JP2007208028A - Manufacturing method of solid interconnection and solid wiring board fabricated thereby - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of fabricating a solid interconnection which allows the formation of solid interconnection electrodes in a fine pitch, and has an excellent connection reliability. <P>SOLUTION: This manufacturing method of solid interconnections fabricates a first interconnection electrode group 30 in a plurality of stages, and a second interconnection electrode 40 for connecting the first interconnection electrode group 30 at least in the height direction by stereolithography. The method comprises a process of carrying out batch exposure in a predetermined pattern formed in a mask 150 and in a predetermined thickness, to form the first interconnection electrode group 30 and the second interconnection electrode 40 sequentially in the height direction; and a process of forming an insulation layer to bury the first interconnection electrode group 30 and the second interconnection electrode 40 in. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a manufacturing method of a three-dimensional wiring capable of forming a high-density, three-dimensional wiring with high productivity, and a three-dimensional wiring substrate manufactured by the manufacturing method.

  In recent years, cellular phones, portable information terminals, and the like have made rapid progress toward integrated information devices by incorporating various functions therein. Therefore, in order to realize diversified functions with a limited volume, it is premised on miniaturization and high performance of various devices such as semiconductor chips. However, even a semiconductor chip that has been highly integrated is becoming difficult to improve significantly with conventional methods in terms of cost and technology.

  Therefore, at present, the importance of high-density mounting technology for storing devices in a compact manner is increasing.

  Further, in order to achieve high integration of devices, two-dimensional to three-dimensional wiring that can cope with fine wiring of devices is desired. Therefore, the point of development is how to form a three-dimensional wiring by a simple process with high density.

  Conventionally, a printed circuit board generally having a three-dimensional wiring structure as shown in FIG. 14 has been realized (see, for example, Patent Document 1).

  A conventional printed circuit board having a multilayer structure laminated in four layers will be briefly described below.

  FIG. 14 is a partial perspective view for explaining a main part structure of a conventional printed circuit board having a multilayer structure laminated in four layers and a manufacturing method thereof.

  First, as shown in FIG. 14A, on one side of the resin film 1010, for example, three conductive patterns 1020 formed by printing a conductive paste and conductive vias 1030 in which via holes are filled with the conductive paste, for example, three sheets The single-sided conductor film 1050 is formed. Here, in the conductor pattern 1020, a land 1040 for allowing a positional deviation from the conductive via 1030 is formed when the single-sided conductor film 1050 is laminated.

  Next, as shown in FIG. 14B, three single-sided conductor films 1050 are placed with the positions of the conductor pattern 1020 and the conductive via 1030 aligned. Then, the printed circuit board 1000 having a four-layer structure as shown in FIG. 14C is formed by applying pressure while heating from above and below the three single-sided conductor films 1050 using, for example, a press. .

  Moreover, the manufacturing method of the wiring board which has a three-dimensional wiring structure is disclosed using the optical shaping method (for example, refer patent document 2).

  Hereinafter, a method for manufacturing a wiring board having a three-dimensional wiring structure using an optical modeling method will be described with reference to FIGS. 15 and 16.

  FIG. 15 is a cross-sectional view schematically showing a wiring board manufacturing apparatus, and FIG. 16 is a cross-sectional view for explaining a wiring board manufacturing method using the manufacturing apparatus of FIG.

  As shown in FIG. 15, the wiring board manufacturing apparatus 1100 includes a first storage tank 1120 that stores an insulating liquid resin 1110 and a second storage tank 1140 that stores a conductive liquid resin 1130. And it has the movement control part 1180 which moves the 1st storage tank 1120 and the 2nd storage tank 1140 by turns the board | substrate 1160 installed in the table 1150. FIG. Further, for example, the insulating liquid resin 1110 or the conductive liquid resin 1130 on the substrate 1160 disposed at a predetermined depth is cured by scanning a predetermined pattern with a laser irradiation device 1190 that generates ultraviolet rays or the like, A predetermined pattern is formed by stereolithography.

  Hereinafter, a specific manufacturing method will be described with reference to FIG.

  First, as shown in FIG. 16A, the substrate 1160 is immersed in the insulating liquid resin 1110 of the first storage tank 1120, and an electrical insulating layer 1200 is formed on the surface of the substrate 1160 with a predetermined thickness by stereolithography. Form.

  Next, as shown in FIG. 16B, after the conductive liquid resin 1130 is dipped in the conductive liquid resin 1130 of the second storage tank 1140 and flattened to a predetermined thickness, a predetermined conductor pattern 1210 is formed. Then, it is formed on the electrical insulating layer 1200 by stereolithography. Thereafter, the conductive liquid resin 1130 other than the conductor pattern 1210 is removed to form the first conductor pattern 1210.

  Next, as shown in FIG. 16C, the substrate 1160 is immersed in the insulating liquid resin 1110 of the first storage tank 1120, and the electrically insulating layer 1220 is formed on the conductor pattern 1210 of the substrate 1160 by stereolithography. Is formed with a predetermined thickness. At this time, the via hole 1230 is formed by removing the insulating liquid resin 1110 without irradiating the insulating liquid resin 1110 at a predetermined position of the conductor pattern 1210 with light.

  Next, as shown in FIG. 16D, after the conductive liquid resin 1130 is immersed in the conductive liquid resin 1130 of the second storage tank 1140 and flattened to a predetermined thickness, the via hole 1230 is covered. A second-layer conductor pattern 1240 is formed on the electrically insulating layer 1220 by stereolithography.

  Next, as shown in FIG. 16E, an electrically insulating layer 1250 and a third conductor pattern 1260 are formed on the conductor pattern 1240 by the same method as described above.

  It is described that a multilayer wiring board can be formed with high productivity through the above steps.

  Moreover, the example which formed the three-dimensional structure by the optical modeling method using a liquid crystal mask is disclosed (for example, refer patent document 3).

  According to the above method, a plurality of parts with different shapes can be produced simultaneously by forming a three-dimensional shape of a modeling object made of a photo-curing resin with a liquid crystal mask in a non-laminated manner. Has been shown to be suitable.

  Similarly, a method for manufacturing a circuit component in which an electric circuit pattern is formed on a three-dimensional structure using an optical modeling method is disclosed (for example, see Patent Document 4).

According to the above, as shown in FIG. 17, the three-dimensional structure 1300 is formed by curing the photocurable resin in a layer shape by the optical modeling method. Then, a metal plating is formed on the surface, and the electric circuit pattern 1310 is formed by using the metal plating by a photolithography method and an etching method. As a result, a circuit component in which the electric circuit pattern 1310 is formed on the three-dimensional structure 1300 can be obtained in a short period of time.
JP 2002-368418 A JP 2004-22623 A JP 2001-252986 A Japanese Patent Laid-Open No. 10-12995

  However, in the printed circuit board as shown in Patent Document 1, a laminated substrate is configured by forming conductor patterns on the upper and lower surfaces of a plurality of resin films and connecting to conductive vias formed in the resin film. Then, the land is formed in consideration of the shift of the connection position between the conductive via and the conductive pattern when the resin film is laminated.

  For this reason, the following problem described with reference to FIG. 18 occurs.

  FIG. 18 is a schematic diagram for explaining a state in which the conductive via 1030 and the conductor pattern 1020 are connected via the land 1040.

  That is, as shown in the plan view of FIG. 18B, the conductor pattern 1020 must be disposed away from the land 1040 by the land 1040 connected to the conductive via 1030, and the conductor pattern 1020 is formed at a fine pitch. There was a problem that could not be done.

  Moreover, since the conductor pattern 1020 can be formed only on both surfaces of the resin film, high-density three-dimensional wiring is limited.

  In addition, since the conductive via 1030 and the conductor pattern 1020 are connected by pressure contact or pressure bonding, there is a problem in connection reliability such as increase in connection resistance due to foreign matters mixed in the connection interface or formation of an oxide film. In order to prevent this, if the interface is processed by etching or the like, there arises a problem that productivity is lowered due to an increase in the number of processes.

  In addition, when a plurality of resin films are laminated and integrated, there is a problem in reliability because peeling or the like is likely to occur due to remaining bubbles.

  Similarly, the wiring board shown in Patent Document 2 has an advantage that a wiring board having a multilayer structure can be easily manufactured because the conductor pattern and the electrically insulating layer are formed by switching the storage tank. .

  However, the wiring board also has a problem that a conductor pattern with a fine pitch cannot be formed because the conductor pattern is larger than the shape of the conductive via.

  And since the conductor pattern was formed on the electrically insulating layer formed flat, the subject that a conductor pattern could not be formed in arbitrary positions occurred.

  Furthermore, since the conductor pattern, the conductive via, and the electrically insulating layer are formed for each layer in separate steps, productivity is lowered and there is a problem in the reliability of the connection between the conductor pattern and the conductive via. It was.

  Further, according to Patent Document 3, three-dimensional insulating structures can be manufactured in a lump, but there is no disclosure regarding a three-dimensional wiring electrode that is electrically connected.

  Moreover, the circuit component shown by patent document 4 forms an electric circuit pattern in the predetermined position of the surface of a three-dimensional structure.

  Therefore, it is difficult to form an electric circuit pattern having a three-dimensional structure. Furthermore, since the electric circuit pattern is formed by etching, it is difficult to form a fine three-dimensional structure at a step, resulting in low productivity.

  The present invention solves the above-described problems, and provides a three-dimensional wiring manufacturing method capable of forming a three-dimensional wiring having a fine pitch in a batch with high productivity, and a three-dimensional wiring board manufactured by the method. It is the purpose.

  In order to achieve the above-described object, a method for manufacturing a three-dimensional wiring according to the present invention includes a first wiring electrode group having a plurality of stages and a second wiring that connects at least a height direction between the first wiring electrode group. A three-dimensional wiring manufacturing method using a stereolithography method, wherein a predetermined pattern formed on a mask is collectively exposed to a predetermined thickness, and the first wiring electrode is sequentially formed in a height direction. A method of forming a group and a second wiring electrode.

  Furthermore, a method of further forming an insulating layer in which the first wiring electrode group and the second wiring electrode are embedded may be included.

  By these methods, a three-dimensional wiring electrode group can be produced with high productivity. Also, after forming the three-dimensional wiring electrode group, it is possible to eliminate the concept of the layer in the multilayer substrate formed for each layer by providing an insulating layer for embedding them, and to produce the wiring electrode group at an arbitrary position. it can. In addition, the reliability of the three-dimensional wiring electrode group can be improved by the insulating layer.

  Further, the mask may be a liquid crystal panel for creating a pattern.

  By this method, a three-dimensional wiring electrode group can be easily and continuously formed in an arbitrary shape and an arbitrary direction with a single mask.

  Furthermore, the first wiring electrode group and the second wiring electrode may be formed of a photocurable resin containing a conductive filler.

  By this method, a three-dimensional wiring electrode group that is electrically connected simultaneously with photocuring can be formed.

  Furthermore, the first wiring electrode group and the second wiring electrode may be composed of a photocurable resin and a metal layer formed on the outer surface thereof.

  By this method, a three-dimensional wiring electrode group having low wiring resistance and excellent high-frequency transmission characteristics can be formed at a time with good productivity.

  Further, the photocurable resin may be a resin that cures with visible light.

  By this method, a three-dimensional wiring electrode group can be formed without deteriorating the characteristics of the liquid crystal material of the liquid crystal panel.

  In addition, the three-dimensional wiring board of the present invention has a configuration manufactured by a three-dimensional wiring manufacturing method.

  Thereby, the three-dimensional wiring board excellent in design freedom can be realized with high productivity.

  According to the method for manufacturing a three-dimensional wiring of the present invention, a three-dimensional wiring electrode group having a fine pitch that realizes high-density mounting can be formed at a time, and thus an excellent effect in improving productivity can be achieved.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
Below, the manufacturing method of the solid wiring in the 1st Embodiment of this invention is demonstrated in the example applied to the solid wiring board.

  FIG. 1A is a partial plan view schematically showing a three-dimensional wiring board manufactured by the three-dimensional wiring manufacturing method according to the first embodiment of the present invention, and FIG. FIG. 4C is a cross-sectional view taken along the line A, and FIG.

  As shown in FIG. 1, the three-dimensional wiring substrate 10 is three-dimensionally formed on a surface of an insulating substrate 20 made of, for example, polyethylene terephthalate (PET) by a photocurable resin containing a conductive filler such as silver particles. The formed wiring electrode group is embedded in the insulating layer 50.

  Here, in order to make the explanation easy to understand, the band electrode group shown in FIG. 1A is referred to as the first wiring electrode group 30, and the circle electrode group is shown as the second wiring electrode group 30. The wiring electrode 40 is used. The second wiring electrode 40 has the same function as the conductive via in the conventional wiring board, and connects the first wiring electrode group 30 formed in a plurality of stages in the height (thickness) direction. To do. Needless to say, the shape of the second wiring electrode 40 is not limited to a circular shape, and may be arbitrarily designed, for example, a polygon or an ellipse.

  In the three-dimensional wiring board 10 formed by the three-dimensional wiring manufacturing method according to the first embodiment of the present invention, the first wiring electrode group 30 is provided in the height direction of the three-dimensional wiring board 10. The first wiring electrode 32 corresponding to the lowermost stage, the first wiring electrode 34 corresponding to the second stage, and the first wiring electrode 36 corresponding to the uppermost stage are configured in, for example, three stages. An example is shown.

  Below, the manufacturing method of the three-dimensional wiring in the 1st Embodiment of this invention is demonstrated using the manufacturing method of the three-dimensional wiring board 10 as an example using FIG. 2 and FIG.

  FIG. 2 is a cross-sectional view for explaining a method for manufacturing a three-dimensional wiring board using the method for manufacturing a three-dimensional wiring in the first embodiment of the present invention. FIG. 3 is a cross-sectional view for explaining the manufacturing method of the three-dimensional wiring in the first embodiment of the present invention.

  First, as shown in FIG. 2A, an insulating substrate 20 such as a PET film having a thickness of 20 μm to 1000 μm, a polyimide film, a glass epoxy substrate, a ceramic substrate, a glass substrate, or the like is prepared.

  Next, as shown in FIG. 2B, the first wiring electrode 32, the second wiring electrode 40, and the second stage are sequentially formed on the insulating substrate 20 by using an optical modeling method. The first wiring electrode 34, the second wiring electrode 40, and the first wiring electrode 36 in the third stage are formed.

  Here, the manufacturing method of the three-dimensional wiring electrode group which consists of the 1st wiring electrode group 30 and the 2nd wiring electrode 40 is demonstrated in detail using FIG.

  First, as shown in FIG. 3A, for example, a container 110 filled with a urethane-based photocurable resin (hereinafter referred to as “conductive photocurable resin”) 100 containing a conductive filler such as silver particles. The insulating substrate 20 placed on the table 120 that can move at least in the Z direction is immersed therein.

  Then, a mask 150 having an opening 140 having a predetermined pattern made of, for example, a metal that blocks at least ultraviolet light or visible light is disposed on the conductive photocurable resin 100 covering the insulating substrate 20. Then, the conductive photocurable resin 100 on the insulating substrate 20 is irradiated with, for example, irradiation light 130 emitted from a light irradiation device (not shown) through the opening 140 of the mask 150. Thus, for example, the first wiring electrodes 32 in the first stage are collectively formed on the insulating substrate 20 via the mask 150 having the pattern-shaped openings 140 of the first wiring electrodes 32 in the first stage. Formed in thickness. The predetermined thickness is, for example, 1 μm to 100 μm in the case of a wiring pattern, and the thickness can be arbitrarily adjusted by the intensity of the irradiation light 130 and the irradiation time. At this time, it is preferable to remove the influence of the diffracted light generated by the opening 140 of the mask 150. Thereby, a pattern with a steep cross-sectional shape can be formed.

  Here, an argon laser, a He—Cd laser, a YAG laser, a helium neon laser, a semiconductor laser, a high-pressure mercury lamp, a xenon lamp, a metal halide lamp, a tungsten lamp, a halogen lamp, a fluorescent lamp, or the like can be used as the light irradiation device.

  Next, as shown in FIG. 3B and FIG. 3C, the table 120 is sequentially moved in the Z direction, and a predetermined pattern corresponding to the first wiring electrode group 30 and the second wiring electrode 40 is obtained. The conductive photo-curing resin 100 is cured while sequentially replacing the mask 150 having the opening 140 to form the first wiring electrode group 30 and the second wiring electrode 40.

  Thereby, a three-dimensional wiring electrode group as shown in FIG. 2B is formed in the conductive photocurable resin 100.

  Here, the table 120 is moved corresponding to the replacement of the mask 150 as described below. At that time, for example, according to the thickness of each step of the first wiring electrode group 30 and the height (thickness) of the second wiring electrode 40, the intensity of the irradiation light 130, the irradiation time, and the conductivity of the conductive photocurable resin 100. The amount of movement of the table 120 is controlled by the control device 160 in consideration of the shape and size of the filler.

  Hereinafter, the manufacturing method of the three-dimensional wiring in which the shape of the opening of the mask and the shape of the opening of the mask are formed on the insulating substrate will be described in more detail with reference to FIGS.

  FIG. 4 is a plan view showing an example of a mask at each processing stage for forming the first wiring electrode group and the second wiring electrode on the three-dimensional wiring board. 5 is a plan view showing a wiring electrode group formed on the insulating substrate corresponding to each mask of FIG. 4, and the right side of FIG. 5 is the left side of FIG. It is AA sectional view. Note that the right side of FIG. 5 shows only a predetermined pattern after the conductive photo-curing resin is cured, but in the actual process, there is an uncured conductive photo-curing resin around it. Yes.

  First, as shown in FIG. 4A, the mask 150 having the first wiring electrode-shaped opening 141 in the first stage is irradiated with irradiation light to cure the conductive photo-curing resin. As a result, the first wiring electrode 32 in the first stage is formed on the insulating substrate 20 as shown in FIG. At this time, the insulating substrate 20 is held in a state where the thickness of the first wiring electrode 32 of the first stage, for example, about 20 μm, is sunk in the conductive photo-curing resin, and optical modeling is performed.

  Next, as shown in FIG. 4B, a mask having a second wiring electrode-shaped opening 142 for connecting the first wiring electrode at the first stage and the first wiring electrode at the second stage. 150 is irradiated with irradiation light to cure the conductive photocurable resin. Thereby, the second wiring electrode 40 is formed on the first wiring electrode 32 in the first stage as shown in FIG. At this time, the insulating substrate 20 is further held in a state where the thickness of the second wiring electrode 40, for example, about 50 μm, is submerged in the conductive photo-curing resin, and optical modeling is performed.

  Next, as shown in FIG. 4C, the mask 150 provided with the opening 143 in the first wiring electrode shape in the second stage connected to the second wiring electrode is irradiated with irradiation light to make the conductive property conductive. The photo-curing resin is cured. As a result, as shown in FIG. 5C, the second-stage first wiring electrode 34 is formed on the second wiring electrode 40. At this time, the insulating substrate 20 is further held in a state where the thickness of the first wiring electrode 34 in the second stage, for example, about 20 μm, is sunk in the conductive photo-curing resin, and optical modeling is performed.

  Next, as shown in FIG. 4D, a mask having a second wiring electrode-shaped opening 144 for connecting the first wiring electrode at the second stage and the first wiring electrode at the third stage. 150 is irradiated with irradiation light to cure the conductive photocurable resin. Thereby, the second wiring electrode 40 is formed on the first wiring electrode 34 in the second stage as shown in FIG. At this time, the insulating substrate 20 is further held in a state where the thickness of the second wiring electrode 40, for example, about 75 μm, is submerged in the conductive photo-curing resin, and optical modeling is performed.

  Next, as shown in FIG. 4 (e), the mask 150 having the first wiring electrode-shaped opening 145 connected to the second wiring electrode is irradiated with irradiation light, thereby making it conductive. The photo-curing resin is cured. As a result, as shown in FIG. 5E, the third-stage first wiring electrode 36 is formed on the second wiring electrode 40. At this time, the insulating substrate 20 is held in a state where the thickness of the first wiring electrode 36 of the third stage, for example, about 25 μm, is sunk in the conductive photo-curing resin, and optical modeling is performed.

  As described above, according to the manufacturing method of the three-dimensional wiring in the first embodiment of the present invention, at least the connection portions of the first wiring electrode group and the second wiring electrode are continuously integrated in the same shape. Further, they can be formed in a lump in the plane direction.

  The three-dimensional wiring electrode group shown in FIG. 2B is formed in the uncured conductive photocurable resin 100 by the above-described three-dimensional wiring manufacturing method.

  Next, as shown in FIG. 2 (c), by removing the uncured conductive photo-curing resin 100 that has not been irradiated with the irradiation light 130 using, for example, immersion in a solvent, air blow, or spin coater, A three-dimensional wiring electrode group composed of the first wiring electrode group 30 and the second wiring electrode 40 is formed.

  Next, as shown in FIG. 2D, a first wiring electrode group 30 shown in FIG. 2C or the like is filled in a container (not shown) filled with a liquid resin such as acrylic, urethane, or epoxy. A wiring electrode group composed of the second wiring electrodes 40 is immersed. Then, for example, by curing with ultraviolet rays, the three-dimensional wiring board 10 having the insulating layer 50 is formed.

  The insulating layer 50 can also be formed by injecting a PET resin around the wiring electrode group using, for example, a capillary phenomenon.

  As described above, according to the method of manufacturing a three-dimensional wiring according to the first embodiment of the present invention, a three-dimensional wiring electrode group composed of a first wiring electrode group and a second wiring electrode is batched. Therefore, for example, a three-dimensional wiring board can be easily manufactured with greatly improved productivity.

  Further, the first wiring electrode group and the second wiring electrode can be formed by arranging the mask at any position by exchanging the mask. As a result, it is possible to realize a manufacturing method with a high degree of design freedom in which the formation positions of the first wiring electrode group and the second wiring electrode are not limited.

  In addition, since the first wiring electrode group and the second wiring electrode can be continuously formed only by exchanging the mask, the interface between the first wiring electrode group and the second wiring electrode is not formed. Therefore, it is possible to realize a method for manufacturing a three-dimensional wiring that has no increase in connection resistance at the interface and is excellent in connection reliability with small variations.

  Moreover, as will be described with reference to FIG. 6, a wiring electrode group composed of a first wiring electrode group and a second wiring electrode formed by using the manufacturing method of the three-dimensional wiring in the first embodiment of the present invention. Has the following characteristics.

  FIG. 6A is a partial perspective view showing a connection state between the first wiring electrode group and the second wiring electrode, and FIG. 6B shows the connection between the first wiring electrode group and the second wiring electrode. It is a fragmentary top view explaining arrangement relation.

  That is, as shown in FIG. 6A, the first wiring electrode 32 in the first stage and the first wiring electrode 34 in the second stage are at least connected to each other via the second wiring electrode 40. Are formed continuously and integrally in the same shape. Therefore, as shown in FIG. 6B, there is no need to provide a land that is conventionally required. As a result, since the first wiring electrode group and the second wiring electrode can be formed continuously, it is not necessary to form a land in consideration of misalignment, and the first wiring electrode group and the second wiring electrode can be formed at a fine pitch. 2 wiring electrodes can be formed.

  In the first embodiment of the present invention, an example in which a predetermined wiring electrode group is three-dimensionally formed by exchanging masks has been described. However, the present invention is not limited to this. For example, a predetermined pattern can be created based on CAD data, for example, a matrix drive type liquid crystal panel can be used as a mask. At this time, in order to prevent deterioration of characteristics of the liquid crystal material of the liquid crystal panel, the irradiation light for irradiating the liquid crystal panel is visible light such as an argon laser (wavelength 488 nm) or a helium neon laser (wavelength 632.8 nm). It is preferable. Among these, when a fine shape is formed, one having a short wavelength is more preferable.

  Thereby, since the mask replacement step can be omitted, a method for manufacturing a three-dimensional wiring in a shorter time can be realized.

  In addition, since the liquid crystal panel can continuously create an arbitrary pattern by an electric signal, for example, as shown in FIG. 7, the first wiring electrodes 170 and 175 and the second wiring electrodes having different arbitrary inclinations and cross-sectional shapes are used. 42 can be freely formed. Thereby, the manufacturing method of the solid wiring excellent in the versatility with a high design freedom is further realizable.

  Below, the optical modeling apparatus which implement | achieves the manufacturing method of the three-dimensional wiring in the 1st Embodiment of this invention is demonstrated using FIG.

  FIG. 8 is a schematic diagram of an optical modeling apparatus 200 that realizes the method of manufacturing a three-dimensional wiring according to the first embodiment of the present invention.

  As shown in FIG. 8, the optical modeling apparatus 200 includes, for example, a light irradiation apparatus 202, a collimator unit 204, polarizers 206 and 208, a pattern creation apparatus 210, a lens 212, a mirror 214, an objective lens 216, and a conductive photo-curing resin. It comprises a filled container 218, a table 220 for moving an object, a control device 222 for controlling the table 220, and the like.

  Note that the light irradiation device 202 includes a laser or a lamp that generates visible light, ultraviolet light, or the like.

  The pattern creating apparatus 210 is composed of a metal replaceable mask or a liquid crystal panel. In the case of a liquid crystal panel, for example, predetermined two-dimensional pattern information such as CAD data is displayed on the liquid crystal panel 211 via a control unit 224 such as a PC.

  Hereinafter, the operation of the liquid crystal panel 211 will be described as an example of the pattern creation device 210.

  First, for example, the laser beam 203 emitted from the light irradiation device 202 is expanded in beam diameter by the collimator unit 204 so that the entire surface of the liquid crystal panel 211 can be irradiated.

  Then, for example, light of a linearly polarized component of the laser beam 203 is cut by a polarizer 206 provided in front of the liquid crystal panel 211 to improve the contrast of the pattern.

  Further, the liquid crystal panel 211 displays a predetermined pattern output from the control unit 224 by, for example, matrix driving of a thin film transistor (TFT).

  A pattern displayed on the liquid crystal panel 211 is converted into light shading by a polarizer 208 provided after the liquid crystal panel 211.

  Then, the laser beam 203 that has passed through the polarizer 208 is coupled to the conductive photocurable resin 100 through an optical system that converts a pattern composed of the lens 212, the mirror 214, the objective lens 216, and the like into an arbitrary size. And expose with a predetermined pattern.

  Further, the control device 222 sequentially moves the table 220 in the Z direction, for example, to form a three-dimensional wiring.

  Needless to say, the pattern creating apparatus 210 includes a mechanism for exchanging the mask in accordance with the operation of the table 220 when the pattern creating apparatus 210 is constituted by a plurality of masks.

  In the above description, the laser beam 203 is irradiated from the upper surface of the container 218. However, the present invention is not limited to this. For example, as shown in the optical modeling apparatus 250 in FIG. 9, the laser beam 203 is transmitted through the bottom surface of the container 218. For example, the light transmission window 226 is formed of quartz or the like, and the insulating substrate 20 installed on the table 220 is pulled up. However, a three-dimensional solid wiring may be formed. In this case, the conductive photo-curing resin 100 is supplied with good flatness because it is regulated by the bottom surface of the container 218 and the insulating substrate 20. Therefore, after flattening using the viscosity of the conductive photo-curing resin 100, it is possible to form in a short time compared to the case where the table 220 is pulled down to form the three-dimensional wiring.

  In the above description, the wiring electrode group is embedded in the insulating layer. However, the present invention is not limited to this. For example, when the wiring electrode group has the mechanical strength necessary for maintaining the three-dimensional wiring structure, the insulating layer may not be provided. Thereby, since there is no dielectric layer such as an insulating layer, a three-dimensional wiring board having a three-dimensional wiring with further improved high-frequency characteristics can be obtained.

  Furthermore, when an insulating layer is formed, the insulating substrate may be removed by, for example, a polishing method. As a result, a thinner three-dimensional wiring board can be realized.

  Hereinafter, another example to which the method for manufacturing a three-dimensional wiring according to the first embodiment of the present invention is applied will be described with reference to FIG.

  FIG. 10 is a diagram for explaining another example to which the manufacturing method of the three-dimensional wiring according to the first embodiment of the present invention is applied.

  That is, the present invention is applied to a so-called wafer level chip size package (WL-CSP) in which a three-dimensional wiring is formed and rewired to the electrode terminal 320 of the semiconductor chip 310 formed on the wafer 300.

  FIG. 10A is a plan view showing a semiconductor chip 310 formed on a wafer 300 such as silicon. FIGS. 10B to 10D are three-dimensional wirings on the wafer 300 in FIG. It is the sectional view on the AA line of the same figure (a) explaining the process of forming. 10 (b) to 10 (d) are shown as individual semiconductor chips 310, but are usually formed in the state of a wafer 300. FIG.

  First, as shown in FIG. 10A, a wafer 300 on which semiconductor chips 310 are formed is prepared.

  Next, as shown in FIG. 10B, the second wiring electrode 340 and the first wiring are formed on the electrode terminals 320 of the semiconductor chip 310 formed at a pitch of 40 μm, for example, by the optical modeling method described above. A wiring electrode group 330 including the electrodes 350 is formed. As a result, the minute electrode terminals 320 formed on the semiconductor chip 310 are formed on the entire surface of the semiconductor chip 310 by three-dimensional wiring, for example, and can be flip-chip mounted on another circuit board, for example, at a pitch of 120 μm. Rewiring is performed in the arrangement of the electrode terminals 355.

  Next, as shown in FIG. 10C, an insulating layer 360 is formed around the wiring electrode group 330 that is three-dimensionally wired with, for example, a sealing resin, and the wiring electrode group 330 is embedded. At this time, it is preferable to embed at least the uppermost wiring electrode group 330 so as to be exposed. However, if difficult, the wiring electrode group 330 is exposed by a polishing process such as CMP (Chemical Mechanical Polishing), for example. Also good. Thereby, the wiring electrode group 330 is reliably exposed, and a highly reliable connection is possible.

  Next, as shown in FIG. 10D, bumps 370 are formed on the exposed electrode terminals 355 of the wiring electrode group 330 using, for example, solder balls.

  Then, by separating the semiconductor chip 310 on which the bumps 370 are formed into individual pieces by, for example, a dicing method, a highly reliable WL-CSP can be easily obtained.

  In the above description, the bump 370 is formed by a separate process using a solder ball or the like. However, the present invention is not limited to this. For example, bumps may be formed integrally with the three-dimensional wiring electrode group using the stereolithography method. In this case, it is important to form at least the insulating layer 360 so that the bump is not buried.

  In the above description, the example of forming the rewiring wiring electrode group directly on the semiconductor chip 310 has been described. However, the present invention is not limited to this. For example, you may produce as an interposer etc. which have the wiring electrode group for rewiring.

  Below, the electroconductive photocurable resin 100 used for the 1st Embodiment of this invention is demonstrated in detail.

  That is, the conductive photocurable resin 100 contains at least a photocurable resin containing a photocurable monomer and a photopolymerization initiator, and a conductive filler.

  Here, the photocurable monomer preferably includes both a polyfunctional monomer having a plurality of photopolymerizable groups and a monofunctional monomer having only one photopolymerizable group.

  As the polyfunctional monomer having a plurality of photopolymerizable groups, for example, a compound having two or more polymerizable functional groups such as a carbon-carbon double bond heavy bond in one molecule is used. The number of polymerizable functional groups contained in the polyfunctional monomer is preferably 3 to 10, but is not limited to these ranges. In addition, when the number of polymerizable functional groups is less than 3, the curability tends to decrease. When the number of functional groups exceeds 10, the molecular size tends to increase and the viscosity tends to increase.

  Specific examples of the polyfunctional monomer having a plurality of photopolymerizable groups include, for example, allylated cyclohexyl diacrylate, 1,4-butanediol diacrylate, 1,3-butylene glycol diacrylate, and 1,6-hexane. Diol diacrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, polyethylene glycol diacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, dipentaerythritol mono Hydroxypentaacrylate, ditrimethylolpropane tetraacrylate, glycerol diacrylate, metho Cyclohexyl diacrylate, neopentyl glycol diacrylate, propylene glycol diacrylate, polypropylene glycol diacrylate, triglycerol diacrylate, trimethylolpropane triacrylate, bisphenol A diacrylate, diacrylate of bisphenol A-ethylene oxide adduct, bisphenol Examples thereof include diacrylates of A-propylene oxide adducts. Moreover, the compound which substituted a part or all of the acryl group contained in the said compound by the methacryl group, for example can also be used.

  A monofunctional monomer having only one photopolymerizable group is added to the conductive photocurable resin in order to prevent the fog phenomenon. When the monofunctional monomer is not contained, photocuring is likely to proceed, so that photocuring proceeds not only to the exposed portion but also to the non-exposed portion, so that a so-called fog phenomenon that the pattern boundary is blurred is likely to occur.

  In addition, since the monofunctional monomer has a relatively low viscosity, it may be added to reduce the viscosity of the conductive photo-curing resin.

  Examples of monofunctional monomers having only one photopolymerizable group include benzyl acrylate, butoxyethyl acrylate, butoxytriethylene glycol acrylate, cyclohexyl acrylate, dicyclopentanyl acrylate, dicyclopentenyl acrylate, 2-ethylhexyl acrylate, and glycerol. Acrylate, glycidyl acrylate, heptadecafluorodecyl acrylate, 2-hydroxyethyl acrylate, isobornyl acrylate, 2-hydroxypropyl acrylate, isodexyl acrylate, isooctyl acrylate, lauryl acrylate, 2-methoxyethyl acrylate, methoxyethylene glycol acrylate, Methoxydiethylene glycol acrylate, octafluoropentyla Relate, phenoxyethyl acrylate, stearyl acrylate, trifluoroethyl acrylate. Moreover, the compound which substituted the acryl group contained in the said compound by the methacryl group, for example can also be used as a monofunctional monomer.

  Moreover, as a photoinitiator, a commercially available photoinitiator can be used conveniently. As the photopolymerization initiator, for example, a combination of a photoreducible dye and a reducing agent is used. The photopolymerization initiator is not limited to these.

  Here, examples of the photoreductive dye include benzophenone, methyl o-benzoylbenzoate, 4,4′-bis (dimethylamine) benzophenone, 4,4′-bis (diethylamine) benzophenone, α-aminoacetophenone, 4 , 4′-dichlorobenzophenone, 4-benzoyl-4′-methyldiphenyl ketone, dibenzyl ketone, fluorenone, 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, p-tert-butyldichloroacetophenone Thioxanthone, 2-methylthioxanthone, 2-chlorothioxanthone, 2-isopropylthioxanthone, diethylthioxanthone, benzyldimethyl ketal, benzylmethoxyethyl acetal, benzoin methyl ether, anthraquino 2-tert-butylanthraquinone, 2-amylanthraquinone, β-chloroanthraquinone, anthrone, benzanthrone, dibenzsuberon, methyleneanthrone, 4-azidobenzylacetophenone, 2,6-bis (p-azidobenzylidene) -4-methylcyclohexanone 1-phenyl-propanedione-2- (O-ethoxycarbonyl) oxime, 1,3-diphenyl-propanetrione-2- (O-ethoxycarbonyl) oxime, 1-phenyl-3-ethoxypropanetrione-2- (O-benzoyl) oxime, Michler's ketone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholino Phenyl) -butanone-1 Naphthalenesulfonyl chloride, quinolinesulfonyl chloride, n-phenylthioacridone, 2,2'-azobisisobutyronitrile, diphenylsulfide, benzthiazole disulfide, triphenylphosphine, camphorquinone, carbon tetrabrominated, tribromophenylsulfone Benzoyl peroxide, eosin, methylene blue. These may be used alone or in combination of two or more.

  Furthermore, examples of the reducing agent include ascorbic acid and triethanolamine. These may be used alone or in combination of two or more.

  Moreover, as a conductive filler, if it is a metal microparticle which has electroconductivity, it can use without limitation. Examples thereof include fine particles such as gold, silver, platinum, nickel, copper, palladium, molybdenum, and tungsten. These metal fine particles may be used alone or in combination of two or more. Moreover, the alloy powder which consists of an alloy containing the said element can also be used as a conductive filler.

  In order to obtain a low resistance wiring electrode group by firing at a low temperature, it is preferable to use a metal material having a relatively low melting point and a low specific resistance value as the conductive filler. As such a metal material, for example, gold, silver and copper are preferable. Silver is most suitable because gold is very expensive, copper is easily oxidized, and cannot be fired in air.

  The shape of the conductive filler may be various shapes such as a lump shape, a scale shape, a microcrystalline shape, a spherical shape, a granular shape, and a flake shape, or may be indefinite. Among them, the shape of the conductive filler is preferably spherical or granular. This is because the light transmittance during exposure is good and the exposure efficiency is good.

  Furthermore, the average particle diameter of the conductive filler is preferably less than 3 μm, and more preferably less than 1 μm. Since the conductive filler has an average particle size of less than 3 μm, it can be sintered at a low temperature of about 150 ° C. to 350 ° C., so that the wiring electrode has a small specific resistance value after sintering and excellent electrical conductivity. A group is obtained. By using such fine particles, a conductive photo-curing resin with high resolution can be obtained. Moreover, when the average particle diameter of the conductive filler is less than 1 μm, it is possible not only to perform sintering at a low temperature but also to form a finer wiring electrode group. Furthermore, when the average particle diameter of the conductive filler is 3 μm or more, the surface roughness of the conductive photo-curing resin increases and the dimensional accuracy decreases.

  Further, in order to supply the conductive photocurable resin in a short time when the substrate is moved, the viscosity of the conductive photocurable resin is preferably 10 Pa · s or less, and more preferably 1 Pa · s or less. . In particular, when the viscosity of the conductive photocurable resin is 1 Pa · s or less, the supply time of the conductive photocurable resin to the substrate surface can be further shortened, so that the thickness of the conductive photocurable resin is made thinner. And the resolution of the wiring electrode group can be improved. Furthermore, productivity can also be improved by shortening supply time. On the other hand, when the viscosity of the conductive photo-curing resin is higher than 10 Pa · s, it takes a long time to form a wiring electrode group having a predetermined thickness, or in the conductive photo-curing resin during the supply process. Air may enter.

  Here, the viscosity is a value measured by using a cone plate viscometer at a temperature of 25 ° C., for example.

  Moreover, about the photocurable resin contained in conductive photocurable resin, the proper compounding quantity of a polyfunctional monomer, a monofunctional monomer, and a photoinitiator is 5 polyfunctional monomers per 100 weight part of conductive fillers. It is desirable that the weight is 30 to 30 parts by weight, the monofunctional monomer is 0.5 to 10 parts by weight, and the photopolymerization initiator is 0.1 to 5 parts by weight. And when the quantity of each photocurable resin remove | deviates from the said range, desired electroconductivity will not be acquired, and also a problem will arise in the point of formation of adhesiveness and a wiring electrode group.

  The conductive photocurable resin may contain, for example, a dispersant and a viscosity modifier in addition to the conductive filler and the photocurable resin.

(Second Embodiment)
Below, the manufacturing method of the three-dimensional wiring in the 2nd Embodiment of this invention is demonstrated in the example applied to the three-dimensional wiring board.

  FIG. 11A is a partial plan view schematically showing a three-dimensional wiring board manufactured by the three-dimensional wiring manufacturing method according to the second embodiment of the present invention, and FIG. FIG. 4C is a cross-sectional view taken along line -A, and FIG. 4C is a cross-sectional view taken along line BB in FIG.

  As shown in FIG. 11, the three-dimensional wiring board 400 includes a wiring electrode group configured by forming a metal layer 410 on the outer surface of a wiring resin group formed three-dimensionally by a photocurable resin such as urethane resin. The structure is embedded in the insulating layer 450. Here, as the metal layer 410, for example, gold, silver, copper, or the like is formed using, for example, an electroless plating method.

  That is, the second embodiment is different from the first embodiment in that a metal layer 410 is formed on the outer surface of the wiring resin group to form a wiring electrode group, and the other configurations are the same. It is.

  Here, in order to make the explanation easy to understand, the band electrode group shown in FIG. 11A is shown as a first wire electrode group 430, and the ring electrode group shown in a circle is a second one. The wiring electrode 440 is used. The second wiring electrode 440 has the same function as the conductive via in the conventional wiring board, and connects the first wiring electrode group 430 formed in a plurality of stages in the height (thickness) direction. To do.

  Furthermore, in the second embodiment of the present invention, the first wiring electrode group 430 is the first wiring electrode 432 in the first stage corresponding to the lowest stage provided in the height direction of the three-dimensional wiring board 400. For example, the first wiring electrode 434 in the second stage and the first wiring electrode 436 in the third stage corresponding to the uppermost stage are illustrated as an example of three stages.

  Hereinafter, a three-dimensional wiring board manufactured using the method for manufacturing a three-dimensional wiring according to the second embodiment of the present invention will be described as an example with reference to FIG. In addition, the same code | symbol is attached | subjected and demonstrated to the same component as FIG.

  FIG. 12 is a cross-sectional view illustrating a method of manufacturing a three-dimensional wiring board manufactured using the method of manufacturing a three-dimensional wiring in the second embodiment of the present invention.

  First, as shown in FIG. 12A, an insulating substrate 420 such as a PET film having a thickness of 20 μm to 1000 μm, a polyimide film, a glass epoxy substrate, a ceramic substrate, or a glass substrate is prepared.

  Next, as shown in FIG. 12B, the first wiring resin 431 at the first stage and the first wiring resin 433 at the first stage are sequentially formed on the insulating substrate 420 by using an optical modeling method. And a first wiring resin group 429 composed of the first wiring resin 435 in the third stage, and a second wiring resin 439 that connects these stages in the height direction. At this time, the connection portion 445 between the first wiring resin group 429 and the second wiring resin 439 is formed continuously and integrally with at least the same shape.

  The manufacturing method of the first wiring resin group and the second wiring resin is the same as that of the first wiring electrode group of the first embodiment described with reference to FIG. 2, but does not contain a conductive filler. It is different in that it is formed of a photocurable resin.

  Therefore, a method for manufacturing a three-dimensional wiring of the first wiring resin group 429 and the second wiring resin 439 will be briefly described with reference to FIG.

  First, as shown in FIG. 13A, for example, an insulating substrate 420 installed on a table 520 movable in the Z direction is placed in a container 510 filled with a urethane-based photocurable resin 500, for example. Immerse.

  Then, a mask 550 having an opening 540 having a predetermined pattern made of, for example, a metal that blocks at least ultraviolet light or visible light is disposed on the photocurable resin 500 that covers the insulating substrate 420. Then, the light curable resin 500 on the insulating substrate 420 is irradiated with irradiation light 530 emitted from, for example, a light irradiation device (not shown) through the opening 540 of the mask 550. Accordingly, for example, the first wiring resin 431 in the first stage is collectively applied to the insulating substrate 420 via the mask 550 having the pattern-shaped openings 540 of the first wiring resin 431 in the first stage. Formed in thickness. The predetermined thickness is, for example, 1 μm to 100 μm in the case of a wiring pattern, and the thickness can be arbitrarily adjusted by the intensity of irradiation light 530 and the irradiation time. At this time, it is preferable to eliminate the influence of the diffracted light generated by the opening 540 of the mask 550. Thereby, a pattern with a steep cross-sectional shape can be formed.

  In addition, the light irradiation apparatus and the photocurable resin 500 can use the same thing as 1st Embodiment.

  Next, as shown in FIG. 13B and FIG. 13C, the table 520 is sequentially moved in the Z direction, and predetermined corresponding to the first wiring resins 431, 433, 435 and the second wiring resin 439 is obtained. The photo-curing resin 500 is cured while sequentially replacing the mask 550 having the pattern opening 540, thereby forming the first wiring resin group 429 and the second wiring resin 439.

  Thereby, a three-dimensional wiring resin group as shown in FIG. 12B is formed in the photocurable resin 500.

  Here, the table 520 is moved in accordance with the replacement of the mask 550 as described below. For example, according to the thickness of each step of the first wiring resin group 429 and the height (thickness) of the second wiring resin 439, the intensity of the irradiation light 530, the irradiation time, the characteristics of the photocurable resin 500, and the like. The amount of movement of the table 520 is controlled by the control device 560 in consideration.

  For example, as described in the first embodiment with reference to FIGS. 4 and 5, the shape of the opening of the mask and the shape of the opening of the mask are three-dimensionally formed on the insulating substrate. A wiring resin group is formed.

  Here, although the example in which the wiring electrode group is formed by exchanging the mask has been described above, the present invention is not limited to this. For example, as described with reference to FIGS. 8 and 9 in the first embodiment, it goes without saying that the liquid crystal panel may be used as a mask.

  The manufacturing method of the wiring resin group is the same as that of the first wiring electrode group, and the description thereof will be omitted. However, the only difference is that the wiring resin group is formed of a photocurable resin that does not contain a conductive filler. is there.

  Next, as shown in FIG. 12C, the uncured photocurable resin 500 that has not been irradiated with the irradiation light 530 is removed by, for example, immersion in a solvent, air blow, or spin coater. A three-dimensional wiring resin group composed of one wiring resin group 429 and a second wiring resin 439 is formed.

  Next, as shown in FIG. 12D, at least the entire outer surfaces of the first wiring resin group 429 and the second wiring resin 439 are, for example, about several μm to 10 several μm by using an electroless plating method. A metal layer 410 made of a single layer film such as gold, nickel, copper or silver or a laminated film such as gold / nickel / copper is formed. The thickness of the metal layer 410 can be arbitrarily adjusted depending on the immersion time and the temperature of the plating tank.

  Through the above steps, the first wiring electrode 432 composed of the first wiring resin 431 and the metal layer 410 in the first stage, and the first wiring resin 433 and the metal layer 410 in the second stage. A first wiring electrode group 430 is formed by the wiring electrodes 434 and the first wiring electrodes 436 including the first wiring resin 435 and the metal layer 410 in the third stage. Similarly, the second wiring electrode 440 is formed by the second wiring resin 439 and the metal layer 410. The first wiring electrode group 430 and the second wiring electrode 440 form a three-dimensional wiring electrode group.

  Here, it is preferable that the outer surfaces of the first wiring resin group and the second wiring resin are roughened by, for example, etching. Also, when forming the first wiring resin group and the second wiring resin by stereolithography, a large number of minute holes are formed from the surface of the first wiring resin group and the second wiring resin toward the inside. However, the first wiring resin group and the second wiring resin may be made porous. As a result, nuclei are easily formed when a plating film such as copper is formed as the metal layer 410, and productivity and reliability can be improved by shortening the adhesion strength of the metal layer 410 and the plating formation time.

  Next, as shown in FIG. 12E, for example, a first wiring electrode group 430 shown in FIG. 12D is placed in a container (not shown) filled with a liquid resin such as acrylic, urethane, or epoxy. The wiring electrode group composed of the second wiring electrodes 440 is immersed at least. Then, for example, by curing with ultraviolet rays, the insulating layer 450 in which the first wiring electrode group 430 and the second wiring electrode 440 are embedded is formed.

  The insulating layer 450 can also be formed by injecting a PET resin around the wiring resin group using, for example, a capillary phenomenon.

  Further, as shown in FIG. 12 (f), in the process of FIG. 12 (d), the insulating substrate 420 on which the metal layer 410 is formed is removed by using, for example, a polishing method. Is produced.

  According to the method of manufacturing a three-dimensional wiring according to the second embodiment of the present invention, a three-dimensional wiring electrode group composed of a first wiring electrode group and a second wiring electrode electrically connected by a metal layer. Therefore, it is possible to realize a method for manufacturing a three-dimensional wiring with high production efficiency.

  In addition, since the first wiring resin group and the second wiring resin are formed continuously and integrally and are electrically connected by a metal layer formed on the outer surface thereof, the wiring resistance is low and the high frequency characteristics are excellent. In addition, highly reliable three-dimensional wiring can be realized.

  In addition, the first wiring resin group and the second wiring resin having a predetermined pattern can be formed by replacing the mask or by arranging the liquid crystal panel at an arbitrary position. As a result, it is possible to realize a manufacturing method with a high degree of design freedom in which the formation positions of the first wiring resin group and the second wiring resin are not limited.

  Further, since the first wiring electrode group and the second wiring electrode can be formed continuously only by exchanging the mask or changing the display pattern of the liquid crystal panel, the first wiring electrode group and the second wiring electrode The interface is not formed. Therefore, it is possible to realize a highly reliable manufacturing method of a three-dimensional wiring that does not cause peeling at the interface.

  Further, as in the first embodiment, since the first wiring resin group and the second wiring resin are continuously and integrally formed, it is not necessary to form a land in consideration of misalignment and the like. The first wiring resin group and the second wiring resin can be formed with a small pitch.

  In the second embodiment, the example in which the insulating substrate on which the metal layer is formed is removed by the electroless plating method is described, but the present invention is not limited to this. For example, a step of providing a new insulating base material by adhesion or the like may be provided in order to increase the mechanical strength and increase the reliability against deformation or the like. Needless to say, in order to protect the metal layer exposed on the surface from which the insulating substrate has been removed, for example, a step of providing a protective layer by laminating a PET film or the like may be included.

  In the second embodiment of the present invention, the example in which the metal layer is formed by the electroless plating method has been described. However, the present invention is not limited to this. For example, after forming a thin metal layer by an electroless plating method, the metal layer may be further formed by an electrolytic plating method. Thereby, the manufacturing method of the three-dimensional wiring which performs formation of a metal layer in a short time is realizable.

  The manufacturing method of a three-dimensional wiring of the present invention manufactures a three-dimensional wiring board used for an electronic device such as an electronic component that requires high-density mounting or a portable information device that requires a small and thin high-density wiring that can be connected. Useful in technical fields.

(A) Partial plan view schematically showing a three-dimensional wiring board produced by the three-dimensional wiring manufacturing method according to the first embodiment of the present invention (b) AA line cross-sectional view (c) of FIG. BB sectional view of the same figure (a) Sectional drawing explaining the manufacturing method of the three-dimensional wiring board using the manufacturing method of the three-dimensional wiring in the 1st Embodiment of this invention Sectional drawing explaining the manufacturing method of the solid wiring in the 1st Embodiment of this invention The top view which shows an example of the mask of each process step which forms the 1st wiring electrode group and the 2nd wiring electrode on a three-dimensional wiring board in the manufacturing method of the three-dimensional wiring of the 1st Embodiment of this invention The figure which shows the wiring electrode group formed on an insulating substrate corresponding to each mask of FIG. (A) Partial perspective view showing the connection state of the first wiring electrode and the second wiring electrode of the three-dimensional wiring board in the first embodiment of the present invention (b) In the first embodiment of the present invention Partial plan view for explaining the relationship between the first wiring electrode group and the second wiring electrode of the three-dimensional wiring board Sectional drawing explaining another example of the shape of the 1st wiring electrode group and the 2nd wiring electrode which were formed with the manufacturing method of the solid wiring in the 1st Embodiment of this invention Schematic diagram of an optical modeling apparatus that realizes the manufacturing method of the three-dimensional wiring in the first embodiment of the present invention Schematic diagram of an optical modeling apparatus for explaining another example of the manufacturing method of the three-dimensional wiring in the first embodiment of the present invention The figure explaining another example to which the manufacturing method of the three-dimensional wiring in the 1st Embodiment of this invention is applied (A) Partial plan view schematically showing a three-dimensional wiring board produced by the three-dimensional wiring manufacturing method according to the second embodiment of the present invention (b) AA line sectional view (c) of FIG. BB sectional view of the same figure (a) Sectional drawing explaining the manufacturing method of the three-dimensional wiring board produced using the manufacturing method of the three-dimensional wiring in the 2nd Embodiment of this invention Sectional drawing explaining the manufacturing method of the solid wiring in the 2nd Embodiment of this invention Partial perspective view for explaining a main structure of a conventional printed circuit board having a multilayer structure laminated in four layers and a manufacturing method thereof Sectional drawing which shows the manufacturing apparatus of the conventional wiring board typically Sectional drawing explaining the manufacturing method of a wiring board using the manufacturing apparatus of FIG. The perspective view explaining the circuit component which has the conventional three-dimensional structure Schematic diagram explaining a state where conductive vias and conductor patterns of a conventional wiring board are connected via lands

Explanation of symbols

10,400 Three-dimensional wiring board 20,420 Insulating board 30,430 First wiring electrode group 32, 34, 36, 170, 175, 350, 432, 434, 436 First wiring electrode 40, 42, 340, 440 Second wiring electrode 45, 445 Connection portion 50, 360, 450 Insulating layer 100 Conductive photo-curing resin 110, 218, 510 Container 120, 220, 520 Table 130, 530 Irradiation light 140, 141, 142, 143, 144 145, 540 Opening 150, 550 Mask 160, 222, 560 Control device 200, 250 Stereolithography device 202 Light irradiation device 203 Laser light 204 Collimator portion 206, 208 Polarizer 210 Pattern creation device 211 Liquid crystal panel 212 Lens 214 Mirror 216 Objective Lens 224 control unit 226 Transmissive window 300 wafer 310 semiconductor chips 320,355 electrode terminals 330 of the wiring-electrode group 370 bump 410 metal layer 429 first wiring resin group 431,433,435 first wiring resin 439 second wiring resin 500 photocurable resin

Claims (7)

A three-dimensional wiring manufacturing method in which a plurality of first wiring electrode groups and a second wiring electrode that connects at least a height direction between the first wiring electrode groups are formed using an optical modeling method. There,
A method of manufacturing a three-dimensional wiring, wherein a predetermined pattern formed on a mask is collectively exposed to a predetermined thickness, and the first wiring electrode group and the second wiring electrode are sequentially formed in a height direction. The method for manufacturing a three-dimensional wiring according to claim 1, further comprising forming an insulating layer in which the first wiring electrode group and the second wiring electrode are embedded. The method of manufacturing a three-dimensional wiring according to claim 1, wherein the mask is a liquid crystal panel that forms the pattern. The three-dimensional object according to any one of claims 1 to 3, wherein the first wiring electrode group and the second wiring electrode are formed of a photocurable resin containing a conductive filler. Wiring manufacturing method. The said 1st wiring electrode group and the said 2nd wiring electrode consist of a photocurable resin and the metal layer formed in the outer surface, The any one of Claim 1 to 3 characterized by the above-mentioned. The manufacturing method of the three-dimensional wiring of description. The method for manufacturing a three-dimensional wiring according to claim 4, wherein the photocurable resin is a resin that is cured by visible light. A three-dimensional wiring board produced by the method of manufacturing a three-dimensional wiring according to any one of claims 1 to 6.

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