CN208560293U - High isolation electronic packaging covers band - Google Patents
High isolation electronic packaging covers band Download PDFInfo
- Publication number
- CN208560293U CN208560293U CN201820442880.1U CN201820442880U CN208560293U CN 208560293 U CN208560293 U CN 208560293U CN 201820442880 U CN201820442880 U CN 201820442880U CN 208560293 U CN208560293 U CN 208560293U
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- film
- layer
- bonding coat
- antistatic
- high isolation
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Abstract
The utility model is that a kind of high isolation electronic packaging covers band, have and low is stained with glutinous characteristic, comprising sequentially from top to bottom light-transmitting substrate layer, bonding coat, antistatic layer and the separation layer of storehouse, reach packaging, storage purpose to overlay electronic component, wherein light-transmitting substrate layer tool translucency and heat resistance, bonding coat has stickiness, and antistatic layer have it is antistatic, especially, separation layer have buffer action, it can be used to overlay electronic component and reach packaging, storage purpose, and have and low attach characteristic.Therefore, the utility model is well suited for packing time millimeter light emitting diode or bare crystalline, needed for meeting.
Description
Technical field
The utility model covers band about a kind of high isolation electronic packaging, and high isolation electronic packaging of especially having covers
The structure of lid band designs, and the covering belt surface of type is mainly sticked in general heat-sealing/pressure, under conditions of reserved bonding space, patch
Attached one layer of separation layer uses the demand for reaching high isolation to component bonding coat is isolated Yu is contained.
Background technique
In recent years, mentioning with demand of the display equipment to more thin design and Advanced Integrated Circuits (IC) encapsulation procedure
It rises, so that being developed after whole and each luminescence component and raw secondary millimeter light emitting diode (Mini LED) and its packing colloid is small
Exploitation, development and bare crystalline (Bare Die) encapsulation technology of change technology, it has also become the essential core technology of presently relevant industry it
One.
But in response to Mini LED component and the lightening development of bare crystalline component, it is necessary to according to the Mini LED component or bare crystalline
Element shapes and design the thermoplastic resin carrying belt for storing the component, size also tends to be shallow, and is storing
After the component, multiplies the covering band as covering material of carrier band top coating, can will be covered by the sealed knife or pinch roller of heating
Lid band both ends alongst continuously seal, and form the packing material for storing the component.
However, disadvantage of the prior art is that the packing material of accommodating component can be because covering the surface with bonding coat and component
Energy is close, and the two is caused to occur being stained with glutinous phenomenon.
Hence it is highly desirable to a kind of innovation high isolation electronic packaging cover band, using the buffer action of separation layer with
It prevents from being stained with glutinous between the component and packing material of storage, uses all problems for solving the above-mentioned prior art.
Utility model content
The main purpose of the utility model is to provide a kind of high isolation electronic packaging cover band, including sequentially by upper and
Light-transmitting substrate layer, bonding coat, antistatic layer and the separation layer of push-down stack reach packaging, storage mesh to overlay electronic component
, wherein light-transmitting substrate layer tool translucency and heat resistance, bonding coat has a stickiness, and antistatic layer have it is antistatic, especially, every
Absciss layer has buffer action.
Furthermore, bonding coat is stacked over the lower surface of light-transmitting substrate layer, and antistatic layer is stacked over the following table of bonding coat
Face, and separation layer is the lower surface for being stacked over antistatic layer, to cover and pack electronic building brick.In particular, antistatic layer and
The lateral dimension of separation layer is identical, and is less than the lateral dimension of bonding coat, so that the two sides of bonding coat can reserve bonding space,
Mutually to bind.
The utility model high isolation electronic packaging covering band due to comprising bonding coat with there are special on antistatic layer
The separation layer of design, and reserved bonding coat is to the space that is bonded, can when heat-sealing/pressure sticks and multiplies carrier band in thermoplastic resin system,
It places 24~72 hours, will not also occur and electricity for a long time under 60~80 DEG C of hot environment by the separation layer of special designing
The phenomenon that sub-component attaches actually reaches and low attaches characteristic.
Detailed description of the invention
Schematic diagram of Fig. 1 display according to the utility model embodiment high isolation electronic packaging covering band.
Wherein, the reference numerals are as follows:
10 light-transmitting substrate layers
20 bonding coats
30 antistatic layers
40 separation layers
50 electronic building bricks
Specific embodiment
Cooperate icon and component symbol to do more detailed description to the embodiments of the present invention below, makes to be familiar with ability
The technical staff in domain can implement accordingly after studying this specification carefully.
With reference to Fig. 1, the utility model embodiment high isolation electronic packaging covers the schematic diagram of band.As shown in Figure 1, this reality
With the high isolation electronic packaging of new embodiment covering band include light-transmitting substrate layer 10, bonding coat 20, antistatic layer 30 and
Separation layer 40, sequentially from top to bottom storehouse, wherein light-transmitting substrate layer 10 has translucency and heat resistance, and bonding coat 20 has stickiness, and
Antistatic layer 30 have it is antistatic, in particular, separation layer 40 have buffer action, can be used to cover and pack electronic building brick 50, and not
Adhesion than as follows millimeter light emitting diode (Mini Light Emitting Diode) component and bare crystalline component, and then reaches packet
Dress, storage purpose.
Bonding coat 20 with a thickness of 10 μm~50 μm, and preferably can for acryl glue, silica gel, PU glue, rubber or polymerization
The similar colloidal materials such as glue.
Antistatic layer 30 with a thickness of 0.1 μm~1 μm, the conducting polymer of mesh can be continuously turned on for tool, or include gold
Belong to the substrate of particle or antistatic agent, wherein antistatic agent can be the interfacial activity with absorption moisture in air and performance effect
Agent.
Furthermore separation layer 40 with a thickness of 1 μm~30 μm, can be the low surface energy material of PE film, PP film, PTFE film etc.
Material, or change film surface micro-structure through chemistry and physics mode, use the material for adjusting its surface energy and there is isolation effect.
Furthermore, the lateral dimension of antistatic layer 30 and separation layer 40 is identical, and is less than the transverse direction of bonding coat 20
Size, so that the two sides of bonding coat 20 reserve bonding space, such as 0.5mm~2.5mm, also that is, under the part of bonding coat 20
Surface be it is exposed, mutually to bind.For example, the bare lower surface in 20 left side of bonding coat and the bare lower surface on right side can be mutual
Bonding.Therefore, the electronic building brick 50 for being isolated the covering of layer 40 is substantially that will not contact with bonding coat 20, avoidable to be stained with
It is glutinous, so the utility model is stained with glutinous characteristic with low.
It is apparent that the utility model by a manner of reserved bonding space by separation layer 40 fit in bonding coat 20 with resist it is quiet
The bottom surface of electric layer 30, rather than generally bonding coat 20 and 30 surface of antistatic layer are completely covered with coating method, so that bonding coat
20 can completely possess and stick together effect, enable its electronic packaging covering band both can intact package component, can also make component be not stained with stick in
On covering band.
Due to comprising there are the separation layers 40 of special designing on bonding coat 20 and antistatic layer 30, and reserved bonding coat 20 is used
With the space of fitting, such covering band can be when heat-sealing/pressure sticks and multiplies carrier band in thermoplastic resin system, by the isolation of special designing
Layer and placed for a long time under 60~80 DEG C of hot environment 24~72 hours, will not also occur to attach with electronic building brick shows
As.
The foregoing is merely the preferred embodiment to explain the utility model, it is not intended to accordingly do this creation any
Formal limitation, therefore, all have any modification or a change made under identical creation spirit in relation to the utility model, all
It should include being intended to the scope of protection in the utility model.
Claims (6)
1. a kind of high isolation electronic packaging covers band characterized by comprising
One light-transmitting substrate layer has translucency and heat resistance；
One bonding coat has stickiness, is stacked over a lower surface of the light-transmitting substrate layer；
One antistatic layer, have it is antistatic, be stacked over a lower surface of the bonding coat；And
One separation layer has buffer action, is stacked over a lower surface of the antistatic layer, to cover and pack an electronic building brick,
Wherein, the lateral dimension of the antistatic layer and the separation layer is identical, and is less than the lateral dimension of the bonding coat, so that should
The two sides of bonding coat reserve bonding space, mutually to bind.
2. high isolation electronic packaging as described in claim 1 covers band, which is characterized in that the light-transmitting substrate layer is poly- to benzene
Dioctyl phthalate second diester film (polyethylene terephthalate film, PET), polyethylene film (polyethylene
Film, PE), poly (ethylene naphthalate) film (polyethylene naphthalate film, PEN) or triacetate fiber
Film (Triacetate Cellulose film, TAC film).
3. high isolation electronic packaging as described in claim 1 covers band, which is characterized in that the bonding coat be acryl glue,
Silica gel, PU glue, rubber or polymeric gel, and the bonding coat with a thickness of 10 μm~50 μm.
4. high isolation electronic packaging as described in claim 1 covers band, which is characterized in that the antistatic layer is that tool is continuously led
The conducting polymer of logical mesh, or the substrate comprising metallic or antistatic agent, the antistatic agent are in absorption air
Moisture and play effect interfacial agent, the antistatic layer with a thickness of 0.1 μm~1 μm.
5. high isolation electronic packaging as described in claim 1 covers band, which is characterized in that the separation layer with a thickness of 1 μm
~30 μm, and the separation layer is PE film, PP film, PTFE film.
6. high isolation electronic packaging as described in claim 1 covers band, which is characterized in that the electronic building brick is primary millimeter
Light emitting diode (Mini Light Emitting Diode) component or bare crystalline (Bare Die) component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820442880.1U CN208560293U (en) | 2018-03-30 | 2018-03-30 | High isolation electronic packaging covers band |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820442880.1U CN208560293U (en) | 2018-03-30 | 2018-03-30 | High isolation electronic packaging covers band |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208560293U true CN208560293U (en) | 2019-03-01 |
Family
ID=65453832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820442880.1U Active CN208560293U (en) | 2018-03-30 | 2018-03-30 | High isolation electronic packaging covers band |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208560293U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110316472A (en) * | 2018-03-30 | 2019-10-11 | 玮锋科技股份有限公司 | High isolation electronic packaging covers band |
-
2018
- 2018-03-30 CN CN201820442880.1U patent/CN208560293U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110316472A (en) * | 2018-03-30 | 2019-10-11 | 玮锋科技股份有限公司 | High isolation electronic packaging covers band |
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