JPH0258655B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method for manufacturing small electronic equipment.

[Technical background of the invention]

Recently, small electronic devices such as small electronic calculators have become so thin that they can be called card-shaped.

This type of thin and small electronic device generally includes a frame that serves as the frame of the device, and film-like electronic components such as a film-like wiring board, a film-like liquid crystal display panel, and a film-like solar cell arranged inside the frame. A pair of panels that serve as the front and back materials of the device are laminated, a filler made of adhesive is filled between the pair of panels from the inside of the frame to the outer periphery, and this filler is used to bond the pair of panels together. It has a structure in which panels are adhesively bonded together, and the pair of panels are made by laminating a slightly larger resin film on the outer surface of a hard sheet with approximately the same external shape as the frame. The outer periphery of the film is bonded to a filler that is filled in the outer periphery of the frame so as to cover the outer periphery of the frame to form the outer periphery of the device.

This small electronic device generally has the film-shaped electronic component arranged inside the frame, and a resin film that is sufficiently larger than the external dimensions of the product is laminated on the outer surface of the sheet that has approximately the same external shape as the frame on the front and back surfaces. A front panel and a back panel are laminated together, and the filler is filled between the front panel and the back panel from the inside of the frame to the outer periphery to produce a crude product larger than the outer diameter of the product. The product is manufactured by finishing cutting the outer periphery of the resin film and the filler material slightly outside the outer edges of the frame and sheet using a laser beam.

By the way, in manufacturing the above-mentioned small electronic devices,
When the rough product is finished cut with a laser beam, in order to leave the filler that forms the outer peripheral surface of the device with a substantially uniform thickness over the entire outer circumference of the frame, it is necessary to cut the filler material when finishing cutting the rough product. It is necessary to precisely align the cut position, ie, a position slightly outside the outer edges of the frame and sheet, with the laser beam position.

Therefore, conventionally, a mark is printed in advance on the outer periphery of the resin sheet to be removed by the finishing cut, and by automatically detecting this mark, the cut position of the rough product is aligned with the laser beam position. .

However, in this method of printing marks on the resin film and then detecting the marks, the outer periphery of the resin film may sag or become wavy, causing the marks to be misaligned. Therefore, if alignment is performed with respect to the laser beam based on the position of this mark, the cutting position will deviate from the laser beam position, and the part that is deviated from the predetermined cutting position will be cut by the laser beam. On one side, the resin film and filler are cut more than necessary, and on the other side, the resin film and filler are not cut enough, leaving the filler that forms the outer peripheral surface of the device with a substantially uniform thickness over the entire circumference. In addition, if the mark position is greatly misaligned due to sagging or waving of the resin film, the misalignment of the cutting position will become large and the rough product will be cut inside the outer edges of the frame and sheet. Therefore, there was a problem in that the frame and sheet were exposed to the outside and the quality of the product was lost.

[Purpose of the invention]

This invention was made in view of the above-mentioned circumstances, and its purpose is to cut the outer periphery of a film member forming the outer surface of a device at a substantially uniform position from the outer periphery of a frame or panel. Can be done. An object of the present invention is to provide a method for manufacturing small electronic devices.

[Summary of the invention]

That is, the present invention forms at least one of a panel or a frame with a thin metal plate, detects the outer periphery of the thin metal plate using a detection device, and detects a film member having an outer diameter larger than the outer diameter of a product bonded to the thin metal plate. is cut into the product outline.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings.

First, the structure of a small electronic device manufactured by the manufacturing method of the present invention will be explained.

FIG. 1 shows the appearance of a small electronic computer manufactured by the manufacturing method of the present invention.
A display section 2, a keyboard section 3, and a solar cell section 4 are formed on the surface of this small electronic calculator.

Figure 2 is an exploded perspective view of the above-mentioned small electronic calculator.
FIG. 3 is an enlarged sectional view taken along the line - in FIG. 1, and the main body 1 of this small electronic calculator consists of a frame 11 shaped as shown in FIG. 2, and a front panel 1a on the surface of the main body. It has a structure in which a front sheet 12 and a front film 13 are laminated together, and a back sheet 14 and a back film 15 forming a back panel 1b on the back side of the main body.

Inside the main body 1 is a wiring board 20 in which wirings 21, 21 are printed on both sides of a synthetic resin film and the wirings are covered with insulating materials 22, 22;
A film-like liquid crystal display cell 30 and a film-like solar cell 40 are arranged, and furthermore, a synthetic resin film spacer 50 having approximately the same external shape as the wiring board 20 is polymerized on the upper surface of the wiring board 20. .

The wiring board 20 has an LSI chip 23 inserted into a through hole formed in the wiring board 20, and
Chip parts such as capacitors and diodes 24, 2
4 is attached, and this wiring board 20
A large number of sets of split-type fixed contacts 25, 25 are arranged and formed on the upper surface of the switch, which are short-circuited by removable contacts, which will be described later.

The spacer 50 has a large number of key openings 5 surrounding each of the fixed contacts 25, 25 on the wiring board 20.
1 and 51 are drilled, and the lower surface thereof has the above-mentioned
Through holes 52 and 53 are provided to escape the portions of the LSI chip 23 and the chip components 24 and 24 that protrude onto the wiring board 20, and the spacer 50 is inserted into the through holes 52 and 53 so that the LSI chip 23 can escape. and chip parts 24, 24 are fitted and bonded onto the wiring board 20.

The wiring board 20 and the spacer 50 are arranged in the frame 11, and the film-like liquid crystal display cell 30 and the film-like solar cell 40 are arranged inside the frame 11.
are arranged in parallel with the wiring board 20 in the frame 11, the liquid crystal display cell 30 is connected to the wiring board 20 by a film-shaped heat-seal connector 31, and the solar cell 40 is also connected to the film-shaped heat-seal connector 41. Therefore, the wiring board 2
Connected to 0.

The frame 11 is formed by punching out a thin metal plate such as stainless steel (SUS), and is provided as a reinforcing material.

The film-like liquid crystal display cell 30, as shown in its cross section in FIG. The transparent film base materials 32a, 32b are adhered via the sealing material 34, and the upper and lower film base materials 32a, 3
The liquid crystal display cell 30 is of the T.N type (twisted nematic type), and the polarizing films 35a and 35b disposed on the upper and lower surfaces are formed of the film base material. 32
A, 32b are bonded to the outer surfaces thereof with a transparent adhesive 36, and a reflecting plate 37 is further bonded to the lower surface of the lower polarizing film 35b with a transparent adhesive 36. Note that 33a is a terminal portion of the electrode 33, and the heat seal connector 31 is connected to this terminal portion 33a by heat compression bonding. Polarizing films 35a, 35 of this film-like liquid crystal display cell 30
Total thickness including b and reflector 37 is approximately 550μ (0.55mm)
It is.

Further, as shown in the cross section of FIG. 4, the film solar cell 40 includes a metal film substrate 42 on which an electrode 44 is formed via an insulating film 43.
and an epoxy resin-based transparent film 45 with a transparent electrode 46 formed on the lower surface, and an amorphous silicon 45 is sandwiched between the solar cell 45 and the film solar cell 40. The thickness of this film solar cell 40 is 202μ (about 0.2mm). .

The liquid crystal display cell 30 has its upper surface, that is, the upper surface of the upper polarizing plate 35a, bonded to the lower surface of the display section 2 of the front film 13 using a transparent adhesive 60 applied to the lower surface of the front film 13. Although the solar cell 40 is also not shown, the transparent adhesive 60 is applied to the lower surface of the solar cell portion 4 of the front film 13 on its upper surface.
It is glued by.

On the other hand, the front seat 12 and the back seat 14 both have approximately the same external shape as the frame 11, and are made of thin metal plates (such as stainless steel) with a thickness of approximately 100 μm. , a key opening 12 that matches the key openings 51, 51 provided in the spacer 50;
1, 121, an opening 122 into which the upper part of the liquid crystal display cell 30 is fitted, and an opening 123 into which the solar cell 40 is fitted.
Recesses 124 and 125 are formed by half-etching to receive the portions of the chip parts 24 and 24 that protrude above the space 50.

The front sheet 12 is integrated with the frame 11 by bonding its bottom surface to the top surface of the frame 11, and the spacer 50 bonded to the wiring board 20 is bonded to the bottom surface of the front sheet 12. Further, the LSI chip 23 and chip parts 24, 24 are also bonded to the recesses 124, 125 of the front seat 12.

Further, both the front film 13 and the back film 15 are connected to the front seat 12.
and the back sheet 14, each of which is made of a polyester synthetic resin film with a thickness of approximately 70 μm.The back film 15 is laminated on the lower surface of the back sheet 14 and is used as the back panel 1b of a small electronic device. The front film 13 is laminated on the upper surface of the front sheet 12 to constitute the front panel 1a of the small electronic device.

The front film 13 has a mask printed on the lower surface of the transparent film except for the display section 2 and the solar cell section 4, and numbers and symbols are printed on each key section 3a, 3a of the keyboard section 3.
The front seat 12 and the front film 13
Front panel 1 constructed by laminating
a indicates each key portion 3a, 3 of the keyboard portion 3.
This key part 3 is made of a single-layer structure with only the front film 13 made of synthetic resin film.
The structure is such that a and 3a can be elastically deformed.

The wiring board 20 is provided on the lower surface of each of the key portions 3a, 3a of the front film 13.
The key portions 3a, 3a of the front film 13 are placed opposite the fixed contacts 25, 25 on the front film 13, respectively.
A film-shaped movable contact 26 is provided that can be brought into contact with the fixed contact 25 by pressing .
This movable contact 26 is made by adhering a carbon film 28 to the lower surface of a double-sided adhesive film 27 and cutting it into a predetermined size. It is adhesively fixed to the front film 13.

Further, in FIG. 3, reference numeral 16 indicates the wiring board 2 disposed below the front panel 1a.
0. It is a filler that fixes the LSI chip 23, chip parts 24, liquid crystal display panel 30, solar cell 40, etc., and this filler 16 is an adhesive with a certain degree of fluidity (for example, acrylic or epoxy type adhesive). The back panel 1b is made by drip-filling a liquid-mixed adhesive and curing it, and the back panel 1b is made by stacking the adhesive on top of the adhesive and applying pressure to cure the adhesive before the adhesive hardens. The filler material 16 is bonded to the filler material 16 by doing this. Further, the filler 16 is also filled in the outer periphery of the frame 11 to cover the outer periphery of the frame 11 and is bonded to the outer periphery of the front film 13 and the back film 15. The outer circumferential surface of the main body 1 is cut together with the outer circumferential parts of the front film 13 and back film 15 by a finishing cut that matches the outer shape of the product, and is finished into a flat surface.

That is, the above-mentioned small-sized electronic calculator has a frame 11 adhered to a front panel 1a made by laminating the front sheet 12 and a front film 13, and a wiring board 20, a film-like liquid crystal display 30, and a film-like liquid crystal display 30 on the inner surface of the front panel 1a. Place and adhere solar cells 40, etc., and fill them with filler 1.
6, and has a laminated structure in which a back panel 1b, which is a laminated back sheet 14 and a back film 15, is adhered to the filler 16, and the thickness of this small electronic calculator is approximately 0.8 mm.
It is.

Next, a method of manufacturing the above-mentioned small electronic calculator will be explained.

As shown in the outline in FIG. 5, the manufacturing method of this embodiment is to intermittently feed a band-shaped film material 13a which becomes the front film 13, and laminate the front sheet 12 to the film material 13a to form a small electronic device. Forming the front panel 1a of the formula calculator, this front panel 1a
A spacer 51, a wiring board 20, a film-like liquid crystal display cell 30, a film-like solar cell 40
After arranging and adhering film-like electronic components such as, dropping an adhesive to become the filler 16 on it, and polymerizing and adhering the back panel 1b in which a resin film which becomes the back film 15 is laminated to the back sheet 14, By heating and drying this at the curing temperature of the adhesive 16 and curing the adhesive, the front panel 1a and the back panel 1b are bonded by the filler 16 made of the adhesive, and then the front film 13 and A small electronic calculator is completed by cutting the film material 13a to become the back film 15 and the resin film to become the back film 15 together with the outer periphery of the filler 16 according to the outer shape of the product.This manufacturing method will be explained in detail. Then, it is as follows.

FIG. 6 shows the film material 13a, which has a strip shape slightly wider than the front film 13, and the front film 13 is displayed at regular intervals on its lower surface. A portion 2, a keyboard portion 3, and a solar cell portion 4 are printed. The front films 13, 13 formed on the film material 13a are cut along the cutting lines shown by two-dot chain lines in FIG. 6 in a finishing cut process using a laser beam, which will be described later. Further, on the lower surface of the front film 13 portion of the film material 13a, a transparent adhesive 60 (see FIG. 3) is applied to the entire surface of the front film 13 except for the movable contact bonding portion.
is applied, and this adhesive-applied surface is covered with a strip-shaped separator (release paper) 1 having the same width as the film material 13a.
3b. This strip-shaped film material 13a is wound into a roll, and is unwound from the roll and sent to an assembly line with the adhesive coated surface facing upward.

FIG. 7 shows the feeding mechanism for the film material 13a, in which the film material 13a is fed out from the roll, with the separator 13b covering the adhesive coated surface being peeled off, and the film material 13a is moved between a pair of upper and lower parts that reciprocate. It is adapted to be fed intermittently by movable grips 71, 71. The separator 13b is wound around a winding shaft 70 and peeled off from the film material 13a. The movable grips 71, 71 move forward by a certain distance by gripping the film material 13a from above and below, and then release the film material 13a and retreat to the original position, as shown by broken lines in the figure. It is a moving object, and the film material 1
3a is intermittently fed a fixed distance by repeating the reciprocating movement of the movable grips 71, 71. Also, in Figure 7, 7
2 and 72 grip the film material 13a by pinching and gripping the film material 13a when the movable grips 71 and 71 are not gripping the film material 13a.
These fixed grips 72, 72 grip the film material 13a when the movable grips 71, 71 send the film material 13a a certain distance and release the film material 13a. , the movable grips 71, 71 which have returned to their original positions are attached to the film material 1 again.
The film material 13a is released when the film material 3a is grabbed. Note that the movable grip 7
1 and 71 and the fixed grips 72 and 72 are adapted to grip the part of the film material 13a to which the adhesive 60 is not applied (the part between the front film 13 part and the next front film 13 part). , therefore the movable grips 71, 71
and the fixed grips 72, 72 are attached to the film material 13.
When releasing a, the film material 13a will not be pulled up by the upper grip.
Further, this film material feeding mechanism is provided at a plurality of locations on the assembly line at appropriate intervals.

Thus, the film material 1 is intermittently fed through the assembly line with the adhesive coated side facing upward.
For 3a, first, the front seat 12 and
The film-like liquid crystal display cell 30 and the film-like solar cell 40 are simultaneously arranged and bonded.

The front sheet 12 is formed of a large number of belt-shaped metal sheets 12a at regular intervals as shown in FIG. 8, and is wound into a roll (see FIG. 5).
The band-shaped metal sheet 12 fed out from the roll
A is punched out along the outline shown by the two-dot chain line in FIG.
It is once placed on the front seat positioning portion of the positioning table 80 shown in the figure.

On the other hand, as shown in FIG. 9, the film-like liquid crystal display cell 30 includes an upper film base material 32a and a polarizing plate 35a, a lower film base material 32b and a polarizing plate 35b, and a reflecting plate 37 on the lower surface thereof. By making the display cell band 30a into a band shape, a large number of display cells are formed at regular intervals on the band body 30a (this display cell band 30a is also wound into a roll as shown in FIG. 5). Each of the film-like liquid crystal display cells 30, 30 formed in the cell band 30a is also punched out along the outline indicated by the two-dot chain line in FIG. Once placed in the section.

Further, the film solar cell 40 has a 10th
As shown in the figure, a large number of battery bands 40a are formed at regular intervals by forming a metal film substrate 42 with an insulating film 43 formed on the upper surface at regular intervals. Each of the film solar cells 40, 40 formed on this battery band 40a is also punched out along the outline shown by the two-dot chain line in FIG. The positioning table 80 shown in FIG.
Once placed on the solar cell positioning unit (as shown in the figure). In addition, in FIG. 10, 38 is a terminal portion of the solar cell 40, and 49 is a sealing material for sealing the periphery between the metal film substrate 42 and the upper film 45 of the solar cell 40.

As shown in FIG. 11, the front sheet 12, the liquid crystal display cell 30, and the solar cell 40 are placed on the positioning table 80 with their back surfaces (lower surfaces) facing upward. . Further, the liquid crystal display cell 30 and the solar cell 40 may be placed on the positioning table 80 by inserting and placing them through the openings 122 and 123 after placing the front sheet 12, or by placing the liquid crystal display cell 30 and the solar cell 40 on the positioning table 80. It may be placed before placing.

The front seat 12 and the liquid crystal display cell 30 are positioned and placed on the positioning table 80.
And the solar cell 40 is attached to the front sheet suction jig 81 and the liquid crystal display cell suction jig 8 shown in FIG.
2 and a solar cell suction jig (not shown), and is carried onto the film material 13a whose feeding has been stopped, and the front film 1
The front film 13 is positioned and placed in three parts, and is adhered to the front film 13 part coated with a transparent adhesive 60. The front sheet 12, the liquid crystal display cell 30, and the solar cell 40 are bonded to the film material 13a as shown in FIG.
A is supported on a support base 83 and is rolled by a rolling roller 84, whereby the front sheet 12 is rolled onto the film material 1.
At the same time, the liquid crystal display cell 30 and the solar cell 40 are bonded to the surface of the film material 13a. Note that the rolling pressure roller 84 is
As shown by the arrow in FIG. 2, the film material 13a is moved while being pressed against the front sheet 12, and after being rolled, it is pulled upward and returned to its original position.

In this way, the front panel 1 has the front sheet 12 laminated to the front film 13.
a, and this front panel 1a
The film material 13a on which the liquid crystal display cell 30 and the solar cell 40 are arranged and bonded is again sent through the assembly line and stopped at the next component assembly position, where the film-like movable contact 26 and the spacer 50 are assembled.
Then, the wiring board 20 and frame 11 are assembled.

The film-shaped movable contact 26 is made by cutting a double-sided adhesive film 27 with a carbon film 28 adhered to one side to a predetermined size as described above. The same number of key parts 3a, 3a of the 13 keys are arranged to correspond to the arrangement of the key parts 3a, 3a to form one set, and a large number of sets are arranged on a strip separator 85 (see FIGS. 13 and 14). They are attached at regular intervals (attached on the surface to which the carbon film 28 is not attached). A large number of movable contacts 2 are set on this strip separator 85.
The contact strip 26a to which the contacts 6 and 26 are attached is wound into a roll as shown in FIG. It is peeled off from the separator 85 and incorporated into the film material 13a.

13 and 14 show the movable contacts 26, 2.
6 shows an example of how to peel off the key portions 3a, 86 from the separator 85.
a separator presser 8 for pressing the separator 85 from above around each set of movable contacts 26, 26 arranged in a configuration corresponding to 3a;
Reference numerals 7 and 87 are contact push-up needles arranged on the lower side of the separator 85 so as to face approximately the center of each of the movable contacts 26 and 26;
26, each movable contact 26, as shown in FIG.
26 reaches above the contact push-up needles 87, 87, feeding of the contact band 26a is stopped, and then the separator pressers 86, 86 are lowered and the contact push-up needles 87, 87 are raised. As shown in FIG. 14, the contacts are peeled off from the separator 85 by the contact push-up needles 87, 87 which break through the separator 85 and rise. The movable contacts 26, 26 peeled off from this separator 85 are
It is sucked by the vacuum suction jigs 88, 88 descending between the separator holders 86, 86, is carried onto the film material 13a, and is positioned on the key portions 3a, 3a of the front panel 1a portion. Adhesive 27a on the surface of the film-like movable contact 26
(See FIG. 3) is bonded to the front film 13. Although only two movable contacts are shown in FIGS. 13 and 14, this movable contact 262
6 from the separator 85 and adhesion to the film material 13a using the same number of contact push-up needles 87 and suction jig 88 as the number of movable contacts for one set.
One set is done all at once.

The spacer 50 is made of a double-sided adhesive film coated with adhesives 61a, 61b (see FIG. (see FIG. 1 and FIG. 16), a large number of which are held at regular intervals. A spacer band 50a with this spacer 50 sandwiched between separators 89a and 89b
The spacers 50, 50 are also wound into a roll as shown in FIG. 5, and are unrolled from this roll with the back surfaces of the spacers 50, 50 facing upward.

Spacer band 50a let out from the roll
As shown in FIG. 15, the upper separator 89b is first peeled off to expose the back surfaces of the spacers 50, 50, that is, the wiring board adhesive surfaces, and then the wiring board is attached to the wiring board adhesive surface of the spacer 50. After laminating 20, it is sent to the spacer take-out position. On the other hand, the separator 89a on the lower side of the spacer band 50a is folded back at the tip of the moving table 90 and wound up into a roll via a roller 91. Then, to take out the polymer of the spacer 50 and the wiring board 20 from the lower separator 89a, the feeding of the spacer band 50a is stopped when the polymer reaches the removal position, and in this state, the top surface of the wiring board 20 is removed. After lowering the vacuum adsorption jig 92 and adsorbing the polymer to this jig 92,
The supply side of the separator band 50a is connected to the spacer band 50a.
While winding up the lower separator 89a, the movable table 9 is restrained from unwinding.
0 as shown by the arrow in FIG. 16, the lower separator 89a is removed from the spacer 50.
This is done by peeling off the

The polymer of the spacer 50 and the wiring board 20 adsorbed to the vacuum suction jig 92 and taken out is as follows:
The film material 13a is carried into the front panel 1a portion of the film material 13a using the jig 92, and is bonded onto the front sheet 12 of the front panel 1a with the adhesive 61a on the surface of the spacer.

As shown in FIG. 17, the wiring board 20 is formed in large numbers at regular intervals on a strip-shaped substrate film 20a, and the LSI chips 23 are attached to the wiring board 20 in advance by soldering and connecting them to the wiring. This LSI chip 23 is in resin mode. Note that this substrate film 20a
As shown in FIG. 5, it is wound into a roll and is unwound from this roll. Then, the wiring board 20 is punched out from the substrate film 20a along the outline shown by the two-dot chain line in FIG. (adhered with adhesive 61b on the surface of the spacer 50).

Further, the frame 11 is coated with an adhesive 62 (see FIG. 3) on its surface, and is attached to a band-shaped separator 93 on this adhesive-coated surface as shown in FIG. 18. Note that a large number of frames 11 are attached to this strip separator 93 at regular intervals, and a frame strip 11a is formed by attaching a large number of frames 11 to this strip separator 93.
It is also wound into a roll as shown in FIG.

Then, the frame 11 is taken out from the frame band 11a that is unrolled from the roll by adsorption with a vacuum suction jig (not shown) (the separator 93 is removed from the frame 11 by, for example, removing the separator 93 from the spacer 50). The film material 13a is carried onto the film material 13a by this suction jig, and positioned and bonded to the front sheet 12 (bonded with the adhesive 62 applied to the surface of the frame 11). be done.

Note that the film-shaped fixed contacts 26, 26,
The order in which the polymers of the spacer 50 and the wiring board 20 are bonded to the frame 11 may be arbitrarily determined.

The film material 13a into which the movable contacts 26, 26, the spacer 50, the wiring board 20, and the frame 11 have been assembled is again sent to the next component assembly position and stopped, and at this position, the film material 13a is attached to the wiring board 20. Chip components 24, 24 such as diodes and capacitors are incorporated.

Chip parts 2 such as the diodes and capacitors
A large number of chips 4 and 24 are attached to a strip-shaped base film at regular intervals, and are punched out from this chip component strip.

FIG. 19 shows a chip component band 24a with a diode mounted thereon, and the diode 94 has leads 96 and 9 formed by coating copper foil on its upper surface and etching it.
6, and through holes 95a, 9 are formed in the portions of the leads 96, 96 corresponding to the wiring board connection terminals.
It is directly attached to one lead 96 of the strip-shaped base film 95 forming the base film 5a, and is connected to the other lead 96 by wire bonding and sealed with resin.

Further, FIG. 20 shows a chip component 24b to which a capacitor (for example, a tantalum capacitor) is attached. It is directly attached to and sealed with resin.

These chip parts bands 24a, 24b are also wound into rolls as shown in FIG. 5, and the chip parts 24, 24 attached to these chip parts bands 24a, 24b are
4b along the punching lines shown by dashed lines in FIGS. 19 and 20, and carried onto the film material 13a by a vacuum suction jig and assembled into the wiring board 20 by soldering.

FIG. 21 shows a state in which the chip component 24 having the diode 94 is assembled into the wiring board 20, and the chip component 24 is fitted into a through hole formed in the wiring board 20. , the leads 96, 96 are soldered to the terminal portions of the wires 21, 21 on the surface of the wiring board 20 (the wires on the lower surface of the wiring board 20 in FIG. 3).

Note that the film-like liquid crystal display panel 30 assembled on the film material 13a in the previous step
and the film solar cell 40 are the wiring board 2
0, the wiring board 20 is connected to the film-like heat seal connectors 31 and 41 shown in FIG.
The connection is made with the chip part 2.
This may be carried out in parallel with the assembly of chips 4 and 24, or may be carried out before or after the chip parts are assembled.

FIG. 22 is a plan view showing the state in which each part is assembled into the film material 13a that is intermittently fed through the assembly line in the process up to this point. The front sheet 12 is laminated onto a film material 13a to form a front panel 1a, and a film-like liquid crystal display panel 30 and a film-like solar cell 40 are incorporated into the front panel 1a, and the figure shows a film-like movable contact. 26, 26, spacer 50, wiring board 20, and frame 11 are assembled, and the figure shows a state in which the wiring board 20, the liquid crystal display panel, and the solar cell 40 are connected by heat seal connectors 31, 41. .

Therefore, after laminating the front sheet 12 on the film material 13a to form the front panel 1a and assembling all the parts thereon, a functional test is first performed, and then the film material 13a is laminated with the front sheet 12 on the film material 13a. As shown in FIG. 5 while feeding intermittently, adhesive 16a serving as filler 16 is first dropped onto the front panel 1a portion, and then back panel 1b is constructed by laminating back sheet 14 and back film 15 thereon. After polymerizing, this back panel 1b is pressurized from above and then heated and dried to harden the adhesive 16a which becomes the filler 16, and the hardened filler 16 bonds the front panel 1a and the back panel. 1b.

FIGS. 23 and 24 show the steps from the process of dropping the adhesive 16a onto the front panel 1a portion of the film material 13a that is being fed intermittently on the table 99 to the process of polymerizing and pressurizing the back panel 1b. , adhesive 16 serving as filler 16
As shown in FIGS. 23 and 2, a is dropped onto the front panel 1a at multiple locations at appropriate intervals along the front side edge in the film material feeding direction, and is also dropped on both sides of the front panel 1a. It is also dripped almost in the center of the edge.

This adhesive 16a is a two-component mixture type in which a base resin and a curing agent are mixed, and the base resin and curing agent are separately supplied to a mixer 100 shown in FIG. 23 and mixed. stored inside. Note that a predetermined amount, for example, an amount corresponding to the amount of adhesive used in one day, is stored in the mixer 100 at one time. Then, the adhesive in this mixer 100 is transferred to a distributor 1 by an adhesive extrusion screw (not shown) provided in this mixer 100.
01 to a plurality of nozzles 102, 102 arranged in accordance with the adhesive dropping position, and by opening the valve device 103 for a certain period of time, each nozzle 102, 102 simultaneously releases the adhesive onto the front panel 1a portion. Approximately the same amount of adhesive is dropped at each adhesive dropping position.

In the next step, the adhesive 16a is applied to the front panel 1a portion onto which the adhesive 16a has been dripped, as shown in FIGS. 23 and 24.
The back panel 1b is polymerized from above.

As shown in FIG. 5, the back panel 1b is wound with an adhesive 63 on one side.
(See Figure 3) Strip-shaped resin film 15 coated with
Pay out a from the roll and make this resin film 15.
It is formed by laminating the back sheet 14 on the adhesive-coated surface of a, and then cutting the resin film 15a to a certain extent larger than the product outline.The back sheet 15 is wound into a roll as shown in FIG. A strip metal sheet 14a fed out from a lever roll is punched out according to the outer shape of the backsheet, superposed on the surface of the resin film 15a by a vacuum suction jig (not shown), and laminated by a pressure roller. In addition,
The adhesive coated surface of the resin film 15a is protected by a separator (not shown), and this separator is peeled off before the back sheet 14 is laminated.

The back panel 1b, which is made up of the back film 15 cut from the resin film 15a and the back sheet 14 laminated thereon, is once placed on a turntable (not shown) and its direction is determined by the rotation of the turntable. Thereafter, the back sheet 14 is carried onto the film material 13a with the surface facing downward by a transport jig 104 shown in FIG. 23, and is polymerized onto the front panel 1a from above the adhesive 16a.

The conveying jig 104 has a vacuum suction jig 106 vertically movably supported on an elevating body 105 that moves up and down vertically, and the vacuum suction jig 106 is moved up and down by a drive mechanism (not shown). It is inclined from a state in which it is in contact with the lower surface of the body 105 to a state shown in FIG. 23. Further, in FIG. 23, reference numeral 107 presses one end edge of the back film 15 of the back panel 1b (the edge on the front end side with respect to the feeding direction of the film material 13a) against the film material 13a, and presses one end of the back film 15 against the film material 13a. This is a positioning pressing member that is adhered by the adhesive 63 applied to the lower surface.

The back panel 1b is superimposed on the front panel 1a portion of the film material 13a in the following manner.

First, the back panel 1b that has been transported by adsorbing it to the lower surface of the vacuum suction jig 106 by the transport jig 104 (during this transport, the vacuum suction jig 106 is in contact with the lower surface of the elevating body 105), The vacuum suction jig 107 is placed opposite the front panel 1a portion of the film material 13a, and in this state, the vacuum suction jig 107 is
By rotating the back panel 1b downward as shown in FIG. 3, the back panel 1b attracted by the vacuum suction jig 107 is tilted as shown in the figure, and the back seat 14 of the back panel 1b and the front seat of the front panel 1a are separated. One end edge with 12 (front end edge with respect to the feeding direction of the film material 13a)
After aligning, the positioning pressing member 107
One end edge of the back film 15 is adhered to the film material 13a, and one end of the back panel 1b is positioned so as not to shift relative to the front panel 1a. In FIG. 24, a indicates the part of the back film 15 to which the film material is adhered. After this, while lowering the elevating body 105, the vacuum suction jig 106 is attached to the front panel 1a.
This causes the back panel 1b to fall down, and the back panel 1b is successively superposed on the front panel 1a from one end thereof, and the back panel 1b is lifted up by the elevating body 105 via the vacuum suction jig 106. on the front panel 1a. In this way, film material 13
The adhesive 16a is applied to the front panel 1a portion of
When the back panel 1b is overlaid and pressed from above, the adhesive 16a dropped at intervals on the front panel 1a spreads around it, and the adhesive 16a is attached to the front panel 1a as shown in FIG. It extends from the entire width of one end between the back panel 1b and the back panel 1b to both sides.

Here, the superposition of the back panel 1b onto the front panel 1a is carried out by slanting the back panel 1b on the front panel 1a to face each other, positioning one end of the back panel 1b, and then laying down the back panel 1b. The procedure of sequentially polymerizing onto the front panel 1a from one end side is performed in order to minimize the amount of air trapped between the front panel 1a and the back panel 1b when the back panel 1b is polymerized. According to such a polymerization method, the air between the panels 1a and 1b is pushed out to the other end side of the panels 1a and 1b by the back panel 1b that is laid down from the tilted state, so that the air trapped between the panels 1a and 1b is The amount can be reduced.
Note that the conveyance jig 104 is attached to the back panel 1b.
After the superposition of the back panel 1b, the adsorption of the back panel 1b is released, the back panel 1b is lifted up, and moved onto the turntable, where it waits in preparation for conveyance of the next back panel.

After the back panel 1b is superposed on the front panel 1a portion of the film material 13a in this way, the back panel 1b is attached from one end side (from the side where the edge of the back film 15 is adhered to the film material 13a). The back panel 1 is pressurized from above by a pressurizing body that moves toward the other end.
Glue b to the front panel 1a.

As shown in FIGS. 23 and 24, the bonding of both panels 1a and 1b is carried out by moving on the back panel 1b from one end to the other while maintaining a constant level, and by a drive mechanism (not shown). This is performed by the pressure roller 108 which is rotated in the moving direction in synchronization with the moving speed.

In this way, the pressure roller 108 moves the back panel 1b from one end side to the other end side.
When pressure is applied, the adhesive 16a at one end between the panels 1a and 1b is pushed and spread between the panels 1a and 1b from one end to the other end as the pressure roller 108 moves. By spreading the adhesive 16a, both panels 1a and 1b
The air between them is pushed out from one end to the other.

Therefore, according to this pressurizing method, both panels 1
While pushing out the air between the panels 1a and 1b, the adhesive 16a serving as the filler 16 can be spread over the entire area between the panels 1a and 1b, as shown by the chain line in FIG. Furthermore, when pressing the pack panel 1b from one end to the other end, if the pressurizing body moves while rubbing the surface of the back panel 1b, the back panel 1b will be squeezed by the moving pressurizing body, causing wrinkles and waves. However, in this pressurizing method, since the pressurizing roller 108 that rotates in synchronization with the moving speed is used as the pressurizing body, the back panel 1b is pressurized from one end side to the other end side. However, the back panel 1b is not wrinkled or wavy.

After this, as shown in FIGS. 23 and 24, the periphery of the back film 15 of the back panel 1b is pressed against the film material 13a from above using the pressing jig 109 on the frame, so that the entire circumference of the back film 15 is pressed. The adhesive 16a that is adhered to the film material 13a (adhered by the adhesive 63 applied to the lower surface of the back film 15) and that has wrapped around the outer periphery of the frame 11 (see Fig. 3) does not flow outward any further. After that, the adhesive 16a is cured by heating and drying it.

After the front panel 1a and the back panel 1b are bonded to each other by the filler 16 cured by curing the adhesive 16a, the back film 15 is first bonded at a position slightly inside the outer periphery of the back film 15. 15 and the film material 13a are cut together and the front film 13 is cut from the film material 13a, thereby producing a crude product A as shown in FIG.
and then front film 1 of this crude product A.
3 and the outer periphery of the back film 15 is covered with the filler 16.
A final cut is made along with the outer periphery using a laser beam to complete product B.

FIG. 25 shows the finishing cutting process, which is carried out as follows.

In FIG. 25, 200 is a crude product storage box, and the crude products A are stored in this box 200 in a stacked manner. Reference numeral 201 denotes a moving table that reciprocates between the position shown by a solid line and the position shown by a chain line in the figure, and the crude product A is transferred to the crude product storage box 20 by a vacuum suction jig (not shown).
They are taken out one by one from 0 and placed on the moving table 201, which is waiting at the position shown by the solid line, with the back panel 1b facing upward. This moving platform 2
01 waits for the crude product A to be placed and moves to the position shown by the chain line. 202 and 203 are the moving bases 20
A pair of magnetic sensors are disposed above the moving path of the moving body 201 so as to closely face the upper surface of the rough product A placed on the moving body 201.
02 and 203 are arranged on a reference line K that is perpendicular to the moving direction of the moving table 201. The pair of magnetic sensors 202 and 203 are connected to the back sheet 14 under the back film 15 of the crude product A.
is for detecting the direction of the moving table 20.
When the side edge of the back sheet 14 of the crude product A placed on the base line 1 and moving passes under the magnetic sensors 202, 203, the back sheet 14 made of a metal sheet is detected and the back sheet 14 relative to the reference line K is detected. It is designed to detect the deviation angle of the side edges of the FIG. 26 is a plan view showing the state at the time of detecting the deviation angle, and in the figure, 202a, 20
3a indicates the center of the magnetic sensors 202, 203. The reason why the direction of the back sheet 14 is detected is that the back sheet 15 itself is detected instead of detecting the outer edge of the raw product A, that is, the side edge of the back film 15. This is because the side edges of the back film 15 are not necessarily parallel to the side edges of the back sheet 14 since it is roughly cut from the resin film 15a shown in FIG.

The rough product A whose orientation of the sheet 14 has been detected in this way is taken out from above the moving table 201 by the vacuum suction jig after moving the moving table 201 to the position shown by the chain line, and is placed on the moving table 201. It is placed on the turntable 204 in the same orientation as before. This turntable 204 is for adjusting the direction of the rough product A so that the side edges of the back sheet 14 coincide with a predetermined direction.
The back sheet 14 is rotated by the angle of deviation of the back sheet 14 with respect to the reference line K detected at steps 2 and 203. Figure 26 shows this turntable 20.
FIG. 4 is a plan view of a state in which the orientation of the crude product A is being corrected by step 4.

On the other hand, in FIG. 25, reference numeral 205 denotes a finishing cutting table that moves back and forth between the product transfer position shown by the chain line in the figure and the laser cutting position shown by the solid line, and is also moved back and forth and left and right at the laser cutting position. The rough product A whose orientation has been corrected by the turntable 204 is placed on the processing table 205 waiting at the product transfer position by a vacuum suction jig with the corrected orientation, and this processing table is By the movement of 205, it is carried to the laser cutting position.

Further, above the laser cutting position, a pair of magnetic sensors 206 and 2 are provided for detecting one end edge and one end edge of the back sheet 15 of the crude product A, respectively.
07 is arranged so as to closely face the upper surface of the rough product A, and a straight line in the front-rear direction of the processing table passes through the position of one sensor 206, and a straight line in the width direction of the processing table passes through the position of the other sensor 207. Directly above the position slightly outward from the orthogonal point with the straight line,
A laser oscillator 208 is arranged in a fixed manner. Second
FIG. 6 shows the pair of magnetic sensors 206 and 207 for the rough product A placed on the processing table 205.
This is a plan view showing the positional relationship between the laser oscillator 208 and the laser oscillator 208. In the figure, 206a and 207a indicate the centers of the magnetic sensors 206 and 207.

The finishing cutting table 205, on which the rough product A was placed, was moved to the laser cutting position.
is first moved in either the X or Y directions shown by arrows in FIGS. 25 and 26, for example in the X direction, and one side edge of the back sheet 14 of the crude product A is detected by one of the magnetic sensors 206. When the magnetic sensor 207 detects one end of the back sheet 14 of the crude product A after being moved in the Y direction, it is stopped at that position.

In this way, when one side edge of the back sheet 14 of the crude product A is aligned with the center position of one of the magnetic sensors 206 and one end edge of the back sheet 14 is aligned with the center position of the other sensor 207, the laser oscillator 208 Slightly outside one corner of the back sheet 14 (product outline b to be described later)
(right above the corner of).

After this, while emitting a laser beam from the laser oscillator 208, the processing table 205 is moved back and forth and left and right so as to draw a rectangle in the width direction and the front and rear directions by the same distance as the width and length of the product. The outer periphery of the back film 15 and front film 13 and the outer periphery of the filler 16 of the crude product A are cut with a laser beam along the product outline b shown by a dashed line in FIGS. 25 and 26. Complete product B. Note that the processing table 20
The movement pattern at the time of laser cutting No. 5 is stored in advance in the movement control device of the processing table 205.

The finished product B cut from the crude product A in this way is stored in the product storage position shown in FIG. box 20
9 and stored in this box 209.

However, in this production method, crude product A
During finishing cutting, the outer edge of the back sheet 14 made of metal is detected by magnetic sensors 206, 207 to align the cut of the rough product A. A predetermined cutting position slightly outside the outer edge (a position 0.1 to 0.3 mm outside the outer edge of the frame 11 and back sheet 14) can be precisely aligned with the position of the laser beam emitted from the laser oscillator 208, and therefore It is possible to obtain a high-quality product in which the thickness of the filler 16 that is left on the outer periphery of the frame 11 and forms the outer peripheral surface of the product is substantially uniform over the entire circumference.

In the above embodiment, the back sheet 14 is made of metal and the outer edge of the back sheet 14 is detected by the magnetic sensors 206, 207.
If the frame 1 is made of metal, the outer edge of the frame 11 can be detected by the magnetic sensors 206 and 207 to align the cut of the rough product A. Also, if the back sheet 14 and the frame 11 are not made of metal, However, if the front sheet 12 is made of metal, the outer edge of the metal front sheet 12 can be detected from the opposite side of the raw product A to align the cut of the raw product A. That is, the frame 1
1, the front seat 12, and the back seat 14, as long as at least one of them is made of metal, the others do not necessarily need to be made of metal.

In addition, in the above embodiment, a magnetic sensor is used as a sensor for detecting metal, but this sensor may be a capacitance type proximity sensor that detects a difference in dielectric constant, or a sensor made of a permanent magnet and a soft ferromagnetic material. A reed switch can also be used in which a contact opens due to a change in the magnetic field when a metal object passes between a pair of contacts. For example, when the back sheet 14 of the back panel 1b is made of metal and the back film 15 is a transparent film, a reflective type that irradiates light onto the surface of the rough product and detects the reflection of the light from the back sheet 14 with a light receiving element may be used. It is also possible to use optical sensors.

It should be noted that the manufacturing method of the present invention is of course applicable not only to manufacturing the small-sized electronic calculator of the above embodiment but also to manufacturing other small-sized electronic devices.

〔Effect of the invention〕

According to the present invention, at least one of the panel or the frame is formed of a thin metal plate, and the outer periphery of the thin metal plate is detected by a detection device to form a film member having an outer diameter larger than the outer diameter of a product bonded to the thin metal plate. Since the cutter is designed to cut the product to the outer shape of the product, the cutting position of the film member relative to the outer periphery of the thin metal plate can always be the same regardless of the positional relationship between the thin metal plate and the film member. can improve the quality of

[Brief explanation of drawings]

1 and 2 are an external perspective view and an exploded perspective view of a small electronic calculator manufactured by the manufacturing method of the present invention, FIG. 3 is an enlarged sectional view taken along the line - in FIG. The figure is an enlarged sectional view of a portion of a film solar cell built into the small electronic calculator. 5 to 26 show an embodiment of the present invention, in which FIG. 5 is a schematic diagram of the entire manufacturing process, FIG. 6 is a perspective view of the film material that will become the front film of the front panel, and FIG. The figure is a schematic diagram of the film material feeding method, Figure 8 is a perspective view of a band-shaped metal sheet that becomes the front sheet of the front panel, Figure 9 is a perspective view of a display cell band on which film-shaped liquid crystal display cells are formed, and Figure 10 The figure is a perspective view of a battery band on which film-shaped solar cells are formed, Figure 11 is a cross-sectional view of the front sheet, liquid crystal display cell, solar cell positioning stand, and suction jig, and Figure 12 is the front sheet and liquid crystal display cell. 13 and 14 are cross-sectional views showing a method for peeling off a film-like movable contact from a contact strip. 17 is a schematic diagram illustrating a method of taking out a spacer from a spacer and an enlarged view of a spacer taking out part; FIG. 17 is a perspective view of a substrate film on which a wiring board is formed;
Figure 8 is a perspective view of a frame band, Figure 19 is a cross-sectional view of a chip component band with a diode attached, Figure 20 is a cross-sectional view of a chip component band with a capacitor attached, and Figure 21 is a cross-sectional view of a chip component band with a diode. FIG. 22 is a cross-sectional view of the circuit board assembled into a wiring board, and FIGS.
The figure is a front view and a plan view showing the process from dropping adhesive as a filler onto the film material to polymerizing and pressurizing the back panel, and Figure 25 is a perspective view showing the finishing cutting process of the rough product. FIG. 26 is an enlarged plan view of each step in FIG. 25. 1a...Front panel, 1b...Back panel, 11...Frame, 12...Front sheet, 13...Front film, 14...Back sheet, 15...Back film, 16...Filling material, 20...Wiring board , 30... film-like liquid crystal display cell, 40... film-like solar cell, A...
Crude product, B... Finished product, 205... Processing table for finishing cut, 206, 207... Magnetic sensor, 2
08... Laser oscillator, b... Product outline.

Claims (1)

[Claims] 1. An electronic component and a thin metal plate formed in the shape of a frame or panel for housing the electronic component are adhered to a film member that has an outer diameter larger than the outer diameter of the product and is decorated with decorative printing. A method for manufacturing a small electronic device, characterized in that the film member is cut into a product outer shape by detecting the outer peripheral edge of a thin metal plate.