TW201613761A - Cover film and electronic component packaging employing same - Google Patents

Cover film and electronic component packaging employing same

Info

Publication number
TW201613761A
TW201613761A TW104126472A TW104126472A TW201613761A TW 201613761 A TW201613761 A TW 201613761A TW 104126472 A TW104126472 A TW 104126472A TW 104126472 A TW104126472 A TW 104126472A TW 201613761 A TW201613761 A TW 201613761A
Authority
TW
Taiwan
Prior art keywords
mass
cover film
olefin
contain
resin
Prior art date
Application number
TW104126472A
Other languages
Chinese (zh)
Other versions
TWI659838B (en
Inventor
Akira Sasaki
Takayuki Iwasaki
Takanori Atsusaka
Tadaaki Hirooka
Shigeru Sakamoto
Original Assignee
Denki Kagaku Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo Kk filed Critical Denki Kagaku Kogyo Kk
Publication of TW201613761A publication Critical patent/TW201613761A/en
Application granted granted Critical
Publication of TWI659838B publication Critical patent/TWI659838B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
    • B65D65/38—Packaging materials of special type or form
    • B65D65/40—Applications of laminates for particular packaging purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00—Packages comprising articles attached to cards, sheets or webs
    • B65D73/02—Articles, e.g. small electrical components, attached to webs
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/105—Metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/21—Anti-static
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/31—Heat sealable

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Wrappers (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

The present invention provides a cover film which exhibits peel strength that continuously remains constant within a range of prescribed values during peeling of the cover film, and which moreover has exceptional transparency, and does not readily give rise to "film rip" during high-speed peeling. This cover film comprises at least (A) a base material layer, (B) an adhesive layer, (C) an intermediate layer, and (D) a heat sealing layer containing a heat-sealable resin. The main component of the (B) adhesive layer is a polyester resin, and 50 mass% or more of the curing agent is isophorone diisocyanate. The (D) heat sealing layer includes (d-1) 50-90 mass% of an olefin resin comprising any one or more olefin-styrene block copolymers that contain 58-82 mass% of an olefin component and ethylene-vinyl acetate copolymers that contain 75-88 mass% of an olefin component, and (d-2) 10-40 mass% of a potassium ionomer having anti-static properties.
TW104126472A 2014-08-15 2015-08-14 Cover film and electronic component package using the same TWI659838B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014165353 2014-08-15
JP2014-165353 2014-08-15

Publications (2)

Publication Number Publication Date
TW201613761A true TW201613761A (en) 2016-04-16
TWI659838B TWI659838B (en) 2019-05-21

Family

ID=55304158

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104126472A TWI659838B (en) 2014-08-15 2015-08-14 Cover film and electronic component package using the same

Country Status (5)

Country Link
JP (1) JP6694387B2 (en)
KR (1) KR102337822B1 (en)
CN (1) CN106604816B (en)
TW (1) TWI659838B (en)
WO (1) WO2016024529A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI778161B (en) * 2017-10-31 2022-09-21 日商電化股份有限公司 cover film
TWI830811B (en) * 2018-11-14 2024-02-01 日商電化股份有限公司 Package containing heat dissipation substrate and packing box

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018101295A1 (en) * 2016-12-02 2018-06-07 大日本印刷株式会社 Transparent electroconductive cover tape
CN111344130B (en) * 2017-06-08 2022-08-19 日产化学株式会社 Method for manufacturing substrate for flexible device
JP6763421B2 (en) * 2018-09-18 2020-09-30 大日本印刷株式会社 Cover tape and packaging for electronic component packaging
SG11202105744QA (en) * 2018-12-19 2021-07-29 Denka Company Ltd Cover film and electronic component package using same
CN114007862A (en) * 2019-07-11 2022-02-01 电化株式会社 Cover film and electronic component package using the same
KR20220079864A (en) * 2019-10-11 2022-06-14 다이니폰 인사츠 가부시키가이샤 Cover tapes for packaging electronic components, packaging bodies and sets for packaging bodies
CN110948985A (en) * 2019-11-28 2020-04-03 江门市蓬江区华龙包装材料有限公司 Anti-static easy-uncovering film for electronic carrier tape and preparation method thereof
JP7469914B2 (en) * 2020-03-05 2024-04-17 住友ベークライト株式会社 Cover tape for packaging electronic components and electronic component package
JP7289816B2 (en) * 2020-03-30 2023-06-12 住友ベークライト株式会社 Cover tape and electronic component package
CN113650384A (en) * 2021-07-26 2021-11-16 江阴宝柏新型包装材料有限公司 Easy-to-peel blown film and preparation method thereof
WO2023145919A1 (en) * 2022-01-31 2023-08-03 大日本印刷株式会社 Hygroscopic film and hygroscopic laminate

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3241220B2 (en) 1994-10-28 2001-12-25 住友ベークライト株式会社 Cover tape for packaging chip-type electronic components
JP3201507B2 (en) 1995-05-30 2001-08-20 住友ベークライト株式会社 Cover tape for packaging electronic components
JPH09175592A (en) * 1995-12-26 1997-07-08 Du Pont Mitsui Polychem Co Ltd Cover tape for packing electronic part
JP3801296B2 (en) 1997-03-13 2006-07-26 信越ポリマー株式会社 Top cover tape
JP2000327024A (en) 1999-05-17 2000-11-28 Shin Etsu Polymer Co Ltd Cover tape
JP4598598B2 (en) * 2005-05-26 2010-12-15 大日本印刷株式会社 Cover tape and manufacturing method thereof
JP4712502B2 (en) 2005-09-29 2011-06-29 電気化学工業株式会社 Cover film
JP5296564B2 (en) * 2009-01-28 2013-09-25 電気化学工業株式会社 Cover film
SG174337A1 (en) * 2009-03-13 2011-11-28 Denki Kagaku Kogyo Kk Cover film
DE112011102024B4 (en) * 2010-06-15 2022-02-03 Denka Company Limited masking tape
EP2600391A1 (en) * 2010-07-28 2013-06-05 Du Pont-Mitsui Polychemicals Co., Ltd. Laminate film, and film for use in production of semiconductor comprising same
JP2012214252A (en) * 2010-09-30 2012-11-08 Sumitomo Bakelite Co Ltd Cover tape for packaging electronic component

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI778161B (en) * 2017-10-31 2022-09-21 日商電化股份有限公司 cover film
TWI830811B (en) * 2018-11-14 2024-02-01 日商電化股份有限公司 Package containing heat dissipation substrate and packing box
US11912489B2 (en) 2018-11-14 2024-02-27 Denka Company Limited Package accommodating heat dissipation substrate and packing box

Also Published As

Publication number Publication date
TWI659838B (en) 2019-05-21
KR102337822B1 (en) 2021-12-09
CN106604816A (en) 2017-04-26
KR20170044661A (en) 2017-04-25
CN106604816B (en) 2020-07-24
WO2016024529A1 (en) 2016-02-18
JP6694387B2 (en) 2020-05-13
JPWO2016024529A1 (en) 2017-06-01

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