JP2001156429A - Method of manufacturing wiring circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of easily manufacturing a fine wiring circuit board of high density in a comparatively short time without requiring much labor. SOLUTION: A resin block 12 formed by two-dimensionally curing photosetting resin liquid 10 is stacked up on a first support 50 for the formation of a three-dimensional conductive first wiring circuit 70, where the first support 50 is the inner bottom of a tank 20 formed by curing photosetting resin liquid 10. Then, the first wiring circuit 70 is buried in a first insulating resin. The first support 50 is cut off from the first insulating resin and the first wiring circuit 70 which are formed inside the first support 50. Then, a second wiring circuit and an electronic part connecting conductor pad connected to the second wiring circuit and the first wiring circuit 70 are formed on the surface of the first insulating resin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a printed circuit board for forming a printed circuit or the like three-dimensionally by using an optical molding technique.

[0002]

2. Description of the Related Art In recent years, as electronic components such as semiconductor chips have become more dense and highly integrated, wiring circuits and the like on a printed circuit board on which the electronic components are mounted have been increasingly densified. With the miniaturization, multilayer circuit boards are being increasingly used.

[0003]

However, a printed circuit board having such a multi-layered fine printed circuit at a high density requires a great deal of work and time to manufacture, and the cost is greatly increased. I have. As a result, compared to electronic components such as semiconductor chips, printed circuit boards on which the components are mounted have become expensive.

The present invention can solve such a problem.
It can easily and quickly form a printed circuit board with a miniaturized high-density wiring circuit without the need for trouble and time.
A method of manufacturing a printed circuit board, wherein the cost is significantly reduced as compared to a conventional printed circuit board having a multilayered structure and a fine and high-density wiring circuit. The purpose of the present invention is to provide a manufacturing method.

[0005]

To achieve the above object, a first method of manufacturing a printed circuit board according to the present invention is characterized by including the following steps. a. The photocurable resin, which is located on a predetermined plane at the bottom in a tank containing an uncured photocurable resin liquid in which the photocurable resin liquid portion cured by focusing light becomes an electrically conductive resin mass. Focus the light emitted from the luminous body on the liquid part,
The light-curable resin liquid portion focused on the light is cured, and a resin mass formed by curing the light-curable resin liquid portion forms a plate-like first support at the bottom in the tank, and the second support is formed. (1) A step of providing a first injection port in one support. b. Focus of light emitted from the luminous body from a plane side closer to the first support to a predetermined portion of the photocurable resin liquid located on each plane divided into a plurality of steps vertically from above the first support to above the first support In order, and selectively cure two-dimensionally the photocurable resin liquid portion at a predetermined portion located on each plane where the light is focused, and the two-dimensionally cured photocurable resin A conductive resin block formed by stacking liquid portions three-dimensionally is formed on the first support, and the resin block forms a conductive first wiring circuit three-dimensionally on the first support. Forming a support wall upright around the periphery of the first support. c. The light emitted from the light emitter is focused on the photocurable resin liquid portion located on a predetermined plane in the upper portion of the inside of the tank including the upper end of the first wiring circuit and the upper end of the support wall, and the light is Cure the focused photocurable resin liquid part,
A step of forming a plate-shaped second support at an upper end of the first wiring circuit and an upper end of the support wall by using a resin mass obtained by curing the photocurable resin liquid portion. d. The first support, the second support, the support wall, and the first support
Take out the wiring circuit from the photocurable resin liquid in the tank,
A step of injecting a first insulating resin into an inner space surrounded by a first support, a second support, and a support wall through the first inlet, and embedding a first wiring circuit in the first insulating resin. e. A step of cutting off the first support, the second support, and the support wall from ends of the first insulating resin and the first wiring circuit formed inside the first support, the second support, and the support wall; f. A second wiring circuit and a second wiring circuit are formed on the surface of the first insulating resin where the first support and the second support are cut off and exposed.
Forming a conductive pad for connecting electronic components connected to the wiring circuit, the conductive pad being connected to the first wiring circuit;

A second method of manufacturing a printed circuit board according to the present invention is characterized in that the following method is included in place of steps b to f of the first method of manufacturing a printed circuit board of the present invention. . b1. A focal point of light emitted from the luminous body from a plane side closer to the first support to a predetermined portion of the photocurable resin liquid which is located on each plane divided into a plurality of stages vertically from above the first support to above the first support. In order, and selectively cure two-dimensionally the photocurable resin liquid portion at a predetermined portion located on each plane where the light is focused, and the two-dimensionally cured photocurable resin A conductive resin block formed by three-dimensionally stacking liquid parts is formed on the first support, and the resin block allows the conductive first wiring circuit, the first wiring circuit, and the first wiring circuit to be formed on the first support. Forming a three-dimensional conductive ground cylinder surrounding the periphery thereof at a predetermined interval, and forming a support wall upright on the periphery of the first support; c1. Focus the light emitted from the light emitter on the photocurable resin liquid portion located on a predetermined plane in the upper portion of the tank including the upper end of the first wiring circuit, the upper end of the ground cylinder, and the upper end of the support wall. At the same time, the light-curable resin liquid portion in which the light is focused is cured, and a plate-like second support is formed on the upper end of the first wiring circuit by a resin mass obtained by curing the light-curable resin liquid portion. The upper end of the first wiring circuit inserted inside the ground cylinder into a second support portion immediately above the upper end of the ground cylinder. Providing a second inlet in which a support arm for supporting the support is provided. d1. The first support, the second support, the support wall, the first
The wiring circuit and the ground cylinder are taken out of the photo-curable resin liquid in the tank, and are passed through the first inlet to the first space in the inner space surrounded by the first support, the second support, and the support wall.
An insulating resin is injected, the first wiring circuit and the ground cylinder are embedded in the first insulating resin, and a second insulating resin is injected into the ground cylinder through the second injection port. Filling the second insulating resin with the first wiring circuit inserted inside. e1. The first support, the second support and the support wall,
A step of cutting together with the support arm from the first insulating resin, the second insulating resin, the end of the first wiring circuit, and the end of the ground cylinder formed inside thereof. f1. A second support is provided on the surface of the first insulating resin and the second insulating resin where the first support and the second support are cut off and exposed.
A step of forming a wiring circuit, a conductor pad for connecting electronic components connected to the second wiring circuit, wherein the conductor pad is connected to the first wiring circuit and the conductor pad is connected to the ground cylinder.

A third method of manufacturing a printed circuit board according to the present invention is characterized in that the following method is included in place of the steps b to f of the first method of manufacturing a printed circuit board of the present invention. . b2. A focal point of light emitted from the luminous body from a plane side closer to the first support to a predetermined portion of the photocurable resin liquid which is located on each plane divided into a plurality of stages vertically from above the first support to above the first support. In order, and selectively cure two-dimensionally the photocurable resin liquid portion at a predetermined portion located on each plane where the light is focused, and the two-dimensionally cured photocurable resin A conductive resin block formed by three-dimensionally stacking liquid parts is formed on the first support, and the resin block forms a conductive first wiring circuit and a conductive ground cylinder on the first support. And three-dimensionally forming a support wall on the periphery of the first support. c2. Focus the light emitted from the light emitter on the photocurable resin liquid portion located on a predetermined plane in the upper portion of the tank including the upper end of the first wiring circuit, the upper end of the ground cylinder, and the upper end of the support wall. At the same time, the light-curable resin liquid portion in which the light is focused is cured, and a plate-like second support is formed on the upper end of the first wiring circuit by a resin mass obtained by curing the light-curable resin liquid portion. Forming a continuous line with the upper end of the ground cylinder and the upper end of the support wall. d2. The first support, the second support, the support wall, the first
The wiring circuit and the ground cylinder are taken out of the photo-curable resin liquid in the tank, and are passed through the first inlet to the first space in the inner space surrounded by the first support, the second support, and the support wall.
A step of injecting an insulating resin and embedding the first wiring circuit and the ground cylinder in the first insulating resin; e2. The first support, the second support and the support wall,
A step of cutting off the first insulating resin, the end of the first wiring circuit, and the end of the ground cylinder formed inside the first insulating resin. f2. A second wiring circuit, and a conductive pad for connecting an electronic component connected to the second wiring circuit, on the surface of the first insulating resin where the first support and the second support are cut off and exposed, wherein the first wiring Forming a conductor pad connected to the circuit and a conductor pad connected to the ground cylinder.

A fourth method of manufacturing a printed circuit board according to the present invention is characterized in that the following method is included in place of steps b to f of the first method of manufacturing a printed circuit board of the present invention. . b3. A focal point of light emitted from the luminous body from a plane side closer to the first support to a predetermined portion of the photocurable resin liquid which is located on each plane divided into a plurality of stages vertically from above the first support to above the first support. In order, and selectively cure two-dimensionally the photocurable resin liquid portion at a predetermined portion located on each plane where the light is focused, and the two-dimensionally cured photocurable resin A conductive resin block formed by three-dimensionally stacking liquid parts is formed on the first support, and the resin block forms a conductive first wiring circuit and a conductive ground cylinder on the first support. And three-dimensionally forming a support wall on the periphery of the first support. c3. Focus the light emitted from the luminous body on the photocurable resin liquid portion located on a predetermined plane in the upper portion of the tank including the upper end of the first wiring circuit, the upper end of the ground cylinder, and the upper end of the support wall. At the same time, the light-curable resin liquid portion where the light is focused is cured, and a plate-like second support is formed on the upper end of the first wiring circuit by a resin mass obtained by curing the light-curable resin liquid portion. Forming a second inlet in the second support portion immediately above the upper end of the gland cylindrical body while being formed so as to be continuous with the upper end of the gland cylindrical body and the upper end of the support wall. d3. The first support, the second support, the support wall, the first
The wiring circuit and the ground cylinder are taken out of the photo-curable resin liquid in the tank, and are passed through the first inlet to the first space in the inner space surrounded by the first support, the second support, and the support wall.
An insulating resin is injected, the first wiring circuit and the ground cylinder are embedded in the first insulating resin, and the second insulating resin is injected into the ground cylinder through the second inlet, and the second insulating resin is injected into the ground cylinder. A step of filling the insulating resin. e3. The first support, the second support and the support wall,
A step of cutting off the first insulating resin, the second insulating resin, the end of the first wiring circuit, and the end of the ground cylinder formed inside the first and second insulating resins. f3. A second support is provided on the surface of the first insulating resin and the second insulating resin where the first support and the second support are cut off and exposed.
A step of forming a wiring circuit, a conductor pad for connecting electronic components connected to the second wiring circuit, wherein the conductor pad is connected to the first wiring circuit and the conductor pad is connected to the ground cylinder.

In the first, second, third or fourth method of manufacturing a printed circuit board, the b, b1, b2 or b
In the three steps, the photocurable resin liquid portion at a predetermined portion located on each plane divided into a plurality of steps vertically from above the first support to above the first support is selectively two-dimensionally cured to three-dimensionally. Using a stacked conductive resin mass, a conductive first wiring circuit that is complicatedly bent on a plate-shaped first support formed at the bottom of the tank, and surrounds the first wiring circuit and the periphery thereof. A conductive ground cylinder having a complicated bend or the like or a conductive ground cylinder having a complicated bend can be formed three-dimensionally easily and quickly using a stereolithography technique without any trouble.

Next, in the step d, d1, d2 or d3, the above-described three-dimensionally formed conductive first wiring circuit or a ground cylinder is additionally embedded in the first insulating resin, or the ground cylinder is formed. The second insulating resin may be filled between the conductive member and the conductive wiring circuit inserted inside the ground cylinder, or the ground insulating member may be filled with the second insulating resin. A conductive first wiring circuit, such as a complicated bend, and a conductive ground tube inside a conductive bend, such as a complicated bend, are formed on an insulating substrate made of the first insulating resin or a second insulating resin. A coaxial line in which the first wiring circuit is inserted through the second insulating resin, a conductive ground cylinder that is bent in a complicated manner, or a conductive ground cylinder filled with the second insulating resin is the same as the other. A printed circuit board embedded in a state in which it is intricately entangled with the first wiring circuit, the coaxial line, or the ground cylinder having the structure can be easily and quickly formed without trouble.

When the second insulating resin is a dielectric,
A portion in which the conductive first wiring circuit is inserted inside the conductive ground cylinder through the second insulating resin can be formed in a capacitor such as a decoupling capacitor. Then, a printed circuit board in which the capacitor is embedded in a state of being intricately entangled with the first wiring circuit in a three-dimensional manner can be easily and quickly formed without trouble.

In order to achieve the above object, a fifth method of manufacturing a printed circuit board according to the present invention includes the following steps. A. The photocurable resin which is located on a predetermined plane at the bottom in the tank containing the uncured photocurable resin liquid in which the photocurable resin liquid portion cured by focusing light becomes an insulating resin block. Focus the light emitted from the luminous body on the liquid part,
The light-curable resin liquid portion focused on the light is cured, and a resin mass formed by curing the light-curable resin liquid portion forms a plate-like first support at the bottom in the tank, and the second support is formed. (1) A step of providing a first injection port in one support. B. Focus of light emitted from the luminous body from a plane side closer to the first support to a predetermined portion of the photocurable resin liquid located on each plane divided into a plurality of steps vertically from above the first support to above the first support In order, and selectively cure two-dimensionally the photocurable resin liquid portion at a predetermined portion located on each plane where the light is focused, and the two-dimensionally cured photocurable resin An insulating resin block formed by stacking liquid portions three-dimensionally is formed on the first support, and the resin block forms an insulating first wiring circuit bone three-dimensionally on the first support. And forming a support wall upright on the periphery of the first support. C. The light emitted from the luminous body is focused on a photocurable resin liquid portion located on a predetermined plane in the upper portion of the tank including the upper end of the first wiring circuit bone and the upper end of the support wall, and the light is By curing the focused photocurable resin liquid part, and by curing the photocurable resin liquid part,
A step of forming a plate-shaped second support continuously with an upper end of the first wiring circuit bone and an upper end of the support wall; D. The first support, the second support, the support wall, and the first support
Removing the wiring circuit bone from the photocurable resin solution in the tank and applying a metal plating to the first wiring circuit bone; E. FIG. A first insulating resin is injected into the inner space surrounded by the first support, the second support, and the support wall through the first injection port, and the metal-plated first wiring circuit bone is removed from the first insulating resin. The process of embedding in resin. F. Removing the first support, the second support, and the support wall from the ends of the first insulating resin and the first wiring circuit bone formed inside thereof; G. FIG. A second wiring circuit and a second wiring circuit are formed on the surface of the first insulating resin where the first support and the second support are cut off and exposed.
Forming a conductive pad for connecting electronic components connected to the wiring circuit, the conductive pad being connected to the metal plating applied to the first wiring circuit bone;

A sixth method of manufacturing a printed circuit board according to the present invention includes the following steps instead of the B to G steps of the fifth method of manufacturing a printed circuit board of the present invention. . B1. Focus of light emitted from the luminous body from a plane side closer to the first support to a predetermined portion of the photocurable resin liquid located on each plane divided into a plurality of steps vertically from above the first support to above the first support In order, and selectively cure two-dimensionally the photocurable resin liquid portion at a predetermined portion located on each plane where the light is focused, and the two-dimensionally cured photocurable resin An insulating resin block formed by three-dimensionally stacking liquid parts is formed on the first support, and the resin block forms an insulating first wiring circuit frame and the first wiring circuit frame on the first support. And three-dimensionally forming an insulating ground cylindrical bone surrounding the periphery of the first support at a predetermined interval, and forming a support wall upright on the periphery of the first support. C1. Focus of light emitted from the illuminant on the photocurable resin liquid portion located on a predetermined plane in the upper portion of the inside of the tank including the upper end of the first wiring circuit bone, the upper end of the ground cylindrical bone, and the upper end of the support wall. And the light-curable resin liquid portion where the light is focused is cured, and the plate-shaped second support is formed by the resin mass obtained by curing the light-curable resin liquid portion. The first wiring circuit skeleton formed inside the ground cylindrical bone at the second support portion formed immediately above the upper end of the ground cylindrical bone, the upper end of the ground cylindrical bone, and the upper end of the support wall. Providing a second inlet in which a support arm supporting the upper end of the second support is provided. D1. The first support, the second support, the support wall, the first
Removing the wiring circuit bone and the ground cylinder bone from the photocurable resin liquid in the tank, and applying metal plating to the first wiring circuit bone and the ground cylinder bone. E1. A first insulating resin is injected into an inner space surrounded by a first support, a second support, and a support wall through the first injection port, and the metal-plated first wiring circuit bone and ground cylindrical body bone Embedded in the first insulating resin,
The second insulating resin is injected into the ground cylindrical body through the second inlet, and the second insulating resin is injected between the metal-plated ground cylindrical body and the first wiring circuit bone inserted inside the ground cylindrical body. 2 A step of filling the insulating resin. F1. The first support, the second support and the support wall,
A step of cutting off the first insulating resin, the second insulating resin, the end of the first wiring circuit bone, and the end of the ground cylindrical bone formed on the inside. G1. A second support is provided on the surface of the first insulating resin and the second insulating resin where the first support and the second support are cut off and exposed.
A wiring circuit, a conductive pad for connecting electronic components connected to the second wiring circuit, a conductive pad connected to metal plating applied to the first wiring circuit bone, and a metal pad applied to the ground cylindrical body. Forming a conductive pad connected to the plating;

A seventh method of manufacturing a printed circuit board according to the present invention includes the following steps in place of the B to G steps of the fifth method of manufacturing a printed circuit board of the present invention. . B2. A focal point of light emitted from the luminous body from a plane side closer to the first support to a predetermined portion of the photocurable resin liquid which is located on each plane divided into a plurality of stages vertically from above the first support to above the first support. In order, and selectively cure two-dimensionally the photocurable resin liquid portion at a predetermined portion located on each plane where the light is focused, and the two-dimensionally cured photocurable resin An insulating resin block formed by stacking liquid portions three-dimensionally is formed on the first support, and the resin block allows the insulating first wiring circuit bone and the insulating ground cylinder to be formed on the first support. A step of forming the bone three-dimensionally and erecting a support wall on the periphery of the first support. C2. Focus of light emitted from the illuminant on the photocurable resin liquid portion located on a predetermined plane in the upper portion of the inside of the tank including the upper end of the first wiring circuit bone, the upper end of the ground cylindrical bone and the upper end of the support wall. And the light-curable resin liquid portion where the light is focused is cured, and the plate-like second support is attached to the first wiring circuit frame by a resin mass obtained by curing the light-curable resin liquid portion. Forming the upper end of the main body, the upper end of the ground cylindrical body, and the upper end of the support wall. D2. The first support, the second support, the support wall, the first
Removing the wiring circuit bone and the ground cylinder bone from the photocurable resin liquid in the tank, and applying metal plating to the first wiring circuit bone and the ground cylinder bone. E2. A first insulating resin is injected into an inner space surrounded by a first support, a second support, and a support wall through the first injection port, and the metal-plated first wiring circuit bone and ground cylindrical body bone Embedded in the first insulating resin. F2. The first support, the second support and the support wall,
Cutting off the first insulating resin, the end of the first wiring circuit bone, and the end of the ground cylindrical bone formed inside the first insulating resin. G2. A second wiring circuit, and a conductive pad for connecting an electronic component connected to the second wiring circuit, on the surface of the first insulating resin where the first support and the second support are cut off and exposed, wherein the first wiring Forming a conductive pad connected to the metal plating applied to the circuit bone and a conductive pad connected to the plated metal applied to the ground cylindrical body;

An eighth method of manufacturing a printed circuit board according to the present invention includes the following steps instead of the B to G steps of the fifth method of manufacturing a printed circuit board according to the present invention. . B3. A focal point of light emitted from the luminous body from a plane side closer to the first support to a predetermined portion of the photocurable resin liquid which is located on each plane divided into a plurality of stages vertically from above the first support to above the first support. In order, and selectively cure two-dimensionally the photocurable resin liquid portion at a predetermined portion located on each plane where the light is focused, and the two-dimensionally cured photocurable resin An insulating resin block formed by stacking liquid portions three-dimensionally is formed on the first support, and the resin block allows the insulating first wiring circuit bone and the insulating ground cylinder to be formed on the first support. A step of forming the bone three-dimensionally and erecting a support wall on the periphery of the first support. C3. Focus of light emitted from the illuminant on the photo-curable resin liquid portion located on a predetermined plane in the upper portion of the inside of the tank including the upper end of the first wiring circuit bone, the upper end of the ground cylindrical bone, and the upper end of the support wall. And the light-curable resin liquid portion where the light is focused is cured, and the plate-like second support is attached to the first wiring circuit frame by a resin mass obtained by curing the light-curable resin liquid portion. And forming a second injection port in a second support portion immediately above the upper end of the gland cylindrical bone while being formed so as to be continuous with the upper end of the gland cylindrical bone and the upper end of the support wall. D3. The first support, the second support, the support wall, the first
Removing the wiring circuit bone and the ground cylinder bone from the photocurable resin liquid in the tank, and applying metal plating to the first wiring circuit bone and the ground cylinder bone. E3. A first insulating resin is injected into an inner space surrounded by a first support, a second support, and a support wall through the first injection port, and the metal-plated first wiring circuit bone and ground cylindrical body bone Embedded in the first insulating resin,
A step of injecting a second insulating resin into the metal-plated ground cylindrical bone through the second inlet, and filling the ground cylindrical bone with the second insulating resin. F3. The first support, the second support and the support wall,
A step of cutting off the first insulating resin, the second insulating resin, the end of the first wiring circuit bone, and the end of the ground cylindrical bone formed on the inside. G3. A second support is provided on the surface of the first insulating resin and the second insulating resin where the first support and the second support are cut off and exposed.
A wiring circuit, a conductive pad for connecting electronic components connected to the second wiring circuit, a conductive pad connected to metal plating applied to the first wiring circuit bone, and a metal pad applied to the ground cylindrical body. Forming a conductive pad connected to the plating;

In the fifth, sixth, seventh or eighth method of manufacturing a printed circuit board, the B, B1, B2, B3
Alternatively, in the B4 step, the photocurable resin liquid portion at a predetermined portion located on each plane divided into a plurality of steps vertically from above the first support to above the first support is selectively two-dimensionally cured to three-dimensionally Insulating first wiring circuit bone, such as intricately bent, is placed on a plate-like first support formed at the bottom of the tank, using an insulating resin lump stacked on the first wiring circuit bone, and the first wiring circuit bone and the like. Easily and quickly three-dimensionally insulates the surrounding ground cylindrical bone with intricately bent or intricately bent ground using stereolithography technology. Can be formed.

Then, D, D1, D2, D3 or D
In the four steps, metal plating can be applied to the above-mentioned three-dimensionally formed insulating first wiring circuit bone or ground cylindrical body. Then, the first wiring circuit bone or the ground cylindrical bone can be made conductive.

Then, in the E, E1, E2 or E3 step, the above-mentioned three-dimensionally formed conductive first wiring circuit bone or ground cylindrical body is embedded in a first insulating resin, The second insulating resin can be filled between the ground tubular bone and the first wiring circuit bone inserted inside the ground tubular bone, or the ground tubular bone can be filled with the second insulating resin. Then, a first wiring circuit bone having a conductive property such as a complicated bend, and a ground tube having a conductive property such as a complicated bend on an insulating substrate made of the first insulating resin or a second insulating resin in addition thereto. A coaxial line formed by inserting a first wiring circuit bone having conductivity inside a body bone through a second insulating resin, a ground cylindrical body bone having conductivity which is complicatedly bent, or a second insulation. The conductive ground cylindrical body filled with resin is three-dimensionally connected to the conductive first conductive circuit bone, the coaxial line or the conductive ground cylindrical body having the same structure. It is possible to easily and quickly form a printed circuit board embedded in a state where it is entangled in a complicated manner without any trouble.

When the second insulating resin is a dielectric,
A portion where the first wiring circuit bone having conductivity is inserted through the second insulating resin inside the ground cylindrical bone having conductivity can be formed in a capacitor such as a decoupling capacitor. Similarly, when the resin mass constituting the ground cylindrical bone is a dielectric, the outer surface and the inner surface of the ground cylindrical bone are metal-plated with the ground cylindrical bone interposed therebetween. Portions can be formed in the capacitor. Then, a printed circuit board in which these capacitors are embedded in a state in which they are three-dimensionally intertwined with the first printed circuit bone having conductivity can be easily and quickly formed without any trouble. .

In the first, second, third or fourth method for producing a printed circuit board according to the present invention, a third injection port is provided in the support wall formed in the step b, b1, b2 or b3, In the step d, d1, d2 or d3, the first support, the second support, and the first support are surrounded by the first support, the second support, and the support wall through the third fill port instead of or together with the first fill port. It is preferable that a first insulating resin is injected into an inner space, and the first wiring circuit or a ground cylinder is additionally embedded in the first insulating resin.

The first, second, third or fourth embodiment of the present invention
In the method for manufacturing a wired circuit board according to the above, c, c1,
The second support formed in the c2 or c3 step has a fourth support.
By providing an inlet, in the d, d1, d2 or d3 step, instead of the first inlet or the third inlet, or together with the first inlet or the third inlet, through the fourth inlet. Injecting a first insulating resin into an inner space surrounded by the first support, the second support, and the support wall, and embedding the first wiring circuit or a ground cylinder in the first insulating resin. It is preferred.

In the fifth, sixth, seventh or eighth method of manufacturing a printed circuit board according to the present invention, a third injection port is provided in the support wall formed in the step B, B1, B2 or B3. In the step E, E1, E2 or E3, the first support, the second support, and the first support are surrounded by the first support, the second support, and the support wall through the third fill port instead of or together with the first fill port. Preferably, a first insulating resin is injected into the inner space, and the first wiring circuit bone or the ground cylindrical bone is additionally embedded in the first insulating resin.

The fifth, sixth, seventh or eighth aspect of the present invention
In the method for manufacturing a wired circuit board according to the above, C, C1,
A fourth support is formed on the second support formed in the C2 or C3 process.
By providing an inlet, in the E, E1, E2 or E3 step, instead of the first or third inlet, or together with the first or third inlet, through the fourth inlet. A first insulating resin is injected into an inner space surrounded by the first support, the second support, and the support wall, and the first wiring circuit bone or, in addition thereto, the ground cylindrical bone is placed in the first space.
Embedding in insulating resin is preferable.

In the first, second, third, fourth, fifth, sixth, seventh or eighth method of manufacturing a printed circuit board, the first injection port, the third injection port or The first insulating resin can be uniformly and smoothly injected into the inner space surrounded by the first support, the second support, and the support wall through at least two or more injection ports of the fourth injection port. At the same time, another first inlet, third inlet, or fourth inlet that does not inject the first insulating resin can be used for the air vent hole. Then, the first wiring circuit, the first wiring
The wiring circuit bone, the ground cylinder, or the ground cylinder can be securely embedded without any gap.

The first, second, third, fourth, and fourth embodiments of the present invention
In the fifth, sixth, seventh or eighth method of manufacturing a printed circuit board, it is preferable to use laser light as light for curing the photocurable resin liquid.

In the first, second, third, fourth, fifth, sixth, seventh or eighth method of manufacturing a printed circuit board, a laser beam having a high condensing property and a high resolution is used. By using this, the photocurable resin liquid portion at a predetermined portion on each plane divided into a plurality of steps in the tank above and below can be selectively and two-dimensionally cured with high accuracy. Then, a first wiring circuit, a first wiring circuit bone, a ground cylinder or a ground cylinder bone is formed by using a resin mass obtained by curing a photocurable resin liquid portion at a predetermined portion on each plane. It can be formed on the support three-dimensionally with high precision.

[0027]

1 to 4 show a preferred embodiment of a method for manufacturing a first printed circuit board according to the present invention, and FIGS. 1 to 4 are explanatory views of the manufacturing process. Hereinafter, a method for manufacturing the first printed circuit board will be described.

As shown in FIG. 1, the tank 20 containing the uncured photo-curable resin liquid 10 in which the photo-curable resin liquid part, which has been cured by focusing light, becomes a conductive resin block. Provided. Then, the light 40 emitted from the luminous body (not shown) is focused on the photocurable resin liquid 10 located on the predetermined plane 31 at the bottom of the tank 20, and the light 4
The portion of the photocurable resin liquid 10 on the above-mentioned predetermined plane 31, which is focused on 0, is cured. Then, a plate-shaped first support 52 is formed at the bottom inside the tank 20 by the resin mass 12 obtained by curing the photocurable resin liquid 10 portion.
At the same time, the first support 52 is provided with a first injection port 62.
Is provided. Then, the step a of the first method for manufacturing a printed circuit board of the present invention is performed.

Next, each plane divided into a plurality of steps vertically from above the first support 52 to above it, 32, 3
The focus of the light 40 emitted from the luminous body from the side of the plane 32 near the first support 52 is sequentially focused on a predetermined portion of the photo-curable resin liquid 10 located above 3, 34, 35. Then, each plane where the light 40 is focused ... 32, 3
The portions of the photocurable resin liquid 10 at predetermined portions located above 3, 34, 35,... Are selectively and two-dimensionally cured. Then, a conductive resin block 12 formed by three-dimensionally stacking the two-dimensionally cured photocurable resin liquids 10 is formed on the first support 52. The resin block 12 forms a first conductive circuit 70 three-dimensionally on the first support 52. With it, the first
A support wall 56 is formed upright on the periphery of the support 52 so as to be continuous. Then, step b of the first method for manufacturing a printed circuit board of the present invention is performed.

Next, the upper end of the wiring circuit 70 and the support wall 5
The light 40 emitted from the luminous body is focused on the portion of the photocurable resin liquid 10 located on the predetermined plane 39 in the upper part of the tank 20 including the upper end of 6. Then, the portion of the photocurable resin liquid 10 on the predetermined plane 39 where the light 40 is focused is cured. Then, a plate-like second support 54 is formed by connecting the upper end of the wiring circuit 70 and the upper end of the support wall 56 with the resin mass 12 obtained by curing the photocurable resin liquid 10 portion. Then, the step c of the first method for manufacturing a printed circuit board of the present invention is performed.

Next, as shown in FIG. 2, a first wiring circuit 70 formed three-dimensionally on the first support 52, the second support 54, the support wall 56, and the first support 52 is placed in the tank 20. It is taken out of the photocurable resin liquid 10. Then, the first support 52 and the second support 52 pass through the first injection port 62.
The first space in the inner space surrounded by the support 54 and the support wall 56
The insulating resin 90 is injected. And the first support 5
The wiring circuit 70 formed three-dimensionally between the second support 54 and the second support 54 is embedded in the first insulating resin 90. Then, the step d of the first method for manufacturing a printed circuit board of the present invention is performed.

Next, as shown in FIG. 3, the first support 52, the second support 54, and the support wall 56 are cut off from the ends of the first insulating resin 90 and the first wiring circuit 70 formed therein. are doing. Then, the step e of the first method for manufacturing a printed circuit board of the present invention is performed.

Thereafter, as shown in FIG. 4, the first support 52 and the second support 54 are cut away and the first support 52 is exposed.
The second wiring circuit 130 and the second wiring circuit 130 are provided on the surface of the insulating resin 90.
A conductive pad 140 for connecting an electronic component, which is connected to the wiring circuit, is formed to be connected to the first wiring circuit 70. Second wiring circuit 130 and conductive pad 140
Is formed by forming a metal plating layer formed by sequentially applying electroless metal plating and electrolytic metal plating on the surface of the first insulating resin 90, and etching the metal plating layer into a predetermined pattern. . Then, the step f of the first method for manufacturing a printed circuit board of the present invention is performed.

The method for manufacturing the first printed circuit board shown in FIGS. 1 to 4 comprises the above steps.

FIGS. 5 to 8 show a preferred embodiment of the second method of manufacturing a printed circuit board according to the present invention, and FIGS. Hereinafter, a method for manufacturing the second printed circuit board will be described.

In the second method of manufacturing a printed circuit board, as shown in FIG. 5, the first bottom of the inside of the tank 20 formed by the step a of the first method of manufacturing a printed circuit board is used.
The first support 52 is provided on a predetermined portion of the photocurable resin liquid 10 located on each of the planes 32, 33, 34, 35,.
The light 40 emitted from the luminous body from the closer plane 32 is focused in order. Then, the photo-curable resin liquid 10 portion at a predetermined portion located on each of the planes... 32, 33, 34, 35. Then, a conductive resin block 12 formed by three-dimensionally stacking the two-dimensionally cured photocurable resin liquids 10 is formed on the first support 52. Then, the first support 52 is formed by the resin mass 12.
A conductive first wiring circuit 70 and a conductive ground cylinder 80 surrounding the first wiring circuit 70 and the periphery thereof at predetermined intervals are formed three-dimensionally thereon. At the same time, the support wall 56 is formed upright and continuously on the periphery of the first support 52. Then, the step b1 of the second method for manufacturing a printed circuit board of the present invention is performed.

Next, as shown in FIG. 5, the photo-curing located on the predetermined plane 39 in the upper portion of the tank 20 including the upper end of the first wiring circuit 70, the upper end of the ground cylinder 80, and the upper end of the support wall 56. The light 40 emitted from the illuminant is focused on the portion of the liquid resin 10. Then, the portion of the photocurable resin liquid 10 on the predetermined plane 39 where the light 40 is focused is cured. Then, the plate-like second support 54 is fixed to the upper end of the first wiring circuit 70 by the resin mass 12 obtained by curing the photocurable resin liquid 10 portion,
0 and the upper end of the support wall 56.
At the same time, the ground cylinder 80 as shown in FIG.
A second injection port 64 in which a support arm 58 for supporting the upper end of the first wiring circuit 70 inserted into the inside of the first support 54 on the second support 54 is provided. Then, the step c1 of the second method for manufacturing a printed circuit board of the present invention is performed.

Next, the first support 52, the first support 54, the support wall 56, the first wiring circuit 70, and the ground cylinder 80 are taken out of the photocurable resin liquid 10 in the tank 20. Then, the first insulating resin 90 is injected into the inner space surrounded by the first support 52, the second support 54, and the support wall 56 through the first injection port 62. And the first
A wiring circuit 70 and a ground cylinder 80 formed three-dimensionally between the support 52 and the second support 54
It is embedded in the first insulating resin 90. With it, the second
The second insulating resin 92 is injected into the ground cylinder 80 through the inlet 64. And, between the ground cylinder 80 and the wiring circuit 70 inserted inside the ground cylinder 80,
The second insulating resin 92 is filled. Then, the step d1 of the second method for manufacturing a printed circuit board of the present invention is performed.

Next, as shown in FIG. 7, the first support 52, the second support 54, and the support wall 56 are connected to the first insulating resin 90, the second insulating resin 92, the first wiring circuit The support arm 58 and the end of the ground cylinder 80 are cut off together with the support arm 58. Then, the step e1 of the second method for manufacturing a printed circuit board of the present invention is performed.

Thereafter, as shown in FIG. 8, the first support 52 and the second support 54 are cut away and the exposed first support 52 and the second support 54 are removed.
On the surfaces of the insulating resin 90 and the second insulating resin 92, a second wiring circuit 130 and a conductor pad 140 for connecting electronic components connected to the second wiring circuit, the conductor pad 140 being connected to the first wiring circuit 70. , And a conductor pad 140 connected to the ground cylinder 80. The second wiring circuit 130 and the conductor pad 140 are formed in the same manner as described above. Then, the step f1 of the second method for manufacturing a printed circuit board of the present invention is performed.

The method for manufacturing the second printed circuit board shown in FIGS. 5 to 8 comprises the above steps.

FIGS. 9 to 11 show a preferred embodiment of the third method of manufacturing a printed circuit board according to the present invention, and FIGS. 9 to 11 are explanatory views of the manufacturing process. Hereinafter, a method of manufacturing the third printed circuit board will be described.

In this third method for manufacturing a printed circuit board, as shown in FIG. 9, the first bottom of the inside of the tank 20 formed by the step a of the first method for manufacturing a printed circuit board is used.
The first support 52 is provided on a predetermined portion of the photocurable resin liquid 10 located on each of the planes 32, 33, 34, 35,.
The light 40 emitted from the luminous body from the closer plane 32 is focused in order. Then, the photo-curable resin liquid 10 portion at a predetermined portion located on each of the planes... 32, 33, 34, 35. Then, a conductive resin block 12 formed by three-dimensionally stacking the two-dimensionally cured photocurable resin liquids 10 is formed on the first support 52. Then, the first support 52 is formed by the resin mass 12.
A conductive first wiring circuit 70 and a conductive ground cylinder 80 are three-dimensionally formed thereon. With it, the first
A support wall 56 is formed upright on the periphery of the support 52 so as to be continuous. Then, step b2 of the third method of manufacturing a printed circuit board according to the present invention is performed.

Next, as shown in FIG. 9, the photo-curing located on the predetermined plane 39 in the upper part of the tank 20 including the upper end of the first wiring circuit 70, the upper end of the ground cylinder 80, and the upper end of the support wall 56. The light 40 emitted from the illuminant is focused on the portion of the liquid resin 10. Then, the portion of the photocurable resin liquid 10 on the plane 39 where the light 40 is focused is cured. Then, the plate-like second support 54 is attached to the upper end of the first wiring circuit 70, the upper end of the ground cylinder 80, and the upper end of the support wall 56 by the resin mass 12 obtained by curing the photocurable resin liquid 10 portion. It is formed continuously. Then, step c2 of the third method of manufacturing a printed circuit board according to the present invention is performed.

Next, the first support 52, the second support 54, the support wall 56, the first wiring circuit 70, and the ground cylinder 80 are taken out of the photo-curable resin liquid 10 in the tank 20. Then, the first insulating resin 90 is injected into the inner space surrounded by the first support 52, the second support 54, and the support wall 56 through the first injection port 62. And the first
A wiring circuit 70 and a ground cylinder 80 formed three-dimensionally between the support 52 and the second support 54
It is embedded in the first insulating resin 90. Then, the step d2 of the third method of manufacturing a printed circuit board of the present invention is performed.

Next, as shown in FIG. 10, the first support 52, the second support 54 and the support wall 56 are connected to the first insulating resin 90 formed inside thereof, the end of the first wiring circuit 70 and the ground. It is cut off from the end of the cylinder 80. Then, the e1 step of the third method of manufacturing a printed circuit board of the present invention is performed.

Thereafter, as shown in FIG. 11, the second wiring circuit 130 and the second wiring circuit Conductive pad 140 for connecting continuous electronic components
A conductive pad 140 connected to the first wiring circuit 70
And a conductor pad 140 connected to the ground cylinder 80. Second wiring circuit 130 and conductive pad 140
Is formed in the same manner as described above. Then, the step f2 of the third method for manufacturing a printed circuit board according to the present invention is performed.

The method for manufacturing the third printed circuit board shown in FIGS. 9 to 11 comprises the above steps.

FIGS. 12 to 14 show a preferred embodiment of the fourth method of manufacturing a printed circuit board according to the present invention.
14 to 14 are explanatory diagrams of the manufacturing process. Hereinafter, a method for manufacturing the fourth wired circuit board will be described.

In the fourth method for manufacturing a printed circuit board, as shown in FIG. 12, the first support 52 at the bottom of the tank 20 formed by the step a of the first method for manufacturing a printed circuit board is used. The first support 5 is provided on a predetermined portion of the photo-curable resin liquid 10 located on each of the planes 32, 33, 34, 35.
The light 40 emitted from the luminous body from the side of the plane 32 closer to the second is focused in order. Then, the photo-curable resin liquid 10 portion at a predetermined portion located on each of the planes... 32, 33, 34, 35. Then, a conductive resin block 12 formed by three-dimensionally stacking the two-dimensionally cured photocurable resin liquids 10 is formed on the first support 52. Then, the first support 5 is formed by the resin mass 12.
2, a conductive wiring circuit 70 and a conductive ground cylinder 80 are formed three-dimensionally. At the same time, a support wall 56 is formed upright and continuously on the periphery of the first support 52. Then, step b3 of the fourth method for manufacturing a printed circuit board according to the present invention is performed.

Next, as shown in FIG. 12, the upper end of the wiring circuit 70, the upper end of the ground cylinder 80, and the support wall 5
The light 40 emitted from the luminous body is focused on the portion of the photocurable resin liquid 10 located on the predetermined plane 39 in the upper part of the tank 20 including the upper end of 6. Then, the portion of the photocurable resin liquid 10 on the predetermined plane 39 where the light 40 is focused is cured. Then, the plate-like second support 54 is connected to the upper end of the wiring circuit 70, the upper end of the ground cylinder 80, and the upper end of the support wall 56 by the resin mass 12 obtained by curing the photocurable resin liquid 10 portion. Has formed. At the same time, the second support 54 just above the upper end of the ground cylinder 80
A second injection port 64 as shown in FIG. 12 is provided in the portion. Then, the step c3 of the fourth method for manufacturing a printed circuit board according to the present invention is performed.

Next, the first support 52, the second support 54, the support wall 56, the first wiring circuit 70, and the ground cylinder 80 are taken out of the photo-curable resin liquid 10 in the tank 20. Then, the first insulating resin 90 is injected into the inner space surrounded by the first support 52, the second support 54, and the support wall 56 through the first injection port 62. And the first
First wiring circuit 70 and ground cylinder 80 formed three-dimensionally between support 52 and second support 54
Is embedded in the first insulating resin 90. With it
The second insulating resin 92 is injected into the ground cylinder 80 through the second injection port 64. And the ground cylinder 80
Is filled with a second insulating resin 92. Then, the step d3 of the fourth method for manufacturing a printed circuit board of the present invention is performed.

Next, as shown in FIG. 13, the first support 52, the second support 54, and the support wall 56 are connected to the first insulating resin 90, the second insulating resin 92,
It is cut off from the end of the first wiring circuit 70 and the end of the ground cylinder 80. Then, the e3 step of the fourth method for manufacturing a printed circuit board according to the present invention is performed.

Thereafter, as shown in FIG. 14, the first wiring 52 and the second wiring circuit 130 are formed on the surfaces of the first insulating resin 90 and the second insulating resin 92 which are exposed after the first support 52 and the second support 54 are cut off. A conductor pad 140 for connecting electronic components, which is connected to the second wiring circuit, is formed as a conductor pad 140 connected to the first wiring circuit 70 and a conductor pad 140 connected to the ground cylinder 80. Second wiring circuit 130
The conductor pads 140 are formed in the same manner as described above. Then, the step f3 of the fourth method for manufacturing a printed circuit board according to the present invention is performed.

The method for manufacturing the fourth printed circuit board shown in FIGS. 12 to 14 comprises the above steps.

In the first, second, third or fourth method of manufacturing a printed circuit board, b, b1, b2 or b
In three steps, each plane divided into a plurality of steps vertically from above the first support 52 to above it, 32, 33, 3
4, 35... Photocurable resin liquid 10 at a predetermined position located on
Using a conductive resin mass 12 that is selectively hardened two-dimensionally and stacked three-dimensionally, it is complicatedly bent on a plate-shaped first support 52 formed at the bottom of the inside of the tank 20. Of the conductive first wiring circuit 70, the conductive ground cylinder 80 surrounding the first wiring circuit and the periphery thereof, such as a complicated bend, or the conductive ground cylinder 80, a complex bend, etc. By using the method, it is possible to easily and quickly form a three-dimensional image without any trouble.

Next, in the step d, d1, d2 or d3, the conductive first wiring circuit 70 formed three-dimensionally or the ground cylinder 80 in addition thereto is embedded in the first insulating resin 90, The space between the ground cylinder 80 and the conductive wiring circuit 70 inserted inside the ground cylinder 80 may be filled with the second insulating resin 92 or the ground cylinder 8 may be filled.
0 can be filled with the second insulating resin 92. Then, on the insulating substrate 100 made of the first insulating resin 90 or the second insulating resin 92 in addition thereto, the conductive first wiring circuit 70 that is bent complicatedly, and the conductive ground cylinder 80 that is bent complicatedly are formed. Inside the conductive wiring circuit 70 is a second
A coaxial line 110 inserted through the insulating resin 92,
The conductive ground cylinder 80 which is bent in a complicated manner or the conductive ground cylinder 8 filled with the second insulating resin 92
0 is the second wiring circuit 70 and the coaxial line 11
The printed circuit board 120 embedded in a state where it is intricately entangled with the 0 or the ground cylinder 80 can be easily and quickly formed without any trouble.

In the case where the second insulating resin 92 is a dielectric, the portion where the conductive first wiring circuit 70 is inserted inside the conductive ground cylinder 80 via the second insulating resin is provided. , And a capacitor such as a decoupling capacitor. Then, the printed circuit board 120 in which the capacitor is embedded in a state in which the first wiring circuit 70 is intricately entangled with the first wiring circuit 70 can be easily and quickly formed without trouble.

FIGS. 15 to 18 show a preferred embodiment of the fifth method of manufacturing a printed circuit board according to the present invention.
FIG. 18 to FIG. 18 are explanatory diagrams of the manufacturing process. Hereinafter, a method of manufacturing the fifth wired circuit board will be described.

As shown in FIG. 15, the tank 21 containing the uncured photo-curable resin liquid 11 in which the photo-curable resin liquid part cured by focusing light becomes an insulating resin lump. Provided. Then, the light 40 emitted from the luminous body (not shown) is focused on the portion of the photocurable resin liquid 11 located on the predetermined plane 31 at the bottom of the tank 21, and the light 4
The portion of the photo-curable resin liquid 11 on the predetermined plane 31 focused on 0 is cured. Then, the tank 2 is formed by a resin mass 13 obtained by curing the photocurable resin liquid 11 portion.
A plate-shaped first support 53 is formed at the inner bottom of the first support 53. At the same time, a first injection port 63 is provided in the first support 53. Then, the step A of the fifth method of manufacturing a printed circuit board of the present invention is performed.

Next, as shown in FIG.
A first support 53 is provided on a predetermined portion of the photocurable resin liquid 11 located on each of the planes 32, 33, 34, 35,.
The light 40 emitted from the luminous body from the closer plane 32 is focused in order. Then, a portion of the photo-curable resin liquid 11 at a predetermined position located on each of the planes... 32, 33, 34, 35. Then, an insulating resin mass 13 formed by three-dimensionally stacking the two-dimensionally cured photocurable resin liquid 11 portions is formed on the first support 53. Then, the first support 53 is formed by the resin mass 13.
An insulating first wiring circuit bone 71 is formed three-dimensionally thereon. At the same time, a support wall 57 is formed upright on the periphery of the first support 53 so as to be continuously formed. Then, the step B of the fifth method of manufacturing a printed circuit board of the present invention is performed.

Next, as shown in FIG. 15, the light-curable resin liquid 11 located on the predetermined plane 39 in the upper portion of the tank 21 including the upper end of the wiring circuit bone 71 and the upper end of the support wall 57 emits light. The light 40 emitted from the body is focused. Then, a predetermined plane 39 on which the light 40 is focused
The upper photocurable resin liquid 11 is cured. The resin mass 13 formed by curing the photocurable resin liquid 11 forms a plate-like second support 55 connected to the upper end of the first wiring circuit bone 71 and the upper end of the support wall 57. . Then, the step C of the fifth method of manufacturing a printed circuit board of the present invention is performed.

Next, as shown in FIG. 16, the first support 53, the second support 55, the support wall 57, and the first wiring circuit bone 71 are taken out of the photo-curable resin liquid 11 in the tank 21. Then, a first wiring circuit bone 71 formed between the first support 53 and the second support 55
Then, metal plating 88 such as Cu plating is applied by an electroless plating method or the like. Then, the step D of the fifth method for manufacturing a printed circuit board of the present invention is performed.

Next, the first insulating resin 90 is injected into the inner space surrounded by the first support 53, the second support 55, and the support wall 57 through the first injection port 63. The first three-dimensionally formed metal plating 88 is provided between the first support 53 and the second support 55.
The wiring circuit bone 71 is embedded in the first insulating resin 90. Then, the step E of the fifth method for manufacturing a printed circuit board of the present invention is performed.

Next, as shown in FIG. 17, the first support 53, the second support 55 and the support wall 57 are separated from the first insulating resin 90 and the first wiring circuit frame 7 formed inside thereof.
One end is cut away. Then, the F step of the fifth method for manufacturing a printed circuit board of the present invention is performed.

Thereafter, as shown in FIG. 18, the second wiring circuit 130 and the second wiring circuit Conductive pad 140 for connecting continuous electronic components
Metal plating 8 applied to the first wiring circuit bone 71
8 are formed. The second wiring circuit 130 and the conductor pad 140 are formed in the same manner as described above.
Has formed. Then, the G step of the fifth method for manufacturing a printed circuit board of the present invention is performed.

The method for manufacturing the fifth wired circuit board shown in FIGS. 15 to 18 comprises the above steps.

FIGS. 19 to 22 show a preferred embodiment of the sixth method of manufacturing a printed circuit board according to the present invention.
FIG. 22 to FIG. 22 are explanatory diagrams of the manufacturing process. Hereinafter, a method of manufacturing the sixth wired circuit board will be described.

In the sixth method of manufacturing a printed circuit board, as shown in FIG. 19, the first support 53 at the bottom of the tank 21 formed by the step A of the fifth method of manufacturing a printed circuit board is used. A first support 53 is provided on a predetermined portion of the photo-curable resin liquid 11 located on each of the planes 32, 33, 34, 35 divided into a plurality of steps vertically from above to below.
The light 40 emitted from the luminous body from the closer plane 32 is focused in order. Then, a portion of the photo-curable resin liquid 11 at a predetermined position located on each of the planes... 32, 33, 34, 35. Then, an insulating resin mass 13 formed by three-dimensionally stacking the two-dimensionally cured photocurable resin liquid 11 portions is formed on the first support 53. Then, the first support 53 is formed by the resin mass 13.
An insulating first wiring circuit bone 71 and an insulating ground cylindrical body bone 81 surrounding the first wiring circuit bone and the periphery thereof at predetermined intervals are formed three-dimensionally thereon. At the same time, a support wall 57 is formed upright on the periphery of the first support 53 so as to be continuously formed. Then, the step B1 of the sixth method for manufacturing a printed circuit board of the present invention is performed.

Next, the tank 2 including the upper end of the first wiring circuit bone 71, the upper end of the ground tubular bone 81, and the upper end of the support wall 57.
1 is a photo-curable resin liquid 1 located on a predetermined flat surface 39
One portion focuses light 40 emitted from the illuminant. Then, the portion of the photocurable resin liquid 11 on the predetermined plane 39 on which the light 40 is focused is cured. Then, the plate-like second support 55 is formed by the resin mass 13 obtained by curing the photo-curable resin liquid 11 to form the upper end of the first wiring circuit bone 71, the upper end of the ground cylindrical bone 81, and the support wall 57. It is formed continuously with the upper end. At the same time, in the second support 55 portion just above the upper end of the ground cylindrical bone 81,
As shown in FIG. 20, the upper end of the first wiring circuit bone 71 inserted into the inside of the ground cylindrical bone 81 is attached to the second support 55.
Inlet 65 provided with a support arm 59 for supporting the
Is provided. Then, the step C1 of the sixth method for manufacturing a printed circuit board of the present invention is performed.

Next, the first support 53, the second support 55, the support wall 57, the first wiring circuit bone 71, and the ground cylindrical bone 81 are taken out of the photocurable resin liquid 11 in the tank 21. Then, a metal plating 88 such as Cu plating is applied to the wiring circuit bone 71 and the ground cylindrical body 81 formed between the first support 53 and the second support 55 by an electroless plating method or the like. ing. Then, step D1 of the sixth method of manufacturing a printed circuit board according to the present invention is performed.

Next, the first insulating resin 90 is injected into the inner space surrounded by the first support 53, the second support 55, and the support wall 57 through the first injection port 63. The first three-dimensionally formed metal plating 88 is provided between the first support 53 and the second support 55.
The wiring circuit bone 71 and the ground cylinder bone 81 are embedded in the first insulating resin 90. At the same time, the second injection port 65
Through the ground cylindrical body 8 with metal plating 88
1 is filled with a second insulating resin 92. Then, between the ground cylindrical bone 81 and the first wiring circuit bone 71 provided with the metal plating 88 inserted inside the ground cylindrical bone 81,
The second insulating resin 92 is filled. Then, the E1 step of the sixth method for manufacturing a printed circuit board of the present invention is performed.

Next, as shown in FIG. 21, the first support 53, the second support 55, and the support wall 57 are connected to the first insulating resin 90, the second insulating resin 92,
The support arm 59 and the end of the first wiring circuit bone 71 and the end of the ground bone cylinder 81 are cut off. Then, the F1 step of the sixth method for manufacturing a printed circuit board of the present invention is performed.

Thereafter, as shown in FIG. 22, the first wiring 53 and the second wiring circuit 130 are formed on the surfaces of the first insulating resin 90 and the second insulating resin 92 which are exposed after the first support 53 and the second support 55 are cut off. A conductive pad 140 connected to the second wiring circuit for connecting electronic components, the conductive pad 140 being connected to the metal plating 88 applied to the first wiring circuit bone 71;
A conductor pad 140 connected to the metal plating 88 applied to the ground cylindrical body 81 is formed. Second wiring circuit 13
0 and the conductor pad 140 are formed in the same manner as described above. Then, the G1 step of the sixth method for manufacturing a printed circuit board of the present invention is performed.

The method for manufacturing the sixth wired circuit board shown in FIGS. 19 to 22 comprises the above steps.

FIGS. 23 to 25 show a preferred embodiment of the method for manufacturing a seventh wired circuit board according to the present invention.
FIG. 25 to FIG. 25 are explanatory diagrams of the manufacturing process. Hereinafter, a method of manufacturing the seventh wired circuit board will be described.

In the seventh method of manufacturing a printed circuit board, a plurality of upper and lower parts are formed vertically from above the first support 53 in the bottom of the tank 21 formed in step A of the above-described method of manufacturing the fifth printed circuit board. Each plane divided into steps… 3
2, 33, 34, 35... Photocurable resin liquid 1 located on
The focus of the light 40 emitted from the luminous body from the side of the plane 32 near the first support 53 is sequentially focused on one predetermined portion. And each plane focused on the light 40 ... 3
2, 33, 34, 35,..., A predetermined portion of the photocurable resin liquid 11 is selectively and two-dimensionally cured. Then, an insulating resin block 1 formed by three-dimensionally stacking the two-dimensionally cured photocurable resin liquid 11 portions.
3 are formed on the first support 53. The resin mass 13 forms the insulating first wiring circuit bone 71 and the insulating ground cylindrical bone 81 three-dimensionally on the first support 53. At the same time, the first support 5
A support wall 57 is formed upright on the peripheral edge of No. 3 so as to be continuous. Then, step B2 of the seventh method of manufacturing a printed circuit board according to the present invention is performed.

Next, the light-emitting resin liquid 11 is positioned on the predetermined flat surface 39 in the upper part of the tank 21 including the upper end of the wiring circuit bone 71, the upper end of the ground cylindrical bone 81, and the upper end of the support wall 57. The light 40 emitted from is focused. Then, a predetermined plane 39 on which the light 40 is focused
The upper photocurable resin liquid 11 is cured. Then, the plate-like second support 55 is formed by the resin mass 13 obtained by curing the photo-curable resin liquid 11 to the upper end of the wiring circuit bone 71, the upper end of the ground cylindrical bone 81, and the support wall 57.
Is formed continuously with the upper end. Then, the C2 step of the seventh method of manufacturing a printed circuit board of the present invention is performed.

Next, the first support 53, the second support 55, the support wall 57, the first wiring circuit bone 71, and the ground cylindrical bone 81 are taken out of the photocurable resin liquid 11 in the tank 21. Then, the first wiring circuit bone 71 and the ground cylindrical body 81 formed between the first support 53 and the second support 55 are subjected to electroless plating or the like to form C
Metal plating 88 such as u plating is applied. Then, step D2 of the seventh method of manufacturing a printed circuit board according to the present invention is performed.

Next, the first insulating resin 90 is injected into the inner space surrounded by the first support 53, the second support 55, and the support wall 57 through the first injection port 63. The first three-dimensionally formed metal plating 88 is provided between the first support 53 and the second support 55.
The wiring circuit bone 71 and the ground cylinder bone 81 are embedded in the first insulating resin 90. Then, the E2 step of the seventh method for manufacturing a printed circuit board according to the present invention is performed.

Next, as shown in FIG. 24, the first support 53, the second support 55, and the support wall 57 are connected to the first insulating resin 90 formed inside the first support 53, the first wiring circuit bone 71, and the like.
And the end of the ground bone cylinder 81. Then, the F2 step of the method for manufacturing a seventh wired circuit board of the present invention is performed.

Thereafter, as shown in FIG. 25, the second wiring circuit 130 and the second wiring circuit Conductive pad 140 for connecting continuous electronic components
Metal plating 8 applied to the first wiring circuit bone 70
8 and a conductive pad 140 connected to the metal plating 88 applied to the ground cylindrical bone 81. Second wiring circuit 130 and conductive pad 140
Is formed in the same manner as described above. Then, step G2 of the seventh method of manufacturing a printed circuit board according to the present invention is performed.

The method for manufacturing the seventh printed circuit board shown in FIGS. 23 to 25 includes the above steps.

FIGS. 26 to 28 show a preferred embodiment of the eighth method of manufacturing a printed circuit board according to the present invention.
28 are explanatory diagrams of the manufacturing process. Hereinafter, a method for manufacturing the eighth wired circuit board will be described.

In the eighth method of manufacturing a printed circuit board, a plurality of upper and lower portions are formed from above the first support 53 at the bottom of the inside of the tank 21 formed in step A of the above-described method of manufacturing the fifth printed circuit board. Each plane divided into steps… 3
2, 33, 34, 35... Photocurable resin liquid 1 located on
The focus of the light 40 emitted from the luminous body from the side of the plane 32 near the first support 53 is sequentially focused on one predetermined portion. And each plane focused on the light 40 ... 3
2, 33, 34, 35,..., A predetermined portion of the photocurable resin liquid 11 is selectively and two-dimensionally cured. Then, an insulating resin block 1 formed by three-dimensionally stacking the two-dimensionally cured photocurable resin liquid 11 portions.
3 are formed on the first support 53. The resin mass 13 forms the insulating wiring circuit bone 71 and the insulating ground cylindrical bone 81 three-dimensionally on the first support 53. At the same time, a support wall 57 is formed upright on the periphery of the first support 53 so as to be continuously formed. Then, step B3 of the eighth method of manufacturing a printed circuit board according to the present invention is performed.

Next, the light-emitting resin is placed on the photocurable resin liquid 11 located on the predetermined plane 39 in the upper portion of the tank 21 including the upper end of the wiring circuit bone 71, the upper end of the ground cylindrical bone 81, and the upper end of the support wall 57. The light 40 emitted from is focused. Then, a predetermined plane 39 on which the light 40 is focused
The upper photocurable resin liquid 11 is cured. Then, the plate-like second support 55 is formed by the resin mass 13 obtained by curing the photo-curable resin liquid 11 to the upper end of the wiring circuit bone 71, the upper end of the ground cylindrical bone 81, and the support wall 57.
Is formed continuously with the upper end. At the same time, the portion of the second support 55 just above the upper end of the ground cylindrical bone 81 is
The second injection port 65 is provided as shown in FIG. Then, step C3 of the eighth method of manufacturing a printed circuit board according to the present invention is performed.

Next, the first support 53, the second support 55, the support wall 57, the first wiring circuit bone 71 and the ground cylindrical bone 81 are taken out of the photo-curable resin liquid 11 in the tank 21. Then, the first wiring circuit bone 71 and the ground cylindrical body 81 formed between the first support 53 and the second support 55 are subjected to electroless plating or the like to form C
Metal plating 88 such as u plating is applied. Then, step D3 of the eighth method of manufacturing a printed circuit board according to the present invention is performed.

Next, the first insulating resin 90 is injected into the inner space surrounded by the first support 53, the second support 55, and the support wall 57 through the first injection port 63. Then, the wiring circuit bone 71 and the ground cylindrical bone 81 provided with the metal plating 88 three-dimensionally formed between the first support 53 and the second support 55 are attached to the first insulating resin 9.
It is embedded in 0. At the same time, the second insulating resin 92 is injected through the second injection port 65 into the ground cylindrical bone 81 on which the metal plating 88 has been applied. The ground cylindrical bone 81 is filled with a second insulating resin 92. Then, the E3 step of the eighth method for manufacturing a printed circuit board of the present invention is performed.

Next, as shown in FIG. 27, the first support 53, the second support 55, and the support wall 57 are separated from each other by the first insulating resin 90, the second insulating resin 92,
The end of the first wiring circuit bone 71 and the end of the ground bone cylinder 81 are cut off. Then, the F3 step of the eighth method for manufacturing a printed circuit board of the present invention is performed.

Thereafter, as shown in FIG. 28, the first wiring 52 and the second wiring circuit 130 are formed on the surfaces of the first insulating resin 90 and the second insulating resin 92, which are exposed by cutting the first support 52 and the second support 54. A conductive pad 140 connected to the second wiring circuit for connecting electronic components, the conductive pad 140 being connected to the metal plating 88 applied to the first wiring circuit bone 70;
A conductor pad 140 connected to the metal plating 88 applied to the ground cylindrical body 81 is formed. Second wiring circuit 13
0 and the conductor pad 140 are formed in the same manner as described above. Then, step G3 of the eighth method of manufacturing a printed circuit board according to the present invention is performed.

The method for manufacturing the eighth printed circuit board shown in FIGS. 26 to 28 comprises the above steps.

In the fifth, sixth, seventh or eighth method of manufacturing a printed circuit board, the B, B1, B2 or B
In the three steps, each plane divided into a plurality of steps vertically from above the first support 53 to above it, 32, 33, 3
4, 35... Photocurable resin liquid 11 at a predetermined portion located above
Using an insulating resin mass 13 that is selectively hardened two-dimensionally and stacked three-dimensionally, it is complicatedly bent on a plate-shaped first support 53 formed on the bottom inside the tank 21. The insulated first wiring circuit bone 71, the insulated ground cylindrical bone 81 surrounding the first wiring circuit bone and the periphery thereof, or the insulated ground cylindrical bone 81 bent intricately. It can be easily and quickly formed three-dimensionally by using a stereolithography technique without trouble.

Next, in the D, D1, D2 or D3 step, the above-described three-dimensionally formed insulating wiring circuit bone 71 or, in addition thereto, the insulating ground cylindrical bone 81
Can be subjected to metal plating 88 such as Cu plating. Then, the first wiring circuit bone 71 or the ground cylindrical bone 81 in addition thereto can be made conductive.

Next, in the E, E1, E2 or E3 step, the first wiring circuit bone 71 formed three-dimensionally and having conductivity or the ground cylindrical bone 81 in addition to the first wiring circuit bone 71 is formed. A second insulating resin 92 is embedded between the ground cylindrical body 81 embedded or provided with conductivity and the conductive first wiring circuit bone 71 inserted inside the ground cylindrical body 81. Or ground cylindrical bone 8
1 can be filled with the second insulating resin 92. Then, the first wiring circuit bone 71 having conductivity such as complicated bending is provided on the insulating substrate 100 made of the first insulating resin 90 or the second insulating resin 92 in addition thereto, and the conductivity is provided such as complicated bending. A coaxial line 110 in which a first wiring circuit bone 71 having electrical conductivity is inserted through an insulating resin 92 inside a ground cylindrical bone 81 provided, a ground cylinder having electrical conductivity such as a complicated bend. Conductive ground cylindrical body 8 filled with body bone 81 or second insulating resin 92
A printed circuit board 120 embedded in a state in which it is intricately entangled three-dimensionally with another conductive circuit bone 71, a coaxial line 110, or a ground cylindrical bone 81 having the same structure and conductivity. Can be easily and quickly formed without trouble.

When the second insulating resin 92 is a dielectric, the first wiring circuit bone 71 having conductivity is provided inside the ground cylindrical bone 81 having conductivity and the second insulating resin 92 is provided. Can be formed in a capacitor such as a decoupling capacitor. Similarly, when the resin mass 13 forming the ground cylindrical bone 81 is a dielectric, the metal plating 88 is applied to the outer surface and the inner surface of the ground cylindrical bone 81 with the ground cylindrical bone 81 interposed therebetween. Can be formed on the capacitor. Then, the printed circuit board 120 in which the capacitors are embedded in a state in which they are intricately intertwined with the conductive first printed circuit bone 71 in a three-dimensional manner can be easily and quickly mounted without trouble. Can be formed.

In the above-described first, second, third or fourth method of manufacturing a printed circuit board, as shown in FIG.
A third injection port 66 is provided in the support wall 56 formed in the step b, b1, b2 or b3, and the d, d1, d2
Or, in the d3 step, instead of the first injection port 62,
Alternatively, the first insulating resin 90 may be injected into the inner space surrounded by the first support 52, the second support 54, and the support wall 56 through the third injection port 66 together with the first injection port 62. Then, the first wiring circuit 70 or, in addition to this, the ground cylinder 80 may be embedded in the first insulating resin 90.

In the first, second, third or fourth method of manufacturing a printed circuit board, as shown in FIG. 29, the first, second, third, or fourth printed circuit board is formed in the step c, c1, c2 or c3. The second support 54 is provided with a fourth injection port 68, and in the d, d1, d2, or d3 step, instead of the first injection port 62 or the third injection port 66, or the first injection port 62 or the third injection port. With its inlet 66, its fourth inlet 68
, The first insulating resin 90 may be injected into an inner space surrounded by the first support 52, the second support 54, and the support wall 56. Then, the first wiring circuit 70 or, in addition to this, the ground cylinder 80 may be embedded in the first insulating resin 90.

In the fifth, sixth, seventh or eighth method of manufacturing a printed circuit board, as shown in FIG.
A third injection port 67 is provided in the support wall 57 formed in the step B, B1, B2 or B3, so that the E, E1, E2
Or, in the E3 process, instead of the first injection port 63,
Alternatively, the first support 53, the second support 55, and the support wall 57 may be passed through the third injection port 67 together with the first injection port 63.
The first insulating resin 90 may be injected into the inner space surrounded by. Then, the first wiring circuit bone 71 or, in addition thereto, the ground cylindrical bone 81 may be embedded in the first insulating resin 90.

In the fifth, sixth, seventh or eighth method of manufacturing a printed circuit board, as shown in FIG. The second support 55 is provided with a fourth injection port 69, and the first injection port 6 is provided in the E, E1, E2 or E3 step.
3 or the third inlet 67 or the first inlet 6
The first support 53, the second support 55, and the support wall 5 through the fourth injection port 69 together with the third or third injection port 67.
7, the first insulating resin 90 may be injected into the inner space surrounded by. Then, the first wiring circuit bone 71 or, in addition thereto, the ground cylindrical bone 81 may be embedded in the first insulating resin 90.

In the first, second, third, fourth, fifth, sixth, seventh or eighth method of manufacturing a printed circuit board, the first injection ports 62, 63, the third Inlet 66, 67
Alternatively, the first supports 52 and 53 and the second support 5 are passed through at least two or more of the fourth inlets 68 and 69.
The first insulating resin 90 can be uniformly and smoothly injected into the inner space surrounded by the fourth and the 55 and the support walls 56 and 57.
At the same time, other first injection ports 62, 63, third injection ports 66, 67, or fourth injection ports 68, 69 into which the first insulating resin 90 is not injected can be used as air vent holes. Then, the first wiring circuit 70 and the first wiring
The wiring circuit bone 71, the ground cylindrical body 80, or the ground cylindrical body 81 can be securely embedded without any gap.

In the above-described first, second, third, fourth, fifth, sixth, seventh or eighth method of manufacturing a printed circuit board, the light for curing the photo-curable resin liquids 10 and 11 is used. Forty,
It is preferable to use laser light such as He-Cd laser light, Nd: YVO4 laser light, or semiconductor laser light.

In this case, a laser beam having a high condensing property and a high resolution is used, and predetermined planes 32, 33, 34, 35, divided into upper and lower sections in the tanks 20, 21 are formed. The portions of the photocurable resin liquids 10 and 11 can be selectively and two-dimensionally cured with high accuracy. The resin block 1 is formed by curing the photocurable resin liquids 10 and 11 at predetermined positions on the respective planes 32, 33, 34, 35.
The first wiring circuit 70 and the first wiring circuit bone 71, or the ground cylinder 80 and the ground cylinder bone 81 in addition to the first wiring circuit 70 and the first wiring circuit bone 81 on the first supports 52 and 53 are three-dimensionally highly accurate. Can be formed.

When laser light is used as the light 40 for curing the photo-curable resin liquids 10, 11, FIGS. 1, 5, 9, 12, 15, 15, 19, 23, and 26,
As shown in FIG. 29 or FIG. 30, a mask 150 made of quartz or the like, which hardly absorbs laser light, is provided, and the bottom of the mask 150 is placed on each plane where the photocurable resin liquids 10 and 11 are to be cured. ... 31, 32, 33, 34, 35 ...
It is good to arrange them in order on the top. Then, the mask 150
The laser light is focused on the bottom of the mask 150, and the photo-curable resin liquids 10 and 11 on the bottom of the mask 150, on which the laser light is focused, are preferably cured. In this case, predetermined planes on which the bottom of the mask 150 is arranged ... 3
1, 32, 33, 34, 35,... And the photocurable resin liquids 10 and 11 can be accurately cured without error.

When laser light is used as the light 40 for curing the photo-curable resin liquids 10 and 11, the same as in FIGS.
9, 12, 15, 19, 23, 26, 2
9, or as shown in FIG. 30, the laser light is focused on predetermined planes... 31, 32, 33, 34, 35,. At the same time, the portions of the photo-curable resin liquids 10 and 11 on predetermined planes... 31, 32, 33, 34, 35. In this case, the resolution of the focal position of the laser beam can be increased to a submicron order. And
Submicron-order high-precision first wiring circuit 70 or first wiring-circuit bone 71 or, in addition, submicron-order high-precision ground cylinder 80 or ground cylinder 81
Can be formed three-dimensionally on the first supports 52 and 53.

The first wiring circuit 70, the first wiring circuit bone 71,
Or, in addition to this, the ground cylinder 80 and the ground cylinder bone 8
First insulating resin 90 for embedding 1 and ground cylinder 8
And the second insulating resin 92 filling the ground cylindrical bone 81 is an epoxy resin having high fluidity and good permeability, BC
B (benzocyclobutene), PPE (poniphenylene ether), epoxy resin, or the like is preferably used.

In the case where a capacitor such as a decoupling capacitor is formed by the ground tube body 80 or the ground tube bone 81 and the first wiring circuit 70 or the first wiring circuit bone 71 inserted therein, the ground tube is used. It is preferable to use a high dielectric constant material such as an insulating resin in which strontium or the like is dispersed and contained in the second insulating resin 92 that fills the body 80 and the ground cylindrical body 81.

Also, metal plating 88 applied to the outer surface and the inner surface of the ground cylindrical bone 81 with the ground cylindrical bone 81 formed from the resin mass 13 as a dielectric material interposed therebetween.
In the case where a capacitor is formed using the above method, the ground cylindrical bone 81 may be formed using a high dielectric material such as an insulating resin in which strontium or the like is dispersed.

The uncured photocurable resin liquid 10 which becomes a conductive resin mass when photocured used in the first, second, third or fourth printed circuit board manufacturing method includes copper polyamide. System material (Polyamide resin mixed with copper filler)
It is good to use etc. On the other hand, the uncured photo-curable resin liquid 11 which becomes an insulating resin block when photo-cured used in the fifth, sixth, seventh or eighth method of manufacturing a printed circuit board
It is preferable to use a polyacid resin, an oxetane resin, an epoxy resin, or a urethane resin.

In the first, second, third or fourth printed circuit board manufacturing method, the first printed circuit 70, the coaxial line 110, the capacitor or The printed circuit board 120 embedded in the insulating substrate 100 by forming two or more of the ground cylinders 80 intricately intertwined with each other can be formed. Similarly, in the fifth, sixth, seventh, or eighth method of manufacturing a printed circuit board, the first printed circuit board having conductivity is obtained by combining any two or more of the methods. The printed circuit board 120 embedded in the insulating substrate 100 can be formed by two or more of the coaxial line 71, the coaxial line 110, the capacitor, and the ground cylinder 81 having conductivity are complicatedly entangled three-dimensionally.

[0110]

As described above, according to the first, second, third, fourth, fifth, sixth, seventh or eighth manufacturing method of the printed circuit board of the present invention, the signal line , A wiring circuit used for a power supply line or a ground line, a coaxial line for transmitting a high-frequency signal, or a wiring circuit board in which capacitors such as decoupling capacitors are densely embedded in an insulating substrate in a three-dimensionally intricately entangled state. Using stereolithography technology
It can be formed easily and quickly without trouble. Further, it is possible to provide a low-cost, high-density wiring circuit, a coaxial circuit, and a wiring circuit board having a capacitor suitable for electronic components such as a high-density semiconductor chip.

[Brief description of the drawings]

FIG. 1 is a process explanatory view of a first method for manufacturing a printed circuit board according to the present invention.

FIG. 2 is a process explanatory view of the first method for manufacturing a printed circuit board according to the present invention;

FIG. 3 is a process explanatory view of the first method for manufacturing a printed circuit board according to the present invention.

FIG. 4 is a process explanatory view of the first method for manufacturing a printed circuit board according to the present invention;

FIG. 5 is a process explanatory view of the second method for manufacturing a printed circuit board according to the present invention.

FIG. 6 is a process explanatory view of the second method for manufacturing a printed circuit board according to the present invention.

FIG. 7 is a process explanatory view of the second method for manufacturing a printed circuit board according to the present invention.

FIG. 8 is a process explanatory view of the second method for manufacturing a printed circuit board according to the present invention.

FIG. 9 is a process explanatory view of the third method for manufacturing a printed circuit board according to the present invention.

FIG. 10 is a process explanatory view of the third method for manufacturing a printed circuit board according to the present invention.

FIG. 11 is a process explanatory view of the third method for manufacturing a printed circuit board according to the present invention.

FIG. 12 is a process explanatory view of the fourth method for manufacturing a printed circuit board according to the present invention.

FIG. 13 is a process explanatory view of the fourth method for manufacturing a printed circuit board according to the present invention.

FIG. 14 is an explanatory process diagram of a fourth method for manufacturing a printed circuit board according to the present invention.

FIG. 15 is a process explanatory view of the fifth method for manufacturing a printed circuit board according to the present invention.

FIG. 16 is a process explanatory view of the fifth method for manufacturing a printed circuit board according to the present invention.

FIG. 17 is a process explanatory view of the fifth method for manufacturing a printed circuit board according to the present invention.

FIG. 18 is a process explanatory view of the fifth method for manufacturing a printed circuit board according to the present invention.

FIG. 19 is a process explanatory view of the sixth method for manufacturing a printed circuit board according to the present invention.

FIG. 20 is an explanatory process diagram of the sixth method for manufacturing a printed circuit board according to the present invention.

FIG. 21 is an explanatory process diagram of the sixth method for manufacturing a printed circuit board according to the present invention.

FIG. 22 is an explanatory process diagram of the sixth method for manufacturing a printed circuit board according to the present invention.

FIG. 23 is an explanatory view illustrating steps of the seventh method of manufacturing a printed circuit board according to the present invention.

FIG. 24 is an explanatory view illustrating a step of the method for manufacturing a seventh wired circuit board according to the present invention;

FIG. 25 is an explanatory process diagram of the seventh method of manufacturing a printed circuit board according to the present invention.

FIG. 26 is a process diagram of the eighth method for manufacturing a printed circuit board according to the present invention.

FIG. 27 is an explanatory process diagram of the eighth method of manufacturing a printed circuit board according to the present invention.

FIG. 28 is an explanatory diagram showing steps of the eighth method of manufacturing a printed circuit board according to the present invention.

FIG. 29 is an explanatory diagram showing steps of the first method of manufacturing a printed circuit board according to the present invention.

FIG. 30 is a process explanatory view of the fifth method for manufacturing a printed circuit board according to the present invention.

[Explanation of symbols]

 10, 11 Photocurable resin liquid 12, 13 Resin lump 20, 21 Tank 31, 39 Predetermined plane 32, 33, 34, 35 Plane 40 Light 52, 53 First support 54, 55 Second support 56, 57 Support wall 58 , 59 Support arm 62, 63 First inlet 64, 65 Second inlet 66, 67 Third inlet 68, 69 Fourth inlet 70 First wiring circuit 71 First wiring circuit bone 80 Ground cylinder 81 Ground cylinder Body bone 90 First insulating resin 92 Second insulating resin 100 Insulating substrate 110 Coaxial line 120 Wiring circuit board 130 Second wiring circuit 140 Conductor pad

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Hiroshi Tanaka 711, Toshida, Kurita-sha, Nagano-shi, Nagano F-term in Shinko Electric Industries Co., Ltd. 5E343 AA01 BB24 DD33 DD57 DD68 GG11 GG13

Claims (13)

[Claims] 1. A method for manufacturing a printed circuit board, comprising the following steps. a. The photocurable resin, which is located on a predetermined plane at the bottom in a tank containing an uncured photocurable resin liquid in which the photocurable resin liquid portion cured by focusing light becomes an electrically conductive resin mass. Focus the light emitted from the luminous body on the liquid part,
The light-curable resin liquid portion focused on the light is cured, and a resin mass formed by curing the light-curable resin liquid portion forms a plate-like first support at the bottom in the tank, and the second support is formed. (1) A step of providing a first injection port in one support. b. Focus of light emitted from the luminous body from a plane side closer to the first support to a predetermined portion of the photocurable resin liquid located on each plane divided into a plurality of steps vertically from above the first support to above the first support In order, and selectively cure two-dimensionally the photocurable resin liquid portion at a predetermined portion located on each plane where the light is focused, and the two-dimensionally cured photocurable resin A conductive resin block formed by stacking liquid portions three-dimensionally is formed on the first support, and the resin block forms a conductive first wiring circuit three-dimensionally on the first support. Forming a support wall upright around the periphery of the first support. c. The light emitted from the light emitter is focused on the photocurable resin liquid portion located on a predetermined plane in the upper portion of the inside of the tank including the upper end of the first wiring circuit and the upper end of the support wall, and the light is Cure the focused photocurable resin liquid part,
A step of forming a plate-shaped second support at an upper end of the first wiring circuit and an upper end of the support wall by using a resin mass obtained by curing the photocurable resin liquid portion. d. The first support, the second support, the support wall, and the first support
Take out the wiring circuit from the photocurable resin liquid in the tank,
A step of injecting a first insulating resin into an inner space surrounded by a first support, a second support, and a support wall through the first inlet, and embedding a first wiring circuit in the first insulating resin. e. A step of cutting off the first support, the second support, and the support wall from ends of the first insulating resin and the first wiring circuit formed inside the first support, the second support, and the support wall; f. A second wiring circuit and a second wiring circuit are formed on the surface of the first insulating resin where the first support and the second support are cut off and exposed.
Forming a conductive pad for connecting electronic components connected to the wiring circuit, the conductive pad being connected to the first wiring circuit; 2. The method for manufacturing a printed circuit board according to claim 1, further comprising the following steps instead of the steps b to f. b1. A focal point of light emitted from the luminous body from a plane side closer to the first support to a predetermined portion of the photocurable resin liquid which is located on each plane divided into a plurality of stages vertically from above the first support to above it. In order, and selectively cure two-dimensionally the photocurable resin liquid portion at a predetermined portion located on each plane where the light is focused, and the two-dimensionally cured photocurable resin A conductive resin block formed by three-dimensionally stacking liquid parts is formed on the first support, and the resin block allows the conductive first wiring circuit, the first wiring circuit, and the first wiring circuit to be formed on the first support. A step of forming a three-dimensional conductive ground cylinder surrounding the periphery thereof at a predetermined interval, and forming a support wall upright on the periphery of the first support. c1. Focus the light emitted from the light emitter on the photocurable resin liquid portion located on a predetermined plane in the upper portion of the tank including the upper end of the first wiring circuit, the upper end of the ground cylinder, and the upper end of the support wall. At the same time, the light-curable resin liquid portion in which the light is focused is cured, and a plate-like second support is formed on the upper end of the first wiring circuit by a resin mass obtained by curing the light-curable resin liquid portion. The upper end of the first wiring circuit inserted inside the ground cylinder into a second support portion immediately above the upper end of the ground cylinder. Providing a second inlet in which a support arm for supporting the support is provided. d1. The first support, the second support, the support wall, the first
The wiring circuit and the ground cylinder are taken out of the photo-curable resin liquid in the tank, and are passed through the first inlet to the first space in the inner space surrounded by the first support, the second support, and the support wall.
An insulating resin is injected, the first wiring circuit and the ground cylinder are embedded in the first insulating resin, and a second insulating resin is injected into the ground cylinder through the second injection port. Filling the second insulating resin with the first wiring circuit inserted inside. e1. The first support, the second support and the support wall,
A step of cutting together with the support arm from the first insulating resin, the second insulating resin, the end of the first wiring circuit, and the end of the ground cylinder formed inside thereof. f1. A second support is provided on the surface of the first insulating resin and the second insulating resin where the first support and the second support are cut off and exposed.
A step of forming a wiring circuit, a conductor pad for connecting electronic components connected to the second wiring circuit, wherein the conductor pad is connected to the first wiring circuit and the conductor pad is connected to the ground cylinder. 3. The method for manufacturing a printed circuit board according to claim 1, further comprising the following steps instead of the steps b to f. b2. A focal point of light emitted from the luminous body from a plane side closer to the first support to a predetermined portion of the photocurable resin liquid which is located on each plane divided into a plurality of stages vertically from above the first support to above the first support. In order, and selectively cure two-dimensionally the photocurable resin liquid portion at a predetermined portion located on each plane where the light is focused, and the two-dimensionally cured photocurable resin A conductive resin block formed by three-dimensionally stacking liquid parts is formed on the first support, and the resin block forms a conductive first wiring circuit and a conductive ground cylinder on the first support. And three-dimensionally forming a support wall on the periphery of the first support. c2. Focus the light emitted from the light emitter on the photocurable resin liquid portion located on a predetermined plane in the upper portion of the tank including the upper end of the first wiring circuit, the upper end of the ground cylinder, and the upper end of the support wall. At the same time, the light-curable resin liquid portion in which the light is focused is cured, and a plate-like second support is formed on the upper end of the first wiring circuit by a resin mass obtained by curing the light-curable resin liquid portion. Forming a continuous line with the upper end of the ground cylinder and the upper end of the support wall. d2. The first support, the second support, the support wall, the first
The wiring circuit and the ground cylinder are taken out of the photo-curable resin liquid in the tank, and are passed through the first inlet to the first space in the inner space surrounded by the first support, the second support, and the support wall.
A step of injecting an insulating resin and embedding the first wiring circuit and the ground cylinder in the first insulating resin; e2. The first support, the second support and the support wall,
A step of cutting off the first insulating resin, the end of the first wiring circuit, and the end of the ground cylinder formed inside the first insulating resin. f2. A second wiring circuit, and a conductive pad for connecting an electronic component connected to the second wiring circuit, on the surface of the first insulating resin where the first support and the second support are cut off and exposed, wherein the first wiring Forming a conductor pad connected to the circuit and a conductor pad connected to the ground cylinder. 4. The method for manufacturing a printed circuit board according to claim 1, further comprising the following steps instead of the steps b to f. b3. A focal point of light emitted from the luminous body from a plane side closer to the first support to a predetermined portion of the photocurable resin liquid which is located on each plane divided into a plurality of stages vertically from above the first support to above the first support. In order, and selectively cure two-dimensionally the photocurable resin liquid portion at a predetermined portion located on each plane where the light is focused, and the two-dimensionally cured photocurable resin A conductive resin block formed by three-dimensionally stacking liquid parts is formed on the first support, and the resin block forms a conductive first wiring circuit and a conductive ground cylinder on the first support. And three-dimensionally forming a support wall on the periphery of the first support. c3. Focus the light emitted from the luminous body on the photocurable resin liquid portion located on a predetermined plane in the upper portion of the tank including the upper end of the first wiring circuit, the upper end of the ground cylinder, and the upper end of the support wall. At the same time, the light-curable resin liquid portion where the light is focused is cured, and a plate-like second support is formed on the upper end of the first wiring circuit by a resin mass obtained by curing the light-curable resin liquid portion. Forming a second inlet in the second support portion immediately above the upper end of the gland cylindrical body while being formed so as to be continuous with the upper end of the gland cylindrical body and the upper end of the support wall. d3. The first support, the second support, the support wall, the first
The wiring circuit and the ground cylinder are taken out of the photo-curable resin liquid in the tank, and are passed through the first inlet to the first space in the inner space surrounded by the first support, the second support, and the support wall.
An insulating resin is injected, the first wiring circuit and the ground cylinder are embedded in the first insulating resin, and the second insulating resin is injected into the ground cylinder through the second inlet, and the second insulating resin is injected into the ground cylinder. A step of filling the insulating resin. e3. The first support, the second support and the support wall,
A step of cutting off the first insulating resin, the second insulating resin, the end of the first wiring circuit, and the end of the ground cylinder formed inside the first and second insulating resins. f3. A second support is provided on the surface of the first insulating resin and the second insulating resin where the first support and the second support are cut off and exposed.
A step of forming a wiring circuit, a conductor pad for connecting electronic components connected to the second wiring circuit, wherein the conductor pad is connected to the first wiring circuit and the conductor pad is connected to the ground cylinder. 5. A third injection port is provided in a support wall formed in the step b, b1, b2 or b3, and the d, d
In step 1, d2 or d3, instead of or together with the first inlet, through the third inlet,
Injecting a first insulating resin into an inner space surrounded by the first support, the second support, and the support wall;
5. The method for manufacturing a printed circuit board according to claim 1, wherein a ground cylinder is embedded in the first insulating resin. 6. A fourth inlet is provided in a second support formed in the step c, c1, c2 or c3, and the first or third inlet is provided in the step d, d1, d2 or d3. Instead of the first inlet or third
A first insulating resin is injected into the inner space surrounded by the first support, the second support, and the support wall through the fourth injection port together with the injection port, and the first wiring circuit or a ground cylinder is additionally provided. The method for manufacturing a printed circuit board according to claim 1, wherein the body is embedded in the first insulating resin. 7. A method for manufacturing a printed circuit board, comprising the following steps. A. The photocurable resin which is located on a predetermined plane at the bottom in the tank containing the uncured photocurable resin liquid in which the photocurable resin liquid portion cured by focusing light becomes an insulating resin block. Focus the light emitted from the luminous body on the liquid part,
The light-curable resin liquid portion focused on the light is cured, and a resin mass formed by curing the light-curable resin liquid portion forms a plate-like first support at the bottom in the tank, and the second support is formed. (1) A step of providing a first injection port in one support. B. Focus of light emitted from the luminous body from a plane side closer to the first support to a predetermined portion of the photocurable resin liquid located on each plane divided into a plurality of steps vertically from above the first support to above the first support In order, and selectively cure two-dimensionally the photocurable resin liquid portion at a predetermined portion located on each plane where the light is focused, and the two-dimensionally cured photocurable resin An insulating resin block formed by stacking liquid portions three-dimensionally is formed on the first support, and the resin block forms an insulating first wiring circuit bone three-dimensionally on the first support. And forming a support wall upright on the periphery of the first support. C. The light emitted from the luminous body is focused on a photocurable resin liquid portion located on a predetermined plane in the upper portion of the tank including the upper end of the first wiring circuit bone and the upper end of the support wall, and the light is By curing the focused photocurable resin liquid part, and by curing the photocurable resin liquid part,
A step of forming a plate-shaped second support continuously with an upper end of the first wiring circuit bone and an upper end of the support wall; D. The first support, the second support, the support wall, and the first support
Removing the wiring circuit bone from the photocurable resin solution in the tank and applying a metal plating to the first wiring circuit bone; E. FIG. A first insulating resin is injected into the inner space surrounded by the first support, the second support, and the support wall through the first injection port, and the metal-plated first wiring circuit bone is removed from the first insulating resin. The process of embedding in resin. F. Removing the first support, the second support, and the support wall from the ends of the first insulating resin and the first wiring circuit bone formed inside thereof; G. FIG. A second wiring circuit and a second wiring circuit are formed on the surface of the first insulating resin where the first support and the second support are cut off and exposed.
Forming a conductive pad for connecting electronic components connected to the wiring circuit, the conductive pad being connected to the metal plating applied to the first wiring circuit bone; 8. The method for manufacturing a printed circuit board according to claim 7, comprising the following steps instead of the B to G steps. B1. Focus of light emitted from the luminous body from a plane side closer to the first support to a predetermined portion of the photocurable resin liquid located on each plane divided into a plurality of steps vertically from above the first support to above the first support In order, and selectively cure two-dimensionally the photocurable resin liquid portion at a predetermined portion located on each plane where the light is focused, and the two-dimensionally cured photocurable resin An insulating resin block formed by three-dimensionally stacking liquid parts is formed on the first support, and the resin block forms an insulating first wiring circuit frame and the first wiring circuit frame on the first support. And three-dimensionally forming an insulating ground cylindrical bone surrounding the periphery of the first support at a predetermined interval, and forming a support wall upright on the periphery of the first support. C1. Focus of light emitted from the illuminant on the photocurable resin liquid portion located on a predetermined plane in the upper portion of the inside of the tank including the upper end of the first wiring circuit bone, the upper end of the ground cylindrical bone, and the upper end of the support wall. And the light-curable resin liquid portion where the light is focused is cured, and the plate-shaped second support is formed by the resin mass obtained by curing the light-curable resin liquid portion. The first wiring circuit skeleton formed inside the ground cylindrical bone at the second support portion formed immediately above the upper end of the ground cylindrical bone, the upper end of the ground cylindrical bone, and the upper end of the support wall. Providing a second inlet in which a support arm supporting the upper end of the second support is provided. D1. The first support, the second support, the support wall, the first
Removing the wiring circuit bone and the ground cylinder bone from the photocurable resin liquid in the tank, and applying metal plating to the first wiring circuit bone and the ground cylinder bone. E1. A first insulating resin is injected into an inner space surrounded by a first support, a second support, and a support wall through the first injection port, and the metal-plated first wiring circuit bone and ground cylindrical body bone Embedded in the first insulating resin,
The second insulating resin is injected into the ground cylindrical body through the second inlet, and the second insulating resin is injected between the metal-plated ground cylindrical body and the first wiring circuit bone inserted inside the ground cylindrical body. 2 A step of filling the insulating resin. F1. The first support, the second support and the support wall,
A step of cutting off the first insulating resin, the second insulating resin, the end of the first wiring circuit bone, and the end of the ground cylindrical bone formed on the inside. G1. A second support is provided on the surface of the first insulating resin and the second insulating resin where the first support and the second support are cut off and exposed.
A wiring circuit, a conductive pad for connecting electronic components connected to the second wiring circuit, a conductive pad connected to metal plating applied to the first wiring circuit bone, and a metal pad applied to the ground cylindrical body. Forming a conductive pad connected to the plating; 9. The method for manufacturing a printed circuit board according to claim 7, further comprising the following steps instead of the steps B to G. B2. A focal point of light emitted from the luminous body from a plane side closer to the first support to a predetermined portion of the photocurable resin liquid which is located on each plane divided into a plurality of stages vertically from above the first support to above the first support. In order, and selectively cure two-dimensionally the photocurable resin liquid portion at a predetermined portion located on each plane where the light is focused, and the two-dimensionally cured photocurable resin An insulating resin block formed by stacking liquid portions three-dimensionally is formed on the first support, and the resin block allows the insulating first wiring circuit bone and the insulating ground cylinder to be formed on the first support. A step of forming the bone three-dimensionally and erecting a support wall on the periphery of the first support. C2. Focus of light emitted from the illuminant on the photocurable resin liquid portion located on a predetermined plane in the upper portion of the inside of the tank including the upper end of the first wiring circuit bone, the upper end of the ground cylindrical bone and the upper end of the support wall. And the light-curable resin liquid portion where the light is focused is cured, and the plate-like second support is attached to the first wiring circuit frame by a resin mass obtained by curing the light-curable resin liquid portion. Forming the upper end of the main body, the upper end of the ground cylindrical body, and the upper end of the support wall. D2. The first support, the second support, the support wall, the first
Removing the wiring circuit bone and the ground cylinder bone from the photocurable resin liquid in the tank, and applying metal plating to the first wiring circuit bone and the ground cylinder bone. E2. A first insulating resin is injected into an inner space surrounded by a first support, a second support, and a support wall through the first injection port, and the metal-plated first wiring circuit bone and ground cylindrical body bone Embedded in the first insulating resin. F2. The first support, the second support and the support wall,
Cutting off the first insulating resin, the end of the first wiring circuit bone, and the end of the ground cylindrical bone formed inside the first insulating resin. G2. A second wiring circuit, and a conductive pad for connecting an electronic component connected to the second wiring circuit, on the surface of the first insulating resin where the first support and the second support are cut off and exposed, wherein the first wiring Forming a conductive pad connected to the metal plating applied to the circuit bone and a conductive pad connected to the plated metal applied to the ground cylindrical body; 10. The method for manufacturing a printed circuit board according to claim 7, further comprising the following steps instead of the steps B to G. B3. A focal point of light emitted from the luminous body from a plane side closer to the first support to a predetermined portion of the photocurable resin liquid which is located on each plane divided into a plurality of stages vertically from above the first support to above the first support. In order, and selectively cure two-dimensionally the photocurable resin liquid portion at a predetermined portion located on each plane where the light is focused, and the two-dimensionally cured photocurable resin An insulating resin block formed by stacking liquid portions three-dimensionally is formed on the first support, and the resin block allows the insulating first wiring circuit bone and the insulating ground cylinder to be formed on the first support. A step of forming the bone three-dimensionally and erecting a support wall on the periphery of the first support. C3. Focus of light emitted from the illuminant on the photo-curable resin liquid portion located on a predetermined plane in the upper portion of the inside of the tank including the upper end of the first wiring circuit bone, the upper end of the ground cylindrical bone, and the upper end of the support wall. And the light-curable resin liquid portion where the light is focused is cured, and the plate-like second support is attached to the first wiring circuit frame by a resin mass obtained by curing the light-curable resin liquid portion. And forming a second injection port in a second support portion immediately above the upper end of the gland cylindrical bone while being formed so as to be continuous with the upper end of the gland cylindrical bone and the upper end of the support wall. D3. The first support, the second support, the support wall, the first
Removing the wiring circuit bone and the ground cylinder bone from the photocurable resin liquid in the tank, and applying metal plating to the first wiring circuit bone and the ground cylinder bone. E3. A first insulating resin is injected into an inner space surrounded by a first support, a second support, and a support wall through the first injection port, and the metal-plated first wiring circuit bone and ground cylindrical body bone Embedded in the first insulating resin,
A step of injecting a second insulating resin into the metal-plated ground cylindrical bone through the second inlet, and filling the ground cylindrical bone with the second insulating resin. F3. The first support, the second support and the support wall,
A step of cutting off the first insulating resin, the second insulating resin, the end of the first wiring circuit bone, and the end of the ground cylindrical bone formed on the inside. G3. A second support is provided on the surface of the first insulating resin and the second insulating resin where the first support and the second support are cut off and exposed.
A wiring circuit, a conductive pad for connecting electronic components connected to the second wiring circuit, a conductive pad connected to metal plating applied to the first wiring circuit bone, and a metal pad applied to the ground cylindrical body. Forming a conductive pad connected to the plating; 11. A third injection port is provided in a support wall formed in the step B, B1, B2 or B3, and the E, E
In step 1, E2 or E3, instead of or together with the first inlet, through the third inlet,
A first insulating resin is injected into an inner space surrounded by the first support, the second support, and the support wall, and the first wiring circuit bone or, in addition thereto, a ground cylindrical bone is embedded in the first insulating resin. The method for manufacturing a printed circuit board according to claim 7, 8, 9, or 10. 12. A second support formed in the C, C1, C2 or C3 step is provided with a fourth inlet, and in the E, E1, E2 or E3 step, the first or third inlet is provided. Instead of the first inlet or third
The first insulating resin is injected into the inner space surrounded by the first support, the second support, and the support wall through the fourth injection port together with the injection port, and the first wiring circuit bone or the ground is added thereto. The method for manufacturing a printed circuit board according to claim 7, wherein a tubular bone is embedded in the first insulating resin. 13. The method according to claim 1, wherein laser light is used as light for curing the photocurable resin liquid.
The method for manufacturing a printed circuit board according to 6, 7, 8, 9, 10, 11 or 12.