TWI403232B - Three-dimensional circuit board formation apparatus and method thereof - Google Patents

Description

Stereo circuit substrate forming device and forming method

The present invention relates to a device and a method for forming a three-dimensional circuit substrate, and more particularly to an apparatus and method for forming a three-dimensional circuit substrate by adhering a circuit substrate to a surface of a roller.

With the miniaturization, multi-functionalization, and cost reduction of electronic devices such as mobile phones, it has been required to mount the circuit board on the inner surface or the outer surface of the casing. Therefore, sometimes the circuit substrate is required to be stereoscopic rather than planar. In addition, in the field of photocopiers, a surface of a roller such as a developing roller, a charging roller, or a transfer roller, or a circuit substrate is applied over the entire circumference, thereby forming a three-dimensional circuit substrate. Program.

In the method of forming a circuit board over the entire surface of the surface of the drum, it is conceivable to use a material having a conductor layer such as copper on the surface of an insulating film such as polyimide to form a conductor layer. A method of forming a circuit board (film-form circuit board) by patterning, and adhering the obtained circuit board to the entire circumference of the surface of the drum using an adhesive. Since such a circuit board can be manufactured in a large amount and at low cost, it is advantageous if it can be adhered to a drum.

However, Patent Document 1 describes a method of adhering a film to a cylindrical or cylindrical can body by a Rotary Cutter method. In this method, it is impossible to maintain a self-standing flexible film, cut to a desired length with high precision, and supply the film obtained by cutting to the can body, and laminate well. Thereby, the film can be attached to the can body. More specifically, the flexible film which is in a wound state and cannot be kept free is vacuum-adsorbed on a feed roll and a cutting roll, and the peripheral speed of the feed roller is made. The peripheral speed of the cutting roll is slow, tension is applied to the film, and the vacuum suction portion of the cutting roll is divided into a plurality of parts to adjust the vacuum strength, thereby imparting lubricity to the film, and the film is cut at a certain interval after the cutting. Timing of lamination of the can body is obtained, and the lamination of the laminating roller is performed by pressing to remove the depression of the film so that air does not remain between the can body and the film, but The can is well laminated.

Patent Document 1 discloses a method of adhering by a rotary cutter method, which is developed for the purpose of attaching a label to a bottle surface of a beverage container such as a can body or a PET bottle. Therefore, it is not necessary to strictly manage the positional accuracy of the label, and the like, and when the label is adhered to the entire surface of the beverage container, there is no problem even if the film is overlapped or gapped.

In contrast, when a film-shaped circuit board for electronic equipment is adhered to the entire surface of the drum by using an adhesive, if the circuit board has a gap or a large gap, a short circuit may occur in the wiring constituting the circuit or Poor conduction, which affects the electrical characteristics of the circuit, thus creating a major problem. Further, in the step after the formation of the three-dimensional circuit substrate, the assembly step of energizing the circuit substrate or the like is continued, and therefore, if the circuit substrate is not adhered to the correct position, it will be generated in the subsequent assembly step. Bring problems such as malfunctions. Therefore, the accuracy of the position of the bond requires very strict management.

As described above, when the drum which is a film substrate adhered to the film by the adhesive is used as a rotating body, the adhesion between the circuit board and the drum is required to be controlled. However, even if it is based on such a requirement, the circuit board in which the adhesive layer is formed in advance is cut accurately, in such a manner that no overlap or a large gap is formed during the pasting, and the film substrate is bonded to the substrate. After the roller, a problem of floating occurs at the end of the circuit board. Further, even when the resin is applied as the surface protection of the circuit board, the step of the gap between the end portions of the circuit board disposed on the adhesive layer cannot be completely filled, and the circuit board can be completely buried. The end is exposed.

Patent Document 1: Japanese Patent Laid-Open No. Hei 10-236446

An object of the present invention is to provide a device for forming a three-dimensional circuit board and a method for forming the same, which are not adhered to an object on a surface of a cylindrical or cylindrical object such as a roller, particularly over the entire circumference, when the circuit board is pasted. The end portion of the circuit board is floated, and the step difference of the gap can be filled by the surface protective resin.

The present invention relates to a method for forming a three-dimensional circuit substrate, which is characterized in that a cylindrical or cylindrical object is rotatably held while the central axis is horizontal, and a separator is attached. The film is adsorbed to the moving means, and the moving means is moved, and the end portion of the adhesive film attached to the release film is bonded to the surface of the object to control the pressure against the surface of the object. The adhesive film with the release film is horizontally moved, and the object is rotated, thereby adhering the adhesive film of the release film to the surface of the object, and from the surface of the adhesive film The release film is removed, and then the circuit board is adsorbed to the moving means, and the moving means is moved, and the end portion of the circuit board is adhered to the surface of the adhesive film adhered to the surface of the object, and is controlled. The substrate is horizontally moved while the pressure of the surface of the adhesive film is pressed, and the object and the adhesive film are rotated. The circuit board is adhered to the surface of the film bonding agent.

The adhesive film of the adhesive film with the release film is an adhesive having adhesiveness at normal temperature, and when the back surface of the film is also provided with a release film, the adhesive film of the release film is attached. The release film of the back surface is removed before being bonded to the surface of the object.

On the other hand, when the adhesive agent for the adhesive film of the release film is a heat-curing type adhesive, the adhesive film of the release film is adhered to the surface of the object, The film is heated, or after the object is heated, the film is bonded to the surface of the object.

Further, when a heat-curing type adhesive is used as the adhesive, the release film can be omitted. At this time, the heat-curing adhesive film or the object is heated, and the adhesive is activated at the time of bonding to impart adhesiveness. First, the heat-curing adhesive film is adhered to the object. Things. Thereafter, while maintaining the activation of the adhesive, the circuit board is adhered to the surface of the adhesive film to form a three-dimensional circuit board.

Further, in place of the adhesive film, the surface of the cylindrical or cylindrical object may be covered with a heat-curing type adhesive in advance, and the object may be rotatably held while the horizontal axis is horizontal. After heating the object, the circuit board is attracted to the moving means, and the moving means is moved, and the end of the circuit board is bonded to the surface of the object to control the surface pressing of the object. The pressure is moved horizontally, and the object is rotated to adhere the circuit board to the surface of the object.

In order to implement the method of forming a three-dimensional circuit substrate of the present invention, a three-dimensional circuit substrate forming apparatus having a rotating mechanism and holding a cylindrical or cylindrical object while the central axis is horizontal is used. And rotating the central axis as a rotation axis; the holding mechanism for holding the adhesive film or the circuit substrate with the release film, and carrying it in a horizontal manner; and the control mechanism for carrying the surface of the object to be rotated Adjusting the relative positional relationship by the manner in which the adhesive film or the circuit board with the release film is in contact with each other, and controlling the pressure on the surface of the object to be constant; and removing the mechanism for adhering the cover to the object The release film on the surface of the adhesive film attached to the surface of the object is removed.

In this case, the adhesive film attached to the release film is adhered to the entire surface of the object, and after the release film on the surface of the adhesive film is removed, the circuit substrate is adhered to the adhesive. The surface of the film.

Further, in the apparatus for forming a three-dimensional circuit board, a removal mechanism for removing a release film covering the back surface of the adhesive film attached to the release film is required, and the adhesive film or the object is heated. And a heating means for accommodating the adhesive film of the peeling film and/or the reference setting means of the circuit board, etc., in the axial direction of the object to be placed on the rotating mechanism.

Further, it is preferable that the rotating mechanism is constituted by two rotating rollers arranged to rotate between the objects.

In the present invention, when a film-shaped circuit board is formed over the entire circumference of a cylindrical or cylindrical object such as a roller, first, after the adhesive film is adhered to the surface of the object, or After the adhesive layer is formed on the surface of the object, a circuit board not provided with the adhesive layer is adhered to the adhesive film or the adhesive layer, whereby the circuit board is adhered to the object. Thereby, the film-formed circuit board piece in which the adhesive layer is formed in advance can be accurately cut, and the circuit board to which the obtained adhesive layer is obtained can be suppressed from being adhered to the object. The end of the circuit board generated at the entire periphery floats, and even if a gap is formed between the ends, the step of the gap can be sufficiently filled by the surface protecting resin.

An embodiment of the present invention will be described in detail based on the drawings. Fig. 1 is a schematic view showing an embodiment of a device for forming a three-dimensional circuit substrate of the present invention. Fig. 2 is a schematic diagram showing the reference setting mechanism of Fig. 1 in a schematic view.

The apparatus for forming a three-dimensional circuit board according to the present invention includes a rotating mechanism (10) that holds a cylindrical or cylindrical object (1) while the central axis is horizontal, and rotates with the central axis as a rotation axis. a holding mechanism (20) for holding the adhesive film (2a) or the circuit substrate (2b) with the release film, and carrying it in a horizontal manner; and a control mechanism (30) for carrying the release film The adhesive layer of the adhesive film (2a) or the circuit substrate (2b) can adjust the relative positional relationship in such a manner that the surface of the rotating object (1) is in contact with each other, and the surface of the object (1) can be applied. The pressure of the pressing is controlled to be constant.

The adhesive film (2a) or the circuit board (2b) with a release film is accommodated in the reference fixing mechanism (40). Further, the adhesive film (2a) and the circuit board (2b) with the release film are cut into a predetermined size in advance in accordance with the size of the object to be attached. For example, when the circuit board is integrally formed as the roller of the object (1), the length of the side of the circuit board (2b) in the direction of the rotation axis of the object (1) is set to be the object (1). The length of the direction of the rotation axis is the same. Further, the length of the side corresponding to the circumferential direction of the object (1) is set to be substantially the same as the circumference of the object (1). However, as will be described later, there is an error in the cutting accuracy, and there is also a tolerance in the shape of the object. In order to correct these differences, it is not necessary to make these dimensional values closely match. Further, in this regard, the case of the adhesive film (2a) with the release film is also the same.

The reference fixing mechanism (40) functions as a holder for the adhesive film (2a) and the circuit board (2b) which are cut into a predetermined size. The reference fixing mechanism (40) is composed of, for example, a fixing plate (41) made of resin and a movable plate (42). The adhesive film (2a) and/or the circuit board (2b) with the release film cut to a predetermined size are set in the reference fixing mechanism (40) in a state where the circuit board is on the upper surface of the circuit board. In the alignment of the reference setting mechanism (40), the adhesive film (2a) of the release film is pressed by the movable plate (42) toward the fixing plate (41) of the fixed reference plate which is written in the XY direction. ) and the circuit board (2b) are set at the correct position.

In addition, when an adhesive which exhibits adhesiveness at normal temperature is used, an adhesive is applied to both surfaces of the substrate on the adhesive film of the general release film, and a release film is disposed on the adhesive. . When such an adhesive film with a release film is used, both the adhesive film (2a) with a release film and the circuit substrate (2b) can be alternately arranged for one reference fixing mechanism (40). However, at this time, the film and the substrate may be disposed in different reference setting mechanisms (40).

On the other hand, an adhesive film having a release film attached to a single side may also be used. At this time, the adhesive film (2a) with the release film and the circuit board (2b) are disposed in different reference setting mechanisms (40).

Further, when a heat-curing type adhesive which exhibits adhesiveness by heating is used, the release film may be omitted, or the release film may be provided on the surface side, so that one reference setting mechanism (40) can be used. ) Used in conjunction with a circuit board, different reference setting mechanisms (40) can also be used.

In addition, when the adhesive film (2a) and the circuit board (2b) of the cut-off release film are set in a plurality of sheets, a magazine in which a plurality of sheets can be stacked and stacked is mounted on a standard. Out of the agency (40).

The adhesive film (2a) and the circuit board (2b) with the release film disposed at the correct position are transported by vacuum suction according to each of the sheets held by the holding mechanism (20) having the small holes. Specifically, the holding mechanism (20) is: an adsorption plate composed of a resin plate or a metal plate having a vacuum-removable small hole; a vacuum suction system connected to the hole; and raising the adsorption plate and the vacuum suction system It consists of a mechanism that descends and moves horizontally.

The holding mechanism (20) rises after adsorbing the adhesive film (2a) or the circuit substrate (2b) attached to the release film.

When the adhesive layer of the adhesive film (2a) is composed of an adhesive which exhibits adhesiveness by heating, the apparatus is provided with a heating mechanism (50). As the heating means (50), a known heater or the like can be used. Since the conditions of the activity vary depending on the type of the binder, the heating temperature and the heating time of the heater are optimized according to the adhesive to be used. The heating temperature is set in the active temperature range of each adhesive.

In addition, in addition to heating the adhesive layer of the adhesive film (2a), the heating mechanism (50) may also heat the object by heating the object (1) to bond the adhesive layer during bonding. Institutional.

Further, in the drawings, a state in which a heat-curing type adhesive is used as the adhesive layer of the adhesive film (2a) is shown. On the other hand, the adhesive layer is composed of an adhesive having adhesiveness at normal temperature, and when a release film is adhered to the back surface of the adhesive film (2a), it is provided to be peeled off from the back surface. The removal mechanism for the film to be removed. A known device for peeling off the release film can also be used for the removal mechanism.

These heating mechanisms (50) and removal mechanisms can also be provided at the same time.

Thereafter, the holding mechanism (20) is moved, and the adhesive film (2a) or the circuit board (2b) with the release film is moved to the object (1) provided with a roll made of metal or resin. Above the rotating mechanism (10). If necessary, at this position, the holding mechanism (20) is lowered. First, the adhesive film (2a) or the circuit board (2b) with the release film is pressed against the surface of the object (1), thereby making The end portion of the adhesive film (2a) or the circuit board (2b) (that is, the side extending toward the direction of rotation of the object (1) toward the front end in the traveling direction) is bonded to the surface. However, this bonding can also be achieved only by horizontal movement.

For the convenience of explanation, although the object (1) is attached to the adhesive film (2a) with the release film and the circuit substrate (2b), the adhesive film (2a) with the release film is actually first applied. Adhesively attached to the object (1), and then the release film adhered to the surface of the adhesive film (2a) is removed, and the circuit substrate (2b) is adhered to the surface of the adhesive film (2a). Thus, a three-dimensional circuit substrate (3) in which the circuit board (2b) is formed on the object (1) can be obtained.

The rotating mechanism (10) has a structure in which two rotating drums that are freely rotatable are adjacent to each other. In the case of a rotating drum, a metal drum can be used. It can also be adhered to the entire circumference of the drum by elastic materials such as rubber. The rotation of the object can be followed by rotatably supporting both ends of the rotating drum by a bearing or the like. The object (1) is placed between the two rotating drums, and is extended toward the side of the rotating film 2a) and the circuit board (2b) in which the peeling film is attached, and the object (1) The rotation axis is moved in a parallel manner to hold the holding mechanism (20). In addition, for example, it is not necessary to form the adhesive film (2a) with a release film or the circuit substrate (2b) at both ends of the object (1), and the both ends may be supported by bearings or the like. Supported in a rotatable manner.

After that, the adhesive film (2a) with the release film or the holding mechanism (20) of the circuit substrate (2b) is horizontally moved, and the adhesive film (2a) or the circuit substrate (2b) from the release film is attached. The side of the object (1) is attached to the surface of the object (1) over the entire circumference of the object (1) in the case of the adhesive film (2a) with the release film, and is on the circuit substrate (2b). In this case, the object (1) is adhered in advance, and adhered to the entire surface of the surface of the adhesive film (2a) from which the release film has been removed. Therefore, there is no possibility of air entrapment between the adhesive film (2a) and the object (1), and between the adhesive film (2a) and the circuit board (2b). Further, even if the shape of the object (1) changes in length, diameter, etc., the holding mechanism (20) can adhere the adhesive film (2a) or the circuit substrate (2b) without changing the jig or structure. ). Further, in order to make the pressure at the time of sticking constant, it is performed by a mechanism using air or oil pressure.

Further, a known device can be used as the mechanism for removing the release film from the surface of the adhesive film (2a) adhered to the object (1). However, since the object (1) to which the adhesive film (2a) is adhered is rotated above the rotary drum (10), the mechanism for removing the release film is supported from the outer periphery of the object (1). After one of the rotating drums (10) is moved away, the release film must be peeled off before reaching the uppermost point. However, when a material having a hard-to-adhesive property such as ruthenium rubber is disposed on the surface as a rotating drum (10), this is not the case.

In the present invention, after the adhesive layer composed of the adhesive film (2a) is formed over the entire circumference of the object (1), the adhesive layer is adhered to the surface of the adhesive layer. The thin film circuit board (2b) forms a three-dimensional circuit board (3). That is, the point at which the adhesive layer and the circuit board (2b) are respectively formed on the object (1) has a feature.

In the present invention, since the adhesive layer and the circuit board (2b) are formed on the object (1) such as a roller, the end portion of the circuit board (2b) formed on the drum can be prevented from floating at the time of pasting. Start.

When a film-formed circuit board with an adhesive is used, the adhesive does not necessarily follow the end of the substrate (insulating film) because of the perpendicularity of the cut side surface or the stretching of the substrate during winding. On the other hand, by separately winding the adhesive film (2a) and the circuit board (2b), the adhesive is inevitably present under the end of the substrate, and since it is wound by applying a certain force to the substrate, Although the end portion has a slight meniscus due to the adhesive, the floating side of the end portion is suppressed, so that floating does not occur. Further, since the end portion of the adhesive layer is shifted from the end portion of the circuit board (2b), the depth of the gap formed between the end portions of the formed film-form circuit substrate (2b) is halved. The gap can be sufficiently filled by the surface protective resin.

Further, as shown in the above aspect, after the adhesive film (2a) with the release film is previously adhered to the surface of the object (1), the circuit is used in addition to the adhesiveness of the adhesive film (2a). The substrate (2b) is adhered to the object (1), and the surface of the object (1) is covered by a heat-hardening type adhesive in advance, and a heat-hardening type adhesive layer is formed on the object. (1) the surface, and the object (1) is directly heated, thereby imparting adhesion to the adhesive layer, and in this state, the circuit substrate (2b) in which the adhesive layer is not formed The same is applied to the surface of the object (1). At this time, although the adhesive step of the adhesive film (2a) can be omitted, it is necessary to use the material of the hard-adhesive property as the rotary drum (10), but as in the above-described aspect, the circuit board after the adhesion can be prevented ( The end portion of 2b) is floated, and a gap formed between the end portions of the adhered circuit substrate (2b) can be filled with a surface protective resin.

Further, when a heat-curing adhesive film is used as the adhesive film (2a), the peeling film is also used in consideration of the ease of alignment during adhesion or the stretching of the adhesive film (2a). The adhesive film is preferably used, but the release film may be omitted, and the adhesive may be activated by heating when the adhesive film (2a) is pasted and when the circuit substrate (2b) is pasted. These pasting jobs.

(Example) (Example 1)

First, the circuit board (2b) is produced in the following manner.

A copper film (A4100, manufactured by Toyobo Co., Ltd.) having a thickness of 35 μm was used to form a copper thin film on the surface by sputtering, and then a copper layer was formed by copper plating. The copper plating was performed by using a plating solution having a copper sulfate concentration of 90 g/liter and a sulfuric acid concentration of 180 g/liter at room temperature, and forming a copper cover having a thickness of 8 μm by a cathode current density of 2 A/dm ² .

Further, a dry film resist (AQ-1158, manufactured by Asahi Kasei Co., Ltd.) was adhered to the surface of the copper layer by a photoresist method, and exposed on a dry film resist using a mask of a predetermined wiring shape, and Development, etching, and peeling of the dry film resist were performed to obtain a circuit substrate (2b).

The obtained circuit substrate (2b) and the adhesive film (2a) of the release film having adhesiveness at normal temperature (manufactured by Dainippon Ink and Chemical Industry Co., Ltd., double-sided adhesive tape #8616), respectively The mold was cut so that the side of the rotation axis direction was 50.3 mm, and the side of the vertical direction was 350 mm. After the cutting, the adhesive film (2a) with the release film and the circuit board (2b) are alternately arranged, and are provided in a cassette (40) shown in Fig. 2 .

Next, the pasting step is performed by using the apparatus for forming a three-dimensional circuit substrate of the schematic view in Fig. 1 . The apparatus includes a vacuum suction elevator (30) (a lifting mechanism by a cylinder), an adsorption plate (20) connected to the elevator, a heater (50), and a protective film (back surface release film) removing device (attachment) a release film on the back surface of the circuit board, a leader tape adhered to an end portion of the release film, a mechanism for peeling off the release film by pinching the guide tape, and a rotating device (10), And a heater for rotating device (not shown). Further, another protective film (surface release film) removing device (the same mechanism as the removal device for the back surface release film) adjacent to the rotating device is provided.

The vacuum adsorption elevator (30) moves the suction plate (20) up and down and horizontally from the cassette (40) toward the rotating device (10). The protective film removing device is adjacent to the heater (50) and is disposed on a line from the cassette (40) toward the rotating device (10). In addition, the heater (50) is not used.

A ruthenium rubber was added to the surface of the metal drum, and a drum having a diameter of 40 mm and a length of 400 mm was used as the rotary drum of the rotary device (10).

In the work, first, a drum (1) composed of an aluminum pipe having a diameter of 16 mm and a length of 300 mm is placed between the rotary drums of the rotary device. In addition, the circuit board (2b), the adhesive film with a peeling film, and the roller 1 are measured correctly for the measurement to be described later. When the gap between the side edges of the circuit board (2b) is calculated from the size of the circuit board (2b) and the adhesive film (2a) with the release film and the diameter of the roll, the logical value is 0.20 mm.

First, the adsorption plate (20) is lowered to the upper of the adhesive film (2a) of the release film contained in the cassette (40), and the adhesive film (2a) to which the release film is attached is adsorbed. The adsorption plate (20) is raised and moved horizontally. In the middle of the horizontal movement, the release film covering the back surface of the adhesive film (2a) with the release film is peeled off by a protective film (back release film) removing device. If the end of the suction plate (20) in the direction of travel reaches above the drum (1) on the rotating device, the suction plate (20) is lowered until the roller (1) can be pressed by a preset pressure. After the end of the adhesive film (2a) in the traveling direction is in contact with the surface of the drum (1), if the adsorption plate (20) is horizontally moved, the roller (1) is also rotated and pasted throughout the circumference. Adhesive film (2a). Thereafter, the release film covering the surface of the adhesive film (2a) adhered to the surface of the roller (1) is peeled off by a protective film (back release film) removing device.

Next, the adsorption plate (20) is lowered onto the circuit board (2b) housed in the cassette (40) to adsorb the circuit board (2b). The adsorption plate (20) is raised and moved horizontally. If the end of the adsorption plate (20) in the traveling direction reaches the drum (1) on the rotating device, the adsorption plate (20) is lowered to be pressed by a preset pressure. Until the drum (1). After the end portion of the circuit board (2b) in the traveling direction is in contact with the surface of the adhesive film (2a), if the adsorption plate (20) is horizontally moved, the roller (1) is also rotated, and the circuit is pasted throughout the circumference. The substrate (2b) is obtained to obtain a three-dimensional circuit substrate (3) on which the circuit substrate (2b) is formed on the drum (1).

Thereafter, the three-dimensional circuit substrate (3) is discharged, and a new roller (1) is placed on the rotating device (10) to change the pressure during the bonding, and the adhesive film is adhered to the plurality of rollers (2a). And circuit board (2b).

From the obtained three-dimensional circuit board (3), the gap between the side edges of the pasted circuit board (2b) was measured for each sample. Further, the end floating state of the elapsed time after the pasting was visually observed. The results are shown in the first table.

(Example 2)

First, the circuit board (2b) was produced in the following manner.

A two-layer substrate (S'perFlex, manufactured by Sumitomo Metal Mining Co., Ltd.) having a thickness of 8 μm of Cu foil laminated on a polyethylene film having a thickness of 38 μm was used, and a dry film resist was adhered to the surface of the copper layer by a photoresist method. (AQ-1158, manufactured by Asahi Kasei Co., Ltd.), and after the mask of the wiring shape is formed, exposure is performed on the dry film resist, and development, etching, and peeling of the dry film resist are performed to obtain a circuit substrate ( 2b).

Then, the obtained circuit board (2b) and the pressure-bonded release film (2a) (SAFW, manufactured by NIKKAN Industrial Co., Ltd.) were respectively cut by a die to rotate the shaft. The side of the direction is 50.3 mm, and the side of the vertical direction is 350 mm. Further, on the adhesive film (2a), a release film is disposed only on the surface side thereof. After the cutting, the adhesive film (2a) with the release film and the circuit board (2b) are alternately arranged, and the cassette (40) shown in Fig. 2 is set.

Next, the adhesive film (2a) was applied in the same manner as in Example 1 except that the heater (50) and the heater for the rotating device (not shown) were used instead of the protective film (back peeling film) removing device. And the bonding of the circuit substrate (2b).

Specifically, the drum (1) composed of an aluminum pipe disposed between the rotary drums of the rotary device is heated by a heater (not shown) by a rotating device, and then the adsorption plate (20) is lowered to be housed in The adhesive film (2a) of the peeling film is attached to the adhesive film (2a) of the peeling film of the cassette (40), and the adhesive film (2a) with the peeling film is adsorbed. The adsorption plate (20) is raised and moved horizontally. The adhesive film (2a) is heated by a heater (50) on the way of horizontal movement. When the end of the suction plate (20) in the traveling direction reaches above the drum (1) on the rotating device, the suction plate (20) is lowered until the roller (1) can be pressed by a preset pressure. After the end of the adhesive layer in the traveling direction contacts the surface of the drum (1), the adsorption plate (20) is horizontally moved, and the roller (1) is also rotated, and the adhesive film is adhered throughout the circumference (2a) ).

Next, maintaining the heated state of the drum (1), in the same manner as in the first embodiment, after the release film is removed from the adhesive film (2a), the circuit board (2b) is adhered to the drum (1) to obtain the roller. (1) A three-dimensional circuit substrate (3) on which a film-form circuit substrate (2b) is formed.

In the same manner as in the first embodiment, the adhesive film (2a) and the circuit board (2b) were adhered to a plurality of rollers (1).

From the obtained three-dimensional circuit board (3), the gap between the side edges of the pasted circuit board (2b) was measured for each sample. Further, the end floating state of the elapsed time after the pasting was visually observed. The results are shown in Table 2.

(Example 3)

In the case of the drum (1), an aluminum tube having an adhesive layer formed on its surface is used. Specifically, dip coating is carried out by using a solution in which a solution-type denatured epoxy adhesive (ARONMIGHTY AS-60, manufactured by Toagosei Co., Ltd.) is diluted twice with toluene. The drum (1) was heated by a rotating device in the same manner as in Example 2 except that the dried one was used at 100 ° C for 2 minutes, and the adhesive film (2a) was omitted. After heating, the circuit board (2b) is adhered in a state where the adhesive layer is activated, and a three-dimensional circuit board (3) is obtained.

From the obtained three-dimensional circuit board (3), the gap between the side edges of the pasted circuit board (2b) was measured for each sample. Further, the end floating state of the elapsed time after the pasting was visually observed. The results are shown in Table 3.

1. . . Object (roller)

2a. . . Adhesive film

2b. . . Circuit substrate

3. . . Stereo circuit substrate

10. . . Rotating mechanism (roller, device)

20. . . Holding mechanism

30. . . Control mechanism

40. . . Benchmarking agency

41. . . Fixed plate

42. . . Movable plate

50. . . Heating mechanism

Fig. 1 is a schematic view showing an embodiment of a device for forming a three-dimensional circuit substrate of the present invention.

Fig. 2 is a schematic view showing a reference setting mechanism of Fig. 1.

1. . . Object (roller)

2a. . . Adhesive film

2b. . . Circuit substrate

3. . . Stereo circuit substrate

10. . . Rotating mechanism (roller, device)

20. . . Holding mechanism

30. . . Control mechanism

40. . . Benchmarking agency

50. . . Heating mechanism

Claims (15)

A method for forming a three-dimensional circuit substrate, wherein a cylindrical or cylindrical object is rotatably held while the central axis is horizontal, and the adhesive film attached to the separator is adsorbed and lowered. And moving the moving means, and moving the moving means, and bonding the end portion of the adhesive film attached to the release film to the surface of the object to control the pressure against the surface of the object, Adhering the adhesive film of the release film horizontally and rotating the object, thereby adhering the adhesive film of the release film to the surface of the object, and the adhesive film from the adhesive The surface is removed from the release film, and then the circuit substrate is adsorbed to the moving means, and the moving means is moved to adhere the end portion of the circuit board to the surface of the adhesive film adhered to the surface of the object. While controlling the pressure against the surface of the adhesive film, the circuit substrate is horizontally moved, and the object and the adhesive are thin. Rotation, whereby the circuit board and adhered to the surface of the film bonding agent. The method for forming a three-dimensional circuit substrate according to claim 1, wherein the adhesive film of the adhesive film with a release film is an adhesive having adhesiveness at normal temperature, and is also provided on the back of the film. In the case of a release film, the release film of the back surface is removed before the adhesive film of the release film is adhered to the surface of the object. The method for forming a three-dimensional circuit substrate according to claim 1, wherein the adhesive film of the adhesive film with the release film is heated hard In the case of the adhesive of the type, the film is heated before the adhesive film of the release film is adhered to the surface of the object. The method for forming a three-dimensional circuit substrate according to the first aspect of the invention, wherein the adhesive agent for the adhesive film of the release film is a heat-curing adhesive, after the object is heated, The film is bonded to the surface of the object. The method of forming a three-dimensional circuit substrate according to claim 1, wherein the adhesive film of the release film is adhered to the entire surface of the object by using a forming device of the three-dimensional circuit substrate, and the bonding is performed. After the release film on the surface of the film is removed, the circuit substrate is adhered to the surface of the adhesive film, wherein the device for forming the three-dimensional circuit substrate has a rotating mechanism and maintains a cylindrical shape while the central axis is horizontal. Or a cylindrical object that rotates with the central axis as a rotation axis; and a holding mechanism that is movable up and down and horizontally moved to hold the adhesive film or circuit substrate with the release film, and horizontally The method of adjusting the relative positional relationship in such a manner that the adhesive film or the circuit board with the release film attached to the surface of the object to be rotated is connected, and the surface of the object can be adjusted. The pressing pressure is controlled to be constant; and the removing mechanism is used to cover the adhesive film attached to the surface of the object The release film on the surface is removed. A method for forming a three-dimensional circuit substrate, which covers a surface of a cylindrical or cylindrical object with a heat-curing type adhesive, and is in the middle The object is held in a rotatable manner while the mandrel is horizontal, and after the object is heated, the circuit board is attracted to a moving means that can be raised and lowered and moved in the horizontal direction, and the moving means is moved. And bonding the end portion of the circuit board to the surface of the object, and horizontally moving while controlling the pressure against the surface of the object, and rotating the object, thereby adhering the circuit board to the object. The surface of the object. A method for forming a three-dimensional circuit substrate, wherein a cylindrical or cylindrical object is rotatably held while the central axis is horizontal, and the heat-curable adhesive film is adsorbed to rise and fall and to be horizontal And moving the moving means to move the heat-curing adhesive film or the object, and bonding the end portion of the heat-curing adhesive film to the object The surface is horizontally moved while controlling the pressure against the surface of the object, and the object is rotated, whereby the heat-curing adhesive film is adhered to the surface of the object, and then the circuit is made The substrate is adsorbed to the moving means, and the moving means is moved, and after the object is heated, the end portion of the circuit board is bonded to the surface of the adhesive film adhered to the surface of the object, and the control is performed thereon. The pressure of the surface of the adhesive film is horizontally moved, and the object and the adhesive film are rotated. This and the circuit board is adhered to the surface of the film bonding agent. A forming device for a three-dimensional circuit substrate, comprising: a rotating mechanism; The cylindrical or cylindrical object is held while the central axis is horizontal, and the central axis is rotated; the holding mechanism is movable up and down and horizontally moved to hold the release film The adhesive film or the circuit substrate is conveyed in a horizontal manner; and the control mechanism adjusts the relative position in such a manner that the adhesive film or the circuit substrate with the release film can be attached to the surface of the object to be rotated a relationship, and a pressure for pressing the surface of the object to be controlled to be constant; and a removing mechanism for removing the release film covering the surface of the adhesive film attached to the surface of the object . The apparatus for forming a three-dimensional circuit board according to the eighth aspect of the invention, further comprising a removal mechanism for removing a release film covering the back surface of the adhesive with the release film. The apparatus for forming a three-dimensional circuit board according to the eighth aspect of the invention, further comprising a heating mechanism for heating the adhesive film or the object. The apparatus for forming a three-dimensional circuit board according to the eighth aspect of the invention, wherein the rotating mechanism is configured by two rotating rollers arranged to rotate between the objects. The apparatus for forming a three-dimensional circuit substrate according to the eighth aspect of the invention, wherein the adhesive film of the release film and/or the foregoing is provided in an axial direction of the object to be placed on the rotating mechanism A reference setting mechanism for housing the circuit board. The three-dimensional shape as described in any one of claims 1 to 5 In the method of forming a circuit board, the adhesive film having the release film and the circuit board are previously cut into a predetermined size in accordance with the size of the object. The method of forming a three-dimensional circuit substrate according to claim 6, wherein the circuit board is previously cut into a predetermined size in accordance with the size of the object. The method of forming a three-dimensional circuit board according to the seventh aspect of the invention, wherein the heat-curable adhesive film and the circuit board are previously cut into a predetermined size in accordance with the size of the object.