CN201923474U - Anti-static patch type electronic element protecting belt - Google Patents

Anti-static patch type electronic element protecting belt Download PDF

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Publication number
CN201923474U
CN201923474U CN2010206866823U CN201020686682U CN201923474U CN 201923474 U CN201923474 U CN 201923474U CN 2010206866823 U CN2010206866823 U CN 2010206866823U CN 201020686682 U CN201020686682 U CN 201020686682U CN 201923474 U CN201923474 U CN 201923474U
Authority
CN
China
Prior art keywords
strap
melt adhesive
adhesive layer
electronic component
belt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010206866823U
Other languages
Chinese (zh)
Inventor
李崇聪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHANGZHOU STAR SEA ELECTRONICS Co Ltd
Original Assignee
CHANGZHOU STAR SEA ELECTRONICS Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHANGZHOU STAR SEA ELECTRONICS Co Ltd filed Critical CHANGZHOU STAR SEA ELECTRONICS Co Ltd
Priority to CN2010206866823U priority Critical patent/CN201923474U/en
Application granted granted Critical
Publication of CN201923474U publication Critical patent/CN201923474U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to an anti-static patch type electronic element protecting belt, comprising a packaging belt and a covering belt, wherein the packaging belt comprises a conducting layer and a hot-melt adhesive layer; the hot-melt adhesive layer is coated on the coarse surface of the conducting layer; the thickness of the conducting layer is 25 to 30mum; the thickness of the hot-melt adhesive layer is 20 to 25mum; the packaging belt is provided with a plurality of concave chambers that are used for containing electronic elements; and the covering belt is arranged on the opening surface of the concave chamber.

Description

Antistatic SMD electronic component boundary belt
Technical field
The utility model relates to a kind of packing electronic component band, particularly a kind of strong strap of antistatic effect that is used for the protector electronic element.
Background technology
The packing of surface mount electron-like components and parts such as sheet type diode, patch-type rectifier bridge etc. all directly realizes by strap and cover tape tight joint at present, the environmental stress that in the process of the two combination, inevitably will add High Temperature High Pressure, but strap and cover tape can be in the of short duration hot environment when adopting this mode, the braid distortion that the requirement of its themoplasticity out of reach regulation forms after will causing and binding, electronic devices and components are got stuck when the online use of client, can not satisfy the needs of automatic sth. made by twisting sheet.And strap and cover tape mutually the mutual friction meeting produce static and can cause semiconductor devices reverse breakdown the ESD sensitivity, electronic devices and components are also formal so just uses electrically inefficacy forever.
The utility model content
The purpose of this utility model is can not anlistatig problem at the current packaging band described in the background technology, and a kind of antistatic SMD electronic component boundary belt is provided.
The realization the technical solution of the utility model is as follows:
A kind of antistatic SMD electronic component boundary belt; it comprises strap and cover tape; described strap comprises conductive layer and hot melt adhesive layer; hot melt adhesive layer is coated on the rough surface of conductive layer; the thickness of conductive layer is 25 μ m~30 μ m; the thickness of hot melt adhesive layer is 20 μ m~25 μ m, and strap is provided with several cavitys that is used to put into electronic component, and cover tape is arranged on the opening surface of cavity.
The cavity of described strap is provided with breather hole.
Described strap side is provided with the through hole that is used for the identification of machine location.
The beneficial effects of the utility model are provided with conductive layer for the strap because of antistatic SMD electronic component boundary belt of the present utility model; therefore; can prevent that the mutual fricative static of strap and cover tape from making the semiconductor devices reverse breakdown of ESD sensitivity; because strap is provided with hot melt adhesive layer; when electronic component is packed; by certain temperature and pressure strap and cover tape are bonded together; can make the themoplasticity of strap reach the requirement of regulation, guarantee that strap can not be out of shape in adhesion process.
Description of drawings
Fig. 1 is a scheme drawing of the present utility model;
Fig. 2 is the scheme drawing of packaging bag of the present utility model;
Among the figure, 1 is strap, and 2 is cover tape, and 3 is conductive layer, and 4 is hot melt adhesive layer, and 5 is cavity, and 6 is breather hole, and 7 is through hole.
The specific embodiment
With reference to Fig. 1 and a kind of antistatic SMD electronic component boundary belt shown in Figure 2; it comprises strap 1 and cover tape 2; described strap 1 comprises conductive layer 3 and hot melt adhesive layer 4; hot melt adhesive layer 4 is coated on the rough surface of conductive layer 3; the thickness of conductive layer 3 is 25 μ m~30 μ m; the thickness of hot melt adhesive layer 4 is 20 μ m~25 μ m; strap 1 is provided with several cavitys 5 that is used to put into electronic component; cover tape 2 is arranged on the opening surface of cavity 5; the cavity 5 of strap 1 is provided with breather hole 6; in order to be convenient to the machine location in the packaging electronic components process, strap 1 side is provided with the through hole 7 that is used for the identification of machine location.The key component of conductive layer 3 is polycarbonate and carbon black, and the component of hot melt adhesive layer 4 is mainly low density polyethylene (LDPE) and vinyl acetate, and the body index that melts of hot melt adhesive layer 4 is 20-30g/min, 230 ℃ ± 10 ℃ of softening points, 180 ± 5 ℃ of solidfying points, 330 ± 5 ℃ of melting points.When packaging electronic components, by machine electronic component is put into strap 1, by hot pressing strap 1 and cover tape 2 are bonded together then, whole packaging process all is that cost of labor is low by machine operation, the good stability of packing, product design height.After packing is finished; normally a certain amount of boundary belt that packages electronic component being put into packing box transports; in transportation; can produce friction between each strap 1 and the cover tape 2, produce static, because strap 1 has electric conductivity; therefore; can timely static be transferred to packing box, can not cause damage, prevent the electrical inefficacy of electronic component electronic component.

Claims (3)

1. antistatic SMD electronic component boundary belt; it comprises strap and cover tape; it is characterized in that: described strap comprises conductive layer and hot melt adhesive layer; hot melt adhesive layer is coated on the rough surface of conductive layer; the thickness of conductive layer is 25 μ m~30 μ m; the thickness of hot melt adhesive layer is 20 μ m~25 μ m, and strap is provided with several cavitys that is used to put into electronic component, and cover tape is arranged on the opening surface of cavity.
2. antistatic SMD electronic component boundary belt according to claim 1, it is characterized in that: the cavity of described strap is provided with breather hole.
3. antistatic SMD electronic component boundary belt according to claim 1 is characterized in that: described strap side is provided with the through hole that is used for the identification of machine location.
CN2010206866823U 2010-12-29 2010-12-29 Anti-static patch type electronic element protecting belt Expired - Fee Related CN201923474U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010206866823U CN201923474U (en) 2010-12-29 2010-12-29 Anti-static patch type electronic element protecting belt

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010206866823U CN201923474U (en) 2010-12-29 2010-12-29 Anti-static patch type electronic element protecting belt

Publications (1)

Publication Number Publication Date
CN201923474U true CN201923474U (en) 2011-08-10

Family

ID=44427340

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010206866823U Expired - Fee Related CN201923474U (en) 2010-12-29 2010-12-29 Anti-static patch type electronic element protecting belt

Country Status (1)

Country Link
CN (1) CN201923474U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106115074A (en) * 2016-07-06 2016-11-16 成都格虹电子科技有限责任公司 The carrier band that antistatic performance is good
CN112313160A (en) * 2018-06-28 2021-02-02 松下知识产权经营株式会社 Electronic component group, capacitor, method for manufacturing electronic component group, reading method, and reading apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106115074A (en) * 2016-07-06 2016-11-16 成都格虹电子科技有限责任公司 The carrier band that antistatic performance is good
CN112313160A (en) * 2018-06-28 2021-02-02 松下知识产权经营株式会社 Electronic component group, capacitor, method for manufacturing electronic component group, reading method, and reading apparatus

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110810

Termination date: 20131229