CN208324406U - A kind of electronic component packaging composite film - Google Patents
A kind of electronic component packaging composite film Download PDFInfo
- Publication number
- CN208324406U CN208324406U CN201820958981.4U CN201820958981U CN208324406U CN 208324406 U CN208324406 U CN 208324406U CN 201820958981 U CN201820958981 U CN 201820958981U CN 208324406 U CN208324406 U CN 208324406U
- Authority
- CN
- China
- Prior art keywords
- layer
- electronic component
- resin
- composite membrane
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model provides one kind and is applied to electronic component packaging composite film, which includes: the charge dissipation layer being cascading from top to bottom, thermoplastic resin peeling layer, middle layer, adhesive layer and substrate layer；The thermoplastic resin peeling layer includes resin layer a and resin layer b.The composite membrane can not only form good adaptation with a variety of plastic carriers or carrier band cladding, and the electronic component of package can be accurately positioned and take out, meanwhile, there is good anti-aging property, load/lid band service life can be significantly improved.
Description
Technical field
The utility model relates to electronic product packaging field of material technology, and in particular to one kind is for electronic component
The composite membrane being packaged.
Background technique
As electronic product is towards miniaturization, the development of slimming, surface mounting technology (SMT) comes into being.Due to piece
The consistency of standardization, the seriation and welding condition of formula component external form and the continuous birth of advanced high speed placement system,
So that surface-pasted the degree of automation is constantly promoted, production efficiency is greatly improved.
Load/lid band is a kind of band-type product applied to electronic packaging field, is generated to adapt to the needs of SMT, they
With specific thickness, the hole being equally spaced in its longitudinal direction for bearing electronic component, also known as pocket, and use
In the location hole for being indexed positioning.Coating film can be along carrier band continuous edge heat seal, by resistance/capacitance/transistor/bis- poles
The carrying of the electronic components such as pipe is accommodated in the pocket of carrier band, and the packet for forming closed type by sealing coating film above carrier band
Dress, for protecting electronic component not contaminated in transit and damaging.Common coating film is thermoplastic resin, such as two-way
Oriented polyester film.
Stabilization with suitable peeling force and force value that electronic packaging epiphragma usually requires that when sealing with carrier band and certain
Antistatic surface ability.Peeling force therein is related with electrostatic considerations, and electrostatic is strong, then peeling force is big, and electrostatic is weak, then peeling force
It is small.But certain electrostatic is also needed, to achieve the purpose that be unlikely to adhesive tape with appropriate peel forces and removed in advance.
If peeling force is larger, electronic component is easy to produce vibration during surface mount and is detached from carrier band hole；If removing
Power is smaller, then adhesive tape can be removed in advance, so that etc. electronic component to be mounted loses the encapsulation of adhesive tape
Protection.Therefore, suitable peeling force plays more important effect to packaging effect.Performance of the encapsulating material in surface mount is steady
Qualitative is an important performance indicator.
Surface mounting technology exist extensive, mass, standardization, it is rapid the features such as, the entire process that mounts is flowing water
Line continuous production, general chip mounter about handle the patch of 60,000~120,000 electronic component per hour, therefore slim
Effective qualification rate of surface mount finished product can effectively be ensured by carrying good stability, promote the production effect of entire assembly line
Rate.
Antistatic technique is an important technology level for influencing attachment stability.Compared to paper carrying belt, plastics are carried
Band is more prone to produce electrostatic.In general, electronic component is more sensitive for electrostatic, and the presence meeting of electrostatic is so that electronics member device
Part is electrostatically adsorbed during surface mount and is detached from carrier band hole, to influence normal attachment process, therefore good
Load/lid band often be unable to do without perfect antistatic process technology.
In addition, electronic component is influenced by high temperature and humidity adverse circumstances during transportation, electronics not only will affect
The ageing-resistant performance of component, meanwhile, electronic component, which tends to be adhered to lid, to be taken, if electronic component is adhered to lid
It takes, is not easy in addition to taking out, it is also possible to electronic component be caused to damage, influence its working life.In this way, for lid band
The weatherability and antistatic property of skin-material propose high requirement.It is right just because of the influence of above-mentioned many extraneous factors
The service life of electronic component can produce bigger effect.
Utility model content
The purpose of this utility model is to provide a kind of composite membranes applied to electronic component packaging, and the composite membrane is not
Only good adaptation can be formed with a variety of plastic carriers or carrier band cladding, the electronic component of package can be accurately positioned
And take out, meanwhile, there is good anti-aging property, load/lid band service life can be significantly improved.
In order to achieve the above object, the specific technical solution of the utility model is as follows:
A kind of electronic component packaging composite film, comprising: charge dissipation layer, the thermoplastic being cascading from top to bottom
Property resin peeling layer, middle layer, adhesive layer and substrate layer；
The thermoplastic resin peeling layer includes resin layer a and resin layer b.
Further, the resin layer a and resin layer b superposition constitutes one group, and the thermoplastic resin peeling layer includes folded
The resin layer a's that adds and resin layer b is one or more groups of.
Further, the charge dissipation layer is coated on the resin layer a, constitutes single film layer structure.
Further, the charge dissipation layer and the resin layer a are bonded a film layer structure.
Further, the middle layer, be the substrate layer and thermoplastic resin peeling layer articulamentum, including one layer or
Person's multilayer.
Further, the adhesive layer is bonded the substrate layer and the middle layer, is located at this therebetween, is formed single
Film structure.
Further, the substrate layer, the film made of Stretch material.
Further, the substrate layer with a thickness of 10-50 μm, middle layer with a thickness of 5-40 μm, thermoplastic resin stripping
Absciss layer with a thickness of 5-30 μm.
Electronic component packaging composite film provided by the utility model, can be with a variety of plastic carriers or carrier band cladding
Adaptation is good, and force value spring high stability, the electronic component of package can be accurately positioned and take out.Meanwhile the packet
Dress composite membrane can continue high-temp resisting high-humidity resisting environment, can adapt to prolonged marine environment, avoid in hot and humid environment
Lead to the problem of the quick-fried band of reel and component adhesion.
Detailed description of the invention
Fig. 1 is the sectional view of packaging composite film provided by the utility model；
1. substrate layer, 2. adhesive layers.3. middle layer, 4. thermoplastic resin peeling layers, 5. charge dissipation layers.
Specific embodiment
The utility model technical problem, technical solution and advantage are illustrated by reference to exemplary embodiment.However, this is practical
It is novel to be not limited to exemplary embodiment as disclosed below, it can be realized by different form.
A kind of electronic component packaging composite film, as shown in Figure 1, comprising: the charge being cascading from top to bottom
Dissipation layer, thermoplastic resin peeling layer, middle layer, adhesive layer and substrate layer；
Thermoplastic resin peeling layer therein, is made of ethene copolymer, and < -70 DEG C of brittle temperature, including resin
Layer a and resin layer b, the resin layer a and resin layer b include one or more groups of.
Resin layer a is made of low melting point high fluidity polyolefin resin, and fusing point is 85-125 DEG C, melt index 8.0-
40.0；Resin layer b is made of high-melting-point low-flow olefin polymer, and fusing point is 120-140 DEG C, melt index 3.0-
15.0。
Resin layer a, fusing point are 85-125 DEG C, and melt index 8.0-40.0, fusing point is low, and mobility is high.Resin layer b melts
Point is 120-140 DEG C, melt index 3.0-15.0, and fusing point is high, and mobility is low.By fusing point and melt index, two are distinguished
A resin layer comes, and the hot combined temp of pre-coating film is generally at 130-220 degrees Celsius, low melting point high fluidity polyolefin resin layer at this time
Compound as the lamination a hot sealing layer directly pasted and carrier band, two layers of adhesiveness can be improved in hot compound tense Flashmelt.It is high
Fusing point low-flow olefin polymer to bond transition zone, and can guarantee the humidity resistance after encapsulation and resistance to deformation as lamination b
Characteristic can also improve the bonding combined strength bination between lamination a and middle layer so that encapsulation rear cover band performance is stablized.
Thermoplastic release layer therein uses stack-design, and low melting point high fluidity olefin resin layer is direct as lamination a
The hot sealing layer pasted and carrier band are compound, and two layers of adhesiveness can be improved in hot compound tense Flashmelt.High-melting-point low-flow alkene
Hydrocarbon polymer to bond transition zone, and can guarantee the humidity resistance after encapsulation and resistance to deformation behavior as lamination b, so that encapsulation
Rear cover band performance is stablized, and the bonding combined strength bination between lamination a and two layers of middle layer can also be improved.And resin melting range range
Narrow, even molecular weight distribution, stable structure has excellent weather resistance, and can reduce influence of the hot and humid environment to lid band, avoid transporting by sea
The destruction of harsh weather in the process.
Meanwhile packaging composite film provided by the utility model, there is lower characterization of adsorption, film surface to electronic component
With high resistant resistance, high impedance is not likely to produce charge, can prevent or adsorb the generation of the electrically charged amount of electronic component, prevent by
Packing material draw use when by the deviation of charge adsorption or position, and cause patch failure or efficiency reduce the case where.Peeling layer
On charge dissipation layer under 5 DEG C -50 DEG C of temperature environment, in the range of relative humidity is 12%-70%, have lower than 1 ×
1010The sheet resistance value of Ω.
Charge dissipation layer is also possible to modified containing acid for the conducting polymer containing poly- (3,4-rthylene dioxythiophene)
Polyolefin resin and conductive agent, it is organic which contains carbon black, metal particle, metal oxide, electrically conductive microparticle, Si base
One or more of compound, organic conductive polymer, ionic liquid and surfactant, the shape by way of intaglio plate coating
At one layer, or above-mentioned conductive agent makes an addition in hot sealing layer with hot sealing layer to be altogether one layer realize.
The whole light transmission rate of the composite membrane is greater than 85% or more.The packaging composite film and a variety of plastic carriers or carrier band skin
The adaptation of material is good, and force value spring stability is high when opening epiphragma, and the electronic component of package can be enable to be accurately positioned
And it takes out.Meanwhile the composite membrane can be resistant to hot and humid environment continuous action at least one week, solve conventional lid band due to heat-sealing
Layer fusing point is lower or heat-resisting, weather resistance is inadequate, and electronic component reel is easy to appear quick-fried band and first device during sea-freight
The problem of part adhesion.
Embodiment 1:
A kind of electronic component packaging composite film, including substrate layer 1, adhesive layer 2, middle layer 3 and the heat being stacked
Plastic resin peeling layer 4.Substrate layer 1 is made of biaxial stretching polyester (BOPET), and with a thickness of 25 μm, adhesive layer 2 is by 30%
Polyurethane, 5% curing agent, surplus bonding agent even spread made of diluent are made, and coating dry weight is 0.2g/m2, thick
Degree is 0.5 μm.Curing agent is isocyanates, and diluent is ethyl acetate.
Middle layer 3 is linear low density polyethylene, and fusing point is between 115-125 DEG C, and elasticity modulus 180-200MPa is close
Degree is 0.915g/cm3.If elasticity modulus is too low, in heat-sealing, resin is easy to overflow the pollution for causing equipment and carrier band, causes
Mounting efficiency reduces, and elasticity modulus is excessive, and Resin crystallization degree is larger, and is not easy sufficiently to melt in heat-sealing, causes to be bonded
The reduction of intensity, therefore, adhesive layer are linear low density polyethylene, can reach good adhesive effect.
Thermoplastic resin layer 4 therein includes the resin layer a and resin layer b being stacked, and resin layer b is located at close to centre
The side of layer.Resin layer a is sour ethene improved-vinyl acetate co-polymer, and fusing point is 95-115 DEG C, MI design 15-20 it
Between, there is high fluidity.Resin layer b is the polymer blend of styrene, and fusing point is 105-120 DEG C, and MI is designed between 7-20,
And there is opposite low-flow energy.Thermoplastic resin layer 4 with a thickness of 15 μm, a, b two layers of thickness ratio 1:4.
Charge dissipation layer 5 is the conducting polymer containing poly- (3,4-rthylene dioxythiophene), the opposite polythiophene of addition 10%
The acrylate adhesive of component.
Binder couse of the middle layer 3 as substrate layer and resin layer as a result, can be such that heat and pressure uniformly fully acts on
Peeling layer, to guarantee force value stability when sealing.Modified thermoplastic resin layer 4 can form good sealing with plastic carrier
Performance, and lamination structure design can make composite membrane have well easily take off performance, the force value even transition when tearing.Charge
Dissipation layer 5 can make film surface have high resistant resistance, can prevent or adsorb the generation of the electrically charged amount of electronic component, prevent from being wrapped
The case where filling object to draw when using by the deviation of charge adsorption or position, and patch failure or efficiency caused to reduce.
Embodiment 2:
A kind of electronic component packaging composite film, including substrate layer 1, adhesive layer 2, middle layer 3 and the heat being stacked
Plastic resin peeling layer 4.Substrate layer 1 is made of biaxial stretching polyester (BOPET), with a thickness of 20 μm；Adhesive layer 2 by 30% it is poly-
Urethane, 5% curing agent, surplus bonding agent even spread made of diluent are made, and coating dry weight is 0.2g/m2, thickness
It is 0.5 μm.Curing agent is isocyanates, and diluent is ethyl acetate.
Middle layer 3 is linear low density polyethylene, and fusing point is between 115-125 DEG C, 13 μm of thickness.
Thermoplastic resin layer 4 includes the resin layer a and resin layer b being stacked, and resin layer b is located at one close to middle layer
Side.Resin layer a is sour ethene improved-vinyl acetate co-polymer, and between 85-100 DEG C, MI is designed between 18-30 fusing point,
With high fluidity.Resin layer b be metallocene low density polyethylene (LDPE), fusing point be 105-110 DEG C between, MI design 7-10 it
Between, and there is opposite low-flow energy；Thermoplastic resin layer 4 with a thickness of 15 μm, a, b two layers of thickness ratio 3:7.
Charge dissipation layer 5 is the conducting polymer containing poly- (3,4-rthylene dioxythiophene), the opposite polythiophene of addition 10%
The acrylate adhesive of component.
The following table 1 is the experiment of machanics test result carried out using composite membrane provided in embodiment 1 and embodiment 2.
Table 1
In general, aged properties is decayed, removing force value decline, and then it is unable to satisfy the requirement worth for peeling force of lid band.
The composite membrane disclosed in the present embodiment 1 and 2 it can be seen from the above test result, under the conditions of temperature 60 C, humidity 90%, always
After changing 7 days, removing force value performance still keeps good.So a kind of electronic component packaging provided by the utility model is compound
Film solves conventional lid band since hot sealing layer fusing point is lower or heat-resisting, weather resistance is inadequate, electronics member device during sea-freight
Part reel is easy to appear the problem of quick-fried band and component adhesion.
More than, although the description of several embodiments of the utility model, but these embodiments are intended only as example
It proposes, is not intended to limit the scope of the utility model.For these new embodiments, can with various other ways into
Row is implemented, and in the range of not departing from the main idea of the utility model, is able to carry out various omissions, displacement and change.These are implemented
Mode and its deformation, while being contained in the scope of the utility model and main idea, are also contained in and to record in claims
In utility model and its equivalency range.
Claims (8)
1. a kind of electronic component packaging composite film characterized by comprising the charge consumption being cascading from top to bottom
Dissipate layer, thermoplastic resin peeling layer, middle layer, adhesive layer and substrate layer；
The thermoplastic resin peeling layer includes resin layer a and resin layer b.
2. composite membrane according to claim 1, which is characterized in that
The resin layer a and resin layer b superposition constitutes one group, and the thermoplastic resin peeling layer includes the resin layer of superposition
A's and resin layer b is one or more groups of.
3. composite membrane according to claim 1, which is characterized in that
The charge dissipation layer is coated on the resin layer a, constitutes single film layer structure.
4. composite membrane according to claim 1, which is characterized in that
The charge dissipation layer and the resin layer a are bonded a film layer structure.
5. composite membrane according to claim 1-4, which is characterized in that
The middle layer is the articulamentum of the substrate layer and thermoplastic resin peeling layer, including one layer or multilayer.
6. composite membrane according to claim 1-4, which is characterized in that
The adhesive layer is bonded the substrate layer and the middle layer, is located at this therebetween, forms single-layer membrane structure.
7. composite membrane according to claim 1-4, which is characterized in that
The substrate layer, the film made of Stretch material.
8. composite membrane according to claim 1-4, which is characterized in that
The substrate layer with a thickness of 10-50 μm, middle layer with a thickness of 5-40 μm, thermoplastic resin peeling layer with a thickness of 5-
30μm。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820958981.4U CN208324406U (en) | 2018-06-21 | 2018-06-21 | A kind of electronic component packaging composite film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820958981.4U CN208324406U (en) | 2018-06-21 | 2018-06-21 | A kind of electronic component packaging composite film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208324406U true CN208324406U (en) | 2019-01-04 |
Family
ID=64769293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820958981.4U Active CN208324406U (en) | 2018-06-21 | 2018-06-21 | A kind of electronic component packaging composite film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208324406U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108582903A (en) * | 2018-06-21 | 2018-09-28 | 北京康得新功能材料有限公司 | A kind of electronic component packaging composite film |
| JP2022125106A (en) * | 2019-04-26 | 2022-08-26 | デンカ株式会社 | Cover film and electronic component package using the same |
-
2018
- 2018-06-21 CN CN201820958981.4U patent/CN208324406U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108582903A (en) * | 2018-06-21 | 2018-09-28 | 北京康得新功能材料有限公司 | A kind of electronic component packaging composite film |
| JP2022125106A (en) * | 2019-04-26 | 2022-08-26 | デンカ株式会社 | Cover film and electronic component package using the same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR950006382B1 (en) | Covering tape for electronic component chip | |
| KR101954467B1 (en) | Cover film | |
| CN103492289B (en) | Coverlay | |
| JP4500769B2 (en) | Cover tape for taping packaging of electronic parts | |
| CN103619725B (en) | Coverlay | |
| CN208324406U (en) | A kind of electronic component packaging composite film | |
| JP6358403B1 (en) | Resin composition, cover tape, and packaging for electronic parts | |
| TWI658932B (en) | Cover tape for packaging electronic parts | |
| WO2017094871A1 (en) | Process release film, use thereof, and method of producing resin-sealed semiconductor using same | |
| JP2012006658A (en) | Chip type electronic component packaging cover tape | |
| SG189367A1 (en) | Cover film | |
| JP2006307032A (en) | Bottom cover tape for small electronic part carrier | |
| JP2609779B2 (en) | Cover tape for packaging chip-type electronic components | |
| KR101145344B1 (en) | Cover tape for the electric part conveyance | |
| CN108582903A (en) | A kind of electronic component packaging composite film | |
| JPH058339A (en) | Cover tape for packaging chip-type electronic part | |
| JP3241220B2 (en) | Cover tape for packaging chip-type electronic components | |
| JP4706122B2 (en) | Carrier package | |
| WO2020059682A1 (en) | Cover tape and packaging body for packaging electronic component | |
| JP2003192022A (en) | Cover tape for transporting chip body | |
| JP4826018B2 (en) | Carrier tape lid | |
| CN207535431U (en) | A kind of heat-sealing type cover strip structure | |
| CN214457742U (en) | Electronic device packaging cover tape | |
| JP6201751B2 (en) | Covering tape for packaging | |
| CN220411464U (en) | Cover tape for packaging electronic components |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200201 Address after: 215600 west side of Taiwan Road, Zhangjiagang Free Trade Zone, Suzhou City, Jiangsu Province, south side of Hexin chemical Patentee after: ZHANGJIAGANG FREE TRADE ZONE KANGDE FILM INDUSTRY CO., LTD. Address before: 102299, Changping District science and Technology Park, Zhenxing Road, 26, 1, 2, Beijing Patentee before: BEIJING KANGDEXIN FUNCTION MATERIAL CO., LTD. |