JP4437505B2 - Laminated tape for packaging materials - Google Patents

Description

  The present invention relates to a laminated tape used as a packaging material for wrapping electronic components and the like when conveying chip-type electronic components.

  As a method of transporting chip components, a taping reel method is known in which the electronic components are packaged and transported in a packaging material. In this taping reel method, parts are inserted into a carrier (paper packaging substrate) with pockets for storing chip-type parts at regular intervals along the length of the tape-shaped cardboard, and cover tape (top tape) is applied from above. It is heat-sealed and sealed, wound up in a reel shape, and conveyed. After transport, in the manufacturing process of circuit boards and the like, the system that peels the cover tape and sucks the chip parts with the air suction nozzle and mounts on the board has become the mainstream

  In such a series of steps from taping to chip supply to the substrate, the following performance is required for the cover tape used as a packaging material for electronic components in order to supply chips reliably. . That is, (1) having good adhesion to a paper packaging substrate. (2) When the cover tape is peeled off, there should be stable peelability, no fluff is generated from the paper packaging substrate, and there is no trouble when mounting the components. (3) It is excellent in so-called antistatic property that suppresses the chip from popping out of the pocket due to peeling electrification generated when the cover tape is peeled off. (4) During transportation, parts do not adhere to the cover tape due to environmental conditions.

  Particularly in recent years, chip-type electronic components have become increasingly smaller in size, and the phenomenon of flaking off the surface of the paper packaging substrate that occurs when the cover tape is peeled off (occurrence of fluff) has an adverse effect on the suction nozzle of the mounting machine. Giving rise to a decrease in the mounting rate. For this reason, especially in cover tapes used for packaging of extremely small parts, it has an excellent releasability, and it is an important performance along with antistatic performance that the surface of the paper packaging substrate is not fluffed at the time of peeling. There is a desire for such a cover tape.

  Packaging substrate containing at least one component selected from polyvinyl acetate resin, ethylene copolymer, acrylic resin and wax on the surface or inside as a method for suppressing the peeling voltage of the packaging material And an olefin copolymer containing a carboxyl group or an acyloxy group in the molecule, an ionomer resin, and at least one polymer selected from a block copolymer of an aromatic vinyl compound and a conjugated diene compound. A method of combining a cover tape having an adhesive resin layer formed of a resin composition has been proposed (see Patent Document 1). In this method, since an effect cannot be obtained when different types of base materials and cover tapes are combined, a cover tape that can exhibit antistatic performance regardless of the types of base materials to be combined is desired.

  In addition, as an antistatic cover tape, an adhesive layer in which an antistatic agent (surfactant = low molecular weight antistatic agent) is kneaded into a polyolefin resin is laminated on a supporting substrate via an intermediate layer. Is known (see Patent Document 2). In this cover tape, the low molecular weight antistatic agent blended as the antistatic agent bleeds at the interface between the cover tape and the paper packaging substrate, and the peel strength is lowered. For this reason, in order to ensure adhesiveness, the adhesion imparting agent is mix | blended and the peel strength is maintained. However, since the antistatic agent, which is a low molecular component, moves in the adhesive layer, sometimes the adhesive force with the paper packaging substrate is increased, or the adhesive force is locally increased. When the cover tape is peeled off, the surface layer of the paper packaging substrate may be torn off to generate fluff. Such a cover film can be sufficiently practically used depending on the size of the component, but in the case of a very small size chip-type electronic component, the surface layer of the paper packaging substrate that is generated when the cover tape is peeled off is peeled off. The phenomenon (generation of fluff) has an adverse effect on the suction nozzle of the mounting machine, causing problems such as a decrease in mounting rate. For this reason, especially for cover tapes used for packaging of extremely small parts, it has an excellent releasability, and at the time of peeling, it is important performance along with antistatic performance not to fluff the surface of the paper packaging substrate. .

  In addition, as a method for preventing the surface resistivity of the adhesive layer from changing depending on temperature and humidity, and thereby causing the surface of the adhesive layer to be charged, it has been studied to add a polymer type antistatic agent to the adhesive. (See Patent Document 3). In such a cover tape, in order to ensure adhesion with the carrier mount, a large amount of tackifier is added to the adhesive, so that the adhesive strength becomes stronger than an appropriate value, or the releasability with time. The paper tape on the surface of the paper packaging substrate is peeled off (fluff generation), which may cause defects in mounting, and a cover tape that does not have such a problem is desired.

Furthermore, due to peeling vibration (chatter) that occurs when the cover tape is peeled from the paper packaging substrate, the chip component in the carrier mount cavity tilts or jumps out of the cavity (chip jump). When sucking with the air suction nozzle, suction at an accurate position is not possible, which causes a reduction in the mounting rate. Such a problem of peeling vibration becomes more prominent as the chip parts become smaller and lighter. Moreover, even if the same cover tape is used, the adhesive strength differs depending on the type and lot of the carrier mount. Therefore, in order to peel the cover tape with a constant peeling force and reduce the peeling vibration, the crimping conditions in the taping machine High-level management is required, such as adjusting each time the type and lot of paper packaging base material changes. For this reason, there is a demand for a cover tape that stably develops a certain adhesive force under a certain pressure bonding condition and hardly causes peeling vibration regardless of the type and lot of the carrier mount.
JP 2003-341720 A Japanese Unexamined Patent Publication No. 2000-191991 JP 2001-200217 A

The object of the present invention is excellent in thermal adhesiveness to a packaging substrate such as a carrier tape, antistatic performance, and good releasability capable of peeling without fluffing the surface of the paper packaging substrate during peeling over a long period of time. An object of the present invention is to provide a laminated tape for packaging material that can maintain and ensure a high mounting rate.
Another object of the present invention is to stably maintain an appropriate adhesive force even when the environment such as humidity changes, and to maintain a constant adhesive force by a constant pressure condition irrespective of the type and lot of the carrier mount. Even if it is a case where it expresses and it is a case where it uses for the packaging of a microchip component, it is providing the laminated tape for packaging materials which can ensure a high mounting rate.

  As a result of diligent studies to achieve the above object, when the thermal adhesive layer provided on the support substrate layer is composed of specific components, adhesion to the packaging substrate, antistatic properties, suppression of fluff generation during peeling, peeling vibration It was found that any of the suppressions can be satisfied, and the present invention has been completed.

That is, in the present invention, a thermal adhesive layer containing a base polymer composed mainly of a polyolefin resin , an alicyclic petroleum resin as a tackifying resin , and a polymer-type antistatic agent is laminated on a supporting base material layer. A laminated tape for packaging material, wherein the base polymer contains 5 to 40% by weight of an ethylene-α-olefin copolymer, and the thermal adhesive layer is a tackifying resin with respect to 100 parts by weight of the base polymer. 1-20 parts by weight of an alicyclic petroleum resin as to provide a packaging material for a laminated tape according to claim 1 to 30 parts by weight including that of the polymeric antistatic agent containing a polyether structure.

  In the packaging tape, the packaging tape can be used as a packaging tape when a chip-type electronic component is conveyed.

  In this specification, the following invention is also described.

  A laminated tape for packaging materials in which a thermal adhesive layer containing a base polymer composed mainly of a polyolefin resin, a tackifying resin, and a polymer type antistatic agent is laminated on a supporting base material layer, The laminated tape for packaging materials, wherein the agent layer contains 1 to 20 parts by weight of a tackifier resin and 1 to 30 parts by weight of a polymer-type antistatic agent with respect to 100 parts by weight of the base polymer.

  As the polymer type antistatic agent, those containing a polyether structure can be suitably used.

  The thermal adhesive layer preferably contains 2 to 13 parts by weight of a tackifier resin and 10 to 30 parts by weight of a polymer antistatic agent with respect to 100 parts by weight of the base polymer.

  The base polymer constituting the thermal adhesive layer contains at least an ethylene-α-olefin copolymer, and the content thereof is preferably 50% by weight or less of the base polymer.

  As the polymer antistatic agent containing a polyether structure, a polymer antistatic agent containing a polyether ester amide can be suitably used.

The thickness of the thermal adhesive layer is 5 to 50 μm, and the surface resistivity of the thermal adhesive layer is preferably 10 ¹³ Ω / □ or less. In addition, when the laminated tape for packaging material of the present invention is heat-sealed to two different paper packaging substrates at 190 ° C., the difference in adhesive strength of the tape to each paper packaging substrate is less than twice. Preferably there is.

  Peeling voltage (23 ° C x 65% RH, peel angle 180 °, peel speed) generated in the adhesive layer when the packaging tape is heat-sealed to the paper base material and then peeled from the paper base material The absolute value of 5000 mm / min and the distance between the electrode and the adhesive layer of 5 mm is preferably 200 V or less.

  The adhesive composition constituting the thermal adhesive layer has a moisture content of 0.5% or less when the adhesive composition is stored for 24 hours in a high-temperature humidity chamber under conditions of 35 ° C. × 80% RH. Preferably there is.

  It is preferable that the laminated tape for packaging material of the present invention can be peeled without fuzzing the paper fibers on the surface of the paper packaging substrate after heat sealing to the paper packaging substrate.

  In the laminated tape for packaging material of the present invention, the thermal adhesive layer is composed of a specific component, so that it has excellent thermal adhesion to a packaging substrate such as a carrier tape, and has long-term antistatic performance and good peelability. Can be maintained over time. For this reason, when the laminated tape for packaging material of the present invention is used as the top cover of a small electronic component packaging material, fluffing on the surface layer of the paper packaging substrate during peeling can be greatly suppressed, and mounting due to fluffing The influence on the air nozzle of the machine can also be suppressed. In addition, regardless of the type of base material to be combined, charging of the top cover surface is prevented, and the influence of the charging on the electronic component is also suppressed, so that favorable component mountability is possible. Furthermore, with respect to a paper packaging substrate that has been widely used, a certain level of adhesiveness is stably exhibited under certain pressure bonding conditions regardless of the type of the substrate. For this reason, when heat-sealing the laminated tape for packaging material to the paper packaging substrate, it is not necessary to finely adjust the crimping conditions according to the type and lot of the paper packaging substrate, and a constant force at the time of peeling. Therefore, peeling vibration is suppressed. Performance such as adhesiveness, peelability, antistatic property, peel vibration prevention property can be achieved without deterioration even after electronic parts are packaged by taping and stored in a warehouse for a long time. . In particular, if anti-static performance is exhibited even in a dry environment where static electricity is likely to be generated, and the thermal adhesive layer is made of an adhesive composition that has a moisture content of a certain value or less after water absorption, it is highly humid or dew condensation. Even at times, a constant adhesive force is expressed and the constant adhesive force is maintained for a long period of time, so that stable mounting is possible regardless of humidity.

  The laminated tape for packaging material of the present invention is composed of a supporting base layer and a thermal adhesive layer provided on the supporting base layer. The supporting substrate constituting the supporting substrate layer may be any material having self-supporting properties, for example, paper such as Japanese paper, thin paper, crepe paper, mixed paper, composite paper; non-woven fabric, cloth; polyethylene, polypropylene, Plastics made of thermoplastic resins such as olefin resins such as ethylene-acid copolymer resins, polypropylene modified resins, thermoplastic elastomers such as styrene thermoplastic elastomers, and polyesters such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate. Films or sheets; metal foils or thin plates composed of metals such as copper and aluminum; and laminates thereof.

  The supporting substrate preferably has a melting point of 90 ° C. or higher. If the melting point is less than 90 ° C, when taping is performed by thermocompression bonding using a metal iron or the like, the support base material may melt and adhere to the iron or the like, and the original packaging purpose may not be achieved. is there.

  The surface of the support substrate layer (the surface opposite to the adhesive layer) may be subjected to conventional surface treatment, easy slip treatment, antistatic treatment, and the like. In addition, the surface of the supporting base material layer that is in contact with the adhesive layer may be subjected to treatment for improving anchoring properties such as ozone treatment and corona treatment, particularly when the supporting base material is a plastic film. Anchoring property improving means by applying an anchor coating agent may be employed.

  The thickness of the supporting base material layer can be selected in a wide range depending on the application within the range in which the mechanical strength, handling property and the like are not impaired, but is generally about 5 to 100 μm, preferably about 10 to 50 μm.

  The thermal adhesive layer is composed of a thermoplastic adhesive containing a base polymer, a tackifying resin, and a polymer type antistatic agent. The base polymer is mainly composed of a polyolefin-based resin, and other polymers, for example, a thermoplastic resin such as a vinyl acetate-based resin, a thermoplastic elastomer, or the like can be used in combination. In addition, the base polymer may be comprised only with polyolefin resin, and can be used 1 type or in combination of 2 or more types.

  Examples of the polyolefin resin include polyolefins such as polyethylene (low density polyethylene, linear low density polyethylene, metallocene catalyzed polyethylene, high density polyethylene, etc.), polypropylene, ethylene-α-olefin copolymer; ethylene copolymer ( For example, ethylene-unsaturated carboxylic acid copolymer such as ethylene-acrylic acid copolymer (EAA) and ethylene-methacrylic acid copolymer (EMAA); ionomer; ethylene-methyl acrylate copolymer, ethylene-acrylic acid (Ethylene copolymer (EEA), ethylene- (meth) acrylic acid ester copolymer such as ethylene-methyl methacrylate copolymer; ethylene-vinyl acetate copolymer (EVA), ethylene-vinyl alcohol copolymer, etc.)) ; Polypropylene modified resin, etc. It is below. The polyolefin resin is contained in the base polymer in an amount of 60% by weight or more, preferably 80% by weight or more, particularly preferably 95% by weight or more.

  Examples of vinyl acetate resins as other polymers include polyvinyl acetate, vinyl acetate- (meth) acrylic acid ester copolymers, vinyl acetate-vinyl ester copolymers, vinyl acetate-maleic acid ester copolymers, and the like. Is mentioned.

  Examples of the thermoplastic elastomer include SIS (styrene-isoprene-styrene block copolymer), SBS (styrene-butadiene-styrene block copolymer), SEBS (styrene-ethylene-butylene-styrene block copolymer), SEPS ( Styrenic thermoplastic elastomers such as styrene-ethylene-propylene-styrene block copolymer) and SEP (styrene-ethylene-propylene block copolymer); styrene block copolymer (for example, styrene block having a styrene content of 5% by weight or more) Copolymer); polyurethane-based thermoplastic elastomer; polyester-based thermoplastic elastomer; blend-based thermoplastic elastomer such as polymer blend of polypropylene and EPT (ternary ethylene-propylene rubber) And the like.

  The base polymer preferably contains an ethylene-α-olefin copolymer within the range of 50% by weight or less in the base polymer. That is, the base polymer is preferably composed of a combination of an ethylene-α-olefin copolymer, a polyolefin resin other than the ethylene-α-olefin copolymer, and, if necessary, other polymers. The content of the ethylene-α-olefin copolymer is more preferably 5 to 40% by weight of the base polymer, and particularly preferably 10 to 35% by weight. By including the ethylene-α-olefin copolymer in the base polymer, the adhesive exhibits appropriate adhesive strength and good peelability, and can prevent changes in adhesive properties over time. When the content of the ethylene-α-olefin copolymer is more than 50% by weight, the adhesive strength exceeds 10 to 70 gf (98.1 to 687 mN) which is an appropriate range. This is not preferable because fuzz is generated on the surface, the thermal adhesive layer becomes too soft, and the adhesive adheres to the sealing iron during pressure bonding with a taping machine. When the ethylene-α-olefin copolymer is contained in the base polymer, for example, as the other polymer, an ethylene-vinyl acetate copolymer resin having a vinyl acetate content of 15% by weight or less, or the vinyl acetate content of 15% by weight. It is preferable to use low density polyethylene in addition to the ethylene-vinyl acetate copolymer resin which is not more than%. Preferred blending amounts in this case are, for example, low density polyethylene: 0 to 10% by weight, ethylene acetate vinyl resin having a vinyl acetate content of 15% by weight or less: 50 to 95% by weight, ethylene-α-olefin copolymer Polymer: 5 to 40% by weight.

  Examples of tackifying resins include petroleum resins (aliphatic petroleum resins, aromatic petroleum resins, alicyclic petroleum resins hydrogenated with the previous aromatic petroleum resin, etc.), rosin resins, terpene resins, styrene resins, coumarone And indene resin. These tackifier resins can be used alone or in combination of two or more. In the case where the adhesive layer is formed by extrusion lamination, alicyclic petroleum resin is particularly preferable from the viewpoint of stability against oxidation because it is melted and oxidized at a high temperature.

  By including a tackifier resin in the adhesive layer, taping workability is improved and a stable and good adhesive force is obtained for a packaging substrate such as a carrier tape.

  The compounding quantity of tackifying resin is 1-20 weight part with respect to 100 weight part of base polymers, Preferably it is 2-13 weight part, Most preferably, it is about 3-10 weight part. When the tackifying resin is less than 1 part by weight, it is difficult to obtain adhesion with a carrier tape (packaging substrate). On the other hand, if the amount exceeds 20 parts by weight, the adhesion to the carrier tape is good, but when peeling, the paper fibers are torn off from the surface of the paper packaging substrate, leading to the generation of fuzz. Problems such as poor adsorption at the surface occur. In addition, the adhesive strength is remarkably increased, and the range of the appropriate adhesive strength of 10 to 70 gf (98.1 mN to 687 mN), which is the standard, is out of the range, so that it is not suitable for use as a top cover tape.

The compounding amount of the polymer type antistatic agent is 1 to 30 parts by weight, preferably 10 to 30 parts by weight, particularly preferably 15 to 25 parts by weight with respect to 100 parts by weight of the base polymer. When the amount of the polymeric antistatic agent is small, the desired antistatic performance cannot be obtained, and the surface resistivity exceeds 10 ¹³ Ω / □. Problems such as sticking occur. On the other hand, if the blending ratio of the polymer type antistatic agent is too large, the antistatic performance will be good, but the adhesive performance will be lowered and the desired adhesive strength will not be obtained. In addition to the polymer antistatic agent, it is also possible to adjust the surface resistivity by using a commonly used low molecular antistatic agent (surfactant). The amount of the low molecular weight antistatic agent used in this case is not particularly limited, but can be appropriately selected within a range not exceeding 5 parts by weight with respect to 100 parts by weight of the base polymer. If the amount of the low molecular weight antistatic agent is too large, problems such as bleeding of the low molecular weight antistatic agent to the surface of the thermal adhesive layer may occur.

As the polymer type antistatic agent, any polymer having antistatic properties can be used and is not particularly limited. Examples thereof include polyamide-based copolymers such as polyether ester amide, carboxylate group-containing polymers such as potassium ionomer, and quaternary ammonium base-containing copolymers. The polymer type antistatic agent moves in the adhesive layer unlike the low molecular type antistatic agent and does not float on the surface of the adhesive layer, so by using the polymer type antistatic agent, Stable antistatic properties and adhesion can be obtained over a long period of time. For example, the surface resistivity of the adhesive layer can be 10 ¹³ Ω / □ or less (for example, about 10 ⁸ to 10 ¹³ Ω / □), preferably about 10 ⁹ to 10 ¹² Ω / □. Moreover, 10-70 gf (98.1 mN-687 mN) which is an appropriate adhesive force can also be stably maintained over a long period of time.

  As the polymer type antistatic agent, for example, polyether ester amide; block polymer of polyolefin and polyether; polymer type antistatic agent containing a polyether structure such as a polymer composed of polyethylene ether and glycol is preferably used. it can. When a polymer type antistatic agent containing a polyether structure is used, when the laminated tape for packaging material is heat-sealed to the packaging substrate and then peeled off, the polyether component remains on the substrate side, and the charge in the adhesive Since a part of the inhibitor is transferred to the surface of the packaging substrate, a high antistatic effect can be exhibited regardless of the type (material) of the packaging substrate. For example, after heat-sealing the laminated tape for packaging material of the present invention to a paper packaging substrate, the absolute value (23 ° C. × 65) of the stripping voltage generated in the thermal adhesive layer when peeled from the paper packaging substrate % RH, peeling angle 180 °, peeling speed 5000 mm / min, distance between the electrode and the adhesive layer 5 mm) is 200 V or less even when any paper packaging substrate is used.

  In addition, since the polyether component remains on the substrate side at the time of peeling, it exhibits a certain adhesive force when heat-sealed under certain conditions to any commonly used paper packaging substrate. . For example, when the laminated tape for packaging material of the present invention is heat-sealed at 190 ° C. to Hokuetsu Papermaking Packaging Base: Trade Name “HOCTO40” and Hokuetsu Papermaking Packaging Base: Tradename “HOCTO40E” The adhesive strength to the packaging base material “HOCTO40E” is within twice the adhesive strength to the paper packaging base material “HOCTO40”. According to the study of the present inventor, the paper packaging substrate “HOCTO40” is a low-molecular-type antistatic agent that does not contain a polymer-type antistatic agent among the paper packaging substrates that are widely used. The paper packaging substrate “HOCTO40E” does not contain a high molecular weight antistatic agent and is the highest for an adhesive containing a low molecular weight antistatic agent. Indicates adhesive strength. For example, commonly used paper packaging substrates such as Fuji Kyowa Paper: trade name “FK-42”, Tokyo Paper: trade name “TK-43”, and Oji Paper: trade name “HJ-42”. The adhesive strength when heat-sealing the laminated tape for packaging material of the present invention at 190 ° C. is the same as when the laminated tape for packaging material of the present invention is heat-sealed at 190 ° C. to the paper packaging substrate “HOCTO40E”. The adhesive strength is less than or equal to twice the adhesive strength when the laminated tape for packaging material of the present invention is heat-sealed to a paper packaging substrate “HOCTO40” at 190 ° C.

  As the polymer type antistatic agent containing a polyether structure, known and commonly used ones can be used. Although not particularly limited, a polymer type antistatic agent containing a polyether ester amide can be particularly preferably used. For example, a polymer type antistatic agent obtained by a reaction of a polyamide having carboxyl groups at both ends and poly (oxyalkylene) glycol and comprising a polyether ester amide having an average molecular weight of about 8000 to 100,000 can be exemplified. The polymer type antistatic agent may be appropriately selected and used in consideration of compatibility and other physical properties depending on the type of base polymer and tackifying resin. The polymer antistatic agent preferably has a thermal decomposition temperature of 120 ° C. or higher in order to prevent deterioration due to high temperature during extrusion lamination or heat sealing.

  The blending amounts of the tackifying resin and the polymer type antistatic agent may be selected within the above-mentioned ranges, respectively, but the total addition amount of the tackifying resin and the polymer type antistatic agent is 100 parts by weight of the base polymer. It is desirable to select within a range of preferably 33 parts by weight or less, more preferably 30 parts by weight or less. When the total amount of addition of the tackifying resin and the polymer antistatic agent is within this range, a laminated tape for a packaging material in which changes over time in properties such as adhesive force and surface resistivity are further suppressed can be obtained. preferable.

  In addition to an antioxidant, an ultraviolet ray inhibitor, and a coupling agent, as a constituent component of the adhesive layer, a mold release agent, a filler, and the like can be added in consideration of easy processability during production. Furthermore, antistatic agents other than those described above can be used in combination.

  Adhesive composition constituting the adhesive layer of the laminated tape for packaging material of the present invention by melt-mixing the above base polymer, tackifying resin, polymer antistatic agent and other components blended as necessary Things are obtained. This adhesive composition has a moisture content of 0 when the adhesive composition is formed into a pellet having a particle size of about 3 mm and stored in a thermostatic chamber at 35 ° C. × 80% RH for 24 hours. 0.5% or less, and particularly preferably 0.3% or less. When the moisture content after moisture absorption is within this range, the adhesive tape has an adhesive layer made of the adhesive, and the adhesive strength variation due to environmental changes is particularly suppressed, and the desired adhesive strength is stable. To last. In particular, a decrease in adhesive strength under high humidity and condensation is remarkably suppressed within the above moisture content range.

  The thickness of the adhesive layer composed of the above components is preferably 5 to 50 μm, particularly preferably about 10 to 30 μm from the viewpoints of adhesion and handling properties. If the thickness of the adhesive layer is less than 5 μm, sufficient adhesive strength may not be obtained. If the thickness is greater than 50 μm, the adhesive may ooze out during heat sealing, causing troubles that contaminate the taping machine or the like.

  In this invention, in order to improve both adhesiveness between the said support base material layer and an adhesive bond layer, an intermediate | middle layer can also be provided. This intermediate layer can be composed of, for example, a thermoplastic resin such as a polyolefin-based resin, a thermoplastic elastomer, or the like. These components can be used alone or in admixture of two or more. As the polyolefin resin and the thermoplastic elastomer, those exemplified above can be used.

  The thickness of the intermediate layer can be appropriately selected within the range that does not impair the workability in the manufacturing process and the handling property when it is made into a laminated tape. For example, when manufactured by a laminating method, the thickness is generally about 5 μm to 30 μm. Is.

  The laminated tape of the present invention is, for example, a conventional single or tandem extrusion laminate in which the constituent components of the adhesive layer are blended at a predetermined ratio, melt blended with a twin-screw kneader, pelletized, or dry blended. According to the method, it can be produced by laminating on a supporting substrate with or without an intermediate layer. Moreover, it can also manufacture by laminating | stacking an adhesive bond layer and an intermediate | middle layer on a support base material layer by coextrusion lamination.

  The laminated tape thus obtained can be suitably used as a laminated tape for a packaging material when a chip-type electronic component such as a resistor such as a chip-fixed resistor or a laminated ceramic capacitor is conveyed. In particular, after heat-sealing to a paper packaging substrate, it has excellent releasability when peeling, and can be peeled without fluffing the paper fibers on the surface of the paper packaging substrate.

EXAMPLES Hereinafter, although this invention is demonstrated in detail based on an Example, this invention is not limited at all by these Examples. In addition, Example 2 is described as a reference example.

Example 1
As a base polymer, ethylene-vinyl acetate copolymer (EVA) (manufactured by Mitsui Petrochemical Co., Ltd .: trade name “Mirason MV0603”) 80 parts by weight; ethylene-α-olefin copolymer 20 parts by weight, alicyclic -Based petroleum resin (Arakawa Chemical Industries, Ltd .: trade name “Arcon P-125”), 10 parts by weight, a polymer type antistatic agent containing a polyether structure (Sanko Chemical Industries, Ltd .: trade name “Sanconol TBX”) -310 ") 5 parts by weight were melt blended in a twin-screw kneader to prepare a melt. An intermediate layer having a thickness of 15 μm made of low-density polyethylene (LDPE) (trade name “Mirason 16P” manufactured by Mitsui Petrochemical Co., Ltd.) is formed on a supporting substrate (polyester film having a thickness of 25 μm) by extrusion lamination. Furthermore, the above melt was melt-extruded on this intermediate layer so as to have a thickness of 20 μm to provide a thermal adhesive layer, and a laminated tape comprising a support substrate, an intermediate layer and a thermal adhesive layer was obtained. .

(Example 2)
As a base polymer, ethylene-vinyl acetate copolymer (EVA) (manufactured by Mitsui Petrochemical Industries, Ltd .: trade name “Mirason MV0603”), 100 parts by weight, alicyclic petroleum resin (manufactured by Arakawa Chemical Industries, Ltd.): 15 parts by weight of a trade name “Arcon P-125”, 1 part by weight of a polyether ester amide (manufactured by Sanyo Kasei Kogyo Co., Ltd .: trade name “Pelestat 230”) as a polymer antistatic agent, a low molecular antistatic agent A melt was prepared by melt blending 1 part by weight (trade name “TS-3B”, manufactured by Kao Corporation) with a biaxial kneader. An intermediate layer having a thickness of 15 μm made of low-density polyethylene (LDPE) (trade name “Mirason 16P” manufactured by Mitsui Petrochemical Co., Ltd.) is formed on a supporting substrate (polyester film having a thickness of 25 μm) by extrusion lamination. Furthermore, the above melt was melt-extruded on this intermediate layer so as to have a thickness of 20 μm to provide a thermal adhesive layer, and a laminated tape comprising a support substrate, an intermediate layer and a thermal adhesive layer was obtained. .

Example 3
As a base polymer, ethylene-vinyl acetate copolymer (EVA) (manufactured by Mitsui Petrochemical Co., Ltd .: trade name “Mirason MV0603”) 70 parts by weight; ethylene-α-olefin copolymer 30 parts by weight, alicyclic -Based petroleum resin (Arakawa Chemical Industries, Ltd .: trade name “Alcon P-125”) 5 parts by weight, polyether ester amide (manufactured by Sanyo Chemical Industries, Ltd .: trade name “Pelestat 230” as a polymer type antistatic agent) ]) 20 parts by weight was melt-blended with a twin-screw kneader to prepare a melt. An intermediate layer having a thickness of 15 μm made of low-density polyethylene (LDPE) (trade name “Mirason 16P” manufactured by Mitsui Petrochemical Co., Ltd.) is formed on a supporting substrate (polyester film having a thickness of 25 μm) by extrusion lamination. Furthermore, the above melt was melt-extruded on this intermediate layer so as to have a thickness of 20 μm to provide a thermal adhesive layer, and a laminated tape comprising a support substrate, an intermediate layer and a thermal adhesive layer was obtained. .

(Example 4)
As a base polymer, ethylene-vinyl acetate copolymer (EVA) (manufactured by Mitsui Petrochemical Co., Ltd .: trade name “Mirason MV0603”) 90 parts by weight; ethylene-α-olefin copolymer 10 parts by weight, alicyclic -Based petroleum resin (Arakawa Chemical Industries, Ltd .: trade name “Alcon P-125”), 10 parts by weight of polyether ester amide (manufactured by Sanyo Chemical Industries, Ltd .: trade name “Pelestat 230”) ]) 20 parts by weight was melt-blended with a twin-screw kneader to prepare a melt. An intermediate layer having a thickness of 15 μm made of low-density polyethylene (LDPE) (trade name “Mirason 16P” manufactured by Mitsui Petrochemical Co., Ltd.) is formed on a supporting substrate (polyester film having a thickness of 25 μm) by extrusion lamination. Furthermore, the above melt was melt-extruded on this intermediate layer so as to have a thickness of 20 μm to provide a thermal adhesive layer, and a laminated tape comprising a support substrate, an intermediate layer and a thermal adhesive layer was obtained. .

(Example 5)
As a base polymer, ethylene-vinyl acetate copolymer (EVA) (manufactured by Mitsui Petrochemical Co., Ltd .: trade name “Mirason MV0603”) 90 parts by weight; ethylene-α-olefin copolymer 10 parts by weight, alicyclic -Based petroleum resin (Arakawa Chemical Industries, Ltd .: trade name “Alcon P-125”), 10 parts by weight of polyether ester amide (manufactured by Sanyo Chemical Industries, Ltd .: trade name “Pelestat 212” as a polymer type antistatic agent) ]) 20 parts by weight was melt-blended with a twin-screw kneader to prepare a melt. An intermediate layer having a thickness of 15 μm made of low-density polyethylene (LDPE) (trade name “Mirason 16P” manufactured by Mitsui Petrochemical Co., Ltd.) is formed on a supporting substrate (polyester film having a thickness of 25 μm) by extrusion lamination. Furthermore, the above melt was melt-extruded on this intermediate layer so as to have a thickness of 20 μm to provide a thermal adhesive layer, and a laminated tape comprising a support substrate, an intermediate layer and a thermal adhesive layer was obtained. .

(Comparative Example 1)
As a base polymer, ethylene-vinyl acetate copolymer (EVA) (manufactured by Mitsui Petrochemical Industries, Ltd .: trade name “Mirason MV0603”), 100 parts by weight, alicyclic petroleum resin (manufactured by Arakawa Chemical Industries, Ltd.): Product name “Arcon P-125”) 15 parts by weight, polyether ester amide (manufactured by Sanyo Kasei Kogyo Co., Ltd .: trade name “Perestat 230”) as polymer type antistatic agent, 0.5 part by weight, low molecular charge One part by weight of an inhibitor (trade name “TS-3B” manufactured by Kao Corporation) was melt blended with a twin-screw kneader to prepare a melt. An intermediate layer having a thickness of 15 μm made of low-density polyethylene (LDPE) (trade name “Mirason 16P” manufactured by Mitsui Petrochemical Co., Ltd.) is formed on a supporting substrate (polyester film having a thickness of 25 μm) by extrusion lamination. Furthermore, the above melt was melt-extruded on this intermediate layer so as to have a thickness of 20 μm to provide a thermal adhesive layer, and a laminated tape comprising a support substrate, an intermediate layer and a thermal adhesive layer was obtained. .

(Comparative Example 2)
As a base polymer, ethylene-vinyl acetate copolymer (EVA) (manufactured by Mitsui Petrochemical Industries, Ltd .: trade name “Mirason MV0603”), 100 parts by weight, alicyclic petroleum resin (manufactured by Arakawa Chemical Industries, Ltd.): 15 parts by weight of trade name “Arcon P-125”) and 1 part by weight of low molecular weight antistatic agent (trade name “TS-3B” manufactured by Kao Corporation) are melt-blended in a twin-screw kneader. Was prepared. An intermediate layer having a thickness of 15 μm made of low-density polyethylene (LDPE) (trade name “Mirason 16P” manufactured by Mitsui Petrochemical Co., Ltd.) is formed on a supporting substrate (polyester film having a thickness of 25 μm) by extrusion lamination. Furthermore, the above melt was melt-extruded on this intermediate layer so as to have a thickness of 20 μm to provide a thermal adhesive layer, and a laminated tape comprising a support substrate, an intermediate layer and a thermal adhesive layer was obtained. .

(Comparative Example 3)
As a base polymer, ethylene-vinyl acetate copolymer (EVA) (manufactured by Mitsui Petrochemical Industries, Ltd .: trade name “Mirason MV0603”), 100 parts by weight, alicyclic petroleum resin (manufactured by Arakawa Chemical Industries, Ltd.): 40 parts by weight of a trade name “Arcon P-125”) and 20 parts by weight of a polyether ester amide (manufactured by Sanyo Kasei Kogyo Co., Ltd .: trade name “Perestat 230”) as a polymer type antistatic agent in a biaxial kneader A melt was prepared by melt blending. An intermediate layer having a thickness of 15 μm made of low-density polyethylene (LDPE) (trade name “Mirason 16P” manufactured by Mitsui Petrochemical Co., Ltd.) is formed on a supporting substrate (polyester film having a thickness of 25 μm) by extrusion lamination. Furthermore, the above melt was melt-extruded on this intermediate layer so as to have a thickness of 20 μm to provide a thermal adhesive layer, and a laminated tape comprising a support substrate, an intermediate layer and a thermal adhesive layer was obtained. .

(Evaluation methods)
The following tests were performed on each laminated tape obtained in the examples and comparative examples.
[150 ° C adhesive strength: peel strength]
Using a taping machine (Tokyo Wells: trade name “TWA-6600”), each laminated tape is applied to the surface of a paper packaging substrate (Hokuetsu Paper: trade name “HOCTO40”) at a temperature of 1600 PCS / min. The film was heat-sealed under the condition of ° C., and the adhesive strength was measured immediately after the heat sealing and after storage for 1 month at 40 ° C. In addition, the measurement of adhesive force was performed on the conditions of a peeling speed of 300 mm / min and a peeling angle of about 180 ° using a peeling tester. The results for Examples 1 and 2 and Comparative Example 1 are shown in Table 1, and the results for Examples 3 and 4 and Comparative Examples 2 and 3 are shown in Table 2, respectively. For Examples 1 and 2 and Comparative Example 1, measurement was performed only immediately after heat sealing.
[180 ° C adhesive strength: peel strength]
The adhesive force was measured immediately after heat sealing and after storage at 40 ° C. for 1 month, except that the pressure bonding temperature was 180 ° C. The results for Examples 1 and 2 and Comparative Example 1 are shown in Table 1, and the results for Examples 3 and 4 and Comparative Examples 2 and 3 are shown in Table 2, respectively. In addition, about Examples 1-2 and the comparative example 1, it measured only immediately after heat sealing.
[Surface resistivity]
For each laminated tape, the surface resistivity of the adhesive layer surface at the time of manufacture (initial) and after storage at 40 ° C. for 1 month is measured with a high resistivity meter (Mitsubishi Chemical Co., Ltd. product name: “High Lester UP”). The results for Examples 1 and 2 and Comparative Example 1 are shown in Table 1, and the results for Examples 3 and 4 and Comparative Examples 2 and 3 are shown in Table 2. Examples 1-2 and Comparative For Example 1, measurements were made only immediately after heat sealing.
[Mountability test]
Each laminated tape was heat-sealed using a top cover to enclose a chip (0603 type) [2000 PCS / test piece] in a carrier, and then cooled to room temperature. When the top cover was peeled off at 23 ° C./50% RH and applied to the mounting machine, the ratio of the chips that could be adsorbed by the air nozzle to the total number of chips was determined. In addition, after encapsulating the chip, it was stored at 23 ° C./30% RH for 1 month, and similarly applied to a mounting machine to determine the ratio of the chip that could be adsorbed by the air nozzle. The results for Examples 1 and 2 and Comparative Example 1 are shown in Table 1, and the results for Examples 3 and 4 and Comparative Examples 2 and 3 are shown in Table 2, respectively. In addition, about Examples 1-2 and the comparative example 1, it measured only immediately after heat sealing.
[Fuzz generation confirmation]
Each laminated tape obtained in Examples 3 and 4 and Comparative Examples 2 and 3 was made of a paper packaging substrate (made by Hokuetsu Paper: trade name “HOCTO40”, manufactured by Fuji Kyowa Paper: trade name “FK-42”, Tokyo Paper Industries). Product: “TK-43”, product name “HJ-42” manufactured by Oji Paper Co., Ltd., using a taping machine (product name “TWA-6600” manufactured by Tokyo Wells) under the condition of 1600 PCS / min. Taping samples heat-sealed at 150 ° C and 180 ° C are stored at 40 ° C for 1 month, and when peeled off, it is visually checked whether paper fibers are attached to the adhesive layer surface. did. The results are shown in Table 3. The evaluation was performed according to the following criteria. ○: No fluffing from the surface of the paper packaging substrate was visually confirmed. Δ: Fluff (paper fiber) of less than 0.5 mm was visually confirmed. X: Fluff (paper fiber) of 0.5 mm or more was visually confirmed.
[Peeling voltage]
Each laminated tape is made of a paper packaging substrate (made by Hokuetsu Paper: trade name “HOCTO40”, made by Fuji Kyowa Paper: trade name “FK-42”, made by Tokyo Paper: trade name “TK-43”, made by Oji Paper: Using a taping machine (manufactured by Tokyo Wells: trade name “TWA-6600”) against a trade name “HJ-42”, Hokuetsu Paper: trade name “HOCTO40E”), a pressure bonding temperature of 180 ° C. under the condition of 1600 PCS / min. A sample was prepared by heat sealing at. The laminated tape (cover tape) for the packaging material of this sample is peeled off 100 mm at a peeling speed of 5000 mm / min in a 180 ° direction using a peeling tester in an atmosphere of 23 ° C. and 65% RH, and the adhesive at that time The amount of static electricity generated on the surface of the layer [peeling voltage (V); surface potential] was measured using a surface potential measuring device (trade name “ELECTROSTATIC VOLTMETER” manufactured by Trek Japan Co., Ltd.). The height of the surface potential measuring probe was about 5 mm from the surface of the adhesive layer. The results are shown in Table 4. The measured value (V) of the surface potential (the amount of static electricity generated on the surface) is an actually measured value.
[Adhesion to commonly used paper packaging substrates]
Using the taping machine (manufactured by Tokyo Wells: trade name “TWA-6600”), the laminated tape for packaging obtained in Example 3 and Comparative Example 2 on a widely used paper packaging substrate, 1600 PCS / Samples were prepared by heat-sealing at 130 ° C., 150 ° C., 170 ° C., and 190 ° C. under the conditions of min. The laminated tape for packaging material of this sample was peeled off at a peeling speed of 300 mm / min and a peeling angle of 180 ° using a peel tester, and the adhesive strength was measured. In addition, as a paper packaging base material that is widely used, Hokuetsu Paper Industries: trade name “HOCTO40”, Fuji Kyowa Paper: trade name “FK-42”, Tokyo Paper Industries: trade name “TK-43”, Oji Paper Product name: “HJ-42”, Hokuetsu Paper Industries: product name “HOCTO40E” was used. The results are shown in Table 5.
[Adhesive strength after moisture absorption]
Using a taping machine (Tokyo Wells: trade name “TWA-6600”), each laminated tape is applied to the surface of a paper packaging substrate (Hokuetsu Paper: trade name “HOCTO40”) at a temperature of 1600 PCS / min. The film was heat-sealed under the conditions of 180 ° C. and 180 ° C., and the adhesive force was measured immediately after the heat sealing and after storage at 23 ° C. × 80% RH for 1 month. In addition, the measurement of adhesive force was performed on the conditions of a peeling speed of 300 mm / min and a peeling angle of about 180 ° using a peeling tester. The results are shown in Table 6.
[Moisture percentage]
The melt for preparing the adhesive layers obtained in Examples 4 and 5 and Comparative Example 2 was formed into pellets having a particle size of about 3 mm to obtain samples. The sample was placed in an opened bottle and stored in a high-temperature humidity chamber under conditions of 35 ° C. × 80% RH for 24 hours, and then the moisture content of the sample was measured using a coulometric titration moisture measuring device. The results are shown in Table 6.

  The laminated tape for packaging material obtained in Example 5 is composed of an adhesive whose adhesive layer has a low moisture content after storage under high humidity, and therefore has an appropriate adhesive strength when stored at high humidity. Even if so, it is maintained for a long time. On the other hand, the laminated tape for packaging material obtained in Example 4 has good adhesive force and surface resistivity, maintains the good values over a long period of time, and has good fuzz generation and peeling voltage. Although it is a good result, since the adhesive layer is composed of an adhesive having a high moisture content of 0.6% after storage under high humidity, the adhesive strength decreases when stored under high humidity. In addition, the laminated tape for packaging material obtained in Comparative Example 2 has a low moisture content of the adhesive after storage under high humidity, but the adhesive strength changes with time because it does not contain a polymer type antistatic agent. In particular, when it is stored under high humidity, the adhesive strength is remarkably reduced.

Claims (2)

Lamination for packaging materials in which a base polymer composed mainly of a polyolefin resin , an alicyclic petroleum resin as a tackifying resin , and a thermal adhesive layer containing a polymeric antistatic agent are laminated on a supporting base material layer An alicyclic petroleum as a tackifying resin, wherein the base polymer contains 5 to 40% by weight of an ethylene-α-olefin copolymer and the thermal adhesive layer is 100 parts by weight of the base polymer. 1-20 parts by weight of the resin, packaging material for a laminated tape according to claim 1 to 30 parts by weight including that of the polymeric antistatic agent containing a polyether structure. Chip-type electronic component according to claim 1 Symbol placement packaging laminate tape for use as a packaging material for a laminated tape when transporting the.