CN201923474U - Anti-static patch type electronic element protecting belt - Google Patents
Anti-static patch type electronic element protecting belt Download PDFInfo
- Publication number
- CN201923474U CN201923474U CN2010206866823U CN201020686682U CN201923474U CN 201923474 U CN201923474 U CN 201923474U CN 2010206866823 U CN2010206866823 U CN 2010206866823U CN 201020686682 U CN201020686682 U CN 201020686682U CN 201923474 U CN201923474 U CN 201923474U
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- CN
- China
- Prior art keywords
- strap
- melt adhesive
- adhesive layer
- electronic component
- belt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to an anti-static patch type electronic element protecting belt, comprising a packaging belt and a covering belt, wherein the packaging belt comprises a conducting layer and a hot-melt adhesive layer; the hot-melt adhesive layer is coated on the coarse surface of the conducting layer; the thickness of the conducting layer is 25 to 30mum; the thickness of the hot-melt adhesive layer is 20 to 25mum; the packaging belt is provided with a plurality of concave chambers that are used for containing electronic elements; and the covering belt is arranged on the opening surface of the concave chamber.
Description
Technical field
The utility model relates to a kind of packing electronic component band, particularly a kind of strong strap of antistatic effect that is used for the protector electronic element.
Background technology
The packing of surface mount electron-like components and parts such as sheet type diode, patch-type rectifier bridge etc. all directly realizes by strap and cover tape tight joint at present, the environmental stress that in the process of the two combination, inevitably will add High Temperature High Pressure, but strap and cover tape can be in the of short duration hot environment when adopting this mode, the braid distortion that the requirement of its themoplasticity out of reach regulation forms after will causing and binding, electronic devices and components are got stuck when the online use of client, can not satisfy the needs of automatic sth. made by twisting sheet.And strap and cover tape mutually the mutual friction meeting produce static and can cause semiconductor devices reverse breakdown the ESD sensitivity, electronic devices and components are also formal so just uses electrically inefficacy forever.
The utility model content
The purpose of this utility model is can not anlistatig problem at the current packaging band described in the background technology, and a kind of antistatic SMD electronic component boundary belt is provided.
The realization the technical solution of the utility model is as follows:
A kind of antistatic SMD electronic component boundary belt; it comprises strap and cover tape; described strap comprises conductive layer and hot melt adhesive layer; hot melt adhesive layer is coated on the rough surface of conductive layer; the thickness of conductive layer is 25 μ m～30 μ m; the thickness of hot melt adhesive layer is 20 μ m～25 μ m, and strap is provided with several cavitys that is used to put into electronic component, and cover tape is arranged on the opening surface of cavity.
The cavity of described strap is provided with breather hole.
Described strap side is provided with the through hole that is used for the identification of machine location.
The beneficial effects of the utility model are provided with conductive layer for the strap because of antistatic SMD electronic component boundary belt of the present utility model; therefore; can prevent that the mutual fricative static of strap and cover tape from making the semiconductor devices reverse breakdown of ESD sensitivity; because strap is provided with hot melt adhesive layer; when electronic component is packed; by certain temperature and pressure strap and cover tape are bonded together; can make the themoplasticity of strap reach the requirement of regulation, guarantee that strap can not be out of shape in adhesion process.
Description of drawings
Fig. 1 is a scheme drawing of the present utility model;
Fig. 2 is the scheme drawing of packaging bag of the present utility model;
Among the figure, 1 is strap, and 2 is cover tape, and 3 is conductive layer, and 4 is hot melt adhesive layer, and 5 is cavity, and 6 is breather hole, and 7 is through hole.
The specific embodiment
With reference to Fig. 1 and a kind of antistatic SMD electronic component boundary belt shown in Figure 2; it comprises strap 1 and cover tape 2; described strap 1 comprises conductive layer 3 and hot melt adhesive layer 4; hot melt adhesive layer 4 is coated on the rough surface of conductive layer 3; the thickness of conductive layer 3 is 25 μ m～30 μ m; the thickness of hot melt adhesive layer 4 is 20 μ m～25 μ m; strap 1 is provided with several cavitys 5 that is used to put into electronic component; cover tape 2 is arranged on the opening surface of cavity 5; the cavity 5 of strap 1 is provided with breather hole 6; in order to be convenient to the machine location in the packaging electronic components process, strap 1 side is provided with the through hole 7 that is used for the identification of machine location.The key component of conductive layer 3 is polycarbonate and carbon black, and the component of hot melt adhesive layer 4 is mainly low density polyethylene (LDPE) and vinyl acetate, and the body index that melts of hot melt adhesive layer 4 is 20-30g/min, 230 ℃ ± 10 ℃ of softening points, 180 ± 5 ℃ of solidfying points, 330 ± 5 ℃ of melting points.When packaging electronic components, by machine electronic component is put into strap 1, by hot pressing strap 1 and cover tape 2 are bonded together then, whole packaging process all is that cost of labor is low by machine operation, the good stability of packing, product design height.After packing is finished; normally a certain amount of boundary belt that packages electronic component being put into packing box transports; in transportation; can produce friction between each strap 1 and the cover tape 2, produce static, because strap 1 has electric conductivity; therefore; can timely static be transferred to packing box, can not cause damage, prevent the electrical inefficacy of electronic component electronic component.
Claims (3)
1. antistatic SMD electronic component boundary belt; it comprises strap and cover tape; it is characterized in that: described strap comprises conductive layer and hot melt adhesive layer; hot melt adhesive layer is coated on the rough surface of conductive layer; the thickness of conductive layer is 25 μ m～30 μ m; the thickness of hot melt adhesive layer is 20 μ m～25 μ m, and strap is provided with several cavitys that is used to put into electronic component, and cover tape is arranged on the opening surface of cavity.
2. antistatic SMD electronic component boundary belt according to claim 1, it is characterized in that: the cavity of described strap is provided with breather hole.
3. antistatic SMD electronic component boundary belt according to claim 1 is characterized in that: described strap side is provided with the through hole that is used for the identification of machine location.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206866823U CN201923474U (en) | 2010-12-29 | 2010-12-29 | Anti-static patch type electronic element protecting belt |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206866823U CN201923474U (en) | 2010-12-29 | 2010-12-29 | Anti-static patch type electronic element protecting belt |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201923474U true CN201923474U (en) | 2011-08-10 |
Family
ID=44427340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206866823U Expired - Fee Related CN201923474U (en) | 2010-12-29 | 2010-12-29 | Anti-static patch type electronic element protecting belt |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201923474U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106115074A (en) * | 2016-07-06 | 2016-11-16 | 成都格虹电子科技有限责任公司 | The carrier band that antistatic performance is good |
| CN112313160A (en) * | 2018-06-28 | 2021-02-02 | 松下知识产权经营株式会社 | Electronic component group, capacitor, method for manufacturing electronic component group, reading method, and reading apparatus |
-
2010
- 2010-12-29 CN CN2010206866823U patent/CN201923474U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106115074A (en) * | 2016-07-06 | 2016-11-16 | 成都格虹电子科技有限责任公司 | The carrier band that antistatic performance is good |
| CN112313160A (en) * | 2018-06-28 | 2021-02-02 | 松下知识产权经营株式会社 | Electronic component group, capacitor, method for manufacturing electronic component group, reading method, and reading apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110810 Termination date: 20131229 |