 exceeds 170 ° C., the temperature at the time of film formation processing becomes high, and the heat seal (taping) workability deteriorates. The softening point of the uneven surface adhesive layer 3 can be adjusted by appropriately selecting the type of the base polymer (thermoplastic resin, thermoplastic elastomer, etc.) of the adhesive forming the uneven surface adhesive layer 3.

The surface uneven adhesive layer 3 is formed on the supporting substrate 2 by
Forming by applying an adhesive so that the surface of the adhesive layer becomes uneven, or by forming an adhesive layer with a flat surface and then processing so that the surface becomes uneven You can When the surface uneven adhesive layer 3 is a porous adhesive layer, it can be formed by applying an adhesive on the supporting base material 2 so that the adhesive layer has porosity. Specifically, when the surface uneven adhesive layer 3 is a porous adhesive layer, the adhesive (adhesive substance) is made into a fiber by using a laminating method such as a melt blow method or a curtain spray method, and the supporting base material is used. A porous adhesive layer can be formed by applying the composition onto the support 2, adhering it to the supporting substrate 2, and then cooling it.

After the surface uneven adhesive layer 3 such as a porous adhesive layer is formed on the supporting base material 2, slits are formed in a predetermined width if necessary to produce the bottom cover tape 1. it can. The bottom cover tape 1 may be in the form of a sheet or in the form of a roll.

The surface uneven adhesive layer 3 such as a porous adhesive layer may be directly formed on the supporting substrate 2, but if necessary, an undercoat layer or a layer other than the undercoat layer may be used. It may be formed via a layer (for example, an intermediate layer). That is, the bottom cover tape 1 of the present invention may include an undercoat layer, an intermediate layer, or the like, if necessary.

In particular, the bottom cover tape 1 may be subjected to antistatic treatment or conductive treatment, if necessary. Such antistatic treatment and conductive treatment can be performed by a conventional method. For example, as an antistatic treatment method, a method of kneading an antistatic agent into the supporting base material 2 of the bottom cover tape 1 or an antistatic treatment on the surface of the supporting base material 2 (on the surface on the surface uneven adhesive layer 3 side) Examples thereof include a method of forming an antistatic layer by applying an agent, a method of adding an antistatic agent to the adhesive forming the surface uneven adhesive layer 3, and the like.
As an antistatic treatment method, a method of forming an antistatic layer on the supporting base material 2 is optimal. As described above, in the present invention, it is possible to form the antistatic layer composed of the antistatic agent alone on the supporting base material 2 of the bottom cover tape 1.
It is possible to efficiently and stably exhibit the antistatic effect.

The antistatic agent is not particularly limited, and a conventional antistatic agent, for example, a quaternary ammonium salt type antistatic agent, a quaternary ammonium resin type antistatic agent,
A cationic antistatic agent such as an imidazoline type antistatic agent can be used. The antistatic agents can be used alone or in admixture of two or more.

In conducting the conductive treatment, a conventional conductivity-imparting agent can be used by a conventional processing method. Similarly to the antistatic treatment, the conductive treatment also includes a method of kneading a conductivity-imparting agent into the supporting base material 2 or imparting conductivity to the surface of the supporting base material 2 (to the surface on the surface uneven adhesive layer 3 side). Examples of the method include a method of forming a conductive layer by applying an agent, a method of adding a conductivity-imparting agent to the adhesive forming the surface unevenness adhesive layer 3, and the like. A treatment method of forming a conductive layer is preferred.

The bottom cover tape of the present invention is used as a bottom cover tape in an electronic parts carrier (carrier material for electronic parts). The electronic component carrier can be composed of a carrier material, a bottom cover tape, and a top cover tape. As a typical example of such an electronic component carrier, an electronic component storage hole for accommodating an electronic component is formed at a predetermined interval in the longitudinal direction at a substantially central portion in the width direction, and The electronic component transporting bottom cover tape covers the bottom surface (or the lower surface) of the electronic component storage hole, and the electronic component transporting cover tape covers the upper surface of the electronic component storage hole. An example of the carrier is a carrier. That is, in the electronic component transporting body of the present invention, the electronic component transporting bottom cover tape is bonded to the carrier material so as to cover the bottom surface of the electronic component storing hole formed in the carrier material.

As the material of the carrier material, any material having self-supporting property may be used. For example, paper such as Japanese paper, crepe paper, synthetic paper, mixed paper, composite paper; polyethylene,
A plastic film or sheet of polypropylene, polyethylene terephthalate, polyvinyl chloride, cellophane or the like; a metal foil or the like can be used. As a carrier material,
Paper or plastic carrier materials are preferred.

As the top cover tape for transporting electronic parts, a conventional top cover tape can be used. For example, a support made of paper, a plastic film or sheet, and a base polymer such as a polyolefin resin can be used. A top cover tape or the like that is at least configured with the adhesive layer

FIG. 2 is a bottom cover tape 1 shown in FIG.
FIG. 3 is a schematic cross-sectional view in a length direction showing a usage state of an electronic component carrier using the. In FIG. 2, 1 is a bottom cover tape, 4 is an electronic component carrier, 5 is a carrier material, 6 is a top cover tape, 7 is a hole for storing electronic components, and 8 is an electronic component. A chip-type electronic component is preferably used as the electronic component 8.

The electronic component carrier 4 has a hole 7 for storing electronic components.
A carrier material 5 formed at regular intervals in the length direction,
Bottom cover tape 1 provided on the lower surface of the carrier material 5
And a top cover tape 6 provided on the upper surface of the carrier material 5. In this electronic component carrier 4, the lower surface of the carrier material 5 is sealed with the bottom car tape 1 (for example,
The electronic component 8 is inserted into a storage pocket formed by heat-sealing, the upper surface of the carrier material 5 is sealed (for example, heat-sealed) with the top cover tape 6, and then the reel-shaped reel is wound and conveyed. .

The surface of the bottom cover tape 1 that contacts the lower surface of the carrier material 5 is the surface of the bottom cover tape 1 on the surface uneven adhesive layer 3 side. That is, the surface uneven adhesive layer 3 of the bottom cover tape 1 can be used for sealing (in particular, heat sealing).

In the electronic component carrier of the present invention, since the bottom cover tape 1 is used, the contact area between the surface uneven adhesive layer 3 and the chip component is reduced, and the excellent chip component adhesion prevention property is obtained. It is being demonstrated. In particular, when the surface unevenness adhesive layer 3 is a porous adhesive layer, the antistatic property can be effectively exhibited, and therefore the more excellent chip component adhesion preventing property can be exhibited. Specifically, the chip component 8 is attached to the surface of the uneven surface adhesive layer 3 due to static electricity, or the chip component 8 is attached to the surface of the uneven surface adhesive layer 3 during storage after storing or enclosing the chip component. Alternatively, it is possible to suppress or prevent the adhesion of the chip component 8 such as the adhesion of the chip component 8 to the surface of the surface uneven adhesive layer 3 by the fusion, and the chip pressing of the air nozzle (suction nozzle) in the automatic assembly system. it can. Therefore, in the manufacturing process of a circuit board or the like, the suction rate of the chip components of the air nozzle in the automatic assembly system is remarkably improved, and the electronic components (chip type electronic components, etc.) can be reliably taken out and smoothly supplied onto the substrate. That is, the chip parts are easily picked up and the chip parts are easily mounted on the substrate.

Therefore, by using the electronic component carrier of the present invention, it is possible to remarkably improve the reliability from the transportation of the electronic components to the step of assembling the electronic components on the circuit board.

As the chip-type electronic component, for example, a wide variety of chip-type electronic components such as a resistor such as a fixed chip resistor and a capacitor such as a laminated ceramic capacitor can be used.

[0045]

According to the bottom cover tape of the present invention, since it has the surface uneven adhesive layer, it has excellent adhesiveness to the carrier material and excellent chip component adhesion preventing property. Further, the antistatic property can be effectively exerted, and the chip component adhesion preventing property can be further enhanced. Therefore, it is excellent in picking up chip parts,
The mountability of the chip component on the substrate can be improved.
Therefore, problems such as sticking of chip parts due to electrification during transportation or peeling, popping out of chip parts, sticking by pressing the chip parts with an air nozzle, etc. are eliminated, and suction mistakes of the air nozzle in the automatic assembly system are eliminated. Therefore, it becomes possible to smoothly supply the chip components to the substrate.

[0046]

The present invention will be described in more detail based on the following examples, but the invention is not intended to be limited by these examples.

Example 1 Japanese paper (thickness 2) which is a supporting substrate.
Curtain spraying method (Sun Co., Ltd.) while melting the product name “Evaflex P2807” (manufactured by Mitsui DuPont Co., Ltd., ethylene-vinyl acetate copolymer; EVA) on 5 μm, basis weight 14 g / m ² ) at 190 ° C. (Curing spray coating device manufactured by Tool Co., Ltd.) to form a porous adhesive layer having an uneven surface and a non-woven fabric shape (basis weight: 3 g / m ² ), which is then 5.25 mm wide. The bottom cover tape was produced by slitting into a tape shape.

Example 2 A porous polyethylene terephthalate film having a coating layer (thickness: 0.5 μm) formed with an antistatic agent (trade name “Bondepp P” manufactured by Konishi Co., Ltd.) on one surface in advance (thickness: 16 μm, pore size: On the surface of the antistatic agent layer side having an average pore diameter of 1 μm and a number of through holes of 100 / cm ² ], the product name “Mirason 10P (manufactured by Mitsui Chemicals, Inc.)” is melted at 340 ° C. by the curtain spray method. After application, the surface is uneven and non-woven (basis weight 3 g
/ M ² ) porous adhesive layer is formed, and
A bottom cover tape was produced by slitting into a tape shape having a width of 5.25 mm.

(Example 3) A polyethylene terephthalate film (thickness: 16) on which aluminum was vapor-deposited beforehand.
(μm) on the aluminum vapor-deposited surface under the trade name "Mirason 1
"0P (manufactured by Mitsui Chemicals, Inc.)" is applied by a curtain spray method while melting at 340 ° C to form a porous adhesive layer having an uneven surface and a non-woven fabric shape (basis weight: 3 g / m ² ).
Further, this was slit into a tape shape having a width of 5.25 mm to produce a bottom cover tape.

(Comparative Example 1) Japanese paper (thickness 3
0 μm, grammage 16 g / m ² ) and low-density polyethylene (trade name “Mirason 10P”, manufactured by Mitsui Chemicals, Inc.) as an adhesive layer to have a thickness of 3 with a single extrusion laminator.
Lamination was performed so as to have a thickness of 0 μm, and a bottom cover tape constituted by laminating a low-density polyethylene layer (adhesive layer) having a smooth surface on Japanese paper was produced.

(Comparative Example 2) Japanese paper (thickness 3
0 μm, grammage 16 g / m ² ) and low-density polyethylene (trade name “Mirason 10P”, manufactured by Mitsui Chemicals, Inc.) as an adhesive layer to have a thickness of 3 with a single extrusion laminator.
After laminating to a thickness of 0 μm and laminating a low-density polyethylene layer (adhesive layer) having a smooth surface on Japanese paper, the surface of the low-density polyethylene layer serving as an adhesive layer is subjected to corona discharge treatment. Then, a cationic antistatic agent [trade name "Statideside", handling company name "Takihara Sangyo Co., Ltd."] was applied with a kiss roll coater to a dry thickness of 0.7 μm. Then, it was dried to produce a bottom cover tape.

(Evaluation Test) The following chip adhesion test was conducted on each of the bottom cover tapes obtained in Examples and Comparative Examples to evaluate the chip adhesion prevention property. The evaluation results are shown in Table 1.

(Chip Adhesion Test) Each bottom cover tape was attached at 200 ° C. to a carrier material (carrier mount) having electronic component storage holes (component storage pockets), and a 1005 size chip resistor was attached to the core. It is put in a component storage pocket (100 pieces), and a top cover tape is stuck on it at 140 ° C. to make a test piece. After storing each of these test pieces under each of the following storage conditions (A) to (C), the cover tape was peeled off in a room at 23 ° C. and 40% RH to mount a chip resistor. Was turned over (that is, the surface on the side of the top cover tape was face down), the number of chip resistors that spontaneously dropped from the carrier mount was measured, and the chip adhesion preventive property was evaluated according to the following evaluation criteria.

(Storage Conditions) (A) The test piece is stored at 40 ° C. and 92% RH for 14 days with the bottom cover tape side facing down. (B) The test piece is bottom covered at 50 ° C. The test piece is stored for 14 days with the surface on the tape side facing down. (C) The surface of the bottom cover tape side (that is, the surface of the supporting base material of the bottom cover tape) in a room at 25 ° C. and 50% RH. Rub with rubbing cloth (JIS L-0803) 10 times

(Evaluation criteria) ◯: No chip resistance adhered (0) Δ: Adhesion of chip resistance is 5 or more and less than 10 X: Adhesion of chip resistors is 10 or more

[0056]

[Table 1]

From Table 1, in the bottom cover tapes according to the examples, there is no adhesion of chip components, and excellent chip component adhesion prevention performance is exhibited. Moreover, condition (C)
In the evaluation test after storage in, in spite of rubbing with a friction cloth to forcefully generate static electricity, there is no adhesion of chip parts. This is because the bottom cover tape according to the example generates static electricity. It is thought that this is due to the prevention of Therefore, the bottom cover tapes according to the examples exhibit an excellent antistatic property, and can effectively suppress or prevent the attachment of chips.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view showing an example of a bottom cover tape for carrying electronic parts of the present invention.

FIG. 2 is a schematic cross-sectional view in a length direction showing a usage state of an electronic component carrier using the bottom cover tape 1 shown in FIG.

[Explanation of symbols]

1 bottom cover tape 2 Support substrate 3 Surface uneven adhesive layer 4 Electronic component carrier 5 Carrier materials 6 Top cover tape 7 Electronic component storage holes 8 electronic components

Continued front page    F-term (reference) 3E067 AB41 AC04 AC11 BA34A                       BB14A BC07A CA21 EA06                       EA32 EB27 EC07 EC25 EC27                       FA01 FC01

Claims (7)

[Claims] 1. A bottom cover tape adhered to a carrier material so as to cover a bottom surface of an electronic component housing hole formed in a carrier material in an electronic component carrier, wherein the bottom cover tape has at least a surface. A bottom cover tape for transporting electronic parts, which has an uneven adhesive layer. 2. The bottom cover tape for transporting electronic parts according to claim 1, wherein the adhesive layer having an uneven surface is a porous adhesive layer. 3. The bottom cover tape for transporting electronic parts according to claim 2, wherein the porous adhesive layer is formed by applying an adhesive in a fibrous form on a supporting base material. 4. The bottom cover tape for transporting electronic parts according to claim 1, which has been subjected to antistatic treatment or conductive treatment. 5. The bottom cover tape for transporting electronic components according to claim 1, wherein the supporting base material in the bottom cover tape is a porous supporting base material. 6. The bottom cover tape for carrying electronic parts according to claim 1, which is adhered to a carrier material so as to cover a bottom surface of an electronic part storing hole formed in the carrier material. An electronic component carrier characterized in that 7. The electronic component carrier according to claim 6, wherein the electronic component is accommodated in an electronic component accommodating hole formed in the carrier material.