CN213564853U

CN213564853U - Anti-static heat-sealing electronic patch packaging film structure

Info

Publication number: CN213564853U
Application number: CN202021874654.4U
Authority: CN
Inventors: 包振雄
Original assignee: Kunshan Kuaikli Electronic Materials Co ltd
Current assignee: Kunshan Kuaikli Electronic Materials Co ltd
Priority date: 2020-09-01
Filing date: 2020-09-01
Publication date: 2021-06-29
Anticipated expiration: 2030-09-01

Abstract

The utility model belongs to the technical field of electronic devices, and discloses an antistatic heat-seal electronic patch packaging film structure, which comprises a PET layer, wherein the lower surface wall of the PET layer is bonded with a first antistatic layer, the lower surface wall of the first antistatic layer is bonded with a first shielding layer, the lower surface wall of the first shielding layer is bonded with a first heat-conducting layer, the upper surface wall of the PET layer is bonded with a polyolefin layer, the upper surface wall of the polyolefin layer is bonded with a second antistatic layer, and the upper surface wall of the second antistatic layer is bonded with a second shielding layer, the utility model discloses an increase the first shielding layer and the second shielding layer, can effectively improve the shielding performance of the packaging film structure, further avoid the electronic elements from being interfered, ensure the normal use of the electronic elements, in addition, the increase the first heat-conducting layer and the second heat-conducting layer can effectively conduct heat, can quickly disperse and guide out the heat generated by the electronic elements, the heat dissipation effect is effectively achieved.

Description

Anti-static heat-sealing electronic patch packaging film structure

Technical Field

The utility model belongs to the technical field of the electron device, concretely relates to antistatic type heat-seal electron paster encapsulation film structure.

Background

SMT is a surface mount technology, which is the most popular technology and process in the electronic assembly industry, and usually a layer of tearable upper cover film with plastic thickness is covered on a carrier tape, so that the tearable cover film and the carrier tape are sealed together to increase the sealing property.

In chinese patent No. CN201721339717.4, an antistatic heat-sealing electronic patch packaging film structure is disclosed, in which "using a unique double-layer antistatic layer can greatly prolong the antistatic service life" is described, but the packaging film structure in this patent does not have an effective heat conducting structure, is not convenient for heat dissipation, and does not have an effective shielding structure, which easily causes signal interference and affects the use of electronic components.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an antistatic type heat-seal electron paster encapsulation film structure to it does not set up effectual heat conduction and shielding structure to propose in solving above-mentioned background art, so that the heat is difficult for effluvium and receives signal interference's problem easily.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an antistatic type heat-seal electron paster encapsulation film structure, includes the PET layer, the lower wall bonding on PET layer has first antistatic backing, the lower wall bonding on first antistatic backing has first shielding layer, the lower wall bonding on first shielding layer has first heat-conducting layer, the last wall bonding on PET layer has the polyolefin layer, the last wall bonding on polyolefin layer has second antistatic backing, the last wall bonding on second antistatic backing has the second shielding layer, the last wall bonding on second shielding layer has the second heat-conducting layer.

Preferably, the lower table wall of first shielding layer and the last equal indent of table wall of second shielding layer form the caulking groove, the last table wall of first heat-conducting layer and the lower table wall of second heat-conducting layer all evaginate and form the lug with caulking groove looks adaptation, spacing recess has been seted up to the outward appearance wall of lug, the inner wall bottom of caulking groove be connected with spacing recess assorted spacing projection.

Preferably, an insulating layer is adhered to the lower surface wall of the first heat conduction layer, and the lower surface wall of the insulating layer is smooth and has no protrusions.

Preferably, the upper surface wall of the second heat conduction layer is bonded with a wear-resistant layer, and the upper surface wall of the wear-resistant layer is provided with anti-skid grains.

Preferably, the two ends of the side wall of the second heat conduction layer are symmetrically connected with tearing hands, and the tearing hands are fixed with two tearing hands.

Preferably, the thicknesses of the first antistatic layer and the second antistatic layer are both 0.001-0.2 mm, and the thickness of the PET layer is 0.001-0.3 mm.

Compared with the prior art, the beneficial effects of the utility model are that:

(1) the utility model discloses an add first shielding layer and second shielding layer, can effectively improve this encapsulation film structure's shielding property, and then avoid electronic component to receive the interference, guaranteed electronic component's normal use, in addition, the first heat-conducting layer and the second heat-conducting layer of addding can effectively carry out heat conduction, can derive the heat dispersion that electronic component produced fast, have played effectual radiating action.

(2) The utility model discloses an add caulking groove and lug, when this encapsulation film structure of production, can make the lug embedding advance the caulking groove and bond, can effectively increase the bonding area between heat-conducting layer and the shielding layer, increase the fastness of bonding, avoid the emergence of coming unstuck, secondly, when connecting heat-conducting layer and shielding layer, can make spacing projection aim at spacing recess, can effectively increase the degree of accuracy of the coincide of bonding between the layer, avoid producing the deviation.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a top view of the present invention;

FIG. 3 is an enlarged view of portion A of FIG. 1;

in the figure: 1. a PET layer; 2. a first antistatic layer; 3. caulking grooves; 4. a first shielding layer; 5. a bump; 6. a first thermally conductive layer; 7. an insulating layer; 8. a polyolefin layer; 9. a second antistatic layer; 10. a second shielding layer; 11. a second thermally conductive layer; 12. a limiting convex column; 13. a wear layer; 14. tearing the hands; 15. and a limiting groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides the following technical solutions: an anti-static heat-sealing electronic patch packaging film structure comprises a PET layer 1, wherein a first anti-static layer 2 is bonded on the lower surface wall of the PET layer 1, a first shielding layer 4 is bonded on the lower surface wall of the first anti-static layer 2, a first heat conduction layer 6 is bonded on the lower surface wall of the first shielding layer 4, a polyolefin layer 8 is bonded on the upper surface wall of the PET layer 1, a second anti-static layer 9 is bonded on the upper surface wall of the polyolefin layer 8, a second shielding layer 10 is bonded on the upper surface wall of the second anti-static layer 9, a second heat conduction layer 11 is bonded on the upper surface wall of the second shielding layer 10, the first shielding layer 4 and the second shielding layer 10 which are additionally arranged can effectively improve the shielding performance of the packaging film structure, further, the electronic element is prevented from being interfered, the normal use of the electronic element is ensured, in addition, the first heat conduction layer 6 and the second heat conduction layer 11 which are additionally arranged can effectively conduct heat, and can disperse and lead out heat generated by the electronic, the heat dissipation effect is effectively achieved.

Further, the lower surface wall of the first shielding layer 4 and the upper surface wall of the second shielding layer 10 are both concave to form an embedded groove 3, the upper surface wall of the first heat conduction layer 6 and the lower surface wall of the second heat conduction layer 11 are both convex to form a lug 5 matched with the embedded groove 3, a limiting groove 15 is formed in the outer surface wall of the lug 5, a limiting convex column 12 matched with the limiting groove 15 is connected to the bottom of the inner wall of the embedded groove 3, when the packaging film structure is produced, the lug 5 can be embedded into the embedded groove 3 to be bonded, the bonding area between the heat conduction layer and the shielding layer can be effectively increased, the bonding firmness is increased, the degumming is avoided, and secondly, when the heat conduction layer and the shielding layers are connected, the limiting convex column 12 can be aligned to the limiting groove 15, the bonding superposition accuracy can be effectively increased, and the deviation is avoided.

Furthermore, the lower surface wall of the first heat conduction layer 6 is bonded with the insulation layer 7, the lower surface wall of the insulation layer 7 is smooth and has no protrusion, and the insulation layer 7 with the smooth and no protrusion on the lower surface wall is tightly attached to the packaging part, so that the insulation property can be effectively improved, and the packaging safety performance is improved.

Furthermore, the upper surface wall of the second heat conduction layer 11 is bonded with the wear-resistant layer 13, the upper surface wall of the wear-resistant layer 13 is provided with anti-slip patterns, and the wear-resistant layer 13 is additionally arranged to effectively increase the wear-resistant performance of the outer wall of the packaging structure, so that the damage caused by friction is avoided.

Further, the lateral wall both ends symmetric connection of second heat-conducting layer 11 has tearing hand 14, and tearing hand 14 is fixed with two altogether, when this packaging structure needs to be torn, utilizes tearing hand 14 to be convenient for tearing of this packaging structure, and is comparatively labour saving and time saving.

Furthermore, the thickness of the first anti-static layer 2 and the thickness of the second anti-static layer 9 are both 0.001-0.2 mm, the thickness of the PET layer is 0.001-0.3 mm, the first anti-static layer 2 and the second anti-static layer 9 are both polyethylene glycol coatings, and the polyethylene glycol coatings are reasonable in thickness and good in anti-static effect.

The utility model discloses a theory of operation and use flow: when the utility model is used, the added first shielding layer 4 and second shielding layer 10 can effectively improve the shielding performance of the packaging film structure, thereby avoiding the interference on the electronic element, ensuring the normal use of the electronic element, the added first heat conduction layer 6 and second heat conduction layer 11 can effectively conduct heat, and can quickly disperse and guide out the heat generated by the electronic element, furthermore, when the packaging film structure is produced, the lug 5 can be embedded into the caulking groove 3 for bonding, the bonding area between the heat conduction layer and the shielding layer can be effectively increased, the bonding firmness is increased, secondly, when the heat conduction layer and the shielding layer are connected, the limit convex column 12 can be aligned to the limit groove 15, the accuracy of bonding superposition can be effectively increased, the deviation is avoided, in addition, the lower surface wall is smooth and has no convex insulating layer 7 tightly attached to the packaging piece, the insulativity can be effectively improved, the safety performance of encapsulation is improved, and the wear-resisting property of the outer wall of the encapsulation structure can be effectively improved by adding the wear-resisting layer 13, so that the abrasion and the damage are avoided.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides an antistatic type heat-seal electron paster encapsulation film structure which characterized in that: including PET layer (1), the lower wall bonding of PET layer (1) has first antistatic coating (2), the lower wall bonding of first antistatic coating (2) has first shielding layer (4), the lower wall bonding of first shielding layer (4) has first heat-conducting layer (6), the last wall bonding of PET layer (1) has polyolefin layer (8), the last wall bonding of polyolefin layer (8) has second antistatic coating (9), the last wall bonding of second antistatic coating (9) has second shielding layer (10), the last wall bonding of second shielding layer (10) has second heat-conducting layer (11).

2. An anti-static heat-seal electronic patch packaging film structure according to claim 1, wherein: the lower table wall of first shielding layer (4) and the last equal indent of table wall of second shielding layer (10) form caulking groove (3), the last table wall of first heat-conducting layer (6) and the lower table wall of second heat-conducting layer (11) all evaginate and form lug (5) with caulking groove (3) looks adaptation, spacing recess (15) have been seted up to the outward appearance wall of lug (5), the inner wall bottom of caulking groove (3) be connected with spacing recess (15) assorted spacing projection (12).

3. An anti-static heat-seal electronic patch packaging film structure according to claim 1, wherein: an insulating layer (7) is adhered to the lower surface wall of the first heat conduction layer (6), and the lower surface wall of the insulating layer (7) is smooth and has no protrusion.

4. An anti-static heat-seal electronic patch packaging film structure according to claim 1, wherein: and the upper wall of the second heat conduction layer (11) is bonded with a wear-resistant layer (13), and the upper wall of the wear-resistant layer (13) is provided with anti-skid grains.

5. An anti-static heat-seal electronic patch packaging film structure according to claim 1, wherein: tearing hands (14) are symmetrically connected to two ends of the side wall of the second heat conduction layer (11), and the tearing hands (14) are fixed to two parts.

6. An anti-static heat-seal electronic patch packaging film structure according to claim 1, wherein: the thickness of the first anti-static layer (2) and the thickness of the second anti-static layer (9) are both 0.001-0.2 mm, and the thickness of the PET layer is 0.001-0.3 mm.