KR20100037085A - Laminated tape for packaging material - Google Patents

Abstract

PURPOSE: A laminated tape for a packaging material is provided to ensure excellent adhesiveness to a packaging base material such as a carrier tape, releasability and antistatic properties, and especially capable of being peeled without fluffing a paper fiber of the surface layer of a paper-made packaging material. CONSTITUTION: A laminated tape for the packaging material is obtained by laminating a thermobonding adhesive layer containing a base polymer, an adhesiveness-imparting resin and a polymer-type antistatic agent on a supporting base material layer. The adhesive layer contains 1-20 pts.wt. adhesiveness-imparting resin and 1-30 pts.wt. polymer type antistatic agent based on 100 pts.wt. base polymer. A polymer type antistatic agent containing a polyether structure is preferable as the polymer type antistatic agent, and the base polymer constituting the thermobonding adhesive layer preferably contains an ethylene-[alpha]-olefin copolymer within the range of <=50 wt.% of the base polymer.

Description

Laminated tape for packaging materials {LAMINATED TAPE FOR PACKAGING MATERIAL}

The present invention relates to, for example, a laminated tape used for a packaging material for packaging a chip-shaped electronic component or the like during transportation of the electronic component.

As a method of conveying a chip component, a taping reel method of packaging and transporting an electronic component in a packaging material is known. In this taping reel method, a cover tape (top tape) is provided after inserting an electronic component into a carrier of a tape-shaped thick paper (paper packaging base material) provided with chip-shaped electronic component storage bags at regular intervals in the longitudinal direction. Heat seal the top surface of the furnace with a roll and reel it to transport. After transportation, a system is mainly used in which a cover tape is peeled off at a manufacturing stage, such as a circuit board, and the chip components are adsorbed with an air adsorption nozzle and then mounted on the board.

In a series of steps from taping to feeding the chip onto the substrate, the following performance is required for the cover tape used as the packaging material of the electronic component to reliably supply the chip: namely, (1) for the paper packaging substrate. Have sufficient adhesion; (2) it has a stable peelability when peeling the cover tape, does not generate fluff from the paper packaging substrate, and does not cause problems when mounting on the substrate; (3) It should be excellent in what is called antistatic property which can suppress a chip sticking out of a pocket by the peeling electrification voltage which arises at the time of cover tape peeling; (4) During transportation, it will not adhere to the parts under various environmental conditions.

In particular, in recent years, chip-type electronic components have tended to decrease in size. In such a situation, the surface layer peeling phenomenon (flux generation) of the paper packaging base material generated when the cover tape is peeled off adversely affects the adsorption nozzle of the mounting machine, which causes problems such as lowering of the mounting rate. For this reason, especially in the cover tape used for packaging a micro component, good peeling property and preventing lint on the surface of the paper packaging substrate during peeling are important performances together with antistatic properties. Cover tapes having the performance described above are desired.

As a method of suppressing the peeling electrification voltage of a packaging material, the packaging base material which contains at least 1 sort (s) of components selected from polyvinyl acetate type resin, an ethylene copolymer, an acrylic resin, and wax in the surface, and a carboxyl group or an acyloxy in a molecule | numerator A method of combining a cover tape having an adhesive resin layer formed by a resin composition comprising at least one polymer selected from an olefin copolymer containing a group, an ionomer resin and a block copolymer of an aromatic vinyl compound and a conjugated diene compound is proposed. (See Japanese Patent Laid-Open No. 2003-341720). In this method, since an effect is not obtained when combining a base material and a cover tape different from what was described above, the cover tape which can exhibit antistatic property irrespective of the kind of base material to be used is desired.

Moreover, as a cover tape which has antistatic property, it is known that the adhesive bond layer which knead | mixed polyolefin resin and antistatic agent (surfactant, ie, low molecular weight antistatic agent), was laminated | stacked on the support base material through an intermediate | middle layer (Japanese Patent Laid-Open) See 2000-191991). In this cover tape, a low molecular weight antistatic agent mixed as an antistatic agent flows out at the interface between the cover tape and the paper packaging base material, thereby lowering the peel strength. For this reason, in order to ensure adhesiveness, peeling strength is mixed and the peeling strength is maintained. However, since the low molecular weight antistatic agent moves in the adhesive layer, when the adhesive strength with the paper packaging substrate is strengthened or locally, the adhesive strength is increased, and when the cover tape is peeled off, the surface layer of the paper packaging substrate is torn to generate fluff. It may be made. Although the cover tape can withstand the actual use sufficiently depending on the size of the part, in the case of a very small chip type electronic part, the surface layer peeling phenomenon (fouffing) of the paper packaging substrate that occurs when the cover tape is peeled off, etc. This adversely affects, causing problems such as lowering of the mounting rate. For this reason, especially in the cover tape used for packaging of very small parts, good peelability and preventing lint on the surface of the paper packaging substrate during peeling are important performances together with antistatic properties.

In addition, the surface resistivity of the adhesive layer changes depending on temperature and humidity, and as a method of preventing the surface of the adhesive layer from being charged by such a change, it has been studied to incorporate a polymer type antistatic agent into the adhesive (Japanese Patent Laid-Open No. 2001). -200217). In such cover tapes, in order to ensure adhesion to the carrier mount, a large amount of tackifier is mixed in the adhesive, so that the adhesive force becomes stronger than the appropriate value, or the peelability decreases over time, and the paper packaging substrate surface Paper fibers exfoliate (produce fluff) and often cause errors during mounting. There is a need for a cover tape that does not have this problem described above.

In addition, the peeling vibration generated when the cover tape is peeled from the paper packaging base material causes the chip component in the carrier mount cavity to lean or protrude from the cavity (chip protrusion), and the chip component adsorbs air. Since the nozzle cannot be adsorbed in the correct position, a mounting rate decrease occurs. This problem of peeling vibration becomes more remarkable as the miniaturization and weight reduction of chip components are realized. In addition, even if the same type of cover tape is used, the types of carrier mounts are different and the adhesive strength is different according to the bundle. Therefore, in order to reduce the peeling vibration by peeling the cover tape with a constant peeling force, the type or bundle of the paper packaging substrate may change. Every time a high level of control is required to adjust the pressing conditions of the taping machine. For this reason, the cover tape which implement | achieves a fixed adhesive force stably by a fixed crimping condition, and hardly generate | occur | produces peeling vibration regardless of the kind or bundle of carrier mounts is desired.

[Document 1] Japanese Unexamined Patent Publication No. 2003-341720 [Document 2] Japanese Unexamined Patent Publication No. 2000-191991 [Document 3] Japanese Unexamined Patent Publication No. 2001-200217

It is an object of the present invention to provide excellent heat adhesion to a packaging substrate such as a carrier tape, and to maintain an antistatic ability and a good peelability for peeling off the surface of the paper packaging substrate during peeling for a long time, It is to provide a laminated tape for packaging material that can secure a high mounting rate.

Another object of the present invention is to maintain a proper adhesive strength stably in spite of environmental changes such as humidity, and to realize a consistent adhesive strength stably under a certain crimping condition regardless of the type or bundle of carrier mounts, used in the packaging of very small chip parts Even if the case is to provide a laminated tape for packaging material that can ensure a high mounting rate.

As a result of earnestly examining in order to achieve the above object, the present inventors can satisfy all of adhesiveness, antistatic property, suppression of fluff generation and suppression of peeling vibration when the heat adhesive layer provided on the support base layer is composed of specific components. It has been found that the present invention has been completed.

That is, this invention provides the following laminated tape for packaging materials.

1. Support substrate layer; And a base polymer having a polyolefin resin as a main component, a tackifying resin, and a polymer antistatic agent, wherein the tackifying resin is 1 to 20 parts by weight, and the polymer antistatic agent is 1 to 30 parts by weight based on 100 parts by weight of the base polymer. Laminated tape for packaging materials including a thermal adhesive layer to be included.

2. The laminated tape for packaging materials according to item 1, wherein the polymer type antistatic agent has a polyether structure.

3. The lamination for packaging materials according to the first or the second, wherein the heat adhesive layer contains 2 to 13 parts by weight of a tackifying resin and 10 to 30 parts by weight of a polymer antistatic agent based on 100 parts by weight of the base polymer. tape.

4. The laminated tape of any of the preceding items, wherein the base polymer comprises at least an ethylene-α-olefin copolymer in an amount of up to 50% by weight of the base polymer.

5. The laminated tape for packaging material according to any one of items 1 to 4, wherein the polymer type antistatic agent is a polymer type antistatic agent containing a polyether ester amide.

6. The laminated tape for packaging material according to any one of items 1 to 5, wherein the thermal adhesive layer has a thickness of 5 to 50 µm, and the surface resistivity of the thermal adhesive layer is 10 ¹³ Ω / square or less.

7. The laminated tape for packaging material according to item 6, wherein the difference in the adhesive strength of the laminated tape between the two paper packaging substrates is less than twice when the laminated tape is heat sealed at two different paper packaging substrates at 190 ° C.

8. The peeling electrification voltage (23 占 폚 x 65%) generated in the heat adhesive layer when the laminated tape for packaging material is heat sealed on the paper packaging base material, and then peeled from the paper packaging base material according to item 6 or 7. RH, peeling angle 180 degrees, peeling speed 5000mm / min, the laminated tape for packaging materials whose absolute value of the distance of 5 mm) between an electrode and a thermal adhesive bond layer is 200 V or less.

9. The method according to any one of items 1 to 8, wherein the adhesive composition constituting the thermal adhesive layer has a moisture content of 0.5% or less after storage for 24 hours in a constant temperature and humidity chamber at 35 ° C × 80% RH. Laminated tape for packaging materials.

10. The packaging material according to any one of items 1 to 9, wherein after the heat-sealing of the laminated tape for packaging material on the paper packaging base material, the paper fiber of the paper packaging base material surface layer is prevented from being fluffed and peeled off. Laminated tape.

The laminated tape for packaging according to the present invention is composed of a support base layer and a heat adhesive layer provided thereon. As a support base material which comprises a support base material layer, any thing can be used as long as it has self-supportability. Examples of such supporting substrates include various papers such as Japanese paper, thin paper, wrinkled paper, honcho paper and composite paper; Nonwovens and cloths; Olefinic resins such as polyethylene, polypropylene and ethylene-acid copolymer resins, thermoplastic elastomers such as polypropylene modified resins and styrenic thermoplastic elastomers, thermoplastic resins of polyesters such as polyethylene terephthalate, polybutylene terephthalate and polyethylene naphthalate Plastic films or sheets composed of the like; Metal foil or sheet made of metal such as copper and aluminum; These laminated bodies etc. are mentioned.

It is preferable that melting | fusing point of a support base material is 90 degreeC or more. When melting | fusing point is less than 90 degreeC, when taping by a thermocompression technique using a metal iron etc., there exists a possibility that a support base material may fuse | melt, adhere to an iron, etc., and cannot achieve the original purpose of packaging.

The surface of the support base material layer (the surface opposite to the adhesive layer) may be subjected to an easy lubrication treatment, an antistatic treatment, or the like, which is a conventional surface treatment method. In addition, the surface of the support substrate layer in contact with the adhesive layer of the support substrate layer may be subjected to a treatment for enhancing fixability such as ozone treatment and corona treatment. In particular, when the supporting substrate is a plastic film, measures for improving fixation by applying a fixed coating may be selected.

Although the thickness of a support base material layer can be selected in a wide range according to a use in the range which does not impair mechanical strength, handleability, etc., it is generally about 5 to about 100 micrometers, Preferably it is about 10 to about 50 micrometers.

The heat adhesive layer is composed of a thermoplastic adhesive containing a base polymer, a tackifying resin, and a polymer type antistatic agent. The base polymer contains a polyolefin-based resin as a main component, and may be used in combination with any of other polymers, for example, thermoplastic resins such as vinyl acetate-based resins, thermoplastic elastomers, and the like. In addition, the base polymer may be composed of only polyolefin resins or a combination of two or more thereof.

Examples of polyolefin-based resins include various polyethylenes (eg, low density polyethylene, straight chain low density polyethylene, polyethylene and high density polyethylene prepared by metallocene catalysis), polypropylene and ethylene-α-olefin copolymers; Ethylene-unsaturated carboxylic acid copolymers including ethylene copolymers (e.g., ethylene-acrylic acid copolymer (EAA) and ethylene-methacrylic acid copolymer (EMAA); ionomers; ethylene-methyl acrylate copolymers, ethylene Ethylene- (meth) acrylate copolymers such as ethyl acrylate copolymer (EEA) and ethylene-methyl methacrylate copolymer, ethylene-vinyl acetate copolymer (EVA), and ethylene-vinyl alcohol copolymer); And polypropylene modified resins. The polyolefin resin is contained in the base polymer in an amount of at least 60% by weight, preferably at least 80% by weight, particularly preferably at least 95% by weight.

Examples of such vinyl acetate-based resins as other polymers include polyvinyl acetate, vinyl acetate- (meth) acrylate copolymers, vinyl acetate-vinyl ester copolymers and vinyl acetate-maleate copolymers.

Examples of thermoplastic elastomers include SIS (styrene-isoprene-styrene block copolymer), SBS (styrene-butadiene-styrene block copolymer), SEBS (styrene-ethylene-butylene-styrene block copolymer), SEPS (styrene-ethylene- Styrene-based thermoplastic elastomers such as propylene-styrene block copolymer) and SEP (styrene-ethylene-propylene block copolymer); Styrenic block copolymers such as styrenic block copolymers having a styrene content of at least 5% by weight; Polyurethane thermoplastic elastomers; Polyester-based thermoplastic elastomers; And mixed thermoplastic elastomers such as polymer blends of polypropylene and EPT (ternary ethylene-propylene rubber).

The base polymer preferably contains up to 50% by weight of ethylene-α-olefin copolymer relative to the base polymer. That is, the base polymer is preferably composed of any one of polyolefin resins other than the ethylene-α-olefin copolymer and the ethylene-α-olefin copolymer, and a combination of other polymers as necessary. The content of the ethylene-α-olefin copolymer is more preferably 5 to 40% by weight, particularly preferably 10 to 35% by weight relative to the base polymer. By containing the ethylene-α-olefin copolymer in the base polymer, the adhesive can exhibit adequate adhesion and good peelability, and can prevent changes over time. If the content of the ethylene-α-olefin copolymer is greater than 50% by weight, the adhesive force exceeds 10 to 70 gf (98.1 to 687 mN), which is an appropriate range, and after peeling, fluff occurs on the paper packaging substrate, or the thermal adhesive layer Problems such as excessive softening cause the adhesive to stick to the sealing stopper during compression by the taper, such a phenomenon described above are undesirable. When the ethylene-α-olefin copolymer is contained in the base polymer, for example, an ethylene-vinyl acetate copolymer resin having a vinyl acetate content of 15 wt% or less as the other polymer or an ethylene-vinyl acetate aerial having a vinyl acetate content of 15 wt% or less It is preferable to further use low density polyethylene for the copolymer resin. Preferable contents in this case are 0 to 10 wt% of low density polyethylene, 50 to 95 wt% of ethylene-vinyl acetate copolymer resin having a vinyl acetate content of 15 wt% or less, and 5 to 40 wt% of ethylene-α-olefin copolymer.

Examples of tackifying resins include petroleum resins (for example, alicyclic petroleum resins obtained by hydrogenating aliphatic petroleum resins, aromatic petroleum resins and aromatic petroleum resins), rosin-based resins, terpene resins, styrene resins, and coumarone-indene resins. It includes. These tackifying resins can be used individually or in combination of 2 or more types. When the adhesive layer is formed by extrusion lamination, these resins are melted and oxidized at a high temperature. In view of stability to oxidation, cycloaliphatic petroleum resins are particularly preferred.

The incorporation of the tackifying resin into the adhesive layer not only improves the tapping workability but also provides stable and good adhesion to a packaging substrate such as a carrier tape.

The content of the tackifying resin is about 1 to about 20 parts by weight, preferably about 2 to about 13 parts by weight, particularly preferably about 3 to about 10 parts by weight, based on 100 parts by weight of the base polymer. When tackifying resin is less than 1 weight part, favorable adhesiveness with respect to a carrier tape (packaging base material) is hard to be obtained. In addition, when the content of the tackifying resin exceeds 20 parts by weight, the adhesion to the carrier tape is good, but when peeling, the paper fibers are torn off from the surface of the paper packaging base material to generate fluff, resulting in poor adsorption at the air nozzle in the circuit board manufacturing process. The same problem occurs. In addition, the adhesive force is significantly increased, which is outside the range of the proper adhesive force of 10 to 70 gf (98.1 mN to 687 mN) defined in the specification. The resulting tape is not suitable for use as a top cover tape.

The mixing amount of the polymer type antistatic agent is 1 to 30 parts by weight, preferably 10 to 30 parts by weight, particularly preferably 15 to 25 parts by weight, based on 100 parts by weight of the base polymer. When the mixing amount of the polymer antistatic agent is too small, the desired antistatic ability is not obtained, the surface resistivity exceeds 10 ¹³ Ω / square, and a problem such that the micro components stick to the adhesive layer by static electricity occurs. On the other hand, when the blending ratio of the polymer type antistatic agent is too high, the antistatic ability is good, but it causes a decrease in the adhesive force and thus cannot obtain the desired adhesive force. On the other hand, in addition to a polymer type antistatic agent, surface resistivity can be adjusted using a normal low molecular type antistatic agent (surfactant) together. In this case, the usage-amount of a low molecular weight antistatic agent is not specifically limited, For example, it can select suitably within the range which does not exceed 5 weight part with respect to 100 weight part of base polymers. If the amount of the low molecular weight antistatic agent is excessively large, problems such as the low molecular antistatic agent flowing out on the surface of the heat adhesive layer may occur, which is not preferable.

A polymer type antistatic agent is not specifically limited, Any polymer can be used as long as it has antistatic property. For example, polyamide type copolymers, such as a polyether ester amide, carboxylate group containing polymers, such as potassium ionomer, and quaternary ammonium salt containing copolymers are mentioned. Unlike the low molecular weight antistatic agent, the polymer type antistatic agent does not move in the adhesive layer or protrude from the surface of the adhesive layer, and stable antistatic property and adhesiveness can be obtained for a long time by using the polymer type antistatic agent. For example, the surface resistivity can be adjusted to 10 ¹³ Ω / □ or less (eg, about 10 ⁸ to about 10 ¹³ Ω / □), preferably about 10 ⁹ to about 10 ¹² Ω / □. Even for the adhesive force, an appropriate adhesive force of 10 to 70 gf (98.1 mN to 687 mN) can be stably maintained for a long time.

As a polymeric antistatic agent, For example, Polyether ester amide; Block polymers of polyolefins and polyethers; Polymeric antistatic agents having a polyether structure, such as polymers of polyethylene ether and glycol, may be preferably used. When a polymer type antistatic agent having a polyether structure is used, when the laminated tape for packaging material is heat sealed to the packaging substrate and then peeled off, the polyether component remains on the substrate side, and a part of the antistatic agent in the adhesive is applied to the packaging substrate surface. Therefore, a high antistatic effect can be exhibited regardless of the kind (material) of a packaging base material. For example, after heat-sealing the laminated tape for packaging materials which concerns on this invention to a paper packaging base material, the absolute value of peeling electrification voltage which arises in an adhesive bond layer when peeling a laminated tape from a paper packaging base material (23 degreeC x 65% RH) Peeling angle: 180 °, peeling speed: 5000 mm / min; distance between the electrode and the thermal adhesive layer: 5 mm) is 200 V or less for any type of paper packaging substrate.

Since the polyether component remains on the base material side at the time of peeling, it exhibits a constant adhesive force when heat-sealed under constant conditions to any paper packaging base material which is generally spread. For example, the laminated tape for a packaging material according to the present invention may be manufactured by the Hokuetsu Paper Mills, Ltd. product name "HOCTO40" and the Hokuets Paper Mills paper packaging base material. When heat-sealing at 190 degreeC on the phosphorus trade name "Hotto 40E", the adhesive force with respect to the paper packaging base material "Hotto 40E" is less than twice the adhesive force with respect to the paper packaging base material "Hotto 40". In addition, according to a study conducted by the present inventors, the paper packaging substrate "Hotto 40" exhibits the lowest adhesion to the adhesive which does not contain a polymer type antistatic agent and contains a low molecular weight antistatic agent among the paper packaging substrates which are generally spread. The paper packaging base material "Hotto 40E" shows the highest adhesive force with respect to the adhesive agent which does not contain a polymer type antistatic agent but contains a low molecular weight antistatic agent among the paper packaging base materials which are generally prevalent. For example, the laminated tape for packaging material according to the present invention is manufactured by Fujikyowa Seishi Co., Ltd. under the trade name "FK-42", Tokyo Paper Mfg. Co., Ltd., at 190 ° C. Adhesion at the time of heat-sealing on paper packaging substrates that are generally spread, such as the trade name "TK-43" of "TJ-43" and the trade name "HJ-42" of Oji Paper Co., Ltd. Silver is less than the adhesive force obtained when the laminated tape for packaging material according to the present invention is heat-sealed at 190 ° C on a paper packaging substrate "Hotto 40E", and the laminated tape for packaging material according to the present invention is placed on a paper packaging substrate "Hotto 40". It is less than twice the adhesive strength obtained when heat-sealing at 190 degreeC.

As the polymer type antistatic agent having a polyether structure, a known one commonly used can be used. Although there is no restriction | limiting in particular in the kind, The polymeric antistatic agent which has a polyether ester amide can be used especially preferably. For example, a polymeric antistatic agent obtained by the reaction of a polyamide having a carboxyl group at both ends and a poly (oxyalkylene) glycol and containing a polyether ester amide having an average molecular weight of about 8000 to about 100000 may be mentioned. have. The polymer type antistatic agent may be appropriately selected and used in consideration of compatibility and other properties, depending on the kind of the base polymer or the tackifying resin. In addition, in order to prevent deterioration due to high temperature during extrusion lamination or heat sealing, the polymer type antistatic agent preferably has a thermal decomposition temperature of 120 ° C. or higher.

Although the mixing amount of each of the tackifying resin and the polymer type antistatic agent may be selected within the above-mentioned range, respectively, the total amount of the tackifying resin and the polymer type antistatic agent to be added is preferably 33 parts by weight or less based on 100 parts by weight of the base polymer. It is preferable to select in the range which becomes 30 weight part or less more preferably. If the total amount of the tackifying resin and the polymer antistatic agent is within this range, the laminated tape for packaging material, which is further suppressed in the change over time of properties such as adhesion and surface resistivity, is preferable.

Moreover, as a structural component of an adhesive bond layer, a mold release agent, a filler, etc. can be added as needed in consideration of antioxidant, a ultraviolet inhibitor, a coupling agent, and the ease of operation at the time of manufacture. It is also possible to use antistatic agents and the like in addition to those described above.

By melt-mixing a base polymer, a tackifying resin, a polymer type antistatic agent, and the other components mixed as needed, the adhesive composition which comprises the adhesive bond layer of the laminated tape for packaging materials which concerns on this invention can be obtained. The adhesive composition is molded into pellets having a particle size of about 3 mm and the resulting pellets after storage for 24 hours in a constant temperature and humidity chamber under the conditions of 35 ° C. × 80% RH preferably have a moisture content of 0.5% or less, in particular 0.3%. If the moisture content after moisture absorption is in this range, since the fluctuation | variation of the adhesive force by the environment change of the laminated tape for packaging materials in which an adhesive bond layer contains the said adhesive agent is suppressed especially, desired adhesive force will be maintained stably. In particular, the fall of the adhesive force under high humidity or condensation is remarkably suppressed within the above moisture content range.

The thickness of the adhesive layer composed of the above components is preferably from about 5 to about 50 µm, particularly preferably from about 10 to about 30 µm, in view of adhesion, handleability and the like. If the thickness of the adhesive layer is less than 5 mu m, sufficient adhesive force cannot be obtained, and if the thickness is thicker than 50 mu m, the adhesive often flows out and contaminates a taper or the like.

According to the present invention, an intermediate layer may be provided between them to enhance the adhesion between the support substrate layer and the adhesive layer. The intermediate layer may be composed of, for example, a thermoplastic resin such as polyolefin resin, a thermoplastic elastomer, or the like. These components may be used alone or in combination of two or more thereof. As polyolefin resin and thermoplastic elastomer, what was illustrated above can be used, respectively.

As thickness of an intermediate | middle layer, it can select suitably in the range which does not impair workability in a manufacturing process or the handleability of the resultant laminated tape. For example, when manufactured by the lamination method, the thickness is about 5 micrometers-about 30 micrometers normally.

The laminated tape according to the present invention comprises, for example, mixing components of an adhesive layer at a predetermined ratio, pelletizing the mixed components through melt mixing using a twin screw kneader, and then using conventional single or serial extrusion. By lamination, it can be produced by laminating the pellet or the mixed components as a result of the dry state on the supporting substrate layer with or without the intermediate layer.

The laminated tape obtained in this way can be suitably used as a laminated tape for packaging materials when carrying chip type electronic components such as resistors and multilayer ceramic capacitors. In particular, the laminated tape is excellent in peelability at the time of peeling after heat sealing on the paper packaging substrate, and can be peeled off without causing lint to the paper fibers of the paper packaging substrate layer.

Since the heat adhesive layer is composed of specific components, the laminated tape for a packaging material according to the present invention is excellent in thermal adhesiveness to a packaging material such as a carrier tape, and can maintain an antistatic property and good peelability for a long time. For this reason, when the laminated tape for a packaging material according to the present invention is used as a top cover for a small electronic component packaging material, it is possible to greatly suppress the occurrence of fluff on the paper packaging substrate during peeling, and to generate the fluff on the air nozzle of the mounting machine. The effect of can also be greatly suppressed. In addition, charging of the top cover surface is suppressed regardless of the type of base material to be combined, and the effect on the electrical component due to charging can also be suppressed, so that good component mounting properties are possible. Moreover, a certain adhesiveness is stably realized with respect to the paper packaging base material generally supplied under constant crimping conditions irrespective of the kind of base material. For this reason, when the laminated tape for packaging materials is heat-sealed on a paper packaging base material, it is not necessary to precisely adjust crimping conditions according to the kind or bundle of paper packaging base materials, and peeling can be performed favorably by a constant force at the time of peeling. There is suppression of peeling vibration. Such properties, such as adhesiveness, peelability, antistatic property, and peeling vibration suppression, do not deteriorate even after electronic components and the like are packaged by taping and stored for a long time in a warehouse or the like, and a high mounting rate can be obtained. Particularly, in a dry environment that is susceptible to static electricity, excellent antistatic properties are exhibited, and when the heat adhesive layer is composed of an adhesive composition having a moisture content after a water absorption is equal to or less than a given value, a constant adhesive force is realized even under high humidity or condensation. Since a constant adhesive force is maintained for a long time, stable mounting can be performed without being affected by humidity.

<Examples>

Hereinafter, although this invention is demonstrated in detail with reference to an Example, this invention is not limited to these Examples.

(Example 1)

Ethylene-vinyl acetate copolymer (EVA) (manufactured by Mitsui Petrochemical Co., Ltd., trade name MIRASON® MV0603) as a base polymer, 80 parts by weight, 20 parts by weight of ethylene-α-olefin copolymer Part, a polymeric antistatic agent (Sanko Chemical Co., Ltd.) having an alicyclic petroleum resin (manufactured by Arakawa Chemical Industries, Ltd., trade name Arkon P-125), and 10 parts by weight of a polyether structure (Sanko Chemical Co., Ltd.), 5 parts by weight of Sankonol TBX-310) was melt mixed by a twin screw kneader to prepare a melt. An intermediate layer having a thickness of 15 µm containing low density polyethylene (LDPE) (trade name Mirason® 16P manufactured by Mitsui Petrochemical Co., Ltd.) was provided by extrusion lamination on a supporting substrate (polyester film having a thickness of 25 µm), and then on the intermediate layer. The laminated tape which consists of a support base material, an intermediate | middle layer, and a thermal adhesive layer was obtained by melt-extruding the said melt and providing a thermal adhesive layer so that thickness may be set to 20 micrometers.

(Example 2)

100 parts by weight of an ethylene-vinyl acetate copolymer (EVA) (manufactured by Mitsui Petrochemical Co., Ltd., trade name Mirason® MV0603), and an alicyclic petroleum resin (manufactured by Arakawa Chemical Industries, brand name Arcon P-125) as a base polymer 1 part by weight of polyether ester amide (manufactured by Sanyo Chemical Industries, trade name PELESTAT® 230) as a polymer antistatic agent, and a low molecular weight antistatic agent (manufactured by Kao Corporation, trade name TS-3B) Melt was prepared by melt-mixing 1 part by weight with a twin screw kneader. A 15-micrometer-thick intermediate layer containing low density polyethylene (LDPE) (trade name Mirason® 16P, manufactured by Mitsui Petrochemical Co., Ltd.) was provided by extrusion lamination on a support substrate (polyester film having a thickness of 25 µm), and then on this intermediate layer. The laminated tape which consists of a support base material, an intermediate | middle layer, and a thermal adhesive layer was obtained by melt-extruding the said melt and providing a thermal adhesive layer so that thickness may be set to 20 micrometers.

(Example 3)

70 parts by weight of an ethylene-vinyl acetate copolymer (EVA) (manufactured by Mitsui Petrochemical Co., Ltd., trade name Mirason® MV0603), 30 parts by weight of an ethylene-α-olefin copolymer, and an alicyclic petroleum resin (Arakawa Chemical Industries) 5 parts by weight of the company's product, Arcon P-125), and 20 parts by weight of a polyether ester amide (manufactured by Sanyo Chemical Industries, trade name Pellesat® 230) as a polymer antistatic agent by melt mixing with a biaxial kneader to prepare a melt. It was. A 15-micrometer-thick intermediate layer containing low density polyethylene (LDPE) (trade name Mirason® 16P, manufactured by Mitsui Petrochemical Co., Ltd.) was provided by extrusion lamination on a support substrate (polyester film having a thickness of 25 µm), and then on this intermediate layer. The laminated tape which consists of a support base material, an intermediate | middle layer, and a thermal adhesive layer was obtained by melt-extruding the said melt and providing a thermal adhesive layer so that thickness may be set to 20 micrometers.

(Example 4)

90 parts by weight of an ethylene-vinyl acetate copolymer (EVA) (manufactured by Mitsui Petrochemical Co., Ltd., trade name Mirason® MV0603), 10 parts by weight of an ethylene-α-olefin copolymer, and an alicyclic petroleum resin (Arakawa Chemical Industries) 10 parts by weight of manufactured by ZK Corporation, trade name Arcon P-125), and 20 parts by weight of a polyether ester amide (manufactured by Sanyo Chemical Industries, trade name Pellesstat® 230) as a polymer antistatic agent by melt mixing with a biaxial kneader to prepare a melt. It was. A 15-micrometer-thick intermediate layer containing low density polyethylene (LDPE) (trade name Mirason® 16P, manufactured by Mitsui Petrochemical Co., Ltd.) was provided by extrusion lamination on a support substrate (polyester film having a thickness of 25 µm), and then on this intermediate layer. The laminated tape which consists of a support base material, an intermediate | middle layer, and a thermal adhesive layer was obtained by melt-extruding the said melt and providing a thermal adhesive layer so that thickness may be set to 20 micrometers.

(Example 5)

90 parts by weight of an ethylene-vinyl acetate copolymer (EVA) (manufactured by Mitsui Petrochemical Co., Ltd., trade name Mirason® MV0603), 10 parts by weight of an ethylene-α-olefin copolymer, and an alicyclic petroleum resin (Arakawa Chemical Industries) 10 parts by weight of the company's product name, Arcon P-125) and 20 parts by weight of a polyether ester amide (manufactured by Sanyo Chemical Industries, Ltd., PelletSat® 212) as a polymer antistatic agent were melt mixed with a twin screw kneader to prepare a melt. It was. A 15-micrometer-thick intermediate layer containing low density polyethylene (LDPE) (trade name Mirason® 16P, manufactured by Mitsui Petrochemical Co., Ltd.) was provided by extrusion lamination on a support substrate (polyester film having a thickness of 25 µm), and then on this intermediate layer. The laminated tape which consists of a support base material, an intermediate | middle layer, and a thermal adhesive layer was obtained by melt-extruding the said melt and providing a thermal adhesive layer so that thickness may be set to 20 micrometers.

(Comparative Example 1)

100 parts by weight of an ethylene-vinyl acetate copolymer (EVA) (manufactured by Mitsui Petrochemical Co., Ltd., trade name Mirason® MV0603), and an alicyclic petroleum resin (manufactured by Arakawa Chemical Industries, brand name Arcon P-125) as a base polymer Parts, 0.5 parts by weight of a polyether ester amide (manufactured by Sanyo Chemical Industries, trade name Pellesatt® 230) as a polymer type antistatic agent, and 1 part by weight of a low molecular antistatic agent (Kao Corporation, trade name TS-3B) The melt was prepared by melt mixing with a twin screw kneader. A 15-micrometer-thick intermediate layer containing low density polyethylene (LDPE) (trade name Mirason® 16P, manufactured by Mitsui Petrochemical Co., Ltd.) was provided by extrusion lamination on a support substrate (polyester film having a thickness of 25 µm), and then on this intermediate layer. The laminated tape which consists of a support base material, an intermediate | middle layer, and a thermal adhesive layer was obtained by melt-extruding the said melt and providing a thermal adhesive layer so that thickness may be set to 20 micrometers.

(Comparative Example 2)

100 parts by weight of an ethylene-vinyl acetate copolymer (EVA) (manufactured by Mitsui Petrochemical Co., Ltd., trade name Mirason® MV0603), and an alicyclic petroleum resin (manufactured by Arakawa Chemical Industries, brand name Arcon P-125) as a base polymer 1 part by weight of a low molecular antistatic agent (manufactured by Kao Corporation, trade name TS-3B) was melt mixed with a biaxial kneader to prepare a melt. A 15-micrometer-thick intermediate layer containing low density polyethylene (LDPE) (trade name Mirason® 16P, manufactured by Mitsui Petrochemical Co., Ltd.) was provided by extrusion lamination on a support substrate (polyester film having a thickness of 25 µm), and then on this intermediate layer. The laminated tape which consists of a support base material, an intermediate | middle layer, and a thermal adhesive layer was obtained by melt-extruding the said melt and providing a thermal adhesive layer so that thickness may be set to 20 micrometers.

(Comparative Example 3)

100 parts by weight of an ethylene-vinyl acetate copolymer (EVA) (manufactured by Mitsui Petrochemical Co., Ltd., trade name Mirason® MV0603), and an alicyclic petroleum resin (manufactured by Arakawa Chemical Industries, brand name Arcon P-125) as a base polymer The melt was prepared by melt-mixing 20 parts by weight of a polyether ester amide (manufactured by Sanyo Chemical Industries, Ltd., trade name PelletSat® 230) as a polymer antistatic agent with a twin screw kneader. A 15-micrometer-thick intermediate layer containing low density polyethylene (LDPE) (trade name Mirason® 16P, manufactured by Mitsui Petrochemical Co., Ltd.) was provided by extrusion lamination on a support substrate (polyester film having a thickness of 25 µm), and then on this intermediate layer. The laminated tape which consists of a support base material, an intermediate | middle layer, and a thermal adhesive layer was obtained by melt-extruding the said melt and providing a thermal adhesive layer so that thickness may be set to 20 micrometers.

(Assessment Methods)

The following test was done about each laminated tape obtained by the Example and the comparative example.

[150 ° C. Adhesion: Peel Strength]

1600 pcs / min, using a taping machine (Tokyo Weld Co., Ltd. make, brand name TWA-6600) on the surface of the paper packaging base material (manufactured by Hokuetsu Paper Mills, brand name Hotto 40), Each laminated tape was heat sealed under the conditions of a compression temperature of 150 ° C. The adhesion was measured immediately after heat sealing and after 1 month storage at 40 ° C. The adhesive force was measured using the peel tester on the conditions of peeling speed 300 mm / min and peel angle about 180 degrees. The results of Examples 1 and 2 and Comparative Example 1 are shown in Table 1, and the results of Examples 3 and 4 and Comparative Examples 2 and 3 are shown in Table 2. In addition, the measurement in Examples 1 and 2 and the comparative example 1 was performed only immediately after heat sealing.

[180 ° C. Adhesion: Peel Strength]

Except having made the crimping temperature 180 degreeC, the adhesive force was measured immediately after heat sealing and after 1 month storage at 40 degreeC by the same method as the measurement of 150 degreeC adhesive force. The results of Examples 1 and 2 and Comparative Example 1 are shown in Table 1, and the results of Examples 3 and 4 and Comparative Examples 2 and 3 are shown in Table 2. In addition, the measurement in Examples 1 and 2 and the comparative example 1 was performed only immediately after heat sealing.

[Surface resistivity]

About each laminated tape, the surface resistivity of the adhesive bond layer surface at the time of manufacture (initial stage) and after 1 month storage at 40 degreeC was measured by the high resistivity measuring instrument (Mitsubishi Chemical Corporation make, brand name Histrastra UP). The results of Examples 1 and 2 and Comparative Example 1 are shown in Table 1, and the results of Examples 3 and 4 and Comparative Examples 2 and 3 are shown in Table 2. In addition, the measurement in Examples 1 and 2 and the comparative example 1 was performed only immediately after heat sealing.

[Mountability Test]

Each laminated tape was heat sealed using a top cover, and the chip (0603 type) [2000 pcs / test species] was sealed in a carrier, and then cooled to room temperature. After peeling the top cover of the resulting carrier with chips at 23 ° C./50% RH. As a result of the chip inside, the carrier was placed in the mounting unit and the ratio of chips that could be adsorbed by the air nozzle was determined. After the chip was enclosed in the carrier and stored at 23 ° C./30% RH for 1 month, the result of the chip was put in the mounting apparatus in the same manner as described above, and the ratio of the chip that can be adsorbed with the air nozzle was determined. . The results of Examples 1 and 2 and Comparative Example 1 are shown in Table 1, and the results of Examples 3 and 4 and Comparative Examples 2 and 3 are shown in Table 2. In addition, the measurement in Examples 1 and 2 and the comparative example 1 was performed only immediately after heat sealing.

[Check fluff occurrence]

The laminated tapes obtained in Examples 3 and 4 and Comparative Examples 2 and 3 were subjected to a paper-based packaging base material (manufactured by Hokuetsu Paper Mills, trade name Hotto 40; manufactured by Fujikyo and Seishi, trade name FK-42, manufactured by Tokyo Paper Manufacturing). 1600 pcs / min, crimping | compression-bonding temperature 150 degreeC, and 180 degreeC using the taping machine (Tokyo Weld company make, brand name TWA-6600) on the brand name TK-43; A tape-sealed taping sample was prepared. When the prepared taped sample was stored at 40 ° C. for 1 month and then peeled off, visual observation of adhesion of paper fibers to the surface of the adhesive layer was observed. The results are shown in Table 3. In addition, evaluation was performed based on the following references | standards.

○: It was not visually confirmed that fluff from the paper packaging base material surface layer occurred.

(Triangle | delta): The fluff (paper fiber) of less than 0.5 mm was visually recognized.

X: The fluff (paper fiber) of 0.5 mm or more was visually confirmed.

[Peelable large voltage]

Each laminated tape was made of a paper packaging base material (manufactured by Hokuetsu Paper Mills, Inc., trade name Hotto 40; manufactured by Fujikyo and Seishi, brand name FK-42; Tokyo Paper Manufacturing, brand name TK-43; HJ-42; and Hokuets Paper Mills Co., Ltd., brand name Hotto 40E, using a taping machine (Tokyo Weld Co., Ltd., brand name TWA-6600), heat-sealed under conditions of 1600 pcs / min and a crimping temperature of 150 ° C. Taped samples were prepared. The laminated tape (cover tape) for the packaging material of the taped sample thus prepared was peeled 100 mm at a peel rate of 5000 mm / min in a 180 ° direction using a peel test machine under an atmosphere of 23 ° C. and 65% RH, and then adhesive The amount of static electricity generated on the layer surface (peelable large voltage (V); surface voltage) was measured using a surface voltage meter (manufactured by TREK JAPAN KK, trade name ELECTROSTATIC VOLTMETER). The height of the surface voltage measuring probe was about 5 mm from the surface of the adhesive layer. The results are shown in Table 4. The measurement value V of the surface voltage (the amount of static electricity generated on the surface) is a measured value.

[Adhesion to Paper Packaging Substrates Widely Used]

The laminated tape for packaging materials obtained in Example 3 and Comparative Example 2 was generally used on a paper packaging base material that is widely used, using a taping machine (manufactured by Tokyo Weld Co., Ltd., product name: TWA-6600), and 1600 pcs / min. Taping samples were prepared by heat sealing at 150 ° C, 170 ° C and 190 ° C, respectively. The laminated tape for packaging materials of the samples thus prepared was peeled using a peel tester at a peel rate of 300 mm / min and a peel angle of 180 ° to measure the adhesive force. Under the present circumstances, as a paper packaging base material generally spread | diffused, Hokuets Paper Mills company make, brand names Hotto 40; Fujikyo and Seishisa make, brand names FK-42; Tokyo Paper Manufacturing, trade name TK-43; Oji Paper Co., Ltd., brand name HJ-42; And Hokuets Paper Mills, trade name Hotto 40E was used. The results are shown in Table 5.

[Adhesion after moisture absorption]

1600 pcs / min, crimping | compression-bonding temperature 150 degreeC on each surface of the paper packaging base material (made by Hokuetsu Paper Mills company, brand name Hotto 40) using a taping machine (Tokyo Weld company make, brand name TWA-6600). And heat sealed at 180 ° C. The adhesive force was measured immediately after heat sealing and after storage for 1 month at 23 ° C. × 80% RH. The adhesive force was measured on the conditions of peeling speed 300mm / min and peeling angle about 180 degrees using the peeling tester. The results are shown in Table 6.

[Water content]

Melts for producing the adhesive layers obtained in Examples 4, 5 and Comparative Example 2 were molded into pellets, and the resulting pellets were used as samples. The sample was placed in an opened bottle and stored for 24 hours in a constant temperature and humidity chamber under the condition of 35 ° C. × 80% RH, and then the moisture content of the sample was measured using a titration-type moisture content measuring apparatus. The results are shown in Table 6.

In the laminated tape for packaging materials obtained in Example 5, since the adhesive layer is composed of an adhesive having a low moisture content after being stored under high humidity, an appropriate adhesive force is maintained for a long time even when stored at high humidity. On the other hand, in the laminated tape for packaging material obtained in Example 4, both the adhesive strength and the surface resistivity are good, and the good value is maintained for a long time and shows good performance against fluff generation or peeling electrification, but the adhesive layer is preserved under high humidity. After the moisture content is 0.5%, it is composed of an adhesive. Therefore, when the laminated tape for packaging materials obtained in Example 4 is preserve | saved under high humidity, the adhesive force falls. In addition, in the laminated tape for packaging materials obtained in Comparative Example 2, the moisture content of the adhesive after storage under high humidity is low, but because it does not contain a polymer type antistatic agent, the adhesive force changes over time, especially when stored under high humidity, Adhesion is significantly reduced.

This application is based on Japanese Patent Application No. 2005-146225, filed May 19, 2005 and 2006-073421, filed March 16, 2006, which is incorporated by reference in its entirety herein.

Claims (5)

On the support base material layer, the heat adhesive layer containing the base polymer which has polyolefin resin as a main component, tackifying resin, and a polymeric antistatic agent is laminated | stacked,
The thermal adhesive layer comprises 1 to 20 parts by weight of a tackifying resin, 1 to 30 parts by weight of a polymer type antistatic agent including a polyether structure, based on 100 parts by weight of the base polymer,
When heat-sealing at 190 degreeC on two different paper packaging substrates, the adhesive force difference of the laminated tape with respect to each paper packaging substrate is 2 times or less, It is characterized by the above-mentioned.
Laminated tape for packaging materials. The peeling electrification voltage (23 ° C x 65% RH, peeling angle 180 °) generated in the heat adhesive layer when the laminated tape for packaging material is heat sealed on the paper packaging substrate and then peeled from the paper packaging substrate. The laminated tape for packaging materials whose absolute value of the peeling speed 5000 mm / min and the distance of 5 mm) between an electrode and a thermal adhesive bond layer is 200 V or less. The laminated tape for packaging materials according to claim 1, wherein the adhesive composition constituting the thermal adhesive layer has a moisture content of 0.5% or less after storage for 24 hours in a constant temperature and humidity chamber at 35 ° C × 80% RH. The laminated tape for packaging material according to claim 1, wherein after the heat-sealing the laminated tape for packaging material on the paper packaging substrate, the paper tape of the paper packaging substrate surface layer can be peeled off without being fluffed. The laminated tape for packaging materials according to any one of claims 1 to 4, which is used as a laminated tape for packaging materials when carrying chip electronic components.