CN101489354B - Device and method for forming a three-dimensional circuit board - Google Patents
Device and method for forming a three-dimensional circuit board Download PDFInfo
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- CN101489354B CN101489354B CN2009100017069A CN200910001706A CN101489354B CN 101489354 B CN101489354 B CN 101489354B CN 2009100017069 A CN2009100017069 A CN 2009100017069A CN 200910001706 A CN200910001706 A CN 200910001706A CN 101489354 B CN101489354 B CN 101489354B
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- circuit board
- mentioned
- adhesive film
- film
- barrier film
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
Abstract
The present invention provides a forming device and forming method of stereo circuit board, which can accuracy paste circuit board in correct location on roller surface of cylinder-shape or barrel-shape, especially on the whole circle to make gaps being the smallest and most shallow. Forming device of the stereo circuit board includes rotary mechanism (10), which holding objects (1) of cylinder-shape or barrel-shape in horizontal status of central axis and rotating the object (1) around the central axis as rotating axle; holding mechanism (20) which holding adhesive film with isolation film with the exposed adhesive layer adown, and carrying horizontally; controlling mechanism (30), which can adjust relative position to make the carried adhesive film with isolation film (2a) or the circuit board (2b) contact with surface of the rotating object (1) and controlling the pressure pushed against the object (1) surface as constancy.
Description
Technical field
The present invention relates to the formation device and the formation method of stereoscopic circuit board, particularly relate to the device and method that is used for forming stereoscopic circuit board by the surface that circuit board is sticked on roller.
Background technology
Follow miniaturization, multifunction and the cost degradation of electronic equipments such as portable phone, need be on the inner surface of its framework, outer surface mounting circuit boards compactly.Therefore, needing circuit board sometimes is not the circuit board on plane but stereoscopic circuit board.In addition, in the photocopier field, also propose to form stereoscopic circuit board at the part or the complete cycle stickup circuit board that develop with the surface of roller, charged roller or transfer roll rollers such as (transfer roller).
As this method that on the surperficial complete cycle of roller, forms circuit board, can expect following method, promptly, the surface of insulating properties films such as use polyimides is provided with the material of conductor layers such as copper, and the conductor layer picture engraving formed circuit board (circuit board of film like), with bonding agent resulting circuit board is sticked on the surperficial complete cycle of roller.Such circuit board is because can be in a large number and the qurer manufacturing, so if can stick on the roller, then be very favourable.
But patent documentation 1 has been put down in writing film has been sticked on method on the tank body (can body) of cylindrical shape or drum in the mode of rotation cutting (rotary cutter).In the method, the film of the softness that can not independently keep cuts into desirable length with high accuracy, will cut resulting film and offer tank body, by carrying out lamination (laminate) well, thereby film can be adhered on the tank body.More particularly, to be in the film of the softness that can not independently keep of rolled state, be wrapped on feeding roller (feed roll) and the cutting roller (cutting roll) by vacuum suction, make the peripheral speed of feeding roller lower than the peripheral speed of cutting roller, film is applied pulling force, be divided into a plurality of the vacuum suction position of cutting roller and adjustment vacuum degree, thereby film is slided, make and produce constant interval between the film after the cut-out, acquisition is to the opportunity of tank body lamination (timing), lamination position at laminating roll (laminate roll), rotate and once exert pressure, eliminate the depression of film, thus can residual air between tank body and film, can carry out lamination well to tank body thus.
The exploitation purpose by the method for attaching that rotates cutting mode of patent documentation 1 record is the bottle surface adhesive label to the container for drink of tank body, bottle etc.Therefore, positional precision that needn't strict control adhesive label etc., in addition, under the situation of the surperficial complete cycle adhesive label of container for drink, for film, though overlap or the gap also no problem.
Relative therewith, stick in the film like of using bonding agent that electronic equipment is used under the situation on the surperficial complete cycle of roller, for this circuit board, if overlap or big gap, then the wiring of forming circuit be short-circuited, poor flow, and the electrical characteristic of circuit is impacted, therefore serious problem can appear.In addition, in the operation after forming stereoscopic circuit board, because the assembling procedure of circuit board being switched on and handling etc. from the outside and then if therefore do not paste circuit board in correct position, will be created in the problem that breaks down in the assembling procedure thereafter.Therefore, for the positional precision of pasting, need carry out very strict management.
Like this, under the situation that the roller that will paste circuit board by bonding agent uses as rotary body, need be controlled at bonding between circuit board and the roller.But, even at the such needs of correspondence, for when pasting, do not overlap or big slit and under the situation that the circuit board that is pre-formed bond layer is cut accurately, also exist be adhered to circuit board on the roller after, produce the problem of perk in the end of this circuit board.And when having applied resin for the surface of protective circuit plate, the difference of height that also has the gap between the end be configured in the circuit board on the bond layer is by complete landfill, and the situation that the end of this circuit board is exposed.
Patent documentation 1: Japanese kokai publication hei 10-236446 communique.
Summary of the invention
The object of the present invention is to provide a kind of formation device and formation method of stereoscopic circuit board; surface at the object of cylindrical shapes such as roller or drum; particularly complete cycle is pasted under the situation of circuit board; can make the end that is secured at the circuit board on the object not produce perk, and can be by the difference of height in surface protection resin landfill gap.
The formation method of stereoscopic circuit board involved in the present invention is characterised in that, object with cylindrical shape or drum, rotatably remain with the central shaft horizontal state, make the adhesive film of mobile unit absorption band barrier film, and this mobile unit is moved, with the engaged at end of the adhesive film of above-mentioned band barrier film surface to above-mentioned object, the pressure that control is on one side pushed the surface of above-mentioned object, the adhesive film of this band barrier film is moved horizontally on one side, and, make above-mentioned object rotation, thereby the adhesive film of above-mentioned band barrier film is sticked on the surface of above-mentioned object, remove barrier film from this surface of having pasted adhesive film, then, make above-mentioned mobile unit absorption circuit board, and this mobile unit is moved, with the engaged at end of foregoing circuit plate surface to the lip-deep adhesive film that sticks on above-mentioned object, the pressure that control is on one side pushed the surface of this adhesive film, this circuit board level is moved on one side, and, make the rotation of above-mentioned object and above-mentioned adhesive film, thereby the foregoing circuit plate is sticked on the surface of above-mentioned adhesive film.
Bonding agent at the adhesive film of above-mentioned band barrier film is the bonding agent that has cementability at normal temperatures, and the back side of this film also has under the situation of barrier film, before will joining the surface of above-mentioned object to, remove the barrier film at this back side with the adhesive film of barrier film.
On the other hand, be under the situation of bonding agent of heat-curing type at the bonding agent of the adhesive film of above-mentioned band barrier film, before will joining the surface of above-mentioned object to the adhesive film of barrier film, this film is heated, perhaps, after above-mentioned object is heated, this film is joined to the surface of this object.
In addition, using under the situation of heat-curing type bonding agent as bonding agent, can omit barrier film.In this case too, by heat-curing type adhesive film or above-mentioned object are heated, when engaging, make the bonding agent activate and be endowed adhesion properties, at first the heat-curing type adhesive film is sticked on the above-mentioned object.Afterwards, and keep the activate of bonding agent, and meanwhile the foregoing circuit plate is sticked on the surface of this adhesive film, thus form stereoscopic circuit board.
In addition, but also utilize the heat-curing type bonding agent to replace adhesive film to cover the surface of the object of cylindrical shape or drum in advance, with the central shaft is that horizontal state rotatably keeps this object, after this object is heated, make above-mentioned mobile unit absorption circuit board, this mobile unit is moved, the engaged at end of foregoing circuit plate is arrived the surface of above-mentioned object, the pressure that control is on one side pushed the surface of this object, circuit board level is moved on one side, and make above-mentioned object rotation, thereby the foregoing circuit plate is sticked on the surface of above-mentioned object.
The formation device of stereoscopic circuit board that is used to implement the formation method of stereoscopic circuit board of the present invention has: rotating mechanism, it is with the object of cylindrical shape or drum, remaining central shaft is horizontal state, and, this object is rotated as rotating shaft with this central shaft; Maintaining body, it keeps also the flatly adhesive film or the circuit board of conveyance band barrier film; Controlling organization, it can regulate relative position relation, make the adhesive film or the circuit board of above-mentioned band barrier film of institute's conveyance contact with the surface of the above-mentioned object that is rotated, and, the pressure that the surface of above-mentioned object is pushed can be controlled to be constant; Remove mechanism, it is used to remove barrier film, and above-mentioned barrier film is the film on surface that has covered the adhesive film of the lip-deep band barrier film that sticks on above-mentioned object.。
In this case, the adhesive film of above-mentioned band barrier film is sticked on the surperficial complete cycle of above-mentioned object, after the barrier film on the surface of removing this adhesive film, the foregoing circuit plate is sticked on the surface of this adhesive film.
In addition, in the formation device of above-mentioned stereoscopic circuit board, also have as required: remove mechanism, it is used for the barrier film at the back side of the bonding agent of the above-mentioned band barrier film of covering is removed; Heating arrangements, it is used for above-mentioned adhesive film or above-mentioned object are heated; Benchmark generates mechanism, the above-mentioned object that it can corresponding load on above-mentioned rotating mechanism axially, hold the adhesive film and/or the foregoing circuit plate of above-mentioned band barrier film.
In addition, preferred above-mentioned rotating mechanism by two the rotation rollers constitute, above-mentioned two the rotation rollers be configured to above-mentioned object be loaded in above-mentioned two the rotation rollers between and be rotated.
The invention effect
In the present invention, when on the surperficial complete cycle of the object of cylindrical shape such as roller or drum, forming the circuit board of film like, at first, adhesive film is sticked on the surface of object or bond layer is sticked on the surface of object, afterwards, the circuit board that bond layer will be set in addition sticks on this adhesive film or the bond layer, thereby, circuit board is sticked on the object.Thus; stick at the circuit board that will cut the band bond layer that obtains accurately under the situation on the complete cycle of object by circuit board thin plate to the film like that is pre-formed bond layer; can suppress to produce the end perk of circuit board; even and under the situation that produces the gap between this end, also can be by the surface protection resin difference of height in landfill gap fully.
Description of drawings
Fig. 1 is the schematic diagram of an embodiment of the formation device of expression stereoscopic circuit board of the present invention.
Fig. 2 is the schematic diagram that the benchmark of presentation graphs 1 generates mechanism.
Embodiment
Describe an embodiment of the invention in detail based on accompanying drawing.An execution mode in Fig. 1, representing the formation device of stereoscopic circuit board of the present invention with schematic diagram.Benchmark with schematic diagrammatic sketch 1 in Fig. 2 generates mechanism.
Stereoscopic circuit board of the present invention forms device to have: rotating mechanism 10, and it is with the object 1 of cylindrical shape or drum, and it is horizontal state that this object is remained central shaft, and to make object 1 be that rotating shaft is rotated with the central shaft; Maintaining body 20, the adhesive film 2a of its retainer belt barrier film (separator) or circuit board 2b, and flatly conveyance adhesive film 2a or circuit board 2b; Controlling organization 30, it can regulate relative position relation, make the adhesive film 2a of band barrier film of institute's conveyance or the bond layer of circuit board 2b contact with the surface of the object 1 of rotation, and, the pressure of pushing for the surface of object 1 can be controlled to be constant.
The adhesive film 2a of band barrier film or circuit board 2b are contained in benchmark respectively and generate in the mechanism 40.In addition, the adhesive film 2a of band barrier film and circuit board 2b is cut into regulation in advance according to the size of the object that is stuck size.For example, under situation, make the side edge length of circuit board 2b on the rotating shaft direction of object 1 identical with the axial length of the rotation of object 1 as the whole circuit forming surface plate of the roller of object 1.In addition, make the circumference of the corresponding side edge length of the circumferencial direction with object 1 of circuit board 2b and object 1 roughly the same.But, as hereinafter described, on cutting accuracy, there is error, in addition, also there is tolerance in the shape of object, because these can be corrected, need not to make these value strict conformances.In addition, about this point, under the situation of adhesive film 2a of band barrier film too.
Benchmark generates the function that mechanism's 40 performances are cut into the support (holder) of the adhesive film 2a of band barrier film of given size and circuit board 2b.Benchmark generates mechanism 40 and is made of for example resinous fixed head 41 and movable platen 42.Under the situation of circuit board, with the supine state of circuit, will be cut into the adhesive film 2a and/or the circuit board 2b of the band barrier film of given size, be positioned over benchmark and generate in the mechanism 40.About generate the contraposition in the mechanism 40 at benchmark, movable platen 42 is to the fixed head 41 that becomes the fixed datum plate of XY direction, press the adhesive film 2a and the circuit board 2b of pressure zone barrier film, thereby will be placed on correct position with the adhesive film 2a and the circuit board 2b of barrier film.
In addition, under the situation of using the bonding agent that presents cementability under the normal temperature, for the adhesive film of general band barrier film, at the two sides of base material adhesive-applying, configuration isolation film on this bonding agent then.Under the situation of the adhesive film that uses this band barrier film, a benchmark is generated mechanism 40, adhesive film 2a that can alternate configurations band barrier film and circuit board 2b the two.But, in this case, also they can be disposed at different benchmark and generate mechanism 40.
On the other hand, also can use single face to be provided with the adhesive film of the band barrier film of barrier film.In this case, the adhesive film 2a with the band barrier film is disposed at different benchmark generation mechanisms 40 with circuit board 2b.
In addition, under the situation of using the heat-curing type bonding agent that presents cementability because of heating, can omit barrier film, and, as long as owing to be arranged on face side being provided with under the situation of barrier film, use together so benchmark can be generated mechanism 40 and circuit board, also can use different benchmark to generate mechanism 40.
In addition, concentrate under the situation of placing at the adhesive film 2a and the circuit board 2b of the band barrier film that many have been cut, the container (magazine) that can hold the adhesive film 2a of overlapping many band barrier films and circuit board 2b is installed on benchmark and generates mechanism 40.
Be placed on the adhesive film 2a and the circuit board 2b of the band barrier film on the tram, the maintaining body 20 that is had aperture is by each Zhang Jinhang vacuum attraction, thereby is adsorbed and conveyance.Specifically, maintaining body 20 has: the adsorption plate that is made of resin plate or metallic plate with the aperture that can carry out vacuum attraction; The vacuum attraction system that is communicated with this hole; The mechanism that makes this adsorption plate and vacuum suction device rise or descend and move in the horizontal direction.
Keep structure 20 after adhesive film 2a that adsorbs the band barrier film or circuit board 2b, to rise.
Presented by heating under the situation that the bonding agent of cementability forms at the bond layer of adhesive film 2a, the formation device of stereoscopic circuit board has heating arrangements 50.Heating arrangements 50 can adopt known heater etc.Because reactive conditions is because of different there are differences of kind of bonding agent, so according to heating the heating-up temperature and the heating time of employed bonding agent optimization heater.Heating-up temperature is in the active temperature scope of each bonding agent.
In addition, heating arrangements 50 can also adopt the mechanism of when engaging bond layer being heated by object 1 is heated except the mechanism that the bond layer that can adopt adhesive film 2a heats.
In addition, the bond layer of adhesive film 2a shown in the drawings uses the situation of heat-curing type bonding agent.On the other hand, form by the bonding agent that has cementability at normal temperatures, and also paste under the situation of barrier film, have the mechanism of removing of the barrier film that is used to remove such back side at the back side of adhesive film 2a at bond layer.This is removed mechanism and also can use and be used to peel off the known device of removing barrier film.
Also can have heating arrangements 50 simultaneously and remove mechanism.
Then, maintaining body 20 is moved, make the adhesive film 2a of band barrier film or the top that circuit board 2b moves to rotating mechanism 10, wherein, on this rotating mechanism 10, be placed with the object 1 that constitutes by metallic or resinous roller.As required, maintaining body 20 is descended, the surface that will be pressed into object 1 at first with the adhesive film 2a or the circuit board 2b of barrier film, thereby make the end (in the side that the rotating shaft direction of object 1 is extended, the end of direction of advance front side) of this adhesive film 2a or circuit board 2b and the surface engagement of object 1.But also can only finish this joint by moving horizontally.
For convenience of explanation, illustrated simultaneously and will stick on situation on the object 1 with the adhesive film 2a of barrier film and circuit board 2b, but, in fact, at first, the adhesive film 2a of band barrier film is sticked on the object 1, then, when the lip-deep barrier film that will stick on this adhesive film 2a is removed, on the surface of this adhesive film 2a, paste circuit board 2b, thereby, obtain on object 1, being formed with the stereoscopic circuit board 3 of circuit board 2b.
Then, inhaling the adhesive film 2a of sclerozone barrier film or the maintaining body 20 of circuit board 2b moves horizontally, simultaneously, from the adhesive film 2a of band barrier film or the side of circuit board 2b, rotation along with object 1, under the situation of adhesive film 2a of band barrier film, stick on the surperficial complete cycle of object 1, stick under the situation of circuit board 2b be adhered on the object 1 in advance and the surperficial complete cycle of the adhesive film 2a that barrier film has been removed on.Therefore, can not be involved in air between adhesive film 2a and the object 1 and between adhesive film 2a and the circuit board 2b.In addition, even the shape of objects 1 such as length, diameter changes, maintaining body 20 can not need to change under the situation of anchor clamps, structure, attaches adhesive film 2a or circuit board 2b.In addition, can attach, make that the pressure when pasting reaches constant by the mechanism of using gases or oil pressure.
In addition, the mechanism as removing barrier film from the surface that sticks on the adhesive film 2a on the object 1 also can use known device.But, owing to be pasted with object 1 rotation on rotation roller 10 of such adhesive film 2a, so after the periphery of object 1 is left a roller in the rotation roller 10 that object 1 is supported and arrive before the peak, barrier film need be peeled off Bao From by the mechanism of removing barrier film.But, under the situation of the rotation roller 10 that has set silicone rubber difficult cementitious material such as (silicone gum) as rotation roller 10 use surfaces, be not limited to above-mentioned.
Such feature is arranged in the present invention: after the bond layer that is made of adhesive film 2a is formed on the complete cycle of object 1, on the surface of this bond layer, paste the film-shaped circuit plate 2b that does not have bond layer, thereby, form stereoscopic circuit board 3.That is, has bond layer and circuit board 2b is respectively formed on the object 1.
In the present invention, owing on objects such as roller 1, form bond layer and circuit board 2b respectively, can prevent from when pasting, to be formed on the end perk of the circuit board 2b on the roller.
Under the situation of the film-shaped circuit plate that uses the band bonding agent, base material extends during owing to cut-out lateral vertical side and coiling, so bonding agent might not be the state that can follow base material (insulating properties film) end.On the other hand, by adhesive film 2a and circuit board 2b are reeled respectively, thereby under the base material end, there is bonding agent, and, because applying constant power reels on base material, the meniscus (meniscus) of the bonding agent that the end produces is micro-, but still the inhibition end portion thickness side that can bond, so perk can not take place.In addition, because the end of bond layer and the end of circuit board 2b stagger,, therefore, can make full use of this gap of surface protection resin landfill so the gap depth that forms each other in the end of the film-shaped circuit plate 2b that has formed reduces by half.
In addition, as above-mentioned execution mode, after on the surface that will stick on object 1 in advance with the adhesive film 2a of barrier film, utilize the cementability of this adhesive film 2a that circuit board 2b is sticked on the object 1, in addition, can also on the surface of object 1, cover the heat-curing type bonding agent in advance, thereby the surface at this object 1 forms the heat-curing type bond layer, by this object 1 is directly heated, give cementability to bond layer, in this state, the circuit board 2b that will not form bond layer similarly sticks on the surface of above-mentioned object 1.In this case; can omit the stickup operation of adhesive film 2a; the substitute is the material that needs to use difficult cementability as rotation roller 10; but it is identical with above-mentioned execution mode; the end perk of circuit board 2b after can preventing to paste; and, the gap that the end of the circuit board 2b after can utilizing surface protection resin landfill to paste forms each other.
In addition, as adhesive film 2a, if the easiness of contraposition or the extension of adhesive film 2a etc. when under the situation of using the heat-curing type adhesive film, also considering to paste, the then preferred adhesive film 2a that uses the band barrier film, but also can omit barrier film, when pasting adhesive film 2a and when pasting circuit board 2b, make its activate, paste adhesive film 2a and circuit board 2b thereby bonding agent heated.
Embodiment
(embodiment 1)
At first, following circuit board manufacturing 2b.
Used thickness is that (Toyo Boseki K.K makes, and A4100), forms the copper film on the surface by sputtering method, then, forms the copper layer with the cathode copper galvanoplastic for the PET film of 35 μ m.Electroplate for cathode copper, at room temperature use concentration of copper sulfate as 90g/ liter, sulfuric acid concentration as the electroplate liquid that 180g/ rises, be 2A/dm by making cathode-current density
2, forming thickness is the copper capping layer of 8 μ m.
And then, by photoetching resist mode, (Asahi Kasei Corporation makes to paste dry film photoresist (dry film resist) at the copper laminar surface, AQ-1158), use the mask of the wiring shape of regulation, on dry film photoresist, expose, develop then, the peeling off of etching and dry film photoresist, thereby obtain circuit board 2b.
By metal pattern respectively to resulting circuit board 2b with have the adhesive film 2a of the band barrier film of cementability at normal temperatures (Dainippon Ink. ﹠ Chemicals Inc makes, double-sided adhesive band #8616) cuts, making it rotate axial side is 50.3mm, and the side of perpendicular direction is 350mm.After the cutting, adhesive film 2a and circuit board 2b alternate configurations with the band barrier film are placed in the box (cassette) 40 as shown in Figure 2.
Next, use the formation device of the stereoscopic circuit board of schematic diagram shown in Figure 1 to paste operation.This device comprises: (vacuum: vacuum) lift 30 lowering or hoisting gear of cylinder (use), the adsorption plate 20, heater 50, the protective film (back side isolated film) that are connected on this lift are removed device (for the barrier film that is pasted on back of circuit board to vacuum suction; pilot tape (leader tape) is pasted in end at this barrier film; peel off this pilot tape by picking up, thereby peel off the mechanism of this barrier film), whirligig 10 and whirligig be with heater (not shown).In addition, adjacent with whirligig also have other protective film (surperficial barrier film) and remove device (removing the device identical mechanism with the back side isolated film is used).
As the rotation roller of whirligig 10, use the diameter that has added silicone rubber (silicone gum) on various metallic rollers surface to be 40mm, length is the roller of 400mm.
In operation, at first loading diameter between the rotation roller of this whirligig is 16mm, and length is the roller 1 that is formed by aluminum pipe of 300mm.In addition, for the adhesive film and the roller 1 of circuit board 2b, band barrier film, in order to carry out mensuration described later, size up correctly in advance.Calculate the gap between the side of circuit board 2b according to the diameter of the size of adhesive film 2a of circuit board 2b and band barrier film and roller, theoretical value is 0.20mm.
At first, adsorption plate 20 is dropped to be contained on the adhesive film 2 of the band barrier film in the box 40, and the adhesive film 2a of absorption band barrier film.Then, adsorption plate 20 is risen and move horizontally.In the process that moves horizontally, remove the barrier film that device is peeled off the back side of the adhesive film 2a that removes the cover tape barrier film by protective film (back side isolated film).In the time of on the roller 1 on the direction of advance end of adsorption plate 20 arrival whirligig, adsorption plate 20 descends, until pressing pressure roller 1 by predefined pressure.After the direction of advance end of adhesive film 2a touched the surface of roller 1, when adsorption plate 20 was moved horizontally, roller 1 is rotation thereupon also, thereby has pasted adhesive film 2a at its complete cycle.Then, remove device by protective film (surperficial barrier film) and peel off the barrier film of removing the surface that covers the adhesive film 2a that is pasted on roller 1 surface.
Next, adsorption plate 20 is dropped to be contained on the circuit board 2b in the box 40 absorption circuit board 2b.Then, adsorption plate 20 is risen and move horizontally.In the time of on the roller 1 on the direction of advance end of adsorption plate 20 arrival whirligig, adsorption plate 20 descends, until pressing pressure roller 1 by predefined pressure.After the direction of advance end of circuit board 2b touched the surface of adhesive film 2a, when adsorption plate 20 was moved horizontally, roller 1 is rotation thereupon also, thereby has pasted circuit board 2b at its complete cycle, thus, obtains being formed with the stereoscopic circuit board 3 of circuit board 2b on roller 1.
Then, discharge stereoscopic circuit board 3, new roller 1 is loaded on the whirligig 10, change the pressure when pasting, a plurality of rollers have been pasted adhesive film 2a and circuit board 2b.
According to the stereoscopic circuit board 3 that is obtained, measured the gap between the side of the circuit board 2b after pasting for various test portions.In addition, visualization with paste after corresponding end perk of elapsed time state.Its measurement result is illustrated in the table 1.
Table 1
(embodiment 2)
At first, following circuit board manufacturing 2.
Use is that stacked thickness is that (Sumitomo Metal Mining Co., Ltd makes the double layer substrate that forms of 8 μ m Copper Foils on the polyimide film of 38 μ m at thickness, S ' perFlex), by the photoresist mode, (Asahi Kasei Corporation makes, and AQ-1158), makes the mask of wiring shape to paste dry film photoresist at the copper laminar surface, afterwards, on dry film photoresist, expose, develop then, etching and peel off dry film photoresist, thereby obtain circuit board 2b.
Next, (Ri Kang Industrial Co., Ltd (ニ Star カ Application Industrial Co., Ltd) makes to the adhesive film 2a of resulting circuit board 2b and thermo-compressed type band barrier film respectively by metal pattern, SAFW) cut, making it rotate axial side is 50.3mm, and the side of vertical direction is 350mm with it.In addition, for this adhesive film 2a, only dispose barrier film in its face side.After cutting, adhesive film and circuit board 2b alternate configurations with the band barrier film are placed in the box 40 as shown in Figure 2.
Next, using heater 50 and whirligig to replace protective film (back side isolated film) to remove outside the device, paste adhesive film 2a and circuit board 2b similarly to Example 1 with heater (not shown).
Particularly, after the roller that is formed by aluminum pipe 1 that disposes between to the rotation roller at whirligig with heater (not shown) by whirligig heats, adsorption plate 20 is dropped to be contained on the adhesive film 2 of the band barrier film in the box 40, and the adhesive film 2a of absorption band barrier film.Adsorption plate 20 is risen and move horizontally.In the process that moves horizontally, 50 couples of adhesive film 2a heat by heater.In the time of on the roller 1 on the direction of advance end of adsorption plate 20 arrival whirligig, adsorption plate 20 descends, until pressing pressure roller 1 by predefined pressure.After the direction of advance end of bond layer touched the surface of roller 1, when adsorption plate 20 was moved horizontally, roller 1 is rotation thereupon also, thereby has pasted adhesive film 2a at its complete cycle.
Then, roller 1 is maintained superheat state, the same with embodiment 1, with barrier film after adhesive film 2a removes, circuit board 2b is pasted on the roller 1, thereby obtains on roller 1, being formed with the stereoscopic circuit board 3 of film-shaped circuit plate 2b.
Identical with embodiment 1, a plurality of rollers 1 are pasted adhesive film 2a and circuit board 2b.
According to resulting stereoscopic circuit board 3, measured the gap between the side of the circuit board 2b after pasting for each test portion.In addition, visualization with paste after corresponding end perk of elapsed time state.Its measurement result is as shown in table 2.
Table 2
(embodiment 3)
As roller 1, use the aluminum pipe that is formed with bond layer on its surface.Particularly, use is that (Toagosei Co., Ltd makes bonding agent in advance with solution-type sex change epoxy, A Longfa (aron mighty) AS-60) becomes 2 times and the solution that obtains with dilution with toluene, to diameter is 16mm, length is that the aluminum pipe of 300mm carries out dip coating, and be heated to 100 ℃, kept 2 minutes, use dried aluminum pipe as roller 1, except the stickup operation of having omitted adhesive film 2a, identical with embodiment 2, heat with heater pair roller 1 by whirligig, bond layer is pasted on the circuit board 2b with the state of activate, thereby obtain stereoscopic circuit board 3.
According to resulting stereoscopic circuit board 3, measured the gap between the side of the circuit board 2b after pasting for each test portion.In addition, visualization with paste after corresponding end perk of elapsed time state.Its measurement result is as shown in table 3.
Table 3
Claims (12)
1. the formation method of a stereoscopic circuit board is characterized in that,
With the object of cylindrical shape or drum, rotatably remain with the central shaft horizontal state,
Make the adhesive film of mobile unit absorption band barrier film, and this mobile unit moved,
With the engaged at end of the adhesive film of above-mentioned band barrier film surface to above-mentioned object, the pressure that control is on one side pushed the surface of above-mentioned object, the adhesive film of this band barrier film is moved horizontally on one side, and, make above-mentioned object rotation, thereby the adhesive film of above-mentioned band barrier film is sticked on the surface of above-mentioned object
Remove barrier film from this surface of having pasted adhesive film,
Then, make above-mentioned mobile unit absorption circuit board, and this mobile unit moved,
With the engaged at end of foregoing circuit plate surface to the lip-deep adhesive film that sticks on above-mentioned object, the pressure that control is on one side pushed the surface of this adhesive film, this circuit board level is moved on one side, and, make the rotation of above-mentioned object and above-mentioned adhesive film, thereby the foregoing circuit plate is sticked on the surface of above-mentioned adhesive film.
2. the formation method of stereoscopic circuit board according to claim 1 is characterized in that,
Bonding agent at the adhesive film of above-mentioned band barrier film is the bonding agent that has cementability at normal temperatures, and the back side of this film also has under the situation of barrier film, before will joining the surface of above-mentioned object to, remove the barrier film at this back side with the adhesive film of barrier film.
3. the formation method of stereoscopic circuit board according to claim 1 is characterized in that,
Be under the situation of bonding agent of heat-curing type at the bonding agent of the adhesive film of above-mentioned band barrier film, before will joining the surface of above-mentioned object to, this film heated with the adhesive film of barrier film.
4. the formation method of stereoscopic circuit board according to claim 1 is characterized in that,
Be under the situation of bonding agent of heat-curing type at the bonding agent of the adhesive film of above-mentioned band barrier film, after above-mentioned object is heated, this film joined to the surface of this object.
5. the formation method of stereoscopic circuit board according to claim 1 is characterized in that,
Use the formation device of stereoscopic circuit board, the adhesive film of above-mentioned band barrier film sticked on the surperficial complete cycle of above-mentioned object, after the barrier film on the surface of removing this adhesive film, the foregoing circuit plate is sticked on the surface of this adhesive film,
The formation device of above-mentioned stereoscopic circuit board has: rotating mechanism, and with the object of cylindrical shape or drum, remaining central shaft is horizontal state, and, object is rotated as rotating shaft with this central shaft; Maintaining body, it keeps also the flatly adhesive film or the circuit board of conveyance band barrier film; Controlling organization, it can regulate relative position relation, make the adhesive film or the circuit board of above-mentioned band barrier film of institute's conveyance contact with the surface of the above-mentioned object that is rotated, and, the pressure that the surface of above-mentioned object is pushed can be controlled to be constant; Remove mechanism, it is used to remove barrier film, and above-mentioned barrier film is the film on surface that has covered the adhesive film of the lip-deep band barrier film that sticks on above-mentioned object.
6. the formation method of a stereoscopic circuit board is characterized in that,
Utilize the bonding agent of heat-curing type to cover the surface of the object of cylindrical shape or drum, it is horizontal state that this object is rotatably remained central shaft,
After this object is heated, make mobile unit absorption circuit board, and this mobile unit is moved,
The engaged at end of foregoing circuit plate is arrived the surface of above-mentioned object, the pressure that control is on one side pushed the surface of this object, the foregoing circuit plate level is moved on one side, and make above-mentioned object rotation, thereby the foregoing circuit plate is sticked on the surface of above-mentioned object.
7. the formation method of a stereoscopic circuit board is characterized in that,
With the object of cylindrical shape or drum, rotatably remaining central shaft is horizontal state,
Make the adhesive film of mobile unit absorption heat-curing type, and this mobile unit moved,
After the adhesive film of this heat-curing type or above-mentioned object are heated, with the engaged at end of the adhesive film of above-mentioned heat-curing type surface to above-mentioned object, the pressure that control is on one side pushed the surface of above-mentioned object, the adhesive film of above-mentioned heat-curing type is moved horizontally on one side, and make above-mentioned object rotation, thereby the adhesive film of above-mentioned heat-curing type is sticked on the surface of above-mentioned object
Then, make above-mentioned mobile unit absorption circuit board, and this mobile unit moved,
After above-mentioned object is heated, with the engaged at end of foregoing circuit plate surface to the lip-deep adhesive film that sticks on above-mentioned object, the pressure that control is on one side pushed the surface of this adhesive film, the foregoing circuit plate level is moved on one side, and make the rotation of above-mentioned object and above-mentioned adhesive film, thereby the foregoing circuit plate is sticked on the surface of above-mentioned adhesive film.
8. the formation device of a stereoscopic circuit board is characterized in that having:
Rotating mechanism, it is with the object of cylindrical shape or drum, and remaining central shaft is horizontal state, and, this object is rotated as rotating shaft with this central shaft;
Maintaining body, it keeps also the flatly adhesive film or the circuit board of conveyance band barrier film;
Controlling organization, it can regulate relative position relation, make the adhesive film or the circuit board of above-mentioned band barrier film of institute's conveyance contact with the surface of the above-mentioned object that is rotated, and, the pressure that the surface of above-mentioned object is pushed can be controlled to be constant;
Remove mechanism, it is used to remove barrier film, and above-mentioned barrier film is the film on surface that has covered the adhesive film of the lip-deep band barrier film that sticks on above-mentioned object.
9. the formation device of stereoscopic circuit board according to claim 8 is characterized in that,
Also have such mechanism of removing, it is used to remove the barrier film at the back side of the bonding agent that covers above-mentioned band barrier film.
10. the formation device of stereoscopic circuit board according to claim 8 is characterized in that,
Also have heating arrangements, it is used to heat above-mentioned adhesive film or above-mentioned object.
11. the formation device of stereoscopic circuit board according to claim 8 is characterized in that,
Above-mentioned rotating mechanism by two the rotation rollers constitute, above-mentioned two the rotation rollers be configured as make above-mentioned object be loaded in above-mentioned two the rotation rollers between and be rotated.
12. the formation device of stereoscopic circuit board according to claim 8 is characterized in that,
Also have benchmark and generate mechanism, its can be aligned in the above-mentioned object that loads on the above-mentioned rotating mechanism axially, hold the adhesive film and/or the foregoing circuit plate of above-mentioned band barrier film.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008005406A JP4428449B2 (en) | 2008-01-15 | 2008-01-15 | Three-dimensional circuit board forming apparatus and forming method |
| JP2008005406 | 2008-01-15 | ||
| JP2008-005406 | 2008-01-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101489354A CN101489354A (en) | 2009-07-22 |
| CN101489354B true CN101489354B (en) | 2011-03-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009100017069A Expired - Fee Related CN101489354B (en) | 2008-01-15 | 2009-01-06 | Device and method for forming a three-dimensional circuit board |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4428449B2 (en) |
| KR (1) | KR100999212B1 (en) |
| CN (1) | CN101489354B (en) |
| TW (1) | TWI403232B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4400673B2 (en) * | 2007-12-13 | 2010-01-20 | 住友金属鉱山株式会社 | Three-dimensional circuit board forming apparatus and forming method |
| JP5131013B2 (en) * | 2008-04-24 | 2013-01-30 | 住友金属鉱山株式会社 | Method and apparatus for forming a three-dimensional circuit board |
| JP5131251B2 (en) * | 2009-06-25 | 2013-01-30 | 住友金属鉱山株式会社 | Three-dimensional circuit board manufacturing method |
| JP5251803B2 (en) * | 2009-09-17 | 2013-07-31 | 住友金属鉱山株式会社 | Three-dimensional circuit board manufacturing method |
| JP5482641B2 (en) * | 2010-12-13 | 2014-05-07 | 住友金属鉱山株式会社 | Manufacturing method of 3D circuit board and squeegee used for manufacturing 3D circuit board |
| JP5794180B2 (en) * | 2012-03-13 | 2015-10-14 | 住友金属鉱山株式会社 | Three-dimensional circuit board, method for producing film-like circuit board, and method for producing three-dimensional circuit board using the same |
| JP5790550B2 (en) * | 2012-03-13 | 2015-10-07 | 住友金属鉱山株式会社 | Three-dimensional circuit board and manufacturing method thereof |
| CN103997858B (en) * | 2014-05-30 | 2017-01-18 | 昆山一邦泰汽车零部件制造有限公司 | Movable printed circuit film ring |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007208028A (en) * | 2006-02-02 | 2007-08-16 | Matsushita Electric Ind Co Ltd | Manufacturing method of solid interconnection and solid wiring board fabricated thereby |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3738518B2 (en) | 1997-02-26 | 2006-01-25 | 東洋製罐株式会社 | Lamination method for can body |
| KR100347857B1 (en) | 2000-09-04 | 2002-08-09 | 오티에스테크놀러지 주식회사 | Method for laminating printed circuit board and apparatus thereof |
| JP4092113B2 (en) * | 2002-02-28 | 2008-05-28 | 大和製罐株式会社 | Method and apparatus for attaching film to can |
| KR100609871B1 (en) | 2005-01-14 | 2006-08-08 | 주식회사 비에이치플렉스 | Coverlay laminating method and machine for multi layer type fpcb |
-
2008
- 2008-01-15 JP JP2008005406A patent/JP4428449B2/en not_active Expired - Fee Related
- 2008-12-11 KR KR1020080125744A patent/KR100999212B1/en active IP Right Grant
- 2008-12-16 TW TW097148882A patent/TWI403232B/en not_active IP Right Cessation
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007208028A (en) * | 2006-02-02 | 2007-08-16 | Matsushita Electric Ind Co Ltd | Manufacturing method of solid interconnection and solid wiring board fabricated thereby |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20090078730A (en) | 2009-07-20 |
| TWI403232B (en) | 2013-07-21 |
| TW200938024A (en) | 2009-09-01 |
| JP4428449B2 (en) | 2010-03-10 |
| CN101489354A (en) | 2009-07-22 |
| KR100999212B1 (en) | 2010-12-07 |
| JP2009170578A (en) | 2009-07-30 |
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