CN107791638A - A kind of cover strip and its application method - Google Patents
A kind of cover strip and its application method Download PDFInfo
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- CN107791638A CN107791638A CN201711013545.6A CN201711013545A CN107791638A CN 107791638 A CN107791638 A CN 107791638A CN 201711013545 A CN201711013545 A CN 201711013545A CN 107791638 A CN107791638 A CN 107791638A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B15/00—Attaching articles to cards, sheets, strings, webs, or other carriers
- B65B15/04—Attaching a series of articles, e.g. small electrical components, to a continuous web
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/06—Polyethene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
- C08L23/0815—Copolymers of ethene with aliphatic 1-olefins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L47/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds; Compositions of derivatives of such polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/06—Vegetal fibres
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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Abstract
The present invention relates to electronic packaging field, the cover strip for coordinating carrier band to use particularly on electronic component, particularly provides a kind of cover strip and its application method that can prevent electrostatic.The cover strip includes cover strip body, and dotted cut is offered on cover strip body, and cover strip body includes substrate layer, sets up antistatic film and protection wax layer successively in the upper surface of substrate layer, antistatic additive is distributed with antistatic film；The middle section of stripping area down-set formation of pressure-sensitive adhesive layer and mask layer successively are corresponded in the lower surface of substrate layer；The two side areas that both sides heat-sealable area is corresponded in the lower surface of substrate layer distinguishes down-set polyurethane adhesive water layer, composite bed, bearing bed and hot sealing layer successively.The present invention can prevent electrostatic, and the stripping process for realizing cover strip need not peel off whole cover strip, and peeling force not influence of the stand under load with material and temperature environment is unrelated with the Nian Jie uniformity, disclosure satisfy that the stable requirement of peeling force, contribute to raising efficiency.
Description
Technical field：
The present invention relates to electronic packaging field, the cover strip for coordinating carrier band (carrying belt) to use particularly on electronic component, tool
A kind of cover strip and its application method that can prevent electrostatic is provided body.
Background technology：
In order to protect electronic component not contaminated and damage in transportation, generally it is loaded into the pocket of carrier band
And sealed using cover strip on the surface of carrier band to form the packaging of closed type；When needing to take out electronic component, by cover strip from load
Take stripping.Traditional cover strip be in the case of external force or heating sealing to carrier band surface, such as temperature-sensitive cover strip and
Pressure-sensitive cover strip；Wherein, the sealing of temperature-sensitive cover strip is to apply certain temperature and pressure by sealing presser feet by sealing machine, makes cover strip
Hotmelt melts be pressed together on the sealing surface of carrier band and realize sealing, and the sealing of pressure-sensitive cover strip is to be applied by sealing machine by pressure roller
Add continuous pressure, the pressure sensitive adhesive of cover strip is bonded on carrier band；Either temperature-sensitive cover strip or pressure-sensitive cover strip, by cover strip from load
Taking the peeling force of stripping should guarantee easily to peel off cover strip, again with certain stability, avoid peeling off
During electronic component is caused to beat or overturn.
At present, the cover strip of in the market is mainly that the size of peeling force is controlled by the cohesive force of PUR or pressure sensitive adhesive,
Such as Chinese patent CN200580049050.8 discloses the cover strip for encapsulating electronic component and the method for preparing the cover strip,
Cover strip therein includes basement membrane, the intermediate layer being made up of thermoplastic resin formed on basement membrane and intaglio plate coating in intermediate layer
On heat sealing agent hot sealing layer, heat sealing agent includes thermoplastic elastomer (TPE) and solvent, and thermoplastic elastomer (TPE) is styrene-ethylene-fourth
Styrene block copolymer or SBS, solvent are toluene, and basement membrane is by poly- to benzene
Naphthalate, polyolefin or one or more layers Biaxially oriented film made from nylon are formed；And Chinese patent
CN201521112808.5 discloses a kind of self-adhering-type cover strip, including be located at from top to bottom film substrate surface from shape glue-line,
Base film layer, pressure-sensitive adhesive layer and foil layer, the pressure-sensitive adhesive layer is arranged at base film layer lower surface, described to be set from shape glue-line
It is placed in base film layer upper surface, the pressure-sensitive adhesive layer and is bonded from shape glue-line by base film layer, then is covered with foil layer structure
Into a self-adhering-type structure；These glue cohesive force size in the different carrier band of matching surface material has difference, and glue is glutinous
It can also be varied under different temperature environments and aging condition, so that peeling force is unstable, easily shell with joint efforts
It is too small from power to cause operating to stop or peeling force excessive phenomena such as causing electronic component to fly out.
Simultaneously as electrostatic may make electronic component failure or damage, therefore it is antistatic to require that cover strip allows for, such as
Chinese patent CN200980139986.8 discloses a kind of cover strip, and it at least has substrate layer, intermediate layer, charge transfer layer and heat
Sealing, sets antistatic layer on the outer surface of the substrate layer, and the charge transfer layer contains the modified vistanex of acid
And conductive agent, the hot sealing layer include thermoplastic resin elements and (b) styrene-conjugation that (a) is made up of acrylic resin
Diene copolymers or its hydrogenated resin, the charge transfer layer contain carbon black, metal particle, metal oxide, electrically conductive microparticle,
At least one of Si bases organic compound, organic conductive polymer, ionic liquid and surfactant；By add carbon black,
The inorganic conductive such as metal particle, metal oxide filler may substantially reduce the light transmittance of cover strip as conductive agent, and then right
Electronic component is observed by cover strip and causes difficulty.
The content of the invention：
The technical problems to be solved by the invention be for cover strip of the prior art exist peeling force it is unstable, may drop
Low-transmittance and to observation electronic component cause difficulty the shortcomings of, there is provided a kind of cover strip and its application method.
The technical scheme adopted by the invention to solve the technical problem is that：A kind of cover strip, comprising alongst extending
Cover strip body, it is characterised in that：Position close to both sides of the edge on cover strip body offers dotted cut, two void respectively
Cover strip body between line otch is stripping area, and the cover strip body in the respective outside of two dotted cuts is heat-sealable area；The cover strip
Body includes substrate layer, sets up antistatic film and protection wax layer successively in the upper surface of the substrate layer, described antistatic
Antistatic additive is distributed with film；The middle section of stripping area down-set pressure sensitive adhesive successively is corresponded in the lower surface of the substrate layer
Adhesive layer and mask layer, the upper surface of formation of pressure-sensitive adhesive layer and the lower surface of substrate layer bond, the lower surface of formation of pressure-sensitive adhesive layer
Bonded with the upper surface of mask layer；The two side areas that both sides heat-sealable area is corresponded in the lower surface of the substrate layer is downward successively respectively
Polyurethane adhesive water layer, composite bed, bearing bed and hot sealing layer are set, and the composite bed is bonded setting with polyurethane adhesive water layer, described
Hot sealing layer is bonded setting with bearing bed.
Further, the thickness of the composite bed is 4~6 μm, and the composite bed is by weight comprising 70~80 parts
Linear polyethylene and 20~30 parts of metallocene PE, the thickness of the bearing bed is 9~11 μm, and the bearing bed is by weight
Part meter is total to comprising 20~30 parts of metallocene PE, 20~30 parts of low density polyethylene (LDPE), 35~45 parts of ethene-a- alkene
Polymers and 5~15 parts of poly- different luxuriant diene.
Further, the thickness of the hot sealing layer is 4~6 μm, and the hot sealing layer is by weight comprising 45~55 parts
Gather different luxuriant diene, 1~10 part of metallocene PE, 12~22 parts of naphthenic oil, 13~23 parts of polybutadiene, 5~15 parts
Acrylic acid ethylene co-polymer and 1~8 part of tin-antiomony oxide nano particle.
Further, the hot sealing layer includes heat sealing agent, and the heat sealing agent includes thermoplastic elastomer (TPE), tackifying resin, prevented
Binding agent and solvent；Thermoplastic elastomer (TPE) includes SBS and hydrogenated styrene-fourth two
At least one of alkene-styrene block copolymer, tackifying resin include hydrogenated rosin resin, hydrogenated rosin glyceride, hydrogenation
In C5 Petropols, hydrogenation C9 Petropols, rosin modified phenolic resin, terpene-styrene resin and Terpene-phenolic resin
At least one, antitack agent include Tissuemat E, OPE, polypropylene wax, polytetrafluoroethylwax wax, polyamide wax and silicon
At least one of oil, solvent are toluene or the mixture of toluene and ethyl acetate.
Further, the antistatic additive is by weight comprising 20~30 parts of glycerine, ethoxylated alkylamine 15-19
Part, 10~20 parts of surfactant, 20~30 parts of polyethylene glycol Synthesis of Oligo Ethylene Glycol, remaining is water.
Further, the formation of pressure-sensitive adhesive layer is polyacrylate series pressure-sensitive layer, the thickness of the formation of pressure-sensitive adhesive layer
Spend for 30~40 μm.
Further, the mask layer is single or multiple lift, and the thickness of the mask layer is 2~200 μm, the mask layer
Material be preferably at least one of polyester, nylon, polyethylene terephthalate (PET), polyethylene or polypropylene.
Further, the mask layer lower surface coat one layer of antistatic layer, the antistatic layer include tin oxide,
At least one of zinc oxide or titanium oxide and surfactant and conducting polymer.
Further, the substrate layer is PET film or Multilayer paper structure, and the Multilayer paper structure includes table successively
Layer, intermediate layer and bottom, the top layer are polymer resin layer, and the thickness on the top layer is 0.5~2 μm, and the intermediate layer is
Needle long fibre wood pulp layer, the thickness in the intermediate layer is 25~30 μm, and the bottom is polymer resin layer, the bottom
Thickness is 2~5 μm.
Meanwhile the present invention also provides a kind of application method of above-mentioned cover strip, the cover strip can coordinate carrier band to electronics member
Part forms closed type packaging, and the application method comprises the following steps：
(1) heat sealing adhesive, by cover strip body by heat sealing adhesive on carrier band, the corresponding covering in the stripping area of cover strip body carries
Take the open cavity for loading electronic component, the open cavity of two heat-sealable area heat sealing adhesives of cover strip body on carrier band
Both sides；
(2) remove, the electronic component in the open cavity on carrier band is exposed after the stripping area of cover strip body is removed.
Due to taking above-mentioned technical proposal, it has the advantages that the present invention：
A kind of cover strip and its application method of the present invention, electrostatic can be prevented, and two dotted cuts can be passed through
Stripping area is separated with heat-sealable area, without bonding between stripping area and carrier band, realizes the stripping process of cover strip without will be whole
Cover strip is peeled off, and peeling force not influence of the stand under load with material and temperature environment of stripping area is removed by two dotted cuts, with
The bonding uniformity is unrelated, disclosure satisfy that the stable requirement of peeling force, contributes to raising efficiency.
Brief description of the drawings：
Fig. 1 is the schematic top plan view of cover strip of the present invention；
Fig. 2 is the schematic cross-sectional view of cover strip of the present invention；
Fig. 3 is the schematic cross-sectional view of substrate layer of the present invention.
Embodiment：
Present disclosure is described further below in conjunction with accompanying drawing.
As shown in figure 1, a kind of cover strip of the present invention, comprising the cover strip body alongst extended, in cover strip
Position on body close to both sides of the edge offers dotted cut 100 respectively, and the cover strip body between two dotted cuts 100 is
Stripping area 101, the cover strip body in the respective outside of two dotted cuts 100 is heat-sealable area 102；The cover strip is used to coordinate carrier band pair
Electronic component forms closed type packaging, and the open cavity for loading electronic component is used on the corresponding covering carrier band in the stripping area 101
And can be removed when needed, the heat-sealable area 102 is bonded in the both sides of the open cavity on carrier band；It is described since so
Stripping area 101 can be separated by two dotted cuts 100 with heat-sealable area 102, and then expose the electronic component on carrier band, heat-sealing
Area is bond regions, and cohesive force is more than the peeling force that stripping area 101 is removed by two dotted cuts 100, realizes the stripping of cover strip
From process without whole cover strip is peeled off, peeling force needs only to the cohesive force being less than between heat-sealable area 102 and carrier band, passes through two
Bar dotted cut 100 removes peeling force not influence of the stand under load with material and temperature environment of stripping area 101, disclosure satisfy that stripping
The stable requirement of power.
As shown in Fig. 2 cover strip body of the present invention includes substrate layer 1, the upper surface of the substrate layer 1 successively to
It is upper setting antistatic film 2 and protection wax layer 3, so since, the upper surface of whole cover strip body leads to covered with antistatic film 2
Overprotection wax layer 3 is protected so that cover strip of the present invention has reliable antistatic effect；In the following table of the substrate layer 1
Face corresponds to the middle section of stripping area 101 down-set formation of pressure-sensitive adhesive layer 9 and mask layer 8 successively, formation of pressure-sensitive adhesive layer 9 it is upper
Surface and the lower surface of substrate layer 1 bond, and the lower surface of formation of pressure-sensitive adhesive layer 9 bonds with the upper surface of mask layer 8, the mask
Layer 8 can cover to the electronic component on carrier band after cover strip body is covered on carrier band and provide certain protecting effect, together
When cover strip body stripping area 101 peel off when, due to mask layer 8 will not with the Nian Jie or Electrostatic Absorption of electronic component generation, because
This will not be peeled off away in the lump together with electronic component, ensure that stripping process does not have an impact to electronic component；In the substrate layer 1
Lower surface correspond to both sides heat-sealable area 102 two side areas respectively successively down-set polyurethane adhesive water layer 4, composite bed 5, carrying
Layer 6 and hot sealing layer 7, the composite bed 5 are bonded setting with polyurethane adhesive water layer 4, and the hot sealing layer 7 is bonded setting with bearing bed 6,
Since so, the stabilization of heat-sealable area 102 and reliable heat-sealing effect can have been ensured.
Wherein, the thickness of the composite bed 5 be 4~6 μm, preferably 5 μm, its include 70~80 parts linear polyethylene and
20~30 parts of metallocene PE.
Wherein, the bearing bed 6 can make heat-sealable area 102 keep enough bonding forces, after ensureing follow-up heat-sealing processing
Reliability, the thickness of the bearing bed 6 is 9~11 μm, preferably 10 μm；And preferably described bearing bed 6 includes 20~30 parts
Metallocene PE, 20~30 parts of low density polyethylene (LDPE), 35~45 parts of ethene-a- olefin copolymers and 5~15 parts it is poly-
Different luxuriant diene.
Wherein, the thickness of the hot sealing layer 7 is 4~6 μm, and preferably 5 μm, it includes 45~55 parts of poly- different luxuriant diene, 1
~10 parts of metallocene PE, 12~22 parts of naphthenic oil, 13~23 parts of polybutadiene, 5~15 parts of vinyl
Copolymer and 1~8 part of tin-antiomony oxide nano particle.
Preferably, heat sealing agent can also be applied to the following table of the bearing bed 6 by the hot sealing layer 7 using coating method
Face, the heat sealing agent include thermoplastic elastomer (TPE), tackifying resin, antitack agent and solvent；Thermoplastic elastomer (TPE) include styrene-
At least one of butadiene-styrene block copolymer and hydrogenated styrene-butadiene-styrene block copolymers, thickening
Resin includes hydrogenated rosin resin, hydrogenated rosin glyceride, hydrogenation C5 Petropols, hydrogenation C9 Petropols, Abietyl modified phenol
At least one of urea formaldehyde, terpene-styrene resin and Terpene-phenolic resin, antitack agent includes Tissuemat E, oxidation gathers
At least one of ethylene waxes, polypropylene wax, polytetrafluoroethylwax wax, polyamide wax and silicone oil, solvent are toluene or toluene and second
The mixture of acetoacetic ester；The processing efficiency lifting of the hot sealing layer 7, technique is simple, and final heat-sealing excellent effect.
In the present invention, antistatic additive is distributed with the antistatic film 2, the antistatic additive includes glycerine, ethyoxyl
Change alkylamine, surfactant, polyethylene glycol Synthesis of Oligo Ethylene Glycol and water, due to ethoxylated alkylamine be affected by temperature it is smaller,
So that the antistatic effect of cover strip of the present invention is stable, and without using inorganic conductive filler, it ensure that the saturating of cover strip
Light rate, it can be easy to observe electronic component by cover strip.Specifically, the antistatic additive includes by weight：Glycerine 20~
30 parts, ethoxylated alkylamine 15-19 parts, 10~20 parts of surfactant, 20~30 parts of polyethylene glycol Synthesis of Oligo Ethylene Glycol, remaining
For water；Wherein, 25 parts of preferably glycerine, 15 parts of surfactant, 25 parts of polyethylene glycol Synthesis of Oligo Ethylene Glycol.
Preferably, the formation of pressure-sensitive adhesive layer 9 is polyacrylate series pressure-sensitive layer, the thickness of the formation of pressure-sensitive adhesive layer 9
Spend for 30~40 μm.
Wherein, the mask layer 8 is single or multiple lift, and its thickness is 2~200 μm；The material of the mask layer 8 is preferably
At least one of polyester, nylon, polyethylene terephthalate (PET), polyethylene or polypropylene.Meanwhile for maximum
Electrostatic is prevented to degree, one layer of antistatic layer is preferably coated in the lower surface of the mask layer 8, the antistatic layer includes oxidation
At least one of tin, zinc oxide or titanium oxide and surfactant and conducting polymer, are not so reducing sealing force
Further increase antistatic effect simultaneously.
In the present invention, the substrate layer 1 is PET film or Multilayer paper structure, as shown in figure 3, the multi-ply paper knot
Structure includes top layer 31, intermediate layer 32 and bottom 33 successively；Top layer 31 is polymer resin layer, and its thickness is 0.5~2 μm；It is middle
Layer 32 is needle long fibre wood pulp layer, and its thickness is 25~30 μm；Bottom 33 is polymer resin layer, and its thickness is 2~5 μm；
The Multilayer paper structure advantageously reduces electrostatic, realizes the recyclable of material, and have reliable intensity.
Meanwhile the present invention also provides a kind of application method of above-mentioned cover strip, the cover strip can coordinate carrier band to electronics member
Part forms closed type packaging, and the application method comprises the following steps：
(1) heat sealing adhesive, by cover strip body by heat sealing adhesive on carrier band, the stripping area 101 of cover strip body is corresponding to be covered
It is used for the open cavity for loading electronic component on lid carrier band, two heat sealing adhesives of heat-sealable area 102 of cover strip body are on carrier band
The both sides of open cavity；
(2) remove, the electronic component in the open cavity on carrier band is exposed after the stripping area 101 of cover strip body is removed.
The application method of the cover strip provided by the invention is in addition to the advantage with cover strip itself, additionally it is possible to significantly reduces
Processing step, while ensure the efficiency and reliability during removing.
Claims (10)
1. a kind of cover strip, include the cover strip body alongst extended, it is characterised in that：Close to both sides on cover strip body
The position at edge offers dotted cut respectively, and the cover strip body between two dotted cuts is stripping area, two dotted cuts
Each the cover strip body in outside is heat-sealable area；The cover strip body includes substrate layer, the upper surface of the substrate layer successively to
It is upper that antistatic film and protection wax layer are set, antistatic additive is distributed with the antistatic film；In the lower surface pair of the substrate layer
Answer the middle section of stripping area down-set formation of pressure-sensitive adhesive layer and mask layer successively, the upper surface of formation of pressure-sensitive adhesive layer and base material
The lower surface of layer bonds, and the lower surface of formation of pressure-sensitive adhesive layer and the upper surface of mask layer bond；In the lower surface of the substrate layer
Correspondingly the two side areas of both sides heat-sealable area distinguishes down-set polyurethane adhesive water layer, composite bed, bearing bed and hot sealing layer successively, institute
State composite bed and setting is bonded with polyurethane adhesive water layer, the hot sealing layer is bonded setting with bearing bed.
2. cover strip according to claim 1, it is characterised in that：The thickness of the composite bed is 4~6 μm, the composite bed
70~80 parts of linear polyethylene and 20~30 parts of metallocene PE is included by weight, and the thickness of the bearing bed is
9~11 μm, the bearing bed is by weight comprising 20~30 parts of metallocene PE, 20~30 parts of low density polyethylene
Alkene, 35~45 parts of ethene-a- olefin copolymers and 5~15 parts of poly- different luxuriant diene.
3. cover strip according to claim 1, it is characterised in that：The thickness of the hot sealing layer is 4~6 μm, the hot sealing layer
By weight comprising 45~55 parts of poly- different luxuriant diene, 1~10 part of metallocene PE, 12~22 parts of naphthenic oil, 13
~23 parts of polybutadiene, 5~15 parts of acrylic acid ethylene co-polymer and 1~8 part of tin-antiomony oxide nano particle.
4. cover strip according to claim 1, it is characterised in that：The hot sealing layer includes heat sealing agent, and the heat sealing agent includes
Thermoplastic elastomer (TPE), tackifying resin, antitack agent and solvent；Thermoplastic elastomer (TPE) includes s-B-S block
At least one of copolymer and hydrogenated styrene-butadiene-styrene block copolymers, tackifying resin include hydrogenated rosin tree
Fat, hydrogenated rosin glyceride, hydrogenation C5 Petropols, hydrogenation C9 Petropols, rosin modified phenolic resin, terpene-styrene
At least one of resin and Terpene-phenolic resin, antitack agent include Tissuemat E, OPE, polypropylene wax, poly-
At least one of tetrafluoroethene wax, polyamide wax and silicone oil, solvent are toluene or the mixture of toluene and ethyl acetate.
5. cover strip according to claim 1, it is characterised in that：The antistatic additive includes glycerine 20~30 by weight
Part, ethoxylated alkylamine 15-19 parts, 10~20 parts of surfactant, 20~30 parts of polyethylene glycol Synthesis of Oligo Ethylene Glycol, remaining is
Water.
6. cover strip according to claim 1, it is characterised in that：The formation of pressure-sensitive adhesive layer is polyacrylate series pressure-sensitive
Layer, the thickness of the formation of pressure-sensitive adhesive layer is 30~40 μm.
7. cover strip according to claim 1, it is characterised in that：The mask layer is single or multiple lift, the mask layer
Thickness is 2~200 μm, and the material of the mask layer is preferably polyester, nylon, polyethylene terephthalate (PET), poly- second
At least one of alkene or polypropylene.
8. cover strip according to claim 1, it is characterised in that：In the lower surface of the mask layer, one layer of coating is antistatic
Layer, the antistatic layer include at least one of tin oxide, zinc oxide or titanium oxide and surfactant and conducting polymer
Thing.
9. cover strip according to claim 1, it is characterised in that：The substrate layer is PET film or Multilayer paper structure, institute
State Multilayer paper structure and include top layer, intermediate layer and bottom successively, the top layer is polymer resin layer, and the thickness on the top layer is
0.5~2 μm, the intermediate layer is needle long fibre wood pulp layer, and the thickness in the intermediate layer is 25~30 μm, and the bottom is height
Molecule resin bed, the thickness of the bottom is 2~5 μm.
10. a kind of application method of cover strip according to claim 1~9 any one, the cover strip can coordinate carrier band
Closed type packaging is formed to electronic component, the application method comprises the following steps：
(1) heat sealing adhesive, by cover strip body by heat sealing adhesive on carrier band, on the corresponding covering carrier band in the stripping area of cover strip body
For loading the open cavity of electronic component, the two of the open cavity of two heat-sealable area heat sealing adhesives of cover strip body on carrier band
Side；
(2) remove, the electronic component in the open cavity on carrier band is exposed after the stripping area of cover strip body is removed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711013545.6A CN107791638B (en) | 2017-10-26 | 2017-10-26 | Cover tape and using method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711013545.6A CN107791638B (en) | 2017-10-26 | 2017-10-26 | Cover tape and using method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107791638A true CN107791638A (en) | 2018-03-13 |
| CN107791638B CN107791638B (en) | 2020-05-01 |
Family
ID=61547824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711013545.6A Active CN107791638B (en) | 2017-10-26 | 2017-10-26 | Cover tape and using method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN107791638B (en) |
Cited By (8)
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| CN108584148A (en) * | 2018-06-15 | 2018-09-28 | 广州市中载电子科技有限公司 | A kind of cover strip structure |
| CN110683208A (en) * | 2018-07-06 | 2020-01-14 | 3M创新有限公司 | Multi-layer cover tape construction |
| CN112108349A (en) * | 2020-09-23 | 2020-12-22 | 江西若邦科技股份有限公司 | Cover tape with good heat sealing performance and preparation method thereof |
| CN112500753A (en) * | 2020-12-01 | 2021-03-16 | 浙江洁美电子科技股份有限公司 | Anti-adhesion and antistatic heat-seal coating and cover tape |
| CN112575611A (en) * | 2020-12-22 | 2021-03-30 | 浙江洁美电子信息材料有限公司 | Paper for storage carrier of micro electronic component and storage carrier |
| CN114889266A (en) * | 2022-04-27 | 2022-08-12 | 河南银金达彩印股份有限公司 | PETG curtain coating membrane |
| CN115027115A (en) * | 2022-03-24 | 2022-09-09 | 深圳市新创源精密智造有限公司 | Environment-friendly composite cover tape and preparation process thereof |
| WO2023017392A1 (en) * | 2021-08-13 | 2023-02-16 | 3M Innovative Properties Company | Antistatic fabric article |
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|---|---|---|---|---|
| CN108584148A (en) * | 2018-06-15 | 2018-09-28 | 广州市中载电子科技有限公司 | A kind of cover strip structure |
| CN110683208A (en) * | 2018-07-06 | 2020-01-14 | 3M创新有限公司 | Multi-layer cover tape construction |
| CN112108349A (en) * | 2020-09-23 | 2020-12-22 | 江西若邦科技股份有限公司 | Cover tape with good heat sealing performance and preparation method thereof |
| CN112500753A (en) * | 2020-12-01 | 2021-03-16 | 浙江洁美电子科技股份有限公司 | Anti-adhesion and antistatic heat-seal coating and cover tape |
| CN112575611A (en) * | 2020-12-22 | 2021-03-30 | 浙江洁美电子信息材料有限公司 | Paper for storage carrier of micro electronic component and storage carrier |
| WO2023017392A1 (en) * | 2021-08-13 | 2023-02-16 | 3M Innovative Properties Company | Antistatic fabric article |
| CN115027115A (en) * | 2022-03-24 | 2022-09-09 | 深圳市新创源精密智造有限公司 | Environment-friendly composite cover tape and preparation process thereof |
| CN114889266A (en) * | 2022-04-27 | 2022-08-12 | 河南银金达彩印股份有限公司 | PETG curtain coating membrane |
| CN114889266B (en) * | 2022-04-27 | 2023-11-07 | 河南银金达彩印股份有限公司 | PETG curtain coating membrane |
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| CN107791638B (en) | 2020-05-01 |
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