US20130074447A1 - Carrier tape winding unit and apparatus of packing semiconductor package - Google Patents

Carrier tape winding unit and apparatus of packing semiconductor package Download PDF

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Publication number
US20130074447A1
US20130074447A1 US13/546,536 US201213546536A US2013074447A1 US 20130074447 A1 US20130074447 A1 US 20130074447A1 US 201213546536 A US201213546536 A US 201213546536A US 2013074447 A1 US2013074447 A1 US 2013074447A1
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US
United States
Prior art keywords
carrier tape
tape
winding
winding reel
adhesion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/546,536
Inventor
Ki-hun Kim
Seok Goh
Byoungjun Min
Poom-Seong Park
Donghae Son
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Assigned to SAMSUNG ELECTRONICS CO., LTD. reassignment SAMSUNG ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GOH, SEOK, KIM, KI-HUN, MIN, BYOUNGJUN, PARK, POOM-SEONG, SON, DONGHAE
Publication of US20130074447A1 publication Critical patent/US20130074447A1/en
Abandoned legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H19/00Changing the web roll
    • B65H19/22Changing the web roll in winding mechanisms or in connection with winding operations
    • B65H19/28Attaching the leading end of the web to the replacement web-roll core or spindle
    • B65H19/286Attaching the leading end of the web to the replacement web-roll core or spindle by applying adhesive to the web
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H19/00Changing the web roll
    • B65H19/22Changing the web roll in winding mechanisms or in connection with winding operations
    • B65H19/29Securing the trailing end of the wound web to the web roll
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65BMACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B9/00Enclosing successive articles, or quantities of material, e.g. liquids or semiliquids, in flat, folded, or tubular webs of flexible sheet material; Subdividing filled flexible tubes to form packages
    • B65B9/02Enclosing successive articles, or quantities of material between opposed webs
    • B65B9/04Enclosing successive articles, or quantities of material between opposed webs one or both webs being formed with pockets for the reception of the articles, or of the quantities of material
    • B65B9/045Enclosing successive articles, or quantities of material between opposed webs one or both webs being formed with pockets for the reception of the articles, or of the quantities of material for single articles, e.g. tablets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00Handled material; Storage means
    • B65H2701/10Handled articles or webs
    • B65H2701/19Specific article or web
    • B65H2701/1942Web supporting regularly spaced non-adhesive articles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting

Definitions

  • the inventive concepts relate to a carrier tape winding unit and/or an apparatus of packing a semiconductor package and, more particularly, to a carrier tape winding unit winding a carrier tape in which semiconductor packages are received and/or an apparatus having the same of packing a semiconductor package.
  • Semiconductor packages may be individualized through semiconductor manufacturing processes and then may be tested. Thereafter, the semiconductor packages may be received into a packing container to be shipped to the outside.
  • the packing container may prevent the semiconductor packages from being physically damaged by an external impact and prevent integrated circuits of the semiconductor packages from being electrically damaged by static electricity.
  • a tray, a tube, or a carrier tape, which is formed of a resin material containing a conductive material, may be desirably used as the packing container.
  • the carrier tape may have a pocket for the semiconductor package.
  • the pocket provided with the semiconductor package may be sealed by a thin and transparent cover tape.
  • the carrier tape having the pocket sealed by the cover tape may be wound round a winding reel.
  • Example embodiments of the inventive concepts may provide a carrier tape winding unit capable of replacing a winding reel automatically and/or an apparatus of packing a semiconductor package having the same.
  • a carrier tape winding unit may include a winding reel and a carrier tape adhesion member configured to attach a front end of a carrier tape before winding the carrier tape to the winding reel and configured to attach a back end of the carrier tape after a completion of the winding.
  • the carrier tape adhesion member may include a tape adhesion unit configured to pick up an adhesive tape cut to a length.
  • the tape adhesion unit may be configured to attach the adhesive tape to the front end of the carrier tape and the winding reel and may be configured to attach the adhesive tape to the back end of the carrier tape and an outer wound portion of the carrier tape.
  • the carrier tape adhesion member may further includes a tape pressurization tool configured to pressurize the adhesive tape to contact the carrier tape.
  • the carrier tape adhesion member may further include a feeder configured to provide the adhesive tape, a chuck configured to chuck a front end of the adhesive tape provided by the feeder to extend the adhesive tape in a length direction, and an adhesive tape cutter configured to cut the adhesive tape extended by the chuck to the length.
  • the tape adhesion unit may include a first adhesion unit adjacent to the winding reel and configured to pick up one end of the adhesive tape; and a second adhesion unit spaced apart from the first adhesion unit in a horizontal direction and configured to pick up another end of the adhesive tape.
  • the carrier tape winding unit may further include a carrier tape transfer member configured to transfer the carrier tape to the winding reel.
  • the carrier tape transfer member may include a transfer rail configured to guide a transfer of the carrier tape, and a guide under the transfer rail.
  • the guide may protrude into a space between an end portion of the transfer rail and the winding reel to support the front end of the carrier tape escaping from the transfer rail.
  • the first and second adhesion units may be configured to attach the one end of the adhesive tape to the carrier tape to locate a center region of the adhesive tape on the front end of the carrier tape supported by the guide.
  • the first and second adhesion units may be configured to attach the another end of the adhesive tape to the winding reel after the guide goes back.
  • the carrier tape winding unit may further include a carrier tape cut member configured to cut the carrier tape after the completion of winding the carrier tape on the winding reel.
  • the carrier tape cut member may include a carrier tape holder configured to pressurize and hold the carrier tape to prevent the carrier tape wound round the winding reel from being unwound, and a carrier tape cutter configured to cut the carrier tape held by the carrier tape holder.
  • the first and second adhesion units may be configured to attach the adhesive tape on the carrier tape to locate a center region of the adhesive tape on the back end of the carrier tape.
  • the carrier tape winding unit may further include a transfer rail extending in a first direction being a transfer direction of the carrier tape toward the winding reel and configured to guide the carrier tape transferred to the winding reel, and a reel replacement member configured to replace the winding reel with another one after the completion of winding the carrier tape to the winding reel.
  • the reel replacement member may include a rotation axis being able to rotate, an axis of the rotation axis aligned with a second direction perpendicular to the first direction, an axis support member configured to support the rotation axis, and a driving part configured to move the axis support member in the second direction.
  • the winding reel may be provided in plural on the rotation axis.
  • the winding reel may be replaceable with another winding reel on the rotation axis by movement of the rotation axis and the axis support member in the second direction.
  • an apparatus of packing a semiconductor package may include a carrier tape supply unit configured to provide a carrier tape, a semiconductor package packing unit configured to pack a semiconductor package in the carrier tape by putting the semiconductor package into a pocket of the carrier tape and bonding a cover tape on a top surface of the carrier tape, and a carrier tape winding unit configured to wind the packed carrier tape.
  • the carrier tape winding unit may include a winding reel configured to wind the packed carrier tape, and a carrier tape adhesion member configured to attach a front end of the packed carrier tape before winding the carrier tape to the winding reel and configured to attach a back end of the packed carrier tape after the completion of winding the carrier tape.
  • the carrier tape adhesion member may include a first adhesion unit over the winding reel and configured to pick up one end of an adhesive tape cut to a length; and a second adhesion unit spaced apart from the first adhesion unit in a horizontal direction and configured to pick another end of the adhesive tape.
  • the first and second adhesion units may be configured to attach the adhesive tape to the front end of the packed carrier tape and the winding reel and may be configured to attach the adhesive tape to the back end of the packed carrier tape and an outer wound portion of the carrier tape.
  • the apparatus may further include a transfer rail guiding a transfer of the packed carrier tape, and a guide under the transfer rail, the guide protruding into a space between an end portion of the transfer rail and the winding reel to support the front end of the packed carrier tape escaping from the transfer rail.
  • the first and second adhesion tools may be configured to attach the one end of the adhesive tape to the packed carrier tape such that a center region of the adhesive tape is on the front end of the packed carrier tape supported by the guide.
  • the first and second adhesion units may be configured to attach the another end of the adhesive tape to the winding reel after the guide goes back.
  • the apparatus may further include a carrier tape holder configured to pressurize and hold the packed carrier tape to prevent the packed carrier tape wound round the winding reel from being unwound after winding the packed carrier tape on the winding reel is finished, and a carrier tape cutter configured to cut the packed carrier tape held by the carrier tape holder.
  • the first and second adhesion units may be configured to attach the adhesive tape on the packed carrier tape to locate a center region of the adhesive tape on the back end of the packed carrier tape.
  • the carrier tape adhesion member may further include a feeder configured to provide the fixing tape, a chuck configured to chuck a front end of the adhesive tape provided by the feeder to extend the adhesive tape in a length direction; and an adhesive tape cutter configured to cut the adhesive tape extended by the chuck to the length.
  • the apparatus may further include a transfer rail configured to extend in a first direction being a transfer direction of the packed carrier tape toward the winding reel and configured to guide the carrier tape transferred to the winding reel, and a reel replacement member configured to replace the winding reel after the completion of winding the carrier tape to the winding reel.
  • the reel replacement member may include a rotation axis being able to rotate, an axis of the rotation axis aligned with a second direction perpendicular to the first direction, an axis support member configured to support the rotation axis, and a driving part configured to move the axis support member in the second direction.
  • the winding reel may be provided in plural on the rotation axis. After the completion of, the winding reel may be replaceable with another winding reel on the rotation axis by movement of the rotation axis and the axis support member in the second direction.
  • an apparatus of packing a semiconductor package may include a winding reel, a transfer rail configured to guide a transfer of a carrier tape to the winding reel, a guide under the transfer rail, the guide protruding into a space between an end portion of the transfer rail and the winding reel to support a portion of the carrier tape escaping from the transfer rail, a carrier tape holder configured to hold the carrier tape wound on the winding reel, and a carrier tape cutter configured to cut the carrier tape held by the carrier tape holder form a back end of the carrier tape at a location between an end portion of the transfer rail and a top or a bottom of a circumference surface of the winding reel.
  • the guide may be configured to proceed toward the winding reel and support the carrier tape passing through the end portion of the transfer rail to introduce a front end of the carrier tape on the winding reel.
  • the apparatus of packing a semiconductor package may further include a carrier tape adhesion member configured to attach an adhesive tape to front end of the carrier tape before winding the carrier tape to the winding reel.
  • a region of the carrier tape may include the front end of the carrier tape overlaps with a region of the adhesive tape.
  • the apparatus of packing a semiconductor package may further include a carrier tape adhesion member configured to attach an adhesive tape to the back end of the carrier tape after a completion of winding the carrier tape to the winding reel.
  • the back end of the carrier tape is located approximately on a center region of the adhesive tape.
  • the guide may be configured to not proceed toward the winding reel after a completion of winding the carrier tape to the winding reel.
  • FIGS. 1-10 represent non-limiting, example embodiments as described herein.
  • FIG. 1 is a schematic view illustrating an apparatus of packing a semiconductor package according to an example embodiments of the inventive concepts
  • FIG. 2 is a schematic view illustrating a method of receiving a semiconductor package in a pocket of a carrier tape of FIG. 1 ;
  • FIG. 3 is an enlarged view of the carrier tape winding unit of FIG. 1 ;
  • FIG. 4 is a cross-sectional view taken along a line A-A′ of FIG. 3 ;
  • FIG. 5 is a plan view illustrating a reel replacement member of FIG. 3 ;
  • FIG. 6 is a schematic view illustrating an operation replacing a winding reel by a reel replacement member
  • FIG. 7 is a flowchart illustrating a detailed method of replacing a winding reel according to an example embodiment of the inventive concepts
  • FIGS. 8A to 8D are schematic views illustrating a method of preparing an adhesive tape according to an example embodiments of the inventive concepts
  • FIGS. 9A to 9E are schematic views illustrating a method of attaching a cut back end of a carrier tape, after a winding is completed, on a winding reel by using an adhesive tape according to an example embodiments of the inventive concepts.
  • FIGS. 10A to 10E are schematic views illustrating a method of attaching a front of a carrier tape, before a winding is started, on a winding reel by using an adhesive tape according to an example embodiments of the inventive concepts.
  • Example embodiments will now be described more fully with reference to the accompanying drawings.
  • Example embodiments may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those of ordinary skill in the art.
  • the thicknesses of layers and regions are exaggerated for clarity.
  • Like reference numerals in the drawings denote like elements, and thus their description will be omitted.
  • first”, “second”, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of example embodiments.
  • spatially relative terms such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the exemplary term “below” can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
  • Example embodiments are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments (and intermediate structures) of example embodiments. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, example embodiments should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an implanted region illustrated as a rectangle may have rounded or curved features and/or a gradient of implant concentration at its edges rather than a binary change from implanted to non-implanted region.
  • a buried region formed by implantation may result in some implantation in the region between the buried region and the surface through which the implantation takes place.
  • the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of example embodiments.
  • FIG. 1 is a schematic view illustrating an apparatus of packing a semiconductor package according to an example embodiment of the inventive concepts
  • FIG. 2 is a schematic view illustrating a method of receiving a semiconductor package in a pocket of a carrier tape of FIG. 1 .
  • an apparatus 1 of packing a semiconductor package may include a carrier tape supply unit 10 , a semiconductor package packing unit 20 , and a carrier tape winding unit 30 .
  • the carrier tape supply unit 10 supplies a carrier tape T 1 to the semiconductor package packing unit 20 .
  • the semiconductor package packing unit 20 packs a semiconductor package in the carrier tape T 1 .
  • the carrier tape winding unit 30 winds the carrier tape T 1 in which the semiconductor package is packed.
  • the carrier tape supply unit 10 includes a carrier tape supply reel 12 and a reel driving part (not shown).
  • the carrier tape T 1 is wound round the carrier tape supply reel 12 .
  • the carrier tape T 1 may be formed of a resin material containing a conductive material.
  • the reel driving part (not shown) rotates the carrier tape supply reel 12 . When the carrier tape supply reel 12 is rotated clockwise by the reel driving part, the carrier tape T 1 may be unwound from the carrier tape supply reel 12 .
  • the carrier tape T 1 may have a plurality of pockets P receiving a plurality of the semiconductor packages PKG.
  • the plurality of pockets P may be formed along a longitudinal direction of the carrier tape T 1 by equal intervals.
  • Transfer holes H which are used for transferring the carrier tape T 1 , may be formed at both edge regions of the pockets P to be arranged in lines.
  • Protrusions 231 of a sprocket 230 described later are inserted in the transfer holes H.
  • the sprocket 230 and the protrusions 231 are illustrated in FIG. 4 .
  • the carrier tape T 1 is moved straight toward the semiconductor package packing unit 20 .
  • the movement of the carrier tape T 1 may also be guided by a transfer rail 21 .
  • the semiconductor package packing unit 20 includes a picker 22 , a cover tape supply reel 24 , an upper heating roller 26 a, and a lower heating roller 26 b.
  • the picker 22 picks up the semiconductor package PKG and then puts the semiconductor package PKG in the pocket P of the carrier tape T 1 .
  • the picker 22 may pick up the semiconductor package PKG by a vacuum suction method.
  • the cover tape supply reel 24 may disposed over the carrier tape T 1 .
  • a cover tape T 2 is wound round the cover tape supply reel 24 .
  • the cover tape T 2 may be formed of a resin material containing a conductive material. When the cover tape supply reel 24 is rotated counterclockwise by a reel driving part (not shown), the cover tape T 2 may be unwound from the cover tape supply reel 24 .
  • the upper heating roller 26 a is disposed on the carrier tape T 1 and the lower heating roller 26 b is disposed under the carrier tape T 1 to face the upper heating roller 26 a .
  • the carrier tape T 1 and the cover tape T 2 are disposed between the upper heating roller 26 a and the lower heating roller 26 b.
  • the upper and lower heating rollers 26 a and 26 b bond the cover tape T 2 on the carrier tape T 1 in thermo-compression.
  • a groove (not shown) may be formed in the lower heating roller 26 b so that the pocket P of the carrier tape T 1 may not be in contact with the lower heating roller 26 b.
  • Heat blocks may be replaced with the upper and lower heating roller 26 a and 26 b. The heat blocks may move in up and down directions to bond the cover tape T 2 to the carrier tape T 1 using thermocompression.
  • the carrier tape winding unit 30 includes a carrier tape adhesion member 100 , a carrier tape transfer member 200 , a carrier tape cut member 300 , and a reel replacement member 400 .
  • FIG. 3 is an enlarged view of the carrier tape winding unit of FIG. 1
  • FIG. 4 is a cross-sectional view taken along a line A-A′ of FIG. 3
  • the carrier tape adhesion member 100 include feeder 110 , a chuck 120 , a tape adhesion tool 130 , an adhesive tape cutter 140 , and an adhesive tape pressurization tool 150 .
  • the feeder 110 may be disposed over and on the right of a winding reel 420 .
  • a adhesive tape T 3 is wound round the feeder 110 .
  • the adhesive tape T 3 may be unwound from the feeder 110 .
  • the chuck 120 may be disposed over and on the left of the winding reel 420 a to face the feeder 110 .
  • the chuck 120 may move straight toward the feeder 110 to chuck the front of the fixing tape T 3 unwound from the feeder 110 .
  • the chuck 120 may move straight in a direction far away from the feeder 110 to extend the chucked fixing tape T 3 in length.
  • the tape adhesion tool 130 includes a first adhesion tool 132 and a second adhesion tool 134 .
  • the first adhesion unit 132 and the second adhesion unit 134 are disposed between the feeder 110 and the chuck 120 and are spaced apart from each other by a desired (or, alternatively a predetermined) interval in a horizontal direction.
  • the first adhesion unit 132 picks up one end of a portion having a desired (or, alternatively a predetermined) length of the fixing tape T 3 and the second adhesion unit 134 picks up another end of the portion having the desired (or, alternatively a predetermined) length of the fixing tape T 3 .
  • the first and second adhesion units 132 and 134 may pick up the fixing taper T 3 by a vacuum suction method.
  • the portion having the desired (or, alternatively a predetermined) length of the fixing tape T 3 may be cut from the fixing tape T 3 by the adhesive tape cutter 140 in the state that the first and second adhesion units 132 and 134 pick up the portion having the desired (or, alternatively a predetermined) length of the adhesive tape T 3 .
  • the first and second adhesion units 132 and 134 may move in up and down directions. In the state that the first and second adhesion units 132 and 134 pick up the cut adhesive tape T 3 (i.e., the cut portion having the desired (or, alternatively a predetermined) length of the adhesive tape T 3 ), the first and second adhesion units 132 and 134 descend to bond the cut adhesive tape T 3 to the winding reel 420 a. In more detail, the first and second adhesion units 132 and 134 may bond the front end of the carrier tape T 1 to the winding reel 420 a before a wind of the winding reel 420 a is started.
  • the first and second adhesion units 132 and 134 may attach a cut back end of the carrier tape T 1 to the winding reel 420 a or the outermost wound portion of the carrier tape T 1 after the winding of the winding reel 420 a is completed. This will be described in more detail later.
  • the tape pressurization tool 150 may be disposed between the first adhesion unit 132 and the second adhesion unit 134 .
  • the tape pressurization tool 150 may include a body 152 and a pressurization part 154 .
  • the pressurization part 154 is a combination of a bottom surface of the body 152 and a pressurization curved surface 155 having an upward concave shape 155 formed on a bottom surface of the pressurization part 154 .
  • the tape pressurization tool 150 may move in up and down directions.
  • the tape pressurization tool 150 descends toward the winding reel 420 a so that the pressurization curved surface 155 pressurizes the adhesive tape T 3 .
  • An adhesion force of the adhesive tape T 3 may be improved by the pressurization force of the tape pressurization tool 150 .
  • the carrier tape transfer member 200 transfers the carrier tape T 1 to the winding reel 420 a.
  • the carrier tape transfer member 200 includes a transfer rail 220 , the sprocket 230 , and a guide 240 .
  • the transfer rail 220 includes a rail part 222 and grippers 224 .
  • the rail part 222 extends in a first direction which is the transfer direction of the carrier tape T 1 toward the winding reel 420 a.
  • the rail part 222 guides the carrier tape T 1 to be transferred toward the winding reel 420 a.
  • a pair of guide sills 223 are formed on a top surface of the rail part 222 . Both edge portions of the carrier tape T 1 are safely mounted on the pair of guide sills 223 , respectively.
  • the guide grippers 224 are disposed over the guide sills 223 to prevent the carrier tape T 1 from breaking away from the transfer rail 220 .
  • the sprocket 230 is disposed over the rail part 222 to transfer the carrier tape T 1 .
  • the sprocket 230 may penetrate the guide gripper 224 and be disposed over the guide sill 223 .
  • a plurality of protrusions 231 are formed on a circumferential surface of the sprocket 230 .
  • the plurality of protrusions 231 are inserted in the transfer holes H of the carrier tape T 1 by the rotation of the sprocket 230 and then the protrusions 231 push sidewalls of the transfer holes H to get out from the transfer holes H. According to these operations, the carrier tape T 1 moves straight toward the winding reel 420 a.
  • the sprocket 230 may be intermittently rotated by a driving part 232 for a step movement of the carrier tape T 1 .
  • the driving part 232 may be a step motor.
  • the guide 240 is disposed under the transfer rail 220 .
  • the guide 240 may go ahead and back in a longitudinal direction of the transfer rail 220 .
  • the guide 240 goes ahead to a space between an end portion of the transfer rail 220 and the winding reel 420 a and supports the carrier tape T 1 passing through the end portion of the transfer rail 220 .
  • the carrier tape cut member 300 cuts the carrier tape T 1 after the wind of the carrier tape T 1 on the winding reel 420 a is completed.
  • the carrier tape cut member 300 includes a carrier tape holder 320 and a carrier tape cutter 340 .
  • the carrier tape holder 320 pressurizes and holds the carrier tape T 1 to prevent the carrier tape T 1 wound on the winding reel 420 a from being unwound.
  • the carrier tape holder 320 may pressurize the carrier tape T 1 wound in a first quadrant with respect to a center of the winding reel 420 a .
  • the carrier tape cutter 340 may be disposed between the transfer rail 220 and the winding reel 420 a.
  • the carrier tape cutter 340 cuts the carrier tape T 1 held by the carrier tape holder 320 .
  • the carrier tape cutter 340 may cut the carrier tape T 1 at any location between the end portion of the transfer rail 220 and the top of a circumferential surface of the winding reel 420 a.
  • FIG. 5 is a plan view illustrating the reel replacement member of FIG. 3 and FIG. 6 is a schematic view illustrating an operation replacing a winding reel by a reel replacement member.
  • the reel replacement member 400 replaces the winding reel 420 a where winding of the carrier tape T 1 is completed with a new winding reel 420 b. Additionally, after winding of the winding reel 420 b is completed, the reel replacement member 400 may replace the winding reel 420 b with another new winding reel 420 c again.
  • the reel replacement member 400 includes a rotation axis 410 , an axis support member 430 , an axis driving part 440 , and a base driving part 450 .
  • the rotation axis 410 is separated from the end portion of the transfer rail 220 in the transfer direction (hereinafter, referred to as ‘a first direction’) of the carrier tape T 1 .
  • An axis of the rotation axis 410 is aligned in a second direction perpendicular to the first direction in a plan view, as illustrated in FIG. 5 .
  • the rotation axis 410 may be provided with a plurality of the winding reels 420 a, 420 b, and 420 c.
  • the plurality of the winding reels 420 a, 420 b, and 420 c are rotated clockwise to be wound with the carrier tape in which the semiconductor packages are packed.
  • Movement of outer winding reels 420 a and 420 c of the winding reels 420 a, 420 b, and 420 c along the rotation axis 410 is limited by stoppers 412 a and 412 b.
  • the winding reels 420 a, 420 b, and 420 c are referred to as a first winding reel, a second winding reel, and a third winding reel, respectively.
  • the axis support member 430 supports the rotation axis 410 .
  • the axis support member 430 may include support rods 432 and a base 434 .
  • the support rods 432 may support both ends of the rotation axis 410 to rotate and may be vertically combined with a top surface of the base 434 .
  • the axis driving part 440 may rotate the rotation axis 410 and the base driving part 450 may move the base 434 straight in the second direction.
  • the base driving part 450 may be a linear motor. Additionally, the base driving part 450 may include a combined structure of a motor and a motive power transmission member converting a turning force of the motor into a linear driving force.
  • the carrier tape cut member 300 cuts the carrier tape T 1 , and the carrier tape adhesion member 100 attaches the adhesive tape T 2 on the cut carrier tape T 1 .
  • the base driving part 450 moves the base 434 straight in the second direction to align the second winding reel 420 b with the carrier tape T 1 on the transfer rail 220 .
  • the carrier tape T 1 is moved toward the second winding reel 420 b, and then the carrier tape adhesion member 100 attaches the carrier tape T 1 on the second winding reel 420 b.
  • the reel replacement member 400 replaces the first winding reel 420 a where the winding of the carrier tape T 1 is completed with the second winding reel 420 b. After the winding of the second winding reel 420 b is completed, the second winding reel 420 b may be replaced with the third winding reel 420 c by the same method described above.
  • FIG. 7 is a flowchart illustrating a detailed method of replacing a winding reel according to an example embodiment of the inventive concepts.
  • the apparatus 1 of packing the semiconductor packages illustrated in FIG. 1 operates an apparatus alarm (S 20 ) and then the apparatus 1 interrupts a process of packing the semiconductor packages (S 30 ). Subsequently, the carrier tape adhesion member 100 prepares the adhesive tape which will be stuck on the first winding reel 420 a (S 40 ).
  • the step S 40 will be described in more detail with reference to FIGS. 8A to 8D .
  • the feeder 110 provides the adhesive tape T 3 .
  • the chuck 120 chucks the end of the adhesive tape T 3 to extend the adhesive tape T 3 by a desired (or, alternatively a predetermined) length.
  • the first adhesion unit 132 picks up a left end of the desired (or, alternatively a predetermined) length of the adhesive tape T 3 and the second adhesion unit 134 picks up a right end of the desired (or, alternatively a predetermined) length of the adhesive tape T 3 .
  • FIG. 8B The adhesive tape cutter 140 cuts the adhesive tape T 3 by the desired (or, alternatively a predetermined) length.
  • FIG. 8C The chuck 120 releases the adhesive tape T 3 and the adhesive tape cutter 140 returns to an initial position.
  • the cut fixing tape T 3 maintains a picked up state by the first and second adhesion tools 132 and 134 .
  • an end of the wound carrier tape T 1 is fixed on the first winding reel 420 a by using the prepared adhesive tape T 3 (S 50 ).
  • the step S 50 will be described in more detail with reference to FIGS. 9A to 9E .
  • the carrier tape holder 320 pressurizes and holds the carrier tape T 1 wound on the first winding reel 420 a ( FIG. 9A ) and the carrier tape cutter 340 cuts the carrier tape T 1 .
  • FIG. 9B The first winding reel 420 a rotates clockwise such that the cut end portion of the carrier tape T 1 is located over the center of the first winding reel 420 a. At this time, the carrier tape cutter 340 returns to an initial position.
  • the first and second adhesion units 132 and 134 descends with picking up the adhesive tape T 3 so that the first and second adhesion units 132 and 134 stick the adhesive tape T 3 to the cut end portion of the carrier tape T 1 .
  • the cut end portion of the carrier tape T 1 is located on a center region of the adhesive tape T 3 .
  • the first and second adhesion units 132 and 134 may stick the adhesive tape T 3 to the cut end portion of the carrier tape T 1 and the outermost wound portion of the carrier tape T 1 .
  • the carrier tape holder 320 returns to an initial position.
  • the tape pressurization tool 150 pressurizes the adhesive tape T 3 so that the adhesive tape T 3 is stuck closely to the carrier tape T 1 .
  • FIG. 9E The tape pressurization tool 150 pressurizes the adhesive tape T 3 so that the adhesive tape T 3 is stuck closely to the carrier tape T 1 .
  • the first winding reel 420 a is replaced with the second winding reel 420 b (S 60 ) and the carrier tape adhesion member 100 prepares a adhesive tape which will be stuck on the second winding reel 420 b (S 70 ).
  • the step S 70 may be substantially the same as the step S 40 . Thus, the detail description for the step S 70 is omitted.
  • a front end of the carrier tape T 1 which will be wound, is attached to the second winding reel 420 b by using the prepared adhesive tape T 3 (S 80 ).
  • the step S 80 will be described in more detail with reference to FIGS. 10 A to 10 E.
  • the guide 240 proceeds toward the second winding reel 420 b and supports the carrier tape T 1 passing through the end portion of the transfer rail 220 .
  • FIG. 10A The first and second adhesion units 132 and 134 descend with picking up the adhesive tape T 3 so that the first and second adhesion units 132 and 134 attach the adhesive tape T 3 to the carrier tape T 1 .
  • the front end of the carrier tape T 1 is located on a center region of the fixing tape T 3 .
  • the first and second adhesion units 132 and 134 attach the adhesive tape T 3 to the carrier tape T 1 so that a region of the carrier tape T 1 is overlapped with a region of the adhesive tape T 3 .
  • the guide 240 returns to an initial position.
  • FIG. 10C The first and second adhesion units 132 and 134 descends toward the second winding reel 420 b so that the first and second adhesion units 132 and 134 attach the rest region of the adhesive tape T 3 that does not overlap with the carrier tape T 1 to a center portion of the second winding reel 420 b (i.e., hub (not shown)).
  • FIG. 10B The guide 240 returns to an initial position.
  • FIG. 10C The first and second adhesion units 132 and 134 descends toward the second winding reel 420 b so that the first and second adhesion units 132 and 134 attach the rest region of the adhesive tape T 3 that does not overlap with the carrier tape T 1 to a center portion of the second winding reel 420 b (
  • FIG. 10D The tape pressurization tool 150 descends toward the second winding reel 420 b so that the tape pressurization tool 150 pressurizes the adhesive tape T 3 to attach the adhesive tape T 3 closely to the center portion of the second winding reel 420 b (i.e., hub (not shown)).
  • FIG. 10E The tape pressurization tool 150 descends toward the second winding reel 420 b so that the tape pressurization tool 150 pressurizes the adhesive tape T 3 to attach the adhesive tape T 3 closely to the center portion of the second winding reel 420 b (i.e., hub (not shown)).
  • the apparatus 1 of packing the semiconductor packages restarts the process packing the semiconductor packages (S 90 ).
  • the apparatus 1 of packing the semiconductor packages according to example embodiments of the inventive concepts can replace the winding reels automatically.
  • the packing process using the apparatus of packing the semiconductor packages according to the example embodiment of the inventive concepts may improve work efficiency and productivity as compared with a conventional manual packing semiconductor packages.

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Abstract

Carrier tape winding units and apparatuses of packing semiconductor package are provided. An exemplary carrier tape winding unit may include a carrier tape adhesion member attaching a front end of a carrier tape before winding or a cut back end of the carrier tape after a completion of winding the carrier tape to a winding reel. The exemplary carrier tape winding unit may further include a reel replacement member that automatically replaces the winding reel with another one after the completion of winding the carrier tape to the winding reel on a rotation axis by movement of a rotation axis and an axis support member in a direction. This direction is perpendicular to a transfer direction of the carrier tape toward the winding reel.

Description

    CROSS-REFERENCE TO RELATED APPLICATIONS
  • This U.S. non-provisional patent application claims priority under 35 U.S.C. §119 to Korean Patent Application No. 10-2011-0097033, filed on Sep. 26, 2011, in the Korean Intellectual Property Office (KIPO), the entirety of which is incorporated by reference herein.
  • BACKGROUND
  • 1. Field
  • The inventive concepts relate to a carrier tape winding unit and/or an apparatus of packing a semiconductor package and, more particularly, to a carrier tape winding unit winding a carrier tape in which semiconductor packages are received and/or an apparatus having the same of packing a semiconductor package.
  • 2. Description of the Related Art
  • Semiconductor packages may be individualized through semiconductor manufacturing processes and then may be tested. Thereafter, the semiconductor packages may be received into a packing container to be shipped to the outside. The packing container may prevent the semiconductor packages from being physically damaged by an external impact and prevent integrated circuits of the semiconductor packages from being electrically damaged by static electricity. A tray, a tube, or a carrier tape, which is formed of a resin material containing a conductive material, may be desirably used as the packing container. The carrier tape may have a pocket for the semiconductor package. The pocket provided with the semiconductor package may be sealed by a thin and transparent cover tape. The carrier tape having the pocket sealed by the cover tape may be wound round a winding reel.
  • SUMMARY
  • Example embodiments of the inventive concepts may provide a carrier tape winding unit capable of replacing a winding reel automatically and/or an apparatus of packing a semiconductor package having the same.
  • According to an example embodiment, a carrier tape winding unit may include a winding reel and a carrier tape adhesion member configured to attach a front end of a carrier tape before winding the carrier tape to the winding reel and configured to attach a back end of the carrier tape after a completion of the winding.
  • The carrier tape adhesion member may include a tape adhesion unit configured to pick up an adhesive tape cut to a length. The tape adhesion unit may be configured to attach the adhesive tape to the front end of the carrier tape and the winding reel and may be configured to attach the adhesive tape to the back end of the carrier tape and an outer wound portion of the carrier tape.
  • The carrier tape adhesion member may further includes a tape pressurization tool configured to pressurize the adhesive tape to contact the carrier tape.
  • The carrier tape adhesion member may further include a feeder configured to provide the adhesive tape, a chuck configured to chuck a front end of the adhesive tape provided by the feeder to extend the adhesive tape in a length direction, and an adhesive tape cutter configured to cut the adhesive tape extended by the chuck to the length.
  • The tape adhesion unit may include a first adhesion unit adjacent to the winding reel and configured to pick up one end of the adhesive tape; and a second adhesion unit spaced apart from the first adhesion unit in a horizontal direction and configured to pick up another end of the adhesive tape.
  • The carrier tape winding unit may further include a carrier tape transfer member configured to transfer the carrier tape to the winding reel. The carrier tape transfer member may include a transfer rail configured to guide a transfer of the carrier tape, and a guide under the transfer rail. The guide may protrude into a space between an end portion of the transfer rail and the winding reel to support the front end of the carrier tape escaping from the transfer rail. The first and second adhesion units may be configured to attach the one end of the adhesive tape to the carrier tape to locate a center region of the adhesive tape on the front end of the carrier tape supported by the guide. The first and second adhesion units may be configured to attach the another end of the adhesive tape to the winding reel after the guide goes back.
  • The carrier tape winding unit may further include a carrier tape cut member configured to cut the carrier tape after the completion of winding the carrier tape on the winding reel. The carrier tape cut member may include a carrier tape holder configured to pressurize and hold the carrier tape to prevent the carrier tape wound round the winding reel from being unwound, and a carrier tape cutter configured to cut the carrier tape held by the carrier tape holder. The first and second adhesion units may be configured to attach the adhesive tape on the carrier tape to locate a center region of the adhesive tape on the back end of the carrier tape.
  • The carrier tape winding unit may further include a transfer rail extending in a first direction being a transfer direction of the carrier tape toward the winding reel and configured to guide the carrier tape transferred to the winding reel, and a reel replacement member configured to replace the winding reel with another one after the completion of winding the carrier tape to the winding reel.
  • The reel replacement member may include a rotation axis being able to rotate, an axis of the rotation axis aligned with a second direction perpendicular to the first direction, an axis support member configured to support the rotation axis, and a driving part configured to move the axis support member in the second direction. The winding reel may be provided in plural on the rotation axis. The winding reel may be replaceable with another winding reel on the rotation axis by movement of the rotation axis and the axis support member in the second direction.
  • According to an example embodiment, an apparatus of packing a semiconductor package may include a carrier tape supply unit configured to provide a carrier tape, a semiconductor package packing unit configured to pack a semiconductor package in the carrier tape by putting the semiconductor package into a pocket of the carrier tape and bonding a cover tape on a top surface of the carrier tape, and a carrier tape winding unit configured to wind the packed carrier tape. The carrier tape winding unit may include a winding reel configured to wind the packed carrier tape, and a carrier tape adhesion member configured to attach a front end of the packed carrier tape before winding the carrier tape to the winding reel and configured to attach a back end of the packed carrier tape after the completion of winding the carrier tape.
  • The carrier tape adhesion member may include a first adhesion unit over the winding reel and configured to pick up one end of an adhesive tape cut to a length; and a second adhesion unit spaced apart from the first adhesion unit in a horizontal direction and configured to pick another end of the adhesive tape. The first and second adhesion units may be configured to attach the adhesive tape to the front end of the packed carrier tape and the winding reel and may be configured to attach the adhesive tape to the back end of the packed carrier tape and an outer wound portion of the carrier tape.
  • The apparatus may further include a transfer rail guiding a transfer of the packed carrier tape, and a guide under the transfer rail, the guide protruding into a space between an end portion of the transfer rail and the winding reel to support the front end of the packed carrier tape escaping from the transfer rail. The first and second adhesion tools may be configured to attach the one end of the adhesive tape to the packed carrier tape such that a center region of the adhesive tape is on the front end of the packed carrier tape supported by the guide. The first and second adhesion units may be configured to attach the another end of the adhesive tape to the winding reel after the guide goes back.
  • The apparatus may further include a carrier tape holder configured to pressurize and hold the packed carrier tape to prevent the packed carrier tape wound round the winding reel from being unwound after winding the packed carrier tape on the winding reel is finished, and a carrier tape cutter configured to cut the packed carrier tape held by the carrier tape holder. The first and second adhesion units may be configured to attach the adhesive tape on the packed carrier tape to locate a center region of the adhesive tape on the back end of the packed carrier tape.
  • The carrier tape adhesion member may further include a feeder configured to provide the fixing tape, a chuck configured to chuck a front end of the adhesive tape provided by the feeder to extend the adhesive tape in a length direction; and an adhesive tape cutter configured to cut the adhesive tape extended by the chuck to the length.
  • The apparatus may further include a transfer rail configured to extend in a first direction being a transfer direction of the packed carrier tape toward the winding reel and configured to guide the carrier tape transferred to the winding reel, and a reel replacement member configured to replace the winding reel after the completion of winding the carrier tape to the winding reel. The reel replacement member may include a rotation axis being able to rotate, an axis of the rotation axis aligned with a second direction perpendicular to the first direction, an axis support member configured to support the rotation axis, and a driving part configured to move the axis support member in the second direction. The winding reel may be provided in plural on the rotation axis. After the completion of, the winding reel may be replaceable with another winding reel on the rotation axis by movement of the rotation axis and the axis support member in the second direction.
  • According to an example embodiment, an apparatus of packing a semiconductor package may include a winding reel, a transfer rail configured to guide a transfer of a carrier tape to the winding reel, a guide under the transfer rail, the guide protruding into a space between an end portion of the transfer rail and the winding reel to support a portion of the carrier tape escaping from the transfer rail, a carrier tape holder configured to hold the carrier tape wound on the winding reel, and a carrier tape cutter configured to cut the carrier tape held by the carrier tape holder form a back end of the carrier tape at a location between an end portion of the transfer rail and a top or a bottom of a circumference surface of the winding reel.
  • The guide may be configured to proceed toward the winding reel and support the carrier tape passing through the end portion of the transfer rail to introduce a front end of the carrier tape on the winding reel.
  • The apparatus of packing a semiconductor package may further include a carrier tape adhesion member configured to attach an adhesive tape to front end of the carrier tape before winding the carrier tape to the winding reel. A region of the carrier tape may include the front end of the carrier tape overlaps with a region of the adhesive tape.
  • The apparatus of packing a semiconductor package may further include a carrier tape adhesion member configured to attach an adhesive tape to the back end of the carrier tape after a completion of winding the carrier tape to the winding reel. The back end of the carrier tape is located approximately on a center region of the adhesive tape.
  • The guide may be configured to not proceed toward the winding reel after a completion of winding the carrier tape to the winding reel.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • Example embodiments will be more clearly understood from the following brief description taken in conjunction with the accompanying drawings. FIGS. 1-10 represent non-limiting, example embodiments as described herein.
  • FIG. 1 is a schematic view illustrating an apparatus of packing a semiconductor package according to an example embodiments of the inventive concepts;
  • FIG. 2 is a schematic view illustrating a method of receiving a semiconductor package in a pocket of a carrier tape of FIG. 1;
  • FIG. 3 is an enlarged view of the carrier tape winding unit of FIG. 1;
  • FIG. 4 is a cross-sectional view taken along a line A-A′ of FIG. 3;
  • FIG. 5 is a plan view illustrating a reel replacement member of FIG. 3;
  • FIG. 6 is a schematic view illustrating an operation replacing a winding reel by a reel replacement member;
  • FIG. 7 is a flowchart illustrating a detailed method of replacing a winding reel according to an example embodiment of the inventive concepts;
  • FIGS. 8A to 8D are schematic views illustrating a method of preparing an adhesive tape according to an example embodiments of the inventive concepts;
  • FIGS. 9A to 9E are schematic views illustrating a method of attaching a cut back end of a carrier tape, after a winding is completed, on a winding reel by using an adhesive tape according to an example embodiments of the inventive concepts; and
  • FIGS. 10A to 10E are schematic views illustrating a method of attaching a front of a carrier tape, before a winding is started, on a winding reel by using an adhesive tape according to an example embodiments of the inventive concepts.
  • It should be noted that these drawings are intended to illustrate the general characteristics of structure and/or methods utilized in certain example embodiments and to supplement the written description provided below. These drawings are not, however, to scale and may not precisely reflect the precise structural or performance characteristics of any given embodiment, and should not be interpreted as defining or limiting the range of values or properties encompassed by example embodiments. For example, the relative thicknesses and positioning of molecules, layers, regions and/or structural elements may be reduced or exaggerated for clarity. The use of similar or identical reference numbers in the various drawings is intended to indicate the presence of a similar or identical element or feature.
  • DETAILED DESCRIPTION OF THE EMBODIMENTS
  • Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those of ordinary skill in the art. In the drawings, the thicknesses of layers and regions are exaggerated for clarity. Like reference numerals in the drawings denote like elements, and thus their description will be omitted.
  • It will be understood that when an element is referred to as being “connected” or “coupled” to another element, it can be directly connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being “directly connected” or “directly coupled” to another element, there are no intervening elements present. Like numbers indicate like elements throughout. As used herein the term “and/or” includes any and all combinations of one or more of the associated listed items. Other words used to describe the relationship between elements or layers should be interpreted in a like fashion (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” “on” versus “directly on”).
  • It will be understood that, although the terms “first”, “second”, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of example embodiments.
  • Spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the exemplary term “below” can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
  • The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments. As used herein, the singular forms “a,” “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises”, “comprising”, “includes” and/or “including,” if used herein, specify the presence of stated features, integers, steps, operations, elements and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and/or groups thereof.
  • Example embodiments are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments (and intermediate structures) of example embodiments. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, example embodiments should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an implanted region illustrated as a rectangle may have rounded or curved features and/or a gradient of implant concentration at its edges rather than a binary change from implanted to non-implanted region. Likewise, a buried region formed by implantation may result in some implantation in the region between the buried region and the surface through which the implantation takes place. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of example embodiments.
  • Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which example embodiments belong. It will be further understood that terms, such as those defined in commonly-used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
  • FIG. 1 is a schematic view illustrating an apparatus of packing a semiconductor package according to an example embodiment of the inventive concepts, and FIG. 2 is a schematic view illustrating a method of receiving a semiconductor package in a pocket of a carrier tape of FIG. 1.
  • Referring to FIGS. 1 and 2, an apparatus 1 of packing a semiconductor package according to the example embodiments may include a carrier tape supply unit 10, a semiconductor package packing unit 20, and a carrier tape winding unit 30.
  • The carrier tape supply unit 10 supplies a carrier tape T1 to the semiconductor package packing unit 20. The semiconductor package packing unit 20 packs a semiconductor package in the carrier tape T1. The carrier tape winding unit 30 winds the carrier tape T1 in which the semiconductor package is packed.
  • The carrier tape supply unit 10 includes a carrier tape supply reel 12 and a reel driving part (not shown). The carrier tape T1 is wound round the carrier tape supply reel 12. The carrier tape T1 may be formed of a resin material containing a conductive material. The reel driving part (not shown) rotates the carrier tape supply reel 12. When the carrier tape supply reel 12 is rotated clockwise by the reel driving part, the carrier tape T1 may be unwound from the carrier tape supply reel 12.
  • The carrier tape T1 may have a plurality of pockets P receiving a plurality of the semiconductor packages PKG. The plurality of pockets P may be formed along a longitudinal direction of the carrier tape T1 by equal intervals. Transfer holes H, which are used for transferring the carrier tape T1, may be formed at both edge regions of the pockets P to be arranged in lines. Protrusions 231 of a sprocket 230 described later are inserted in the transfer holes H. The sprocket 230 and the protrusions 231 are illustrated in FIG. 4. Due to a rotation of the sprocket 230, the protrusions 231 are inserted in the transfer holes H and then the protrusion 231 push sidewalls of the transfer holes H to get out from the transfer holes H. According to these operations, the carrier tape T1 is moved straight toward the semiconductor package packing unit 20. The movement of the carrier tape T1 may also be guided by a transfer rail 21.
  • The semiconductor package packing unit 20 includes a picker 22, a cover tape supply reel 24, an upper heating roller 26 a, and a lower heating roller 26 b. The picker 22 picks up the semiconductor package PKG and then puts the semiconductor package PKG in the pocket P of the carrier tape T1. The picker 22 may pick up the semiconductor package PKG by a vacuum suction method. The cover tape supply reel 24 may disposed over the carrier tape T1. A cover tape T2 is wound round the cover tape supply reel 24. The cover tape T2 may be formed of a resin material containing a conductive material. When the cover tape supply reel 24 is rotated counterclockwise by a reel driving part (not shown), the cover tape T2 may be unwound from the cover tape supply reel 24.
  • The upper heating roller 26 a is disposed on the carrier tape T1 and the lower heating roller 26 b is disposed under the carrier tape T1 to face the upper heating roller 26 a. The carrier tape T1 and the cover tape T2 are disposed between the upper heating roller 26 a and the lower heating roller 26 b. The upper and lower heating rollers 26 a and 26 b bond the cover tape T2 on the carrier tape T1 in thermo-compression. A groove (not shown) may be formed in the lower heating roller 26 b so that the pocket P of the carrier tape T1 may not be in contact with the lower heating roller 26 b. Heat blocks may be replaced with the upper and lower heating roller 26 a and 26 b. The heat blocks may move in up and down directions to bond the cover tape T2 to the carrier tape T1 using thermocompression.
  • The carrier tape winding unit 30 includes a carrier tape adhesion member 100, a carrier tape transfer member 200, a carrier tape cut member 300, and a reel replacement member 400.
  • FIG. 3 is an enlarged view of the carrier tape winding unit of FIG. 1, and FIG. 4 is a cross-sectional view taken along a line A-A′ of FIG. 3. Referring to FIGS. 3 and 4, the carrier tape adhesion member 100 include feeder 110, a chuck 120, a tape adhesion tool 130, an adhesive tape cutter 140, and an adhesive tape pressurization tool 150.
  • The feeder 110 may be disposed over and on the right of a winding reel 420. A adhesive tape T3 is wound round the feeder 110. When the feeder 110 is rotated counterclockwise by a driving part (not shown), the adhesive tape T3 may be unwound from the feeder 110.
  • The chuck 120 may be disposed over and on the left of the winding reel 420 a to face the feeder 110. The chuck 120 may move straight toward the feeder 110 to chuck the front of the fixing tape T3 unwound from the feeder 110. For example, the chuck 120 may move straight in a direction far away from the feeder 110 to extend the chucked fixing tape T3 in length.
  • The tape adhesion tool 130 includes a first adhesion tool 132 and a second adhesion tool 134. The first adhesion unit 132 and the second adhesion unit 134 are disposed between the feeder 110 and the chuck 120 and are spaced apart from each other by a desired (or, alternatively a predetermined) interval in a horizontal direction. The first adhesion unit 132 picks up one end of a portion having a desired (or, alternatively a predetermined) length of the fixing tape T3 and the second adhesion unit 134 picks up another end of the portion having the desired (or, alternatively a predetermined) length of the fixing tape T3. The first and second adhesion units 132 and 134 may pick up the fixing taper T3 by a vacuum suction method. The portion having the desired (or, alternatively a predetermined) length of the fixing tape T3 may be cut from the fixing tape T3 by the adhesive tape cutter 140 in the state that the first and second adhesion units 132 and 134 pick up the portion having the desired (or, alternatively a predetermined) length of the adhesive tape T3.
  • The first and second adhesion units 132 and 134 may move in up and down directions. In the state that the first and second adhesion units 132 and 134 pick up the cut adhesive tape T3 (i.e., the cut portion having the desired (or, alternatively a predetermined) length of the adhesive tape T3), the first and second adhesion units 132 and 134 descend to bond the cut adhesive tape T3 to the winding reel 420 a. In more detail, the first and second adhesion units 132 and 134 may bond the front end of the carrier tape T1 to the winding reel 420 a before a wind of the winding reel 420 a is started. The first and second adhesion units 132 and 134 may attach a cut back end of the carrier tape T1 to the winding reel 420 a or the outermost wound portion of the carrier tape T1 after the winding of the winding reel 420 a is completed. This will be described in more detail later.
  • The tape pressurization tool 150 may be disposed between the first adhesion unit 132 and the second adhesion unit 134. The tape pressurization tool 150 may include a body 152 and a pressurization part 154. The pressurization part 154 is a combination of a bottom surface of the body 152 and a pressurization curved surface 155 having an upward concave shape 155 formed on a bottom surface of the pressurization part 154. The tape pressurization tool 150 may move in up and down directions. The tape pressurization tool 150 descends toward the winding reel 420 a so that the pressurization curved surface 155 pressurizes the adhesive tape T3. An adhesion force of the adhesive tape T3 may be improved by the pressurization force of the tape pressurization tool 150.
  • The carrier tape transfer member 200 transfers the carrier tape T1 to the winding reel 420 a. The carrier tape transfer member 200 includes a transfer rail 220, the sprocket 230, and a guide 240.
  • As illustrated in FIG. 4, the transfer rail 220 includes a rail part 222 and grippers 224. The rail part 222 extends in a first direction which is the transfer direction of the carrier tape T1 toward the winding reel 420 a. The rail part 222 guides the carrier tape T1 to be transferred toward the winding reel 420 a. A pair of guide sills 223 are formed on a top surface of the rail part 222. Both edge portions of the carrier tape T1 are safely mounted on the pair of guide sills 223, respectively. The guide grippers 224 are disposed over the guide sills 223 to prevent the carrier tape T1 from breaking away from the transfer rail 220.
  • The sprocket 230 is disposed over the rail part 222 to transfer the carrier tape T1. The sprocket 230 may penetrate the guide gripper 224 and be disposed over the guide sill 223. A plurality of protrusions 231 are formed on a circumferential surface of the sprocket 230. The plurality of protrusions 231 are inserted in the transfer holes H of the carrier tape T1 by the rotation of the sprocket 230 and then the protrusions 231 push sidewalls of the transfer holes H to get out from the transfer holes H. According to these operations, the carrier tape T1 moves straight toward the winding reel 420 a. The sprocket 230 may be intermittently rotated by a driving part 232 for a step movement of the carrier tape T1. For example, the driving part 232 may be a step motor.
  • The guide 240 is disposed under the transfer rail 220. The guide 240 may go ahead and back in a longitudinal direction of the transfer rail 220. The guide 240 goes ahead to a space between an end portion of the transfer rail 220 and the winding reel 420 a and supports the carrier tape T1 passing through the end portion of the transfer rail 220.
  • The carrier tape cut member 300 cuts the carrier tape T1 after the wind of the carrier tape T1 on the winding reel 420 a is completed. The carrier tape cut member 300 includes a carrier tape holder 320 and a carrier tape cutter 340. The carrier tape holder 320 pressurizes and holds the carrier tape T1 to prevent the carrier tape T1 wound on the winding reel 420 a from being unwound. For example, the carrier tape holder 320 may pressurize the carrier tape T1 wound in a first quadrant with respect to a center of the winding reel 420 a. The carrier tape cutter 340 may be disposed between the transfer rail 220 and the winding reel 420 a. The carrier tape cutter 340 cuts the carrier tape T1 held by the carrier tape holder 320. For example, the carrier tape cutter 340 may cut the carrier tape T1 at any location between the end portion of the transfer rail 220 and the top of a circumferential surface of the winding reel 420 a.
  • FIG. 5 is a plan view illustrating the reel replacement member of FIG. 3 and FIG. 6 is a schematic view illustrating an operation replacing a winding reel by a reel replacement member.
  • Referring to FIGS. 3, 5, and 6, the reel replacement member 400 replaces the winding reel 420 a where winding of the carrier tape T1 is completed with a new winding reel 420 b. Additionally, after winding of the winding reel 420 b is completed, the reel replacement member 400 may replace the winding reel 420 b with another new winding reel 420 c again. The reel replacement member 400 includes a rotation axis 410, an axis support member 430, an axis driving part 440, and a base driving part 450.
  • The rotation axis 410 is separated from the end portion of the transfer rail 220 in the transfer direction (hereinafter, referred to as ‘a first direction’) of the carrier tape T1. An axis of the rotation axis 410 is aligned in a second direction perpendicular to the first direction in a plan view, as illustrated in FIG. 5. The rotation axis 410 may be provided with a plurality of the winding reels 420 a, 420 b, and 420 c. The plurality of the winding reels 420 a, 420 b, and 420 c are rotated clockwise to be wound with the carrier tape in which the semiconductor packages are packed. Movement of outer winding reels 420 a and 420 c of the winding reels 420 a, 420 b, and 420 c along the rotation axis 410 is limited by stoppers 412 a and 412 b. Hereinafter, the winding reels 420 a, 420 b, and 420 c are referred to as a first winding reel, a second winding reel, and a third winding reel, respectively.
  • The axis support member 430 supports the rotation axis 410. The axis support member 430 may include support rods 432 and a base 434. The support rods 432 may support both ends of the rotation axis 410 to rotate and may be vertically combined with a top surface of the base 434. The axis driving part 440 may rotate the rotation axis 410 and the base driving part 450 may move the base 434 straight in the second direction. The base driving part 450 may be a linear motor. Additionally, the base driving part 450 may include a combined structure of a motor and a motive power transmission member converting a turning force of the motor into a linear driving force.
  • After winding of the first winding reel 420 a is completed, the carrier tape cut member 300 cuts the carrier tape T1, and the carrier tape adhesion member 100 attaches the adhesive tape T2 on the cut carrier tape T1. Thereafter, the base driving part 450 moves the base 434 straight in the second direction to align the second winding reel 420 b with the carrier tape T1 on the transfer rail 220. After the second winding reel 420 b is aligned with the carrier tape T1, the carrier tape T1 is moved toward the second winding reel 420 b, and then the carrier tape adhesion member 100 attaches the carrier tape T1 on the second winding reel 420 b. As described above, the reel replacement member 400 replaces the first winding reel 420 a where the winding of the carrier tape T1 is completed with the second winding reel 420 b. After the winding of the second winding reel 420 b is completed, the second winding reel 420 b may be replaced with the third winding reel 420 c by the same method described above.
  • FIG. 7 is a flowchart illustrating a detailed method of replacing a winding reel according to an example embodiment of the inventive concepts.
  • After the winding of the first winding reel 420 a is completed (S10), the apparatus 1 of packing the semiconductor packages illustrated in FIG. 1 operates an apparatus alarm (S20) and then the apparatus 1 interrupts a process of packing the semiconductor packages (S30). Subsequently, the carrier tape adhesion member 100 prepares the adhesive tape which will be stuck on the first winding reel 420 a (S40).
  • The step S40 will be described in more detail with reference to FIGS. 8A to 8D. The feeder 110 provides the adhesive tape T3. The chuck 120 chucks the end of the adhesive tape T3 to extend the adhesive tape T3 by a desired (or, alternatively a predetermined) length. (FIG. 8A) The first adhesion unit 132 picks up a left end of the desired (or, alternatively a predetermined) length of the adhesive tape T3 and the second adhesion unit 134 picks up a right end of the desired (or, alternatively a predetermined) length of the adhesive tape T3. (FIG. 8B) The adhesive tape cutter 140 cuts the adhesive tape T3 by the desired (or, alternatively a predetermined) length. (FIG. 8C) The chuck 120 releases the adhesive tape T3 and the adhesive tape cutter 140 returns to an initial position. The cut fixing tape T3 maintains a picked up state by the first and second adhesion tools 132 and 134. (FIG. 8D)
  • Referring to FIG. 7 again, an end of the wound carrier tape T1 is fixed on the first winding reel 420 a by using the prepared adhesive tape T3 (S50).
  • The step S50 will be described in more detail with reference to FIGS. 9A to 9E. The carrier tape holder 320 pressurizes and holds the carrier tape T1 wound on the first winding reel 420 a (FIG. 9A) and the carrier tape cutter 340 cuts the carrier tape T1. (FIG. 9B) The first winding reel 420 a rotates clockwise such that the cut end portion of the carrier tape T1 is located over the center of the first winding reel 420 a. At this time, the carrier tape cutter 340 returns to an initial position. (FIG. 9C) The first and second adhesion units 132 and 134 descends with picking up the adhesive tape T3 so that the first and second adhesion units 132 and 134 stick the adhesive tape T3 to the cut end portion of the carrier tape T1. At this time, the cut end portion of the carrier tape T1 is located on a center region of the adhesive tape T3. In other words, the first and second adhesion units 132 and 134 may stick the adhesive tape T3 to the cut end portion of the carrier tape T1 and the outermost wound portion of the carrier tape T1. At this time, the carrier tape holder 320 returns to an initial position. (FIG. 9D) The tape pressurization tool 150 pressurizes the adhesive tape T3 so that the adhesive tape T3 is stuck closely to the carrier tape T1. (FIG. 9E)
  • Referring to FIG. 7 again, the first winding reel 420 a is replaced with the second winding reel 420 b (S60) and the carrier tape adhesion member 100 prepares a adhesive tape which will be stuck on the second winding reel 420 b (S70). The step S70 may be substantially the same as the step S40. Thus, the detail description for the step S70 is omitted. A front end of the carrier tape T1, which will be wound, is attached to the second winding reel 420 b by using the prepared adhesive tape T3 (S80).
  • The step S80 will be described in more detail with reference to FIGS. 10 A to 10E. The guide 240 proceeds toward the second winding reel 420 b and supports the carrier tape T1 passing through the end portion of the transfer rail 220. (FIG. 10A) The first and second adhesion units 132 and 134 descend with picking up the adhesive tape T3 so that the first and second adhesion units 132 and 134 attach the adhesive tape T3 to the carrier tape T1. At this time, the front end of the carrier tape T1 is located on a center region of the fixing tape T3. In other words, the first and second adhesion units 132 and 134 attach the adhesive tape T3 to the carrier tape T1 so that a region of the carrier tape T1 is overlapped with a region of the adhesive tape T3. (FIG. 10B) The guide 240 returns to an initial position. (FIG. 10C) The first and second adhesion units 132 and 134 descends toward the second winding reel 420 b so that the first and second adhesion units 132 and 134 attach the rest region of the adhesive tape T3 that does not overlap with the carrier tape T1 to a center portion of the second winding reel 420 b (i.e., hub (not shown)). (FIG. 10D) The tape pressurization tool 150 descends toward the second winding reel 420 b so that the tape pressurization tool 150 pressurizes the adhesive tape T3 to attach the adhesive tape T3 closely to the center portion of the second winding reel 420 b (i.e., hub (not shown)). (FIG. 10E)
  • Referring to FIG. 7 again, the apparatus 1 of packing the semiconductor packages restarts the process packing the semiconductor packages (S90).
  • As described above, the apparatus 1 of packing the semiconductor packages according to example embodiments of the inventive concepts can replace the winding reels automatically. Thus, the packing process using the apparatus of packing the semiconductor packages according to the example embodiment of the inventive concepts may improve work efficiency and productivity as compared with a conventional manual packing semiconductor packages.
  • While example embodiments have been particularly shown and described, it will be understood by one of ordinary skill in the art that variations in form and detail may be made therein without departing from the spirit and scope of the claims. Therefore, it should be understood that the above embodiments are not limiting, but illustrative. Thus, the scope of the inventive concept is to be determined by the broadest permissible interpretation of the following claims and their equivalents, and shall not be restricted or limited by the foregoing description.

Claims (20)

What is claimed is:
1. A carrier tape winding unit comprising:
a winding reel; and
a carrier tape adhesion member configured to attach a front end of a carrier tape before winding the carrier tape to the winding reel and configured to attach a back end of the carrier tape after a completion of the winding.
2. The carrier tape winding unit of claim 1, wherein the carrier tape adhesion member comprises:
a tape adhesion unit configured to pick up an adhesive tape cut to a length, the tape adhesion unit configured to attach the adhesive tape to the front end of the carrier tape and the winding reel and configured to attach the adhesive tape to the back end of the carrier tape and an outer wound portion of the carrier tape.
3. The carrier tape winding unit of claim 2, wherein the carrier tape adhesion member further comprises a tape pressurization tool configured to pressurize the adhesive tape to contact the carrier tape.
4. The carrier tape winding unit of claim 2, wherein the carrier tape adhesion member further comprises:
a feeder configured to provide the adhesive tape;
a chuck configured to chuck a front end of the adhesive tape provided by the feeder to extend the adhesive tape in a length direction; and
an adhesive tape cutter configured to cut the adhesive tape extended by the chuck to the length.
5. The carrier tape winding unit of claim 2, wherein the tape adhesion unit comprises:
a first adhesion unit adjacent to the winding reel, the first adhesion unit configured to pick up one end of the adhesive tape; and
a second adhesion unit spaced apart from the first adhesion unit in a horizontal direction, the second adhesion unit configured to pick up another end of the adhesive tape.
6. The carrier tape winding unit of claim 5, further comprising:
a carrier tape transfer member configured to transfer the carrier tape to the winding reel, the carrier tape transfer member including
a transfer rail configured to guide a transfer of the carrier tape; and
a guide under the transfer rail, the guide protruding into a space between an end portion of the transfer rail and the winding reel to support the front end of the carrier tape escaping from the transfer rail,
wherein the first and second adhesion units are configured to attach the one end of the adhesive tape to the carrier tape to locate a center region of the adhesive tape on the front end of the carrier tape supported by the guide, and
wherein the first and second adhesion units are configured to attach the another end of the adhesive tape to the winding reel after the guide goes back.
7. The carrier tape winding unit of claim 5, further comprising:
a carrier tape cut member configured to cut the carrier tape after the completion of winding the carrier tape on the winding reel, the carrier tape cut member including
a carrier tape holder configured to pressurize and hold the carrier tape to prevent the carrier tape wound round the winding reel from being unwound; and
a carrier tape cutter configured to cut the carrier tape held by the carrier tape holder,
wherein the first and second adhesion units are configured to attach the adhesive tape on the carrier tape to locate a center region of the adhesive tape on the back end of the carrier tape.
8. The carrier tape winding unit of claim 1, further comprising:
a transfer rail extending in a first direction being a transfer direction of the carrier tape toward the winding reel, the transfer rail configured to guide the carrier tape transferred to the winding reel; and
a reel replacement member configured to replace the winding reel with another one after the completion of winding the carrier tape to the winding reel.
9. The carrier tape winding of claim 8, wherein the reel replacement member comprises:
a rotation axis being able to rotate, an axis of the rotation axis aligned with a second direction perpendicular to the first direction;
an axis support member configured to support the rotation axis, and
a driving part configured to move the axis support member in the second direction,
wherein the winding reel is provided in plural on the rotation axis, and
wherein the winding reel is replaceable with another winding reel on the rotation axis by movement of the rotation axis and the axis support member in the second direction.
10. An apparatus of packing a semiconductor package, comprising:
a carrier tape supply unit configured to provide a carrier tape;
a semiconductor package packing unit configured to pack a semiconductor package in the carrier tape by putting the semiconductor package into a pocket of the carrier tape and bonding a cover tape on a top surface of the carrier tape; and
a carrier tape winding unit configured to wind the packed carrier tape, the carrier tape winding unit including,
a winding reel configured to wind the packed carrier tape, and
a carrier tape adhesion member configured to attach a front end of the packed carrier tape before winding the carrier tape to the winding reel and configured to attach a back end of the packed carrier tape after the completion of winding the carrier tape.
11. The apparatus of claim 10, wherein the carrier tape adhesion member comprises:
a first adhesion unit over the winding reel and configured to pick up one end of a adhesive tape cut to a length; and
a second adhesion unit spaced apart from the first adhesion unit in a horizontal direction and configured to pick another end of the adhesive tape,
wherein the first and second adhesion units are configured to attach the adhesive tape to the front end of the packed carrier tape and the winding reel and are configured to attach the adhesive tape to the back end of the packed carrier tape and an outer wound portion of the carrier tape.
12. The apparatus of claim 11, further comprising:
a transfer rail configured to guide a transfer of the packed carrier tape; and
a guide under the transfer rail, the guide protruding into a space between an end portion of the transfer rail and the winding reel to support the front end of the packed carrier tape escaping from the transfer rail,
wherein the first and second adhesion units are configured to attach the one end of the adhesive tape to the packed carrier tape such that a center region of the adhesive tape is on the front end of the packed carrier tape supported by the guide; and
wherein the first and second adhesion units are configured to attach the another end of the adhesive tape to the winding reel after the guide goes back.
13. The apparatus of claim 11, further comprising:
a carrier tape holder configured to pressurize and hold the packed carrier tape to prevent the packed carrier tape wound round the winding reel from being unwound after winding the packed carrier tape on the winding reel is finished; and
a carrier tape cutter configured to cut the packed carrier tape held by the carrier tape holder,
wherein the first and second adhesion units are configured to attach the adhesive tape on the packed carrier tape to locate a center region of the adhesive tape on the cut back end of the packed carrier tape.
14. The apparatus of claim 11, wherein the carrier tape adhesion member further comprises:
a feeder configured to provide the fixing tape;
a chuck configured to chuck a front end of the adhesive tape provided by the feeder to extend the adhesive tape in a length direction; and
an adhesive tape cutter configured to cut the adhesive tape extended by the chuck to the length.
15. The apparatus of claim 10, further comprising:
a transfer rail configured to extend in a first direction being a transfer direction of the packed carrier tape toward the winding reel and configured to guide the carrier tape transferred to the winding reel; and
a reel replacement member configured to replace the winding reel after the completion of winding the carrier tape to the winding reel,
wherein the reel replacement member including,
a rotation axis being able to rotate, an axis of the rotation axis aligned with a second direction perpendicular to the first direction,
an axis support member configured to support the rotation axis,
a driving part configured to move the axis support member in the second direction,
wherein the winding reel is provided in plural on the rotation axis, and
wherein after the completion of winding, the winding reel is replaceable with another winding reel on the rotation axis by movement of the rotation axis and the axis support member in the second direction.
16. An apparatus of packing a semiconductor package, comprising:
a winding reel;
a transfer rail configured to guide a transfer of a carrier tape to the winding reel;
a guide under the transfer rail, the guide protruding into a space between an end portion of the transfer rail and the winding reel to support a portion of the carrier tape escaping from the transfer rail;
a carrier tape holder configured to hold the carrier tape wound on the winding reel; and
a carrier tape cutter configured to cut the carrier tape held by the carrier tape holder to form a back end of the carrier tape at a location between an end portion of the transfer rail and a top or a bottom of a circumference surface of the winding reel.
17. The apparatus of packing a semiconductor package of claim 16, wherein the guide is configured to proceed toward the winding reel and support the carrier tape passing through the end portion of the transfer rail to introduce a front end of the carrier tape on the winding reel.
18. The apparatus of packing a semiconductor package of claim 17, further comprising:
a carrier tape adhesion member configured to attach an adhesive tape to the front end of the carrier tape before winding the carrier tape to the winding reel is started,
wherein a region of the carrier tape including the front end of the carrier tape overlapped with a region of the adhesive tape.
19. The apparatus of packing a semiconductor package of claim 16, further comprising:
a carrier tape adhesion member configured to attach an adhesive tape to the back end of the carrier tape after a completion of winding the carrier tape to the winding reel,
wherein the back end of the carrier tape is located approximately on a center region of the adhesive tape.
20. The apparatus of packing a semiconductor package of claim 16, wherein the guide is configured to not proceed toward the winding reel after a completion of winding the carrier tape to the winding reel.
US13/546,536 2011-09-26 2012-07-11 Carrier tape winding unit and apparatus of packing semiconductor package Abandoned US20130074447A1 (en)

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CN105600542A (en) * 2015-10-22 2016-05-25 佛山达健实验设备有限公司 Method and equipment for carrying out non-glue sealing and winding on external supply package section wound roll and wound roll
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