TWI575462B - Fingerprint identification packge sturcture and maufacturing method thereof - Google Patents

Description

Fingerprint identification package structure and manufacturing method thereof

The invention relates to a package structure and a manufacturing method thereof, and in particular to a fingerprint identification package structure and a manufacturing method thereof.

The fingerprint identification chip package structure can be installed in various types of electronic products, such as smart phones, mobile phones, tablets, notebook computers, and personal digital assistants (PDAs) to identify the user's fingerprints. The existing fingerprint identification chip package can be roughly divided into a package method using a flexible circuit board or a rigid circuit board as a carrier. The fingerprint identification chip package structure of the flexible circuit board usually has a sensing circuit for identifying the fingerprint of the user on the flexible circuit board, and the user performs fingerprint identification by contacting the sensing circuit on the flexible circuit board. However, this type of packaging is to transmit signals to the fingerprint recognition chip through the sensing line on the flexible circuit board, and the response speed is slower than the fingerprint sensing method directly on the fingerprint identification chip.

Another common fingerprint identification chip package structure mainly comprises a circuit carrier board, a fingerprint identification chip, a plurality of wires and an encapsulant. The sensing area for identifying the fingerprint of the user is mostly located on the active surface of the fingerprint identification chip. The fingerprint identification chip is usually attached to the line carrier by the back surface thereof, and is electrically connected to the active surface of the fingerprint identification chip and the line carrier by means of wire bonding. When the encapsulant is formed on the line carrier to cover the wire and the fingerprint identification chip, the wire may be deflected or collapsed by the influence of the mold flow, and the thickness of the encapsulant coated directly above the active surface of the fingerprint identification wafer Variations are easily generated, making the sensing sensitivity of the fingerprint identification chip package structure poor.

The invention provides a method for fabricating a fingerprint identification package structure, which can produce a fingerprint identification package structure with good sensing sensitivity.

The invention provides a fingerprint identification package structure with good sensing sensitivity.

The invention provides a method for fabricating a fingerprint identification package structure, which comprises the following steps. Configure the fingerprint identification chip on the line carrier. The fingerprint identification chip is electrically connected to the line carrier. The adhesive film is disposed on the protective layer, and the protective layer is connected to the active surface of the fingerprint identification wafer through the adhesive film, wherein the fingerprint identification chip is located between the adhesive film and the circuit carrier, and the adhesive film is located between the fingerprint identification wafer and the protective layer . The encapsulant is formed on the line carrier, and the encapsulant is coated with the fingerprint identification wafer, the film and the protective layer, and the surface of the protective layer is exposed.

In an embodiment of the invention, the method for fabricating the fingerprint identification package further includes electrically connecting the active surface of the wafer and the line carrier through the at least one wire.

In an embodiment of the invention, the partial wire is covered by a film.

In an embodiment of the invention, the method for fabricating the fingerprint identification package structure further comprises curing the adhesive film after the protective layer is connected to the active surface of the fingerprint recognition wafer through the adhesive film.

In an embodiment of the invention, the film comprises a B-stage adhesive.

In an embodiment of the invention, the method for fabricating the fingerprint identification package structure further comprises forming an ink layer on the protective layer before the adhesive film is disposed on the protective layer, so that the adhesive film is connected to the protective layer through the ink layer.

The invention further provides a fingerprint identification package structure, which comprises a line carrier board, a fingerprint identification chip, a film, a protective layer and an encapsulant. The fingerprint identification chip is disposed on the line carrier and electrically connected to the bypass carrier. The film is disposed on the active surface of the fingerprint recognition wafer, wherein the fingerprint identification wafer is located between the film and the line carrier. The protective layer is disposed on the film, wherein the film is located between the fingerprint identification wafer and the protective layer. The encapsulant is disposed on the circuit carrier board, wherein the encapsulant colloid covers the fingerprint identification wafer, the adhesive film and the protective layer, and the encapsulant exposes the surface of the protective layer. In an embodiment of the invention, the fingerprint identification package structure further includes at least one wire. The wire is electrically connected to the fingerprint to identify the active surface of the wafer and the line carrier.

In an embodiment of the invention, the fingerprint identification package structure further includes an ink layer. The ink layer is located between the film and the protective layer.

Based on the above, the fingerprint identification package structure of the present invention is formed by connecting the protective layer to the active surface of the fingerprint recognition wafer through the adhesive layer. Since the thickness of the adhesive layer is uniform and not easily deformed, the protective layer and the active surface of the fingerprint recognition wafer are kept parallel, thereby contributing to the improvement of the sensing sensitivity of the fingerprint identification package structure.

The above described features and advantages of the invention will be apparent from the following description.

1A to 1E are schematic cross-sectional views showing a manufacturing process of a fingerprint identification package structure according to an embodiment of the present invention. Referring to FIG. 1A, first, a line carrier 110 is provided, and a fingerprint recognition wafer 120 is disposed on the dielectric layer 111. The line carrier 110 can be a hard circuit board or a flexible circuit board including a dielectric layer 111, a first patterned circuit layer 112, and a second patterned circuit layer 113, and the first patterned circuit layer 112 and The second patterned circuit layers 113 are respectively located on opposite sides of the dielectric layer 111. The fingerprint identification wafer 120 is fixed on the dielectric layer 111 through a die attach process, and the fingerprint identification wafer 120 and the first patterned circuit layer 112 are on the same side of the dielectric layer 111. In detail, the fingerprint identification wafer 120 has an active surface 121 and a back surface 122 opposite to the active surface 121. When performing a die bonding process, a glue layer 130 is first formed on the back surface 122, and then the fingerprint identification wafer 120 is passed through the back. The glue layer 130 on the surface 122 is adhered and fixed to the line carrier 110. The glue layer 130 can be an epoxy resin, a silver paste, a die bond film (DAF), or the like.

Next, referring to FIG. 1B , at least one wire 140 is electrically connected to the active surface 121 of the fingerprint recognition wafer 120 and the first patterned circuit layer 112 of the line carrier 110 by wire bonding. FIG. 1B illustrates an embodiment of a single-sided wire for illustration. In other embodiments, the embodiment of the double-sided wire may also be used. The wire 140 can be electrically connected to the bypass carrier 110 through a forward wire or a reverse wire. Next, referring to FIG. 1C and FIG. 1D , the adhesive film 150 is disposed on the protective layer 160 , and the protective layer 160 is connected to the active surface 121 of the fingerprint recognition wafer 120 through the adhesive film 150 . In this embodiment, the protective layer 160 may be made of a high dielectric constant material such as glass, ceramic, quartz, acryl or plastic. On the other hand, the protective layer 160 has a high hardness and thus has scratch resistance. The film 150 is, for example, a B-stage adhesive or a FOW (Film-over-wire) material, which has a low viscosity coefficient and a low temperature required for curing. Therefore, after the protective layer 160 is connected to the active surface 121 of the fingerprint recognition wafer 120 through the adhesive film 150, the adhesive film 150 is not easily deformed, so that the protective layer 160 and the active surface 121 of the fingerprint recognition wafer 120 are maintained in parallel. In other words, the thickness of the film 150 on the active surface 121 of the fingerprint recognition wafer 120 can be maintained, wherein the thickness of the film 150 is about 40 to 50 microns.

As shown in FIG. 1D, the fingerprint recognition wafer 120 is located between the adhesive film 150 and the line carrier 110, and the adhesive film 150 is located between the fingerprint recognition wafer 120 and the protective layer 160. On the other hand, when the adhesive film 150 is attached to the active surface 121 of the pattern recognition wafer 120, a portion of the wire 140 electrically connected to the active surface 121 of the fingerprint recognition wafer 120 may penetrate the adhesive film 150 and be coated with a film. 150 coated. Thereafter, the film 150 is cured by the low-temperature baking step, so that the protective layer 160 can be fixed over the active surface 121 of the fingerprint recognition wafer 120 through the cured film 150, and the active of the wire 140 and the fingerprint recognition wafer 120 is improved. The joint strength between the surfaces 121. In an embodiment, the protective layer 160 may be made of a transparent material, and the film 150 may be incorporated into the coloring material to shield the lines on the active surface 121 of the fingerprint identification wafer 120. In another embodiment, the protective layer 160 may be made of an opaque material (for example, glass or ceramics), and whether the film 150 is incorporated into the coloring material may be determined according to actual use conditions.

Thereafter, referring to FIG. 1E, a molding process is performed to form an encapsulant 170 on the line carrier 110, and the encapsulant 170 is coated with a portion of the dielectric layer 111, a portion of the first patterned circuit layer 112, and a fingerprint. The wafer 120, the glue layer 130, the wires 140, the film 150, and the protective layer 160 are identified, and at least a portion of the protective layer 160 is exposed to form a surface 161 for the fingers to interfere. So far, the fingerprint identification package structure 100 has been substantially completed.

Since the portion of the wire 140 that is electrically connected to the active surface 121 of the fingerprint recognition wafer 120 is covered by the adhesive film 150, the wire 140 is less likely to be displaced or collapsed by the mold flow during the sealing process. On the other hand, when the user touches the surface 161 of the protective layer 160 with the finger thereof, the difference in the distance between the unevenness of the finger fingerprint and the active surface 121 of the fingerprint recognition wafer 120 causes a change in the capacitance value, wherein the sensed capacitance value is sensed. Changes can be converted into fingerprint images for identification. Since the thickness of the adhesive film 150 is uniform and not easily deformed, the protective layer 160 and the active surface 121 of the fingerprint recognition wafer 120 are kept parallel, and the protective layer 160 is made of a high dielectric constant material, thereby contributing to the improvement of the fingerprint identification package structure. Sensing sensitivity of 100.

Other embodiments are listed below for illustration. It is to be noted that the following embodiments use the same reference numerals and parts of the above-mentioned embodiments, and the same reference numerals are used to refer to the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted portions, reference may be made to the foregoing embodiments, and the following embodiments are not repeated.

2A-2C are schematic cross-sectional views showing a manufacturing process of a fingerprint identification package structure according to another embodiment of the present invention. It should be noted that the partial fabrication steps of the semiconductor package structure 100A (shown in FIG. 2C) of the present embodiment are substantially the same as or similar to those of the fabrication steps shown in FIG. 1A and FIG. 1B, and the detailed description thereof will not be repeated here. First, referring to FIG. 2A, after the lead wire 140 is electrically connected to the active surface 121 of the fingerprint recognition wafer 120 and the line carrier 110 as shown in FIG. 1B, the ink layer 180 is uniformly formed by printing or coating. The ink layer 180 is cured on the protective layer 160 by light or heat, and the film 150 is placed on the cured ink layer 180. In other words, the ink layer 180 is located between the adhesive film 150 and the protective layer 160.

Then, the protective layer 160 and the ink layer 180 are connected to the active surface 121 of the fingerprint recognition wafer 120 through the adhesive film 150. The portion of the wire 140 electrically connected to the active surface 121 of the fingerprint recognition wafer 120 penetrates the adhesive film 150. It is covered by the film 150. Since the adhesive film 150 has a low viscosity coefficient and is not easily deformed, the protective layer 160 and the ink layer 180 can be kept parallel to the active surface 121 of the fingerprint recognition wafer 120. In other words, the thickness of the film 150 on the active surface 121 of the fingerprint recognition wafer 120 can be maintained consistent. Thereafter, the film 150 is cured by the low-temperature baking step, so that the protective layer 160 and the ink layer 180 are fixed to the active surface 121 of the fingerprint recognition wafer 120 through the cured film 150, and the wire 140 and the fingerprint are improved. Bond strength between the active surfaces 121 of the wafer 120.

As shown in FIG. 2B, the fingerprint identification wafer 120 is located between the adhesive film 150 and the line carrier 110, the adhesive film 150 is located between the fingerprint identification wafer 120 and the ink layer 180, and the ink layer 180 is located between the adhesive film 150 and the protective layer 160. between. The ink layer 180 can be used to shield lines on the active surface 121 of the fingerprint recognition wafer 120.

Then, referring to FIG. 2C, the encapsulation process is performed to form the encapsulant 170 on the line carrier 110, and the encapsulant 170 is covered with a portion of the dielectric layer 111, a portion of the first patterned circuit layer 112, the fingerprint identification wafer 120, The glue layer 130, the wires 140, the film 150, the ink layer 180, and the protective layer 160, and expose the surface 161 of the protective layer 160. So far, the fingerprint identification package structure 100A has been substantially completed. Since the thickness of the adhesive film 150 is uniform and not easily deformed, the protective layer 160 and the ink layer 180 are kept parallel to the active surface 121 of the fingerprint recognition wafer 120, and the protective layer 160 is made of a high dielectric constant material, thereby contributing to improvement. The fingerprint identifies the sensing sensitivity of the package structure 100A.

In summary, the fingerprint identification package structure of the present invention is formed by connecting the protective layer to the active surface of the fingerprint recognition wafer through the adhesive layer, or connecting the protective layer and the ink layer to the active surface of the fingerprint recognition wafer through the adhesive layer. . Since the thickness of the adhesive film is uniform and not easily deformed, the active surface or the protective layer and the ink layer of the fingerprint identification wafer and the active surface of the fingerprint recognition wafer are kept parallel, and the protective layer is composed of a high dielectric constant material. Helps improve the sensing sensitivity of the fingerprint identification package structure. On the other hand, since the portion of the wire electrically connected to the active surface of the fingerprint recognition wafer is covered by the film, the wire is not easily displaced or collapsed by the mold flow during the sealing process.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

100,100A‧‧‧Fingerprint identification package structure

110‧‧‧Line carrier

111‧‧‧Dielectric layer

112‧‧‧First patterned circuit layer

113‧‧‧Second patterned circuit layer

120‧‧‧Fingerprint identification chip

121‧‧‧Active surface

122‧‧‧Back surface

130‧‧‧ glue layer

140‧‧‧Wire

150‧‧ ‧ film

160‧‧‧Protective layer

161‧‧‧ surface

170‧‧‧Package colloid

180‧‧‧Ink layer

1A to 1E are schematic cross-sectional views showing a manufacturing process of a fingerprint identification package structure according to an embodiment of the present invention. 2A-2C are schematic cross-sectional views showing a manufacturing process of a fingerprint identification package structure according to another embodiment of the present invention.

100‧‧‧Fingerprint identification package structure

110‧‧‧Line carrier

111‧‧‧Dielectric layer

112‧‧‧First patterned circuit layer

113‧‧‧Second patterned circuit layer

120‧‧‧Fingerprint identification chip

121‧‧‧Active surface

122‧‧‧Back surface

130‧‧‧ glue layer

140‧‧‧Wire

150‧‧ ‧ film

160‧‧‧Protective layer

161‧‧‧ surface

170‧‧‧Package colloid

Claims (10)

A method for fabricating a fingerprint identification package comprises: arranging a fingerprint identification chip on a line carrier; electrically connecting the fingerprint identification chip to the line carrier; arranging a film on a protective layer, and making the protection The layer is connected to an active surface of the fingerprint identification chip through the adhesive film, wherein the fingerprint identification chip is located between the adhesive film and the circuit carrier, and the adhesive film is located between the fingerprint identification wafer and the protective layer, An edge of the film is aligned with an edge of the protective layer and an edge of the fingerprint recognition wafer; and an encapsulant is formed on the circuit carrier, and the encapsulant is coated with the fingerprint identification chip, the film, and the protection a layer and exposing a surface of the protective layer. The method for fabricating the fingerprint identification package structure of claim 1, further comprising: electrically connecting the active surface of the fingerprint identification chip and the line carrier through at least one wire. The method for fabricating a fingerprint identification package structure according to claim 2, wherein a part of the wire is covered by the film. The method for fabricating a fingerprint identification package structure according to claim 1, further comprising: curing the adhesive film after the protective layer is connected to the active surface of the fingerprint recognition wafer through the adhesive film. The method for fabricating a fingerprint identification package structure according to claim 1, wherein the film comprises a B-stage glue. The method for fabricating the fingerprint identification package structure of claim 1, further comprising: forming an ink layer on the protective layer before the adhesive film is disposed on the protective layer, so that the adhesive film passes through the protective film An ink layer is attached to the protective layer. A fingerprint identification package structure includes: a line carrier board; a fingerprint identification chip disposed on the line carrier board and electrically connected to the line carrier board; a film disposed on an active surface of the fingerprint identification chip The fingerprint identification chip is located between the adhesive film and the circuit carrier; a protective layer is disposed on the adhesive film, wherein the adhesive film is located between the fingerprint identification wafer and the protective layer, and the edge of the adhesive film is cut An edge of the protective layer and an edge of the fingerprint identification chip; and an encapsulant disposed on the circuit carrier, wherein the encapsulant encapsulates the fingerprint identification chip, the adhesive film, and the protective layer, and the package The colloid exposes a surface of the protective layer. The fingerprint identification package structure of claim 7, further comprising: at least one wire electrically connected to the active surface of the fingerprint identification chip and the line carrier. The fingerprint identification package structure of claim 8, wherein a part of the wire is covered by the film. The fingerprint identification package structure of claim 9, further comprising: an ink layer between the adhesive film and the protective layer.