JP2003266016A - Cover tape for conveying electronic part, manufacturing method therefor and electronic part conveying body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cover tape for conveying electronic parts, having a good peeling off property and adequate adhesiveness, capable of preventing peeling electrification at the time of peeling off of the cover tape. <P>SOLUTION: The cove tape for conveying the electronic parts is the one in which a heat adhesive resin layer is provided on a support and an antistatic layer is provided on an outer side of the support or between the support and the heat adhesive resin layer. It is characterized in that a contact angle against water is 0.5-95° and a surface resistivity is 1.0×10<SP>13</SP>Ω/square or less on a surface of the heat adhesive resin layer. A critical surface tension γc on the surface of the heat adhesive resin layer may be 2.6×10<SP>-4</SP>-7.0×10<SP>-4</SP>N/cm. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component carrier used for transporting chip type electronic components and the like until it is mounted on a substrate, a cover tape used for the electronic component carrier, and the cover tape. Manufacturing method.

[0002]

2. Description of the Related Art As a general mode of carrying chip type electronic parts such as chip fixed resistors and multilayer ceramic capacitors, a taping reel system using an electronic part carrying tape (electronic part carrying body) is known. In this taping reel system, electronic parts are inserted into a pocket for storing electronic parts, which is provided at regular intervals in the length direction of a plastic or paper carrier tape, by an automatic parts feeder machine, etc. The upper surface is heat-sealed with a cover tape provided with a heat-adhesive resin layer made of a thermoplastic adhesive resin to enclose the electronic components, and then the reels are wound and conveyed. These steps are generally performed using a taping machine. In the process of manufacturing a circuit board or the like at the destination, the mainstream is an automatic assembly system in which after the cover tape is peeled off, the inserted electronic components are automatically adsorbed by an air nozzle and supplied onto the substrate. .

The functions required of the cover tape used in the process of carrying such electronic parts are, specifically, (i) the adhesive strength to various paper mount materials is within a certain range (for example, 0.1 to 0). 1.9 N / mm, preferably 0.3-
0.4 N / mm), (ii) stability of peel strength in an environment such as thermocompression bonding, and proper adhesive strength regardless of temperature and adherend, (iii) taping machine Satisfies the heat resistance requirement to avoid machine troubles due to sticking of heat iron when the machine is stopped, and sticking out.
(iv) Adhesion with the adhesive layer of the cover tape after storing electronic components,
No fusing, (v) Avoidance of electronic component failure or mounting failure due to component pop-out caused by static electricity during tape peeling, (vi) Improving production efficiency by reducing taping speed, etc. Can be mentioned.

In general, the cover tape comprises a heat-adhesive resin formed by an extrusion laminating machine, a T-die extrusion machine, an inflation extrusion machine, and the like, and a base material such as polyethylene terephthalate (PET). It is manufactured by a dry laminating method or the like in which the layers are bonded to each other.

In connection with the recent handling of chip parts such as capacitors and resistors and semiconductor electronic parts,
Various countermeasures against static electricity have been attempted to meet the request of (v). For example, a method of kneading conductive particles (conductive material) such as metal powder or metal oxide, or an antistatic agent such as a surfactant into a thermo-adhesive resin layer forming a tape is used. However, this method has problems such that the surface resistivity of the tape cannot be stably obtained, and the visibility of the component is reduced due to the reduction of the light transmittance.

As another method, a method of coating an antistatic agent, a conductive material, or the like on the surface of the heat-adhesive resin layer with a kiss roll or the like is used, but the heat-adhesive resin layer is stored in a fixed position due to variations in peel strength. Electronic components may pop out of the storage pocket or be misaligned. Furthermore, depending on the constituent components of the heat-adhesive resin layer, the adhesion of the antistatic agent or the conductive material to the heat-adhesive resin layer cannot be obtained, so that the antistatic agent or the like is transferred to the base material side, resulting in an antistatic effect. However, there was a problem such as a decrease in cost, which was also disadvantageous in terms of cost.

[0007]

[Patent Document 1] Japanese Patent Laid-Open No. 11-286079

[0008]

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to have surface characteristics capable of preventing peeling electrification and the like at the time of peeling of a cover tape, and to have a small variation in peeling strength at the time of peeling and to have a good peeling property. Another object of the present invention is to provide a cover tape for transporting electronic components, which has a suitable adhesiveness and a method for manufacturing the same.

Another object of the present invention is to provide a cover tape for transporting electronic parts, which has high transparency, good visibility of electronic parts, and excellent storage stability, in addition to the above characteristics, and a method for producing the same. To provide. Still another object of the present invention is to provide an electronic component carrier including the cover tape having the above-mentioned excellent performance.

[0010]

Means for Solving the Problems As a result of intensive studies for achieving the above object, the present inventors have found that at least one surface of a cover tape is subjected to a specific treatment and the thickness of an antistatic layer is adjusted. As a result, a tape having certain surface characteristics can be obtained, so that it is possible to prevent defects in electronic components due to static electricity, and further, by providing a heat-adhesive resin layer of a specific composition, peeling stability, appropriate adhesiveness, Further, they have found that high light transmittance can be obtained and completed the present invention.

That is, the present invention relates to a heat-bonded resin on a support.
An oil layer is provided and heat-bonded to the outside of the support or to the support.
Carrying electronic parts that has an antistatic layer between it and the resin layer
It is a cover tape for sending, and it does not smell on the surface of the thermal adhesive resin layer.
, The contact angle to water is 0.5 to 95 °, surface resistivity
Is 1.0 × 10¹³Cover for transporting electronic parts with Ω / □ or less
-Provide tape. At this time, on the surface of the thermal adhesive resin layer
The critical surface tension γc in the example is 2.6 × 10^-Four~
7.0 x 10^-FourN / cm. Furthermore, cover tape
Of water on the opposite surface of the heat-bonded resin layer of
The angle may be 0.5-70 ° and the cover tape
The surface resistivity of both surfaces is 1.0 x 10 ¹³Ω / □ or less
May be

The heat-adhesive resin layer is at least selected from an olefin copolymer having a carboxyl group or an acyloxy group in the molecule, an ionomer resin, and a block copolymer of an aromatic vinyl compound and a conjugated diene compound. One or more components of a polymer, 1 to 100 parts by weight of an adhesion-imparting resin to 100 parts by weight of the polymer, and the polymer 10
It may be composed of 0.05 to 50 parts by weight with respect to 0 parts by weight of an antistatic agent and / or a conductive material. The thickness of the antistatic layer is, for example, 0.005 to 5 μm.

The peeling force after the cover tape is adhered to a paper mount and left for 30 days is, for example, 0.1 to 0.9 N in an environment of 60 ° C. and 90% RH, and the light is transmitted. The rate is, for example, 80% or more. Further, at least one surface of the cover tape may be subjected to at least one kind of treatment selected from humidification treatment, steam spray treatment, and water-based antistatic agent spray treatment.

The present invention also provides at least a laminate in which a heat-adhesive resin layer is provided on a support and an antistatic layer is provided outside the support or between the support and the heat-adhesive resin layer. Provided is a method for producing a cover tape for carrying electronic parts, which comprises subjecting one surface to at least one treatment selected from a humidification treatment, a water vapor spray treatment, and a water-based antistatic spray treatment.

Furthermore, the present invention is an electronic component carrier comprising an electronic component housing portion for housing an electronic component, and a cover tape covering the electronic component housing portion, wherein the electronic tape is one of the above electronic components. Provided is an electronic component carrier using a component carrying cover tape.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as necessary. FIG. 1 is a schematic sectional view showing an example of a cover tape for carrying electronic parts according to the present invention. In this cover tape for transporting electronic components, a thermal adhesive resin layer 2 is laminated on a support 1, and an antistatic layer 3 is provided on the back surface of the support 1. FIG. 2 is a schematic cross-sectional view showing another example of the electronic component carrying cover tape of the present invention. In this cover tape for transporting electronic parts, an undercoat layer 4 and an intermediate layer 5 are provided between the support 1 and the heat-adhesive resin layer 2 in the cover tape of FIG.

The support 1 may be any one having a self-supporting property, for example, paper; polyolefin resins such as polyethylene and polypropylene (for example, high molecular weight polypropylene); polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate. And the like; polycarbonate; polysulfone resin such as polyphenylene sulfide and polyether sulfone; polyether ether ketone; nylon (polyamide); polyimide; plastic film or sheet such as styrene resin such as polystyrene.

One side or both sides of the above plastic film or sheet is subjected to a treatment such as an easy-adhesion treatment or an electric discharge treatment, and also Japanese paper, capacitor kraft paper, Manila paper, crepe paper, flat paper, hemper paper, glassine. Paper 1 and polyolefin such as polyethylene and polypropylene may be laminated and used as the support 1.

The support 1 is, if necessary, a conventional additive such as an antioxidant, an ultraviolet absorber, a softening agent, an anticorrosive agent, inorganic particles, an antistatic agent (for example, a quaternary ammonium salt). Etc.), a conductive metal powder, an organic conductive polymer agent, a titanium-based or silane-based coupling agent, and the like.

The melting point of the support 1 is preferably 90 ° C. or higher. If the melting point of the support 1 is less than 90 ° C., the support 1 may shrink or melt during taping of the electronic component, making the taping state unstable, and spilling or popping out the electronic component. is there.

The support 1 may be either a single layer or multiple layers. The thickness of the support 1 is generally about 2 to 250 μm, preferably about 20 to 200 μm.

The cover tape for carrying electronic parts according to the present invention comprises:
By providing the undercoat layer 4 between the support 1 and the thermal adhesive resin layer 2 (when the intermediate layer 5 is provided, the support 1 and the intermediate layer 5), high interlayer strength can be secured. Undercoat layer 4
Is composed of a known or commonly used adhesive (anchor coating agent), for example, urethane-based adhesive, isocyanate-based adhesive, polyester-based adhesive, epoxy-based adhesive,
It is formed by a conventional coating method such as a method of applying an adhesive such as an oxazaline adhesive or an organic electrostatic induction prevention adhesive on the support 1 using a kiss roll coater. The thickness of the undercoat layer 4 is about 0.05 to 30 μm. When the undercoat layer 4 is made of a urethane adhesive or the like, the thickness is preferably about 0.05 to 10 μm. If the thickness of the undercoat layer 4 is too large, the handleability of the cover tape is impaired, which is disadvantageous in terms of cost.

When the support 1 and the heat-adhesive resin layer 2 can be laminated with high adhesive strength, the undercoat layer 4 does not necessarily have to be provided.

Further, by providing the intermediate layer 5, the adhesiveness between the support 1 and the thermal adhesive resin layer 2 can be enhanced. The intermediate layer 5 includes, for example, polyethylene (for example, low-density polyethylene, linear low-density polyethylene, metallocene-catalyzed polyethylene, medium-density polyethylene, high-density polyethylene, etc.), ethylene copolymer (for example, ethylene-α-olefin copolymer). A thermoplastic resin such as a polyolefin-based resin (such as a coalesced product); a thermoplastic elastomer; rubber or the like, and particularly preferably a polyolefin-based resin. The polymers constituting the intermediate layer 5 may be used alone or in combination of two or more. Middle layer 5
Can be formed by laminating the above-mentioned constituent polymers by a conventional method such as an extrusion laminating method, a co-extrusion method using a T-die tandem extrusion laminator, or a dry laminating method.

If necessary, the surface of the intermediate layer 5 may be subjected to a conventional surface treatment such as corona discharge treatment or plasma treatment to improve the activity. The thickness of the intermediate layer 5 can be appropriately selected within a range that does not impair the handleability of the cover tape, but is generally about 5 to 30 μm.

When the support 1 and the heat-adhesive resin layer 2 can be laminated with high adhesive strength, the intermediate layer 5 does not necessarily have to be provided.

Examples of the base polymer constituting the heat-adhesive resin layer 2 include, for example, an olefin copolymer containing a carboxyl group or an acyloxy group in the molecule, an ionomer resin, and a block of an aromatic vinyl compound and a conjugated diene compound. Polymers of at least one component selected from copolymers can be used. These polymers may be used alone or in combination of two or more.

Examples of the olefinic copolymer containing a carboxyl group in the molecule include ethylene-acrylic acid copolymer (EAA), ethylene-methacrylic acid copolymer (EMAA), ethylene-maleic acid (or (Fumaric acid) copolymer such as ethylene-unsaturated carboxylic acid copolymer; propylene-acrylic acid copolymer, propylene-
Propylene-unsaturated carboxylic acid copolymers such as methacrylic acid copolymers and propylene-maleic acid (or fumaric acid) copolymers; ethylene-vinyl acetate-unsaturated carboxylic acid copolymers and the like. These polymers may be used alone or in combination of two or more.

In the olefin-based copolymer containing a carboxyl group in the molecule, the content of the carboxyl group-containing monomer unit (eg, the content of acrylic acid moiety in EAA) is, for example, 4 to 30% by weight, preferably 10 to It is 15% by weight. If it is less than 4% by weight, the adhesiveness tends to decrease, and since the number of cross-linking starting points is small, the heat resistance after curing tends to decrease. When it exceeds 30% by weight, the stress relaxation property tends to decrease due to an increase in elastic modulus after curing, and the hygroscopic property of the heat-adhesive resin also increases due to the hygroscopic property of the carboxyl group. The vapor pressure caused by the vaporization of the moisture causes a problem that peeling and voids (spaces) are likely to occur.

The ethylene-acrylic acid copolymer (EA
As A), for example, Nippon Polychem Co., Ltd., trade name “Novatech EAA”; Dow Chemical Japan Co., Ltd., trade name “Primacol” and the like are commercially available, and the ethylene-methacrylic acid copolymer ( EMAA), for example, manufactured by Mitsui DuPont Polychemical Co., Ltd.,
Commercial products such as the product name "Nukurel" are available.

Examples of the olefin copolymer containing an acyloxy group (eg acetoxy group) in the molecule include ethylene-vinyl acetate copolymer (EVA) and ethylene-ethylene diacetate copolymer. Polymers: propylene-based copolymers such as propylene-vinyl acetate copolymer and propylene-ethylene diacetate copolymer. At this time, the content of the acyloxy group-containing monomer unit (for example, the content of vinyl acetate in EVA) is, for example, 6 to 28% by weight, preferably 6 to 14% by weight. When the amount is less than 6% by weight, the adhesiveness becomes poor, and when the amount is more than 28% by weight, the film cracking at the time of film formation due to the adsorbed moisture due to the increase in hygroscopicity and the adhesiveness stability are poor.

The ethylene-vinyl acetate copolymer (EV
As A), for example, the vinyl acetate content is 10% by weight.
Commercially available products such as Mitsui Chemicals Co., Ltd., trade name “Mirason”; Mitsui DuPont Polychemical Co., Ltd., trade name “Evaflex” are available below.

Examples of the ionomer resin include resins obtained by crosslinking a part of the carboxyl groups of the ethylene-unsaturated carboxylic acid copolymer with a metal. As the ionomer resin, for example, a product name “HIMIRAN” manufactured by Mitsui DuPont Polychemical Co., Ltd. is commercially available.

The block copolymer of an aromatic vinyl compound and a conjugated diene compound is, for example, a block composed of a polymer portion of an aromatic vinyl compound such as polystyrene and a polymer portion of a conjugated diene compound such as polybutadiene or polyisoprene. A copolymer is mentioned.

The block copolymer of the aromatic vinyl compound and the conjugated diene compound is preferably hydrogenated from the viewpoint of thermal stability. Further, maleic acid or the like is further added to form a phase copolymer with the polyolefin resin. It is more preferable that the solubility and the reactivity with the epoxy resin are enhanced. Examples of such block copolymers include Asahi Kasei Kogyo Co., Ltd., trade name “Tuftec M Series”; Shell Japan Co., Ltd., trade name “Clayton FG1901X”
Commercial products such as

As the base polymer constituting the heat-adhesive resin layer 2, of the above polymers, an olefin copolymer and a block copolymer may be used in combination. In this case, the ratio of use is, for example, olefin-based copolymer / block copolymer = 40/60 to 80/20 (weight ratio), and preferably 45/55 to 70/30 (weight ratio). . When the use ratio of the olefin-based copolymer is less than 40% by weight, the rubber-like property becomes stronger and the processability is lowered, and the content of the functional group such as carboxyl group in the adhesive composition is decreased. Adhesion and heat resistance are also reduced. When the use ratio of the olefin-based copolymer is more than 80% by weight, it becomes difficult to form a heat-adhesive resin layer having a good appearance.

In addition to the base polymer, a tackifying resin, an antistatic agent, a conductive material and the like are often added to the heat-adhesive resin layer 2. Examples of the tackifying resin include petroleum resin [aliphatic petroleum resin (C ₅ series), aromatic petroleum resin (C ₉ series), alicyclic petroleum resin obtained by hydrogenating the aromatic petroleum resin], rosin series Examples thereof include resins, phenol resins, alkylphenol resins, styrene resins, terpene resins (dipentene resin, α-pinene resin, β-pinene resin, terpene phenol resin, terpene resin obtained by hydrogenating the terpene resin, etc.). These tackifying resins can be used alone or in combination of two or more. By including the tackifying resin in the heat-adhesive resin layer 2, taping workability is improved and stable and good adhesive force can be obtained with respect to a packaging base material such as a carrier tape.

The softening temperature of the tackifying resin is preferably 50 ° C. or higher. When the softening temperature is lower than 50 ° C, the heat-adhesive resin layer is likely to be softened during transportation or storage, and electronic components are adhered and fused to the heat-adhesive resin layer to cause a problem when incorporated into a circuit board or the like. .

The amount of tackifying resin compounded is about 1 to 100 parts by weight, preferably about 5 to 50 parts by weight, based on 100 parts by weight of the base polymer. When the amount of the tackifying resin is less than 1 part by weight, the adhesive strength is low and the tape may float after taping and the parts may pop out. Also,
If the compounding amount of tackifying resin exceeds 100 parts by weight, the adhesive strength will be too high and the tape will break, or the thermo-adhesive resin layer will become hard and slip stick phenomenon (running) will occur at the time of peeling and parts will pop out. Variations in peel strength will increase, for example, it will become easier.

Examples of the antistatic agent include anionic surfactants such as alkyl sulfates and alkylaryl sulfates; cationic surfactants such as quaternary ammonium salts; nonionic surfactants such as glycerin monostearate. Agents; amphoteric surfactants such as betaine such as dimethylalkyl betaine; surfactants such as tertiary amines. Examples of the conductive material include metal oxides, metal powders, carbon black, and the like. The blending amount (total) of the antistatic agent and the conductive material is, for example, 0.05 to 50 parts by weight, preferably 0.1 to 10 parts by weight, based on 100 parts by weight of the base polymer. If the blending amount of these additives exceeds 50 parts by weight, the adhesiveness tends to decrease.

The heat-adhesive resin layer 2 further includes an inorganic filler (eg silica, alumina, aluminum hydroxide, magnesium hydroxide, etc.), an organic filler, a pigment, as long as the characteristics of the cover tape are not deteriorated. You may mix | blend additives, such as an antioxidant and a coupling agent (for example, silane coupling agent etc.). As the inorganic filler, those subjected to surface treatment with a silane coupling agent are preferable from the viewpoint of compatibility with resin and improvement of adhesion. The amount of each additive compounded is, for example, about 0 to 10 parts by weight (preferably 0.01 to 1 part by weight) with respect to 100 parts by weight of the base polymer. If the compounding amount of the additive exceeds 10 parts by weight, the adhesiveness is likely to decrease.

The thickness of the heat-adhesive resin layer 2 can be appropriately selected within a range that does not impair the adhesiveness, handleability and the like.
Generally, it is from 1 to 150 μm, preferably from 5 to 50 μm. When the thickness of the heat-adhesive resin layer 2 is less than 1 μm, the adhesive strength is weak, and when it exceeds 150 μm, the total thickness of the tape increases and the taping failure easily occurs due to the adhesive sticking out at the time of taping.

The surface of the heat-adhesive resin layer 2 is, if necessary,
A conventional surface treatment such as corona discharge treatment or plasma treatment may be applied to improve the activity.

The heat-adhesive resin layer 2 is obtained by melt-mixing the base polymer with a tackifying resin, an antistatic agent, a conductive material, and other additives, if necessary, with a kneader kneader, a continuous biaxial kneader, or the like. Then, the obtained mixture (or pelletized product) is subjected to, for example, an extrusion laminating method, T
It can be formed by laminating by a conventional method such as a coextrusion method using a die tandem extrusion laminator or the like, a dry laminating method or the like.

The antistatic layer 3 is composed of a resin layer containing an antistatic agent, and is provided outside the support 1 or between the support 1 and the thermal adhesive resin layer 2. As the antistatic agent, those exemplified above can be used. Examples of the resin forming the resin layer include olefin resins such as polyethylene and polypropylene; ethylene-acrylic acid copolymer (EAA), ethylene-methacrylic acid copolymer (EMAA), ethylene-ethyl acrylate copolymer. , Ethylene-vinyl acetate copolymer (EVA) and other ethylene-based binary copolymers; ethylene-butyl acrylate-
Examples include ethylene-based terpolymers such as methacrylic acid copolymers.

The thickness of the antistatic layer 3 is, for example, 0.005.
It is about 5 μm. By adjusting the thickness within the above range, the surface resistivity on both surfaces of the cover tape can be controlled. If less than 0.005 μm,
It is not preferable because the antistatic effect is deteriorated, interlayer breakage of the laminate is apt to occur, and when the thickness exceeds 5 μm, the antistatic effect is high, but transparency is deteriorated and adhesiveness to the carrier tape is deteriorated.

The cover tape for carrying electronic parts according to the present invention comprises:
For example, at least one of a laminate in which the thermal adhesive resin layer 2 is provided on the support 1 and the antistatic layer 3 is provided outside the support 1 or between the support 1 and the thermal adhesive resin layer 2. Can be manufactured by applying at least one treatment selected from a humidifying treatment with a humidifier, a steam spraying treatment, and a water-based antistatic agent spraying treatment.

The water-based antistatic agent is water-soluble or water-dispersible among the above-mentioned antistatic agents, specifically, anionic surfactants such as sodium dodecyl sulfate and quaternary ammonium salts. Such as cationic surfactants, nonionic surfactants such as polyoxyethylene alkyl ethers, amphoteric surfactants such as betaines such as dimethylalkyl betaines; water-soluble or water-dispersible surfactants such as tertiary amines Examples thereof include an aqueous solution or an aqueous dispersion. Further, as the water-based antistatic agent,
It is also possible to use an aqueous dispersion liquid in which conductive fine particles (conductive material) such as metal oxide, metal powder, carbon black and the like are dispersed in water.

The above treatment is performed by the support 1 and the heat-adhesive resin layer 2.
And at least one surface of the laminate having the antistatic layer 3. The treatment may be carried out in combination with the surface treatment, and for example, it is carried out by a method of performing steam spray treatment or water-based antistatic agent spray treatment at the same time as performing any of corona discharge treatment and plasma treatment. be able to.

After the treatment, it is preferable to go through a curing (curing) and a drying step in order to fix the surface active agent and the like on the adherend surface.

The cover tape for carrying electronic parts according to the present invention comprises:
On the surface of the heat-adhesive resin layer 2, the contact angle with water is in the range of 0.5 to 95 °, and the surface resistivity is 1.
The main feature is that it is 0 × 10 ¹³ Ω / □ or less.

For the contact angle of water on the surface of the heat-adhesive resin layer 2, the composition of the resin forming the heat-adhesive resin layer 2 may be appropriately selected and / or the heat-adhesive resin layer 2 may be provided on the support 1. After forming a laminated body provided with the antistatic layer 3 on the outer side of the support 1 or between the support 1 and the heat-adhesive resin layer 2, the above-mentioned steam spray treatment is performed on the surface of the heat-adhesive resin layer 2. When performing the processing such as the above, it can be adjusted within a certain numerical range by appropriately selecting the spray amount, spray time, and type of spray component. Further, by the same method, the surface resistivity of the surface of the heat-adhesive resin layer 2 is 1.0 × 10 ¹³ Ω / □ or less, preferably 10 ² to 1 in an environment of 23 ° C. and 30% RH.
It can be adjusted within the range of 0 ¹³ Ω / □, particularly 10 ^{4 to} 5 × 10 ¹² Ω / □. Further, the critical surface tension γc on the surface of the heat-adhesive resin layer 2 can be adjusted within the range of 2.6 × 10 ^{−4 to} 7.0 × 10 ⁻⁴ N / cm by the same method as described above. Is.

The cover tape for carrying electronic parts according to the present invention comprises:
In addition to the above characteristics, the surface of the cover tape on the opposite side of the heat-adhesive resin layer 2 has a contact angle with water of 0.5 to 7
It is preferably in the range of 0 °, and more preferably the surface resistivity of both surfaces of the cover tape is 1.0 × 10 ¹³ Ω / □ or less.

The contact angle of water on the surface of the cover tape opposite to the heat-adhesive resin layer 2 is determined by the antistatic layer 3 described above.
The heat-adhesive resin layer 2 is provided on the support 1, and the antistatic layer 3 is provided outside the support 1 or between the support 1 and the heat-adhesive resin layer 2. After forming the provided laminated body, when performing one of the surfaces of the laminated body or both surfaces of the laminated body with the above-mentioned steam spraying treatment or the like, the amount of spraying, the spraying time, and the type of the spraying components are appropriately selected to be constant. It can be adjusted within the numerical range of. Furthermore, the heat-bonding resin layer 2
The surface resistivity of both surfaces of the cover tape is, for example, 1.0 × 10 ¹³ Ω under the environment of 23 ° C. and 30% RH by appropriately adopting the method of adjusting the characteristics of the surface of the cover tape or the surface opposite thereto. / □ or less, preferably 10 ² Ω / □ ~
It can be adjusted within the range of 10 ¹³ Ω / □, particularly 10 ⁴ Ω / □ to 5 × 10 ¹² Ω / □.

The cover tape for carrying electronic parts of the present invention preferably has a light transmittance of 80% or more. The light transmittance of the tape can be adjusted by appropriately selecting the constituent components and thickness of each layer such as the support 1, the heat-adhesive resin layer 2 and the antistatic layer 3. In particular, in the method of the present invention, the antistatic property is imparted by performing any one of humidification treatment, steam spraying, and water-based antistatic agent spraying, so that high transparency can be obtained.

The cover tape for carrying electronic parts according to the present invention comprises:
Affix the cover tape to a paper backing paper, 60 ℃, 90% RH
The peeling strength after standing for 30 days under the environment of 0.1 to 0.
It is preferably about 9 N (EIAJ standard), more preferably about 0.1 to 0.7 N, and particularly preferably about 0.1 to 0.3 N. This peeling force can be adjusted by, for example, appropriately selecting the composition of the resin that constitutes the thermal adhesive resin layer 2.

The electronic component carrier of the present invention comprises an electronic component housing portion for housing an electronic component, and a cover tape for covering the electronic component housing portion. Cover tapes for parts transportation are used.

As a typical example of such an electronic component carrier, an embossed carrier tape in which electronic component accommodating recesses for accommodating electronic components are formed at predetermined intervals in the longitudinal direction at a substantially central portion in the width direction. And a cover tape for transporting electronic components for covering the upper surface of the recess for storing electronic components.

The material of the embossed carrier tape may be any one having self-supporting property, and for example, paper such as Japanese paper, crepe paper, synthetic paper, mixed paper, composite paper; polyethylene, polypropylene, polyethylene terephthalate, poly A plastic film or sheet such as vinyl chloride or cellophane; a metal foil can be used.

As another example of the electronic component carrier of the present invention, for example, a square hole punch carrier tape having a square punch hole for inserting a component and a lower surface of the square hole of the square hole punch carrier tape are covered. An example of the carrier is a bottom cover tape for covering the top surface of the square hole of the square hole punch carrier tape and a top cover tape for covering the top surface of the square hole. In such a carrier, the cover tape for carrying electronic parts of the present invention can be used, for example, as the top cover tape.

The cover tape for carrying electronic parts and the electronic part carrier of the present invention can be suitably used for carrying a wide range of chip type electronic parts such as resistors such as chip fixed resistors and capacitors such as laminated ceramic capacitors. .

[0062]

According to the cover tape for transporting electronic parts of the present invention, the surface characteristics such as the contact angle with respect to water and the surface resistivity are set within a certain numerical range. Good peelability that can be prevented and appropriate adhesiveness can be exhibited, and variations in peel strength during peeling can be reduced. Moreover, high transparency can be maintained, and the visibility of electronic components is improved. Therefore, it is possible to prevent various process troubles in a series of processes from the transportation of electronic components to the process of assembling them into the circuit board, and the reliability of components and the reliability of mounting are greatly improved.

In the cover tape for transporting electronic parts having the above characteristics, the heat-adhesive resin layer is provided on the support, and the antistatic layer is provided outside the support or between the support and the heat-adhesive resin layer. It can also be produced by the method of the present invention, such as performing a treatment such as water vapor spraying on at least one surface of the provided laminate, adjusting the thickness of the antistatic layer, or the like.

[0064]

The present invention will be described in more detail based on the following examples, but the invention is not intended to be limited by these examples. In the following, "parts" means "parts by weight".

Example 1 Ethylene-vinyl acetate copolymer (EVA; manufactured by Mitsui DuPont Polychemical Co., Ltd., trade name "Evaflex P-"
1407 ") 100 parts, alicyclic hydrocarbon resin (manufactured by Arakawa Chemical Co., Ltd., trade name" ALCON P-100 ") 20 parts,
Two parts of glycerin monostearate (antistatic agent; Riken Vitamin Co., Ltd., trade name "S-100") was kneaded in a kneader kneader at 140 ° C. for 20 minutes, then pelletized and heat-bonded resin. Got Polyester film with antistatic layer (support with antistatic layer; Toyobo Co., Ltd.,
Anchor coating agent (undercoat layer; urethane adhesive) is applied to the surface opposite to the antistatic layer of the product name "E7415") and dried, and low density polyethylene (LD-P
E: Mitsui Chemicals, Inc., trade name "Mirason 10P") resin was melt extruded to provide an intermediate layer. Furthermore, the pelletized heat-adhesive resin is melt-extruded by an extrusion laminating machine to provide a heat-adhesive resin layer, and an antistatic layer (thickness 0.1 μm) / support (polyester film;
Thickness 24.9 μm) / undercoat layer (thickness 0.5 μm) / intermediate layer (LD-PE; thickness 15 μm) / thermoadhesive resin layer (E
VA + alicyclic hydrocarbon resin + antistatic agent; thickness 20μ
A laminated body (total thickness 60 μm) having a layer structure of m) was obtained. Thereafter, both surfaces of the laminate were subjected to steam spraying treatment with a humidifier, dried and rolled up to produce a cover tape for transporting electronic components.

Example 2 30 parts of a styrene block copolymer (manufactured by Shell Chemical Co., Ltd., trade name "Califlex TR1186"), ethylene-vinyl acetate copolymer (manufactured by Mitsui DuPont Polychemical Co., Ltd.) Name "Eva Flex P-1407") 7
0 parts, terpene phenolic resin (Arakawa Chemical Co., Ltd.,
Trade name "Tamanol 803") 20 parts, antistatic agent (manufactured by Riken Vitamin Co., Ltd., trade name "Riquey Mar SE-30"
1 ") 0.5 part in a kneader kneader at 140 ° C for 2
After kneading for 0 minutes, the mixture was pelletized to obtain a heat-adhesive resin. Polyester film with antistatic layer (support with antistatic layer; manufactured by Toyobo Co., Ltd., trade name “E7415”)
Anchor coat agent (undercoat layer; urethane adhesive) is applied and dried on the surface opposite to the antistatic layer, and low density polyethylene (LD-PE; Asahi Kasei Co., Ltd., trade name "L-1885") is applied on the upper layer. The resin was melt extruded to provide an intermediate layer. Further, the pelletized heat-adhesive resin was melt-extruded by an extrusion laminating machine to provide a heat-adhesive resin layer, and an antistatic layer (thickness 0.1 μm) / support (polyester film; thickness 24. 9 μm) / undercoat layer (thickness 0.5 μm) / intermediate layer (LD-PE; thickness 15 μm)
/ Thermal adhesive resin layer (styrene block copolymer + EVA
+ Terpene phenolic resin + antistatic agent; thickness 20μ
A laminated body (total thickness 60 μm) having a layer structure of m) was obtained. After that, the surface of the heat-adhesive resin layer of the laminate was treated with dimethylalkylbetaine (amphoteric surfactant; trade name "SAT-4", manufactured by Nippon Pure Chemical Industries, Ltd.) as an antistatic agent (Molecular Coating System: After spraying with an ultra-high pressure nozzle, a hot air drying process was performed at 70 to 80 ° C., and the film was rolled up to produce a cover tape for transporting electronic components.

Comparative Example 1 In Example 1, polyester film with antistatic layer (support with antistatic layer; manufactured by Toyobo Co., Ltd., trade name "E7"
415 "), a polyester film having no antistatic layer (support: manufactured by Toray Industries, Inc., trade name" S "
-10 "; thickness 25 μm), and a cover tape for transporting electronic components was produced in the same manner as in Example 1 except that the steam spraying treatment was not performed.

Comparative Example 2 A cover tape for transporting electronic parts was produced in the same manner as in Example 1 except that the steam spray surface treatment was not performed.

Comparative Example 3 In Example 1, polyester film with antistatic layer (support with antistatic layer; manufactured by Toyobo Co., Ltd., trade name “E7”)
415 "), a polyester film having no antistatic layer (support: manufactured by Toray Industries, Inc., trade name" S "
-10 "; a thickness of 25 µm), and a cover tape for carrying electronic parts was produced in the same manner as in Example 1.

Evaluation Test The following tests were performed on the tapes obtained in the examples and comparative examples. The results are shown in Table 1. (Contact Angle) The contact angles of water on the heat-bonding resin layer side surface and the antistatic layer surface were measured with an automatic contact angle meter (CA-X type, manufactured by Kyowa Interface Science Co., Ltd.). (Surface Resistivity) The surface resistivity of the surface of the heat-adhesive resin layer and the surface of the antistatic layer was measured by a micro-current electrometer according to the test standard according to JIS K6911. (Critical surface tension) Critical surface tension of the surface of the thermal adhesive resin layer γ
c was calculated based on the measured value of the contact angle. (Peeling force) The tapes (width: 5.
The heat-adhesive resin layer side (3 mm) is placed on a paper mount, and a taping machine (manufactured by Tokyo Wells) is used, and the temperature is 180.
After pressure-bonding for 0.2 seconds under conditions of ° C and pressure of 0.25 MPa, aging was performed at room temperature for 1 hour or more. Using a Tensilon tensile tester, the peeling force was measured under the conditions of a peeling speed of 300 mm / min and a peeling angle of about 180 °. Further, after the above pressure-bonding operation, the peeling force when stored for 30 days under the conditions of 60 ° C. and 90% RH was measured. (Light transmittance) The light transmittance of the tape was measured by a haze meter.

[0071]

[Table 1] The tapes of Examples 1 and 2 had a contact angle to water and a surface resistivity within appropriate numerical ranges, and were excellent in peeling force and light transmittance. On the other hand, in the tapes of Comparative Examples 1 to 3, the contact angle to water and the surface resistivity deviated from the desirable numerical ranges, and the peeling force during storage was decreased.

[0072]

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view showing an example of a cover tape for carrying electronic parts of the present invention.

FIG. 2 is a schematic cross-sectional view showing another example of the electronic component carrying cover tape of the present invention.

[Explanation of symbols]

1 support 2 Thermal adhesive resin layer 3 Antistatic layer 4 Undercoat layer 5 Middle class

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Wataru Kakimoto             Nitto 1-2, Shimohozumi, Ibaraki City, Osaka Prefecture             Electric Works Co., Ltd. (72) Inventor Atsushi Tani             Nitto 1-2, Shimohozumi, Ibaraki City, Osaka Prefecture             Electric Works Co., Ltd. F-term (reference) 3E067 AB41 AC04 BA26A BB01A                       BB14A BB22A BB25A CA11                       CA21 CA24 CA30 EA35 EB27                       EC07 EC25 EE26 FA09                 4D075 AE03 AE27 BB79Z BB92Z                       CA12 CA22 DA04 DB18 DB36                       DB37 DB48 DB53 DB55 DC21                       DC36 EA35 EB08 EB12 EB13                       EB14 EB19 EB20 EB22 EB56                       EC54 EC60                 4F100 AK03C AK06 AK06B AK42                       AK42A AK70C AK73C AL01C                       BA03 BA07 BA16 CA22C                       CB01 EH23 EH46 EJ64 EJ86                       GB41 JB05C JB06C JG03                       JG03B JG04 JL11 JL12C                       JN01 YY00C                 5E313 AA03 AA18 CC05 DD31

Claims (11)

[Claims] 1. A cover tape for transporting electronic components, comprising: a heat-adhesive resin layer provided on a support; and an antistatic layer provided outside the support or between the support and the heat-adhesive resin layer. Then, on the surface of the heat-adhesive resin layer, the contact angle to water is 0.5 to 95 °, and the surface resistivity is 1.0 × 10 ¹³ Ω.
/ □ or less cover tape for transporting electronic components. 2. The cover tape for transporting electronic components according to claim 1, wherein the critical surface tension γc on the surface of the heat-adhesive resin layer is 2.6 × 10 ^{−4 to} 7.0 × 10 ⁻⁴ N / cm. 3. The cover tape for transporting electronic components according to claim 1, wherein the surface of the cover tape on the side opposite to the heat-adhesive resin layer has a contact angle with water of 0.5 to 70 °. 4. The cover tape for carrying electronic parts according to claim 1, wherein the surface resistivity of both surfaces of the cover tape is 1.0 × 10 ¹³ Ω / □ or less. 5. The heat-adhesive resin layer is selected from an olefin copolymer containing a carboxyl group or an acyloxy group in the molecule, an ionomer resin, and a block copolymer of an aromatic vinyl compound and a conjugated diene compound. At least one component of a polymer, 1 to 100 parts by weight of an adhesion-imparting resin with respect to 100 parts by weight of the polymer, and the polymer 1
The cover tape for transporting electronic components according to any one of claims 1 to 4, which is composed of 0.05 to 50 parts by weight of an antistatic agent and / or a conductive material with respect to 00 parts by weight. 6. The thickness of the antistatic layer is 0.005 to 5 μm.
The cover tape for transporting electronic components according to any one of claims 1 to 5. 7. The cover tape according to claim 1, wherein at least one surface of the cover tape is subjected to at least one treatment selected from a humidifying treatment, a steam spraying treatment, and a water-based antistatic agent spraying treatment. A cover tape for transporting electronic components according to item. 8. A cover tape is attached to a paper mount for 60
The cover tape for transporting electronic components according to claim 1, which has a peel force of 0.1 to 0.9 N after being left for 30 days in an environment of 90 ° C. and 90% RH. 9. The light transmittance is 80% or more.
The cover tape for electronic component conveyance as described in any one of 8-8. 10. A thermal adhesive resin layer is provided on a support,
And, on at least one surface of the laminate having an antistatic layer provided on the outer side of the support or between the support and the heat-adhesive resin layer, selected from humidification treatment, steam spray treatment, and water-based antistatic agent spray treatment. A method of manufacturing a cover tape for transporting electronic components, which comprises subjecting at least one of the above-mentioned treatments. 11. An electronic component carrier comprising an electronic component housing portion for housing an electronic component and a cover tape covering the electronic component housing portion, wherein the cover tape is any one of claims 1 to 9. An electronic component transporter using the cover tape for transporting electronic components according to the above item.