JP2003292034A - Bottom cover tape for conveying electronic component and electronic component conveyer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a bottom cover tape for an electronic component carrier, which can suppress adhesion of a chip component while maintaining adhesion to a carrier tape. <P>SOLUTION: This bottom cover tape for conveying the electric component covers the bottom surface of a hole for housing the electronic component, which is formed in the carrier tape of the electronic component conveyer; an adhesive layer, which is to be bonded to the carrier tape by heat, is formed on one side of a supporting base material layer; and the adhesive layer in a part of the hole for housing the electronic component is partially provided in the bottom cover tape. Antistatic properties or electrical conductivity can also be imparted to the supporting base material layer, and the antistatic properties or the electrical conductivity can also be imparted to the adhesive layer. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component carrier used for transporting chip type electronic components, and a bottom cover tape used for the electronic component carrier.

[0002]

2. Description of the Related Art Electronic components such as chip-type electronic components such as chip fixed resistors and laminated ceramic capacitors are conveyed by punching square holes for accommodating chip-type electronic components at regular intervals in the length direction of tape-shaped cardboard. The bottom surface of the paper carrier (carrier tape) on which is formed is heat-sealed (taping) with a bottom cover tape to prepare a storage pocket, and immediately after that, a chip-type electronic component is inserted into the storage pocket, and the paper carrier A series of taping reel systems are widely used in which the upper surface is heat-sealed with a top cover tape to encapsulate a chip-type electronic component, and then the reel is wound and conveyed. Then, in the process of manufacturing the circuit board etc. of the transfer destination, after the top cover tape is peeled off, the automatic assembly system that automatically sucks the stored chip type electronic components with the air nozzle and supplies them onto the substrate becomes the mainstream. ing.

In such an automatic assembling system, the bottom cover tape has good adhesiveness to the carrier tape for the purpose of surely mounting the chip parts, and prevents static electricity caused by vibration during taping work and transportation. Characteristics such as so-called antistatic property that prevents adhesion of the chip component to the adhesive layer, and so-called chip adhesion prevention effect (adhesion suppression effect) that can prevent adhesion of the chip component to the adhesive layer due to external force. Required to have.

Conventionally, as the bottom cover tape, one side of a supporting base material layer made of Japanese paper, thin paper, etc. is used.
It has been used that an adhesive layer made of a polyolefin resin or the like is provided, and if necessary, the adhesive layer is coated with an antistatic agent. On the other hand, there is a problem that some mounting defects occur due to defective chip adsorption. In addition, with the recent trend toward lighter, thinner, shorter and smaller chip components, the chip components are more likely to adhere to the adhesive layer (or coated antistatic agent) of the bottom cover tape due to slight static electricity or external force. Therefore, a phenomenon in which a chip component cannot be adsorbed by an air nozzle often occurs, and a reduction in mounting reliability of the component becomes a problem.

[0005]

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a bottom cover tape for carrying electronic parts, which can suppress the adhesion of chip parts while maintaining the adhesiveness to the carrier tape, and the bottom cover tape. An object is to provide an electronic component carrier.

[0006]

Means for Solving the Problems As a result of intensive investigations by the present inventors in order to achieve the above object, the adhesive layer was formed on one side of the supporting base material layer of the bottom cover tape at a portion corresponding to the hole for storing electronic parts. The present invention has been completed, and found that the partial provision of (1) provides excellent antistatic properties while retaining the adhesiveness to the carrier tape, and can significantly suppress the adhesion of the chip component to the adhesive layer surface.

That is, the present invention is a bottom cover tape for covering the bottom surface of the electronic component housing hole formed in the carrier tape in the electronic component carrier, wherein one surface of the supporting base material layer is heated by the carrier tape and heat. Provided is a bottom cover tape for transporting electronic components, in which an adhesive layer to be bonded is formed, and the adhesive layer in the hole for storing electronic components in the adhesive layer is partially provided. The support base material layer may be imparted with antistatic property or conductivity, and the adhesive layer may be imparted with antistatic property or conductivity.

Further, the present invention is an electronic component carrier comprising a carrier tape having an electronic component storage hole formed therein, and a bottom cover tape covering the bottom surface of the electronic component storage hole. As an electronic component carrier, the electronic component carrier bottom cover tape described above is used.

Further, according to the present invention, there are provided a carrier tape having a hole for storing electronic parts, a bottom cover tape for covering a bottom surface of the hole for storing electronic parts, and a top cover tape for covering an upper surface of the hole for storing electronic parts. An electronic component carrier provided with the above-mentioned bottom cover tape for electronic component transportation is used as the bottom cover tape.

DETAILED DESCRIPTION OF THE INVENTION

Embodiments of the present invention will be described below with reference to the drawings as necessary. FIG. 1 is a schematic cross-sectional view in the length direction showing an example of the bottom cover tape of the present invention, and FIG. 2 is a schematic perspective view showing an example of the bottom cover tape of the present invention. The bottom cover tape 1 is composed of a supporting base material layer 2 and an adhesive layer 3 formed on the supporting base material layer 2, and the adhesive layer is formed in a portion of the carrier tape corresponding to the electronic component storage hole. 3 is partially provided. In addition, in this example, the adhesive layer 3 is also partially formed in a portion that comes into contact with the carrier tape.

The supporting base material constituting the supporting base material layer 2 may be one having self-supporting property, for example, paper such as Japanese paper, thin paper, crepe paper, synthetic paper, mixed paper, composite paper; non-woven fabric. , Cloth; plastic film or sheet;
Examples thereof include a metal foil or a thin plate made of a metal such as copper or aluminum; and a laminated body of these. The supporting base materials may be used alone or in combination of two or more kinds.

When the bottom cover tape of the present invention is adhered to the carrier tape by heating, it is exposed to high temperature for a short time, and as a result, moisture contained in the adhesive layer of the bottom cover tape expands rapidly ( The bottom cover tape may be easily peeled from the carrier tape due to vaporization or the like. Therefore, as the supporting base material, one having a property of allowing moisture to permeate is preferably used. For example, when a porous base material is used as a support base material, gas components (steam, etc.) vaporized in the adhesive layer,
Since it can be released to the outside from the open end of the porous substrate, it is possible to suppress or prevent the decrease in adhesiveness and maintain high adhesiveness.

The above-mentioned porous substrate, especially the porous substrate made of a fibrous substance, is, for example, a porous paper material (for example,
Kraft paper, crepe paper, Japanese paper, clay-coated paper, high-quality paper, glassine paper, Kurpac paper, etc.), porous cloth material (for example, aramid fiber, rayon fiber, acetate fiber, polyester fiber, polyvinyl alcohol fiber, polyamide fiber) , Polyolefin fibers, fluorine fibers, stainless fibers, asbestos, glass cloth, glass fibers, Manila hemp, non-woven fabrics and woven fabrics made of synthetic or natural fibers such as pulp). In the porous base material made of a fibrous substance, the fibrous substances may be used alone or in combination of two or more kinds. In addition, the porous substrate is used alone or
It can be used in combination of two or more species.

If necessary, one or both surfaces of the supporting base material layer 2 may be subjected to a conventional surface treatment such as corona discharge treatment. Moreover, the support base material layer 2 may be provided with antistatic property or conductivity, if necessary. The antistatic property or the conductivity is imparted by a conventional method, for example, by kneading the antistatic agent or the conductive material into the supporting base material layer 2, or on the surface of the supporting base material layer 2. Can be applied.

Examples of the antistatic agent include anionic surfactants such as alkyl sulfates and alkylaryl sulfates; cationic surfactants such as quaternary ammonium salts; nonionic surfactants such as glycerin monostearate. Agents; surfactants such as amphoteric surfactants such as betaine, and the like. Examples of the conductive material include metal oxides, metal powders, carbon black, and the like. You may use these individually or in mixture of 2 or more types.

The antistatic property or conductivity can also be imparted by providing an uneven shape on the back surface of the supporting base material layer 2 and suppressing charging due to friction of the supporting base material layer 2.

In the supporting base material layer 2, if necessary, a conventional additive such as an antioxidant, an ultraviolet absorber, a softening agent,
A rust preventive agent, inorganic particles, an organic conductive polymer agent, a titanium-based or silane-based coupling agent, and the like may be added.

The thickness of the supporting base material layer 2 can be appropriately selected within a range that does not impair mechanical strength, handling property, etc., and is, for example, generally about 5 to 100 μm, preferably about 10 to 50 μm.

The adhesive layer 3 is not particularly limited, but is generally composed of a hot-melt adhesive or a thermosetting adhesive. As the base polymer of the hot melt adhesive, for example, a thermoplastic resin such as an olefin resin, a vinyl acetate resin, a polyester resin, an acrylic resin, a styrene resin, a thermoplastic elastomer, or the like can be used. As the base polymer of the curable adhesive, for example, a thermosetting resin such as urea resin, melamine resin, phenol resin or epoxy resin can be used. These base polymers can be used alone or in combination of two or more.

Examples of the olefin resin include:
Polyethylene (low density polyethylene, linear low density polyethylene, metallocene-catalyzed polyethylene, high density polyethylene, etc.), polypropylene, polyolefin such as ethylene-α-olefin copolymer resin; ethylene copolymer (for example, ethylene-acrylic acid copolymer) Coalescence (EA
A), ethylene-unsaturated carboxylic acid copolymers such as ethylene-methacrylic acid copolymer (EMAA); ionomers; ethylene-methyl acrylate copolymer, ethylene-
Ethylene acrylate copolymer (EEA), ethylene- (meth) acrylic acid ester copolymer such as ethylene-methyl methacrylate copolymer; ethylene-vinyl acetate copolymer (EVA); ethylene-vinyl alcohol copolymer Etc.); polypropylene-modified resins and the like.

Examples of vinyl acetate resins include polyvinyl acetate, vinyl acetate- (meth) acrylic acid ester copolymers, vinyl acetate-vinyl ester copolymers, vinyl acetate-maleic acid ester copolymers and the like. To be

Examples of the thermoplastic elastomer include SIS (styrene-isoprene-styrene block copolymer), SBS (styrene-butadiene-styrene block copolymer), SEBS (styrene-ethylene-butylene-styrene block copolymer). Polymer), SEPS
(Styrene-ethylene-propylene-styrene block copolymer), SEP (styrene-ethylene-propylene block copolymer), and other styrene-based thermoplastic elastomers (styrene-based block copolymers; for example, styrene-based polymers having a styrene content of 5% by weight or more) Block copolymer); polyurethane thermoplastic elastomer; polyester thermoplastic elastomer; polypropylene and EPT
Examples include blended thermoplastic elastomers such as polymer blends with (ternary ethylene-propylene rubber).

The thickness of the adhesive layer 3 can be appropriately selected within a range that does not impair the adhesiveness and handling property, but is generally about 2 to 90 μm. The thickness of the adhesive layer 3 is 2μ
If it is less than m, the adhesive strength will be weak, and if it exceeds 90 μm, the total thickness of the tape will increase, and defective taping will easily occur due to sticking out of the adhesive during taping.

The adhesive layer 3 may be provided with antistatic property or conductivity, if necessary. The antistatic property or conductivity is determined by a conventional method, for example, by kneading an antistatic agent or a conductive material into the adhesive layer 3, or by using the adhesive layer 3
It can be applied by applying an antistatic agent or a conductive material on the surface. As the antistatic agent and the conductive material, those exemplified above can be used.

When the antistatic agent and the conductive material are kneaded into the adhesive layer 3, the compounding amount (total) is the base polymer 1
The amount is, for example, 0.05 to 50 parts by weight, preferably 0.1 to 10 parts by weight, relative to 00 parts by weight. If the blending amount of these additives exceeds 50 parts by weight, the adhesiveness tends to decrease.

If necessary, a tackifier, an antioxidant, an ultraviolet absorber, a rust preventive, a softener, a surfactant, a filler, a coupling agent, a cross-linking agent, etc. are added to the adhesive layer 3. The agent may be blended.

The main feature of the electronic component carrying bottom cover tape 1 of the present invention is that the adhesive layer 3 is partially provided at a portion corresponding to the electronic component housing hole. Specifically, for example, the constituent components of the adhesive layer 3 are heated and melted, and a nozzle capable of discharging in a fibrous state is used to partially (for example, reticulate, After being applied in a grid (FIG. 2), it is cooled and wound into a roll.
By slitting (cutting) this into a predetermined width, the bottom cover tape 1 in which the adhesive layer 3 is partially formed on the supporting base material layer 2 can be obtained.

FIG. 3 is a schematic sectional view showing an example of the electronic parts carrier of the present invention. More specifically, it is a schematic cross-sectional view in the length direction showing a usage state of a chip type electronic component carrier using the bottom cover tape shown in FIG. 2. The chip type electronic component carrier 4 is provided on the bottom surface of the carrier tape 5 and a carrier tape 5 in which punched square holes (electronic component storing holes) 7 for accommodating chip type electronic components are formed at regular intervals in the length direction. Bottom cover tape 1 and carrier tape 5
And a top cover tape 6 provided on the upper surface of the. In this carrier 4, the chip-type electronic component 8 is inserted into a storage pocket formed by heat-sealing the lower surface of the carrier tape 5 with the bottom cover tape 1, and the upper surface of the carrier tape 5 is heated with the top cover tape 6. After sealing, the reel is wound and conveyed.

At this time, since the adhesive layer 3 of the bottom cover tape 1 is partially formed on the supporting base material layer 2 at the portion of the hole 7 for storing electronic parts, the bottom cover tape 1
The contact area between the adhesive layer 3 and the chip component 8 is reduced, and the adhesion of the chip component 8 to the surface of the adhesive layer 3 due to an external force can be suppressed. In addition, the bottom cover tape 1 has an exposed portion of the supporting base material layer 2 that does not have the adhesive layer 3, and may hold moisture in the air between the chip component 8 and the exposed portion. It has excellent antistatic properties, and can suppress or prevent the chip component 8 from adhering to the surface of the adhesive layer 3 due to static electricity.
Therefore, in the automatic assembly system, problems such as adhesion caused by the air nozzle pressing the chip component 8 are solved, the adsorption rate to the chip component 8 is significantly improved, and the chip component 8 can be smoothly supplied to the substrate. Becomes

The electronic component carrier of the present invention comprises a carrier tape having holes for storing electronic components, and a bottom cover tape for covering the bottom surface of the holes for storing electronic components. The bottom cover tape for transporting electronic parts is used. As a specific example, for covering the carrier tape in which the electronic component storing holes for storing electronic components are formed at predetermined intervals in the length direction at the widthwise central portion, and to cover the bottom surface of the electronic component storing holes. And a bottom cover tape, and a carrier having a pocket for storing electronic parts, which is formed by thermally adhering the bottom cover tape to the carrier tape.

The carrier tape may be made of any material having a self-supporting property, for example, paper such as Japanese paper, crepe paper, synthetic paper, mixed paper, composite paper; polyethylene, polypropylene, polyethylene terephthalate, polychlorinated paper. A plastic film or sheet such as vinyl or cellophane; a metal foil can be used.

Another electronic component carrier of the present invention is a carrier tape having an electronic component storage hole, a bottom cover tape covering the bottom surface of the electronic component storage hole, and an upper surface of the electronic component storage hole. And a top cover tape for covering the above. The bottom cover tape for carrying electronic parts according to the present invention is used as the bottom cover tape. A specific example is a carrier in which electronic components are stored in an electronic component storage pocket formed by the carrier tape and the bottom cover tape, and the top surface of the storage pocket is covered with a top cover tape. As the top cover tape, a top cover tape commonly used for electronic component carriers can be used.

The bottom cover tape for transporting electronic components and the electronic component transporter of the present invention are preferably used for transporting a wide range of chip type electronic components such as resistors such as chip fixed resistors and capacitors such as laminated ceramic capacitors. it can.

[0034]

According to the present invention, since the adhesive layer is partially formed on one surface of the supporting base material layer of the bottom cover tape, the adhesion of the chip component is suppressed while maintaining the adhesiveness to the carrier tape. it can. Therefore, the mounting reliability of components is greatly improved in a series of processes from the transportation of electronic components to the process of assembling them on a circuit board.

[0035]

The present invention will be described in more detail based on the following examples, but the invention is not intended to be limited by these examples. Example 1 Japanese paper as a base material (thickness 30 μm, basis weight 14 g / m ² ).
Ethylene-vinyl acetate copolymer (EVA resin) on top
(Heat-melting adhesive; trade name "P2807", manufactured by Mitsui DuPont Polychemical Co., Ltd.) is melted by heating, and is extruded and applied in a lattice shape so that the applied amount is about 8 g / m ^2, and then cooled. , Rolled up. This is 5.25
A bottom cover tape was obtained by slitting a width of mm.

Example 2 In Example 1, an antistatic agent (trade name "Bondepp P", manufactured by Konishi Co., Ltd .; 4) was used as a base material instead of Japanese paper.
Porous polyethylene terephthalate (PET) coated with a polymer containing a moiety derived from an acrylate having a primary ammonium base (thickness 16 μm, caliber 1 μm
m, Example 1 except that 20 through holes / m ² ) were used.
A bottom cover tape was obtained by the same operation as above.

Comparative Example 1 Japanese paper as a base material (thickness 30 μm, basis weight 14 g / m ² ).
30 μ of low density polyethylene (LDPE) (adhesive; trade name “Mirason 10P”, manufactured by Mitsui Chemicals, Inc.)
After being laminated by a single extrusion laminator so as to have a thickness of m, a bottom cover tape was obtained by slitting a width of 5.25 mm.

Comparative Example 2 In Comparative Example 1, after the adhesive was laminated on the base material, the surface of the adhesive layer was subjected to corona discharge treatment, and the same surface was treated with a cationic antistatic agent (trade name "STA"). Thiside ",
Takihara Sangyo Co., Ltd. was applied using a kiss roll coater and dried to obtain a bottom cover tape.

Evaluation Test The bottom cover tapes obtained in Examples and Comparative Examples were evaluated for chip adhesion as follows. (Chip adhesion) Paper carrier (Hokuetsu Paper Mills, HO
After heat-sealing (taping) each bottom cover tape to the bottom surface of the CTO-60), insert the chip component into the square hole for storing the chip component, heat-seal the top cover tape to seal the chip component, and form a reel. Roll up to 23 ℃, 5
One stored at 0% RH for 2 weeks, 50 ° C, 1
A sample was stored for 2 weeks under the condition of 0% RH. Peeling off the top cover tape while holding these samples so that the top cover tape side faces the ground,
At that time, when the chip dropped, it was evaluated as ◯, when partially peeled, it was evaluated as Δ, and when it was not dropped, it was evaluated as x. The results are shown in Table 1.

[Table 1]

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view showing an example of a bottom cover tape for carrying electronic parts of the present invention.

FIG. 2 is a schematic perspective view showing an example of a bottom cover tape for carrying electronic parts of the present invention.

FIG. 3 is a schematic sectional view showing an example of an electronic component carrier of the present invention.

[Explanation of symbols]

1 Bottom Cover Tape 2 Supporting Base Layer 3 Adhesive Layer 4 Chip Type Electronic Component Carrier 5 Carrier Tape 6 Top Cover Tape 7 Chip Type Punched Square Hole for Electronic Component Storage (Hole for Electronic Component Storage) 8 Chip Electronic Component

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) C09J 201/00 B65D 85/38 NF term (reference) 3E067 AA11 AB47 AC04 BA38A BB01A BB12A BB14A BB25A BC04A CA21 CA24 EA06 EA32 EB27 EC07 EC24 EC38 FA01 FA09 FC01 GD07 GD08 GD10 3E096 AA06 BA09 CA15 CC01 DA04 DA14 DB06 DC03 EA01X EA01Y EA02X EA02Y EA06X EA06Y FA07 FA09 FA22 FA27 FA31 GA03 GA05 4J004 AA06 AA07 AA09 AA10 AA15 AB03 AB05 CA07 CA08 CB01 CB02 CC02 CC03 CD01 CD08 CE03 FA05 FA08 4J040 DA001 DA121 DB031 DE021 DF041 DM011 ED001 EF001 JA09 JB01 JB02 LA06 NA19

Claims (5)

[Claims] 1. A bottom cover tape for covering a bottom surface of an electronic component storing hole formed in a carrier tape of an electronic component carrier, the adhesive being heat-bonded to the carrier tape on one surface of a supporting base material layer. A bottom cover tape for transporting electronic components, wherein an agent layer is formed, and the adhesive layer in the hole for storing electronic components in the adhesive layer is partially provided. 2. The bottom cover tape for transporting electronic parts according to claim 1, wherein the support base material layer is provided with antistatic property or conductivity. 3. The bottom cover tape for transporting electronic components according to claim 1, wherein the adhesive layer is provided with antistatic property or conductivity. 4. An electronic component carrier comprising a carrier tape having an electronic component storage hole formed therein and a bottom cover tape covering a bottom surface of the electronic component storage hole, wherein the bottom cover tape is used as the bottom cover tape. An electronic component transporter using the electronic component transporting bottom cover tape according to any one of 1 to 3. 5. An electronic component comprising a carrier tape having an electronic component storage hole formed therein, a bottom cover tape covering a bottom surface of the electronic component storage hole, and a top cover tape covering an upper surface of the electronic component storage hole. An electronic component transporter, wherein the bottom cover tape for transporting electronic components according to claim 1 is used as the bottom cover tape.