TWI675752B - Highly isolated electronic packaging cover tape - Google Patents

Abstract

The invention relates to a high-isolation electronic packaging cover tape, which has the characteristics of low adhesion, and includes a light-transmitting substrate layer, an adhesive layer, an antistatic layer, and an isolation layer which are sequentially stacked from top to bottom, and is used to cover electronic components. For packaging and storage purposes, the light-transmitting substrate layer is light-transmissive and heat-resistant, the adhesive layer is sticky, and the anti-static layer is anti-static. In particular, the isolation layer has an isolation function, which can be used to cover electronic components to achieve packaging. , Storage purpose, and has low adhesion characteristics. Therefore, the present invention is very suitable for packaging sub-millimeter light emitting diodes (Mini LEDs) or bare chips (Bare Dies) to meet the needs.

Description

High isolation electronic packaging cover tape

The invention relates to a structural design of a high-isolation electronic packaging cover tape, especially a high-isolation electronic packaging cover tape, which is mainly based on the surface of a general heat-sealing / press-bonding type cover tape, and the conditions for the reserved adhesive space Next, an isolation layer is attached to isolate the adhesive layer and the component to be stored, so as to achieve the requirement of high isolation.

In recent years, with the demand for thinner and lighter designs of display devices and the advancement of advanced integrated circuit (IC) packaging processes, the integration of various light-emitting elements has led to the development of sub-millimeter light-emitting diodes (Mini LEDs) and their packaging gels. The development and development of miniaturization technology and bare die packaging technology have become one of the main core technologies in the related industry.

However, in response to the development of thin and light components of Mini LED elements and bare chips, a thermoplastic resin carrier tape must be designed to accommodate the Mini LED element or the bare chip element. The size of the thermoplastic resin carrier tape also tends to be thin and thin. After the component, the cover tape coated on the carrier tape is used as a cover material, and the two ends of the cover tape can be continuously sealed along the length direction by a heated sealing knife or a pressure roller to form a package for storing the component. .

However, a disadvantage of the conventional technology is that the packaging of the stored components may have a sticking phenomenon due to the similar surface energy of the cover tape adhesive layer and the component.

Therefore, there is a great need for an innovative high-isolation electronic packaging cover tape, which uses the isolation effect of the isolation layer to prevent adhesion between the stored components and the packaging, so as to solve all the problems of the conventional technology.

The main purpose of the present invention is to provide a high-isolation electronic packaging cover tape, which includes a light-transmitting substrate layer, an adhesive layer, an antistatic layer, and an isolation layer that are sequentially stacked from top to bottom, and is used to cover electronic components to achieve packaging, For storage purposes, the light-transmitting substrate layer is light-transmissive and heat-resistant, the adhesive layer is sticky, and the anti-static layer is anti-static. In particular, the isolation layer has an isolation function.

Further, the adhesive layer is stacked on the lower surface of the transparent substrate layer, the antistatic layer is stacked on the lower surface of the adhesive layer, and the isolation layer is stacked on the lower surface of the antistatic layer to cover and package the electronic components. In particular, the lateral dimensions of the antistatic layer and the isolation layer are the same and are smaller than the lateral dimension of the adhesive layer, so that the two sides of the adhesive layer can reserve an adhesive space for adhering to each other.

The highly-isolated electronic packaging cover tape of the present invention includes a specially designed isolation layer on the adhesive layer and the antistatic layer, and reserves a space for the adhesive layer to be adhered, which can be heat-sealed / press-bonded to a thermoplastic resin. When carrying the tape, by using a specially designed isolation layer, it can be left for 24 to 72 hours in a high temperature environment of 60 to 80 ℃ for a long time, and it will not adhere to electronic components, and it will indeed achieve low adhesion.

The following describes the embodiments of the present invention in more detail with illustrations and component symbols, so that those skilled in the art can implement them after studying this specification.

Referring to the first figure, a schematic diagram of a high-isolation electronic packaging cover tape according to an embodiment of the present invention. As shown in the first figure, the high-isolation electronic packaging cover tape according to the embodiment of the present invention includes a light-transmitting substrate layer 10, an adhesive layer 20, an antistatic layer 30, and an isolation layer 40, which are sequentially stacked from top to bottom, where The light-transmitting substrate layer 10 is light-transmissive and heat-resistant, the adhesive layer 20 is tacky, and the antistatic layer 30 is antistatic. In particular, the isolation layer 40 has an isolation function, and can be used to cover and package the electronic component 50. Adhesion, such as sub-millimeter light emitting diode (Mini Light Emitting Diode) elements and bare crystal elements, to achieve packaging and storage purposes.

The thickness of the adhesive layer 20 is from 10 to 50 μm, and it is preferably a similar glue material such as acrylic glue, silicon glue, PU glue, rubber, or polymer glue.

The thickness of the antistatic layer 30 is 0.1 to 1 μm. The antistatic layer 30 can be a conductive polymer with a continuous conduction mesh, or a substrate containing metal particles or an antistatic agent. The antistatic agent can be an interface that adsorbs moisture in the air and exerts effects. Active agent.

In addition, the thickness of the isolation layer 40 is 1 to 30 μm, and it can be a low surface energy material such as a PE film, a PP film, a PTFE film, or a chemical and physical method to change the surface microstructure of the film to adjust its surface energy. Material of isolation effect.

Further, the lateral dimensions of the antistatic layer 30 and the isolation layer 40 are the same and smaller than the lateral dimension of the adhesive layer 20, so that adhesive space is reserved on both sides of the adhesive layer 20, such as 0.5 to 2.5 mm, that is, the adhesive layer The lower surface of part 20 is bare for bonding to each other. For example, the exposed lower surface of the left side and the exposed lower surface of the right side of the adhesive layer 20 may be adhered to each other. Therefore, the electronic component 50 covered by the isolation layer 40 does not substantially contact the adhesive layer 20 and can avoid sticking. Therefore, the present invention has the characteristics of low sticking.

Obviously, the present invention will adhere the isolation layer 40 to the bottom surface of the adhesive layer 20 and the antistatic layer 30 in a manner to reserve an adhesive space, instead of generally covering the surfaces of the adhesive layer 20 and the antistatic layer 30 by a coating method. In this way, the adhesive layer 20 can completely maintain the adhesive effect, so that the electronic packaging cover tape can not only package the components in good condition, but also prevent the components from being stuck on the cover tape.

Since the adhesive layer 20 and the antistatic layer 30 include a specially designed isolation layer 40 and a space for the adhesive layer 20 to be attached is reserved, such a cover tape can be heat-sealed / compressed to a thermoplastic resin carrier tape. At the same time, by using a specially designed isolation layer, it can be left for a long time in a high temperature environment of 60 ~ 80 ℃ for 24 ~ 72 hours, and the phenomenon of adhesion to electronic components will not occur.

The above are only used to explain the preferred embodiments of the present invention, and are not intended to limit the present invention in any form. Therefore, any modification or change related to the present invention made under the same spirit of the invention Should still be included in the scope of the present invention.

10 Transparent substrate layer 20 Adhesive layer 30 Antistatic layer 40 Isolation layer 50 Electronic components

The first figure shows a schematic diagram of a high-isolation electronic packaging cover tape according to an embodiment of the present invention.

Claims (6)

A high-isolation electronic packaging cover tape includes: a light-transmitting substrate layer, which is light-transmissive and heat-resistant; an adhesive layer, which is adhesive, is stacked on a lower surface of one of the light-transmitting substrate layers; an antistatic Layer, which has antistatic properties, is stacked on a lower surface of the adhesive layer; and an isolation layer, which has an isolation function, is stacked on a lower surface of the antistatic layer to cover and package an electronic component, wherein the antistatic layer And the lateral dimension of the isolation layer is the same and is smaller than the lateral dimension of the adhesive layer, so that adhesive spaces are reserved on both sides of the adhesive layer for adhesion to each other. According to the high-isolation electronic packaging cover tape described in item 1 of the patent application scope, wherein the light-transmitting substrate layer 10 is a polyethylene terephthalate film (PET) or a polyethylene film (PE), polyethylene naphthalate film (PEN) or triacetate cellulose film (TAC film). According to the high-isolation electronic packaging cover tape described in item 1 of the scope of the patent application, the adhesive layer is made of acrylic glue, silicone glue, PU glue, rubber, or polymer glue, and the thickness of the adhesive layer is 10-50 μm. According to the high-isolation electronic packaging cover tape described in item 1 of the scope of the patent application, wherein the antistatic layer is a conductive polymer with a continuous conductive mesh, or a substrate containing metal particles or an antistatic agent, the antistatic agent is It has a surfactant that adsorbs moisture in the air and exerts effects. The thickness of the antistatic layer is 0.1 to 1 μm. According to the high-isolation electronic packaging cover tape described in item 1 of the scope of the patent application, wherein the thickness of the isolation layer is 1 to 30 μm, and the isolation layer is a PE film, a PP film, a PTFE film, or chemically and physically A material that changes the microstructure of the film surface to adjust the surface energy and has an isolation effect. According to the high-isolation electronic packaging cover tape described in item 1 of the scope of the patent application, wherein the electronic component is a Mini Light Emitting Diode or Bare Die component.