TWI575462B - Fingerprint identification packge sturcture and maufacturing method thereof - Google Patents
Fingerprint identification packge sturcture and maufacturing method thereof Download PDFInfo
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- TWI575462B TWI575462B TW105106073A TW105106073A TWI575462B TW I575462 B TWI575462 B TW I575462B TW 105106073 A TW105106073 A TW 105106073A TW 105106073 A TW105106073 A TW 105106073A TW I575462 B TWI575462 B TW I575462B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
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Description
本發明是有關於一種封裝結構及其製作方法,且特別是有關於一種指紋辨識封裝結構及其製作方法。The invention relates to a package structure and a manufacturing method thereof, and in particular to a fingerprint identification package structure and a manufacturing method thereof.
指紋辨識晶片封裝結構能夠裝設於各類的電子產品,例如智慧型手機、行動電話、平板電腦、筆記型電腦以及個人數位助理(PDA)等,用以辨認使用者的指紋。現有的指紋辨識晶片封裝大致可分成以軟性電路板或硬式電路板作為承載件的封裝方式。軟性電路板的指紋辨識晶片封裝結構通常是將用以辨識使用者的指紋的感測線路設置於軟性電路板上,而使用者透過接觸軟性電路板上的感測線路來進行指紋辨識。然而此種封裝方式是透過軟性電路板上的感測線路傳送訊號至指紋辨識晶片,相較於直接於指紋辨識晶片上進行指紋感測的方式,其反應速度較慢。The fingerprint identification chip package structure can be installed in various types of electronic products, such as smart phones, mobile phones, tablets, notebook computers, and personal digital assistants (PDAs) to identify the user's fingerprints. The existing fingerprint identification chip package can be roughly divided into a package method using a flexible circuit board or a rigid circuit board as a carrier. The fingerprint identification chip package structure of the flexible circuit board usually has a sensing circuit for identifying the fingerprint of the user on the flexible circuit board, and the user performs fingerprint identification by contacting the sensing circuit on the flexible circuit board. However, this type of packaging is to transmit signals to the fingerprint recognition chip through the sensing line on the flexible circuit board, and the response speed is slower than the fingerprint sensing method directly on the fingerprint identification chip.
另一種常見的指紋辨識晶片封裝結構主要包含線路載板、指紋辨識晶片、多個導線以及封裝膠體,其中用以辨識使用者的指紋的感測區域大多是位於指紋辨識晶片的主動表面。指紋辨識晶片通常是以其背面貼合於線路載板上,並透過打線接合的方式使導線電性連接指紋辨識晶片的主動表面與線路載板。在形成封裝膠體於線路載板上,以包覆導線與指紋辨識晶片時,導線可能受到模流的影響而偏移或塌陷,而包覆於指紋辨識晶片的主動表面正上方的封裝膠體的厚度容易產生變異,使得指紋辨識晶片封裝結構的感測靈敏度不佳。Another common fingerprint identification chip package structure mainly comprises a circuit carrier board, a fingerprint identification chip, a plurality of wires and an encapsulant. The sensing area for identifying the fingerprint of the user is mostly located on the active surface of the fingerprint identification chip. The fingerprint identification chip is usually attached to the line carrier by the back surface thereof, and is electrically connected to the active surface of the fingerprint identification chip and the line carrier by means of wire bonding. When the encapsulant is formed on the line carrier to cover the wire and the fingerprint identification chip, the wire may be deflected or collapsed by the influence of the mold flow, and the thickness of the encapsulant coated directly above the active surface of the fingerprint identification wafer Variations are easily generated, making the sensing sensitivity of the fingerprint identification chip package structure poor.
本發明提供一種指紋辨識封裝結構的製作方法,其能製作得到具有良好的感測靈敏度的指紋辨識封裝結構。The invention provides a method for fabricating a fingerprint identification package structure, which can produce a fingerprint identification package structure with good sensing sensitivity.
本發明提供一種指紋辨識封裝結構,其具有良好的感測靈敏度。The invention provides a fingerprint identification package structure with good sensing sensitivity.
本發明提出一種指紋辨識封裝結構的製作方法,其包括以下步驟。配置指紋辨識晶片於線路載板上。使指紋辨識晶片與線路載板電性連接。配置膠膜於保護層上,並使保護層透過膠膜連接至指紋辨識晶片的主動表面,其中指紋辨識晶片位於膠膜與線路載板之間,且膠膜位於指紋辨識晶片與保護層之間。形成封裝膠體於線路載板上,並使封裝膠體包覆指紋辨識晶片、膠膜以及保護層,且暴露出保護層的表面。The invention provides a method for fabricating a fingerprint identification package structure, which comprises the following steps. Configure the fingerprint identification chip on the line carrier. The fingerprint identification chip is electrically connected to the line carrier. The adhesive film is disposed on the protective layer, and the protective layer is connected to the active surface of the fingerprint identification wafer through the adhesive film, wherein the fingerprint identification chip is located between the adhesive film and the circuit carrier, and the adhesive film is located between the fingerprint identification wafer and the protective layer . The encapsulant is formed on the line carrier, and the encapsulant is coated with the fingerprint identification wafer, the film and the protective layer, and the surface of the protective layer is exposed.
在本發明的一實施例中,上述的指紋辨識封裝結構的製作方法更包括透過至少一導線電性連接指紋辨識晶片的主動表面與線路載板。In an embodiment of the invention, the method for fabricating the fingerprint identification package further includes electrically connecting the active surface of the wafer and the line carrier through the at least one wire.
在本發明的一實施例中,上述的部分導線被膠膜所包覆。In an embodiment of the invention, the partial wire is covered by a film.
在本發明的一實施例中,上述的指紋辨識封裝結構的製作方法更包括在使保護層透過膠膜連接至指紋辨識晶片的主動表面之後,固化膠膜。In an embodiment of the invention, the method for fabricating the fingerprint identification package structure further comprises curing the adhesive film after the protective layer is connected to the active surface of the fingerprint recognition wafer through the adhesive film.
在本發明的一實施例中,上述的膠膜包括B階膠材(B-stage adhesive)。In an embodiment of the invention, the film comprises a B-stage adhesive.
在本發明的一實施例中,上述的指紋辨識封裝結構的製作方法更包括在配置膠膜於保護層上之前,形成油墨層於保護層上,以使膠膜透過油墨層連接至保護層。In an embodiment of the invention, the method for fabricating the fingerprint identification package structure further comprises forming an ink layer on the protective layer before the adhesive film is disposed on the protective layer, so that the adhesive film is connected to the protective layer through the ink layer.
本發明另提出一種指紋辨識封裝結構,其包括線路載板、指紋辨識晶片、膠膜、保護層以及封裝膠體。指紋辨識晶片配置於線路載板上並與缐路載板電性連接。膠膜配置於指紋辨識晶片的主動表面上,其中指紋辨識晶片位於膠膜與線路載板之間。保護層配置於膠膜,其中膠膜位於指紋辨識晶片與保護層之間。封裝膠體配置於線路載板上,其中封裝膠體包覆指紋辨識晶片、膠膜以及保護層,且封裝膠體暴露出該保護層的表面。在本發明的一實施例中,上述的指紋辨識封裝結構更包括至少一導線。導線電性連接指紋辨識晶片的主動表面與線路載板。The invention further provides a fingerprint identification package structure, which comprises a line carrier board, a fingerprint identification chip, a film, a protective layer and an encapsulant. The fingerprint identification chip is disposed on the line carrier and electrically connected to the bypass carrier. The film is disposed on the active surface of the fingerprint recognition wafer, wherein the fingerprint identification wafer is located between the film and the line carrier. The protective layer is disposed on the film, wherein the film is located between the fingerprint identification wafer and the protective layer. The encapsulant is disposed on the circuit carrier board, wherein the encapsulant colloid covers the fingerprint identification wafer, the adhesive film and the protective layer, and the encapsulant exposes the surface of the protective layer. In an embodiment of the invention, the fingerprint identification package structure further includes at least one wire. The wire is electrically connected to the fingerprint to identify the active surface of the wafer and the line carrier.
在本發明的一實施例中,上述的指紋辨識封裝結構更包括油墨層。油墨層位於膠膜與保護層之間。In an embodiment of the invention, the fingerprint identification package structure further includes an ink layer. The ink layer is located between the film and the protective layer.
基於上述,本發明的指紋辨識封裝結構的製作方法係透過膠層使保護層連接至指紋辨識晶片的主動表面。由於膠層的厚度一致且不易變形,使得保護層與指紋辨識晶片的主動表面維持平行,因此有助於提升指紋辨識封裝結構的感測靈敏度。Based on the above, the fingerprint identification package structure of the present invention is formed by connecting the protective layer to the active surface of the fingerprint recognition wafer through the adhesive layer. Since the thickness of the adhesive layer is uniform and not easily deformed, the protective layer and the active surface of the fingerprint recognition wafer are kept parallel, thereby contributing to the improvement of the sensing sensitivity of the fingerprint identification package structure.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。The above described features and advantages of the invention will be apparent from the following description.
圖1A至圖1E是本發明一實施例的指紋辨識封裝結構的製作流程的剖面示意圖。請參考圖1A,首先,提供線路載板110,並配置指紋辨識晶片120於介電層111上。線路載板110可為硬式電路板或可撓性電路板,其包括介電層111、第一圖案化線路層112以及的第二圖案化線路層113,且相第一圖案化線路層112與第二圖案化線路層113分別位於介電層111的相對兩側。指紋辨識晶片120係透過黏晶(die attach)製程固定於介電層111上,且指紋辨識晶片120與第一圖案化線路層112位於介電層111的同一側。詳細而言,指紋辨識晶片120具有主動表面121與相對於主動表面121的背表面122,在進行黏晶製程時,需先形成膠層130於背表面122上,再使指紋辨識晶片120透過背表面122上的膠層130黏貼固定於線路載板110。膠層130可為環氧樹脂、銀膠、黏晶膠膜(DAF)或其他適用者。1A to 1E are schematic cross-sectional views showing a manufacturing process of a fingerprint identification package structure according to an embodiment of the present invention. Referring to FIG. 1A, first, a line carrier 110 is provided, and a fingerprint recognition wafer 120 is disposed on the dielectric layer 111. The line carrier 110 can be a hard circuit board or a flexible circuit board including a dielectric layer 111, a first patterned circuit layer 112, and a second patterned circuit layer 113, and the first patterned circuit layer 112 and The second patterned circuit layers 113 are respectively located on opposite sides of the dielectric layer 111. The fingerprint identification wafer 120 is fixed on the dielectric layer 111 through a die attach process, and the fingerprint identification wafer 120 and the first patterned circuit layer 112 are on the same side of the dielectric layer 111. In detail, the fingerprint identification wafer 120 has an active surface 121 and a back surface 122 opposite to the active surface 121. When performing a die bonding process, a glue layer 130 is first formed on the back surface 122, and then the fingerprint identification wafer 120 is passed through the back. The glue layer 130 on the surface 122 is adhered and fixed to the line carrier 110. The glue layer 130 can be an epoxy resin, a silver paste, a die bond film (DAF), or the like.
接著,請參考圖1B,透過打線接合的方式使至少一導線140電性連接指紋辨識晶片120的主動表面121與線路載板110的第一圖案化線路層112。圖1B繪示出單邊打線的實施態樣以作說明,於其他實施例中,雙邊打線的實施態樣亦可為之。導線140可透過正向打線或逆向打線等方式而電性連接於缐路載板110。接著,請參考圖1C與圖1D,配置膠膜150於保護層160上,並使保護層160透過膠膜150連接至指紋辨識晶片120的主動表面121。在本實施例中,保護層160可為高介電常數材料所構成,例如:玻璃、陶瓷、石英、壓克力或塑膠等。另一方面,保護層160的硬度較高,故具有防刮的特性。膠膜150例如是B階膠材或FOW (Film-over-wire)材質,其黏滯係數較低,且固化時所需的溫度較低。因此,在保護層160透過膠膜150連接至指紋辨識晶片120的主動表面121之後,膠膜150不易變形,得使保護層160與指紋辨識晶片120的主動表面121維持平行。換言之,位於指紋辨識晶片120的主動表面121上的膠膜150的厚度可維持一致,其中膠膜150的厚度約介於40~50微米。Next, referring to FIG. 1B , at least one wire 140 is electrically connected to the active surface 121 of the fingerprint recognition wafer 120 and the first patterned circuit layer 112 of the line carrier 110 by wire bonding. FIG. 1B illustrates an embodiment of a single-sided wire for illustration. In other embodiments, the embodiment of the double-sided wire may also be used. The wire 140 can be electrically connected to the bypass carrier 110 through a forward wire or a reverse wire. Next, referring to FIG. 1C and FIG. 1D , the adhesive film 150 is disposed on the protective layer 160 , and the protective layer 160 is connected to the active surface 121 of the fingerprint recognition wafer 120 through the adhesive film 150 . In this embodiment, the protective layer 160 may be made of a high dielectric constant material such as glass, ceramic, quartz, acryl or plastic. On the other hand, the protective layer 160 has a high hardness and thus has scratch resistance. The film 150 is, for example, a B-stage adhesive or a FOW (Film-over-wire) material, which has a low viscosity coefficient and a low temperature required for curing. Therefore, after the protective layer 160 is connected to the active surface 121 of the fingerprint recognition wafer 120 through the adhesive film 150, the adhesive film 150 is not easily deformed, so that the protective layer 160 and the active surface 121 of the fingerprint recognition wafer 120 are maintained in parallel. In other words, the thickness of the film 150 on the active surface 121 of the fingerprint recognition wafer 120 can be maintained, wherein the thickness of the film 150 is about 40 to 50 microns.
如圖1D所示,指紋辨識晶片120位於膠膜150與線路載板110之間,且膠膜150位於指紋辨識晶片120與保護層160之間。另一方面,當膠膜150貼附至紋辨識晶片120的主動表面121上時,導線140中電性連接於指紋辨識晶片120的主動表面121的部分會穿入膠膜150,而被膠膜150所包覆。之後,透過低溫烘烤的步驟使膠膜150固化,使得保護層160可透過固化後的膠膜150固定於指紋辨識晶片120的主動表面121的上方,且提高導線140與指紋辨識晶片120的主動表面121之間的接合強度。在一實施例中,保護層160可選用透明材質,此時的膠膜150可摻入色料,以遮蔽位於指紋辨識晶片120的主動表面121上的線路。於另一實施例中,保護層160可選用不透明材質(例如:玻璃或陶瓷等),此時的膠膜150是否摻入色料則可依實際運用狀況而決定。As shown in FIG. 1D, the fingerprint recognition wafer 120 is located between the adhesive film 150 and the line carrier 110, and the adhesive film 150 is located between the fingerprint recognition wafer 120 and the protective layer 160. On the other hand, when the adhesive film 150 is attached to the active surface 121 of the pattern recognition wafer 120, a portion of the wire 140 electrically connected to the active surface 121 of the fingerprint recognition wafer 120 may penetrate the adhesive film 150 and be coated with a film. 150 coated. Thereafter, the film 150 is cured by the low-temperature baking step, so that the protective layer 160 can be fixed over the active surface 121 of the fingerprint recognition wafer 120 through the cured film 150, and the active of the wire 140 and the fingerprint recognition wafer 120 is improved. The joint strength between the surfaces 121. In an embodiment, the protective layer 160 may be made of a transparent material, and the film 150 may be incorporated into the coloring material to shield the lines on the active surface 121 of the fingerprint identification wafer 120. In another embodiment, the protective layer 160 may be made of an opaque material (for example, glass or ceramics), and whether the film 150 is incorporated into the coloring material may be determined according to actual use conditions.
之後,請參考圖1E,進行封膠製程(molding process),形成封裝膠體170於線路載板110上,並使封裝膠體170包覆部分介電層111、部分第一圖案化線路層112、指紋辨識晶片120、膠層130、導線140、膠膜150以及保護層160,且暴露出至少部分保護層160,以形成供手指抵觸之表面161。至此,指紋辨識封裝結構100已大致製作完成。Thereafter, referring to FIG. 1E, a molding process is performed to form an encapsulant 170 on the line carrier 110, and the encapsulant 170 is coated with a portion of the dielectric layer 111, a portion of the first patterned circuit layer 112, and a fingerprint. The wafer 120, the glue layer 130, the wires 140, the film 150, and the protective layer 160 are identified, and at least a portion of the protective layer 160 is exposed to form a surface 161 for the fingers to interfere. So far, the fingerprint identification package structure 100 has been substantially completed.
由於導線140中電性連接於指紋辨識晶片120的主動表面121的部分被膠膜150所包覆,因此在進行封膠製程時,導線140不易受到模流的影響而偏移或塌陷。另一方面,當使用者以其手指抵觸保護層160的表面161時,手指指紋的凹凸與指紋辨識晶片120的主動表面121之間的距離差異會造成電容值變化,其中感測所得的電容值變化便可轉換成指紋畫像以供辨識。由於膠膜150的厚度一致且不易變形,得使保護層160與指紋辨識晶片120的主動表面121維持平行,且保護層160為高介電常數材料所構成,因此有助於提升指紋辨識封裝結構100的感測靈敏度。Since the portion of the wire 140 that is electrically connected to the active surface 121 of the fingerprint recognition wafer 120 is covered by the adhesive film 150, the wire 140 is less likely to be displaced or collapsed by the mold flow during the sealing process. On the other hand, when the user touches the surface 161 of the protective layer 160 with the finger thereof, the difference in the distance between the unevenness of the finger fingerprint and the active surface 121 of the fingerprint recognition wafer 120 causes a change in the capacitance value, wherein the sensed capacitance value is sensed. Changes can be converted into fingerprint images for identification. Since the thickness of the adhesive film 150 is uniform and not easily deformed, the protective layer 160 and the active surface 121 of the fingerprint recognition wafer 120 are kept parallel, and the protective layer 160 is made of a high dielectric constant material, thereby contributing to the improvement of the fingerprint identification package structure. Sensing sensitivity of 100.
以下將列舉其他實施例以作為說明。在此必須說明的是,下述實施例沿用前述實施例的元件標號與部分內容,其中採用相同的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例,下述實施例不再重複贅述。Other embodiments are listed below for illustration. It is to be noted that the following embodiments use the same reference numerals and parts of the above-mentioned embodiments, and the same reference numerals are used to refer to the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted portions, reference may be made to the foregoing embodiments, and the following embodiments are not repeated.
圖2A至圖2C是本發明另一實施例的指紋辨識封裝結構的製作流程的剖面示意圖。需說明的是,本實施例的半導體封裝結構100A(繪示於圖2C)的部分製作步驟大致與圖1A及圖1B所示的製作步驟相同或相似,於此不再重複贅述。首先,請參考圖2A,在如圖1B所示的使導線140電性連接指紋辨識晶片120的主動表面121與線路載板110之後,先透過印刷或塗佈等方式均勻地形成油墨層180於保護層160上,並照光或加熱使油墨層180固化,再將膠膜150配置於固化後的油墨層180上。換言之,油墨層180是位於膠膜150與保護層160之間。2A-2C are schematic cross-sectional views showing a manufacturing process of a fingerprint identification package structure according to another embodiment of the present invention. It should be noted that the partial fabrication steps of the semiconductor package structure 100A (shown in FIG. 2C) of the present embodiment are substantially the same as or similar to those of the fabrication steps shown in FIG. 1A and FIG. 1B, and the detailed description thereof will not be repeated here. First, referring to FIG. 2A, after the lead wire 140 is electrically connected to the active surface 121 of the fingerprint recognition wafer 120 and the line carrier 110 as shown in FIG. 1B, the ink layer 180 is uniformly formed by printing or coating. The ink layer 180 is cured on the protective layer 160 by light or heat, and the film 150 is placed on the cured ink layer 180. In other words, the ink layer 180 is located between the adhesive film 150 and the protective layer 160.
接著,使保護層160及油墨層180透過膠膜150連接至指紋辨識晶片120的主動表面121,導線140中電性連接於指紋辨識晶片120的主動表面121的部分會穿入膠膜150,而被膠膜150所包覆。由於膠膜150的黏滯係數較低、不易變形,因此能使保護層160及油墨層180與指紋辨識晶片120的主動表面121維持平行。換言之,位於指紋辨識晶片120的主動表面121上的膠膜150的厚度可維持一致。之後,透過低溫烘烤的步驟使膠膜150固化,使得保護層160及油墨層180可透過固化後的膠膜150固定於指紋辨識晶片120的主動表面121的上方,並提高導線140與指紋辨識晶片120的主動表面121之間的接合強度。Then, the protective layer 160 and the ink layer 180 are connected to the active surface 121 of the fingerprint recognition wafer 120 through the adhesive film 150. The portion of the wire 140 electrically connected to the active surface 121 of the fingerprint recognition wafer 120 penetrates the adhesive film 150. It is covered by the film 150. Since the adhesive film 150 has a low viscosity coefficient and is not easily deformed, the protective layer 160 and the ink layer 180 can be kept parallel to the active surface 121 of the fingerprint recognition wafer 120. In other words, the thickness of the film 150 on the active surface 121 of the fingerprint recognition wafer 120 can be maintained consistent. Thereafter, the film 150 is cured by the low-temperature baking step, so that the protective layer 160 and the ink layer 180 are fixed to the active surface 121 of the fingerprint recognition wafer 120 through the cured film 150, and the wire 140 and the fingerprint are improved. Bond strength between the active surfaces 121 of the wafer 120.
如圖2B所示,指紋辨識晶片120位於膠膜150與線路載板110之間,膠膜150位於指紋辨識晶片120與油墨層180之間,且油墨層180位於膠膜150與保護層160之間。油墨層180可用以遮蔽位於指紋辨識晶片120的主動表面121上的線路。As shown in FIG. 2B, the fingerprint identification wafer 120 is located between the adhesive film 150 and the line carrier 110, the adhesive film 150 is located between the fingerprint identification wafer 120 and the ink layer 180, and the ink layer 180 is located between the adhesive film 150 and the protective layer 160. between. The ink layer 180 can be used to shield lines on the active surface 121 of the fingerprint recognition wafer 120.
之後,請參考圖2C,進行封膠製程,形成封裝膠體170於線路載板110上,並使封裝膠體170包覆部分介電層111、部分第一圖案化線路層112、指紋辨識晶片120、膠層130、導線140、膠膜150、油墨層180以及保護層160,且暴露出保護層160的表面161。至此,指紋辨識封裝結構100A已大致製作完成。由於膠膜150的厚度一致且不易變形,得使保護層160及油墨層180與指紋辨識晶片120的主動表面121維持平行,且保護層160為高介電常數材料所構成,因此有助於提升指紋辨識封裝結構100A的感測靈敏度。Then, referring to FIG. 2C, the encapsulation process is performed to form the encapsulant 170 on the line carrier 110, and the encapsulant 170 is covered with a portion of the dielectric layer 111, a portion of the first patterned circuit layer 112, the fingerprint identification wafer 120, The glue layer 130, the wires 140, the film 150, the ink layer 180, and the protective layer 160, and expose the surface 161 of the protective layer 160. So far, the fingerprint identification package structure 100A has been substantially completed. Since the thickness of the adhesive film 150 is uniform and not easily deformed, the protective layer 160 and the ink layer 180 are kept parallel to the active surface 121 of the fingerprint recognition wafer 120, and the protective layer 160 is made of a high dielectric constant material, thereby contributing to improvement. The fingerprint identifies the sensing sensitivity of the package structure 100A.
綜上所述,本發明的指紋辨識封裝結構的製作方法係透過膠層使保護層連接至指紋辨識晶片的主動表面,或者是透過膠層使保護層及油墨層連接至指紋辨識晶片的主動表面。由於膠膜的厚度一致且不易變形,得使保護層與指紋辨識晶片的主動表面或保護層及油墨層與指紋辨識晶片的主動表面維持平行,且保護層為高介電常數材料所構成,因此有助於提升指紋辨識封裝結構的感測靈敏度。另一方面,由於導線中電性連接於指紋辨識晶片的主動表面的部分被膠膜所包覆,因此在進行封膠製程時,導線不易受到模流的影響而偏移或塌陷。In summary, the fingerprint identification package structure of the present invention is formed by connecting the protective layer to the active surface of the fingerprint recognition wafer through the adhesive layer, or connecting the protective layer and the ink layer to the active surface of the fingerprint recognition wafer through the adhesive layer. . Since the thickness of the adhesive film is uniform and not easily deformed, the active surface or the protective layer and the ink layer of the fingerprint identification wafer and the active surface of the fingerprint recognition wafer are kept parallel, and the protective layer is composed of a high dielectric constant material. Helps improve the sensing sensitivity of the fingerprint identification package structure. On the other hand, since the portion of the wire electrically connected to the active surface of the fingerprint recognition wafer is covered by the film, the wire is not easily displaced or collapsed by the mold flow during the sealing process.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.
100、100A‧‧‧指紋辨識封裝結構100,100A‧‧‧Fingerprint identification package structure
110‧‧‧線路載板110‧‧‧Line carrier
111‧‧‧介電層111‧‧‧Dielectric layer
112‧‧‧第一圖案化線路層112‧‧‧First patterned circuit layer
113‧‧‧第二圖案化線路層113‧‧‧Second patterned circuit layer
120‧‧‧指紋辨識晶片120‧‧‧Fingerprint identification chip
121‧‧‧主動表面121‧‧‧Active surface
122‧‧‧背表面122‧‧‧Back surface
130‧‧‧膠層130‧‧‧ glue layer
140‧‧‧導線140‧‧‧Wire
150‧‧‧膠膜150‧‧ ‧ film
160‧‧‧保護層160‧‧‧Protective layer
161‧‧‧表面161‧‧‧ surface
170‧‧‧封裝膠體170‧‧‧Package colloid
180‧‧‧油墨層180‧‧‧Ink layer
圖1A至圖1E是本發明一實施例的指紋辨識封裝結構的製作流程的剖面示意圖。 圖2A至圖2C是本發明另一實施例的指紋辨識封裝結構的製作流程的剖面示意圖。1A to 1E are schematic cross-sectional views showing a manufacturing process of a fingerprint identification package structure according to an embodiment of the present invention. 2A-2C are schematic cross-sectional views showing a manufacturing process of a fingerprint identification package structure according to another embodiment of the present invention.
100‧‧‧指紋辨識封裝結構 100‧‧‧Fingerprint identification package structure
110‧‧‧線路載板 110‧‧‧Line carrier
111‧‧‧介電層 111‧‧‧Dielectric layer
112‧‧‧第一圖案化線路層 112‧‧‧First patterned circuit layer
113‧‧‧第二圖案化線路層 113‧‧‧Second patterned circuit layer
120‧‧‧指紋辨識晶片 120‧‧‧Fingerprint identification chip
121‧‧‧主動表面 121‧‧‧Active surface
122‧‧‧背表面 122‧‧‧Back surface
130‧‧‧膠層 130‧‧‧ glue layer
140‧‧‧導線 140‧‧‧Wire
150‧‧‧膠膜 150‧‧ ‧ film
160‧‧‧保護層 160‧‧‧Protective layer
161‧‧‧表面 161‧‧‧ surface
170‧‧‧封裝膠體 170‧‧‧Package colloid
Claims (10)
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