PH12021550814A1 - Cover tape for packing electronic component and package - Google Patents

Cover tape for packing electronic component and package

Info

Publication number
PH12021550814A1
PH12021550814A1 PH12021550814A PH12021550814A PH12021550814A1 PH 12021550814 A1 PH12021550814 A1 PH 12021550814A1 PH 12021550814 A PH12021550814 A PH 12021550814A PH 12021550814 A PH12021550814 A PH 12021550814A PH 12021550814 A1 PH12021550814 A1 PH 12021550814A1
Authority
PH
Philippines
Prior art keywords
cover tape
electronic component
layer
package
heat
Prior art date
Application number
PH12021550814A
Inventor
Masakuni Inoue
Yasunori Nagatsuka
Kazuki Tsukiyama
Hironori Hagio
Takaki Miyachi
Original Assignee
Dainippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Printing Co Ltd filed Critical Dainippon Printing Co Ltd
Publication of PH12021550814A1 publication Critical patent/PH12021550814A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00—Packages comprising articles attached to cards, sheets or webs
    • B65D73/02—Articles, e.g. small electrical components, attached to webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/67—Containers, packaging elements or packages, specially adapted for particular articles or materials for web or tape-like material
    • B65D85/671—Containers, packaging elements or packages, specially adapted for particular articles or materials for web or tape-like material wound in flat spiral form

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)
  • Laminated Bodies (AREA)

Abstract

The present disclosure provides a cover tape for packaging an electronic component, the cover tape having: a substrate layer; a heat-seal layer which is disposed on one surface side of the substrate layer and includes an ethylene-vinyl acetate copolymer; and an antistatic layer which is disposed on the opposite surface side of the surface of the heat-seal layer of the substrate layer and includes a conductive polymer, wherein the Vickers hardness of the heat-seal layer is a predetermined value or greater.
PH12021550814A 2018-09-18 2021-04-13 Cover tape for packing electronic component and package PH12021550814A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018173796A JP6763421B2 (en) 2018-09-18 2018-09-18 Cover tape and packaging for electronic component packaging
PCT/JP2019/036300 WO2020059682A1 (en) 2018-09-18 2019-09-17 Cover tape and packaging body for packaging electronic component

Publications (1)

Publication Number Publication Date
PH12021550814A1 true PH12021550814A1 (en) 2021-10-04

Family

ID=69887030

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12021550814A PH12021550814A1 (en) 2018-09-18 2021-04-13 Cover tape for packing electronic component and package

Country Status (6)

Country Link
JP (1) JP6763421B2 (en)
KR (1) KR102657425B1 (en)
CN (1) CN112703157A (en)
PH (1) PH12021550814A1 (en)
TW (1) TWI805842B (en)
WO (1) WO2020059682A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020204138A1 (en) * 2019-04-03 2020-10-08 大日本印刷株式会社 Electronic component packaging cover tape and package
JP7524582B2 (en) * 2020-03-31 2024-07-30 大日本印刷株式会社 Molded body, transfer sheet, and method for producing molded body

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57131106A (en) * 1981-02-05 1982-08-13 Matsushita Electric Ind Co Ltd Synchronizing detecting device
JP2601273Y2 (en) * 1993-05-14 1999-11-15 松下電器産業株式会社 Cover tape for chip body transport and electronic components
JPH1095448A (en) 1996-09-18 1998-04-14 Dainippon Printing Co Ltd Lid material for carrier tape
JP2001003014A (en) * 1999-06-16 2001-01-09 Nitto Denko Corp Bottom cover tape for chip type electronic part carrier
JP4061136B2 (en) * 2002-06-25 2008-03-12 大日本印刷株式会社 Antistatic laminate, method for producing the same, and cover tape for taping packaging
JP2012214252A (en) * 2010-09-30 2012-11-08 Sumitomo Bakelite Co Ltd Cover tape for packaging electronic component
MY181505A (en) * 2013-07-09 2020-12-24 Sumitomo Bakelite Co Cover tape for packaging electronic part
WO2015029867A1 (en) * 2013-09-02 2015-03-05 電気化学工業株式会社 Cover film and electronic component package
JP5701350B2 (en) * 2013-09-03 2015-04-15 日本マタイ株式会社 Bottom cover tape for transporting electronic components
CN106604816B (en) * 2014-08-15 2020-07-24 电化株式会社 Cover film and electronic component package using same
CN109790345B (en) * 2016-09-28 2021-02-12 住友电木株式会社 Resin composition, outer sealing tape, and package for electronic component

Also Published As

Publication number Publication date
JP6763421B2 (en) 2020-09-30
TW202017820A (en) 2020-05-16
CN112703157A (en) 2021-04-23
KR102657425B1 (en) 2024-04-16
JP2020045130A (en) 2020-03-26
TWI805842B (en) 2023-06-21
WO2020059682A1 (en) 2020-03-26
KR20210060507A (en) 2021-05-26

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