KR20020060618A - Bottom cover tape for electronic part carrier - Google Patents

Abstract

PURPOSE: To obtain a bottom cover tape excellent in adhesive properties with respect to a carrier tape, also favorable for antistatic properties, and excellent in antisticking properties and anticorrosive properties for chip components. CONSTITUTION: The bottom cover tape for an electronic component carrier has a support base layer and an adhesive layer containing 1-50 pts.wt. of an alicyclic saturated hydrocarbon resin and 0.1-20 pts.wt. of an amphoteric surfactant and/or a nonionic surfactant, not including halogen and/or sulfur, per 100 pts.wt. of a base polymer. It is preferable that the thickness of the adhesive layer is 5-50 μm, that the softening point of the adhesive layer is 60-170°C, and that the surface resistivity of the adhesive layer is 108-1013 ω/(square). Further, the surface roughness of the adhesive layer may be 0.1-20 μm, and the friction-charged electrostatic potential thereof may be at most 3,000 V.

Description

Bottom cover tape for electronic component carrier {BOTTOM COVER TAPE FOR ELECTRONIC PART CARRIER}

The present invention relates to a lower cover tape for an electronic component carrier used for conveying chip electronic components. More specifically, the present invention relates to a lower cover tape having excellent adhesion to a carrier tape, good antistatic properties, and excellent adhesion and chipping resistance of chip components.

In the method of conveying chip electronic components (chip components) such as chip holding resistors and multilayer ceramic capacitors, the bottom surface of a paper carrier (carrier tape) made of a tape-shaped cardboard with rectangular holes for storing chip electronic components at regular intervals in the longitudinal direction. Is sealed by heat sealing (tapping) with a lower cover tape to form a pocket for storage, and immediately after that, chip-shaped electronic components are respectively stored in the storage pocket. Subsequently, after sealing the upper surface of the paper carrier with an upper cover tape to seal the chip-shaped electronic component, the paper carrier is wound on a reel and conveyed. This continuous taping reel method is widely used. In manufacturing processes, such as a circuit board by which a paper carrier is conveyed, an upper cover tape can be peeled from a paper carrier, and the chip-shaped electronic component accommodated can be automatically adsorb | sucked with an air nozzle, and can be supplied on a board | substrate. This automatic assembly system is mainly used.

In this automatic assembly system, the lower cover tape is attached to the carrier tape. Therefore, it is important that the lower cover tape has good adhesion to the carrier tape.

In recent years, a phenomenon in which chip components cannot be adsorbed with an air nozzle has occurred, resulting in a problem of deterioration of adsorption efficiency. This problem is caused by the adhesion of the chip component to the adhesive layer surface due to the generation of static electricity on the lower cover tape due to the miniaturization and weight reduction of the chip component, and the force caused by the force generated when the air nozzle presses the chip component onto the adhesive layer. It is presumed to be due to the adhesion of the chip component to the adhesive layer due to insufficient cooling of the adhesive layer due to the adhesion to the adhesive layer surface or the reduction of the time between the application of the lower cover tape and the storage of the chip component into the storage pocket. .

While this problem occurs, a serious problem arises in which the chip parts are corroded by the lower cover tape. Therefore, it is desired to provide a lower cover tape which can suppress or prevent corrosion of the chip parts and which is excellent in the reliability of the chip parts.

Accordingly, it is an object of the present invention to provide a lower cover tape for an electronic component carrier which is not only excellent in adhesion to a carrier tape, but also excellent in antistatic property and excellent in anti-sticking and corrosion resistance of chip components.

The present inventors earnestly examined the solution to the above problem. As a result, when the adhesive layer on the support base material layer is formed of a specific resin composition in the lower cover tape for an electronic component carrier, requirements for adhesion to the carrier tape, antistatic property, and anti-sticking and corrosion resistance of the chip component are met. It was found that all could be met.

1 is a schematic cross-sectional view showing an embodiment of a lower cover tape of the present invention,

It is a schematic sectional drawing of the longitudinal direction which shows the use condition of the carrier material for chip type electronic components containing the lower cover tape of FIG.

* Explanation of symbols for the main parts of the drawings

1: lower cover tape 2: support base layer

3: adhesive layer 4: carrier material for chip type electronic parts

5: carrier tape 6: top cover tape

7: rectangular hole for chip-shaped electronic component storage 8: chip-type electronic component

The present invention is a support substrate layer; And 1 to 50 parts by weight of an alicyclic saturated hydrocarbon-based resin based on 100 parts by weight of the base polymer, and 0.1 to 20 parts by weight of an amphoteric and / or nonionic surfactant that does not contain halogen atoms and sulfur atoms. A bottom cover tape for an electronic component carrier comprising a layer is provided.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described, referring an accompanying drawing as needed. 1 is a schematic diagram illustrating an embodiment of a lower cover tape for an electronic component carrier according to the present invention. In Fig. 1, reference numeral 1 denotes a lower cover tape, 2 denotes a support base layer, and 3 denotes an adhesive layer. The lower cover tape 1 includes a support base layer 2 and an adhesive layer 3 provided on the support base layer 2.

Support base layer (2)

Arbitrary materials which have self-support can be used as a support base material which comprises the support base material layer 2. Examples of such supporting substrates include paper such as Japanese paper, thin paper, crepe paper, synthetic paper, blended paper and composite paper; Non-woven; cloth; Olefin-based resins (e.g. polyethylene, polypropylene, ethylene-acid copolymer resins), polypropylene modified resins, thermoplastic elastomers (e.g. styrene-based thermoplastic elastomers) and polyesters (e.g. polyethylene terephthalates, polybutylene terephthalates, polyethylene Plastic films or sheets of thermoplastic resins such as naphthalate); Metal foil or sheet of metal such as copper and aluminum; These laminated bodies etc. are mentioned.

It is preferable that melting | fusing point of the said support base material 2 is 90 degreeC or more. When the melting point of the support base material 2 is less than 90 ° C, the support base material 2 is attached to the heating iron when the bottom cover tape is heat-bonded to the electronic component using a metal heating iron, thereby achieving the purpose of the original cover. There is a possibility of not being able to.

The surface (surface opposite to the adhesive layer 3) of the support base material layer 2 may be subjected to conventional surface treatment, slip improvement treatment, antistatic treatment, or the like. Moreover, the support base material layer 2 may be subjected to the process for improving the anchoring effect, such as ozone treatment and corona treatment, on the surface by the side of the adhesive bond layer. In particular, when the support base material is a plastic film, an anchor coating agent may be applied to improve the anchoring effect.

The thickness of the support base material layer 2 can be selected widely according to a use, as long as the mechanical strength and handleability are not impaired. However, it is practically about 5 to 100 mu m, preferably about 10 to 50 mu m.

Adhesive Layer (3)

The adhesive layer 3 is formed of a thermoplastic adhesive. The thermoplastic adhesive contains at least a base polymer, an alicyclic saturated hydrocarbon-based resin, and an amphoteric surfactant and / or a nonionic surfactant containing no halogen atoms and sulfur atoms. More specifically, the thermoplastic adhesive includes 1 to 50 parts by weight of an alicyclic saturated hydrocarbon-based resin based on 100 parts by weight of the base polymer, and an amphoteric surfactant and / or a nonionic interface containing no halogen atoms and / or sulfur atoms. At least 0.1 to 20 parts by weight of active agent.

Base polymer

As the base polymer, thermoplastic resins such as olefin resins, vinyl acetate resins, polyester resins and styrene resins, thermoplastic elastomers and the like can be used. These base polymers can be used individually or in combination of 2 or more types.

Examples of the olefin resin that can be used in the present invention include polyethylene (eg, low density polyethylene, linear low density polyethylene, metallocene catalyzed polyethylene, high density polyethylene); Polyolefins such as polypropylene and ethylene-α-olefin copolymer resins; Ethylene-unsaturated carboxylic acid copolymers such as ethylene copolymers (e.g., ethylene-acrylic acid copolymer (EAA) and ethylene-methacrylic acid copolymer (EMAA); ionomers; ethylene-methyl acrylate copolymers, ethylene-ethyl acrylate) Ethylene- (meth) acrylic acid ester copolymers such as copolymers (EEA) and ethylene-methyl methacrylate copolymers; ethylene-vinyl acetate copolymers (EVA); ethylene-vinyl alcohol copolymers); And polypropylene modified resins.

Examples of vinyl acetate-based resins include polyvinyl acetate, vinyl acetate- (meth) acrylic acid ester copolymers, vinyl acetate-vinyl ester copolymers, and vinyl acetate-maleic acid ester copolymers.

Examples of thermoplastic elastomers include SIS (styrene-isoprene-styrene block copolymer), SBS (styrene-butadiene-styrene block copolymer), SEBS (styrene-ethylene-butylene-styrene block copolymer), SEPS (styrene-ethylene- Styrenic thermoplastic elastomers such as propylene-styrene block copolymers) and SEP (styrene-ethylene-propylene block copolymers) (styrene-based block copolymers such as styrene-based block copolymers having a styrene content of at least 5% by weight); Polyurethane-based thermoplastic elastomers; Polyester-based thermoplastic elastomers; And blended thermoplastic elastomers such as polymer blends of polypropylene and EPT (terpolymer ethylene-propylene rubber).

Alicyclic saturated hydrocarbon-based resin

As the alicyclic saturated hydrocarbon-based resin, for example, a resin obtained by completely hydrogenating an aromatic petroleum resin (for example, a C ₉ -based petroleum resin) (sometimes referred to as an "alicyclic saturated petroleum resin") can be used. Specific examples of the resin include ESCOREZ5300 and ESCOREX5380 (trade names of products of Exxon Mobil Corporation).

These alicyclic saturated hydrocarbon type resins can be used individually or in combination of 2 or more types. In the case where the adhesive layer 3 is formed by extrusion lamination requiring melting at a high temperature, an alicyclic saturated petroleum resin is particularly preferable in view of stability to oxidation.

When alicyclic saturated hydrocarbon-based resin is incorporated into the adhesive layer 3 as a tackifying resin, the taping efficiency is improved, and the lower cover tape can be stable to the carrier tape and exhibit good adhesion.

The amount of alicyclic saturated hydrocarbon-based resin to be incorporated into the adhesive layer is, for example, about 1 to 50 parts by weight, preferably about 5 to 30 parts by weight, based on 100 parts by weight of the base polymer. When the amount of the alicyclic saturated hydrocarbon-based resin is less than 1 part by weight based on 100 parts by weight of the base polymer, when the supporting substrate 2 is paper, the molten adhesive composition cannot adhere to the supporting substrate 2. There is a need to form an intermediate layer by carrying out coextrusion or tandem extrusion lamination, rather than simple extrusion lamination. In addition, the lower cover tape can hardly have the desired adhesiveness to the carrier tape (paper carrier).

On the other hand, when the amount of the alicyclic saturated hydrocarbon resin exceeds 50 parts by weight based on 100 parts by weight of the base polymer, the metal roll provided in contact with the adhesive layer 3 and the adhesive layer 3 immediately after extrusion during film formation; Blocking may occur between and prevents stable production. In addition, the chip component is attached to the adhesive layer 3, so that it is difficult to adsorb the chip component with the air nozzle in the circuit board fabrication process.

Amphoteric Surfactants, Nonionic Surfactants

As the amphoteric surfactant and / or nonionic surfactant to be incorporated into the adhesive layer 3, those which do not contain halogen atoms and sulfur atoms can be used. By using the surfactant which does not contain such a halogen atom and a sulfur atom as surfactant which consists of an amphoteric surfactant and / or a nonionic surfactant, electrode corrosion of a chip component can be prevented.

In surfactants containing halogen atoms, the halogen atoms are mostly present in the form of halogen ions (eg chlorine ions). In surfactants containing sulfur atoms, the sulfur atoms are mostly present in the form of sulfate ions. The presence of these halogen ions (eg chlorine ions) or sulfate ions corrodes the metal, which acts as an electrode of the chip component. However, the lower cover tape of the present invention contains, as an antistatic agent, a surfactant which does not contain halogen atoms or sulfur atoms, especially in the form of halogen ions or sulfate ions, respectively, so that the electrodes of the chip parts are not corroded.

The amphoteric surfactant is not particularly limited. Examples of amphoteric surfactants usable in the present invention include N, N-dimethyl-N-alkylaminoacetic acid betaine and 2-alkyl-1'-hydroxyethyl-1-carboxymethylimidazolinium betaine. .

Examples of nonionic surfactants usable in the present invention include glycerin fatty acid esters, sorbitan fatty acid esters, sucrose fatty acid esters, polyoxyethylene alkyl phenyl ethers, polyoxyethylene alkyl ethers, polyoxyethylene polyoxypropylene block copolymers, poly Ethylene glycol fatty acid esters (polyoxyethylene fatty acid esters), polyoxyethylene sorbitan fatty acid esters, and fatty acid alkanolamides.

These amphoteric surfactants and / or nonionic surfactants can be used individually or in mixture of 2 or more types.

The amount of the surfactant (amphoteric surfactant and / or nonionic surfactant) to be incorporated into the adhesive layer is 0.1 to 20 parts by weight based on 100 parts by weight of the base polymer in terms of active ingredient or solid content, preferably 0.5 to 10 parts. Parts by weight. When the amount of the surfactant incorporated is less than 0.1 part by weight based on 100 parts by weight of the base polymer, the antistatic property obtained is lowered, and the chip part adheres to the surface of the adhesive layer due to static electricity, and thus sufficient antistatic effect cannot be exhibited. have. Specifically, when the amount of the surfactant incorporated into the adhesive layer is less than 0.1 part by weight based on 100 parts by weight of the base polymer, the surface resistivity of the adhesive layer exceeds 1 × 10 ¹³ Ω / square, and the triboelectric charging of the adhesive layer is performed. The rate can exceed 3,000V. On the other hand, when the amount of the surfactant incorporated into the adhesive layer exceeds 20 parts by weight based on 100 parts by weight of the base polymer, the surfactant is leaked to the surface or the interface of the adhesive layer to provide sufficient adhesion to the adherend (carrier tape). Can't get it. Moreover, adhesiveness with respect to the support base material layer 2 may be inadequate, and the interface breakage of the adhesive bond layer 3 and the support base material layer 2 may be caused.

In the present invention, the adhesive layer 3 may contain additives such as fillers, antioxidants, softeners, ultraviolet absorbers, rust inhibitors, coupling agents, antistatic agents and crosslinking agents other than the above.

The thickness of the adhesive layer 3 can be appropriately selected as long as its adhesiveness and handleability are not impaired. However, it is about 5-50 micrometers practically. When the thickness of the adhesive layer 3 is less than 5 mu m, the adhesive layer may exhibit poor adhesion to the carrier tape (adhered body) and become difficult to process. On the other hand, if the thickness of the adhesive layer (3) exceeds 50㎛, the total thickness of the lower cover tape is too large, there is a problem of lowering handleability or lowering production efficiency due to the weight increase caused especially when produced in a long length Done.

In the present invention, the softening point of the adhesive layer 3 is preferably about 60 to 170 ° C (more preferably about 70 to 150 ° C). When the softening point of the adhesive bond layer 3 is less than 60 degreeC, a chip component becomes easy to adhere or adhere to the adhesive bond layer 3, when the electronic component conveyance body in which the chip component is sealed is exposed to a high temperature and high humidity environment for a long time. On the other hand, when the softening point of the adhesive layer 3 exceeds 170 degreeC, high temperature is required for film formation, the heat sealing (tapping) efficiency falls, and surfactant mixed in the adhesive layer 3 (amphoteric surfactant and / Or nonionic surfactant) vaporizes to reduce the antistatic effect.

The softening point of the adhesive layer 3 can be adjusted by appropriately selecting the base polymer (for example, thermoplastic resin, thermoplastic elastomer) or other factors constituting the adhesive layer 3.

The surface resistivity of the adhesive layer 3 is preferably 10 ⁸ to 10 ¹³ Ω / square (more preferably 10 ⁸ to 10 ¹² Ω / square). The surface resistivity of the adhesive layer 3 can be adjusted by suitably selecting the kind and mixing ratio of resin which comprises the adhesive layer 3, additives, such as surfactant (antistatic agent) to be mixed, etc.

It is preferable that the triboelectric charge rate of the adhesive bond layer 3 is 3,000V or less (especially 1,000V or less). The frictional electrification voltage of the adhesive layer 3 can be adjusted by appropriately selecting the kind of the thermoplastic adhesive mixed into the adhesive layer 3, the thickness of the adhesive layer 3, and the like.

In the present invention, the surface roughness (average roughness Ra) of the adhesive layer 3 is preferably 0.1 to 20 µm (more preferably 1 to 18 µm). When the surface roughness of the adhesive bond layer 3 is less than 0.1 micrometer, the contact area with the chip component of an adhesive layer increases, the adhesiveness of the adhesive bond layer with respect to a chip component becomes high, and a chip component becomes easy to adhere to an adhesive bond layer. On the other hand, when the surface roughness of the adhesive bond layer 3 exceeds 20 micrometers, a problem may arise that an adhesive bond layer cracks or the adhesiveness to a carrier tape (adhered body) falls during film formation.

In the present invention, an intermediate layer may be provided between the supporting base layer 2 and the adhesive layer 3 to increase the adhesion between the two layers. This intermediate layer may be formed of a thermoplastic resin such as polyolefin resin, thermoplastic elastomer, rubber, or the like. Examples of the olefin resins include low density polyethylene, linear low density polyethylene, ethylene-α-olefin copolymers and ethylene-vinyl acetate copolymers. These components which comprise an intermediate | middle layer can be used individually or in mixture of 2 or more types. The thickness of the intermediate layer can be appropriately selected as long as the handleability and the like of the lower cover tape are not impaired, for example, about 0 to 40 mu m. The intermediate layer does not necessarily have to be provided.

The lower cover tape 1 of the present invention, for example, melt blends the components of the adhesive layer 3 in a predetermined proportion by means of a biaxial kneader and pelletizes the blends or dry blends the components in the same manner. The pelletized blend or the dry blend can be prepared by laminating or without the intermediate layer on the support base layer 2 by conventional single or tandem extrusion lamination. In addition, the lower cover tape 1 can also be manufactured by coextrusion and laminating | stacking the adhesive bond layer 3 and an intermediate | middle layer on the support base material layer 2.

FIG. 2 is a schematic cross-sectional view in the longitudinal direction showing a state of use of a carrier material for a chip type electronic component including the lower cover tape 1 shown in FIG. 1. The carrier material 4 for chip-shaped electronic components includes a carrier tape 5 through which rectangular holes 7 for chip-shaped electronic components are stored at regular intervals, a lower cover tape 1 provided on the lower surface of the carrier tape 5, and a carrier. And an upper cover tape 6 provided on the upper surface of the tape 5. The carrier material 4 heat seals the lower surface of the carrier tape 5 with the lower cover tape 1 to form a storage pocket. The chip-shaped electronic component 8 is accommodated in each storage pocket, respectively. The upper surface of the carrier tape 5 is heat-sealed with the upper cover tape 6. Next, the carrier tape 5 is wound on a reel and conveyed.

Since the adhesive layer 3 of the lower cover tape 1 is formed of a resin composition containing a base polymer, a specific tackifier and a specific antistatic agent (surfactant) in a specific ratio, the lower cover tape 1 and the carrier tape (5) is firmly adhere | attached with each other, and the lower cover tape 1 can be peeled off from the cover tape 5 during conveyance, and it can prevent the chip component 8 from falling.

In addition, the lower cover tape 1 is excellent in antistatic property, and therefore, the chip parts can be prevented from adhering considerably. Specifically, the lower cover tape 1 can suppress or prevent the chip component 8 from adhering to the surface of the adhesive layer 3. In addition, it is possible to suppress or prevent the chip component 8 from adhering or fusion to the surface of the adhesive layer 3 even during storage or storage of the chip component 8.

With such a structure, the adsorption efficiency of the chip component by the air nozzle in the automatic assembly system is remarkably improved, so that the chip component can be reliably taken out from the carrier tape and supplied onto the substrate.

In addition, since the adhesive layer 3 does not contain any components (halogen ions such as chlorine ions, sulfur compounds such as sulfate ions, etc.), the lower cover tape 1 suppresses corrosion of the chip component 8. Or it can prevent, and the corrosion resistance of a chip component is excellent. Therefore, the lower cover tape 1 can act as an electronic component carrier for enhancing the reliability during packaging and storage.

The lower cover tape obtained in this way can be used suitably for conveying chip-like electronic components, such as a chip fixed resistor and a multilayer ceramic capacitor.

The lower cover tape of the present invention includes an adhesive layer formed by a specific component and is excellent in heat adhesion to the carrier tape. In addition, the lower cover tape of the present invention exhibits excellent antistatic properties. Therefore, since the lower cover tape of the present invention generates a very low frictional electrification voltage during conveyance or the like, it is possible to suppress or prevent the chip component from adhering to the adhesive layer surface by static electricity. Therefore, the lower cover tape of this invention is excellent in the adhesion prevention of a chip component. In addition, since the lower cover tape of the present invention contains an antistatic agent having no halogen atom or sulfur atom, the electrode of the chip component is not corroded.

Therefore, defects such as the attachment or repulsion of the chip component by static electricity and the attachment of the chip component due to pressing the chip component with the air nozzle during transportation, peeling, etc. can be eliminated. Adsorption error of the chip component is eliminated, and the chip component can be smoothly supplied to the substrate.

The invention is further illustrated by the following examples, which should not be construed as limiting the invention thereto.

Example

Example 1

Low density polyethylene (LDPE) (base polymer, trade name "LJ800", manufactured by Mitsubishi Chemical Corporation, density 0.918 g / cm 3, melt flow rate (MFR) 20 g / 10 min, softening point 82 ° C. ) 100 parts by weight, alicyclic hydrocarbon-based resin (adhesion imparting resin, trade name "ESCOREZ5300", exon mobil corporation) 20 parts by weight and nonionic surfactant (antistatic agent (polyoxyethylene fatty acid ester), trade name "Nonion S-10 ", NOF Corporation) 1.5 weight part was knead | mixed for 30 minutes at 130 degreeC with the biaxial kneader, and pelletized. Subsequently, the pelletized blend was extruded at a temperature of 250 ° C. through an extrusion laminating machine to form a film and laminated on Japanese paper (thickness 40 μm, basis weight 19 g / m 2) serving as a supporting substrate. Subsequently, an adhesive bond layer was laminated | stacked on the Japanese paper with a film thickness of 25 micrometers, and the laminated tape (lower cover tape) was obtained. The laminated tape thus obtained had a total thickness of 55 µm and a surface roughness Ra of the adhesive layer of 4 µm.

Example 2

100 weight part, alicyclic ethylene-vinyl acetate copolymer (EVA resin) (base polymer, brand name "LV140", Mitsubishi Chemical Co., Ltd. product, vinyl acetate content 2 weight%, MFR 1.5g / 10min, softening point 87 degreeC) 10 parts by weight of a group hydrocarbon resin (adhesive imparting resin, trade name "ESCOREZ5380", made by Exxon Mobil Corporation) and a nonionic surfactant (trade name "AIMEX 300-LD", Sanyo Chemical Industries, Ltd. (Sanyo Chemical Industries, Ltd.) )) 5 parts by weight were pelletized in the same manner as in Example 1. Subsequently, the pelletized blend was extruded at a temperature of 220 ° C. through an extrusion laminating machine to form a film and laminated on Japanese paper (thickness 40 μm, basis weight 18 g / m 2) serving as a supporting substrate. Next, an adhesive bond layer was laminated | stacked on the Japanese paper with a film thickness of 20 micrometers, and the laminated tape (lower cover tape) whose total thickness is 50 micrometers was obtained. Then, this laminated tape was sand blasted so that the surface roughness Ra of an adhesive bond layer might be 15 micrometers.

Example 3

Low density polyethylene (LDPE) (base polymer, trade name "LJ800", manufactured by Mitsubishi Chemical Corporation, density 0.918 g / cm 3, MFR 20 g / 10 min, softening point 82 ° C) 100 parts by weight, alicyclic hydrocarbon-based resin (adhesive) 20 parts by weight of the imparting resin, trade name "ESCOREZ5300", Exon Mobil Corporation) and 2 parts by weight of polyethylene glycol (antistatic agent, nonionic surfactant) were kneaded with a Banbury mixer and then pelletized. Subsequently, the pelletized blend was extruded at a temperature of 250 ° C. through an extrusion laminating machine to form a film and laminated on Japanese paper (thickness 25 μm, basis weight 14 g / m 2) serving as a supporting substrate. Subsequently, an adhesive bond layer was laminated | stacked on the Japanese paper with a film thickness of 25 micrometers, and the laminated tape (lower cover tape) was obtained. The laminated tape thus obtained had a total thickness of 50 µm and a surface roughness Ra of the adhesive layer of 3 µm.

Comparative Example 1

Low-density polyethylene (trade name "LJ800", Mitsubishi Chemical Co., Ltd. product, density 0.918g / cm <3>, MFR 20g / 10min, softening point 82 degreeC) was made to Japanese paper (thickness 40micrometer, basis weight 18g / m <2>) which is a support base material layer. Lamination was carried out through an extrusion laminating machine to obtain a laminated tape having a total thickness of 55 μm and an adhesive layer having a surface roughness Ra of 0.05 μm.

Comparative Example 2

5 parts by weight of quaternary ammonium salt (cationic antistatic agent) to 100 parts by weight of linear low density polyethylene (trade name "UF240", manufactured by Mitsubishi Chemical Corporation, density 0.923 g / cm 3, MFR 2 g / 10 min, softening point 85 ° C.) Added. The mixture was kneaded with a kneader and then extruded and laminated on Japanese paper (thickness 35 μm, basis weight 15 g / m 2), which is a support base layer, by an extruder, and a laminated tape having a total thickness of 50 μm and an adhesive layer surface roughness Ra of 0.5 μm Got it.

Evaluation test

The following test was done about the laminated tape obtained by the Example and the comparative example, respectively. The results are shown in Table 1.

(Tensile strength and elongation)

Tensile strength (N / 5.25 mm) and elongation (N / 5.25 mm) were measured at a tensile rate of 300 mm / min using a tension meter.

(Adhesiveness)

Taping of laminated tape on the surface of paper carrier (HOKUETU PAPER MILLS, LTD., HOCTO-60) and heat sealing machine (Tokyo Weld Co., Ltd.) Machine) at a temperature of 170 ° C., iron pressing force 1.5 kgf (14.7 N), and 1,200 PCS / min. Adhesiveness (adhesive force) (N / 5.25 mm) was measured at a peeling speed of 300 mm / min and a peeling angle of 180 ° using a peeling tester.

(Surface resistivity)

The surface resistivity (Ω) of various laminated tapes was measured using a high resistivity hysteristor UP (Hirestor UP, manufactured by Mitsubishi Chemical Co., Ltd.) under conditions of 500V × 30 seconds in an atmosphere of 23 ° C. and 65% RH.

(Friction large voltage)

According to JIS L 1094, the frictional electrification voltage (V) on the adhesive layer side of various laminated tapes was measured.

(Corrosion inhibitory)

The adhesive layer side of various laminated tapes was heat bonded to nickel foil (Ni foil) and stored for 100 hours in an atmosphere of 60 ° C / 90% RH. Subsequently, the laminated tape was peeled off from Ni foil and the discoloration degree of Ni foil was investigated. Discoloration at all was evaluated as "G (good)", some parts discolored as "F (normal)", and the whole surface discolored as "P (poor)".

(Ion extraction amount)

The material of the adhesive layer of the various laminated tapes was immersed in 50 ml of purified water in pelletized form. The ionic component was then extracted by boiling at reflux for 45 minutes at a temperature of 100 ° C. After cooling the extract thus obtained, the amount (extracted amount) (ppm) of chloride ions (Cl ⁻ ) and sulfate ions (SO ₄ ^2- ) contained in the extract was determined by ion chromatography. In Table 1 below, “ND” means “not detected”.

Example No. Comparative Example No. One 2 3 One 2 Tensile Strength (N / 5.25mm) 10 11 10 10 8 Elongation (N / 5.25㎜) 3 2 3 2 1.5 Adhesiveness (N / 5.25㎜) 300 < 150 250 < 200 < 120 Surface resistivity (Ω) 1 × 10 ¹⁰ 5 × 10 ⁸ 3 × 10 ⁸ 1 × 10 ¹⁴ < 1 × 10 ⁹ Frictional high voltage (V) 170 100 35 3200 15 Corrosion inhibitor G G G G F to P Ion extraction amount Chlorine Ion (ppm) ND ND ND ND 28 Sulfate ion (ppm) ND ND ND ND 4

As can be seen from Table 1, the lower cover tape according to the embodiment has good adhesion to the carrier tape. In addition, the lower cover tape of the embodiment produces a low frictional electrification voltage and a low surface resistivity on the adhesive layer. Therefore, the lower cover tape of the embodiment is excellent in antistatic property and can suppress or prevent adhesion of chips. In addition, the adhesive layer in contact with the chip component does not contain chlorine ions or sulfate ions and does not corrode Ni. Therefore, the corrosion prevention property is also excellent.

This application is based on the JP Patent application 2001-003710 of the January 11, 2001 application, The whole content is taken in here as a reference.

The lower cover tape of the present invention is excellent in heat adhesion to the carrier tape because the adhesive layer is composed of specific components. Moreover, since high antistatic property can be exhibited and the frictional electrification voltage is very low during conveyance etc., the adhesion of the chip component to the adhesive bond layer surface by static electricity is suppressed or prevented, and it is excellent in the adhesion prevention property of a chip component. Moreover, since the antistatic agent which does not have a halogen atom or a sulfur atom is used, the electrode of a chip component does not corrode.

Therefore, defects such as the attachment or repulsion of the chip component by static electricity and the attachment of the chip component due to pressing the chip component with the air nozzle during transportation, peeling, etc. can be eliminated. Adsorption error of the chip component is eliminated, and the chip component can be smoothly supplied to the substrate.

Claims (8)

A support base layer and an adhesive layer, wherein the adhesive layer is 100 parts by weight of the base polymer; 1 to 50 parts by weight of an alicyclic saturated hydrocarbon resin; And 0.1 to 20 parts by weight of a surfactant of at least one of an amphoteric surfactant containing no halogen atoms and sulfur atoms and a nonionic surfactant containing no halogen atoms and sulfur atoms. The method of claim 1, The lower cover tape for electronic component carriers whose thickness of an adhesive bond layer is 5-50 micrometers, the softening point of an adhesive bond layer is 60-170 degreeC, and the surface resistivity of an adhesive bond layer is 10 ^{8-10 13} ohm / square. The method of claim 1, The lower cover tape for an electronic component carrier whose surface roughness of an adhesive bond layer is 0.1-20 micrometers. The method of claim 2, The lower cover tape for an electronic component carrier whose surface roughness of an adhesive bond layer is 0.1-20 micrometers. The method of claim 1, The lower cover tape for an electronic component carrier whose frictional electrification voltage of an adhesive bond layer is 3,000V or less. The method of claim 2, The lower cover tape for an electronic component carrier whose frictional electrification voltage of an adhesive bond layer is 3,000V or less. The method of claim 3, wherein The lower cover tape for an electronic component carrier whose frictional electrification voltage of an adhesive bond layer is 3,000V or less. The method of claim 4, wherein The lower cover tape for an electronic component carrier whose frictional electrification voltage of an adhesive bond layer is 3,000V or less.